CN109560006B - Automatic source production line of scribbling of silicon chip - Google Patents
Automatic source production line of scribbling of silicon chip Download PDFInfo
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- CN109560006B CN109560006B CN201710879417.3A CN201710879417A CN109560006B CN 109560006 B CN109560006 B CN 109560006B CN 201710879417 A CN201710879417 A CN 201710879417A CN 109560006 B CN109560006 B CN 109560006B
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- silicon wafer
- boat
- silicon
- tray
- drying furnace
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 188
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 186
- 239000010703 silicon Substances 0.000 title claims abstract description 186
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 230000007246 mechanism Effects 0.000 claims abstract description 179
- 238000000576 coating method Methods 0.000 claims abstract description 87
- 239000011248 coating agent Substances 0.000 claims abstract description 80
- 238000012546 transfer Methods 0.000 claims abstract description 41
- 238000001035 drying Methods 0.000 claims abstract description 40
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 34
- 239000011574 phosphorus Substances 0.000 claims abstract description 34
- 239000000843 powder Substances 0.000 claims abstract description 33
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052796 boron Inorganic materials 0.000 claims abstract description 28
- 238000005507 spraying Methods 0.000 claims abstract description 28
- 230000007306 turnover Effects 0.000 claims description 24
- 238000012216 screening Methods 0.000 claims description 22
- 238000009792 diffusion process Methods 0.000 claims description 18
- 239000013072 incoming material Substances 0.000 claims description 17
- 239000012634 fragment Substances 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 6
- 238000007873 sieving Methods 0.000 claims description 4
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 20
- 230000008569 process Effects 0.000 abstract description 16
- 238000012797 qualification Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 89
- 230000005540 biological transmission Effects 0.000 description 20
- 239000007921 spray Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides an automatic silicon wafer source coating production line which comprises a boron coating device, a first drying furnace, a phosphorus coating device, a second drying furnace and a powder spraying unit, wherein a first transfer manipulator is arranged between the boron coating device and the first drying furnace, between the first drying furnace and the phosphorus coating device, between the phosphorus coating device and the second drying furnace and between the second drying furnace and the powder spraying unit, and a silicon wafer overturning mechanism is arranged at one end of the downstream of the first drying furnace. The automatic silicon wafer source coating production line is high in automation degree, a plurality of processes of the silicon wafer source coating are automatically carried out, a large number of special personnel are not required to be equipped for manual operation, the error rate is low, the coating efficiency is high, the coating is uniform, and the product qualification rate is high.
Description
Technical Field
The invention belongs to the field of silicon wafer production equipment, and particularly relates to an automatic silicon wafer source coating production line.
Background
With the rapid development of the semiconductor industry, the productivity of semiconductor silicon wafers is expanding. In the process of manufacturing a semiconductor silicon wafer, a diffusion source is required to be coated on the silicon wafer to form a PN junction, but in the prior art, a manual coating method is mostly used for completion, and as various operation flows are involved in the production of the silicon wafer, the product efficiency and quality are required to be improved, and the existing manual coating operation method comprises the following steps: the error rate of manual operation is high; special personnel are required to be equipped for operation; the problem of manual coating inefficiency, consequently, in order to solve the inhomogeneous quality problem of coating that manual coating caused, a demand automation equipment realizes circular silicon chip automatic coating function, makes the silicon chip evenly coat, avoids the unqualified product that causes because personnel's problem, realizes stable high-efficient output.
Disclosure of Invention
The invention aims to solve the problem of providing an automatic silicon wafer source coating production line, which has the advantages of high automation degree of coating silicon wafer diffusion sources, high product qualification rate and high production efficiency.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides an automatic source production line that scribbles of silicon chip, includes scribbles boron device, first dry-off oven, scribbles phosphorus device, second dry-off oven and powder unit, scribbles between boron device and the first dry-off oven, between first dry-off oven and the phosphorus device, scribbles between phosphorus device and the second dry-off oven, between second dry-off oven and the powder unit all is equipped with first transfer manipulator, and the low reaches one end of first dry-off oven is equipped with silicon chip tilting mechanism.
In the technical scheme, preferably, the automatic feeding device further comprises a feeding line, a second transferring manipulator is arranged between the feeding line and the boron coating device, the feeding line comprises a full flower basket feeding line, a full flower basket overturning mechanism and an empty flower basket outflow line, and the full flower basket overturning mechanism is arranged at one end of the downstream of the full flower basket feeding line.
In the technical scheme, the automatic feeding device is characterized by further comprising a feeding line, wherein a third transferring manipulator is arranged between the feeding line and the powder spraying unit, the feeding line comprises an empty boat inflow line, a full boat outflow line and a silicon boat overturning mechanism, a movable shaft is arranged between the downstream end of the empty boat inflow line and the upstream end of the full boat outflow line, and the silicon boat overturning mechanism is movably arranged on the movable shaft.
In the technical scheme, preferably, the boron coating device comprises a first machine table, a first nozzle, a first tray, a first lifting mechanism and a first rotating mechanism, wherein the bottom of the first tray is connected with a lifting shaft of the first lifting mechanism, the bottom of the first lifting mechanism is connected with a rotating shaft of the first rotating mechanism, the first rotating mechanism is fixed on the first machine table, and the first nozzle is arranged above the first tray.
In the technical scheme, preferably, the phosphorus coating device comprises a second machine table, a second nozzle, a second tray, a second lifting mechanism and a second rotating mechanism, wherein the bottom of the second tray is connected with a lifting shaft of the second lifting mechanism, the bottom of the second lifting mechanism is connected with a rotating shaft of the second rotating mechanism, the second rotating mechanism is fixed on the second machine table, and the second nozzle is arranged above the second tray.
In the technical scheme, preferably, the powder spraying unit comprises a third machine table, a third tray, a third lifting mechanism and a movable flange, wherein the third lifting mechanism is arranged on the third machine table, a lifting shaft of the third lifting mechanism is connected with the bottom of the third tray, and the movable flange is arranged above the third tray.
In the technical scheme, preferably, the first drying furnace comprises a first furnace body and a first conveyor belt, wherein the first conveyor belt is arranged in the first furnace body, and a first air supply motor and a first air exhaust motor are arranged on the first furnace body.
In the technical scheme, preferably, the second drying furnace comprises a second furnace body and a second conveyor belt, wherein the second conveyor belt is arranged in the second furnace body, and a second air supply motor and a second air exhaust motor are arranged on the second furnace body.
In the technical scheme, preferably, still be equipped with first piece sieving mechanism between boron coating device and the material loading line, first piece sieving mechanism includes incoming material lifting machine, first light source, first image acquisition device and first piece collection box, and downstream one end after the basket tilting mechanism upset is located to the incoming material lifting machine is equipped with the fourth and transports manipulator between incoming material lifting machine and the first image acquisition device.
In the technical scheme, preferably, a second chip screening device is further arranged between the silicon chip overturning mechanism and the phosphorus coating device, the second chip screening device comprises a second light source, a second image acquisition device and a second chip collection box, and a fifth transfer manipulator is arranged between the silicon chip overturning mechanism and the second chip collection box.
The invention has the advantages and positive effects that: the automatic silicon wafer source coating production line has high automation degree, a plurality of processes of the silicon wafer source coating continuously and mechanically run on the production line, a large number of special personnel are not required to be equipped for manual operation, the error rate is low, the coating efficiency is high, the coating is uniform, and the product percent of pass is high.
Drawings
FIG. 1 is a schematic diagram of an automatic silicon wafer source coating production line;
FIG. 2 is a schematic diagram of the structure of the feeding line in the present invention;
FIG. 3 is a schematic view of a chip screening apparatus according to the present invention;
FIG. 4 is a top view of the incoming hoist of the present invention;
FIG. 5 is a front view of the incoming hoist of the present invention;
FIG. 6 is a top view of a cache elevator of the present invention;
FIG. 7 is a front view of a cache elevator of the present invention;
fig. 8 is a front view of the boron-coating apparatus of the present invention;
FIG. 9 is a schematic view of the structure of the oven and wafer turnover mechanism of the present invention;
FIG. 10 is a schematic view of a debris screening apparatus according to the present invention;
FIG. 11 is a front view of the phosphorus applicator of the present invention;
FIG. 12 is a top view of the powder coating device of the present invention;
FIG. 13 is a left side view of the powder coating device of the present invention;
FIG. 14 is a schematic diagram of the structure of the feed line in the present invention.
In the figure:
1. a boron coating device; 2. a drying furnace; 3. a phosphorus coating device; 4. a drying furnace; 5. a powder spraying unit; 6. a transfer manipulator; 7. a silicon wafer overturning mechanism; 8. feeding lines; 9. a transfer manipulator; 10. a blanking line; 11. a machine table; 12. a nozzle; 13. a tray; 14. a lifting mechanism; 15. a rotation mechanism; 16. a transfer manipulator; 17. a debris screening device; 18. a debris screening device; 19. a buffer lifting mechanism; 20. a transfer manipulator; 21. a furnace body; 22. a conveyor belt; 23. an air supply motor; 24. an exhaust motor; 25. a transfer manipulator; 26. a transfer manipulator; 27. a transfer manipulator; 28. a suction cup; 29. a clamp; 31. a machine table; 32. a nozzle; 33. a tray; 34. a lifting mechanism; 35. a rotation mechanism; 51. a machine table; 52. a tray; 53. a movable flange; 54. a lifting mechanism; 55. vibrating the powder spraying unit; 71. a suction cup; 72. sucker support rods; 73. a motor; 81. feeding lines of the full flower basket; 82. a basket turning mechanism; 83. a flow-out line of the hollow flower basket; 101. an empty boat inflow line; 102. a full boat outflow line; 103. a silicon boat turnover mechanism; 104. a movable shaft; 171. a light source; 172. an image acquisition device; 173. a transfer manipulator; 174. a material feeding elevator; 175. a debris collection box; 176. a buffer lifting mechanism; 177. a transfer manipulator; 178. a traversing robot; 179. a support frame; 181. a light source; 182. an image acquisition device; 183. a transfer manipulator; 184. a support frame; 185. a debris collection box; 531. a driving cylinder; 532. a flange; 533. a baffle; 551. a sieve bed; 552. a vibration mechanism; 821. a transmission mechanism; 822. a rotating shaft; 823. a turnover motor; 811. a transmission support; 812. a conveyor belt; 813. a flower basket clamping device; 831. a transmission support; 832. a conveyor belt; 833. a flower basket clamping device; 1741. a conveyor belt; 1742. a flower basket clamping mechanism; 1743. a basket lifting mechanism; 1744. a support frame; 1761. a conveyor belt; 1762. a flower basket clamping mechanism; 1763. a basket lifting mechanism; 1764. a support frame; 8211. a transmission support; 8212. A conveyor belt; 8213. flower basket clamping device.
Detailed Description
Embodiments of the invention are further described below with reference to the accompanying drawings:
as shown in fig. 1, the automatic silicon wafer source coating production line in this embodiment includes a boron coating device 1, a drying furnace 2, a phosphorus coating device 3, a drying furnace 4 and a powder spraying unit 5, transfer manipulators are respectively arranged between the boron coating device 1 and the drying furnace 2, between the drying furnace 2 and the phosphorus coating device 3, between the phosphorus coating device 3 and the drying furnace 4, and between the drying furnace 4 and the powder spraying unit 5, and a silicon wafer overturning mechanism 7 is arranged at one end of the downstream of the drying furnace 2. After a boron diffusion source is sprayed on a silicon wafer in a boron coating device 1, the silicon wafer is transported to a drying furnace 2 by a transporting manipulator 6, one surface of the sprayed boron diffusion source is dried and diffused by boron, then the silicon wafer is turned 180 degrees by a silicon wafer turning mechanism 7 at the downstream of the drying furnace 2, the other surface of the silicon wafer is upwards, the silicon wafer is transported to a phosphorus coating device 3 by a transporting manipulator 20 to spray the phosphorus diffusion source, the silicon wafer is transported to a drying furnace 4 by a transporting manipulator 26 to be dried and diffused on the back surface, the silicon wafer is transported to a powder spraying unit by a transporting manipulator 25, aluminum oxide powder is sprayed on the silicon wafers which are transported one by one, and the silicon wafer is prevented from sticking in the diffusion process. The automatic silicon wafer source coating production line realizes the pipelining of the whole silicon wafer source coating process, can realize the whole silicon wafer source coating process, does not need manual operation, completely uses automation equipment, and has high automation degree and high production efficiency.
As shown in fig. 2, in a preferred scheme, the production line further comprises a feeding line 8, a transferring manipulator 9 is arranged between the feeding line 8 and the boron coating device 1, the feeding line 8 comprises a full basket feeding line 81, a basket turning mechanism 82 and an empty basket outflow line 83, the basket turning mechanism 82 is arranged at one end of the downstream of the full basket feeding line 81 and is in a straight line with the full basket feeding line 81, a basket containing silicon wafers transmitted by the full basket feeding line 81 is received, the basket turning mechanism 82 comprises a transmission mechanism 821, a rotating shaft 822 and a turning motor 823 which are horizontally arranged, the transmission mechanism 821 is fixedly connected with the rotating shaft 822, the rotating shaft 822 is fixed at the side of the transmission mechanism 821 parallel to the transmission direction, an output shaft of the turning motor 823 is connected with the rotating shaft 822, the turning motor 823 operates to drive the rotating shaft 822 to rotate around the side by 90 degrees, the basket on the transmission mechanism 821 is converted from a lying position into a lying position, the silicon wafers in the basket are received by standing position for the sucking discs on the transferring manipulator 9, the basket is transferred, the turning mechanism is turned over the silicon wafers are received at the side of the empty basket 823, and the empty basket 83 is received at the position after the turning mechanism is turned over.
The feeding line 8 can convey the device for bearing the silicon wafer provided by the upstream process to source coating process equipment, adjust the silicon wafer to adapt to the angle of the next step equipment, and simultaneously convey the unnecessary empty basket back to the production line, so that the degree of automation is high, and manual transfer is not needed.
The conveying mechanism 821 comprises a conveying support 8211, a conveying belt 8212 and a flower basket clamping device 8213, wherein the conveying belt 8212 is arranged on the conveying support 8211, the flower basket clamping device 8213 is fixed on the conveying mechanism 821 after being conveyed to the flower basket overturning mechanism 82 by the full flower basket feeding line 81, the flower basket clamping device 8213 cannot move along the vertical direction, when the flower basket overturning mechanism 82 overturns, the flower basket in the flower basket clamping device is driven to overturn by 90 degrees, after silicon chips in the flower basket are all drawn away, the conveying belt 8212 of the conveying mechanism 821 is driven to the opposite direction, and the conveying mechanism 821 is aligned with the empty flower basket outflow line 83 at the moment to convey the empty flower basket to the empty flower basket outflow line 83 and be conveyed back by the outflow line. Wherein, basket clamping device 8213 can be fixed in the rail shelves pole of transmission support 8211 top, is located the conveyer belt 8212, does not restrict the basket in the removal of horizontal direction, but restricts the basket in the removal of vertical direction to after basket tilting mechanism 82 90 degrees rotations, the basket can not fall down.
The basket feeding line 81 includes a conveying frame 811, a conveying belt 812 mounted on the conveying frame 811, and a basket clamping device 813 arranged above the conveying belt 812, wherein the basket clamping device 813 can be a rail rod fixed on the conveying frame 811 and positioned above the conveying belt 812, so as to prevent the basket from falling down from the conveying belt 812 when being turned over or shifted in the conveying process.
The empty basket discharge line 83 comprises a transmission support 831, a conveyor belt 832 arranged on the transmission support 831 and a basket clamping device 833 arranged above the conveyor belt 832, wherein the basket clamping device 833 can be a fence stop lever fixed on the transmission support 831 and positioned above the conveyor belt 832, so that the basket is prevented from falling down from the conveyor belt 832 when being turned over or shifted in the transmission process.
As shown in fig. 3, a debris screening device 17 is further disposed between the feeding line 8 and the boron coating device 1, the debris screening device 17 includes a light source 171, an image acquisition device 172, a transfer manipulator 173, a controller, an image display device, and a debris collection box 175, the image acquisition device 172 is disposed near the light source 171, and the image acquisition device 172, the transfer manipulator 173, and the image display device are electrically connected to the controller. The transfer manipulator 173 draws out the silicon wafer in the basket turning mechanism 82 on the feeding line 8 from the carrying basket, and places the silicon wafer above the light source 171, under the irradiation of the light source 171, controls the image acquisition device 172 to take a picture of the silicon wafer, and transmits the image to the image display device, and after the worker observes the silicon wafer fragments in front of the image display device, the worker transfers the silicon wafer fragments into the fragment collection box 175 by operating the transfer manipulator 173, so as to screen the fragments. The staff can monitor the piece condition of a plurality of technology nodes department simultaneously on image display device, and need not to go to the scene and pick out the piece, labour saving and time saving, efficient. The image capturing device 172 may be an industrial camera. A support 179 may also be provided above the light source 171, and the transfer robot 173 withdraws the silicon wafer from the carrier basket and places it on the support 179 for image acquisition.
As shown in fig. 4 and 5, the debris screening device 17 may further include an incoming material lifter 174, the transferring manipulator 173 is disposed between the incoming material lifter 174 and the image collecting device 172, the incoming material lifter 174 is located downstream of the basket turning mechanism 82 and is kept on the same line, and is directly connected with the basket turning mechanism 82 of the feeding line 8, so that the continuity is higher, the automation degree is higher, the incoming material lifter 174 includes a conveyor belt 1741, a basket clamping mechanism 1742, a support frame 1744 and a basket lifting mechanism 1743, the conveyor belt 1741 is erected on the support frame 1744, the basket clamping mechanism 1742 is disposed above the conveyor belt 1741, and the basket lifting mechanism 1743 is disposed below the basket clamping mechanism 1742. The basket bearing the silicon chip is sent into the production line by the feeding line 8, after the basket turning mechanism 82 is rotated by 90 degrees, the basket is sent onto the conveying belt 1741 of the feed elevator 174 by the conveying belt 8212 of the basket turning mechanism 82 and is fixed by the basket clamping mechanism 1742, the transfer manipulator 173 withdraws the silicon chip from the basket, and the silicon chip is placed above the light source 171 to collect images, as the silicon chip is gradually withdrawn, the height of the silicon chip in the basket is lowered, in order to ensure that the height of the first silicon chip in the basket is unchanged, and after each time one silicon chip is withdrawn, the basket lifting mechanism 1743 lifts the height of the basket, so that the height of the silicon chip at the uppermost layer is consistent with the height of the transfer manipulator. The basket lifting mechanism 1742 can be motor-controlled lifting, the conveyor belt 1741 is arranged on two sides of the support frame 1744, the middle part of the support frame 1744 is empty, a threaded shaft of the lifting motor extends out from the middle of the support frame 1744 and is contacted with the basket clamping mechanism 1742 below the basket, so that the basket lifting mechanism is jacked up, and the height of the basket is improved. The incoming material elevator 174 can be directly connected with the production line of the previous procedure, so that the operation between the production line and the chip screening device is more consistent, the production continuity is higher, and the degree of automation is higher.
As shown in fig. 6 and 7, the device further comprises a buffer lifting mechanism 176, similar to the incoming material elevator 174, a transferring manipulator 177 is arranged between the buffer lifting mechanism 176 and the image acquisition device 172, the buffer lifting mechanism 176 comprises a conveying belt 1761, a basket clamping mechanism 1762, a supporting frame 1764 and a basket lifting mechanism 1763, the conveying belt 1761 is erected on the supporting frame 1764, the basket clamping mechanism 1762 is arranged above the conveying belt 1761, the basket lifting mechanism 1762 is arranged below the basket clamping mechanism 1742, the transferring manipulator 177 is electrically connected with the controller, a traversing robot 178 is further arranged between the buffer lifting mechanism 176 and the incoming material elevator 174, when the material of the incoming material elevator 174 is excessive and the debris screening is slow, the carrying basket is conveyed to the buffer lifting mechanism 176 through the traversing robot 178, the transferring manipulator 177 is also arranged between the buffer lifting mechanism 176 and the image acquisition device 172, the image acquisition can be carried out with the silicon chip on the incoming material elevator 174, and the debris screening efficiency is high.
According to the chip screening device, workers do not need to monitor, screen and pick chips in the silicon chips at each process node on site, the condition of the chips at a plurality of process nodes can be monitored on the image display device at the same time, and the chips are picked, so that time and labor are saved, and the efficiency is high; the feeding elevator is arranged and can be directly connected with the production line of the previous working procedure, so that the operation between the production line and the chip screening device is more consistent, the production continuity is higher, and the degree of automation is higher; the buffer lifting device is arranged, so that materials which cannot be processed in time by the incoming material lifting machine can be buffered, and the incoming material lifting machine can be used for alternately screening silicon wafers, so that the efficiency is higher.
As shown in fig. 8, the boron coating apparatus 1 includes a machine 11, a nozzle 12, a tray 13, a lifting mechanism 14, and a rotation mechanism 15, wherein the bottom of the tray 13 is connected to a lifting shaft of the lifting mechanism 14, the bottom of the lifting mechanism 14 is connected to a rotation shaft of the rotation mechanism 15, the rotation mechanism 15 is fixed to the machine 11, and the nozzle 12 is provided above the tray 13. After the silicon wafer is sucked up by the transfer manipulator 9, the lifting mechanism 14 of the boron coating device 1 is lifted, so that the height of the tray 13 on the silicon wafer is aligned with the height of the transfer manipulator, after the silicon wafer is placed on the tray 13 by the transfer manipulator, the lifting mechanism 14 descends to the lower part of the nozzle 12, the rotating mechanism 15 drives the tray 13 to rotate at a high speed, and meanwhile, the nozzle 12 sprays boron diffusion source solution. The lifting mechanism 14 can be a lifting cylinder, the rotating mechanism 15 can be a motor, and the boron coating device 1 can uniformly spray the diffusion source solution on the silicon wafer.
As shown in fig. 9, the drying furnace 2 comprises a furnace body 21 and a conveyor belt 22, the conveyor belt 22 is arranged in the furnace body 21, an air supply motor 23 and an air exhaust motor 24 are arranged on the furnace body 21, silicon wafers sprayed with boron diffusion sources on the boron coating device 1 are sucked by a transfer manipulator 6 and transferred onto the conveyor belt 22 of the drying furnace 2, enter the furnace body 21 for drying and diffusion, the dried silicon wafers are sent out from the other end of the furnace body 21 by the conveyor belt 22 after the drying is finished, the air supply motor 23 continuously supplies air into the furnace body 21, and the air exhaust motor 24 discharges gas generated by diffusion source solutions in the furnace body to ventilate the furnace body 21.
The silicon wafer overturning mechanism 7 comprises a sucker 71, a sucker support rod 72 and a motor 73, wherein an output shaft of the motor 73 is connected with one end of the sucker support rod 72, the sucker 71 is arranged at one end of the sucker support rod 72, the sucker 71 sucks silicon wafers conveyed out of the drying furnace 2, the motor 73 drives the sucker support rod 72 to rotate 180 degrees around a shaft, the silicon wafers on the sucker 71 are changed from front to back, and then are transported to the phosphorus coating device 3 through the transporting manipulator 20 for spraying of phosphorus diffusion sources.
As shown in fig. 10, a chip screening device 18 may be further disposed between the silicon chip turnover mechanism 7 and the phosphorus coating device 3, the chip screening device 18 includes a light source 181, an image acquisition device 182, a transfer manipulator 183, a controller, an image display device and a chip collection box 185, the image acquisition device 182 is disposed near the light source 181, the image acquisition device 182, the transfer manipulator 183 and the image display device are respectively electrically connected with the controller, the transfer manipulator 183 is disposed between the silicon chip turnover mechanism 7 and the chip collection box 185, the silicon chip turnover mechanism 7 turns over the silicon chip and then places the silicon chip on the upper side of the light source 181, under the irradiation of the light source 181, the image acquisition device 182 is controlled to photograph the silicon chip and transmit the image to the image display device, and after observing the silicon chip in front of the image display device, a worker transfers the silicon chip into the chip collection box 185 by operating the transfer manipulator 183, thereby screening the chip. The staff can monitor the piece condition of a plurality of technology nodes department simultaneously on image display device, and need not to go to the scene and pick out the piece, labour saving and time saving, efficient. The image capturing device 182 may be an industrial camera. A supporting frame 184 may be arranged above the light source 181, and the suction cup 71 withdraws the silicon wafer from the drying furnace 2 and then places the silicon wafer on the supporting frame 184 for image acquisition.
The buffer lifting mechanism 19 can be further arranged between the fragment screening device 18 and the phosphorus coating device 4, the transfer manipulator 183 is arranged between the buffer lifting mechanism 19 and the image acquisition device 182, the buffer lifting mechanism 19 comprises a conveying belt, a flower basket clamping mechanism, a supporting frame and a flower basket lifting mechanism, the conveying belt is arranged on the supporting frame, the flower basket clamping mechanism is arranged above the conveying belt, the flower basket lifting mechanism is arranged below the flower basket clamping mechanism, the transfer manipulator 183 is electrically connected with the controller, when the number of silicon wafers screened by the fragment screening device 18 is too large, and when the phosphorus coating device 4 processes slowly, the transfer manipulator 183 transfers the silicon wafers to the buffer lifting mechanism 19 for buffering.
As shown in fig. 11, the phosphorus coating apparatus 3 includes a machine table 31, a nozzle 32, a tray 33, a lifting mechanism 34, and a rotation mechanism 35, wherein the bottom of the tray 33 is connected to a lifting shaft of the lifting mechanism 34, the bottom of the lifting mechanism 34 is connected to a rotation shaft of the rotation mechanism 35, the rotation mechanism 35 is fixed to the machine table 31, and the nozzle 32 is provided above the tray 33. After the silicon wafer is sucked up by the transferring manipulator 20, the lifting mechanism 34 of the phosphorus coating device 3 is lifted up, the height of the tray 33 on the lifting mechanism is aligned with the height of the transferring manipulator 20, after the transferring manipulator 20 places the silicon wafer on the tray 33, the lifting mechanism 34 is lowered to the position below the nozzle 32, the rotating mechanism 35 drives the tray 33 to rotate at a high speed, and meanwhile, the nozzle 32 sprays phosphorus diffusion source solution. The phosphorus coating device 3 can uniformly spray the phosphorus diffusion source solution on the silicon wafer.
The same as the drying furnace 2, the drying furnace 4 comprises a furnace body and a conveyor belt, the conveyor belt is arranged in the furnace body, an air supply motor and an air exhaust motor are arranged on the furnace body, a silicon wafer sprayed with a phosphorus diffusion source on the phosphorus coating device 3 is sucked by a transfer manipulator 26 and transferred onto the conveyor belt of the drying furnace 4, and enters the furnace body to be dried and diffused, the conveyor belt sends the silicon wafer out from the other end of the furnace body after the drying is finished, the air supply motor continuously feeds air into the furnace body, and the air exhaust motor discharges air generated by a diffusion source solution in the furnace body to ventilate the furnace body.
As shown in fig. 12 and 13, the powder spraying unit 5 includes a machine 51, a tray 52, a movable flange 53, a lifting mechanism 54 and a vibration powder spraying unit 55, the lifting mechanism 54 is disposed on the machine 51, a lifting shaft of the lifting mechanism 54 is connected with the bottom of the tray 52, the movable flange 53 is disposed above the tray 52, and the vibration powder spraying unit 55 is disposed above the movable flange 53. The baffle 533 is placed on the tray 52, the baffle 533 is larger than the silicon wafer, the silicon wafer is protected, the silicon wafer is prevented from being scratched by the tray, the silicon wafer conveyed after being coated and dried is firstly sucked by the suction cup 28 on the transferring manipulator 27 arranged on the machine table 51, the lifting mechanism 54 is lifted, the manipulator 27 places the silicon wafer on the baffle 533 on the tray 52, the movable baffle 53 is adjusted to position the silicon wafer, the transferred silicon wafer is stacked one by one on the first silicon wafer, the movable baffle 53 is used for adjusting a large number of stacked silicon wafers, the vibration powder spraying unit 55 is used for continuously vibrating in the whole process, the aluminum oxide powder is fully contained in the vibration powder spraying unit 55, the sieve mesh is arranged at the bottom of the vibration powder spraying unit 55, the aluminum oxide powder is sprayed onto the silicon wafer from the sieve mesh in the vibration process, after a certain number of silicon wafers are stacked, the opening of the silicon wafer boat is aligned, the silicon wafer boat is inserted into the silicon wafer boat from the side of the stacked silicon wafer boat, the silicon wafer lifting mechanism 54 is lowered, the tray 52 is lowered, and the silicon wafer is fully loaded to be fully loaded to the next silicon wafer is carried to the next process. The device can be in the continuous automatic powder spraying of silicon chip stacking process, can effectively prevent the silicon chip from taking place to glue the piece at the in-process of high temperature diffusion process, and need not artifical powder spraying, efficient, labour saving and time saving.
The machine bench 51 is also provided with a transferring manipulator 16, the end part of the transferring manipulator 16 is provided with a clamp 29, the transferring manipulator 16 clamps the silicon boat from the silicon boat supply device, then after the silicon wafers stacked on the movable flanges 53 reach a certain number, the transferring manipulator 16 clamps the silicon boat, the silicon wafers are inserted from the side surfaces of the silicon boat, the lifting mechanism 54 descends to separate the tray 52 from the baffle 533, the baffle 533 and the silicon wafers are left in the silicon boat, then the transferring manipulator 16 transfers the silicon boat filled with the silicon wafers to the next process production line, the silicon boat does not need to be manually transferred, the continuity of the powder spraying device and the downstream process is better, the degree of automation is higher, and the efficiency is high.
The vibration powder spraying unit 55 comprises a sieve bed 551 and a vibration mechanism 552, wherein the sieve bed 551 is connected with the machine table 51 through the vibration mechanism 552, and a plurality of sieve holes are formed in the bottom of the sieve bed 551. There are various types of vibrating powder spraying devices, and there are many disclosures of such devices (e.g., CN 201510825393.4) in the prior art, and specific structures of the sieve bed and the vibrating mechanism in the vibrating powder spraying unit are not limited herein, and various types of structures can be used in the present invention.
The movable flange 53 may include a plurality of driving cylinders 531 and a plurality of flanges 532, where the driving cylinders 531 are horizontally disposed on the machine 51, the telescopic shaft of the driving cylinders 531 is connected with one end of the flanges 532, and the other end of the flanges 532 extends beyond the height of the tray 52, and when a large number of silicon wafers are stacked on the tray 52, the driving cylinders 531 drive the flanges 532 to make the stacked silicon wafers stacked in order, so as to prevent the stacked silicon wafers from sliding down from the tray 52.
As shown in fig. 14, the device further comprises a discharging line 10, a transferring manipulator 16 is arranged between the discharging line 10 and the powder spraying unit 5, the discharging line 10 comprises an empty boat inflow line 101, a full boat outflow line 102 and a silicon boat turnover mechanism 103, a moving shaft 104 is arranged between the downstream end of the empty boat inflow line 101 and the upstream end of the full boat outflow line 102, and the silicon boat turnover mechanism 103 is movably arranged on the moving shaft 104 and can rotate 90 degrees around the moving shaft 104. The silicon wafer after the coating process is carried to the blanking line 10, the empty silicon boat is sent to the silicon boat turning mechanism 103 from the empty boat inflow line 101, after the silicon boat turning mechanism 103 turns 90 degrees, the silicon boat is changed from the horizontal position to the side vertical position, the transferring manipulator 16 clamps the silicon boat out of the silicon boat turning mechanism 103 and inserts the silicon boat from the side of the silicon wafer, the full boat is placed on the silicon boat turning mechanism 103, the silicon boat turning mechanism 103 turns 90 degrees around the moving shaft 104, the silicon boat turning mechanism 103 turns to the horizontal position, the silicon boat turning mechanism 103 moves along the moving shaft 104 from the empty boat inflow line 101 to the side of the full boat outflow line 102, and the full boat is sent out from the full boat outflow line 102.
The blanking line 10 can provide a silicon boat for bearing the silicon wafer finished by the source coating process and convey the silicon wafer obtained by the source coating process to the equipment of the next process, so that the automation degree is high, and manual transfer is not needed.
The moving shaft 104 may be an air cylinder, the telescopic shaft of the air cylinder is connected with the middle line at the bottom of the silicon boat turnover mechanism 103, the air cylinder drives the telescopic shaft to stretch and retract so that the silicon boat turnover mechanism 103 moves along the shaft, the other end of the air cylinder is connected with the output shaft of the motor, and the motor drives the output shaft to rotate so as to drive the air cylinder to rotate around the moving shaft 104, so that the silicon boat turnover mechanism 103 rotates around the moving shaft 104, and the silicon boat turnover mechanism 103 rotates to a turned position.
The silicon boat turnover mechanism 103 comprises a support, a conveyor belt erected on the support and a silicon boat clamping device arranged above the conveyor belt, when the silicon boat is conveyed onto the silicon boat turnover mechanism 103 from the empty boat inflow line 101, the silicon boat clamping device is fixed on the silicon boat turnover mechanism 103, so that the silicon boat cannot move along the vertical direction, when the silicon boat turnover mechanism 103 turns over, the silicon boat therein is driven to turn over 90 degrees, after the silicon boat turnover mechanism 103 is put into a full boat by a transferring manipulator, the silicon boat turnover mechanism 103 rotates 90 degrees around an axle, and then moves to the side of the full boat outflow line 102 along the moving shaft 104, and the conveyor belt of the silicon boat turnover mechanism 103 drives in the opposite direction, so that the full boat is conveyed to the full boat outflow line 102 and is sent out of the coating source production line due to the fact that the silicon boat turnover mechanism 103 is aligned with the full boat outflow line 102. The silicon boat clamping device can be a fence rod which is fixed on the silicon boat turnover mechanism 103 and is positioned above the conveying belt, so that the movement of the silicon boat in the horizontal direction is not limited, but the movement of the silicon boat in the vertical direction is limited, and therefore, after the silicon boat turnover mechanism 103 rotates by 90 degrees, the silicon boat cannot fall down.
The empty boat inflow line 101 comprises a transmission support, a conveyor belt erected on the transmission support and a silicon boat clamping device arranged above the conveyor belt, wherein the silicon boat clamping device can be a fence baffle rod fixed on the transmission support and positioned above the conveyor belt, so that the flower basket is prevented from turning over or shifting down from the conveyor belt in the conveying process.
The full boat outflow line 102 comprises a transmission support, a conveyor belt erected on the transmission support and a silicon boat clamping device arranged above the conveyor belt, wherein the silicon boat clamping device can be a fence baffle rod fixed on the transmission support and positioned above the conveyor belt, so that the basket is prevented from turning over or shifting to fall off from the conveyor belt in the conveying process.
The automatic silicon wafer source coating production line is high in automation degree, a plurality of processes of the silicon wafer source coating are automatically carried out, a large number of special personnel are not required to be equipped for manual operation, the error rate is low, the coating efficiency is high, the coating is uniform, and the product qualification rate is high.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (8)
1. The utility model provides an automatic source production line that scribbles of silicon chip which characterized in that: the device comprises a boron coating device, a first drying furnace, a phosphorus coating device, a second drying furnace and a powder spraying unit, wherein a first transfer manipulator is arranged between the boron coating device and the first drying furnace, between the first drying furnace and the phosphorus coating device, between the phosphorus coating device and the second drying furnace, and between the second drying furnace and the powder spraying unit;
the automatic feeding device comprises a boron coating device, and is characterized by further comprising a feeding line, a second transferring manipulator is arranged between the feeding line and the boron coating device, the feeding line comprises a full flower basket feeding line, a full flower basket overturning mechanism and an empty flower basket outflow line, and the full flower basket overturning mechanism is arranged at one downstream end of the full flower basket feeding line;
the device also comprises a discharging line, a third transferring manipulator is arranged between the discharging line and the powder spraying unit, the discharging line comprises an empty boat inflow line, a full boat outflow line and a silicon boat overturning mechanism, a movable shaft is arranged between the downstream end of the empty boat inflow line and the upstream end of the full boat outflow line, and the silicon boat turnover mechanism is movably arranged on the movable shaft;
the silicon wafer overturning mechanism comprises a sucker and a sucker support rod, the sucker is arranged at one end of the sucker support rod, the sucker sucks up the silicon wafer transported out of the first drying furnace, the sucker support rod is controlled to rotate 180 degrees around a shaft, the silicon wafer on the sucker is changed from front to back, and then is transported to the phosphorus coating device through a transportation manipulator for spraying a phosphorus diffusion source.
2. The automatic silicon wafer source coating production line according to claim 1, wherein: the boron coating device comprises a first machine table, a first nozzle, a first tray, a first lifting mechanism and a first rotating mechanism, wherein the bottom of the first tray is connected with a lifting shaft of the first lifting mechanism, the bottom of the first lifting mechanism is connected with a rotating shaft of the first rotating mechanism, the first rotating mechanism is fixed on the first machine table, and the first nozzle is arranged above the first tray.
3. The automatic silicon wafer source coating production line according to claim 1, wherein: the phosphorus coating device comprises a second machine table, a second nozzle, a second tray, a second lifting mechanism and a second rotating mechanism, wherein the bottom of the second tray is connected with a lifting shaft of the second lifting mechanism, the bottom of the second lifting mechanism is connected with a rotating shaft of the second rotating mechanism, the second rotating mechanism is fixed on the second machine table, and the second nozzle is arranged above the second tray.
4. The automatic silicon wafer source coating production line according to claim 1, wherein: the powder spraying unit comprises a third machine table, a third tray, a third lifting mechanism and a movable flange, wherein the third lifting mechanism is arranged on the third machine table, a lifting shaft of the third lifting mechanism is connected with the bottom of the third tray, and the movable flange is arranged above the third tray.
5. The automatic silicon wafer source coating production line according to claim 1, wherein: the first drying furnace comprises a first furnace body and a first conveyor belt, wherein the first conveyor belt is arranged in the first furnace body, and a first air supply motor and a first air exhaust motor are arranged on the first furnace body.
6. The automatic silicon wafer source coating production line according to claim 1, wherein: the second drying furnace comprises a second furnace body and a second conveyor belt, wherein the second conveyor belt is arranged in the second furnace body, and a second air supply motor and a second air exhaust motor are arranged on the second furnace body.
7. The automatic silicon wafer source coating production line according to claim 1, wherein: still be equipped with first piece sieving mechanism between boron coating device with go up the stockline, first piece sieving mechanism includes incoming material lifting machine, first light source, first image acquisition device and first piece collection box, the incoming material lifting machine is located downstream one end after basket tilting mechanism upset, the incoming material lifting machine with be equipped with the fourth between the first image acquisition device and transport the manipulator.
8. The automatic silicon wafer source coating production line according to claim 1, wherein: the silicon wafer overturning mechanism is characterized in that a second fragment screening device is further arranged between the silicon wafer overturning mechanism and the phosphorus coating device, the second fragment screening device comprises a second light source, a second image acquisition device and a second fragment collection box, and a fifth transfer manipulator is arranged between the silicon wafer overturning mechanism and the second fragment collection box.
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