CN109887882A - 一种在微孔内快速填充纳米粒子的方法 - Google Patents
一种在微孔内快速填充纳米粒子的方法 Download PDFInfo
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- CN109887882A CN109887882A CN201910091582.1A CN201910091582A CN109887882A CN 109887882 A CN109887882 A CN 109887882A CN 201910091582 A CN201910091582 A CN 201910091582A CN 109887882 A CN109887882 A CN 109887882A
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111292950A (zh) * | 2019-12-30 | 2020-06-16 | 电子科技大学 | 一种嵌入式磁心微型化三维电感的制作方法和电感 |
CN112018031A (zh) * | 2020-09-09 | 2020-12-01 | 合肥工业大学 | 一种基于铜纳米粒子填充SiC通孔的方法 |
CN116445037A (zh) * | 2023-06-16 | 2023-07-18 | 合肥晶合集成电路股份有限公司 | 金属纳米墨水及其制备方法、半导体结构的制备方法 |
Citations (5)
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CN101584010A (zh) * | 2007-01-09 | 2009-11-18 | 同和电子科技有限公司 | 银粒子分散液及其制造方法 |
CN102754194A (zh) * | 2010-03-09 | 2012-10-24 | 东京毅力科创株式会社 | 基板的配线方法和半导体制造装置 |
CN103361694A (zh) * | 2013-08-08 | 2013-10-23 | 上海新阳半导体材料股份有限公司 | 一种用于3d铜互连高深宽比硅通孔技术微孔电镀填铜方法 |
CN106011962A (zh) * | 2016-07-13 | 2016-10-12 | 中南大学 | 一种超声外场作用下的tsv电镀方法及系统 |
CN107675233A (zh) * | 2017-09-29 | 2018-02-09 | 中南大学 | Tsv盲孔填充的新方法及系统 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101584010A (zh) * | 2007-01-09 | 2009-11-18 | 同和电子科技有限公司 | 银粒子分散液及其制造方法 |
CN102754194A (zh) * | 2010-03-09 | 2012-10-24 | 东京毅力科创株式会社 | 基板的配线方法和半导体制造装置 |
CN103361694A (zh) * | 2013-08-08 | 2013-10-23 | 上海新阳半导体材料股份有限公司 | 一种用于3d铜互连高深宽比硅通孔技术微孔电镀填铜方法 |
CN106011962A (zh) * | 2016-07-13 | 2016-10-12 | 中南大学 | 一种超声外场作用下的tsv电镀方法及系统 |
CN107675233A (zh) * | 2017-09-29 | 2018-02-09 | 中南大学 | Tsv盲孔填充的新方法及系统 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111292950A (zh) * | 2019-12-30 | 2020-06-16 | 电子科技大学 | 一种嵌入式磁心微型化三维电感的制作方法和电感 |
CN112018031A (zh) * | 2020-09-09 | 2020-12-01 | 合肥工业大学 | 一种基于铜纳米粒子填充SiC通孔的方法 |
CN112018031B (zh) * | 2020-09-09 | 2023-12-19 | 合肥工业大学 | 一种基于铜纳米粒子填充SiC通孔的方法 |
CN116445037A (zh) * | 2023-06-16 | 2023-07-18 | 合肥晶合集成电路股份有限公司 | 金属纳米墨水及其制备方法、半导体结构的制备方法 |
CN116445037B (zh) * | 2023-06-16 | 2023-10-03 | 合肥晶合集成电路股份有限公司 | 金属纳米墨水及其制备方法、半导体结构的制备方法 |
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