CN109905818B - 扬声器模块 - Google Patents

扬声器模块 Download PDF

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CN109905818B
CN109905818B CN201810357679.8A CN201810357679A CN109905818B CN 109905818 B CN109905818 B CN 109905818B CN 201810357679 A CN201810357679 A CN 201810357679A CN 109905818 B CN109905818 B CN 109905818B
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space
sound box
porous particles
speaker module
volume
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CN109905818A (zh
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张嘉仁
林婉琪
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Acer Inc
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Acer Inc
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2803Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means for loudspeaker transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H04R2201/029Manufacturing aspects of enclosures transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Abstract

本发明提供一种扬声器模块,包括音箱、振膜及多个多孔隙颗粒。振膜配置于音箱且适于接收信号而振动。这些多孔隙颗粒配置于音箱内且适于吸收音箱内的空气的能量。

Description

扬声器模块
技术领域
本发明涉及一种声学装置,尤其涉及一种扬声器模块。
背景技术
先前技术如传统的封闭式音箱,振膜的振动在音箱内会造成声波反弹,而声波反弹所造成的压力,造成振膜的振动受到干扰,抑制了振膜的振幅,使得扬声器在低频时表现较差。
虽增大音箱容积可降低声波反弹所造成的压力,从而改善上述问题。然而,随着电子产品的轻薄化趋势,音箱容积受到限制。因此,如何通过足够小的音箱达到令消费者满意的低频表现,是应用于可携式电子产品的扬声器模块当前设计上的重要课题。
发明内容
本发明提供一种扬声器模块,具有良好的低频表现且可节省配置空间。
本发明的扬声器模块包括音箱、振膜及多个多孔隙颗粒。振膜配置于音箱且适于接收信号而振动。这些多孔隙颗粒配置于音箱内且适于吸收音箱内的空气的能量。
基于上述,本发明的扬声器模块在音箱内配置了多孔隙颗粒。当声波传入多孔隙颗粒的孔隙内而摩擦时,会将空气粒子的振动能量在孔隙内转变成热能,从而减少空气粒子振动的强度。藉此,不需增大音箱的容积,就可避免声波反弹所造成的压力抑制振膜的振幅,以达到节省配置空间及提升低频表现的效果,等同于增大了音箱的等效容积。
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合附图作详细说明如下。
附图说明
图1是本发明一实施例的扬声器模块的立体图;
图2是图1的扬声器模块的部分结构立体图;
图3是图2的挡墙、透气膜及第一空间的示意图;
图4是图1的扬声器模块于另一视角的立体图;
图5是本发明另一实施例的扬声器模块的部分构件分解图。
附图标号说明:
100:扬声器模块
110:音箱
110a:开孔
110b:盖体
112:挡墙
120:振膜
130:多孔隙颗粒
140、240:透气膜
212:胶材
S:容纳空间
S1、S1’:第一空间
S2:第二空间
具体实施方式
图1是本发明一实施例的扬声器模块的立体图。图2是图1的扬声器模块的部分结构立体图。图3是图2的挡墙、透气膜及第一空间的示意图。请参考图1至图3,本实施例的扬声器模块100包括音箱110、振膜120及多个多孔隙颗粒130。音箱110内具有至少一挡墙112,挡墙112将音箱110的容纳空间S分隔为第一空间S1及第二空间S2。这些多孔隙颗粒130填充于音箱110内的第一空间S1中,振膜120配置于音箱110且对应于第二空间S2,并适于接收信号而振动。这些多孔隙颗粒130适于吸收音箱110内的空气的振动能量。
详细而言,当振膜120振动而驱使音箱110内的空气振动时,声波传入多孔隙颗粒130的孔隙内而摩擦,以将空气粒子的振动能量在孔隙内转变成热能,从而减少空气粒子振动的强度。藉此,不需增大音箱110的容积,就可避免声波反弹所造成的压力抑制振膜120的振幅,以达到节省配置空间及提升低频表现的效果,等同于增大了音箱的等效容积。本实施例的音箱110的实际容积例如大于0毫升且小于或等于5毫升,以适用于轻薄型的笔记本电脑或其他轻薄电子产品。
在本实施例中,这些多孔隙颗粒130例如是天然沸石粉,各多孔隙颗粒130的粒径例如是0.3~0.6毫米。然本发明不以此为限,其可具有其他适当粒径且可为其他具孔隙的适当材质的颗粒。此外,第一空间S1的体积例如是音箱110的容纳空间S的体积的40%,这些多孔隙颗粒130填满于第一空间S1,以使这些多孔隙颗粒130的总体积亦为音箱110的容积的40%,然本发明不以此为限。
在本实施例中,扬声器模块100包括至少一透气膜140(图3显示为两个),两透气膜140分别覆盖第一空间S1的相对两端,第一空间S1位于两透气膜140之间,使音箱110内的空气可流通于第一空间S1而接触这些多孔隙颗粒130。透气膜140例如是不织布或其他适当透气材,本发明不对此加以限制。
图4是图1的扬声器模块于另一视角的立体图。请参考图4,音箱110的背面可具有开孔110a,这些多孔隙颗粒130可通过开孔110a而装填至第一空间S1中,待装填完成后利用盖体110b覆盖开孔110a。在其他实施例中,可先制作出装填有多孔隙颗粒的组件,再将此组件装入音箱中,详述如下。
图5是本发明另一实施例的扬声器模块的部分构件分解图。图5的两透气膜240类似于图2及图3所示的透气膜140,胶材212胶合于两透气膜240之间而构成挡墙,此挡墙类似于图2及图3所示的挡墙112,被其围绕的第一空间S1’类似图1至图3所示的第一空间S1。图5所示实施例与图1至图3所示实施例的不同处在于,先将多孔隙颗粒封入透气膜240与胶材212之间的第一空间S1’,再将透气膜240、胶材212及填充于其间的多孔隙颗粒所构成的组件装设至音箱内。胶材212的材质例如是环氧树脂、氯丁二烯橡胶或其他适当的胶材,本发明不对此加以限制。
综上所述,本发明的扬声器模块在音箱内配置了多孔隙颗粒。当声波传入多孔隙颗粒的孔隙内而摩擦时,会将空气粒子的振动能量在孔隙内转变成热能,从而减少空气粒子振动的强度。藉此,不需增大音箱的容积,就可避免声波反弹所造成的压力抑制振膜的振幅,以达到节省配置空间及提升低频表现的效果,等同于增大了音箱的等效容积。
虽然本发明已以实施例揭示如上,然其并非用以限定本发明,任何所属技术领域中技术人员,在不脱离本发明的精神和范围内,当可作些许的更改与润饰,故本发明的保护范围当视权利要求所界定的为准。

Claims (7)

1.一种扬声器模块,其特征在于,包括:
音箱;
振膜,配置于所述音箱且适于接收信号而振动;
多个多孔隙颗粒,配置于所述音箱内且适于吸收所述音箱内的空气的能量;以及
两透气膜,
其中所述音箱内具有至少一挡墙,所述挡墙将所述音箱的容纳空间分隔为第一空间及第二空间,所述多个多孔隙颗粒填充于所述第一空间,所述振膜对应于所述第二空间,
其中所述两透气膜覆盖所述第一空间,所述第一空间位于所述两透气膜之间。
2.根据权利要求1所述的扬声器模块,其特征在于,所述多个多孔隙颗粒的总体积是所述音箱的容积的40%。
3.根据权利要求1所述的扬声器模块,其特征在于,各所述多孔隙颗粒的粒径是0.3~0.6毫米。
4.根据权利要求1所述的扬声器模块,其特征在于,所述多个多孔隙颗粒是天然沸石粉。
5.根据权利要求1所述的扬声器模块,其特征在于,所述音箱的容积大于0毫升且小于或等于5毫升。
6.根据权利要求1所述的扬声器模块,其特征在于,所述第一空间的体积是所述音箱的所述容纳空间的体积的40%。
7.根据权利要求1所述的扬声器模块,其特征在于,包括胶材,其中所述胶材胶合于所述两透气膜之间而构成所述挡墙。
CN201810357679.8A 2017-12-07 2018-04-20 扬声器模块 Active CN109905818B (zh)

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US201762595595P 2017-12-07 2017-12-07
US62/595,595 2017-12-07
TW107106764 2018-03-01
TW107106764A TWI678932B (zh) 2017-12-07 2018-03-01 揚聲器模組

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US20190182581A1 (en) 2019-06-13
CN109905818A (zh) 2019-06-18
US10440466B2 (en) 2019-10-08
EP3496418B1 (en) 2020-09-16
EP3496418A1 (en) 2019-06-12

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