CN109618429B - 一种耐温在200-250℃的金属箔发热片的制备方法 - Google Patents

一种耐温在200-250℃的金属箔发热片的制备方法 Download PDF

Info

Publication number
CN109618429B
CN109618429B CN201811422189.8A CN201811422189A CN109618429B CN 109618429 B CN109618429 B CN 109618429B CN 201811422189 A CN201811422189 A CN 201811422189A CN 109618429 B CN109618429 B CN 109618429B
Authority
CN
China
Prior art keywords
temperature
metal foil
polyimide film
dianhydride
heating sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811422189.8A
Other languages
English (en)
Other versions
CN109618429A (zh
Inventor
岑建军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NINGBO JINSHAN NEW MATERIAL Co.,Ltd.
Original Assignee
Ningbo Cen Electronic Material Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Cen Electronic Material Co ltd filed Critical Ningbo Cen Electronic Material Co ltd
Priority to CN201811422189.8A priority Critical patent/CN109618429B/zh
Publication of CN109618429A publication Critical patent/CN109618429A/zh
Application granted granted Critical
Publication of CN109618429B publication Critical patent/CN109618429B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/0427Coating with only one layer of a composition containing a polymer binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • C08K2003/2241Titanium dioxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017Manufacturing methods or apparatus for heaters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)

Abstract

本发明涉及一种金属箔发热片,特别是一种耐温在200‑250℃的金属箔发热片的制备方法,其是通过金属箔的表面复合一层带粘性的聚酰亚胺薄膜而得。其中带粘性的聚酰亚胺薄膜是在热固性聚酰亚胺薄膜表面涂覆一层热熔性的聚酰胺酸液体而得,热熔性的聚酰胺酸液体的制备是先将通过二酐与二胺在极性溶剂下缩聚而得的聚酰胺酸溶液稀释涂到热固性聚酰亚胺薄膜上面,接着放置到设置有烘箱的传送带上,完成聚酰胺酸的彻底亚胺化;本发明通过在金属箔的表面复合一层带粘性的聚酰亚胺薄膜而使得的耐温达到200‑250℃。

Description

一种耐温在200-250℃的金属箔发热片的制备方法
技术领域
本发明涉及一种金属箔发热片,特别是一种耐温在200-250℃的金属箔发热片的制备方法。
背景技术
金属箔发热片传统上使用聚酰亚胺薄膜涂有机硅压敏胶、环氧树脂热熔胶,FEP树脂涂覆等材料加以绝缘,但是有机硅压敏胶耐温只有180℃,环氧树脂耐温只有150℃, FEP耐温只有200℃,这里的耐温都是指长期耐温。很明显,上述这些涂覆在聚酰亚胺薄膜上的物质最大耐温都无法超过200℃,因此限制了这种蚀刻金属波发热片应用环境。
发明内容
本发明的目的是为了解决上述现有技术的不足而提供一种耐温在200-250℃的金属箔发热片的制备方法。
为了实现上述目的,本发明所设计的一种耐温在200-250℃的金属箔发热片的制备方法,包括以下步骤:
步骤一、制备热固性聚酰亚胺薄膜,先将二胺放入反应釜中,并用极性溶剂溶解,然后放入改性纳米粉末,最后再分批加入二酐到反应釜中,搅拌,最后加入极性溶剂调节控制最后反应生成物的粘度达到90000±5000 cP,再脱泡流延成膜即可得到热固性聚酰亚胺薄膜;其中改性纳米粉末按重量份包括20-30份四氟化硅、10-15份氧化铝、30-40份氧化硅、1-5份氧化钛、0.1-0.3份氧化铪;
步骤二、制备带粘性的聚酰亚胺薄膜,在上述得到的热固性聚酰亚胺薄膜上涂上一层热熔性的聚酰胺酸液体,涂层厚度在3-7微米,具体步骤是将通过二酐与二胺在极性溶剂下缩聚而得的聚酰胺酸溶液稀释涂到热固性聚酰亚胺薄膜上面,接着放置到设置有烘箱的传送带上,完成聚酰胺酸的彻底亚胺化,其中烘箱的梯次温度为80-380℃,传送带的速度2-15米/min;
步骤三、制备金属箔发热片,先将金属箔与带粘性的聚酰亚胺薄膜热压复合,然后对金属箔进行蚀刻,已经蚀刻一面的金属箔再与带粘性的聚酰亚胺薄膜热压复合,最后连接出两个正负极即可得到金属箔发热片,其中热压复合时的热压温度为300-350℃,压力大于6kgf/平方厘米,保温时间为3-10分钟。
所述烘箱的梯次温度具体为
从80℃加热至100℃,保温30-60min,
加热升温至160℃,保温15-30min,
加热升温至200℃,保温15-30min,
加热升温至250℃,保温30-60min,
加热升温至300℃,保温15-30min,
加热升温至380℃,保温5-15min。
所述二酐为均苯四甲酸二酐(PMDA)、3,3',4,4'-联苯四羧酸二酐(BPDA)、3,3',4,4'-二苯酮四酸二酐(BTDA)、4,4'-联苯醚二酐(ODPA)、双酚A二酐(BPADA)、4,4'-(六氟异丙烯)二酞酸酐(6FPA)中的一种或几种;
所述二胺为4,4-二氨基二苯醚(ODA)、对苯二胺(PPD)、4,4-二氨基二苯基甲烷(MDA)、2,2'-双(三氟甲基)-4,4'-二氨基联苯(TFMB)(TFMB)、4,4-二氨基苯砜(4,4-DDS)、1,4-双(4-氨基-2-三氟甲基苯氧基)苯(6FAPB)中的一种或几种;
所述的极性溶剂是二甲基乙酰胺(DMAC)、N-甲基吡咯烷酮(NMP)、二甲基甲酰胺(DMF)中的一种或几种。
本发明得到的一种耐温在200-250℃的金属箔发热片的制备方法,其通过在金属箔的表面复合一层带粘性的聚酰亚胺薄膜而使得的耐温达到200-250℃。
具体实施方式
下面结合实施例对本发明进一步说明。
实施例1:
本实施例提供的一种耐温在200-250℃的金属箔发热片的制备方法,包括以下步骤:
步骤一、制备热固性聚酰亚胺薄膜,先将二胺放入反应釜中,并用极性溶剂溶解,然后放入改性纳米粉末,最后再分批加入二酐到反应釜中,搅拌,最后加入极性溶剂调节控制最后反应生成物的粘度达到90000±5000 cP,再脱泡流延成膜即可得到热固性聚酰亚胺薄膜;其中改性纳米粉末按重量份包括20份四氟化硅、10份氧化铝、30份氧化硅、1份氧化钛、0.1份氧化铪;
步骤二、制备带粘性的聚酰亚胺薄膜,在上述得到的热固性聚酰亚胺薄膜上涂上一层热熔性的聚酰胺酸液体,涂层厚度在3-7微米,具体步骤是将通过二酐与二胺在极性溶剂下缩聚而得的聚酰胺酸溶液稀释涂到热固性聚酰亚胺薄膜上面,接着放置到设置有烘箱的传送带上,完成聚酰胺酸的彻底亚胺化,其中烘箱的梯次温度为80-380℃,传送带的速度2-15米/min;
步骤三、制备金属箔发热片,先将金属箔与带粘性的聚酰亚胺薄膜热压复合,然后对金属箔进行蚀刻,已经蚀刻一面的金属箔再与带粘性的聚酰亚胺薄膜热压复合,最后连接出两个正负极即可得到金属箔发热片,其中热压复合时的热压温度为300-350℃,压力大于6kgf/平方厘米,保温时间为3-10分钟。
所述烘箱的梯次温度具体为
从80℃加热至100℃,保温30-60min,
加热升温至160℃,保温15-30min,
加热升温至200℃,保温15-30min,
加热升温至250℃,保温30-60min,
加热升温至300℃,保温15-30min,
加热升温至380℃,保温5-15min。
所述二酐为均苯四甲酸二酐(PMDA)、3,3',4,4'-联苯四羧酸二酐(BPDA)、3,3',4,4'-二苯酮四酸二酐(BTDA)、4,4'-联苯醚二酐(ODPA)、双酚A二酐(BPADA)、4,4'-(六氟异丙烯)二酞酸酐(6FPA)中的一种或几种;
所述二胺为4,4-二氨基二苯醚(ODA)、对苯二胺(PPD)、4,4-二氨基二苯基甲烷(MDA)、2,2'-双(三氟甲基)-4,4'-二氨基联苯(TFMB)(TFMB)、4,4-二氨基苯砜(4,4-DDS)、1,4-双(4-氨基-2-三氟甲基苯氧基)苯(6FAPB)中的一种或几种;
所述的极性溶剂是二甲基乙酰胺(DMAC)、N-甲基吡咯烷酮(NMP)、二甲基甲酰胺(DMF)中的一种或几种。
实施例2:
本实施例提供的一种耐温在200-250℃的金属箔发热片的制备方法,包括以下步骤:
步骤一、制备热固性聚酰亚胺薄膜,先将二胺放入反应釜中,并用极性溶剂溶解,然后放入改性纳米粉末,最后再分批加入二酐到反应釜中,搅拌,最后加入极性溶剂调节控制最后反应生成物的粘度达到90000±5000 cP,再脱泡流延成膜即可得到热固性聚酰亚胺薄膜;其中改性纳米粉末按重量份包括30份四氟化硅、15份氧化铝、40份氧化硅、5份氧化钛、0.3份氧化铪;
步骤二、制备带粘性的聚酰亚胺薄膜,在上述得到的热固性聚酰亚胺薄膜上涂上一层热熔性的聚酰胺酸液体,涂层厚度在3-7微米,具体步骤是将通过二酐与二胺在极性溶剂下缩聚而得的聚酰胺酸溶液稀释涂到热固性聚酰亚胺薄膜上面,接着放置到设置有烘箱的传送带上,完成聚酰胺酸的彻底亚胺化,其中烘箱的梯次温度为80-380℃,传送带的速度2-15米/min;
步骤三、制备金属箔发热片,先将金属箔与带粘性的聚酰亚胺薄膜热压复合,然后对金属箔进行蚀刻,已经蚀刻一面的金属箔再与带粘性的聚酰亚胺薄膜热压复合,最后连接出两个正负极即可得到金属箔发热片,其中热压复合时的热压温度为300-350℃,压力大于6kgf/平方厘米,保温时间为3-10分钟。
实施例3:
本实施例提供的一种耐温在200-250℃的金属箔发热片的制备方法,包括以下步骤:
步骤一、制备热固性聚酰亚胺薄膜,先将二胺放入反应釜中,并用极性溶剂溶解,然后放入改性纳米粉末,最后再分批加入二酐到反应釜中,搅拌,最后加入极性溶剂调节控制最后反应生成物的粘度达到90000±5000 cP,再脱泡流延成膜即可得到热固性聚酰亚胺薄膜;其中改性纳米粉末按重量份包括25份四氟化硅、12份氧化铝、35份氧化硅、3份氧化钛、0.2份氧化铪;
步骤二、制备带粘性的聚酰亚胺薄膜,在上述得到的热固性聚酰亚胺薄膜上涂上一层热熔性的聚酰胺酸液体,涂层厚度在3-7微米,具体步骤是将通过二酐与二胺在极性溶剂下缩聚而得的聚酰胺酸溶液稀释涂到热固性聚酰亚胺薄膜上面,接着放置到设置有烘箱的传送带上,完成聚酰胺酸的彻底亚胺化,其中烘箱的梯次温度为80-380℃,传送带的速度2-15米/min;
步骤三、制备金属箔发热片,先将金属箔与带粘性的聚酰亚胺薄膜热压复合,然后对金属箔进行蚀刻,已经蚀刻一面的金属箔再与带粘性的聚酰亚胺薄膜热压复合,最后连接出两个正负极即可得到金属箔发热片,其中热压复合时的热压温度为300-350℃,压力大于6kgf/平方厘米,保温时间为3-10分钟。

Claims (3)

1.一种耐温在200-250℃的金属箔发热片的制备方法,其特征在于:包括以下步骤:
步骤一、制备热固性聚酰亚胺薄膜,先将二胺放入反应釜中,并用极性溶剂溶解,然后放入改性纳米粉末,最后再分批加入二酐到反应釜中,搅拌,最后加入极性溶剂调节控制最后反应生成物的粘度达到90000±5000 cP,再脱泡流延成膜即可得到热固性聚酰亚胺薄膜;其中改性纳米粉末按重量份包括20-30份四氟化硅、10-15份氧化铝、30-40份氧化硅、1-5份氧化钛、0.1-0.3份氧化铪;
步骤二、制备带粘性的聚酰亚胺薄膜,在上述得到的热固性聚酰亚胺薄膜上涂上一层热熔性的聚酰胺酸液体,涂层厚度在3-7微米,具体步骤是将通过二酐与二胺在极性溶剂下缩聚而得的聚酰胺酸溶液稀释涂到热固性聚酰亚胺薄膜上面,接着放置到设置有烘箱的传送带上,完成聚酰胺酸的彻底亚胺化,其中烘箱的梯次温度为80-380℃,传送带的速度2-15米/min;
步骤三、制备金属箔发热片,先将金属箔与带粘性的聚酰亚胺薄膜热压复合,然后对金属箔进行蚀刻,已经蚀刻一面的金属箔再与带粘性的聚酰亚胺薄膜热压复合,最后连接出两个正负极即可得到金属箔发热片,其中热压复合时的热压温度为300-350℃,压力大于6kgf/平方厘米,保温时间为3-10分钟。
2.根据权利要求1所述的一种耐温在200-250℃的金属箔发热片的制备方法,其特征在于:所述二酐为均苯四甲酸二酐(PMDA)、3,3',4,4'-联苯四羧酸二酐(BPDA)、3,3',4,4'-二苯酮四酸二酐(BTDA)、4,4'-联苯醚二酐(ODPA)、双酚A二酐(BPADA)、4,4'-(六氟异丙烯)二酞酸酐(6FPA)中的一种或几种;
所述二胺为4,4-二氨基二苯醚(ODA)、对苯二胺(PPD)、4,4-二氨基二苯基甲烷(MDA)、2,2'-双(三氟甲基)-4,4'-二氨基联苯(TFMB)(TFMB)、4,4-二氨基苯砜(4,4-DDS)、1,4-双(4-氨基-2-三氟甲基苯氧基)苯(6FAPB)中的一种或几种;
所述的极性溶剂是二甲基乙酰胺(DMAC)、N-甲基吡咯烷酮(NMP)、二甲基甲酰胺(DMF)中的一种或几种。
3.根据权利要求1所述的一种耐温在200-250℃的金属箔发热片的制备方法,其特征在于:
所述烘箱的梯次温度具体为
从80℃加热至100℃,保温30-60min,
加热升温至160℃,保温15-30min,
加热升温至200℃,保温15-30min,
加热升温至250℃,保温30-60min,
加热升温至300℃,保温15-30min,
加热升温至380℃,保温5-15min。
CN201811422189.8A 2018-11-27 2018-11-27 一种耐温在200-250℃的金属箔发热片的制备方法 Active CN109618429B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811422189.8A CN109618429B (zh) 2018-11-27 2018-11-27 一种耐温在200-250℃的金属箔发热片的制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811422189.8A CN109618429B (zh) 2018-11-27 2018-11-27 一种耐温在200-250℃的金属箔发热片的制备方法

Publications (2)

Publication Number Publication Date
CN109618429A CN109618429A (zh) 2019-04-12
CN109618429B true CN109618429B (zh) 2021-02-02

Family

ID=66004789

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811422189.8A Active CN109618429B (zh) 2018-11-27 2018-11-27 一种耐温在200-250℃的金属箔发热片的制备方法

Country Status (1)

Country Link
CN (1) CN109618429B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112063294A (zh) * 2020-08-13 2020-12-11 苏州聚萃材料科技有限公司 聚酰胺酸溶液功能性保护漆、其制备方法及其应用

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62178344A (ja) * 1986-01-31 1987-08-05 鐘淵化学工業株式会社 複合ポリイミドフイルム
CN103502006A (zh) * 2011-03-30 2014-01-08 宇部兴产株式会社 聚酰亚胺膜和使用其的金属层压体
US8668980B2 (en) * 2010-12-07 2014-03-11 E I Du Pont De Nemours And Company Filled polyimide films and coverlays comprising such films
CN104311851A (zh) * 2014-10-24 2015-01-28 宁波今山电子材料有限公司 红色聚酰亚胺薄膜的制备方法
CN104672901A (zh) * 2015-02-28 2015-06-03 重庆杰博科技有限公司 透明聚酰亚胺薄膜及其制备方法
CN106566462A (zh) * 2015-10-09 2017-04-19 北京化工大学 一种耐高温聚酰亚胺胶黏剂的制备方法
CN107249877A (zh) * 2015-02-26 2017-10-13 宇部兴产株式会社 覆铜层叠板的制造方法
CN107921475A (zh) * 2015-08-03 2018-04-17 Ipi技术株式会社 能够进行高温热熔敷的耐热性聚酰亚胺涂敷膜的形成方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62178344A (ja) * 1986-01-31 1987-08-05 鐘淵化学工業株式会社 複合ポリイミドフイルム
US8668980B2 (en) * 2010-12-07 2014-03-11 E I Du Pont De Nemours And Company Filled polyimide films and coverlays comprising such films
CN103502006A (zh) * 2011-03-30 2014-01-08 宇部兴产株式会社 聚酰亚胺膜和使用其的金属层压体
CN104311851A (zh) * 2014-10-24 2015-01-28 宁波今山电子材料有限公司 红色聚酰亚胺薄膜的制备方法
CN107249877A (zh) * 2015-02-26 2017-10-13 宇部兴产株式会社 覆铜层叠板的制造方法
CN104672901A (zh) * 2015-02-28 2015-06-03 重庆杰博科技有限公司 透明聚酰亚胺薄膜及其制备方法
CN107921475A (zh) * 2015-08-03 2018-04-17 Ipi技术株式会社 能够进行高温热熔敷的耐热性聚酰亚胺涂敷膜的形成方法
CN106566462A (zh) * 2015-10-09 2017-04-19 北京化工大学 一种耐高温聚酰亚胺胶黏剂的制备方法

Also Published As

Publication number Publication date
CN109618429A (zh) 2019-04-12

Similar Documents

Publication Publication Date Title
TWI498364B (zh) 低介電常數及低光澤度之聚醯亞胺膜及其製備方法
EP1448669B1 (en) Adhesive composition comprising a polyimide copolymer and method for preparing the same
TWI439371B (zh) 具改良耐溶劑性的透明聚醯亞胺薄膜
CN106029744B (zh) 聚酰亚胺树脂、使用其的树脂组合物及层叠膜
TWI595024B (zh) 聚醯胺酸、覆銅板及電路板
TWI572479B (zh) 包含聚醯亞胺樹脂之金屬積層板及其製造方法
TWI705092B (zh) 軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板以及包含此積層板的電子裝置
JP5589742B2 (ja) ポリアミック酸ワニス、ポリイミドワニス、それらの製造方法及び接続構造体
JP2012251080A (ja) 新規ポリイミドおよびその用途
WO2008032669A1 (fr) Composition de résine de polyimide, son procédé de fabrication et plaqué métallique
CN109618429B (zh) 一种耐温在200-250℃的金属箔发热片的制备方法
TWI723360B (zh) 包括交聯性二酐類化合物及抗氧化劑的聚醯亞胺前驅物組成物、由上述聚醯亞胺前驅物組成物製備的聚醯亞胺膜及其製備方法以及包括此聚醯亞胺膜的電子裝置
CN109591411B (zh) 一种聚酰亚胺厚板的制备方法
US11597880B2 (en) Polymer film and method for manufacturing the same
KR20200022902A (ko) 결정성 폴리이미드 수지 및 열전도성 필러를 포함하는 폴리이미드 필름 및 이의 제조방법
JP7267567B2 (ja) 低誘電率ポリイミド
CN107916090B (zh) 一种低模量、高粘结能力的热塑性聚酰亚胺组合物及其应用和制备方法
TWI516366B (zh) Polyimide / metal composite laminated board and its preparation method
CN109437905B (zh) 一种耐撕裂石墨膜的制备方法
CN115505261B (zh) 高分子薄膜及其制造方法
CN115505262B (zh) 高分子薄膜及其制造方法
US20220389225A1 (en) Polymer film and method for manufacturing the same
JP2019214642A (ja) カバーレイフィルム用ポリイミドフィルムおよびその製造方法
KR102260052B1 (ko) 폴리아믹산 조성물, 폴리아믹산 조성물의 제조방법 및 이를 포함하는 폴리이미드
TWI461293B (zh) Composite laminated board and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20211229

Address after: 315176 88 Kesheng Road, jishigang Town, Haishu District, Ningbo City, Zhejiang Province

Patentee after: NINGBO JINSHAN NEW MATERIAL Co.,Ltd.

Address before: 315217 No.4 factory building, Houhou Chencun Industrial Zone, Yunlong Town, Yinzhou District, Ningbo City, Zhejiang Province (Ningbo Jinshan Electronic Materials Co., Ltd.)

Patentee before: NINGBO CEN ELECTRONIC MATERIAL CO.,LTD.