CN109906501A - 用于改良型装载端口的系统、装置和方法 - Google Patents
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Abstract
实施方式提供用于改良的装载端口的系统、装置、及方法,包含:一框架,该框架支撑一坞部及一载体开启器;一升降机,该升降机是可操作的以升高及降低该载体开启器;一隔离室,该升降机是可操作的以在该隔离室内移动,该隔离室包含一容积,该容积与一设施前端模块(EFEM)的一容积隔离;及位于该隔离室内的一净化供应,该净化供应是可操作的以净化该隔离室的反应性气体,该反应性气体受困于该隔离室内。公开了众多额外方面。
Description
相关申请
本申请主张第15/348,967号,申请日为2016年11月10日,标题为“SYSTEMS,APPARATUS,AND METHODS FOR AN IMPROVED LOAD PORT(用于改良型装载端口之的系统、装置和方法)”(代理案号第24538-04/USA)的美国非临时专利申请的优先权,出于所有目的,其全部内容通过引用方式并入本文。
技术领域
本申请相关于电子设备制造系统,且更特定地,相关于针对用于这些系统的改良装载端口的系统、装置及方法。
背景技术
来自清洁室的氧(例如氧气)可具有对基板(例如,半导体晶片)有害的影像。因此,基板典型地储存于密封载体中和/或保持于非反应性气体(例如,氮)环境中。电子设备处理系统使用耦接至清洁室和处理工具之间的设施前端模块(equipment front end module,EFEM)或工厂界面的装载端口。操作员或材料处理系统可装载基板载体至装载端口上,使得可装载基板进入处理系统或从处理系统移除基板。清洁室具有为操作员提供的氧环境,而用于处理系统的EFEM典型地具有氮环境以保护基板。理想上,EFEM提供阻挡以将氧保持在处理系统外,但在一些情况下,装载端口可造成氧污染。因此,需要包含改良的装载端口的系统、装置、和方法。
发明内容
在一些实施方式中,提供一种装载端口系统。该装载端口系统包含:一框架,该框架支撑一坞部(dock)和一载体开启器;一升降机,该升降机是可操作的以升高和降低该载体开启器;一隔离室,该升降机是可操作的以在该隔离室内移动,该隔离室包含一容积,该容积与一设施前端模块(EFEM)的一容积隔离;和一净化供应,该净化供应位于该隔离室内,该净化供应是可操作的以净化该隔离室的反应性气体,该反应性气体受困于该隔离室内。
在一些其他实施方式中,提供一种装载端口。该装载端口包含:一隔离室,该隔离室用于一升降机,该隔离室由一壳体和一框架来界定,该隔离室包含一容积,该容积与一设施前端模块(EFEM)的一容积隔离,该EFEM和该装载端口是可耦接的;和一净化供应,该净化供应位于该隔离室内,该净化供应是可操作的以净化该隔离室的反应性气体,该反应性气体受困于该隔离室内。
而在另外的实施方式中,提供一种用于净化一设施前端模块(EFEM)系统的方法。该方法包含以下步骤:使用一气体来注满一EFEM,该气体对与将被传递通过该EFEM系统的基板是非反应性的;和使用设置于一隔离室内的一非反应性气体供应来净化耦接至该EFEM的一装载端口的一隔离室的反应性气体,该反应性气体受困于该隔离室内。
通过由下文的详细描述、随附的权利要求、和随附的附图图式来示出的众多实施方式和实施方案(包含针对实现实施方式所考量的最佳模式),实施方式的其他特征、方面、和优点将变得更显而易见。实施方式也可能够用于其他和不同的应用,且在各方面可修改其一些细节,所有修改不会脱离所公开的实施方式的范围。据此,附图和描述应视为在本质上进行说明,而不应被视为限制。附图不必依尺寸绘制。说明书意图涵盖落于权利要求的范围内的所有修改、等效物、和替代物。
附图说明
图1A和图1B为根据一些实施方式描绘电子设备处理系统的示例的框图。
图2A为根据一些实施方式描绘安装了下壳体的示例装载端口的前视等距视图。
图2B为根据一些实施方式描绘移除了下壳体的示例装载端口的前视等距视图。
图3为根据一些实施方式描绘示例装载端口的后视等距视图。
图4为根据一些实施方式描绘示例装载端口的后视平面视图。
图5为根据一些实施方式说明净化电子设备处理系统的示例方法的流程图。
具体实施方式
本文描述的实施方式提供用于连接至用于电子设备制造系统的设施前端模块(EFEM)的改良的装载端口的系统、装置、和方法。EFEM典型地提供被气体(例如,氮)充满的封闭环境,该气体不与待装载进入处理工具的基板反应。EFEM包含机器人以使得基板能在清洁室环境(例如,经由装载端口从密封的基板载体内)和处理系统内部之间的传输。在使用中,EFEM理想上维持在正向压力、仅有氮的环境中。然而,气密密封并未在清洁室和EFEM之间持续维持。例如,在维持期间,氧被导入EFEM以允许人员安全地进入。之后,EFEM再次被氮注满以迫使剩余的氧离开。
发明人判断:耦接至EFEM的传统装载端口可困住可保持于装载端口的隔离室中的氧,且氧可缓慢地逸漏进入EFEM,特别是在从停靠的基板载体传输基板期间装载端口的载体开启器被开启和降低时。隔离室为装载端口的下方部分内的封闭容积,在开启基板载体时,升降机在该隔离室内平移向上和向下以降低和升高装载端口的载体开启器。隔离室与EFEM流体连通,且升降机的移动可推动受困的氧离开隔离室而进入EFEM。此外,在EFEM被注满氮之后,氧从装载端口的隔离室缓慢逸漏是特别有问题的,因为氧(对基板材料具有反应性)可污染移动经过EFEM的基板。实施方式通过提供装载端口的隔离室内的专用氮净化供应来解决此问题,该净化供应是可操作的以迫使受困的氧离开,使得氧可在EFEM被氮注满时被移除。在一些实施方式中,隔离室内的风扇与或不与该专用氮净化供应一起使用以迫使氧离开装载端口。在一些实施方式中,EFEM内的风扇与或不与该专用氮净化供应一起使用,以将氧拉离装载端口。
转至图1A和图1B,表示了根据一些实施方式的示例电子设备处理系统100的框图。图1B描绘与图1A相同的系统100,但包含垂直虚线101以标示氧(例如,反应性)环境和氮(例如,非反应性)环境之间的边界。系统100包含耦接至EFEM 104的基板处理工具102。EFEM104耦接至装载端口105,装载端口105包含框架106以支撑停靠托盘108、载体开启器110、升降机112、和由装载端口壳体116环绕的隔离室114。装载端口壳体116也封闭支撑控制器118的控制部件板和隔离室净化供应120。
停靠托盘108适于接收基板载体122(例如,前开式标准舱(front openingunified pod,FOUP))。经由载体开启器110来接取(access)基板载体122,经由升降机112来降低载体开启器110离开通道,升降机112在EFEM 104中向上和向下移动载体开启器110,载体开启器110由升降机臂124承载,升降机臂124在隔离室114中从升降机112延伸。隔离室114包含升降机112。应注意,被装载端口壳体116封闭的容积(即,隔离室114)与EFEM 104流体连通,这是由用于移动延伸穿过框架106的元件的开口(见图3,302)而导致的。
如图1B中的垂直虚线101所图标,系统100的左侧上的元件可维持于氧环境中(例如,清洁室),同时系统100的右侧上的元件理想上维持于非反应性气体(例如,氮)环境中。气体经选择以相对于基板是非反应性的。
在操作中,EFEM 104初始地被氮注满以迫使氧离开。然而,氧受困于隔离室114中,且使用设置于隔离室114内的专用隔离室净化供应120来净化。选择地或额外地,使用设置于装载端口壳体116内的风扇来净化隔离室114(即,由装载端口壳体116封闭的容积),或使用与隔离室114相邻的EFEM 104内的风扇或真空源来而被抽抽空。一旦氧被冲出EFEM 104,基板载体122可停靠于装载端口105以输送基板至基板处理工具102或从基板处理工具102接收基板。经由升降机112来降低载体开启器110。基板经由机器人(未示出)被插入基板载体122或从基板载体122移除,接着升高载体开启器110以重新密封基板载体122。在图1A和图1B图中虚拟地示出,装载端口壳体116内的控制器118(包含被编程的处理器和储存处理器可执行指令的内存)可耦接至每一个主动部件以控制其操作。
在一些实施方式中,隔离室114内的净化供应120设置于隔离室114的下端且经布置以迫使受困的反应性气体向上离开隔离室114。在一些实施方式中,隔离室114内的净化供应120设置于隔离室114的上端且经布置以迫使受困的反应性气体向下离开隔离室114。在一些实施方式中,隔离室114包含设置于隔离室114的与净化供应120相对的一端的通风口。通风口可包含单向检查阀以允许气体离开隔离室但不返回进入。在一些实施方式中,净化供应120可被风扇取代,该风扇设置于用于净化供应120的上述任何布置中。
图2A和图2B描绘装载端口105的示例实施方式的前视等距视图。应注意,在图2A中安装了装载端口壳体116,且在图2B中移除了装载端口壳体116。也应注意,在图2A和图2B中以及在图第3和图4中,即使在表示部件的不同视角时,使用相同的参考数字以指示相同部件。在图2B中,上述关于图1A和图1B提及的控制部件板202是可见的。
图3描绘后视等距视图且图4描绘装载端口105的示例实施方式的后视平面视图。在这些付图中清楚表示了至隔离室114的开口302。隔离室114内的容积部分地与EFEM 104内的容积隔离(图1),但由于用于升降机臂124的开口302,隔离室114与EFEM 104流体连通。应注意,开口302被最小化,以便最小化移入EFEM 104环境的颗粒。因此,有两个容积被开口302分开:EFEM 104环境和隔离室114容积。因为仅有小的开口302连接该两个容积,反应性气体受困于隔离室114容积内部,除非导入净化供应120。若受困的氧未从隔离室114净化掉,氧逸漏进入EFEM 104内的容积,特别是在升降机112移动穿过隔离室114以降低或升高载体开启器110时。
在一些实施方式中,隔离室净化供应120以大约10至大约100lpm的范围内的速率和大约0.5的WC至大约3的WC的范围内的压力来提供非反应性气体(例如,氮)。其他范围为可能的。在一些实施方式中,EFEM净化供应(未示出)以大约20lpm至大约1000lpm的范围内的速率和大约0.5的WC至大约3的WC的范围内的压力来提供非反应性气体(例如,氮)。其他范围为可能的。在包含风扇的替代的实施方式中,风扇可经选择以移动大约10至大约100lpm的气体。
现在转至图5,提供描绘示例方法500的实施方式的流程图。初始地,系统100的基板处理工具102侧(即,EFEM 104)被非反应性气体(例如,氮)注满以迫使氧离开(502)。同时或在一延迟之后,使用专用隔离室净化供应120来净化受困于隔离室114中的氧(504)。选择地或额外地,使用风扇以净化隔离室114的任何受困的氧。在氧被冲出隔离室114和EFEM104之后,基板载体122可停靠于装载端口105(506)。选择地,基板载体122可停靠于装载端口105,接着在开启基板载体122之前净化隔离室114和EFEM 104。载体开启器110开启基板载体122且接着经由升降机112降低载体开启器110与基板载体122的闸(508)。基板被插入基板载体122或自基板载体122移除,接着升高载体开启器110以重新密封基板载体122(510)。
在此公开内容中描述众多实施方式,且仅为图示目的而呈现。所描述实施方式在任何意义上不会也不意图作为限制。目前所公开的实施方式可广泛应用至众多其他实施方式,其通过本公开内容是显而易见的。熟悉本领域的技术人员将理解:所公开实施方式可以多种修改和替代(例如结构、逻辑、软件、和电性修改)来实践。尽管所公开的实施方式的特定特征可参考一个或更多个特定实施方式和/或附图来描述,应理解这些特征不限于参考所描述的使用于该一个或更多个特定实施方式或附图中,除非被清楚规定。
本公开内容并非是所有实施方式的字面描述或必须在所有实施方式中呈现的实施方式的特征的列表。本公开内容提供给熟悉本领域的技术人员几个实施方式的可行描述。这些实施方式的其中一些可不在本申请中主张,但可在主张本申请的优先权的一个或更多个后续申请中主张。
前述仅公开示例实施方式。上文公开的装置、系统和方法的落于权利要求书的保护范围内的修改对熟悉本领域的技术人员而言为显而易见的。据此,尽管结合示例实施方式来公开实施方式,应理解其他实施方式可落于如权利要求书所界定的意图的精神和范围内。
Claims (15)
1.一种装载端口系统,包括:
一框架,该框架支撑一坞部(dock)及一载体开启器;
一升降机,该升降机是可操作的以升高及降低该载体开启器;
一隔离室,该升降机是可操作的以在该隔离室内移动,该隔离室包含一容积,该容积与一设施前端模块(EFEM)的一容积隔离;及
一净化供应,该净化供应位于该隔离室内,该净化供应是可操作的以净化该隔离室的反应性气体,该反应性气体受困于该隔离室内。
2.如权利要求1所述的系统,进一步包含一壳体,该壳体安装于该框架上且与该框架一起界定出该隔离室的该容积,其中该净化供应经由该壳体进入该隔离室。
3.如权利要求1所述的系统,其中该隔离室内的该净化供应是可操作的以使用一气体来净化该隔离室,该气体与将被传递通过工厂接口闸的基板是非反应性的。
4.如权利要求3所述的系统,其中受困的该反应性气体为氧,且非反应性的该净化气体为氮。
5.如权利要求1所述的系统,其中该隔离室内的该净化供应设置于该隔离室的一下端且经布置以迫使受困的反应性气体向上离开该隔离室。
6.如权利要求1所述的系统,其中该隔离室内的该净化供应设置于该隔离室的一上端,且经布置以迫使受困的反应性气体向下离开该隔离室。
7.如权利要求1所述的系统,其中该隔离室包含一开口,该开口设置于该隔离室的与该净化供应相对的一侧上。
8.一种装载端口,包括:
一隔离室,该隔离室用于一升降机,该隔离室由一壳体及一框架来界定,该隔离室包含一容积,该容积与一设施前端模块(EFEM)的一容积隔离,该EFEM与该装载端口是可耦接的;及
一净化供应,该净化供应位于该隔离室内,该净化供应是可操作的以净化该隔离室的反应性气体,该反应性气体受困于该隔离室内。
9.如权利要求8所述的装载端口,其中该净化供应经由该壳体进入该隔离室。
10.如权利要求8所述的装载端口,其中该隔离室内的该净化供应是可操作的以使用一气体来净化该隔离室,该气体与将被传递通过该EFEM的基板是非反应性的。
11.如权利要求10所述的装载端口,其中受困的该反应性气体为氧,且非反应性的该净化气体为氮。
12.如权利要求8所述的装载端口,其中该隔离室内的该净化供应设置于该隔离室的一下端,且经布置以迫使受困的反应性气体向上离开该隔离室。
13.如权利要求8所述的装载端口,其中该隔离室内的该净化供应设置于该隔离室的一上端,且布置以迫使受困的反应性气体向下离开该隔离室,并且其中该隔离室包含一开口,该开口设置于该隔离室的与该净化供应相对的一侧。
14.一种用于净化一设施前端模块(EFEM)系统的方法,该方法包括以下步骤:
使用一气体来注满一EFEM,该气体对于将被传递通过该EFEM系统的基板是非反应性的;
使用设置于一隔离室内的一非反应性气体供应来净化耦接至该EFEM的一装载端口的一隔离室的反应性气体,该反应性气体受困于该隔离室内;以及
经由界定该隔离室的一壳体来将供应该非反应性气体供应至该隔离室。
15.如权利要求14所述的方法,其中该隔离室内的该净化供应设置于该隔离室的一下端,且净化受困的该反应性气体的步骤包含以下步骤:迫使受困的该反应性气体向上离开该隔离室。
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