CN208433377U - A kind of silicon wafer production line - Google Patents
A kind of silicon wafer production line Download PDFInfo
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- CN208433377U CN208433377U CN201820881050.9U CN201820881050U CN208433377U CN 208433377 U CN208433377 U CN 208433377U CN 201820881050 U CN201820881050 U CN 201820881050U CN 208433377 U CN208433377 U CN 208433377U
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Abstract
The utility model proposes a kind of silicon wafer production lines, source drying component and second, which is applied, including first applies source drying component, described first, which applies source drying component, applies source mechanism including first, first waste collection bucket, first blower, first drying oven, first silicon wafer turn-over mechanism and No.1 robot, described second, which applies source drying component, applies source mechanism including second, second waste collection bucket, second blower, second drying oven, second silicon wafer turn-over mechanism and No. two robots, the second waste collection bucket is connected with the second painting source mechanism, the silicon wafer production line further includes backing plate, the backing plate is divided into feeding area, workspace and discharge zone, there is gaily decorated basket turnover mechanism in the feeding area, the discharge zone is equipped with silicon wafer flour-sprinkle mechanism, four axis robots and conveyor pallet structure, the gaily decorated basket turnover device can will fill silicon The gaily decorated basket of piece carries out 90 degree of overturnings, and the silicon wafer flour-sprinkle mechanism is between the second silicon wafer turn-over mechanism and four axis robot.
Description
Technical field
The utility model relates to silicon wafer production equipment field, especially a kind of silicon wafer production line.
Background technique
Solar energy is a kind of energy of clean and environmental protection, needs to use silicon wafer in the preparation of solar energy equipment, in silicon wafer
It in manufacturing process, needs to coat diffusion layer to silicon wafer, need by multiple tracks technique, existing production method is applied using artificial
Source, artificial turn-over, the mode of manual handling are processed.The silicon wafer finished product of generation is very different, and waste paper rate is high, while again
It expends a large amount of artificial, leads to that silicon wafer is at high cost, low efficiency.Therefore the industrial flow-line for needing a kind of silicon wafer production, is able to ascend
Silicon wafer quality product rate improves silicon wafer processing efficiency, reduces the silicon wafer production line of cost of labor.
Utility model content
To solve the above-mentioned problems, the utility model proposes one kind can be improved silicon wafer processing efficiency, improves silicon wafer quality product
Rate reduces the silicon wafer production line of cost simultaneously.
What the utility model was achieved through the following technical solutions:
The utility model proposes a kind of silicon wafer production lines, for the painting source of silicon wafer, the silicon wafer production line packet
Include the first painting source drying component and the second painting source drying component, described first to apply source drying component include first applying source mechanism, the
One waste collection bucket, the first blower, the first drying oven, the first silicon wafer turn-over mechanism and No.1 robot, first waste liquid are received
Collection bucket is connected with the first painting source mechanism；First blower is connected with the first painting source mechanism, and first blower is used
In extracting the air in the first painting source mechanism, to play positioning action to the silicon wafer being placed in the first painting source mechanism；
The No.1 robot is located at first drying oven and described first and applies between source mechanism, the first silicon wafer turn-over mechanism position
In the one end of first drying oven far from the No.1 robot；
Described second, which applies source drying component, applies source mechanism, the second waste collection bucket, the second blower, the second drying including second
Furnace, the second silicon wafer turn-over mechanism and No. two robots, the second waste collection bucket is connected with the second painting source mechanism, described
Second blower is connected with the second painting source mechanism, and second blower is used to extract the air in the second painting source mechanism,
To play positioning action to the silicon wafer being placed in the second painting source mechanism；No. two robots are located at described second and dry
Dry furnace and described second applies between source mechanism, and the second silicon wafer turn-over mechanism is located at second drying oven far from described No. two
One end of robot；
The silicon wafer production line further includes backing plate, and the backing plate is divided into feeding area, workspace and discharge zone, institute
Stating feeding area has gaily decorated basket turnover mechanism, the discharge zone to be equipped with silicon wafer flour-sprinkle mechanism, four axis robots and pallet conveying
The gaily decorated basket for filling silicon wafer can be carried out 90 degree of overturnings by mechanism, the gaily decorated basket turnover device, and the silicon wafer flour-sprinkle mechanism is located at institute
It states between the second silicon wafer turn-over mechanism and four axis robot.
Further, the silicon wafer production line further includes fixed frame and support frame, and the fixed frame is erected at described
On backing plate, support frame as described above is used to support the backing plate；The feeding area is also equipped with line of laying up, gaily decorated basket elevator, goes out blue line
With the first cache mechanism, the blue line out and the line of laying up are for transporting the gaily decorated basket, the upper blue line and the gaily decorated basket tipper
Structure connection, the gaily decorated basket elevator are located at the gaily decorated basket turnover mechanism close to the side of first drying oven, and the gaily decorated basket mentions
No. three robots are equipped between the machine of liter and first cache mechanism, the workspace is additionally provided with the second cache mechanism and No. four machines
Device people, the discharge zone are additionally provided with third cache mechanism and No. five robots.
Further, the silicon wafer production line further include the first fragmentation collection assembly, the second fragmentation collection assembly and
Third fragmentation collection assembly, the first fragmentation collection assembly be located at the gaily decorated basket elevator and first cache mechanism it
Between, the first fragmentation collection assembly include the first fragmentation collection box, first light source, the first image capture device, described first
Image capture device is located at the surface of the first light source；The second fragmentation collection assembly is located at the first silicon wafer turn-over
Between mechanism and second cache mechanism, the second fragmentation collection assembly includes the second fragmentation collection box, second light source, the
Two image capture devices, second image capture device are located at the surface of the second light source, and the third fragmentation is collected
For component between the second silicon wafer turn-over structure and the third cache mechanism, the third fragmentation collection assembly includes the
Three fragmentation collection boxes, third light source, third image capture device, the third image capture device are located at the third light source
Surface.
Further, the silicon wafer production line further includes no less than one display screen, and the display screen is for seeing
Examine and control the working condition of the silicon wafer production line；Electrical cabinet component and robot control are additionally provided in support frame as described above
Device.
Further, the first painting source mechanism includes multiple first silicon wafer fixed stations, multiple first motors and multiple the
One applies source nozzle, and the first silicon wafer fixed station is for placing silicon wafer, the first silicon wafer fixed station and one described the
One applies the cooperation of source nozzle, and colloid can be squeezed out and fall on the center of the silicon wafer fixed station by the first painting source nozzle；One
The first silicon wafer fixed station is connect with first motor, and first motor drives the silicon wafer fixed station high speed to revolve
Turn；It is described second painting source mechanism include multiple second silicon wafer fixed stations, multiple second motors and it is multiple second apply source nozzle, it is described
Second silicon wafer fixed station applies the cooperation of source nozzle for placing silicon wafer, the second silicon wafer fixed station and one described second,
Colloid can be squeezed out and fall on the center of the silicon wafer fixed station by the second painting source nozzle；One second silicon wafer is fixed
Platform is connect with second motor, and second motor drives the silicon wafer fixed station high speed rotation.
Further, first drying oven is additionally provided with the first conveyer belt, the first touch screen, first goes out into furnace and first
Furnace, for transmitting silicon wafer, first touch screen is same as observing and adjusting the furnace of first drying oven first transmission belt
Temperature, described first is used for input air into furnace, and described first comes out of the stove for exhaust gas to be discharged；Second drying oven is additionally provided with second
Conveyer belt, the second touch screen, second are come out of the stove into furnace and second, and for transmitting silicon wafer, described second touches second transmission belt
Screen is same as observing and adjusting the furnace temperature of second drying oven；Described second is electrical for inputting into furnace, and described second comes out of the stove use
In discharge exhaust gas, first drying oven is arranged in parallel with second drying oven, and first drying oven and described second dries
Dry furnace is installed contrary.
Further, the first silicon wafer turn-over mechanism includes the first silicon wafer turn-over rig and the first silicon wafer traverse displacement unit,
The first silicon wafer turn-over rig is equipped with the first sucker, and first sucker is for fixing silicon wafer, the first silicon wafer turn-over dress
It sets and is able to drive the overturning of silicon wafer 180 degree, the first silicon wafer traverse displacement unit is able to drive silicon wafer and moves in the horizontal direction；It is described
Second silicon wafer turn-over mechanism includes the second silicon wafer turn-over rig and the second silicon wafer traverse displacement unit, and the second silicon wafer turn-over rig is set
There is the second sucker, for fixing silicon wafer, the second silicon wafer turn-over rig is able to drive silicon wafer 180 degree and turns over second sucker
Turn, the second silicon wafer traverse displacement unit is able to drive silicon wafer and moves in the horizontal direction.
Further, four axis robot includes first axle, two the second axis, third axis and machinery disposed in parallel
Pawl, one end of the gripper are equipped with article putting groove, and the gripper can be respectively along the first axle, second axis and described
Third axis is mobile, and the gripper can drive the article putting groove to rotate.
Further, the silicon wafer flour-sprinkle mechanism is equipped with opening, door opener, positioning device, funnel and powder sprinkling device, institute
Door opener is stated for controlling the exposing of the opening and blocking, the positioning device is used to limit the position of silicon wafer, the leakage
Bucket is placed on the powder sprinkling device, and the powder sprinkling device is for giving silicon wafer powder.
Further, the silicon wafer production line is additionally provided with multiple filtering blowers, and the filtering blower is used for will be described
Air in silicon wafer production line is filtered and is discharged into atmosphere.
The utility model has the beneficial effects that
The silicon wafer production line high degree of automation of the utility model, multiple processes that silicon wafer applies source can be by described
Silicon wafer production line is completed, and is reduced cost of labor, is improved the production efficiency and quality product rate of silicon wafer.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram at visual angle of the silicon wafer production line；
Fig. 2 is the schematic diagram at another visual angle of the silicon wafer production line；
Fig. 3 is a kind of showing for the visual angle for the silicon wafer production line for eliminating the filtering blower and the fixed frame
It is intended to；
Fig. 4 is the schematic diagram for eliminating a kind of visual angle of the silicon wafer production line of support frame as described above；
Fig. 5 is the structural schematic diagram for the first painting source mechanism that removal described first applies after the hood of source；
Fig. 6 is the structural schematic diagram of the silicon wafer flour-sprinkle mechanism；
Fig. 7 is the structural schematic diagram of the first silicon wafer turn-over mechanism；
Fig. 8 is the structural schematic diagram of the silicon wafer turnover mechanism；
Fig. 9 is the structural schematic diagram of four axis robot；
Figure 10 is the structural schematic diagram of first cache mechanism；
Figure 11 is the structural schematic diagram of the No.1 robot；
Figure 12 is the structural schematic diagram of No. two robots；
Figure 13 is the structural schematic diagram of the conveyor pallet structure；
Figure 14 is the structural schematic diagram of the blue line out；
Figure 15 is the structural schematic diagram of the line of laying up；
Figure 16 is the structural schematic diagram of the first fragmentation collection assembly；
Figure 17 is the structural schematic diagram of the gaily decorated basket elevator；
Figure 18 is the structural schematic diagram of No. three robots；
Figure 19 is the structural schematic diagram of first drying oven and second drying oven.
Specific embodiment
In order to it is clearer, completely illustrate the technical solution of the utility model, with reference to the accompanying drawing to the utility model
It is described further.
Fig. 1 to Figure 19 is please referred to, the utility model proposes a kind of silicon wafer production lines, described for the painting source of silicon wafer
Silicon wafer production line includes the first painting source drying component and second applies source drying component, and first painting source drying component includes
First applies source mechanism 21, the first waste collection bucket 22, the first blower 23, the first drying oven 24,25 and of the first silicon wafer turn-over mechanism
No.1 robot 11, described first, which applies source mechanism 21, is used to apply source, the first waste collection bucket 22 and institute to the one side of silicon wafer
State the connection of the first painting source mechanism 21, it is preferred that the first waste collection bucket 22 applies source mechanism 21 by conduit and described first
Connection.The first waste collection bucket 22 is used to collect the waste liquid that the first painting source mechanism 21 generates in applying source procedure.Institute
It states the first blower 23 and described first and applies the connection of source mechanism 21, first blower 23 applies source mechanism 21 for extracting described first
Interior air, to play positioning action to the silicon wafer being placed in the first painting source mechanism 21.The No.1 robot 11
It is applied between source mechanism 21 positioned at first drying oven 24 and described first.The No.1 robot 11 is equipped with the first mechanical hand
111, the first fuselage 113, the first sliding rail 112, first movement device 114 and the second mobile device 115.First fuselage 113
It can move reciprocatingly along first sliding rail 112, the first movement device 114 can be axis with first fuselage 113
The heart 360 degree of rotations in the horizontal direction, second mobile device 115 can be axle center with first movement device 114 in level
360 degree of rotations on direction, first mechanical hand can be axle center with second mobile device 115, in the horizontal direction
Upper 360 degree of rotations.Preferably, in order not to destroy the uniformity behind silicon wafer painting source, first mechanical hand 111 is fixture.It is described
The silicon wafer for completing one side painting source can be taken out from the first painting source mechanism 21 and transport to described first by No.1 robot 11
On drying oven 24.Specifically, first mechanical hand 111 clamps the both ends that one side applies the silicon wafer in source, first fuselage 113 exists
It is moved on first sliding rail 112, the first movement device 114, second mobile device 115 and the first mechanical hand 111
According to preset angular turn, to change the distance between silicon wafer and first drying oven 24, so that first machine
Silicon wafer is sent into the first drying oven 24 by hand 111.First drying oven 24 can be by the silicon chip drying in the source that applies.First silicon wafer
Turn-over mechanism 25 is located at side of first drying oven 24 far from the No.1 robot 11, the first silicon wafer turn-over mechanism
25 can receive from the next silicon wafer of first drying oven 24 transmission and by silicon wafer turnover 180 degree, so that silicon wafer is without the source of painting
One facing towards upper.
Described second to apply source drying component include second applying source mechanism 31, the second waste collection bucket 32, the second blower 33, the
Two drying ovens 34, the second silicon wafer turn-over mechanism 35 and No. two robots 22.The second waste collection bucket 32 and described second applies
Source mechanism 31 connects, it is preferred that the second waste collection bucket 32 can be connect by conduit with the second painting source mechanism 31.
Second blower 33 and described second applies the connection of source mechanism 31.Second blower 33 applies source mechanism for extracting described second
Air in 31.The second painting source mechanism 31 carries out painting source, second waste collection without the source of painting to silicon wafer on one side
Bucket 32 is same as collecting the waste liquid that the second painting source mechanism 31 generates in applying source procedure.Second blower 33 does not stop will be described
Second applies the air extraction in source mechanism 31, to play the work of positioning to the silicon wafer being placed in the second painting source mechanism 31
With.No. two robots 22 are located at second drying oven 34 and described second and apply between source mechanism 31, No. two machines
The silicon wafer for completing painting source can be transported in second drying oven 34 by people 22 from the second painting source mechanism 31.Preferably,
No. two robots 12 are equipped with the second mechanical hand 121, the second fuselage 122, third mobile device 123, the 4th mobile device
114. applied since silicon wafer is secondary it is former after be on one side it is wet, in order not to destroy the uniformity that silicon wafer applies source, second mechanical hand
121 be fixture, and the third mobile device can be axle center 360 degree of rotations in the horizontal direction, institute with second fuselage 122
Stating the 4th mobile device 124 can be that axle center rotate for 360 degree in the horizontal direction with the third mobile device 123, described the
Two mechanical hands 121 can be axle center 360 degree of rotations in the horizontal direction with the 4th mobile device 124.Second machine
Hand 121 clamps the both ends of the silicon wafer in secondary painting source, second mechanical hand 121, the third mobile device 123, the described 4th
Silicon wafer is taken out and is sent from the second painting source mechanism 32 according to preset angular turn, second mechanical hand 121 by mobile device 124
Enter the second drying oven 34.Second drying oven 34 is by silicon chip drying.The second silicon wafer turn-over mechanism 35 is located at described second
Side of the drying oven 34 far from No. two robots 22.Silicon wafer can be carried out 180 degree by the second silicon wafer turn-over mechanism 35
Overturning.
The silicon wafer production line further includes backing plate 62, and the backing plate 62 is divided into feeding area 621, workspace 622
With discharge zone 623, the feeding area 621 has gaily decorated basket turnover mechanism 45, the discharge zone 623 to be equipped with silicon wafer flour-sprinkle mechanism
51, the gaily decorated basket for filling silicon wafer can be carried out 90 by four axis robots 52 and conveyor pallet structure 54, the gaily decorated basket turnover mechanism 45
Degree overturning, makes the gaily decorated basket become vertical state from horizontality.The silicon wafer flour-sprinkle mechanism 51 is located at the second silicon wafer turnover machine
Between structure 35 and four axis robot 52, the silicon wafer flour-sprinkle mechanism 51 can prevent painting source from completing the uniform dusting of silicon wafer
Silicon wafer afterwards is sticked together.The silicon wafer that powder is completed can be collected using silicon boat and be transported to institute by four axis robot 52
It states on conveyor pallet structure 54, the conveyor pallet structure 54 exports silicon boat, and staff is facilitated to be collected.This is practical new
The silicon wafer production line high degree of automation of type realizes the streamlined operation that silicon wafer applies source procedure, improves silicon wafer quality product
Rate improves production efficiency, reduces cost of labor, is suitble to industrial batch machining silicon wafer.
Fig. 1 to Figure 19 is please referred to, the silicon wafer production line further includes fixed frame 61 and support frame 71, the fixed frame
61 are erected on the backing plate 62, and the fixed frame 61 is equipped with fixed bracket 613, sealing plate 611 and sliding door 612, the fixation
Bracket 613 is aluminum frame, is had the advantages that secured, slim and graceful.The sealing plate 611 is transparent acrylic sealing plate 611, thus through envelope
Plate 611, staff can see the operating condition inside the silicon wafer production line.The sliding door 612 can be in water
It square relatively moves upwards, when needing, staff opens sliding door 612 and handles work.The support frame as described above 71 is used for
Support the backing plate 62.Support frame as described above 71 includes cover board 711 and supporting support 712, and the cover board 711 is for protecting the branch
Equipment in support 71, and have Packed function, the supporting support 712 is steelframe, has and consolidates, is not easy to get rusty, support
The strong advantage of power.The feeding area 621 is also equipped with line 41 of laying up, gaily decorated basket elevator 42, goes out blue line 43 and the first cache mechanism
44, the blue line 43 out and the line 41 of laying up are for transporting the gaily decorated basket.Preferably, line 41 and the gaily decorated basket tipper of laying up
Structure 45 connects.The line 41 of laying up is additionally provided with the first conveyer belt 411, and first conveyer belt 411 fills silicon wafer for being driven
The gaily decorated basket, first transmission belt 411 are also used to limit position of the gaily decorated basket in transmission, thus line 41 and the gaily decorated basket of laying up
Turnover mechanism 45 can complete the conveying linking of the gaily decorated basket.The gaily decorated basket elevator 42 is located at the gaily decorated basket turnover mechanism 45 close to institute
The side of the first drying oven 24 is stated, No. three robots are equipped between the gaily decorated basket elevator 42 and first cache mechanism 44
13, the workspace 622 is additionally provided with the second cache mechanism 27 and No. four robots 14, and it is slow that the discharge zone 623 is additionally provided with third
Deposit mechanism 53 and No. five robots 15.In the present embodiment, No. three robots, No. four robots, No. five machines
The structure of device people is identical.No. three robots are equipped with third mechanical hand 131, third fuselage 132,133 and of the 5th mobile device
6th mobile device 134, the third mechanical hand 131 are preferably sucker, and the third mechanical hand can be mobile with the described 6th
Device 134 is axle center 360 degree of rotations in the horizontal direction, and the 6th mobile device 134 can be with the 5th mobile device
133 be axle center 360 degree of rotations in the horizontal direction, and the 5th mobile device 133 can be axle center with the third fuselage 132
360 degree of rotations in the horizontal direction.When transmitting silicon wafer, silicon wafer, the third mechanical hand is sucked in the third mechanical hand 131
131, silicon wafer is transported to first according to preset angular turn by the 5th mobile device 133, the 6th mobile device 134
Apply source mechanism 21.
In production, the gaily decorated basket for being loaded with silicon wafer is put into the line 41 of laying up by staff, and the line 41 of laying up will be spent
Basket transmission, the gaily decorated basket turnover mechanism 45 and the linking of line 41 of laying up, the gaily decorated basket turnover mechanism 45 are received from described second
The gaily decorated basket is simultaneously carried out 90 degree of overturnings by the gaily decorated basket of the transmission of conveyer belt 242, and the gaily decorated basket is made to become vertical state from horizontality.The gaily decorated basket
Turnover mechanism 45 and the gaily decorated basket elevator 42 linking, the gaily decorated basket elevator 42 include that gaily decorated basket positioning device 421 and the gaily decorated basket mention
Device 422 is risen, the gaily decorated basket for the vertical state that the gaily decorated basket turnover mechanism 45 transmits is placed on by the gaily decorated basket elevator 42
In gaily decorated basket positioning device 421, by silicon wafer, the slices from the gaily decorated basket are successively extracted out for No. three robots 13, due to the silicon in the gaily decorated basket
Piece is pumped, in order to which the height for keeping the height of the silicon wafer in the gaily decorated basket to extract with No. three robots 13 is consistent, the gaily decorated basket
Lifting device 422 slowly promotes the gaily decorated basket, to guarantee being normally carried out for process.It is empty after the silicon wafer in the gaily decorated basket is all pumped
The gaily decorated basket by go out blue line 43 transmit.Silicon wafer production line high degree of automation during feeding, a whole set of journey
Sequence is coherent, time saving and energy saving, improves work efficiency.
Fig. 1 to Figure 19 is please referred to, the silicon wafer production line further includes the first fragmentation collection assembly 46, the second fragmentation receipts
Collection component and third fragmentation collection assembly, the first fragmentation collection assembly 46 are located at the gaily decorated basket elevator 42 and described first
Between cache mechanism 44, the first fragmentation collection assembly 46 includes the first fragmentation collection box 462, first light source 461, the first figure
As capture device 463, the first image capture device 463 is located at the surface of the first light source 461.The silicon wafer production
Assembly line further includes no less than one display screen, specifically, being respectively located at the workspace there are two display screen tools
The second display screen 65 of 622 sides and the first display screen 64 positioned at 621 side of feeding area.No. three robots 13 will
For silicon wafer after extracting out in the gaily decorated basket, silicon wafer is put into the surface of first light source 461, the first image by No. three robots 13
Capture device 463 acquires the image of silicon wafer and image is shown that staff is according to the figure for seeing silicon wafer in the first display screen 64
As judging whether silicon wafer is fragmentation, if it is fragmentation, staff controls No. three robots 13 and fragmentation is put into the first fragmentation receipts
Collect box 462, if it is complete silicon wafer, staff controls No. three robots 13 and silicon wafer is placed into the first painting source mechanism
21 carry out the operation of next step.Due to detection silicon wafer whether be fragmentation process expend time it is long, in order to guarantee the gaily decorated basket
Elevator 42 is run as usual, and No. three robots 13 can be a piece of from the gaily decorated basket on the gaily decorated basket elevator 42 by silicon wafer
Piece is extracted out and is put into first cache mechanism 44.To guarantee the coherent operation of equipment.Preferably, in the present embodiment, institute
Stating the first cache mechanism 44 includes for placing silicon wafer support 442 described in the silicon wafer support 442 and silicon wafer support lifting device 441. of silicon wafer
Equipped with the card slot 443 for placing silicon wafer, the height that No. three robots 13 draw silicon wafer immobilizes, and therefore, is placing
During, the silicon wafer support lifting device 441 slowly promotes the silicon wafer support 442, enables No. three robots by silicon wafer
It is successively placed on the card slot 443.The second fragmentation collection assembly is located at the first silicon wafer turn-over mechanism 25 and described
Between two cache mechanisms 27, second cache mechanism 27 is identical as the structure of first cache mechanism 44.Described second is broken
Piece collection assembly includes the second fragmentation collection box 262, second light source 261, the second image capture device.The silicon wafer produces flowing water
Line is additionally provided with third conveyer belt 28, and the silicon wafer for completing turn-over is placed on the third and transmitted by the first silicon wafer turn-over mechanism 25
On band 28, silicon wafer is sucked up from the third conveyer belt 28 and silicon wafer is placed into described second by No. four robots 14
The top of light source 261, the second light source 261 carry out silicon wafer polishing, second image capture device to the image of silicon wafer
It captures and is shown on second display screen 65, staff can observe whether silicon wafer is fragmentation, if it is fragmentation, then control four
Fragmentation is put into the second fragmentation collection box 262 by number robot 14, and if it is complete silicon wafer, silicon wafer is put by No. four robots 14
Second applies the operation that source mechanism 31 carries out next step.Time-consuming for the process of observation silicon wafer, in order to guarantee the normal operation of equipment, work
Make personnel and can control No. four robots 14 will to be first inserted into second cache mechanism 27 from the received silicon wafer of conveyer belt, then again
Silicon wafer is extracted from the second cache mechanism 27 to be checked.The third fragmentation collection assembly is located at the second silicon wafer turn-over knot
Between structure and the third cache mechanism 53, the third cache mechanism 53 is identical as the structure of first cache mechanism 44.
The third fragmentation collection assembly includes third fragmentation collection box, third light source, third image capture device, the third image
Capture device is located at the surface of the third light source, and No. five robots 15 draw the silicon wafer in the second turn-over mechanism and will
Its top for being placed into the third light source, the third light source capture silicon to silicon wafer polishing, the third image capture device
The image of piece simultaneously passes it to first display screen 64, the image that staff can observe silicon wafer judge silicon wafer whether be
Fragmentation, silicon wafer are fragmentations, and fragmentation is put into third fragmentation collection box by No. five robots 15, and silicon wafer is complete, and No. five robots 15 are then
Silicon wafer is put into the operation that the silicon wafer flour-sprinkle mechanism 51 carries out next step.Observation fragmentation needs to expend longer time, in order to
Guarantee the normal operation of equipment, the silicon wafer in silicon wafer turn-over mechanism can be first placed into third cache mechanism by No. five robots 15
In 53, observation processing then is carried out to the silicon wafer in third cache mechanism 53 again.In the present embodiment, the first image captures
Device 463, second image capture device, the structure of the third image capture device are identical, it is preferred that first figure
As capture device 463 can be industrial camera either other can be realized the device of picture catching and transmitting, in the present embodiment
In, the first image capture device 463, second image capture device, the third image capture device can pass through
The realization such as mounting plate either bracket is connect with the fixed frame 61, in another embodiment, the first image capture device
463 can be industrial camera either other can be realized the device of picture catching and transmitting, the first image capture device
463, second image capture device, the third image capture device can be realized by mounting plate either bracket etc. with
The connection of the backing plate 62.
In the present embodiment, first display screen 64 can also be used to observe and control the work of the workspace 622
Situation, the silicon chip image including handling the second image capture device transmitting.The second display screen 65 is for observing and controlling
Make the working condition of the feeding area 621 and the discharge zone 623, including processing the first image capture device 463 and institute
State the image of third image capture device.Electrical cabinet component 81 and robot controller 91 are additionally provided in support frame as described above 71.Institute
Electrical cabinet component 81 is stated for providing electric power support to the silicon wafer production line, the robot controller 91 is for controlling
Above-mentioned all robots.
Fig. 3 and Fig. 5 are please referred to, described first, which applies source mechanism 21, applies multiple first silicon wafers of source hood (not labeled) including first
Fixed station 211, multiple first motors 213 and multiple first apply source nozzle 212.Specifically, the first painting source hood is equipped with
Multiple first openings, No. three robots 13 can pass through the first opening transmission silicon wafer.11 energy of No.1 robot
Enough pass through the silicon wafer in the first opening clamping painting source.The first painting source hood can be avoided painting source liquid in painting source procedure and fly
Out.The first silicon wafer fixed station 211 has 3, and first motor 213 has 3, and described first, which applies source nozzle 212, has
There are 3.The first painting source mechanism 21 can carry out painting source to three silicon wafers simultaneously, compare manual work, improve production effect
Rate.The first silicon wafer fixed station 211 is for placing silicon wafer, the first silicon wafer fixed station 211 and one described first
Painting source nozzle 212 cooperates, and the first painting source nozzle 212 can will apply source colloid and squeeze out and fall in the silicon wafer fixed station
Centre, the first silicon wafer fixed station 211 are connect with first motor 213, and first motor 213 drives described
Silicon wafer fixed station high speed rotation.When being placed with silicon wafer on first fixed station, described first, which applies source nozzle 212, will apply source glue
Body squeezes out and falls on the center of silicon wafer.First motor 213 drives silicon wafer high speed rotation, to equably cover source colloid is applied
It covers on silicon wafer, first blower 23 does not stop from the first painting source mechanism 21 to extract air out, to guarantee silicon wafer in height
Suction during speed rotation by wind-force will not fly out from the first painting source mechanism 21.Described second applies source mechanism 31
Source hood, multiple second silicon wafer fixed stations, multiple second motors and multiple second are applied including second and applies source nozzle, specifically, institute
The quantity for stating the second silicon wafer fixed station, second motor and the second painting source nozzle is three, and described second applies source machine
Structure 31 can carry out painting source to three silicon wafers simultaneously, compared to manual work, improve production efficiency.When second silicon wafer is solid
When determining to be placed with silicon wafer on platform, the second painting source nozzle will apply source colloid and squeeze out and fall on the center of silicon wafer.Second horse
Up to silicon wafer high speed rotation is driven, to equably be covered on source colloid is applied on silicon wafer, second blower 33 does not stop air
It applies source mechanism 31 from described second to extract out, to guarantee silicon wafer during high speed rotation by the suction of wind-force, Bu Huicong
The second painting source mechanism 31 flies out.In the present embodiment, the first painting source mechanism 21 and described second applies source mechanism 31
Structure is identical, and the first painting source mechanism 21 is different from the second painting painting colloid in source of source mechanism 31,
Fig. 3 and Fig. 5 are please referred to, first drying oven 24 is additionally provided with the second conveyer belt 242, the first touch screen 241, first
244 are come out of the stove into furnace 243 and first, and first transmission belt is same as observing and adjust for transmitting silicon wafer, first touch screen 241
The furnace temperature of whole first drying oven 24.Described first is electrical for inputting into furnace 243, and described first comes out of the stove 244 for being discharged
Air；Second drying oven 34 is additionally provided with the second conveyer belt, the second touch screen, second comes out of the stove into furnace and second, and described second
For transmitting silicon wafer, second touch screen is same as observing and adjusting the furnace temperature of second drying oven 34 transmission belt.Described
Two is electrical for inputting into furnace, and described second comes out of the stove for air, first drying oven 24 and second drying oven to be discharged
34 are arranged in parallel, and first drying oven 24 is installed contrary with second drying oven 34.
Referring to FIG. 7, the first silicon wafer turn-over mechanism 25 includes that the first silicon wafer turn-over rig 251 and the first silicon wafer are traversing
Device 252, the first silicon wafer turn-over rig 251 are equipped with the first sucker 253, and first sucker 253 is for fixing silicon wafer, institute
It states the first silicon wafer turn-over rig 251 and is able to drive the overturning of silicon wafer 180 degree, the first silicon wafer traverse displacement unit 252 is able to drive silicon
Piece moves in the horizontal direction, and when work, first sucker 253 draws silicon wafer from second conveyer belt 242, due to silicon
Position of the piece on second conveyer belt 242 is different, and the first silicon wafer traverse displacement unit 252 is first laterally moved to the silicon wafer to be drawn
Relative position, first sucker 253 is sucked silicon wafer, and the first silicon wafer traverse displacement unit 252 resets, and first silicon wafer turns over
Rotary device drive silicon wafer turnover 180 degree so that silicon wafer without apply source one side upward.The structure of second turn-over mechanism with
The structure of first turn-over rig is identical.The second silicon wafer turn-over mechanism 35 includes the second silicon wafer turn-over rig and the second silicon
Piece traverse displacement unit, the second silicon wafer turn-over rig are equipped with the second sucker, and second sucker is for fixing silicon wafer, and described second
Silicon wafer turn-over rig is able to drive the overturning of silicon wafer 180 degree, and the second silicon wafer traverse displacement unit is able to drive silicon wafer in the horizontal direction
Upper movement.When work, second sucker draws silicon wafer from second conveyer belt, since silicon wafer is on the second conveyer belt
Position is different, and the second silicon wafer traverse displacement unit is first laterally moved to the relative position of the silicon wafer to be drawn, and silicon wafer is sucked in the sucker,
The second silicon wafer traverse displacement unit resets, and the second silicon wafer turnover device drives silicon wafer turnover 180 degree.
Fig. 9 and Figure 13 are please referred to, four axis robot 52 includes 521, two the second axis disposed in parallel of first axle
523, third axis 522 and gripper 524, one end of the gripper 524 are equipped with article putting groove 525, and the article putting groove 525 is for putting
Set silicon boat.The gripper 524 can be moved along the first axle 521, second axis 523 and the third axis 522 respectively,
The gripper 524 can drive the article putting groove 525 to rotate.At work, when the silicon stored in the silicon wafer flour-sprinkle mechanism 51
When piece reaches systemic presupposition value, the gripper 524 grabs empty silicon boat and is placed in article putting groove 525, and the silicon boat is vertical
Direction, the gripper 524 drive silicon boat mobile, and the silicon wafer that powder is finished is collected in silicon boat.The then gripper 524
The article putting groove 525 is driven to be rotated by 90 °, so that the silicon boat is changed to horizontality by vertical state, the then gripper
524 take out silicon boat from the silicon wafer flour-sprinkle mechanism 51, and the gripper 524 is moved along second axis 523, by silicon boat water
The flat top for being moved to the conveyor pallet structure 54, then the gripper 524 is moved along the first axle 521, will be described
Silicon boat is placed on the conveyor pallet structure 54, then is exported silicon boat by the tray conveying device, to realize silicon boat
Automatic Conveying, high degree of automation promote working efficiency.Preferably, the tray conveying device 54 includes pallet 541 and the
Two sliding rails 542, the pallet 541 can move reciprocatingly along second sliding rail 542, to complete the transmission of silicon boat.
Referring to FIG. 6, the silicon wafer flour-sprinkle mechanism 51 is equipped with opening 513, door opener 514, positioning device 515, funnel
511 and powder sprinkling device 512, the door opener 514 is used to control the exposing of the opening 513 and blocks, the positioning device
515 for limiting the position of silicon wafer, and the funnel 511 is placed on 512 top of powder sprinkling device, and the funnel 511 is provided with
Alumina powder, the powder sprinkling device 512 is for giving silicon wafer powder.When the control of door opener 514 opening 513 is exposed, institute
No. five robots 15 are stated by silicon wafer from 513 investment of opening, the positioning device 515 positions silicon wafer, to limit silicon wafer
Position after freely falling body.512 double swerve of powder sprinkling device, drives the funnel 511 to move left and right, thus equal to silicon wafer
Even powder prevents silicon wafer from generating adhesion.In the present embodiment, the silicon wafer quantity in the silicon wafer powder sprinkling device 512 reaches default
Height, specifically, reach 500 silicon wafers superposition height when, silicon wafer can be removed.
Fig. 1 and Fig. 2 are please referred to, the silicon wafer production line is additionally provided with multiple filtering blowers 63, the filtering blower 63
For the air in the silicon wafer production line to be filtered and is discharged into atmosphere.Applying source to silicon wafer uses boron molten
Liquid or phosphorus solution, have volatility, therefore, the filtering blower 63 can by the air in the silicon wafer production line into
Row is filtered and is discharged into atmosphere, to keep workplace air pure and fresh, while also avoiding pollution environment.
Certainly, the utility model can also have other numerous embodiments, be based on present embodiment, the ordinary skill of this field
Personnel's obtained other embodiments under the premise of not making any creative work, belong to the utility model and are protected
Range.
Claims (10)
1. a kind of silicon wafer production line, the painting source for silicon wafer, which is characterized in that the silicon wafer production line includes first
Component is dried in painting source and component is dried in the second painting source, and first painting source drying component includes the first painting source mechanism, the first waste liquid
Collecting vessel, the first blower, the first drying oven, the first silicon wafer turn-over mechanism and No.1 robot, the first waste collection bucket and
Described first applies source mechanism connection；First blower is connected with the first painting source mechanism, and first blower is for extracting
Described first applies the air in source mechanism, to play positioning action to the silicon wafer being placed in the first painting source mechanism；Described one
Number robot is located at first drying oven and described first and applies between source mechanism, and the first silicon wafer turn-over mechanism is located at described
The one end of first drying oven far from the No.1 robot；
It is described second apply source drying component include second apply source mechanism, the second waste collection bucket, the second blower, the second drying oven,
Second silicon wafer turn-over mechanism and No. two robots, the second waste collection bucket are connected with the second painting source mechanism, and described the
Two blowers are connected with the second painting source mechanism, and second blower is used to extract the air in the second painting source mechanism, from
And positioning action is played to the silicon wafer being placed in the second painting source mechanism；No. two robots are located at second drying
Furnace and described second applies between source mechanism, and the second silicon wafer turn-over mechanism is located at second drying oven far from No. two machines
One end of device people；
The silicon wafer production line further includes backing plate, and the backing plate is divided into feeding area, workspace and discharge zone, it is described on
Material area has gaily decorated basket turnover mechanism, the discharge zone to be equipped with silicon wafer flour-sprinkle mechanism, four axis robots and conveyor pallet structure,
The gaily decorated basket for filling silicon wafer can be carried out 90 degree of overturnings by the gaily decorated basket turnover device, and the silicon wafer flour-sprinkle mechanism is located at described second
Between silicon wafer turn-over mechanism and four axis robot.
2. silicon wafer production line according to claim 1, which is characterized in that the silicon wafer production line further includes solid
Determine frame and support frame, the fixed frame is erected on the backing plate, and support frame as described above is used to support the backing plate；The feeding area
It is also equipped with line of laying up, gaily decorated basket elevator, goes out blue line and the first cache mechanism, the blue line out and the line of laying up are for transporting
The gaily decorated basket, the upper blue line are connect with the gaily decorated basket turnover mechanism, and it is close that the gaily decorated basket elevator is located at the gaily decorated basket turnover mechanism
The side of first drying oven is equipped with No. three robots between the gaily decorated basket elevator and first cache mechanism, described
Workspace is additionally provided with the second cache mechanism and No. four robots, and the discharge zone is additionally provided with third cache mechanism and No. five machines
People.
3. silicon wafer production line according to claim 2, which is characterized in that the silicon wafer production line further includes
One fragmentation collection assembly, the second fragmentation collection assembly and third fragmentation collection assembly, the first fragmentation collection assembly are located at institute
It states between gaily decorated basket elevator and first cache mechanism, the first fragmentation collection assembly includes the first fragmentation collection box, the
One light source, the first image capture device, the first image capture device are located at the surface of the first light source；Described second
Fragmentation collection assembly is between the first silicon wafer turn-over mechanism and second cache mechanism, the second fragmentation collection group
Part includes the second fragmentation collection box, second light source, the second image capture device, and second image capture device is located at described the
The surface of two light sources, the third fragmentation collection assembly are located at the second silicon wafer turn-over structure and the third cache mechanism
Between, the third fragmentation collection assembly includes third fragmentation collection box, third light source, third image capture device, and described
Three image capture devices are located at the surface of the third light source.
4. silicon wafer production line according to claim 2, which is characterized in that the silicon wafer production line further includes not
Display screen less than one, the display screen are used to observe and control the working condition of the silicon wafer production line；The branch
Electrical cabinet component and robot controller are additionally provided in support.
5. silicon wafer production line according to claim 1, which is characterized in that the first painting source mechanism includes multiple the
One silicon wafer fixed station, multiple first motors and multiple first apply source nozzle, and the first silicon wafer fixed station is for placing silicon wafer, and one
A first silicon wafer fixed station and the first painting source nozzle cooperation, the first painting source nozzle can squeeze out colloid
And fall on the center of the silicon wafer fixed station；One the first silicon wafer fixed station is connect with first motor, described
First motor drives the silicon wafer fixed station high speed rotation；It is described second apply source mechanism include multiple second silicon wafer fixed stations, it is more
A second motor and multiple second applies source nozzle, and the second silicon wafer fixed station is for placing silicon wafer, second silicon wafer
Colloid can be squeezed out and fall on the silicon wafer by fixed station and the second painting source nozzle cooperation, the second painting source nozzle
The center of fixed station；One the second silicon wafer fixed station is connect with second motor, and second motor drives institute
State silicon wafer fixed station high speed rotation.
6. silicon wafer production line according to claim 1, which is characterized in that first drying oven is additionally provided with the first biography
Band, the first touch screen, first is sent to come out of the stove into furnace and first, first transmission belt is for transmitting silicon wafer, first touch screen
It is same as observing and adjusting the furnace temperature of first drying oven, described first is used for input air into furnace, and described first, which comes out of the stove, is used for
Exhaust gas is discharged；Second drying oven is additionally provided with the second conveyer belt, the second touch screen, second comes out of the stove into furnace and second, and described
For transmitting silicon wafer, second touch screen is same as observing and adjusting the furnace temperature of second drying oven two transmission belts；Described
Two is electrical for inputting into furnace, and described second comes out of the stove for exhaust gas to be discharged, and first drying oven and second drying oven are flat
Row setting, first drying oven is installed contrary with second drying oven.
7. silicon wafer production line according to claim 1, which is characterized in that the first silicon wafer turn-over mechanism includes the
One silicon wafer turn-over rig and the first silicon wafer traverse displacement unit, the first silicon wafer turn-over rig are equipped with the first sucker, and described first inhales
Disk is able to drive the overturning of silicon wafer 180 degree, the first silicon wafer traverse displacement unit for fixing silicon wafer, the first silicon wafer turn-over rig
Silicon wafer is able to drive to move in the horizontal direction；The second silicon wafer turn-over mechanism includes the second silicon wafer turn-over rig and the second silicon
Piece traverse displacement unit, the second silicon wafer turn-over rig are equipped with the second sucker, and second sucker is for fixing silicon wafer, and described second
Silicon wafer turn-over rig is able to drive the overturning of silicon wafer 180 degree, and the second silicon wafer traverse displacement unit is able to drive silicon wafer in the horizontal direction
Upper movement.
8. silicon wafer production line according to claim 1, which is characterized in that four axis robot include first axle,
One end of two the second axis, third axis and grippers disposed in parallel, the gripper is equipped with article putting groove, and the gripper can
It is moved respectively along the first axle, second axis and the third axis, the gripper can drive the article putting groove to rotate.
9. silicon wafer production line according to claim 1, which is characterized in that the silicon wafer flour-sprinkle mechanism be equipped with opening,
Door opener, positioning device, funnel and powder sprinkling device, the door opener are used to control the exposing of the opening and block, institute
It states positioning device and is placed on the powder sprinkling device for limiting the position of silicon wafer, the funnel, the powder sprinkling device is for giving
Silicon wafer powder.
10. silicon wafer production line according to claim 1, which is characterized in that the silicon wafer production line is additionally provided with
Multiple filtering blowers, the air in the silicon wafer production line for being filtered and being discharged into atmosphere by the filtering blower
In.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820881050.9U CN208433377U (en) | 2018-06-05 | 2018-06-05 | A kind of silicon wafer production line |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201820881050.9U CN208433377U (en) | 2018-06-05 | 2018-06-05 | A kind of silicon wafer production line |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571164A (en) * | 2018-06-05 | 2019-12-13 | 深圳市旭控科技有限公司 | silicon wafer production line |
| CN112275671A (en) * | 2020-12-25 | 2021-01-29 | 西安奕斯伟硅片技术有限公司 | Wafer sorting equipment and wafer sorting method |
| CN113044539A (en) * | 2021-04-23 | 2021-06-29 | 上海匠实半导体科技中心 | Automatic feeding system |
-
2018
- 2018-06-05 CN CN201820881050.9U patent/CN208433377U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571164A (en) * | 2018-06-05 | 2019-12-13 | 深圳市旭控科技有限公司 | silicon wafer production line |
| CN112275671A (en) * | 2020-12-25 | 2021-01-29 | 西安奕斯伟硅片技术有限公司 | Wafer sorting equipment and wafer sorting method |
| CN113044539A (en) * | 2021-04-23 | 2021-06-29 | 上海匠实半导体科技中心 | Automatic feeding system |
| CN113044539B (en) * | 2021-04-23 | 2022-07-26 | 上海提牛机电设备有限公司 | Automatic feeding system |
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Effective date of registration: 20210813 Address after: 518125 2nd floor, building B, 84 Xinyu Road, Xiangshan community, Xinqiao street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Jiaqiang Laser Technology Co.,Ltd. Address before: 518000 first floor, building C, Fukang community and Hengxing science and Technology Park, Longhua sub district office, Longhua District, Shenzhen, Guangdong Province Patentee before: SHENZHEN SINOCO TECHNOLOGY Co.,Ltd. |