CN107013867A - A kind of automobile LED headlamp - Google Patents
A kind of automobile LED headlamp Download PDFInfo
- Publication number
- CN107013867A CN107013867A CN201710405915.4A CN201710405915A CN107013867A CN 107013867 A CN107013867 A CN 107013867A CN 201710405915 A CN201710405915 A CN 201710405915A CN 107013867 A CN107013867 A CN 107013867A
- Authority
- CN
- China
- Prior art keywords
- substrate
- copper plate
- conducting
- fixing hole
- conducting copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
Abstract
The present invention relates to a kind of automobile LED headlamp, including substrate, the LED chip being arranged on substrate and fixed heat-conducting cylinder, described substrate is the metallic plate Jing Guo electric heating separating treatment, circuit is printed with the two sides of substrate, described circuit is connected with LED chip, described substrate thickness is 0.8 2 millimeters, substrate both sides are each provided with one piece of conducting copper plate, conducting copper plate is seamlessly connected with substrate, and described fixation heat-conducting cylinder is provided with fixing hole, and conducting copper plate is plugged in fixing hole with substrate.The design method of the present invention avoid orthodox car use by two it is packaged have a back-to-back assembling of substrate of LED chip by the way of, the thickness of substrate can be reduced so that LED chip generation light type close to conventional halogen lamp light type.
Description
【Technical field】
The present invention relates to a kind of LED lamp for use in vehicle, more particularly to a kind of car headlamp.
【Background technology】
Traditional automobile LED headlamp is used the two packaged back-to-back assemblings of substrate for having a LED chip 10, to up to
To 360 ° of luminous purposes, but it is due to that substrate needs certain thickness to ensure that Stability Analysis of Structures and radiating are good in itself, and this
Individual thickness can make automobile LED headlamp light type blind area very big at least more than 2 millimeters because of the stop of substrate, up to not
Required to user.And between substrate and substrate fastened using screw, this mode requires the fastening force that screw is provided
Amount is big, otherwise because of vibrations LED chip can be made to be separated with substrate, it is impossible to radiates and causes LED chip to burn out or shorten the life-span.
The tightening force of screw is increased, then needs increase backing plate to make to balance in power, applies intensified pressure to backing plate to protect in substrate both sides
Card reaches technological requirement, and this when requires again to the thickness of backing plate, if backing plate is too thin, probably due to can not bear big
Pressure and damage by pressure, it is therefore desirable to increase the thickness of backing plate, and increase the thickness of backing plate, again can because backing plate is too thick and is in the light, shadow
Ring LED light type.
【The content of the invention】
Present invention seek to address that above mentioned problem and provide a kind of heat conductivility it is good, need not using fastened by screw LED chip,
The good automobile LED headlamp of light type.
To achieve the above object, a kind of automobile LED headlamp of the invention includes substrate 20, set on the base plate 20
LED chip 10 and fixed heat-conducting cylinder 40, described substrate 20 is the metallic plate Jing Guo electric heating separating treatment, the both sides of substrate 20
Circuit is printed with face, described circuit is connected with LED chip 10, the described thickness of substrate 20 is 0.8-2 millimeters, 20 liang of substrate
Side is each provided with one piece of conducting copper plate 30, and conducting copper plate 30 is seamlessly connected with substrate 20, and described fixation heat-conducting cylinder 40 is provided with
Fixing hole 41, conducting copper plate 30 is plugged in fixing hole 41 with substrate 20.
Further, described conducting copper plate 30 is seamlessly connected with the inwall of fixing hole 41.
Further, described LED chip 10 is 2-8, in the left and right sides for being fixedly installed on substrate 20.
Further, the described thickness of conducting copper plate 30 is 0.4-1.5 millimeters.
Further, in addition to radiator 50, described radiator 50 is arranged on fixed heat-conducting cylinder 40.
Further, the length and width of described substrate 20 is all higher than conducting copper plate 30, and substrate 20 stretches out fixing hole 41,
Conducting copper plate 30 does not stretch out fixing hole 41.
Further, the material of described substrate 20 is that copper, the material of fixed heat-conducting cylinder 40 are aluminium.
The contribution of the present invention is the provision of a kind of automobile LED headlamp, and LED chips are set directly at by the headlamp
On substrate both sides, substrate is handled by electric heating isolation technics, and electric current can be avoided to influence each other without influenceing heat conduction, circuit
It is luminous so as to be connected realization with LED chip to be printed on substrate both sides, and this kind of mode avoids orthodox car packaged to be had using by two
The mode of the back-to-back assembling of substrate of LED chip, can reduce the thickness of substrate so that the light type that produces of LED chip is close to biography
The light type of system Halogen lamp LED.And the heat that this kind design enables LED chip to produce directly is conducted by substrate, LED core
Between piece and substrate be seamlessly connected, make heat conduction than traditional backing plate design faster, it is more efficient.In addition, the present invention is devised
Conducting copper plate, conducting copper plate is pressed into fixing hole after substrate is clipped in the middle by machine, and fixing hole is designed using negative common difference,
The internal diameter in hole is smaller 0.05-0.1 millimeters than conducting copper plate and substrate sum so that substrate can stabilizer pole be fixed on fixed heat conduction
In cylinder, substrate, conducting copper plate, material be copper, the material of fixed heat-conducting cylinder is aluminium, is mutually seamlessly connected between copper and copper, can
Make heat being transmitted on fixed heat-conducting cylinder extremely fast, so that heat is discharged by radiator.Solve and increase in the prior art
The nonmetallic materials such as cushioning plate influence heat conductivility problem.Meanwhile, conducting copper plate also acts as the purpose of protection printed circuit, is inciting somebody to action
When conducting copper plate and substrate grafting are entered in fixing hole, because the thickness of the thickness ratio printed circuit of conducting copper plate is big, only it can make to lead
Hot copper coin is with wall friction in fixing hole so as to play the purpose of protection printed circuit.
【Brief description of the drawings】
Fig. 1 is Structure explosion diagram of the invention.
Fig. 2 is substrate of the present invention, conducting copper plate, the combining structure schematic diagram of fixed heat-conducting cylinder.
Fig. 3 is structural representation of the invention.
Fig. 4 is orthodox car LED light type schematic diagram.
Fig. 5 is LED lamp of automobile light type schematic diagram of the present invention.
【Embodiment】
The following example is being explained further and supplementing to the present invention, and the present invention is not limited in any way.
Embodiment 1
As shown in Figure 1, 2, 3, a kind of automobile LED headlamp of the present embodiment includes substrate 20, set on the base plate 20
LED chip 10 and fixed heat-conducting cylinder 40, described substrate 20 is the metallic plate Jing Guo electric heating separating treatment, the both sides of substrate 20
Circuit is printed with face, described circuit is connected with LED chip 10, the described thickness of substrate 20 is 0.8-2 millimeters, 20 liang of substrate
Side is each provided with one piece of conducting copper plate 30, and conducting copper plate 30 is seamlessly connected with substrate 20, and described fixation heat-conducting cylinder 40 is provided with
Fixing hole 41, conducting copper plate 30 is plugged in fixing hole 41 with substrate 20.
In the present embodiment, substrate 20 is the metallic plate by electric heating separating treatment, can isolate electric current without influenceing thermal conductivity
Energy.Circuit is printed with the two sides of substrate 20, LED chip 10 is connected with circuit, power on circuitry makes LED chip 10 light.By
In the stop of substrate 20, the light type that LED chip 10 is sent can be made to be affected, substrate 20 is thicker, light type blind area will be bigger, from
And do not reach use requirement, as shown in Figure 4.Traditional automobile LED headlamp is used the two packaged bases for having a LED chip 10
The back-to-back assembling of plate, to reach 360 ° of luminous purposes, but is due to that substrate needs certain thickness to ensure structure in itself
Stable and radiating is good, and this thickness is at least more than 2 millimeters, therefore can make to shine before automobile LED because of the stop of substrate
Lamplight type blind area is very big.And the design of the present embodiment can reduce the thickness of substrate 20, substrate substantially may be used when 0.8 millimeter
Realize that the light type of LED chip 10, close to halogen bulb, reaches design requirement, as shown in Figure 5.The thickness of substrate 20 is alternatively
1.0 millimeters, 1.2 millimeters, 1.4 millimeters, 1.6 millimeters, 1.8 millimeters, 2.0 millimeters.Other substrate 20 also should not be too thin, too thin
Heat then is conducted without enough media, the temperature of substrate 20 can be made too high, the service life of LED chip 10, light decay is influenceed
Seriously.
In order that heat can be conducted quickly, the present embodiment is also provided with conducting copper plate 30, and conducting copper plate 30 is set
It is seamlessly connected in the both sides of substrate 20, and with substrate 20, being directly connected to of such metal and metal can improve heat transfer efficiency.Traditional
Automobile LED headlamp is due to being by the way of screw is by two pieces of back-to-back fastenings of substrate, therefore inevitably using non-
The backing plate of metal material ensures stress equalization and Stability Analysis of Structures, and the backing plate of nonmetallic materials can also influence heat conductivility, make
The heat of automobile LED headlamp can not be exported, and influence service life.Furthermore, can not be avoided completely by the way of screw is fastened
Screw stripped thread, once screw fastening is not firm, rocking in vehicle traveling process makes screw loose, heat dispersion will drastically under
Drop, the temperature of LED chips 10 can be raised quickly, or even be burnt out.The design of the present embodiment completely avoid above mentioned problem.
Fixed heat-conducting cylinder 40 is provided with fixing hole 41, and conducting copper plate 30 is plugged in fixing hole 41 with substrate 20.Conduction copper
Plate 30 is pressed into fixing hole 41 after substrate 20 is clipped in the middle by machine, and fixing hole 41 is designed using negative common difference, fixing hole
41 internal diameter is smaller 0.05-0.1 millimeters than conducting copper plate 30 and the sum of substrate 20 so that substrate 20 can stabilizer pole be fixed on
Determine in heat-conducting cylinder 40, substrate 20, conducting copper plate 30, the material of fixed heat-conducting cylinder 40 are copper, mutual seamless company between copper and copper
Connect, heat being transmitted on fixed heat-conducting cylinder 40 extremely fast can be made, so as to discharge heat by radiator 50.Solve existing
Increase the nonmetallic materials such as backing plate influence heat conductivility problem in technology.Meanwhile, conducting copper plate 30 also acts as protection printed circuit
Purpose, when conducting copper plate 30 and the grafting of substrate 20 are entered in fixing hole 41, due to conducting copper plate 30 thickness ratio print electricity
The thickness on road is big, can only make conducting copper plate 30 with wall friction in fixing hole 41 to play the purpose of protection printed circuit.
Embodiment 2
As shown in Figure 1, 2, 3, in the present embodiment, described conducting copper plate 30 is seamlessly connected with the inwall of fixing hole 41.It is described
LED chip 10 be 2-8, in the left and right sides for being fixedly installed on substrate 20.The described thickness of conducting copper plate 30 is 0.4-
1.5 millimeter.Also include radiator 50, described radiator 50 is arranged on fixed heat-conducting cylinder 40.The length of described substrate 20
Conducting copper plate 30 is all higher than with width, substrate 20 stretches out fixing hole 41, and conducting copper plate 30 does not stretch out fixing hole 41.Described substrate
20th, the material of fixed heat-conducting cylinder 40 is copper.
Although being disclosed by above example to the present invention, protection scope of the present invention is not limited thereto,
Under conditions of without departing from present inventive concept, deformation, replacement that each component is done to more than etc. will fall into the right of the present invention
In claimed range.
Claims (7)
1. a kind of automobile LED headlamp, including substrate (20), the LED chip (10) that is arranged on substrate (20) and fixed heat conduction
Cylinder (40), described substrate (20) is to be printed with circuit on the metallic plate Jing Guo electric heating separating treatment, the two sides of substrate (20),
Described circuit is connected with LED chip (10), it is characterised in that：Described substrate (20) thickness is 0.8-2 millimeters, substrate (20)
Both sides are each provided with one piece of conducting copper plate (30), and conducting copper plate (30) is seamlessly connected with substrate (20), described fixation heat-conducting cylinder
(40) fixing hole (41) is provided with, conducting copper plate (30) is plugged in fixing hole (41) with substrate (20).
2. a kind of automobile LED headlamp as claimed in claim 1, it is characterised in that：Described conducting copper plate (30) is with fixing
Hole (41) inwall is seamlessly connected.
3. a kind of automobile LED headlamp as claimed in claim 2, it is characterised in that：Described LED chip (10) is 2-8,
In the left and right sides for being fixedly installed on substrate (20).
4. a kind of automobile LED headlamp as claimed in claim 2, it is characterised in that：Described conducting copper plate (30) thickness is
0.4-1.5 millimeters.
5. a kind of automobile LED headlamp as claimed in claim 4, it is characterised in that：Also include radiator (50), described dissipates
Hot device (50) is arranged on fixed heat-conducting cylinder (40).
6. a kind of automobile LED headlamp as claimed in claim 5, it is characterised in that：The length and width of described substrate (20)
Degree is all higher than conducting copper plate (30), and substrate (20) stretches out fixing hole (41), and conducting copper plate (30) does not stretch out fixing hole (41).
7. a kind of automobile LED headlamp as claimed in claim 6, it is characterised in that：The material of described substrate (20) be copper,
Fixed heat-conducting cylinder (40) material is aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710405915.4A CN107013867A (en) | 2017-06-01 | 2017-06-01 | A kind of automobile LED headlamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710405915.4A CN107013867A (en) | 2017-06-01 | 2017-06-01 | A kind of automobile LED headlamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107013867A true CN107013867A (en) | 2017-08-04 |
Family
ID=59452089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710405915.4A Pending CN107013867A (en) | 2017-06-01 | 2017-06-01 | A kind of automobile LED headlamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107013867A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108548155A (en) * | 2018-04-28 | 2018-09-18 | 深圳市益科光电技术有限公司 | A kind of radiator structure of LED automobile headlamp |
| CN108775510A (en) * | 2018-07-26 | 2018-11-09 | 佛山市国星光电股份有限公司 | A kind of novel lamp structure |
| CN109980074A (en) * | 2017-12-27 | 2019-07-05 | 晶能光电（江西）有限公司 | The preparation method of LED headlamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203784786U (en) * | 2014-03-28 | 2014-08-20 | 潘骏文 | High-brightness LED (Light-Emitting Diode) automotive headlamp |
| CN204786013U (en) * | 2015-07-16 | 2015-11-18 | 广州市雷腾照明科技有限公司 | Motorcycle headlamp light source subassembly |
| US20160153636A1 (en) * | 2014-11-27 | 2016-06-02 | Toshiba Lighting & Technology Corporation | Lighting Device for Vehicle |
| CN207350095U (en) * | 2017-06-01 | 2018-05-11 | 广州市日雄电子科技有限公司 | A kind of automobile LED headlamp |
-
2017
- 2017-06-01 CN CN201710405915.4A patent/CN107013867A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203784786U (en) * | 2014-03-28 | 2014-08-20 | 潘骏文 | High-brightness LED (Light-Emitting Diode) automotive headlamp |
| US20160153636A1 (en) * | 2014-11-27 | 2016-06-02 | Toshiba Lighting & Technology Corporation | Lighting Device for Vehicle |
| CN204786013U (en) * | 2015-07-16 | 2015-11-18 | 广州市雷腾照明科技有限公司 | Motorcycle headlamp light source subassembly |
| CN207350095U (en) * | 2017-06-01 | 2018-05-11 | 广州市日雄电子科技有限公司 | A kind of automobile LED headlamp |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109980074A (en) * | 2017-12-27 | 2019-07-05 | 晶能光电（江西）有限公司 | The preparation method of LED headlamp |
| CN108548155A (en) * | 2018-04-28 | 2018-09-18 | 深圳市益科光电技术有限公司 | A kind of radiator structure of LED automobile headlamp |
| CN108775510A (en) * | 2018-07-26 | 2018-11-09 | 佛山市国星光电股份有限公司 | A kind of novel lamp structure |
| CN108775510B (en) * | 2018-07-26 | 2023-10-20 | 佛山市国星光电股份有限公司 | Lamp structure |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170804 |