CN109687830A - A kind of ultra-wideband amplifier based on HBT-HEMT Stack Technology - Google Patents

A kind of ultra-wideband amplifier based on HBT-HEMT Stack Technology Download PDF

Info

Publication number
CN109687830A
CN109687830A CN201811593520.2A CN201811593520A CN109687830A CN 109687830 A CN109687830 A CN 109687830A CN 201811593520 A CN201811593520 A CN 201811593520A CN 109687830 A CN109687830 A CN 109687830A
Authority
CN
China
Prior art keywords
network
cecg
inductance
order matrix
input terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811593520.2A
Other languages
Chinese (zh)
Other versions
CN109687830B (en
Inventor
林倩
邬海峰
张晓明
刘林盛
潘赢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qinghai Nationalities University
Original Assignee
Qinghai Nationalities University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qinghai Nationalities University filed Critical Qinghai Nationalities University
Priority to CN201811593520.2A priority Critical patent/CN109687830B/en
Publication of CN109687830A publication Critical patent/CN109687830A/en
Application granted granted Critical
Publication of CN109687830B publication Critical patent/CN109687830B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/42Modifications of amplifiers to extend the bandwidth
    • H03F1/48Modifications of amplifiers to extend the bandwidth of aperiodic amplifiers
    • H03F1/483Modifications of amplifiers to extend the bandwidth of aperiodic amplifiers with field-effect transistors
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/56Modifications of input or output impedances, not otherwise provided for
    • H03F1/565Modifications of input or output impedances, not otherwise provided for using inductive elements
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189High-frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H03F3/193High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only with field-effect devices
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/21Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
    • H03F3/211Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45Differential amplifiers
    • H03F3/45071Differential amplifiers with semiconductor devices only
    • H03F3/45076Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/45179Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using MOSFET transistors as the active amplifying circuit
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/451Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2203/00Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
    • H03F2203/45Indexing scheme relating to differential amplifiers
    • H03F2203/45302Indexing scheme relating to differential amplifiers the common gate stage of a cascode dif amp being controlled

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Amplifiers (AREA)

Abstract

The invention discloses a kind of ultra-wideband amplifiers based on HBT-HEMT Stack Technology, distribution network is inputted including second-order matrix, network is balanced between second-order matrix grade, second-order matrix output synthesis network, first CECG stacked transistors, 2nd CECG stacked transistors, 3rd CECG stacked transistors, 4th CECG stacked transistors, network and second-order matrix output synthesis network the first feeding network being connected and the second feeding network being connected with first to fourth CECG stacked transistors are balanced between second-order matrix grade, core architecture of the present invention amplifies network using the matrix that first to fourth CECG stacks transistor npn npn composition, combine second-order matrix power amplifier ultra wide band Frequency Response, the high frequency mismatch feature of amplifier is stacked so as to improve traditional single CE stacking or CG, so that Entire power amplifier obtains good wide band high-gain and high-power output ability.

Description

A kind of ultra-wideband amplifier based on HBT-HEMT Stack Technology
Technical field
The present invention relates to hetero-junction bipolar transistor radio-frequency power amplifier and integrated circuit fields, especially for super A kind of ultra-wideband amplifier based on HBT-HEMT Stack Technology of the transmitting module application of broadband transceiver end.
Background technique
With the fast development of spread spectrum, software radio, ultra-wideband communications, WLAN (WLAN) etc., radio frequency Front-end transceiver also develops to high-performance, highly integrated, low-power consumption direction.Therefore the urgent demand transmitter in market radio frequency with Microwave power amplifier has the performances such as ultra wide band, high-output power, high efficiency, low cost, and integrated circuit is exactly expected to completely The key technology of the foot market demand.
However, when realizing radio frequency and microwave power amplifier chip circuit using integrated circuit technology design, performance Certain restriction is received with cost, major embodiment:
(1) wide band high-gain amplifying power is limited: traditional single-transistor receives the influence of gain bandwidth product, needs to sacrifice increasing Benefit could obtain ultra wide band amplifying power, and therefore, wide band high-gain amplifying power is severely limited.
(2) broadband high-power amplifying power is limited: the characteristic frequency of transistor is higher and higher in semiconductor technology, thus band Low breakdown voltage is carried out to limit the power capacity of one-transistor.In order to obtain power capabilities, multichannel is generally required Transistor power synthesis, but since the energy loss of multichannel synthesis network causes the efficiency of power amplifier relatively low, circuit It is unable to satisfy low-power consumption or green communications demand.
The circuit structure of common ultra-wideband high power amplifier has very much, most typically traditional distributed amplifier, But the requirement that traditional distributed amplifier will meet parameters simultaneously is very difficult, is primarily due to:
1. core amplifying circuit is multiple single-transistors using distributed air-defense in traditional distributed power amplifier The mode of arrangement is realized, since single-transistor is influenced by parasitic parameter, when being increased with working frequency, and power gain meeting It significantly reduces while power characteristic etc. also can significantly deteriorate, therefore in order to obtain the flat enlarged structure of ultra wide band, it is necessary to is sacrificial Domestic animal low-frequency gain carrys out balanced high-frequency loss, causes the ultra wide band gain of traditional distributed amplifier very low;
2. also having and being put using Cascode pair transistor distribution to improve the influence that amplifier gain improves isolation Big structure, but although Cascode pair transistor increases circuit isolation, but can not gain become with what frequency significantly deteriorated Gesture also cannot achieve the optimum impedance matching between Cascode pair transistor, to reduce characteristics of output power.
It can thus be seen that the ultra-wide band radio-frequency Designing power amplifier difficult point based on integrated circuit technology are as follows: ultra wide band Lower high-power output difficulty is larger;The distributed amplification structure of traditional single transistor structure or Cascode transistor exists very More limitations.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of ultra-wideband amplifier based on HBT-HEMT Stack Technology, The advantages of combining based on triode Stack Technology and matrix amplifier has high-power output ability, high power under ultra wide band Gain, it is good input, output matching properties, and it is at low cost the advantages that.
The technical scheme to solve the above technical problems is that a kind of ultra wide band based on HBT-HEMT Stack Technology Amplifier, which is characterized in that inputted between distribution network, second-order matrix grade including second-order matrix and balance network, second-order matrix output Synthesize network, the first CECG stacked transistors, the 2nd CECG stacked transistors, the 3rd CECG stacked transistors, the 4th CECG heap Folded transistor and balanced between second-order matrix grade the first feeding network that network and second-order matrix output synthesis network are connected and The second feeding network being connected with first to fourth CECG stacked transistors;
The input terminal of second-order matrix input distribution network is the ultra-wideband amplifier entirely based on HBT-HEMT Stack Technology Input terminal, the first output end connect with the input terminal of the first CECG stacked transistors, second output terminal and the 2nd CECG The input terminal of stacked transistors connects;
The first port that network is balanced between second-order matrix grade is connect with the first output end of the first feeding network, second-order matrix The input terminal of the second port of network and the output end of the first CECG stacked transistors, the 3rd CECG stacked transistors is balanced between grade It connects simultaneously, the third port of network and output end, the 4th CECG of the 2nd CECG stacked transistors is balanced between second-order matrix grade The input terminal of stacked transistors connects simultaneously;
The output end of second-order matrix output synthesis network is the ultra-wideband amplifier entirely based on HBT-HEMT Stack Technology Output end, first input end connect with the second output terminal of the first feeding network, the second input terminal and the 3rd CECG heap The output end connection of folded transistor, third input terminal are connect with the output end of the 4th CECG stacked transistors;
The input terminal of first feeding network is connect with supply voltage Vdd;
The input terminal of second feeding network is connect with supply voltage Vcc, the output end of the second feeding network and first to The feed end of four CECG stacked transistors connects.
Further, second-order matrix input distribution network includes putting from the ultra wide band based on HBT-HEMT Stack Technology The inductance L that big device input terminal is sequentially connected in series to ground terminalb1、Lb2、Lb3, capacitance Cload1With load resistance Rload1, inductance Lb1 With Lb2Connecting node be second-order matrix input distribution network the first output end, inductance Lb2With Lb3Connecting node be second order The second output terminal of Input matrix distribution network.
The beneficial effect of above-mentioned further scheme is: the second-order matrix input distribution network that the present invention uses is in addition to being able to achieve The distributed power distribution of input radio frequency signal is outer, moreover it is possible to carry out impedance matching to radio-frequency input signals and improve the stabilization of circuit Property.
Further, the input terminal of N CECG stacked transistors connects capacitor Cbj, capacitor CbjThe other end connect cascode Pipe QsjBase stage, QsjFeed inductance L in sequential series between base stage and the feed end of N CECG stacked transistorssjAnd feedback Resistance Rsj, cascode pipe QsjEmitter ground connection, QsjCollector connect field effect transistor MtjSource electrode, MtjGrid with Resistance RrjWith capacitor CtjIt is connected, capacitor CtjThe other end ground connection, resistance RrjThe other end connect resistance R simultaneouslypj、Rqj, resistance RpjThe other end ground connection, resistance RqjThe other end be connected to field effect transistor MtjDrain electrode field effect transistor MtjDrain electrode Connect the output end of N CECG stacked transistors, wherein N mono-, two, three, four, j=1,2,3,4.
The beneficial effect of above-mentioned further scheme is: the CECG stacking transistor npn npn that the present invention uses, which can be obviously improved, to be put The gain of big device and power capacity, while improving mismatch properties between the grade of conventional CSCG stacking transistor npn npn, it reduces equivalent defeated Capacitor expands amplifier bandwidth out.
Further, network is balanced between second-order matrix grade includes the resistance R being sequentially connected in seriesload2, capacitor Cload2, inductance Lm1、 Lm2、Lm3, capacitor Cload3, resistance Rload3, and Rload2And Rload3The other end be grounded simultaneously, capacitor Cload2With inductance Lm1 Connected node balances the first port of network, inductance L between second-order matrix gradem1With inductance Lm2Connected node is second moment The second port of network, inductance L are balanced between battle array gradem2With inductance Lm3Connected node balances the of network between second-order matrix grade Three output ports.
The beneficial effect of above-mentioned further scheme is: network is balanced between the second-order matrix grade that the present invention uses in addition to being able to achieve The distributed power distribution of interstage radio frequency signal is outer, moreover it is possible to carry out impedance matching to radio frequency inter stage signal and improve the stabilization of circuit Property.
Further, second-order matrix output synthesis network includes the resistance R being sequentially connected in seriesload4, capacitor Cload4, inductance Lc1、 Lc2、Lc3, capacitor Cout, resistance Rload4The other end ground connection, capacitor CoutThe other end be second-order matrix output synthesis network it is defeated Outlet, capacitor Cload4With inductance Lc1Connected node is the first input end at second-order matrix output synthesis network, inductance Lc1With electricity Feel Lc2Connected node is second input terminal at second-order matrix output synthesis network, inductance Lc2With inductance Lc3Connected node is The third input terminal at second-order matrix output synthesis network.
The beneficial effect of above-mentioned further scheme is: the second-order matrix output synthesis network that the present invention uses is in addition to being able to achieve The distributed power synthesis for exporting radiofrequency signal is outer, moreover it is possible to carry out impedance matching to radio frequency output signal and improve the effect of circuit Rate.
Further, the input terminal of the first feeding network connects ground capacity C simultaneouslyvdd, feed inductance Lvdd1And Lvdd2, feedback Inductance Lvdd1The other end be the first feeding network the first output end, feed inductance Lvdd2The other end be the first transmission network The second output terminal of network.
Further, the input terminal of the second feeding network connects resistance RVCC1And RVCC2, RVCC3, resistance RVCC2The other end Field effect transistor M is connected simultaneouslyvccGrid and electricity RVCC3, resistance RVCC2The other end and field effect transistor MvccGrid With cascode pipe QvccCollector connect simultaneously, cascode pipe QvccEmitter ground connection, MvccSource electrode and QvccBase stage pass through resistance RVCC4Connection, RVCC1With RVCC3Node and field effect transistor MvccDrain electrode connection, Rvcc4With MvccSource electrode tie point be the The output end of two feeding networks.
Detailed description of the invention
Fig. 1 is power amplifier functional block diagram of the present invention;
Fig. 2 is power amplifier circuit figure of the present invention.
Specific embodiment
Carry out detailed description of the present invention illustrative embodiments with reference to the drawings.It should be appreciated that shown in attached drawing and The embodiment of description is only exemplary, it is intended that is illustrated the principle and spirit of the invention, and is not limited model of the invention It encloses.
The embodiment of the invention provides a kind of ultra-wideband amplifier based on HBT-HEMT Stack Technology, one kind being based on HBT- The ultra-wideband amplifier of HEMT Stack Technology, which is characterized in that input between distribution network, second-order matrix grade and put down including second-order matrix Weigh network, second-order matrix output synthesis network, the first CECG stacked transistors, the 2nd CECG stacked transistors, the 3rd CECG heap Folded transistor, the 4th CECG stacked transistors and balance network and second-order matrix output synthesis network phase between second-order matrix grade The first feeding network even.And network and the first CECG stacked transistors, the 2nd CECG stacking are balanced between second-order matrix grade The second connected feeding network of transistor, the 3rd CECG stacked transistors, the 4th CECG stacked transistors.
As shown in Figure 1, the input terminal of second-order matrix input distribution network is entirely super based on HBT-HEMT Stack Technology The input terminal of broad band amplifier, the first output end are connect with the input terminal of the first CECG stacked transistors, second output terminal It is connect with the input terminal of the 2nd CECG stacked transistors;
The first port that network is balanced between second-order matrix grade is connect with the first output end of the first feeding network, second-order matrix The input terminal of the second port of network and the output end of the first CECG stacked transistors, the 3rd CECG stacked transistors is balanced between grade It connects simultaneously, the third port of network and output end, the 4th CECG of the 2nd CECG stacked transistors is balanced between second-order matrix grade The input terminal of stacked transistors connects simultaneously;
The output end of second-order matrix output synthesis network is the ultra-wideband amplifier entirely based on HBT-HEMT Stack Technology Output end, first input end connect with the second output terminal of the first feeding network, the second input terminal and the 3rd CECG heap The output end connection of folded transistor, third input terminal are connect with the output end of the 4th CECG stacked transistors;
The input terminal of first feeding network is connect with supply voltage Vdd;
The input terminal of second feeding network is connect with supply voltage Vcc, the output end of the second feeding network and first to The feed end of four CECG stacked transistors connects.
As shown in Fig. 2, second-order matrix input distribution network includes the inductance L being sequentially connected in series from amplifier in groundb1、 Lb2、Lb3, capacitance Cload1With load resistance Rload1, inductance Lb1With Lb2Connecting node be second-order matrix input distribution network The first output end, inductance Lb2With Lb3Connecting node be second-order matrix input distribution network second output terminal;
The input terminal of N CECG stacked transistors (wherein N is one, two, three, four) connects capacitor Cbj(wherein j=1,2, 3,4), capacitor CbjThe other end connect cascode pipe QsjBase stage, QsjBetween base stage and the feed end of N CECG stacked transistors Feed inductance L in sequential seriessjAnd feed resistance Rsj, cascode pipe QsjEmitter ground connection, QsjCollector connect field-effect Transistor MtjSource electrode, MtjGrid and resistance RrjWith capacitor CtjIt is connected, capacitor CtjThe other end ground connection, resistance RrjIt is another It holds while connecting resistance Rpj、Rqj, resistance RpjThe other end ground connection, resistance RqjThe other end be connected to field effect transistor Mtj's Drain field effect transistor MtjDrain electrode connection N CECG stacked transistors output end;
It includes the resistance R being sequentially connected in series that network is balanced between second-order matrix gradeload2, capacitor Cload2, inductance Lm1、Lm2、Lm3, electricity Hold Cload3, resistance Rload3, and Rload2And Rload3The other end be grounded simultaneously, capacitor Cload2With inductance Lm1Connected node The first port of network, inductance L are balanced between second-order matrix gradem1With inductance Lm2Connected node balances between second-order matrix grade The second port of network, inductance Lm2With inductance Lm3Connected node balances the third output port of network between second-order matrix grade;
Second-order matrix output synthesis network includes the resistance R being sequentially connected in seriesload4, capacitor Cload4, inductance Lc1、Lc2、Lc3, electricity Hold Cout, resistance Rload4The other end ground connection, capacitor CoutThe other end be second-order matrix output synthesis network output end, capacitor Cload4With inductance Lc1Connected node is the first input end at second-order matrix output synthesis network, inductance Lc1With inductance Lc2It is connected Node be second-order matrix output synthesis network the second input terminal, inductance Lc2With inductance Lc3Connected node is second-order matrix The third input terminal at output synthesis network;
The input terminal of first feeding network connects ground capacity C simultaneouslyvdd, feed inductance Lvdd1And Lvdd2, feed inductance Lvdd1The other end be the first feeding network the first output end, feed inductance Lvdd2The other end be the of the first feeding network Two output ends;
The input terminal of second feeding network connects resistance RVCC1And RVCC2, RVCC3, resistance RVCC2The other end connect field simultaneously Effect transistor MvccGrid and electricity RVCC3, resistance RVCC2The other end and field effect transistor MvccGrid and cascode pipe Qvcc Collector connect simultaneously, cascode pipe QvccEmitter ground connection, MvccSource electrode and QvccBase stage pass through resistance RVCC4Connection, RVCC1 With RVCC3Node and field effect transistor MvccDrain electrode connection, Rvcc4With MvccSource electrode tie point be second feeding network Output end.
Concrete operating principle and process of the invention are introduced below with reference to Fig. 2:
Radio-frequency input signals enters circuit by input terminal IN, and second-order matrix input point is entered in a manner of current distribution formula The inductance L of distribution networkb1、Lb2、Lb3, useful signal is by inputting blocking coupled capacitor Cb1And Cb2Into cascode pipe Qs1And Qs2Base Pole, reflection signal pass through capacitance Cload1Into input absorbing load Rload1, useful signal is again with current distribution formula from crystalline substance Body pipe Qt1And Qt2Collector output, then entered in a manner of current distribution formula and balance network L between second-order matrix gradem1、Lm2、 Lm3, useful signal is by inputting blocking coupled capacitor Cb3And Cb4Into cascode pipe Qs3And Qs4Base stage, reflection signal pass through Capacitance Cload2、Cload3Into absorbing load R between gradeload2、Rload3, last useful signal in a manner of current distribution formula into Enter second-order matrix output synthesis network Lc1、Lc2、Lc3, pass through collector blocking coupled capacitor CoutIt is exported from output end OUT, it is anti- It penetrates incoming signal and passes through capacitance Cload4Into input absorbing load Rload4
Based on foregoing circuit analyze, a kind of ultra-wideband amplifier based on HBT-HEMT Stack Technology proposed by the present invention with The previous amplifier architecture based on integrated circuit technology is the difference is that core architecture stacks crystal using Matrix C ECG Pipe amplifies network:
CECG stacked transistor is very different in structure with traditional one-transistor, is not repeated herein;
CECG stack transistor npn npn and Cascode transistor the difference is that: the piled grids of Cascode transistor Compensating electric capacity is the biggish capacitor of capacitance, and for realizing the AC earth of base stage, and CECG stacks the grid compensation of transistor npn npn Capacitor is the lesser capacitor of capacitance, for realizing the synchronous hunting of grid voltage.
In the ultra-wideband amplifier circuit entirely based on HBT-HEMT Stack Technology, the size of transistor and other direct currents Feed resistance, the size of compensating electric capacity be after the indices such as the gain for comprehensively considering entire circuit, bandwidth and output power certainly Fixed, by the layout design and rational deployment in later period, required indices can be better achieved, realize in ultra wide band Under the conditions of high-power output ability, high power gain, good input and output matching properties.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.

Claims (7)

1. a kind of ultra-wideband amplifier based on HBT-HEMT Stack Technology, which is characterized in that input and distribute including second-order matrix Network, second-order matrix output synthesis network, the first CECG stacked transistors, the 2nd CECG heap are balanced between network, second-order matrix grade Folded transistor, the 3rd CECG stacked transistors, the 4th CECG stacked transistors and the balance network and two between second-order matrix grade Rank Output matrix the first connected feeding network of synthesis network and the second feedback being connected with first to fourth CECG stacked transistors Electric network;
The input terminal of the second-order matrix input distribution network is that the entire ultra wide band based on HBT-HEMT Stack Technology is put The input terminal of big device, the first output end are connect with the input terminal of the first CECG stacked transistors, second output terminal and The input terminal of the 2nd CECG stacked transistors connects;
The first port that network is balanced between the second-order matrix grade is connect with the first output end of first feeding network, described The second port of network is balanced between second-order matrix grade and the output end of the first CECG stacked transistors, the 3rd CECG stack crystalline substance The input terminal of body pipe connects simultaneously, and the third port and the 2nd CECG that network is balanced between the second-order matrix grade stack crystal The output end of pipe, the 4th CECG stacked transistors input terminal connect simultaneously;
The output end of the second-order matrix output synthesis network is that the entire ultra wide band based on HBT-HEMT Stack Technology is put The output end of big device, first input end are connect with the second output terminal of first feeding network, the second input terminal and institute State the output end connection of the 3rd CECG stacked transistors, the output end of third input terminal and the 4th CECG stacked transistors Connection;
The input terminal of first feeding network is connect with supply voltage Vdd;
The input terminal of second feeding network is connect with supply voltage Vcc, the output end of the second feeding network and described first Feed end to the 4th CECG stacked transistors connects.
2. the ultra-wideband amplifier according to claim 1 based on HBT-HEMT Stack Technology, which is characterized in that described two It includes the inductance L being sequentially connected in series from the ultra-wideband amplifier input terminal to ground terminal that rank Input matrix, which distributes network,b1、Lb2、 Lb3, capacitance Cload1With load resistance Rload1, the inductance Lb1With Lb2Connecting node be the second-order matrix input point First output end of distribution network, the inductance Lb2With Lb3Connecting node be the second-order matrix input distribution network second Output end.
3. the ultra-wideband amplifier according to claim 1 based on HBT-HEMT Stack Technology, which is characterized in that described The input terminal of N CECG stacked transistors connects capacitor Cbj, capacitor CbjThe other end connect cascode pipe QsjBase stage, QsjBase stage with Feed inductance L in sequential series between the feed end of the N CECG stacked transistorssjAnd feed resistance Rsj, described total Penetrate pipe QsjEmitter ground connection, QsjCollector connect field effect transistor MtjSource electrode, MtjGrid and resistance RrjAnd electricity Hold CtjIt is connected, the capacitor CtjThe other end ground connection, the resistance RrjThe other end connect resistance R simultaneouslypj、Rqj, resistance Rpj The other end ground connection, resistance RqjThe other end be connected to field effect transistor MtjDrain electrode, field effect transistor MtjDrain electrode connect Connect the output end of the N CECG stacked transistors, wherein N mono-, two, three, four, j=1,2,3,4.
4. the ultra-wideband amplifier according to claim 1 based on HBT-HEMT Stack Technology, which is characterized in that described two It includes the resistance R being sequentially connected in series that network is balanced between rank matrix gradeload2, capacitor Cload2, inductance Lm1、Lm2、Lm3, capacitor Cload3, electricity Hinder Rload3, and Rload2And Rload3The other end be grounded simultaneously, capacitor Cload2With inductance Lm1Connected node is described two The first port of network, inductance L are balanced between rank matrix gradem1With inductance Lm2Connected node balances between the second-order matrix grade The second port of network, inductance Lm2With inductance Lm3Connected node balances the third output of network between the second-order matrix grade Port.
5. the ultra-wideband amplifier according to claim 1 based on HBT-HEMT Stack Technology, which is characterized in that described two It includes the resistance R being sequentially connected in series that rank Output matrix, which synthesizes network,load4, capacitor Cload4, inductance Lc1、Lc2、Lc3, capacitor Cout, resistance Rload4The other end ground connection, capacitor CoutThe other end be the second-order matrix output synthesis network output end, capacitor Cload4 With inductance Lc1Connected node is the first input end at second-order matrix output synthesis network, inductance Lc1With inductance Lc2It is connected Node be the second-order matrix output synthesis network the second input terminal, inductance Lc2With inductance Lc3Connected node is described The third input terminal at second-order matrix output synthesis network.
6. the ultra-wideband amplifier according to claim 1 based on HBT-HEMT Stack Technology, which is characterized in that described The input terminal of one feeding network connects ground capacity C simultaneouslyvdd, feed inductance Lvdd1And Lvdd2, feed inductance Lvdd1The other end For the first output end of first feeding network, inductance L is fedvdd2The other end be the second defeated of first feeding network Outlet.
7. the ultra-wideband amplifier according to claim 1 based on HBT-HEMT Stack Technology, which is characterized in that described The input terminal of two feeding networks connects resistance RVCC1And RVCC2, RVCC3, resistance RVCC2The other end connect field effect transistor simultaneously MvccGrid and electricity RVCC3, resistance RVCC2The other end and the field effect transistor MvccGrid and cascode pipe QvccCurrent collection Pole connects simultaneously, the cascode pipe QvccEmitter ground connection, MvccSource electrode and QvccBase stage pass through resistance RVCC4Connection, RVCC1With RVCC3Node and field effect transistor MvccDrain electrode connection, Rvcc4With MvccSource electrode tie point be the second feeding network it is defeated Outlet.
CN201811593520.2A 2018-12-25 2018-12-25 Ultra-wideband amplifier based on HBT-HEMT stacking technology Active CN109687830B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811593520.2A CN109687830B (en) 2018-12-25 2018-12-25 Ultra-wideband amplifier based on HBT-HEMT stacking technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811593520.2A CN109687830B (en) 2018-12-25 2018-12-25 Ultra-wideband amplifier based on HBT-HEMT stacking technology

Publications (2)

Publication Number Publication Date
CN109687830A true CN109687830A (en) 2019-04-26
CN109687830B CN109687830B (en) 2024-02-06

Family

ID=66189385

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811593520.2A Active CN109687830B (en) 2018-12-25 2018-12-25 Ultra-wideband amplifier based on HBT-HEMT stacking technology

Country Status (1)

Country Link
CN (1) CN109687830B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110311634A (en) * 2019-08-07 2019-10-08 青海民族大学 A kind of ultra-wideband amplifier based on CSCB transistor
CN114172476A (en) * 2022-02-09 2022-03-11 成都嘉纳海威科技有限责任公司 Broadband negative feedback amplifier

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5867061A (en) * 1996-12-04 1999-02-02 Northern Telecom Limited Transformer coupled stacked power amplifier
US20070069821A1 (en) * 2005-09-27 2007-03-29 Lee Young J Active balun device
CN101834572A (en) * 2010-05-14 2010-09-15 北京瑞夫艾电子有限公司 Broadband radio-frequency combining power amplifier
CN103595359A (en) * 2013-10-17 2014-02-19 天津大学 0.1-5GHz CMOS (complementary metal oxide semiconductor) power amplifier
CN203747756U (en) * 2014-01-21 2014-07-30 上海镭芯微电子有限公司 Ultra-wideband low-noise monolithic integrated amplifier
CN106487342A (en) * 2016-10-24 2017-03-08 成都嘉纳海威科技有限责任公司 A kind of matrix power amplifier based on transistor stack structure
CN107332518A (en) * 2017-06-28 2017-11-07 苏州远创达科技有限公司 A kind of broadband Doherty power amplifier

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5867061A (en) * 1996-12-04 1999-02-02 Northern Telecom Limited Transformer coupled stacked power amplifier
US20070069821A1 (en) * 2005-09-27 2007-03-29 Lee Young J Active balun device
CN101834572A (en) * 2010-05-14 2010-09-15 北京瑞夫艾电子有限公司 Broadband radio-frequency combining power amplifier
CN103595359A (en) * 2013-10-17 2014-02-19 天津大学 0.1-5GHz CMOS (complementary metal oxide semiconductor) power amplifier
CN203747756U (en) * 2014-01-21 2014-07-30 上海镭芯微电子有限公司 Ultra-wideband low-noise monolithic integrated amplifier
CN106487342A (en) * 2016-10-24 2017-03-08 成都嘉纳海威科技有限责任公司 A kind of matrix power amplifier based on transistor stack structure
CN107332518A (en) * 2017-06-28 2017-11-07 苏州远创达科技有限公司 A kind of broadband Doherty power amplifier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110311634A (en) * 2019-08-07 2019-10-08 青海民族大学 A kind of ultra-wideband amplifier based on CSCB transistor
CN114172476A (en) * 2022-02-09 2022-03-11 成都嘉纳海威科技有限责任公司 Broadband negative feedback amplifier

Also Published As

Publication number Publication date
CN109687830B (en) 2024-02-06

Similar Documents

Publication Publication Date Title
CN106487342A (en) A kind of matrix power amplifier based on transistor stack structure
CN109687831A (en) A kind of ultra-wideband amplifier based on Darlington stacked tubes
CN108683410A (en) A kind of Darlington distributed power amplifier based on triode Stack Technology
CN206259910U (en) A kind of power amplifier of distributed three stacked structure for considering Miller effect
CN108649911B (en) Millimeter wave broadband high-efficiency transistor stacking power amplifier
CN206259911U (en) A kind of power amplifier of distributed two stacked structure for considering Miller effect
CN106411268A (en) Power amplifier of distributed two-stack structure considering miller effect
CN206259914U (en) A kind of matrix power amplifier based on transistor stack structure
CN107733381A (en) A kind of High-efficiency high-gain Doherty stacks power amplifier
CN110460311A (en) A kind of high efficiency high power millimeter wave synthesis power amplifier
CN106487338A (en) A kind of power amplifier of distributed three stacked structure of consideration Miller effect
CN207475495U (en) A kind of High-efficiency high-gain Doherty stacks power amplifier
CN109687830A (en) A kind of ultra-wideband amplifier based on HBT-HEMT Stack Technology
CN108649913A (en) A kind of Darlington distributed power amplifier based on linearisation Stack Technology
CN109450389A (en) A kind of ultra-wideband amplifier based on three rank Darlington transistor of stacked
CN109274339A (en) A kind of Doherty driving Doherty power amplifier
CN210246697U (en) Broadband amplifier based on cascode composite tube
CN111030607B (en) Two-dimensional traveling wave high-gain broadband CMOS power amplifier
CN110324011A (en) A kind of high-power enhancement mode field effect transistor power amplifier
CN109450390A (en) A kind of second-order matrix amplifier with high-gain and high-power
CN209488526U (en) A kind of ultra-wideband amplifier based on CECG stacked transistors
CN110311634A (en) A kind of ultra-wideband amplifier based on CSCB transistor
CN110365298A (en) A kind of millimeter-wave power amplifiers being distributed active transformation synthesis
CN110350877A (en) A kind of power amplifier of high-gain distribution transformer synthesis
CN208754252U (en) A kind of Darlington distributed power amplifier based on linearisation Stack Technology

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant