CN109616428B - 带有多个加热区的基板支撑件 - Google Patents

带有多个加热区的基板支撑件 Download PDF

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Publication number
CN109616428B
CN109616428B CN201811129813.5A CN201811129813A CN109616428B CN 109616428 B CN109616428 B CN 109616428B CN 201811129813 A CN201811129813 A CN 201811129813A CN 109616428 B CN109616428 B CN 109616428B
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China
Prior art keywords
heating
heater
heating zone
circular vacuum
substrate support
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CN201811129813.5A
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English (en)
Chinese (zh)
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CN109616428A (zh
Inventor
松下智治
贾勒帕里·拉维
蔡振雄
阿拉维德·卡马斯
枭雄·袁
曼朱纳塔·科普帕
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN109616428A publication Critical patent/CN109616428A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/037—Heaters with zones of different power density
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

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  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
CN201811129813.5A 2014-12-31 2015-10-22 带有多个加热区的基板支撑件 Active CN109616428B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201462098887P 2014-12-31 2014-12-31
US62/098,887 2014-12-31
US14/634,711 US9888528B2 (en) 2014-12-31 2015-02-27 Substrate support with multiple heating zones
US14/634,711 2015-02-27
CN201580068865.4A CN107112262B (zh) 2014-12-31 2015-10-22 带有多个加热区的基板支撑件
PCT/US2015/056934 WO2016109008A1 (en) 2014-12-31 2015-10-22 Substrate support with multiple heating zones

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580068865.4A Division CN107112262B (zh) 2014-12-31 2015-10-22 带有多个加热区的基板支撑件

Publications (2)

Publication Number Publication Date
CN109616428A CN109616428A (zh) 2019-04-12
CN109616428B true CN109616428B (zh) 2023-02-03

Family

ID=56166038

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201811129813.5A Active CN109616428B (zh) 2014-12-31 2015-10-22 带有多个加热区的基板支撑件
CN201580068865.4A Active CN107112262B (zh) 2014-12-31 2015-10-22 带有多个加热区的基板支撑件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201580068865.4A Active CN107112262B (zh) 2014-12-31 2015-10-22 带有多个加热区的基板支撑件

Country Status (6)

Country Link
US (1) US9888528B2 (https=)
JP (1) JP6974169B2 (https=)
KR (1) KR102425944B1 (https=)
CN (2) CN109616428B (https=)
TW (1) TWI682489B (https=)
WO (1) WO2016109008A1 (https=)

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JP6847610B2 (ja) * 2016-09-14 2021-03-24 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
US10468290B2 (en) * 2016-11-02 2019-11-05 Ultratech, Inc. Wafer chuck apparatus with micro-channel regions
US11598003B2 (en) * 2017-09-12 2023-03-07 Applied Materials, Inc. Substrate processing chamber having heated showerhead assembly
US11330673B2 (en) * 2017-11-20 2022-05-10 Applied Materials, Inc. Heated substrate support
US12009185B2 (en) 2018-02-09 2024-06-11 Applied Materials, Inc. Semiconductor processing apparatus having improved temperature control
US10910243B2 (en) * 2018-08-31 2021-02-02 Applied Materials, Inc. Thermal management system
US20210398829A1 (en) * 2018-11-30 2021-12-23 Lam Research Corporation Ceramic pedestal with multi-layer heater for enhanced thermal uniformity
US11562913B2 (en) * 2019-04-25 2023-01-24 Watlow Electric Manufacturing Company Multi-zone azimuthal heater
US11923233B2 (en) 2019-06-25 2024-03-05 Applied Materials, Inc. Dual-function wafer backside pressure control and edge purge
US20210035851A1 (en) * 2019-07-30 2021-02-04 Applied Materials, Inc. Low contact area substrate support for etching chamber
CN121666015A (zh) * 2019-09-27 2026-03-13 朗姆研究公司 用于影响衬底支撑件的温度分布轮廓的可调式和不可调式热屏
JP7407752B2 (ja) * 2021-02-05 2024-01-04 日本碍子株式会社 ウエハ支持台
US20220367236A1 (en) * 2021-05-16 2022-11-17 Applied Materials, Inc. Heater pedestal with improved uniformity
EP4177030A1 (de) * 2021-06-14 2023-05-10 MULTIVAC Sepp Haggenmüller SE & Co. KG Arbeitsstation für folienverarbeitende verpackungsmaschine
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
TW202349558A (zh) * 2022-04-28 2023-12-16 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 靜電卡盤台座加熱器及用於選擇性地夾持及加熱基材之設備
WO2024091389A1 (en) * 2022-10-24 2024-05-02 Lam Research Corporation Heat flow control in a processing tool
JP2024155101A (ja) 2023-04-20 2024-10-31 住友電気工業株式会社 ウエハ保持体
WO2024257286A1 (ja) 2023-06-14 2024-12-19 住友電気工業株式会社 ウエハ保持台、および半導体処理装置
KR102731017B1 (ko) 2023-10-30 2024-11-19 주식회사 미코세라믹스 세라믹 서셉터

Citations (7)

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WO1999056307A1 (en) * 1998-04-28 1999-11-04 Applied Materials, Inc. Improved heater for use in substrate processing apparatus to deposit tungsten
JP2003007432A (ja) * 2001-06-21 2003-01-10 Nhk Spring Co Ltd セラミックスヒータ
TW563222B (en) * 2001-06-25 2003-11-21 Applied Materials Inc Apparatus and method for thermally isolating a heat chamber
JP2005136104A (ja) * 2003-10-29 2005-05-26 Ngk Spark Plug Co Ltd 静電チャック
KR20070105929A (ko) * 2006-04-27 2007-10-31 어플라이드 머티어리얼스, 인코포레이티드 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대
JP2009076689A (ja) * 2007-09-20 2009-04-09 Tokyo Electron Ltd 基板処理装置及びそれに用いる基板載置台
CN103733327A (zh) * 2011-08-08 2014-04-16 应用材料公司 具有加热器的基板支撑件

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JP2527836B2 (ja) * 1990-08-17 1996-08-28 日本碍子株式会社 半導体ウエハ―加熱装置
JP3210051B2 (ja) * 1992-01-16 2001-09-17 株式会社東芝 気相成長装置
US6001183A (en) * 1996-06-10 1999-12-14 Emcore Corporation Wafer carriers for epitaxial growth processes
US6617553B2 (en) * 1999-05-19 2003-09-09 Applied Materials, Inc. Multi-zone resistive heater
JP2002100460A (ja) * 2000-09-22 2002-04-05 Ibiden Co Ltd セラミックヒータおよびホットプレートユニット
JP4660926B2 (ja) 2001-01-09 2011-03-30 東京エレクトロン株式会社 枚葉式の処理装置
JP3897563B2 (ja) * 2001-10-24 2007-03-28 日本碍子株式会社 加熱装置
JP4642358B2 (ja) * 2004-01-13 2011-03-02 株式会社日立ハイテクノロジーズ ウエハ載置用電極
JP3769583B1 (ja) * 2004-07-09 2006-04-26 積水化学工業株式会社 基材処理装置及び方法
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US7705276B2 (en) * 2006-09-14 2010-04-27 Momentive Performance Materials Inc. Heater, apparatus, and associated method
JP2008207198A (ja) * 2007-02-26 2008-09-11 Matsushita Electric Ind Co Ltd 金型ガイド機構および金型
JP2009054871A (ja) 2007-08-28 2009-03-12 Tokyo Electron Ltd 載置台構造及び処理装置
US20090274590A1 (en) * 2008-05-05 2009-11-05 Applied Materials, Inc. Plasma reactor electrostatic chuck having a coaxial rf feed and multizone ac heater power transmission through the coaxial feed
US8274017B2 (en) * 2009-12-18 2012-09-25 Applied Materials, Inc. Multifunctional heater/chiller pedestal for wide range wafer temperature control
JP2012028428A (ja) * 2010-07-21 2012-02-09 Tokyo Electron Ltd 載置台構造及び処理装置
KR101343556B1 (ko) * 2012-05-18 2013-12-19 주식회사 케이에스엠컴포넌트 2차원적으로 배선된 열선을 포함하는 세라믹 히터
US9538583B2 (en) 2013-01-16 2017-01-03 Applied Materials, Inc. Substrate support with switchable multizone heater
US9853579B2 (en) 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999056307A1 (en) * 1998-04-28 1999-11-04 Applied Materials, Inc. Improved heater for use in substrate processing apparatus to deposit tungsten
JP2003007432A (ja) * 2001-06-21 2003-01-10 Nhk Spring Co Ltd セラミックスヒータ
TW563222B (en) * 2001-06-25 2003-11-21 Applied Materials Inc Apparatus and method for thermally isolating a heat chamber
JP2005136104A (ja) * 2003-10-29 2005-05-26 Ngk Spark Plug Co Ltd 静電チャック
KR20070105929A (ko) * 2006-04-27 2007-10-31 어플라이드 머티어리얼스, 인코포레이티드 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대
JP2009076689A (ja) * 2007-09-20 2009-04-09 Tokyo Electron Ltd 基板処理装置及びそれに用いる基板載置台
CN103733327A (zh) * 2011-08-08 2014-04-16 应用材料公司 具有加热器的基板支撑件

Also Published As

Publication number Publication date
US20160192444A1 (en) 2016-06-30
KR20170101973A (ko) 2017-09-06
TW201624607A (zh) 2016-07-01
CN109616428A (zh) 2019-04-12
JP6974169B2 (ja) 2021-12-01
US9888528B2 (en) 2018-02-06
CN107112262B (zh) 2021-09-03
TWI682489B (zh) 2020-01-11
CN107112262A (zh) 2017-08-29
JP2018505551A (ja) 2018-02-22
WO2016109008A1 (en) 2016-07-07
KR102425944B1 (ko) 2022-07-26

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