CN109545819A - 显示模组 - Google Patents
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Abstract
一种显示模组,包含多个阵列排列的封装体,每一个该封装体包括基板、至少二个像素,及封装材。所述像素阵列设置于该基板上,且每一个像素具有第一发光二极体晶片、第二发光二极体晶片,及第三发光二极体晶片,相邻的所述像素的所述第一发光二极体晶片之间具有一内部间距。该封装材覆盖所述像素与该基板。相邻的所述封装体的最相邻的所述像素的各该第一发光二极体晶片间具有外部间距,该外部间距等于该内部间距,让发光二极体晶片的内部间距与其外部间距相等不仅能有效提高显示屏的解析度还能增强各像素间的混光效果使色彩显示更佳而具有更真实的影像。
Description
技术领域
本发明涉及一种显示模组,特别是涉及一种具有多个将多个像素封装成单个封装体的显示模组。
背景技术
现有的发光二极体显示屏主要是由多组经封装的三原色(RGB)发光二极体晶片排列所构成,简单地来说,一般是将红色、绿色及蓝色三种颜色的发光二极体晶片封装成一封装体,再将多个该封装体彼此阵列排列设置在一电路板上而构成一发光二极体显示屏。
目前发光二极体显示屏的显示质量要求越来越高,常见用来提升显示质量的方式,是在相同尺寸的显示屏上设置更多像素以提高显示屏的解析度,但要在相同面积设置更多像素时,需要缩小各该封装体的体积,然而,当各该封装体的体积越做越小时,对应所述发光二极体晶片而设置于该封装体外表面的多个外接电极(也就是用来供焊接到该电路板的焊垫)也会越来越密集,使得承载所述封装体的该电路板的线路也必须相对应的制作得更密集,但该电路板还需额外设置例如驱动IC或其他被动元件(电容或电阻),因此,若该电路板的线路越趋密集时,不仅会提高该电路板的制作成本,且其制程能力也有一定的局限,从而无法因应让体积缩小的所述封装体设置。
此外,一般是缩小各该封装体的长宽,让各该封装体之间的间距更为紧密而提高解析度,但该封装体的高度不会有太大的变化,因此,让经缩小的该封装体整体的高宽比因而变大,使得当要将其设置到该电路板上时,容易造成在该电路板运送过程或是显示屏组装施工过程中,因为碰触产生的力矩变大使该封装体容易脱落,进而造成后端维修以及服务上的高成本的缺点。
再者,若要让整体显示屏具有更佳的显示效果,需要让各封装体之间的所述发光二极体晶片之间的距离相等,然而,随着缩小各该封装体的体积后,将所述封装体设置于该电路板时,要让各该封装体之间的所述发光二极体晶片之间的距离相等的制程难度也跟着上升,容易造成间距过小或过宽的问题而影响显示质量。
发明内容
本发明的目的在于提供一种显示模组。
本发明显示模组,包含多个阵列排列的封装体,每一个该封装体包括基板、至少二个像素,及封装材。
所述像素阵列设置于该基板上,且每一个该像素具有第一发光二极体晶片、第二发光二极体晶片,及第三发光二极体晶片,相邻的所述像素的所述第一发光二极体晶片之间具有内部间距。该封装材覆盖所述像素与该基板。
于本发明中,相邻的所述封装体的最相邻的所述像素的各该第一发光二极体晶片之间具有外部间距,该外部间距等于该内部间距。
较佳地,本发明显示模组,每一个该封装体的该封装材的背面具有电连接所述像素且数量小于四倍的所述像素数量的外接电极。
本发明显示模组,每一个该封装体中的所述像素的排列数量为2n×2m,n、m为自然数,且n、m介于0至3。
本发明显示模组,该内部间距与该外部间距介于0.5mm至1.25mm。
本发明显示模组,该第一发光二极体晶片的发光波长介于605nm至645nm,该第二发光二极体晶片的发光波长介于510nm至545nm,该第三发光二极体晶片的发光波长介于450nm至485nm。
本发明显示模组,所述阵列排列的封装体的所述像素是以720×480、1280×720、1920×1808、3840×2160,或4096×2160方式排列。
本发明的有益效果在于:以该封装材同时将多个像素封装成该封装体,以让单个封装体具有多组三原色像素,不仅能有效缩短各像素之间的距离,还能降低整体的该封装体的高宽比而能提升设置在电路板的稳定性,此外,让发光二极体晶片的内部间距与其外部间距相等不仅能有效提高显示屏的解析度还能增强各像素间的混光效果使色彩显示更佳而具有更真实的影像。
附图说明
图1是一俯视示意图,说明本发明显示模组的一实施例;
图2是一俯视示意图,辅助说明该实施例的多个封装体内的像素排列的另一种态样;及
图3是一立体示意图,说明该第一实施例的外接电极。
具体实施方式
下面结合附图及实施例对本发明进行详细说明。
参阅图1至图3,本发明显示模组的一实施例,包含多个阵列设置在一电路板(图未示)的封装体2,每一个该封装体2包括一基板(图未示)、四组设置于该基板上的像素3,一覆盖所述像素3与该基板的封装材4。换句话说,本实施例是直接以该封装材4将多个该像素3一同封装成单一个封装体2,而适用于本实施例的该封装材4的材料可选自透明高分子材料,或其他用于封装发光二极体晶片的材料,此材料的选用为本领域人员所周知,于此不加以赘述。
所述像素3是以阵列方式设置于该基板上,且每一个该像素3具有一第一发光二极体晶片31、一第二发光二极体晶片32,及一第三发光二极体晶片33,于本实施例中,该像素3是由三原色(RGB)的发光二极体晶片所构成而适用于应用在显示屏上,也就是说,本实施例是以该第一发光二极体晶片31为能发出波长介于605nm至645nm的红色发光二极体晶片,该第二发光二极体晶片32为能发出波长介于510nm至545nm的绿色发光二极体晶片,该第三发光二极体晶片33为能发出波长介于450nm至485nm的蓝色发光二极体晶片为例做说明。
此处要说明的是,所述像素3的数量与排列并无特别限制,由于所述封装体2适用于应用在显示屏上,因此,较佳地,所述封装体2与所述像素3的排列为以阵列方式排列,也就是能以行列为1×2、1×3、1×4、1×5…等一维的方式排列(如图2便是以所述像素3为1×3的方式排列的态样说明),更佳地,也能以行列为2n×2m的二维矩阵方式排列,其中,n、m为自然数,且n、m介于1至3,图1便是以每一个该封装体2具有四组该像素3且分别以2×2的方式排列为例做说明。此处要补充说明的是,所述封装体2阵列排列构成该显示模组时,所述封装体2的所述像素3的像素比例分别可为标准解析度(standard definition,SD)、高解析度(high definition,HD)、全高解析度(Full HD),或4K解析度(4K resolution),也就是等封装体2的所述像素3是以720×480(也就是SD)、1280×720(也就是HD)、1920×1808(也就是Full HD)、3840×2160,或4096×2160方式排列。
除了所述像素3以矩阵方式排列之外,本发明还对每一个该封装体2之间及每一个该封装体2内的各像素3之间的距离进一步限制为相等,也就是说,于每一个该封装体2内的相邻的所述像素3的所述第一发光二极体晶片31之间具有一内部间距A,而相邻的所述封装体2的最相邻的所述像素3的各该第一发光二极体晶片31之间则具有一外部间距B,且该外部间距B等于该内部间距A。较佳地,于本实施例中,该内部间距A与该外部间距B介于0.5mm至1.25mm。
由于本实施例是将多个该像素3一同封装成单一个封装体2,能有效增加该封装体2的底部与顶部面积,也就是增加整体封装体2的长L与宽W,让其高度H相对于长L与宽W的比例降低,也就是让整体封装体2的高宽比降低,且对单个封装体2而言也能具有更多对应各发光二极体晶片的外接电极5(也就是该封装体2背面的焊锡),让封装体2于后续设置在电路板能拥有高焊锡强度而提升整体稳定性,避免电路板运送过程或是显示屏组装施工时,因为碰触该封装体2产生的力矩变大使该封装体2容易脱落的现象发生。此外,除了将多个该像素3一同封装成单个封装体2之外,还进一步设计让各像素3间距相等,增强各像素3间的混光效果而具有更佳的色彩显示效果以让影像呈现更为真实。
此处要另外说明的是,一般而言,现有的封装体是将三个发光二极体晶片封装成单一个封装体,且每个封装体会具有四个与各发光二极体晶片电连接并供外界电连接的外接电极,也就是现有外接电极所对应的数量就是封装体数量的四倍。举例来说,当有四组封装体时,总共会有十六个外接电极,因此,当要提高显示屏的解析度而将现有封装体体积缩小时,其形成在封装体背面的外接电极也越趋密集,使得承载所述封装体的该电路板的线路也越趋密集,然而,电路板制程能力有一定的局限且还需供其他元件设置,若有在有限的面积承载更多的封装体时,会提高该电路板的成本与制程的难度。
因此,本发明将多个该像素3一同封装成单一个封装体2的同时,还能进一步整合封装体内各所述发光二极体晶片的线路连接,从而减少各发光二极体晶片的接脚(图未示),使得每一个该封装体2的该封装材4的一背面41具有电连接所述发光二极体晶片的所述接脚且数量小于四倍的所述像素3数量的外接电极5。详细地说,如图3所示,本实施例单个封装体2具有四个像素3,而透过内部整合各发光二极体晶片的线路连接,使得该封装体2的背面41减少为十二个外接电极5,其数量是少于现有若为四组封装体所具有的十六个外接电极,有效减少外接电极5的密集程度,让电路板无须提供更多对应的接点。
综上所述,本发明显示模组,通过该封装材4同时将多个像素3封装成单个该封装体2,让单个封装体2具有多组三原色像素3,能有效缩短各像素3之间的距离提高显示屏的解析度,并设计让各像素3之间的内部间距A与外部间距B等距离以增强各像素3间的混光效果,使显示屏具有较佳的色彩显示效果以让影像呈现更为真实,此外,还让整体的该封装体2的高宽比例降低并于单个封装体2具有更多的外接电极5而能提升设置在电路板的稳定性,所以确实能达成本发明的目的。
Claims (6)
1.一种显示模组,包含多个阵列排列的封装体;其特征在于:每一个该封装体包括:基板、至少二个像素,及封装材,所述像素阵列设置于该基板上,且每一个像素具有第一发光二极体晶片、第二发光二极体晶片,及第三发光二极体晶片,相邻的所述像素的所述第一发光二极体晶片之间具有内部间距,该封装材覆盖所述像素与该基板,相邻的所述封装体的最相邻的所述像素的各该第一发光二极体晶片之间具有外部间距,该外部间距等于该内部间距。
2.根据权利要求1所述的显示模组,其特征在于:每一个封装体的封装材的背面具有电连接所述像素且数量小于四倍的所述像素数量的外接电极。
3.根据权利要求1所述的显示模组,其特征在于:每一个封装体中的所述像素的排列数量为2n×2m,n、m为自然数,且n、m介于0至3。
4.根据权利要求1所述的显示模组,其特征在于:该内部间距与该外部间距介于0.5mm至1.25mm。
5.根据权利要求1所述的显示模组,其特征在于:该第一发光二极体晶片的发光波长介于605nm至645nm,该第二发光二极体晶片的发光波长介于510nm至545nm,该第三发光二极体晶片的发光波长介于450nm至485nm。
6.根据权利要求1所述的显示模组,其特征在于:所述阵列排列的封装体的所述像素是以720×480、1280×720、1920×1808、3840×2160,或4096×2160方式排列。
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CN113272881B (zh) * | 2019-11-15 | 2023-08-29 | 京东方科技集团股份有限公司 | 显示面板、拼接显示面板、其制备方法 |
CN213781461U (zh) * | 2020-09-30 | 2021-07-23 | 惠州徳为智能技术有限公司 | 一种led球型显示屏 |
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US20100163892A1 (en) * | 2008-12-29 | 2010-07-01 | Yu-Huan Liu | Led device and method of packaging the same |
US20140353694A1 (en) * | 2013-05-29 | 2014-12-04 | Cree Huizhou Solid State Lighting Company Limited | Multiple pixel surface mount device package |
US20150371976A1 (en) * | 2014-06-19 | 2015-12-24 | E Ink Holdings Inc. | Display apparatus, display module and pixel structure thereof |
CN106960860A (zh) * | 2016-01-11 | 2017-07-18 | 三星显示有限公司 | 柔性显示装置 |
CN107004678A (zh) * | 2014-10-22 | 2017-08-01 | 欧库勒斯虚拟现实有限责任公司 | 显示器、用于显示器的led芯片、用于显示器的像素、用于显示器的控制法、用于显示器的计算机程序 |
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CN1223975C (zh) * | 2003-04-11 | 2005-10-19 | 田志辉 | 混色全彩色led显示模块 |
CN102315362A (zh) * | 2010-06-30 | 2012-01-11 | 一诠精密电子工业(中国)有限公司 | 可提升画面细致度的发光二极管及其排列方法 |
WO2016152321A1 (ja) * | 2015-03-20 | 2016-09-29 | ソニーセミコンダクタソリューションズ株式会社 | 表示装置および照明装置ならびに発光素子および半導体デバイス |
TWI562107B (en) * | 2015-04-23 | 2016-12-11 | Internat Liquid Crystal Display Co Ltd | Display |
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2017
- 2017-09-22 TW TW106132553A patent/TWI660495B/zh active
- 2017-12-01 CN CN201711248587.8A patent/CN109545819A/zh active Pending
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Patent Citations (5)
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US20100163892A1 (en) * | 2008-12-29 | 2010-07-01 | Yu-Huan Liu | Led device and method of packaging the same |
US20140353694A1 (en) * | 2013-05-29 | 2014-12-04 | Cree Huizhou Solid State Lighting Company Limited | Multiple pixel surface mount device package |
US20150371976A1 (en) * | 2014-06-19 | 2015-12-24 | E Ink Holdings Inc. | Display apparatus, display module and pixel structure thereof |
CN107004678A (zh) * | 2014-10-22 | 2017-08-01 | 欧库勒斯虚拟现实有限责任公司 | 显示器、用于显示器的led芯片、用于显示器的像素、用于显示器的控制法、用于显示器的计算机程序 |
CN106960860A (zh) * | 2016-01-11 | 2017-07-18 | 三星显示有限公司 | 柔性显示装置 |
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US20190096292A1 (en) | 2019-03-28 |
TW201916341A (zh) | 2019-04-16 |
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