CN109560006A - A kind of silicon wafer applies source production line automatically - Google Patents
A kind of silicon wafer applies source production line automatically Download PDFInfo
- Publication number
- CN109560006A CN109560006A CN201710879417.3A CN201710879417A CN109560006A CN 109560006 A CN109560006 A CN 109560006A CN 201710879417 A CN201710879417 A CN 201710879417A CN 109560006 A CN109560006 A CN 109560006A
- Authority
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- China
- Prior art keywords
- silicon wafer
- drying oven
- production line
- gaily decorated
- decorated basket
- Prior art date
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 180
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 180
- 239000010703 silicon Substances 0.000 title claims abstract description 180
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 230000007246 mechanism Effects 0.000 claims abstract description 185
- 230000007306 turnover Effects 0.000 claims abstract description 59
- 238000001035 drying Methods 0.000 claims abstract description 49
- 239000000843 powder Substances 0.000 claims abstract description 36
- 230000003028 elevating effect Effects 0.000 claims description 38
- 239000012634 fragment Substances 0.000 claims description 34
- 238000012216 screening Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 24
- 238000011144 upstream manufacturing Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 27
- 230000008569 process Effects 0.000 abstract description 17
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 238000012797 qualification Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 100
- 230000005540 biological transmission Effects 0.000 description 25
- 238000009792 diffusion process Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 238000010422 painting Methods 0.000 description 4
- 238000009527 percussion Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 3
- 238000006062 fragmentation reaction Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000001427 coherent effect Effects 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention provides a kind of silicon wafer and applies source production line automatically, including Boraxing unit, the first drying oven, boderizing device, the second drying oven and powder unit, between Boraxing unit and the first drying oven, between the first drying oven and boderizing device, between boderizing device and the second drying oven, be equipped with the first transportation manipulator between the second drying oven and powder unit, downstream one end of the first drying oven is equipped with silicon wafer turnover mechanism.The silicon wafer applies source production line automation degree height automatically, and multiple processes that silicon wafer applies source carry out automatically, and without being equipped with a large amount of special messenger's manual operations, fault rate is low, and surface covered is high, and coating is uniform, and product qualification rate is high.
Description
Technical field
The invention belongs to silicon wafer production equipment fields, apply source production line automatically more particularly, to a kind of silicon wafer.
Background technique
With the rapid development of semicon industry, semi-conductor silicon chip production capacity expands increasingly.In semi-conductor silicon chip manufacturing process
It needs to coat diffusion source to silicon wafer, to form PN junction, and in the prior art, mostly be completed using the method coated manually, due to silicon
Piece can be related to several work process when producing, and cause product efficiency and quality all to be improved, the operation applied manually at present
Method exists: manual work fault rate is high；Special messenger need to be equipped with to operate；The low problem of manual surface covered, therefore, to solve
The uneven quality problems of coating caused by artificial coating, a kind of automation equipment of demand realize round silicon wafer automatic coating function,
So that silicon wafer is carried out even application, avoid the substandard product as caused by personnel issue, realizes stability and high efficiency output.
Summary of the invention
The problem to be solved in the present invention is to provide a kind of silicon wafers to apply source production line automatically, and silicon wafer spreads the coating automation in source
Degree is high, and product qualification rate is high, high production efficiency.
In order to solve the above technical problems, the technical solution adopted by the present invention is that: a kind of silicon wafer applies source production line automatically, including
Boraxing unit, the first drying oven, boderizing device, the second drying oven and powder unit, between Boraxing unit and the first drying oven,
It is all provided between one drying oven and boderizing device, between boderizing device and the second drying oven, between the second drying oven and powder unit
There is the first transportation manipulator, downstream one end of the first drying oven is equipped with silicon wafer turnover mechanism.
In technical solution, it is preferred that further include feeding line, it is mechanical that the second transhipment is equipped between feeding line and Boraxing unit
Hand, feeding line include fully loaded feeding line, the first silicon wafer carrying device turnover mechanism and unloaded outflow line, the first silicon wafer carrying device
Turnover mechanism is set to downstream one end of fully loaded feeding line.
In technical solution, it is preferred that further include lower stockline, it is mechanical that third transhipment is equipped between lower stockline and powder unit
Hand, lower stockline include unloaded inflow line, fully loaded outflow line and the second silicon wafer carrying device turnover mechanism, the downstream of unloaded inflow line
Shifting axle is equipped between one end and upstream one end of fully loaded outflow line, removable be set to of the second silicon wafer carrying device turnover mechanism is moved
On moving axis.
In technical solution, it is preferred that Boraxing unit includes the first board, first jet, the first pallet, the first elevating mechanism
With the first rotating mechanism, the lifting axis connection of the first tray bottom and the first elevating mechanism, the bottom of the first elevating mechanism and the
The rotation axis connection of one rotating mechanism, the first rotating mechanism are fixed on the first board, and first jet is set to above the first pallet.
In technical solution, it is preferred that boderizing device includes the second board, second nozzle, the second pallet, the second elevating mechanism
With the second rotating mechanism, the lifting axis connection of the second tray bottom and the second elevating mechanism, the bottom of the second elevating mechanism and the
The rotation axis connection of two rotating mechanisms, the second rotating mechanism are fixed on the second board, and second nozzle is set to above the second pallet.
In technical solution, it is preferred that powder unit includes that third board, third pallet, third elevating mechanism and vibration are spilt
Powder unit, third elevating mechanism are set on third board, and the lifting shaft of third elevating mechanism is connect with third tray bottom, vibration
Powder unit is set to above third pallet.
In technical solution, it is preferred that the first drying oven includes the first furnace body and the first conveyer belt, and the first conveyer belt is set to the
In one furnace body, the first furnace body is equipped with the first air supply motor and first row wind motor.
In technical solution, it is preferred that the second drying oven includes the second furnace body and the second conveyer belt, and the second conveyer belt is set to the
In two furnace bodies, the second furnace body is equipped with the second air supply motor and second row wind motor.
In technical solution, it is preferred that be additionally provided with the first fragment screening plant, the first fragment between Boraxing unit and feeding line
Screening plant includes that supplied materials elevator, first light source, the first image collecting device and the first garbage collection box, supplied materials elevator are set
It is mechanical to be equipped with the 4th transhipment for downstream one end after the overturning of gaily decorated basket turnover mechanism between supplied materials elevator and the first garbage collection box
Hand.
In technical solution, it is preferred that the second fragment screening plant is additionally provided between silicon wafer turnover mechanism and boderizing device, the
Two fragment screening plants include second light source, the second image collecting device and the second garbage collection box, silicon wafer turnover mechanism and the
The 5th transportation manipulator is equipped between two garbage collection boxes.
The advantages and positive effects of the present invention are: the silicon wafer applies automatically, source production line automation degree is high, and silicon wafer applies
Multiple processes in source continuous mechanical movement in the production line, without being equipped with a large amount of special messenger's manual operations, fault rate is low, surface covered
Height, coating is uniform, and product qualification rate is high.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that silicon wafer of the present invention applies source production line automatically.
Fig. 2 is the structural schematic diagram of feeding line in the present invention.
Fig. 3 is the structural schematic diagram of fragment screening plant in the present invention.
Fig. 4 is the top view of supplied materials elevator in the present invention.
Fig. 5 is the main view of supplied materials elevator in the present invention.
Fig. 6 is the top view that elevator is cached in the present invention.
Fig. 7 is the main view that elevator is cached in the present invention.
Fig. 8 is the main view of Boraxing unit in the present invention.
Fig. 9 is the structural schematic diagram of drying oven and silicon wafer turnover mechanism in the present invention.
Figure 10 is the structural schematic diagram of fragment screening plant in the present invention.
Figure 11 is the main view of boderizing device in the present invention.
Figure 12 is the top view of powder sprinkling device in the present invention.
Figure 13 is the left view of powder sprinkling device in the present invention.
Figure 14 is the structural schematic diagram of lower stockline in the present invention.
In figure:
1, Boraxing unit 2, drying oven 3, boderizing device
4, drying oven 5, powder unit 6, transportation manipulator
7, silicon wafer turnover mechanism 8, feeding line 9, transportation manipulator
10, lower stockline 11, board 12, nozzle
13, pallet 14, elevating mechanism 15, rotating mechanism
16, transportation manipulator 17, fragment screening plant 18, fragment screening plant
19, hoisting mechanism 20, transportation manipulator 21, furnace body are cached
22, conveyer belt 23, air supply motor 24, air draft motor
25, transportation manipulator 26, transportation manipulator 27, transportation manipulator
28, sucker 29, fixture 31, board
32, nozzle 33, pallet 34, elevating mechanism
35, rotating mechanism 51, board 52, pallet
53, rib 54, elevating mechanism 55, vibration powder unit are moved
71, sucker 72, sucker strut 73, motor
81, full gaily decorated basket feeding line 82, gaily decorated basket turnover mechanism 83, the empty gaily decorated basket flow out line
101, empty boat inflow line 102, full boat flow out line 103, silicon boat turnover mechanism
104, shifting axle 171, light source 172, image collecting device
173, transportation manipulator 174, supplied materials elevator 175, garbage collection box
176, hoisting mechanism 177, transportation manipulator 178, traversing robot are cached
179, support frame 181, light source 182, image collecting device
183, transportation manipulator 184, support frame 185, garbage collection box
531, cylinder 532, rib 533, baffle are driven
551, sifting bed 552, percussion mechanism 821, transmission mechanism
822, rotation axis 823, overturning motor 811, transmission bracket
812, conveyer belt 813, gaily decorated basket gripping mechanism 831, transmission bracket
832, conveyer belt 833, gaily decorated basket gripping mechanism 1741, conveyer belt
1742, gaily decorated basket clamping mechanism 1743, gaily decorated basket hoisting mechanism 1744, support frame
1761, conveyer belt 1762, gaily decorated basket clamping mechanism 1763, gaily decorated basket hoisting mechanism
1764, support frame 8211, transmission bracket 8212, conveyer belt
8213, gaily decorated basket gripping mechanism
Specific embodiment
The embodiment of the present invention is described further with reference to the accompanying drawing:
As shown in Figure 1, a kind of silicon wafer described in the present embodiment applies source production line automatically, including Boraxing unit 1, drying oven 2,
Boderizing device 3, drying oven 4 and powder unit 5, between Boraxing unit 1 and drying oven 2, between drying oven 2 and boderizing device 3, apply
Between phosphorus device 3 and drying oven 4, transportation manipulator, downstream one end of drying oven 2 are equipped between drying oven 4 and powder unit 5
Equipped with silicon wafer turnover mechanism 7.After silicon wafer sprays boron diffusion source in Boraxing unit 1, drying oven 2 is transported to by transportation manipulator 6
In, drying and the diffusion of boron are carried out on one side to spraying boron diffusion source, then by the silicon wafer turnover mechanism 7 in the downstream of drying oven 2
It is another face-up by silicon wafer turnover 180 degree, then boderizing device 3 is transported to by transportation manipulator 20, carry out the spray of phosphorous diffusion source
It applies, then is transported in drying oven 4 by transportation manipulator 26, drying and the diffusion of phosphorus are carried out to the back side, then by transportation manipulator
Silicon wafer is transferred to powder unit by 25, is carried out spilling alumina powder to the silicon wafer shifted one by one, is prevented silicon wafer during diffusion
Generate bonding die.The silicon wafer applies source production line automatically realizes the pipelining of entire silicon wafer painting source procedure, it can be achieved that silicon wafer applies source
Whole process, manual operation is not needed, all using automation equipment, high degree of automation, high production efficiency.
As shown in Fig. 2, the production line further includes feeding line 8 in preferred embodiment, it is equipped between feeding line 8 and Boraxing unit 1
Transportation manipulator 9, feeding line 8 include that full gaily decorated basket feeding line 81, gaily decorated basket turnover mechanism 82 and the empty gaily decorated basket flow out line 83, gaily decorated basket overturning
Mechanism 82 is set to the one end in the downstream of full gaily decorated basket feeding line 81, and point-blank with full gaily decorated basket feeding line 81, receives by full
What gaily decorated basket feeding line 81 was sent the fill with gaily decorated basket of silicon wafer, gaily decorated basket turnover mechanism 82 includes transmission mechanism 821, horizontally disposed
Rotation axis 822 and overturning motor 823, transmission mechanism 821 is fixedly connected with rotation axis 822, and rotation axis 822 and transmission mechanism
821 side edge parallel with direction of transfer is fixed, and the output shaft of overturning motor 823 is connect with rotation axis 822, overturns motor
823 operations drive rotation axis 822 to rotate, so that transmission mechanism 821 be made to be rotated by 90 ° around side, make the flower on transmission mechanism 821
Basket is changed into erection position by the position that lies low, and the silicon wafer in the gaily decorated basket switchs to the position that lies low by erectting, straight for the sucker on transportation manipulator 9
Absorption silicon wafer is connect, is transported through, the position after gaily decorated basket turnover mechanism 82 is overturn is located at the upstream end that the empty gaily decorated basket flows out line 83, is used for
It receives and silicon wafer is removed to the rear remaining empty gaily decorated basket in gaily decorated basket turnover mechanism 82, and the empty gaily decorated basket is sent back.
The device of the carrying silicon wafer provided by process upstream can be transported to painting source processing apparatus by feeding line 8, and by silicon wafer
It is adjusted to adapt to the angle of lower step equipment, while the unwanted empty gaily decorated basket can be transported back production line, high degree of automation is not necessarily to people
Work is transported manually.
Wherein, transmission mechanism 821 includes transmission bracket 8211, the conveyer belt 8212 being erected on transmission bracket 8211 and sets
Gaily decorated basket gripping mechanism 8213 above conveyer belt 8212, when the gaily decorated basket is sent to gaily decorated basket turnover mechanism 82 by full gaily decorated basket feeding line 81
It after upper, is fixed on transmission mechanism 821 by gaily decorated basket gripping mechanism 8213, keeps it movable along the vertical direction, when the gaily decorated basket is overturn
Mechanism 82 drives the gaily decorated basket therein to turn over and turn 90 degrees when overturning, after silicon wafer is all pumped in the gaily decorated basket, the conveyer belt of transmission mechanism 821
8212 are driven to opposite direction, are aligned since transmission mechanism 821 at this time flows out line 83 with the empty gaily decorated basket, the empty gaily decorated basket is sent to the sky gaily decorated basket
Outflow line 83 simultaneously outflows line and sends back.Wherein, gaily decorated basket gripping mechanism 8213 can be to be fixed on transmission bracket 8211,
Fence lever above conveyer belt 8212 does not limit the movement of the gaily decorated basket in the horizontal direction, but limits the gaily decorated basket in vertical side
Upward movement, so that the gaily decorated basket will not fall down after 82 90 degree of gaily decorated basket turnover mechanism rotations.
Full gaily decorated basket feeding line 81 includes transmitting bracket 811, the conveyer belt 812 being erected on transmission bracket 811 and being set to pass
The gaily decorated basket gripping mechanism 813 of 812 top of band is sent, gaily decorated basket gripping mechanism 813 can be to be fixed on transmission bracket 811, be located at
The fence lever of 812 top of conveyer belt, prevents the gaily decorated basket from translating into or shifting in transmit process and falls down from conveyer belt 812.
The empty gaily decorated basket goes out stockline 83 and includes transmission bracket 831, the conveyer belt 832 being erected on transmission bracket 831 and be set to biography
The gaily decorated basket gripping mechanism 833 of 832 top of band is sent, gaily decorated basket gripping mechanism 833 can be to be fixed on transmission bracket 831, be located at
The fence lever of 832 top of conveyer belt, prevents the gaily decorated basket from translating into or shifting in transmit process and falls down from conveyer belt 832.
As shown in figure 3, being additionally provided with fragment screening plant 17 between feeding line 8 and Boraxing unit 1, fragment screening plant 17 is wrapped
Light source 171, image collecting device 172, transportation manipulator 173, controller, image display device and garbage collection box 175 are included, is schemed
Picture acquisition device 172 is set near light source 171, image collecting device 172, transportation manipulator 173 and image display device point
It is not electrically connected with the controller.Transportation manipulator 173 is by the silicon wafer on feeding line 8 in gaily decorated basket turnover mechanism 82 by taking out in the carrying gaily decorated basket
Out, and it is put in the top of light source 171, under the irradiation of light source 171, control image collecting device 172 takes pictures to silicon wafer, and
Image is reached into image display device, after staff observes silicon wafer fragment before image display device, is transported by operation
The silicon wafer of fragment is transferred in garbage collection box 175 by manipulator 173, so that fragment be screened.Staff can scheme
It is time saving as monitoring the fragmentation figures at multiple process nodes in display device simultaneously, and without picking out by fragment to scene
It is laborsaving, it is high-efficient.Wherein, image collecting device 172 can be industrial camera.Support frame 179 can be also set above light source 171,
Transportation manipulator 173 is placed on support frame 179 after extracting silicon wafer out in the carrying gaily decorated basket, carries out Image Acquisition.
As shown in Figure 4, Figure 5, wherein fragment screening plant 17 can also include supplied materials elevator 174, transportation manipulator
173 are set between supplied materials elevator 174 and image collecting device 172, and supplied materials elevator 174 is located under gaily decorated basket turnover mechanism 82
Trip, and be maintained on the same line, directly it is connected with the gaily decorated basket turnover mechanism 82 of feeding line 8, continuity is higher, automation
Degree is higher, and supplied materials elevator 174 includes conveyer belt 1741, gaily decorated basket clamping mechanism 1742, support frame 1744 and gaily decorated basket elevator
Structure 1743, conveyer belt 1741 are erected on support frame 1744, and gaily decorated basket clamping mechanism 1742 is set to 1741 top of conveyer belt, and the gaily decorated basket mentions
It rises mechanism 1743 and is set to 1742 lower section of gaily decorated basket clamping mechanism.The gaily decorated basket for carrying silicon wafer is sent into production line by feeding line 8, turns over to the gaily decorated basket
After rotation mechanism 82 is rotated by 90 degrees, sent by the conveyer belt 8212 of gaily decorated basket rotating mechanism 82 to the conveyer belt of supplied materials elevator 174
On 1741, and it is fixed by gaily decorated basket clamping mechanism 1742, and silicon wafer is extracted out from the gaily decorated basket, is placed on light source 171 by transportation manipulator 173
Side's acquisition image, since silicon wafer is gradually pumped, the height of silicon wafer declines therewith in the gaily decorated basket, in order to guarantee first silicon in the gaily decorated basket
The height of piece is constant, and after often taking a silicon wafer away, gaily decorated basket hoisting mechanism 1743 increases gaily decorated basket height, make the silicon wafer of top layer with
Transportation manipulator height is consistent.Gaily decorated basket hoisting mechanism 1742 can go up and down for motor control, and conveyer belt 1741 is set up in branch
The two sides of support 1744, the intermediate position of support frame 1744 are sky, and the thread spindle of lifting motor is stretched out by the intermediate of support frame 1744,
It contacts, is jacked up with the gaily decorated basket clamping mechanism 1742 below the gaily decorated basket, improve the height of the gaily decorated basket.Supplied materials elevator 174 can with it is upper
The production line of procedure is directly connected, and keeps the operation between production line and fragment screening plant more coherent, continuous production
Higher, the degree of automation is higher.
It as shown in Figure 6, Figure 7, further include caching hoisting mechanism 176, it is similar with supplied materials elevator 174, cache hoisting mechanism
Transportation manipulator 177 is equipped between 176 and image collecting device 172, caching hoisting mechanism 176 includes conveyer belt 1761, the gaily decorated basket
Clamping mechanism 1762, support frame 1764 and gaily decorated basket hoisting mechanism 1763, conveyer belt 1761 are erected on support frame 1764, gaily decorated basket card
Tight mechanism 1762 is set to 1761 top of conveyer belt, and gaily decorated basket hoisting mechanism 1762 is set to 1742 lower section of gaily decorated basket clamping mechanism, conveyance
Tool hand 177 is electrically connected with the controller, and is cached and is additionally provided with traversing robot 178 between hoisting mechanism 176 and supplied materials elevator 174,
When the material that feeding line 8 is transported to supplied materials elevator 174 is excessive, and fragment screening is slower, can will be held by traversing robot 178
It carries the gaily decorated basket and is transported to caching hoisting mechanism 176, be again provided with transhipment between caching hoisting mechanism 176 and image collecting device 172
Manipulator 177 can carry out fragment screening, fragment screening efficiency with the interspersed progress Image Acquisition of the silicon wafer on supplied materials elevator 174
It is high.
The fragment screening plant, staff are not necessarily to at each process node at scene monitoring screening, pick in silicon wafer
Fragment, fragmentation figures at multiple process nodes can be monitored simultaneously on image display device, and pick to fragment, saved
Shi Shengli, it is high-efficient；Equipped with supplied materials elevator, it can be directly connected with the production line of previous process, make production line and fragment
Operation between screening plant is more coherent, and continuous production is higher, and the degree of automation is higher；Equipped with caching lifting device, can delay
The material that supplied materials elevator can not be handled in time is deposited, and the screening for carrying out silicon wafer can be interted with supplied materials elevator, it is more efficient.
As shown in figure 8, Boraxing unit 1 includes board 11, nozzle 12, pallet 13, elevating mechanism 14 and rotating mechanism 15, support
The lifting axis connection of 13 bottom of disk and elevating mechanism 14, the bottom of elevating mechanism 14 and the rotation axis connection of rotating mechanism 15, rotation
Rotation mechanism 15 is fixed on board 11, and nozzle 12 is set to 13 top of pallet.Silicon wafer is transported after manipulator 9 picks up, Boraxing unit 1
Elevating mechanism 14 rise, make the height of 13 height alignment transportation manipulator of pallet thereon, transportation manipulator places silicon wafer
After on pallet 13, elevating mechanism 14 drops to 12 lower section of nozzle, and rotating mechanism 15 drives 13 high speed rotation of pallet, while nozzle
12 spray boron diffusion source solution.Elevating mechanism 14 can be lifting cylinder, and rotating mechanism 15 can be motor, and Boraxing unit 1 can
Diffusion source solution is uniformly sprayed on silicon wafer.
As shown in figure 9, drying oven 2 includes furnace body 21 and conveyer belt 22, conveyer belt 22 is set in furnace body 21, sets on furnace body 21
There are air supply motor 23 and air draft motor 24, the silicon wafer that boron diffusion source has been sprayed on Boraxing unit 1 is drawn simultaneously by transportation manipulator 6
Be transported on the conveyer belt 22 of drying oven 2, dried into furnace body 21, and spread, after the completion of drying by conveyer belt 22 by its
It is sent out from the other end of furnace body 21, air supply motor 23 is to send constantly into air in furnace body 21, and air draft motor 24 will be spread in furnace body
The gas discharge that source solution generates, to taking a breath in furnace body 21.
Silicon wafer turnover mechanism 7 includes sucker 71, sucker strut 72 and motor 73, the output shaft and sucker strut 72 of motor 73
One end connection, sucker 71 is set to one end of sucker strut 72, and sucker 71 picks up the silicon wafer transported from drying oven 2, motor
73 drive sucker struts 72 are pivoted 180 degree, make the silicon wafer on sucker 71 by face-up switching to reverse side upward, then through turning
Fortune manipulator 20 is transported to the spraying that boderizing device 3 carries out phosphorous diffusion source.
As shown in Figure 10, fragment screening plant 18, debris screen can be also equipped between silicon wafer turnover mechanism 7 and boderizing device 3
Screening device 18 includes that light source 181, image collecting device 182, transportation manipulator 183, controller, image display device and fragment are received
Collect box 185, image collecting device 182 is set near light source 181, image collecting device 182, transportation manipulator 183 and image
Display device is electrically connected with the controller respectively, and transportation manipulator 183 is set between silicon wafer turnover mechanism 7 and garbage collection box 185,
Silicon wafer turnover mechanism 7 will be placed in the top of light source 181 after silicon wafer turnover, under the irradiation of light source 181, control image collector
It sets 182 pairs of silicon wafers to take pictures, and image is reached into image display device, staff observes silicon before image display device
After piece fragment, the silicon wafer of fragment is transferred in garbage collection box 185 by operation transportation manipulator 183, thus by debris screen
It elects.Staff can monitor simultaneously the fragmentation figures at multiple process nodes on image display device, and without to now
Fragment is picked out by field, time saving and energy saving, high-efficient.Wherein, image collecting device 182 can be industrial camera.It can also be in light
Support frame 184 is set above source 181, sucker 71 is placed on support frame 184 after extracting silicon wafer out in drying oven 2, is carried out image and is adopted
Collection.
Caching hoisting mechanism 19 can also be set between fragment screening plant 18 and boderizing device 4, cache hoisting mechanism 19
Between image collecting device 182 be equipped with transportation manipulator 183, caching hoisting mechanism 19 include conveyer belt, gaily decorated basket clamping mechanism,
Support frame and gaily decorated basket hoisting mechanism, conveyer belt frame are set on the support frame, and gaily decorated basket clamping mechanism is set to above conveyer belt, and the gaily decorated basket is promoted
Mechanism is set to below gaily decorated basket clamping mechanism, and transportation manipulator 183 is electrically connected with the controller, after fragment screening plant 18 screens
Silicon wafer is excessive, and when the processing of boderizing device 4 is slower, silicon wafer is transported to caching hoisting mechanism 19 by transportation manipulator 183, is cached.
As shown in figure 11, boderizing device 3 includes board 31, nozzle 32, pallet 33, elevating mechanism 34 and rotating mechanism 35,
The lifting axis connection of 33 bottom of pallet and elevating mechanism 34, the bottom of elevating mechanism 34 and the rotation axis connection of rotating mechanism 35,
Rotating mechanism 35 is fixed on board 31, and nozzle 32 is set to 33 top of pallet.Silicon wafer is transported after manipulator 20 picks up, boderizing dress
It sets 3 elevating mechanism 34 to rise, makes the height of 33 height alignment transportation manipulator 20 of pallet thereon, transportation manipulator 20 is by silicon
After piece is placed on pallet 33, elevating mechanism 34 drops to 32 lower section of nozzle, and rotating mechanism 35 drives 33 high speed rotation of pallet, together
When nozzle 32 spray phosphorous diffusion source solution.Boderizing device 3 can uniformly spray phosphorous diffusion source solution on silicon wafer.
Identical as drying oven 2, drying oven 4 includes furnace body and conveyer belt, and conveyer belt is set in furnace body, and furnace body is equipped with air-supply
Motor and air draft motor, the silicon wafer that phosphorous diffusion source has been sprayed on boderizing device 3 are drawn by transportation manipulator 26 and are transported to baking
On the conveyer belt of dry furnace 4, dried into furnace body, and spread, after the completion of drying by conveyer belt by it from the other end of furnace body
It sends out, air supply motor is that air is sent constantly into furnace body, and air draft motor is discharged the gas that source solution generates is spread in furnace body, right
It takes a breath in furnace body.
As shown in Figure 12 and Figure 13, powder unit 5 includes board 51, pallet 52, removable rib 53,54 and of elevating mechanism
Powder unit 55 is shaken, elevating mechanism 54 is set on board 51, and the lifting shaft of elevating mechanism 54 is connect with the bottom of pallet 52, can
Mobile rib 53 is set to 52 top of pallet, and vibration powder unit 55 is set to the top of removable rib 53.It is placed on pallet 52
Baffle 533,533 size of baffle are greater than silicon wafer, shield to silicon wafer, prevent silicon wafer from being scratched by pallet, after applying source and drying
The silicon wafer sent is located at the absorption of the sucker 28 on the transportation manipulator 27 on board 51 first, and elevating mechanism 54 rises,
Silicon wafer is placed on the baffle 533 on pallet 52 by manipulator 27, and removable rib 53 adjusts position and positions to silicon wafer, it
The silicon wafer transported afterwards one by one toward stacking on first silicon wafer, move rib 53 the stacked on a large amount of silicon wafers of heap are adjusted it is neat,
And in the whole process, vibration powder unit 55 is constantly shaken, and is shaken in powder unit 55 and is filled with alumina powder,
It shakes 55 bottom of powder unit and is equipped with sieve pore, alumina powder in sieve pore by spilling to silicon wafer during vibration, when silicon wafer heap
After folded certain amount, the opening of silicon boat is directed at silicon wafer, and make to fill in silicon wafer insertion silicon boat from the side for the silicon wafer that heap is folded
Silicon boat, then elevating mechanism 54 declines, and pallet 52 declines, and the silicon boat for filling silicon wafer is transported to next technique.The device can
The continuous automatic flour-sprinkle in silicon wafer stacking process can effectively prevent silicon wafer that bonding die occurs during High temperature diffusion process, and
It is high-efficient without artificial powder, it is time saving and energy saving.
Transportation manipulator 16 is additionally provided on board 51, the end of transportation manipulator 16 is equipped with fixture 29, transportation manipulator 16
Silicon boat is clamped from silicon boat feedway, after the silicon wafer to certain amount then stacked on removable rib 53, transhipment is mechanical
Hand 16 clamps silicon boat, and silicon wafer is inserted into from silicon boat side, and elevating mechanism 54 declines, and is detached from pallet 52 and baffle 533, baffle
533 and silicon wafer stay in silicon boat, then the silicon boat for filling silicon wafer is transferred to next production line by transportation manipulator 16, is not necessarily to
Manually transferred silicon boat keeps the continuity of powder sprinkling device and downstream process more preferable, and the degree of automation is higher, high-efficient.
Shaking powder unit 55 includes sifting bed 551 and percussion mechanism 552, and sifting bed 551 passes through percussion mechanism 552 and board 51
Connection, 551 bottom of sifting bed are equipped with several sieve pores.Existing vibration powder sprinkling device also has perhaps in existing patent there are many kinds of type
The disclosure (such as CN201510825393.4) of this multipair device, herein to the sifting bed and percussion mechanism etc. shaken in powder unit
Without limiting, various types of structures can be used specific structure in the present invention.
Moving rib 53 can be includes multiple driving cylinders 531 and multiple ribs 532, and driving 531 level of cylinder is set
In on board 51, the telescopic shaft of driving cylinder 531 is connect with one end of rib 532, and the other end of rib 532 extends beyond pallet
52 height, after stacking a large amount of silicon wafers on pallet 52, driving cylinder 531 drives rib 532, stacks the silicon wafer stacked whole
Together, prevent it from sliding from pallet 52.
As shown in figure 14, further include lower stockline 10, transportation manipulator 16 is equipped between lower stockline 10 and powder unit 5, under
Stockline 10 includes empty boat inflow line 101, full boat outflow line 102 and silicon boat turnover mechanism 103, the downstream one of empty boat inflow line 101
It is equipped with shifting axle 104 between end and upstream one end of full boat outflow line 102, silicon boat turnover mechanism 103 is movably arranged in movement
On axis 104, and it can be rotated by 90 ° around shifting axle 104.The silicon wafer for completing painting source technique is transported to lower stockline 10, and empty silicon boat is by sky
Boat inflow line 101 be sent into silicon boat turnover mechanism 103, silicon boat turnover mechanism 103 turns over turn 90 degrees after, silicon boat becomes edge-on from horizontal position
Position, transportation manipulator 16 clamp out silicon boat from silicon boat turnover mechanism 103, and silicon boat are inserted into from silicon chip side, Jiang Manzhou
It being placed on silicon boat turnover mechanism 103, silicon boat turnover mechanism 103 is rotated by 90 ° rear silicon boat around shifting axle 104 and is changed into horizontal position,
Silicon boat turnover mechanism 103 is flowed out by line 102 along shifting axle 104 by being moved to full boat by empty boat inflow line 101, and by full boat by full
Boat, which flows out line 102, sends out the production line.
Lower stockline 10 can provide carrying silicon boat to be applied the silicon wafer that source technique is completed, and will complete to obtain by applying source technique
The silicon wafer equipment that is transported to next technique, high degree of automation, without manually transporting.
Wherein, shifting axle 104 can be cylinder, and the telescopic shaft of cylinder is connect with 103 bottom middle line of silicon boat turnover mechanism, cylinder
Driving telescopic shaft is flexible to move silicon boat turnover mechanism 103 along axis, and the other end of cylinder and the output axis connection of motor, motor drive
Dynamic output shaft rotation, drives cylinder to be pivoted, so that silicon boat turnover mechanism 103 be made to rotate around shifting axle 104, overturns silicon boat
The rotation of mechanism 103 position to after overturning.
Silicon boat turnover mechanism 103 includes bracket, the conveyer belt being erected on bracket and the silicon boat card above conveyer belt
Tight device is fixed on silicon by silicon boat gripping mechanism after silicon boat is sent on silicon boat turnover mechanism 103 by empty boat inflow line 101
On boat turnover mechanism 103, keeps it movable along the vertical direction, drive silicon boat therein when silicon boat turnover mechanism 103 is overturn
It turns over and turn 90 degrees, Man Zhouhou is put by transportation manipulator, after silicon boat turnover mechanism 103 is pivoted 90 degree, moved along shifting axle 104
It moves to by full boat outflow line 102, the conveyer belt of silicon boat turnover mechanism 103 is driven to opposite direction, due to silicon boat turnover mechanism at this time
103 are aligned with full boat outflow line 102, and Jiang Manzhou is sent to full boat outflow line 102 and sends out painting source production line.Wherein, silicon boat card
Tight device can be to be fixed on silicon boat turnover mechanism 103, and the fence lever above conveyer belt does not limit silicon boat in water
Square upward movement, but the movement of silicon boat in the vertical direction is limited, thus after 103 90 degree of silicon boat turnover mechanism rotate,
Silicon boat will not fall down.
Empty boat inflow line 101 includes transmitting bracket, the conveyer belt being erected on transmission bracket and above conveyer belt
Silicon boat gripping mechanism, silicon boat gripping mechanism can be to be fixed on transmission bracket, and the fence lever above conveyer belt is prevented
Only the gaily decorated basket is translated into or is shifted in transmit process and fallen down from conveyer belt.
Full boat outflow line 102 includes transmitting bracket, the conveyer belt being erected on transmission bracket and above conveyer belt
Silicon boat gripping mechanism, silicon boat gripping mechanism can be to be fixed on transmission bracket, and the fence lever above conveyer belt is prevented
Only the gaily decorated basket is translated into or is shifted in transmit process and fallen down from conveyer belt.
The silicon wafer applies source production line automation degree height automatically, and multiple processes that silicon wafer applies source carry out automatically, without being equipped with
A large amount of special messenger's manual operations, fault rate is low, and surface covered is high, and coating is uniform, and product qualification rate is high.
One embodiment of the present invention has been described in detail above, but the content is only preferable implementation of the invention
Example, should not be considered as limiting the scope of the invention.It is all according to all the changes and improvements made by the present patent application range
Deng should still be within the scope of the patent of the present invention.
Claims (10)
1. a kind of silicon wafer applies source production line automatically, it is characterised in that: including Boraxing unit, the first drying oven, boderizing device, second
Drying oven and powder unit, between the Boraxing unit and first drying oven, first drying oven and the boderizing fill
It is all provided between setting, between the boderizing device and second drying oven, between second drying oven and the powder unit
There is the first transportation manipulator, downstream one end of first drying oven is equipped with silicon wafer turnover mechanism.
2. silicon wafer according to claim 1 applies source production line automatically, it is characterised in that: it further include feeding line, the feeding
The second transportation manipulator is equipped between line and the Boraxing unit, the feeding line includes fully loaded feeding line, the carrying of the first silicon wafer
Device turnover mechanism and unloaded outflow line, the first silicon wafer carrying device turnover mechanism are set to the downstream of the fully loaded feeding line
One end.
3. silicon wafer according to claim 1 or 2 applies source production line automatically, it is characterised in that: further include lower stockline, under described
Third transportation manipulator is equipped between stockline and the powder unit, the lower stockline includes unloaded inflow line, fully loaded outflow line
With the second silicon wafer carrying device turnover mechanism, upstream one end of downstream one end of the zero load inflow line and the fully loaded outflow line
Between be equipped with shifting axle, the second silicon wafer carrying device turnover mechanism is removable to be set on the shifting axle.
4. silicon wafer according to claim 1 or 2 applies source production line automatically, it is characterised in that: the Boraxing unit includes the
One board, first jet, the first pallet, the first elevating mechanism and the first rotating mechanism, first tray bottom and described the
The lifting axis connection of one elevating mechanism, the rotation axis connection of the bottom of first elevating mechanism and first rotating mechanism,
First rotating mechanism is fixed on first board, and the first jet is set to above first pallet.
5. silicon wafer according to claim 1 or 2 applies source production line automatically, it is characterised in that: the boderizing device includes the
Two boards, second nozzle, the second pallet, the second elevating mechanism and the second rotating mechanism, second tray bottom and described the
The lifting axis connection of two elevating mechanisms, the rotation axis connection of the bottom of second elevating mechanism and second rotating mechanism,
Second rotating mechanism is fixed on second board, and the second nozzle is set to above second pallet.
6. silicon wafer according to claim 1 or 2 applies source production line automatically, it is characterised in that: the powder unit includes the
Three boards, third pallet, third elevating mechanism and vibration powder unit, the third elevating mechanism are set to the third board
On, the lifting shaft of the third elevating mechanism is connect with the third tray bottom, and the vibration powder unit is set to described the
Above three pallets.
7. silicon wafer according to claim 1 or 2 applies source production line automatically, it is characterised in that: first drying oven includes
First furnace body and the first conveyer belt, first conveyer belt are set in first furnace body, and first furnace body is equipped with first
Air supply motor and first row wind motor.
8. silicon wafer according to claim 1 or 2 applies source production line automatically, it is characterised in that: second drying oven includes
Second furnace body and the second conveyer belt, second conveyer belt are set in second furnace body, and second furnace body is equipped with second
Air supply motor and second row wind motor.
9. silicon wafer according to claim 2 applies source production line automatically, it is characterised in that: the Boraxing unit and the feeding
The first fragment screening plant is additionally provided between line, the first fragment screening plant includes supplied materials elevator, first light source, first
Image collecting device and the first garbage collection box, the supplied materials elevator are set to the downstream after gaily decorated basket turnover mechanism overturning
One end is equipped with the 4th transportation manipulator between the supplied materials elevator and the first garbage collection box.
10. silicon wafer according to claim 1 or 2 applies source production line automatically, it is characterised in that: the silicon wafer turnover mechanism with
The second fragment screening plant is additionally provided between the boderizing device, the second fragment screening plant includes second light source, second
Image collecting device and the second garbage collection box are equipped with the 5th between the silicon wafer turnover mechanism and the second garbage collection box
Transportation manipulator.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710879417.3A CN109560006B (en) | 2017-09-26 | 2017-09-26 | Automatic source production line of scribbling of silicon chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710879417.3A CN109560006B (en) | 2017-09-26 | 2017-09-26 | Automatic source production line of scribbling of silicon chip |
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| CN109560006B CN109560006B (en) | 2023-10-20 |
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| CN109560006B (en) | 2023-10-20 |
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