CN109690698A - 柔性基板用银糊 - Google Patents

柔性基板用银糊 Download PDF

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Publication number
CN109690698A
CN109690698A CN201780056367.7A CN201780056367A CN109690698A CN 109690698 A CN109690698 A CN 109690698A CN 201780056367 A CN201780056367 A CN 201780056367A CN 109690698 A CN109690698 A CN 109690698A
Authority
CN
China
Prior art keywords
conductive film
silver paste
silver
base board
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780056367.7A
Other languages
English (en)
Chinese (zh)
Inventor
中山和尊
酒井章宏
隅田佐保子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Original Assignee
Noritake Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Publication of CN109690698A publication Critical patent/CN109690698A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Powder Metallurgy (AREA)
CN201780056367.7A 2016-09-16 2017-09-04 柔性基板用银糊 Pending CN109690698A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-182291 2016-09-16
JP2016182291 2016-09-16
PCT/JP2017/031811 WO2018051830A1 (ja) 2016-09-16 2017-09-04 フレキシブル基板用銀ペースト

Publications (1)

Publication Number Publication Date
CN109690698A true CN109690698A (zh) 2019-04-26

Family

ID=61618718

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780056367.7A Pending CN109690698A (zh) 2016-09-16 2017-09-04 柔性基板用银糊

Country Status (5)

Country Link
JP (1) JP6734925B2 (ja)
KR (1) KR20190054095A (ja)
CN (1) CN109690698A (ja)
TW (1) TW201840752A (ja)
WO (1) WO2018051830A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110544565A (zh) * 2019-08-30 2019-12-06 江苏丰创新材料有限公司 一种异相导电膜的制备方法
CN111508637A (zh) * 2020-04-28 2020-08-07 无锡晶睿光电新材料有限公司 一种在80℃下具有高导电性的银浆及其制备方法
CN114905184A (zh) * 2021-02-07 2022-08-16 深圳先进电子材料国际创新研究院 一种银焊膏及其制备方法和应用

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109903885B (zh) * 2018-12-29 2020-10-02 无锡帝科电子材料股份有限公司 导电浆料及其应用、太阳能电池电极和太阳能电池
JP7409654B2 (ja) * 2020-04-17 2024-01-09 十条ケミカル株式会社 スクリーン印刷用導電性樹脂組成物、及びプリント配線板
JP7494583B2 (ja) 2020-06-08 2024-06-04 住友金属鉱山株式会社 厚膜抵抗体組成物及びそれを含む厚膜抵抗ペースト

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10162646A (ja) * 1996-11-28 1998-06-19 Asahi Chem Ind Co Ltd 導電性樹脂組成物
CN102737753A (zh) * 2011-03-31 2012-10-17 太阳控股株式会社 导电性糊剂及导电图案
CN104488040A (zh) * 2012-07-20 2015-04-01 东洋纺株式会社 激光刻蚀加工用导电性糊剂、导电性薄膜以及导电性层积体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003203523A (ja) * 2002-01-08 2003-07-18 Fujikura Ltd 導電ペースト
JP5003895B2 (ja) * 2007-12-13 2012-08-15 戸田工業株式会社 銀微粒子とその製造方法、導電性膜の製造方法
JP2010135180A (ja) * 2008-11-06 2010-06-17 Sekisui Chem Co Ltd 導電性ペースト
JP5785023B2 (ja) 2011-08-03 2015-09-24 第一工業製薬株式会社 銀粒子分散体組成物、これを用いた導電性回路および導電性回路の形成方法
US8502067B2 (en) * 2011-09-20 2013-08-06 E. I. Du Pont De Nemours And Company Method of manufacturing solar cell electrode and conductive paste
US9245664B2 (en) 2011-12-02 2016-01-26 E I Du Pont De Nemours And Company Conductive metal ink
WO2014084275A1 (ja) 2012-11-30 2014-06-05 ナミックス株式会社 導電ペースト及びその製造方法
KR20140094690A (ko) * 2013-01-21 2014-07-31 엘에스전선 주식회사 전도성 잉크 조성물 및 이로부터 전극을 형성하는 방법
WO2016063931A1 (ja) * 2014-10-24 2016-04-28 ナミックス株式会社 導電性組成物及びそれを用いた電子部品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10162646A (ja) * 1996-11-28 1998-06-19 Asahi Chem Ind Co Ltd 導電性樹脂組成物
CN102737753A (zh) * 2011-03-31 2012-10-17 太阳控股株式会社 导电性糊剂及导电图案
CN104488040A (zh) * 2012-07-20 2015-04-01 东洋纺株式会社 激光刻蚀加工用导电性糊剂、导电性薄膜以及导电性层积体

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110544565A (zh) * 2019-08-30 2019-12-06 江苏丰创新材料有限公司 一种异相导电膜的制备方法
CN111508637A (zh) * 2020-04-28 2020-08-07 无锡晶睿光电新材料有限公司 一种在80℃下具有高导电性的银浆及其制备方法
CN111508637B (zh) * 2020-04-28 2021-08-31 无锡晶睿光电新材料有限公司 一种在80℃下具有高导电性的银浆及其制备方法
CN114905184A (zh) * 2021-02-07 2022-08-16 深圳先进电子材料国际创新研究院 一种银焊膏及其制备方法和应用
CN114905184B (zh) * 2021-02-07 2024-01-26 深圳先进电子材料国际创新研究院 一种银焊膏及其制备方法和应用

Also Published As

Publication number Publication date
TW201840752A (zh) 2018-11-16
JP6734925B2 (ja) 2020-08-05
WO2018051830A1 (ja) 2018-03-22
JPWO2018051830A1 (ja) 2019-07-04
KR20190054095A (ko) 2019-05-21

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Application publication date: 20190426

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