CN109904571A - Substrate integral wave guide filter based on electromagnetism hybrid coupled - Google Patents
Substrate integral wave guide filter based on electromagnetism hybrid coupled Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
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Abstract
The invention discloses a kind of substrate integral wave guide filters based on electromagnetism hybrid coupled.A kind of substrate integral wave guide filter based on electromagnetism hybrid coupled of the present invention, comprising: the first metal layer, first medium layer, second metal layer, second dielectric layer, third metal layer, third dielectric layer and the 4th dielectric layer set gradually from top to bottom；First plated-through hole array through first medium layer and collectively forms the first resonant cavity with the first metal layer and second metal layer；Second plated-through hole array runs through second dielectric layer, and collectively forms the second resonant cavity with second metal layer, third metal layer；Third plated-through hole array runs through third dielectric layer, and collectively forms third resonant cavity with third metal layer, the 4th metal layer.The utility model has the advantages that substrate integration wave-guide resonant cavity is disposed vertically, under the premise of guaranteeing that substrate integration wave-guide performance is constant, it can effectively reduce the area of circuit area and encapsulation.
Description
Technical field
The present invention relates to filter fields, and in particular to a kind of substrate integration wave-guide filtering based on electromagnetism hybrid coupled
Device.
Background technique
With the fast development of wireless communication, frequency spectrum resource is more and more nervous, is assigned to available in all kinds of communication systems
Frequency interval is more and more narrow, and the interference between each frequency range is all the more serious, proposes very high requirement to performance of filter index.It is high
Quality factor, filter with low insertion loss, etc. group delays, high out-of-side rejection, small size bandpass filter have received widespread attention.
There are following technical problems for traditional technology:
In existing communication system, the quasi-elliptic filters with definite transmission zero point and good frequency selectivity are obtained
More and more applications.In order to realize quasi- oval filter response, usually using cross-coupling, source-load coupling and bypass
Coupling technique is generated by constructing a plurality of coupling path with certain phase difference between adjacent resonators, between the load of source
Positioned at the transmission zero of near pass-band, and then improve the Out-of-band rejection of filter.But these technologies are tended not to transmission zero
The position of point is controlled, and the flexibility of design is poor, and the coupling topology structure of the filter of these technologies realization is often
It is more complicated.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of substrate integral wave guide filter based on electromagnetism hybrid coupled,
The filter is equivalent to two second order hybrid electromagnetic coupling filters and cascades, and substrate integration wave-guide resonant cavity uses vertical stacks
It stacks and sets, so that circuit structure is compact.
The substrate integration wave-guide filter based on electromagnetism hybrid coupled that in order to solve the above-mentioned technical problems, the present invention provides a kind of
Wave device, comprising:
The first metal layer, first medium layer, second metal layer, second dielectric layer, the third gold set gradually from top to bottom
Belong to layer, third dielectric layer and the 4th dielectric layer；First plated-through hole array runs through first medium layer and and the first metal layer
And second metal layer collectively forms the first resonant cavity；Second plated-through hole array runs through second dielectric layer, and with second
Metal layer, third metal layer collectively form the second resonant cavity；Third plated-through hole array runs through third dielectric layer, and with the
Three metal layers, the 4th metal layer collectively form third resonant cavity.
Input port is provided on the first metal layer in one of the embodiments, is set on the 4th metal layer
It is equipped with output port, input port and output port all use microstrip line to the transition structure of co-planar waveguide.
The output port will by the 4th plated-through hole through three layers of dielectric layer in one of the embodiments,
On 50 ohm of microstrip transmission line in energy coupling to the first metal layer.
The first round coupling is etched respectively on the second metal layer and third metal layer in one of the embodiments,
Hole and the second round coupling aperture, the center and the 4th plated-through hole of the first round coupling aperture and the second round coupling aperture
Center coincides.
The first magnetic coupling rectangular channel and first is etched in the second metal layer in one of the embodiments, and is electrically coupled circle
Hole etches the second magnetic coupling rectangular channel and second on the third metal layer and is electrically coupled circular hole, wherein the first magnetic coupling rectangular channel
It is located at the marginal position of resonant cavity with the second magnetic coupling rectangular channel and about resonant cavity central symmetry, realizes the magnetic of adjacent resonators
Coupling, first is electrically coupled circular hole and second is electrically coupled the center that circular hole is located at resonant cavity, realizes the thermocouple of adjacent resonators
It closes.
In one of the embodiments, by adjusting in second metal layer the first magnetic coupling rectangle slot length for etching and the
One is electrically coupled the radius of circular hole, the position of adjustable lower stopband transmission zero.
In one of the embodiments, by adjusting on third metal layer the second magnetic coupling rectangle slot length for etching and the
Two are electrically coupled the radius of circular hole, the position of stopband transmission zero in adjusting.
Beneficial effects of the present invention:
(1) substrate integration wave-guide resonant cavity is disposed vertically, is guaranteeing the constant premise of substrate integration wave-guide performance
Under, it can effectively reduce the area of circuit area and encapsulation；
(2) by etching rectangular channel and round hole in the common metal layer between adjacent resonators, electromagnetism can be introduced
Hybrid coupled compares existing filter construction so as to introduce the transmission zero of finite frequency, and the present invention is not introducing volume
On the basis of outer circuit area, the selectivity of filter can be improved；
(3) present invention can control magnetic coupling by adjusting the length of rectangular coupling groove and the radius of round coupling aperture respectively
It closes intensity and piezoelectric coupling strength and realizes the controllable of transmission zero location to adjust electromagnetism hybrid coupled coefficient；
(4) present invention has many advantages, such as that flexible design, structure are simple, is easily integrated.
Detailed description of the invention
Fig. 1 is second order electromagnetism hybrid coupled substrate integral wave guide filter structure chart.
Fig. 2 is Fig. 1 filter intermediate metal layer top view.
Fig. 3 is when being electrically coupled to occupy an leading position, and second order electromagnetism hybrid coupled filter transfer parameter is with rectangle coupling
Close the variation of slot length.
When Fig. 4 occupies an leading position for magnetic coupling, second order electromagnetism hybrid coupled filter transfer parameter is with circular electric
The variation of coupled apertures radius.
Fig. 5 is three rank hybrid electromagnetic coupling filter coupling topology structures.
Fig. 6 is three rank electromagnetism hybrid coupled substrate integral wave guide filter structural schematic diagrams.
Fig. 7 is the S parameter curve of filter shown in Fig. 6.
Fig. 8 is the coupling topology structure of quadravalence electromagnetism compound filter.
Fig. 9 is the structural schematic diagram of quadravalence electromagnetism hybrid coupled filter.
Figure 10 (a), (b) are respectively filter the first metal layer shown in Fig. 9 and second metal layer top view.
Figure 11 is the S parameter curve of filter shown in Fig. 9.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, so that those skilled in the art can be with
It more fully understands the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
Embodiment 1
Shown in FIG. 1 is the structural schematic diagram of second order electromagnetism hybrid coupled substrate integral wave guide filter, including successively heap
Folded topside metal layer 1, first medium substrate 2, intermediate metal layer 3, second medium substrate 4 and bottom-side metal layer 5.Described
By all identical metallization of multiple shape and size across first medium substrate 2 between topside metal layer 1 and intermediate metal layer 3
Through-hole array 7 is connected, to constitute the first resonant cavity；By passing through the between the intermediate metal layer 3 and bottom-side metal layer 5
The all identical plated-through hole array 10 of multiple shape and size of second medium substrate layer 4 is connected, and constitutes the second resonant cavity.Its
Middle intermediate metal layer has etched magnetic coupling rectangular channel 9 and has been electrically coupled circular hole 8.The top view of intermediate metal layer is as shown in Fig. 2, rectangle
Coupling slot 9 is located at the marginal position of substrate integration wave-guide resonant cavity, and about resonant cavity central symmetry, to realize adjacent resonance
Magnetic coupling between chamber；Circular electric coupling aperture 8 is located at the center of resonant cavity, realizes being electrically coupled between adjacent resonators.
Furthermore input port 6 and output port 7, input port 6 and output end are provided on topside metal layer 1 and bottom-side metal layer 5
Mouth 7 is all using the transition structure of the identical microstrip line of size to co-planar waveguide, and two ports are symmetrical about filter center.
Design principle of the invention is: by introducing hybrid electromagnetic coupling between adjacent resonators, so that filter
Coupling path is double, improves filter using the superposition of two coupling path energy so as to obtain the transmission zero of finite frequency
The Out-of-band rejection of wave device.
The wherein position f of transmission zeromWith filter centre frequency f0Between relationship it is as follows:
Wherein EcAnd McWhat respectively hybrid electromagnetic coupled is electrically coupled component and magnetic coupling component, and total coefficient of coup is by electricity
Coupled component and magnetic coupling component codetermine.By formula (1) as can be seen that transmission zero caused by hybrid electromagnetic coupling
Point, for passband, when be electrically coupled occupy an leading position when, the position of transmission zero is located at the top of passband, works as magnetic
When coupling is occupied an leading position, transmission zero is located at the lower section of passband.So the length LC of adjusting magnetic coupling rectangular channel can be passed through
The magnetic coupling component of hybrid electromagnetic coupling is controlled with the radius RZ that is electrically coupled circular hole and is electrically coupled the size of component, to control
The position of filter transfer zero point and the relative bandwidth of filter.
Shown in Fig. 3 is the transfer curve of the second order hybrid electromagnetic coupling filter of magnetic coupling dominance, Cong Tuzhong
As can be seen that when the length LC of magnetic coupling rectangular channel is 1.4mm, with the increase for being electrically coupled circle hole radius RZ, transmission zero
Position close filter slowly passband, the bandwidth of filter also can be with reduction.
Shown in Fig. 4 is the transfer curve for being electrically coupled dominant second order hybrid electromagnetic coupling filter, from Fig. 4
As can be seen that when the length LC of magnetic coupling rectangular channel is 1.3mm, with the increase for being electrically coupled circle hole radius RZ, transmission zero
Position far from passband, the bandwidth of filter is also with increase.
Embodiment 2
What the present embodiment provided is three rank hybrid electromagnetic coupling-substrate integral wave guide filters, which can be by two
Second order hybrid electromagnetic coupling filter cascades to obtain, coupling topology structure as shown in figure 5, wherein 1 resonator 2 of resonator it
Between coupled using the hybrid electromagnetic of magnetic coupling dominance, it is electric using dominant mixing is electrically coupled between 2 resonator 3 of resonator
Magnetic coupling.
The structural schematic diagram such as Fig. 6 institute for the three rank hybrid electromagnetic coupling-substrate integral wave guide filters that the present embodiment provides
Show.Including stack gradually from top to bottom the first metal layer 12, first medium layer 13, second metal layer 14, second dielectric layer 15,
Third metal layer 16, third dielectric layer 17 and the 4th metal layer 18.Between first metal 12 and second metal layer 16
It is connected by the plated-through hole 21 through first medium layer, constitutes the first resonant cavity.The second metal layer 14 and third
It is connected between metal layer 16 by 15 plated-through hole 24 through second dielectric layer, collectively forms the second resonant cavity.It is described
Third metal layer 16 and the 4th metal layer 18 between by being connected through the plated-through hole of third dielectric layer 17, collectively form
Third resonant cavity.
Input port 19 and output port 30, input terminal are provided on the first metal layer 12 and the 4th metal layer 18
Mouthfuls 19 with output port 30 all using the identical microstrip line of size to the transition structure of co-planar waveguide, wherein output port 30 passes through
Plated-through hole 26 through three layers of medium substrate is by the microstrip line 20 of 50 Ω of couple electromagnetic energy to top layer, in order to improve
The ability of the energy coupling of plated-through hole 26, etching coupling circular hole on the first metal layer 14 and second metal layer 16
23,28, wherein the center of coupling circular hole 23,28 and the center of metal throuth hole 26 coincide, by the radius for adjusting coupling circular hole
It can change the stiffness of coupling of plated-through hole 26.
In order to realize that the hybrid electromagnetic between adjacent resonators couples, magnetic coupling square is provided in the second metal layer
Shape slot 25 and it is electrically coupled hole 22, magnetic coupling rectangular channel 29 is provided on the third metal layer and is electrically coupled hole 27, wherein magnetic
Coupling rectangular slot 25,29 is all located at the edge of resonant cavity, and about resonant cavity central symmetry, be electrically coupled hole 22,27 be all located at it is humorous
Shake chamber middle position.Due to electric field is most strong at the center of resonant cavity and magnetic field is most weak, resonant cavity edge magnetic field most Qiang Er electricity
It is most weak, so magnetic coupling rectangular channel and being electrically coupled hole respectively and influencing the magnetic coupling between resonant cavity and be electrically coupled.Pass through adjusting
It is electrically coupled the radius of circular hole and the length of magnetic coupling rectangular channel, can be controlled separately magnetic coupling coefficient and electric coupling coefficient, i.e. magnetic
The more long then magnetic coupling coefficient of coupling rectangular slot is bigger, and it is bigger to be electrically coupled the more big then electric coupling coefficient of pore radius.
Fig. 7 is the S parameter curve of filter given by the present embodiment, it can be seen that upper stopband and lower resistance in filter
Band introduces a transmission zero respectively.The centre frequency of filter is 29.5GHz, bandwidth 800MHz, the insertion in passband
2dB is lost, return loss is better than 25dB, and the frequency of two transmission zeros is respectively 27.5GHz and 31.2GHz.
Embodiment 3
What the present embodiment provided is quadravalence hybrid electromagnetic coupling-substrate integral wave guide filter, and what Fig. 8 was provided is the filtering
The coupling topology structure of device, it can be seen that using the hybrid electromagnetic coupling of magnetic coupling dominance between 1 resonator 2 of resonator
It closes, using magnetic coupling between 2 resonator 3 of resonator, is dominant between 3 resonator 4 of resonator using being electrically coupled
The hybrid electromagnetic of gesture couples.
Quadravalence hybrid electromagnetic coupling-substrate integral wave guide filter structural schematic diagram shown in Fig. 9, including from top to bottom according to
The secondary the first metal layer 34 being stacked, first substrate layer 33, plated-through hole array 35, second metal layer 39, the second substrate
Layer 40, plated-through hole array 45, third metal layer 50.Input port 32 and output are provided on the first metal layer 34
Port 36, input port 32 and output port 36 are all using the transition structure of the identical microstrip line of size to co-planar waveguide.It is described
Plated-through hole array 35 through first substrate layer 33 and surrounding first jointly with the first metal layer 34, second metal layer 39
Resonant cavity 46 and the 4th resonant cavity 47, the plated-through hole array 45 run through the second substrate layer 40 and and second metal layer
39, third metal layer 50 surrounds the second resonant cavity 48 and third resonant cavity 49 jointly.First resonant cavity 46 and second humorous
Pass through the magnetic coupling rectangular channel 38 etched in second metal layer 39 between vibration chamber 48 and is electrically coupled the coupling that round hole 41 carries out energy
It closes, to realize that hybrid electromagnetic couples, wherein magnetic coupling rectangular channel 38 is located at 48 marginal position of resonant cavity, and about in resonant cavity
The heart is symmetrical, is electrically coupled the center that circular hole 41 is located at resonant cavity 48.The third resonant cavity 49 and the 4th resonant cavity 47 it
Between by the magnetic coupling rectangular channel 44 that etches in second metal layer 39 and be electrically coupled the coupling that round hole 43 carries out energy, constitute mixed
Electromagnetic coupling is closed, wherein magnetic coupling rectangular channel 44 is located at 49 marginal position of resonant cavity, and about resonant cavity central symmetry, is electrically coupled
Circular hole 43 is located at the center of resonant cavity 49.Pass through perceptual window between second resonant cavity 48 and third resonant cavity 49
42 intercouple.
Substrate integral wave guide filter described in the present embodiment is in the first resonant cavity 46 and the second resonant cavity 48, third resonance
It introduces hybrid electromagnetic between chamber 49 and the 4th resonant cavity 47 to couple, the second resonant cavity and third resonant cavity are introduced directly into perceptual windowing
42 magnetic coupling.It, can be in the upper resistance of filter passband by the size of the hybrid electromagnetic coupling between control adjacent resonators
Band and lower stopband respectively introduce a transmission zero, to improve the band of filter under the premise of not increasing filter circuit area
Outer inhibition.Shown in Fig. 10 is the schematic diagram of filter the first metal layer 34 and second metal layer 39, wherein the first resonant cavity 46
And the second piezoelectric coupling strength and coupling strength between resonant cavity 48 can be by adjusting the length of magnetic coupling rectangular channel respectively
LC1 and circle hole radius RZ1 is electrically coupled to adjust, the stiffness of coupling between the second resonant cavity 48 and third resonant cavity 49 can pass through
Change the width W of perceptual window 42 to adjust, the coupling strength and thermocouple between third resonant cavity 49 and the 4th resonant cavity 47
Closing intensity can be adjusted by changing magnetic coupling rectangle slot length LC2 with the radius RZ2 of round hole is electrically coupled respectively.Pass through tune
Save the value of above-mentioned parameter, the position of the transmission zero of filter given by adjustable the present embodiment and the opposite band of filter
It is wide.
Figure 11 gives the S parameter simulation result of quadravalence hybrid electromagnetic coupling-substrate integral wave guide filter, as shown,
The centre frequency of the filter is 29.5GHz, and relative bandwidth 3%, leading to interior insertion loss is about 2dB, and return loss wants excellent
In -25dB, wherein the position of the transmission zero of stopband and lower stopband is all close to passband on filter, to substantially increase filtering
The Out-of-band rejection of device.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
It encloses without being limited thereto.Those skilled in the art's made equivalent substitute or transformation on the basis of the present invention, in the present invention
Protection scope within.Protection scope of the present invention is subject to claims.
Claims (7)
1. a kind of substrate integral wave guide filter based on electromagnetism hybrid coupled characterized by comprising
The first metal layer that sets gradually from top to bottom, first medium layer, second metal layer, second dielectric layer, third metal layer,
Third dielectric layer and the 4th dielectric layer；First plated-through hole array through first medium layer and with the first metal layer and the
Two metal layers collectively form the first resonant cavity；Second plated-through hole array run through second dielectric layer, and with second metal layer,
Third metal layer collectively forms the second resonant cavity；Third plated-through hole array run through third dielectric layer, and with third metal
Layer, the 4th metal layer collectively form third resonant cavity.
2. the substrate integral wave guide filter as described in claim 1 based on electromagnetism hybrid coupled, which is characterized in that described
It is provided with input port on one metal layer, output port is provided on the 4th metal layer, input port and output port are all
Using the transition structure of microstrip line to co-planar waveguide.
3. the substrate integral wave guide filter as claimed in claim 2 based on electromagnetism hybrid coupled, which is characterized in that described
Energy is coupled to 50 Europe on the first metal layer by the 4th plated-through hole through three layers of dielectric layer by output port
On the microstrip transmission line of nurse.
4. the substrate integral wave guide filter as claimed in claim 3 based on electromagnetism hybrid coupled, which is characterized in that described
The first round coupling aperture and the second round coupling aperture, the first round coupling aperture are etched in second metal layer and third metal layer respectively
It coincides with the center of the second round coupling aperture and the center of the 4th plated-through hole.
5. the substrate integral wave guide filter as described in claim 1 based on electromagnetism hybrid coupled, which is characterized in that described
The first magnetic coupling rectangular channel and first is etched on two metal layers and is electrically coupled circular hole, etches the second magnetic coupling on the third metal layer
Rectangular channel and second is electrically coupled circular hole, wherein the first magnetic coupling rectangular channel and the second magnetic coupling rectangular channel are located at the side of resonant cavity
Edge position and about resonant cavity central symmetry, realizes the magnetic coupling of adjacent resonators, first, which is electrically coupled circular hole and second, is electrically coupled
Circular hole is located at the center of resonant cavity, realizes being electrically coupled for adjacent resonators.
6. the substrate integral wave guide filter as claimed in claim 5 based on electromagnetism hybrid coupled, which is characterized in that pass through tune
The the first magnetic coupling rectangle slot length and first that etch in section second metal layer are electrically coupled the radius of circular hole, adjustable lower stopband
The position of transmission zero.
7. the substrate integral wave guide filter as claimed in claim 5 based on electromagnetism hybrid coupled, which is characterized in that pass through tune
The the second magnetic coupling rectangle slot length and second that etch on section third metal layer are electrically coupled the radius of circular hole, stopband transmission in adjusting
The position of zero point.
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| CN111293388A (en) | 2020-06-16 |
| CN109904571B (en) | 2020-06-05 |
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