CN109862703B - Positioning method for manufacturing mixed pressing plate - Google Patents
Positioning method for manufacturing mixed pressing plate Download PDFInfo
- Publication number
- CN109862703B CN109862703B CN201910254006.4A CN201910254006A CN109862703B CN 109862703 B CN109862703 B CN 109862703B CN 201910254006 A CN201910254006 A CN 201910254006A CN 109862703 B CN109862703 B CN 109862703B
- Authority
- CN
- China
- Prior art keywords
- board
- daughter
- positioning hole
- boards
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention belongs to the field of circuit board manufacturing, and discloses a positioning method for manufacturing a mixed pressing plate, which comprises the following steps: s1: cutting; s2: an inner drill, designing a primary and secondary board positioning hole program, drilling a first positioning hole group on the secondary board, drilling a second positioning hole group on the primary board and drilling a third positioning hole group on the PP board through the primary and secondary board positioning hole program; s3: internally etching, and making and etching inner layer patterns of each daughter board and the mother board; s4: pressing, namely fixing the mother board, the daughter boards and the PP boards by pins and putting the mother board, the daughter boards and the PP boards into a pressing machine for pressing; s5: and (5) removing the pin. Compared with the prior art, the invention ensures that the error of the alignment precision of the daughter board and the mother board after lamination is less than or equal to 3.6mil and the error of the alignment precision between the daughter boards is less than or equal to 3.6mil by controlling the positioning precision of the mother board and the alignment precision of the positioning holes of the mother board and the daughter boards, thereby improving the alignment precision of the mother board and the daughter boards of the mixed compression board.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a positioning method for manufacturing a mixed pressing plate.
Background
In the mixed pressing plate manufacturing process, the traditional positioning mode is as follows: the groove is commonly formed in the mother board, the daughter board is embedded into the mother board for alignment, and the distance between the daughter board and the groove edge on the mother board is 2-3 mil. This locate mode is unfavorable for control daughter board and mother board, the counterpoint of daughter board and daughter board, and the counterpoint precision of mixed clamp board pressfitting back daughter board and mother board is not high, and the counterpoint precision between daughter board and the daughter board is not high.
Therefore, there is a need to provide a new positioning method for manufacturing hybrid board to solve the above-mentioned technical problems.
Disclosure of Invention
The invention provides a positioning method for manufacturing a hybrid pressing plate, and aims to solve the technical problems in the background technology.
The invention is realized in such a way that a positioning method for manufacturing a mixed pressing plate comprises the following steps:
s1: cutting, namely selecting more than two daughter boards, a mother board and more than two PP boards, and shearing according to a preset size;
s2: an inner drill, designing a primary and secondary board positioning hole program, drilling a first positioning hole group on the secondary board, drilling a second positioning hole group on the primary board and drilling a third positioning hole group on the PP board through the primary and secondary board positioning hole program; the first positioning hole group comprises more than two first positioning holes, the second positioning hole group comprises more than two second positioning holes, the diameter of each first positioning hole is equal to that of each second positioning hole, and the positioning precision error of each second positioning hole on the daughter board is 0-3 mil;
s3: after internal etching, inner layer pattern manufacturing and inner layer etching, the alignment precision error between the daughter boards is 0-2mil, and the alignment precision error between each daughter board and the mother board is 0-2 mil;
s4: pressing, namely selecting pins, determining the diameters of the pins according to the alignment precision error obtained in the step S3, fixing the mother board, the daughter boards and the PP boards by the pins, and then sending the fixed mother board, the daughter boards and the PP boards into a pressing machine for pressing to obtain a mixed pressing board, wherein the alignment precision error between the daughter boards and the mother board in the mixed pressing board is 0-3.6mil, and the alignment precision error between the daughter boards in the mixed pressing board is 0-3.6 mil;
s5: removing the pins, and sawing off the pins on the mixed pressing plate by using a tool;
in the step S2, the third positioning hole group includes more than two third positioning holes; the number of the first positioning holes, the number of the second positioning holes and the number of the third positioning holes are equal, and the diameter of the third positioning holes is larger than that of the first positioning holes.
Preferably, after step S3 and before step S4, the method further includes: and forming the daughter board, the mother board and the PP board.
Preferably, after the daughter board molding and the mother board molding are finished, the daughter board is browned and the mother board is browned; step S4 was completed within forty-eight hours after the completion of browning.
Preferably, the thickness of the mother board is H1, the total thickness of all the daughter boards is H2, the total thickness of all the PP boards is H3, and the length of the pin is 0.1mm-0.25mm smaller than the sum of H1, H2 and H3.
Preferably, in step S4, the difference between the diameter of the pin and the diameter of the first positioning hole is equal to the difference between the alignment accuracy errors of each of the daughter boards and the mother board, and the number of the pins is equal to the number of the first positioning holes, each pin is inserted into the first positioning hole group, and each daughter board and/or each PP board is laminated on the mother board along the pin.
Preferably, the pin is a cylindrical pin.
Preferably, the material of cylindric lock is fire-resistant material.
Preferably, the tool in step S5 is a power saw.
Preferably, the diameter of the drill bit of the electric saw is equal to the diameter of the third positioning hole.
Compared with the prior art, the invention ensures that the error of the alignment precision of the daughter board and the mother board after lamination is less than or equal to 3.6mil and the error of the alignment precision between the daughter boards is less than or equal to 3.6mil by controlling the positioning precision of the mother board and the alignment precision of the positioning holes of the mother board and the daughter boards, thereby improving the alignment precision of the mother board and the daughter boards of the mixed compression board.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic sectional view taken along line a-a in fig. 1.
In the figure:
1. the mixed plate comprises a mixed plate body, 2, a sub-plate body, 3, a mother plate body, 4, a PP plate body, 5, a first positioning hole, 6, a second positioning hole, 7 and a third positioning hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-2, a positioning method for manufacturing a hybrid pressing plate comprises the following steps:
step S1: selecting 3 daughter boards 2, a mother board 3 and 3 PP boards 4, and shearing according to a preset size;
step S2: designing a mother-daughter board positioning hole program, respectively drilling 3 second positioning holes 6 on each daughter board 2, 3 first positioning holes 5 on the mother board and 3 third positioning holes 7 on each PP board through the mother-daughter board positioning hole program on a drilling machine. The positioning accuracy error of locating hole is 3mil on each daughter board 2, and the positioning accuracy error between 2 daughter boards is 3mil promptly, and the positioning accuracy error between the locating hole is 3mil on 2 daughter boards and 3 mother boards, and the positioning accuracy error between 2 daughter boards and 3 mother boards is 3mil promptly. The diameter of the first positioning hole 5 and the diameter of the second positioning hole 6 are both 2.1mm, namely, the alignment precision error between the daughter board 2 and the mother board 3 is 0, and the diameter of the third positioning hole 7 is 2.5 mm.
In step S3, after the mother board 3 and each daughter board 2 are subjected to inner layer pattern fabrication and inner layer etching, the diameters of the positioning holes on the daughter boards are changed due to expansion and contraction of the boards 2 in the process, and the diameters of the positioning holes on the daughter boards 2 are reduced by 1mil or increased by 1 mil. The alignment precision error between the daughter boards 2 is 2mil, and the alignment precision error between each daughter board 2 and the mother board 3 is 2 mil;
and step S4, selecting pins according to the alignment precision error obtained in the step S3, wherein the diameter of each selected 3 pins is 2.05mm, inserting each pin into each first positioning hole 5, overlapping each daughter board 2 and each PP board 4 on the mother board 3 along the pins, and the difference between the diameter of each pin and the diameter of each positioning hole on the mother board is equal to the alignment precision error obtained in the step S3, so that the pins can be smoothly inserted into the mother board, and the generation of new alignment precision errors is avoided. After the pins are inserted, the daughter board 2, the mother board 3, the PP board 4 and the pins are jointly sent into a pressing machine for pressing, and then the mixed pressing board 1 is obtained. The alignment precision error between the daughter board 2 and the mother board 3 of the mixed pressure board 1 includes the positioning precision error of the daughter board in step S2 and the alignment precision error of the mother board in step S3, that is, the alignment precision error between the daughter board 2 and the mother board 3 in the mixed pressure board 1 is 3.6 mil. The alignment accuracy error between the sub-boards 2 of the mixed-pressure board 1 includes the positioning accuracy error between the sub-boards 2 in step S2 and the alignment accuracy error between the sub-boards 2 in step S3, that is, the alignment accuracy error between the sub-boards 2 in the mixed-pressure board 1 is 3.6 mil.
And step S5, sawing off the pins on the mixed pressing plate 1 by using an electric saw, wherein the diameter of an electric nozzle of the electric saw is 2.5mm, the diameter of the electric nozzle is equal to that of the third positioning hole 7, and the PP plate 4 overflowing the third positioning hole 7 in the pressing process can be sawed off while the pins are sawed off.
Before step S4, the method further includes: the daughter board 2, the mother board 3, and the PP board 4 are molded. After the daughter board 2 and the mother board 3 are formed, the daughter board 2 and the mother board 3 are browned; step S4 is completed within forty-eight hours after the completion of the browning of the mother board 3 of the daughter board 2. And after the browning of the daughter board 2 and the mother board 3 is finished, the daughter board and the mother board absorb moisture, so that the alignment precision of the mother board and the daughter board is influenced. The design can ensure that the alignment precision of the mother-son board is not influenced.
Further, the thickness of the mother board is 2mm, the total thickness of all the daughter boards is 2mm, the total thickness of all the PP boards is 0.5mm, the length of the selected pin is 4.35mm, and the length of the pin is shorter than (2 mm +2mm +0.5 mm). The design can ensure that the pressing process is not influenced by the pins, and the quality of the mixed pressing plate after pressing is ensured.
Further, in step S4, the pin is a cylindrical pin, and the material of the cylindrical pin is a flame retardant material. The flame-retardant material can ensure that the cylindrical pin cannot be deformed or damaged in the pressing process in a high-temperature environment, and the smooth pressing is ensured.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A positioning method for manufacturing a mixed compression plate is characterized by comprising the following steps:
s1: cutting, namely selecting more than two daughter boards, a mother board and more than two PP boards, and shearing according to a preset size;
s2: an inner drill, designing a primary and secondary board positioning hole program, drilling a first positioning hole group on the secondary board, drilling a second positioning hole group on the primary board and drilling a third positioning hole group on the PP board through the primary and secondary board positioning hole program; the first positioning hole group comprises more than two first positioning holes, the second positioning hole group comprises more than two second positioning holes, the diameter of each first positioning hole is equal to that of each second positioning hole, and the positioning precision error of each second positioning hole on the daughter board is 0-3 mil;
s3: after internal etching, inner layer pattern manufacturing and inner layer etching, the alignment precision error between the daughter boards is 0-2mil, and the alignment precision error between each daughter board and the mother board is 0-2 mil;
s4: pressing, namely selecting pins, determining the diameters of the pins according to the alignment precision error obtained in the step S3, fixing the mother board, the daughter boards and the PP boards by the pins, and then sending the fixed mother board, the daughter boards and the PP boards into a pressing machine for pressing to obtain a mixed pressing board, wherein the alignment precision error between the daughter boards and the mother board in the mixed pressing board is 0-3.6mil, and the alignment precision error between the daughter boards in the mixed pressing board is 0-3.6 mil;
s5: removing the pins, and sawing off the pins on the mixed pressing plate by using a tool;
in the step S2, the third positioning hole group includes more than two third positioning holes; the number of the first positioning holes, the number of the second positioning holes and the number of the third positioning holes are equal, and the diameter of the third positioning holes is larger than that of the first positioning holes.
2. The method of claim 1, further comprising, after step S3 and before step S4: and forming the daughter board, the mother board and the PP board.
3. The positioning method for manufacturing the hybrid board according to claim 2, wherein after the daughter board molding and the mother board molding are completed, the daughter board is browned and the mother board is browned; step S4 was completed within forty-eight hours after the completion of browning.
4. The method as claimed in claim 3, wherein the thickness of the mother board is H1, the total thickness of all the daughter boards is H2, the total thickness of all the PP boards is H3, and the length of the pin is 0.1mm-0.25mm smaller than the sum of H1, H2 and H3.
5. The method as claimed in claim 4, wherein the difference between the diameter of the pin and the diameter of the first positioning hole is equal to the difference between the alignment accuracy errors of each of the daughter boards and the mother board and the number of the pins is equal to the number of the first positioning holes in step S4, each of the pins is inserted into the first positioning hole group, and each of the daughter boards and/or each of the PP boards is laminated on the mother board along the pin.
6. The method as claimed in claim 5, wherein the pin is a cylindrical pin.
7. The method as claimed in claim 6, wherein the cylindrical pin is made of a flame-retardant material.
8. The method as claimed in claim 7, wherein the tool is a power saw in step S5.
9. The method of claim 8, wherein the diameter of the drill of the electric saw is equal to the diameter of the third positioning hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910254006.4A CN109862703B (en) | 2019-03-30 | 2019-03-30 | Positioning method for manufacturing mixed pressing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910254006.4A CN109862703B (en) | 2019-03-30 | 2019-03-30 | Positioning method for manufacturing mixed pressing plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109862703A CN109862703A (en) | 2019-06-07 |
| CN109862703B true CN109862703B (en) | 2021-06-04 |
Family
ID=66902768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910254006.4A Active CN109862703B (en) | 2019-03-30 | 2019-03-30 | Positioning method for manufacturing mixed pressing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109862703B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110505769B (en) * | 2019-09-17 | 2020-07-10 | 四川深北电路科技有限公司 | Positioning and pressing method for manufacturing mixed pressing plate |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013102035A (en) * | 2011-11-08 | 2013-05-23 | Ngk Spark Plug Co Ltd | Ceramic substrate and manufacturing method thereof |
| WO2018071874A2 (en) * | 2016-10-13 | 2018-04-19 | Sanmina Corporation | Improved multilayer printed circuit board via hole registration and accuracy |
| CN107278063A (en) * | 2017-08-07 | 2017-10-20 | 大连崇达电路有限公司 | Print processing method of multi-layer circuit board |
| CN108990318A (en) * | 2018-07-26 | 2018-12-11 | 深圳崇达多层线路板有限公司 | A kind of method for manufacturing circuit board of loophole lamination mistake proofing |
-
2019
- 2019-03-30 CN CN201910254006.4A patent/CN109862703B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109862703A (en) | 2019-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108513458B (en) | Method for processing super-thick 5G antenna PCB module | |
| CN107484356B (en) | Manufacturing method of thick copper sandwich aluminum substrate | |
| CN109862703B (en) | Positioning method for manufacturing mixed pressing plate | |
| CN105517370A (en) | Circuit board pad machining method | |
| CN104470265A (en) | Manufacturing method of multi-layer circuit board | |
| CN109932779A (en) | A kind of integrated optical modular construction and its processing method with isolator | |
| CN102781173B (en) | Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material | |
| CN101932199A (en) | The perforate processing method of printed base plate | |
| CN111885856A (en) | Fusion method and tool for improving interlayer alignment precision of multilayer circuit board | |
| CN103987195B (en) | Boring method for printed substrate | |
| WO2013180088A1 (en) | Metal core substrate, method for manufacturing metal core substrate; and core plate used for metal core substrate and method for manufacturing metal core substrate | |
| CN110996559A (en) | Blind hole plate lamination positioning method | |
| CN104427785A (en) | Manufacturing method of blind holes different in pore diameter, and printed circuit board | |
| CN103929878A (en) | Method for manufacturing PCB substrate plug hole and structure of PCB substrate plug hole | |
| CN116477963A (en) | Method for producing ceramic copper-clad substrate with pins by using porous ceramic | |
| CN110708878B (en) | Processing method of printed circuit board | |
| KR102011840B1 (en) | Method of manufacturing circuit board and chip package and circuit board prepared by the same | |
| CN113068309B (en) | Manufacturing method of heat dissipation circuit board | |
| CN110708896B (en) | Manufacturing method of HDI board | |
| CN113923895A (en) | HDI board manufacturing method for improving through blind hole matching precision and HDI board | |
| KR101956228B1 (en) | hole processing method on FR-4 frame and Pi film for using semiconductor chip test socket | |
| CN114900967B (en) | Cover opening processing method for rigid-flex board | |
| CN113784512B (en) | Method for manufacturing semi-metallized hole of circuit board | |
| CN112839453A (en) | Rigid-flexible combined circuit board and preparation method thereof | |
| CN112954905A (en) | Manufacturing process of PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |