CN201336319Y

CN201336319Y - High-power LED chip soldering copper-aluminum substrate and injection molding encapsulation bracket structure

Info

Publication number: CN201336319Y
Application number: CNU2008202228065U
Authority: CN
Inventors: 李经武
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-11-21
Filing date: 2008-11-21
Publication date: 2009-10-28
Anticipated expiration: 2018-11-21

Abstract

A high-power LED chip soldering copper-aluminum substrate and an injection molding encapsulation bracket structure is characterized in that an aluminum backing plate (1) is positioned below a copper substrate (2) to form a high-power LED chip soldering base electrode together with the copper substrate (2); the copper substrate (2) comprises a lamp cup (2-1), an electrode (2-2) and an electrode (2-3), and the lamp cup (2-1) is used for soldering an LED chip (4); a wire (5) is connected with the electrode (2-2) and the electrode on the LED chip (4); and a plastic bracket (3) is injection-molded on the copper substrate (2) and comprises two mounting holes (3-1, 3-2) and a plastic bracket (7). The structure provided in the utility model can be used as a base unit to integrate a large-sized lighting fixture such as a street lamp by installing the base unit with bolts and lining with an insulating heat conducing film. The structure can be used for producing an ultra high-power light fitting of power more than 100 W, and a power system and a heat radiation system can be isolated with each other.

Description

High-power LED chip soldering copper aluminium base and injection moulding embedding supporting structure

Technical field:

The utility model relates to high-power LED chip soldering copper aluminium base and injection moulding embedding supporting structure.

Background technology:

Chinese patent ZL200720080520.3, the title of utility model is that " illumination with copper framework and the aluminium backing structure of being welded of super-high-power LED chip " not only can be made single LED illuminating lamp and also can be used as integrated elementary cell as high-power illumination light fixtures such as street lamps.The shortcoming of Chinese patent ZL200720080520.3 is a complex structure, the manufacturing process complexity.

Summary of the invention

The purpose of this utility model provides a kind of simple in structure, easily manufactured high-power LED chip soldering copper aluminium base and injection moulding embedding supporting structure.

See Fig. 1-3, high-power LED chip soldering copper aluminium base and injection moulding embedding supporting structure is characterized in that: aluminium backing plate 1 is positioned at copper base 2 belows, with the copper base 2 common high-power LED chip welding substrates of forming; Copper base 2 includes Lamp cup 2-1, electrode 2-2, electrode 2-3, and Lamp cup 2-1 is used to weld led chip 4; One end connection electrode 2-2 of spun gold 5, the other end of spun gold 5 connects the electrode on the led chip 4; Plastic stent 3 is injection-moulded on the copper base 2, and plastic stent 3 includes two installing hole 3-1,3-2, Lamp cup 2-1 and is used for embedding silica gel and the plastic stent 7 of lens 6;

Aluminium backing plate 1 and copper base 2 may be fixed together by 3 liang of installing hole 3-1 of plastic stent and 3-2 crimping by part as injection moulding, and copper base 2 is shaped as square, and two electrodes and two installing hole 3-1,3-2 are positioned at foursquare two orthogonal thereto shapes in diagonal two ends.

Manufacturing process: electrode 2-2 is a zone in the copper base 2 before injection-moulded plastic support 3, and electrode 2-2 and copper base 2 connect as one, and behind plastic stent 3 injection moldeds electrode 2-2 is fixed, and electrode 2-2 separates with substrate 2, becomes independently electrode.

1. the utility model outstanding feature is that the copper base 2 that is used to weld led chip 4 is designed to square, and two electrodes and two installing hole 3-1,3-2 are positioned at foursquare two orthogonal thereto shapes in diagonal two ends, and the copper strips utilance is greater than 90%.

2. another distinguishing feature of the utility model is the support 7 that embedding silica gel and lens 6 are arranged on the plastic stent 3, and aluminium backing plate 1 copper base 2 is born part as injection moulding, by two installing hole 3-1 and 3-2 crimping fixedly aluminium backing plate 1 and copper base 2.

3. another characteristics of the utility model are that installing hole 3-1 and 3-2 have insulating effect, with the utility model during as the integrated large-scale lighting as street lamp of elementary cell, with screw elementary cell is installed, pad is with the insulating heat-conductive film, adopt series-parallel mode can make the above super high power light fixture of power 100W, power-supply system and cooling system can be kept apart mutually.

Description of drawings

Fig. 1 is the utility model front view.

Fig. 2 is an A-A direction cutaway view among Fig. 1.

Fig. 3 is the front view of aluminium backing plate 1 among Fig. 1.

Number in the accompanying drawing: aluminium backing plate 1, copper base 2, Lamp cup 2-1, electrode 2-2, plastic stent 3, installing hole 3-1,3-2, led chip 4, spun gold 5, silica gel and lens 6, the support 7 of silica gel and lens 6.

Embodiment

Referring to Fig. 1-3, see Fig. 1-3, high-power LED chip soldering copper aluminium base and injection moulding embedding supporting structure is characterized in that: aluminium backing plate 1 is positioned at copper base 2 belows, with the copper base 2 common high-power LED chip welding substrates of forming; Copper base 2 includes Lamp cup 2-1, electrode 2-2, electrode 2-3, and Lamp cup 2-1 is used to weld led chip 4; One end connection electrode 2-2 of spun gold 5, the other end of spun gold 5 connects the electrode on the led chip 4; Plastic stent 3 is injection-moulded on the copper base 2, and plastic stent 3 includes two installing hole 3-1,3-2, Lamp cup 2-1 and is used for embedding silica gel and the plastic stent 7 of lens 6;

Claims

1, high-power LED chip soldering copper aluminium base and injection moulding embedding supporting structure is characterized in that: aluminium backing plate (1) is positioned at copper base (2) below, forms the high-power LED chip welding substrate jointly with copper base (2); Copper base (2) includes Lamp cup (2-1), electrode (2-2), electrode (2-3), and Lamp cup (2-1) is used to weld led chip (4); One end connection electrode (2-2) of spun gold (5), the other end of spun gold (5) connects the electrode on the led chip (4); Plastic stent (3) is injection-moulded on the copper base (2), and plastic stent (3) includes two installing holes (3-1,3-2), Lamp cup (2-1) and is used for embedding silica gel and the plastic stent of lens (6) (7).

2 high-power LED chip soldering copper aluminium bases according to claim 1 and injection moulding embedding supporting structure, it is characterized in that: aluminium backing plate (1) and copper base (2) may be fixed together by plastic stent (3) two installing holes (3-1,3-2) crimping by part as injection moulding, copper base (2) is shaped as square, and two electrodes and two installing holes (3-1,3-2) are positioned at foursquare two orthogonal thereto shapes in diagonal two ends.