CN109478018B - 图案描绘装置 - Google Patents

图案描绘装置 Download PDF

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Publication number
CN109478018B
CN109478018B CN201680074442.8A CN201680074442A CN109478018B CN 109478018 B CN109478018 B CN 109478018B CN 201680074442 A CN201680074442 A CN 201680074442A CN 109478018 B CN109478018 B CN 109478018B
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China
Prior art keywords
substrate
scanning direction
sub
magnification
pixel
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CN201680074442.8A
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English (en)
Chinese (zh)
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CN109478018A (zh
Inventor
仓重贵广
渡辺智行
加藤正纪
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Nikon Corp
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Nikon Corp
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Priority to CN201910501101.XA priority Critical patent/CN110221527A/zh
Publication of CN109478018A publication Critical patent/CN109478018A/zh
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Publication of CN109478018B publication Critical patent/CN109478018B/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706845—Calibration, e.g. tool-to-tool calibration, beam alignment, spot position or focus

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201680074442.8A 2015-12-17 2016-12-14 图案描绘装置 Active CN109478018B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910501101.XA CN110221527A (zh) 2015-12-17 2016-12-14 图案描绘装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-246298 2015-12-17
JP2015246298 2015-12-17
PCT/JP2016/087262 WO2017104717A1 (ja) 2015-12-17 2016-12-14 パターン描画装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201910501101.XA Division CN110221527A (zh) 2015-12-17 2016-12-14 图案描绘装置

Publications (2)

Publication Number Publication Date
CN109478018A CN109478018A (zh) 2019-03-15
CN109478018B true CN109478018B (zh) 2020-11-24

Family

ID=59056887

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201680074442.8A Active CN109478018B (zh) 2015-12-17 2016-12-14 图案描绘装置
CN201910501101.XA Pending CN110221527A (zh) 2015-12-17 2016-12-14 图案描绘装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201910501101.XA Pending CN110221527A (zh) 2015-12-17 2016-12-14 图案描绘装置

Country Status (5)

Country Link
JP (3) JP6708217B2 (enExample)
KR (1) KR102641407B1 (enExample)
CN (2) CN109478018B (enExample)
TW (1) TWI722074B (enExample)
WO (1) WO2017104717A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109478018B (zh) * 2015-12-17 2020-11-24 株式会社尼康 图案描绘装置
JP6900978B2 (ja) * 2017-07-25 2021-07-14 株式会社三洋物産 遊技機
CN111065972A (zh) * 2017-09-26 2020-04-24 株式会社尼康 图案描绘装置
TWI648604B (zh) 2017-12-27 2019-01-21 財團法人工業技術研究院 數位直接成像方法與系統、影像產生方法與電子裝置
JP6819737B2 (ja) * 2019-07-22 2021-01-27 株式会社三洋物産 遊技機
TWI762945B (zh) * 2020-06-09 2022-05-01 源台精密科技股份有限公司 無光罩曝光機之動態補正方法及裝置
EP4261615A4 (en) * 2020-12-08 2024-06-19 Inspec Inc. EXPOSURE HEAD, CALIBRATION SYSTEM AND DRAWING DEVICE
CN115860145A (zh) * 2022-12-26 2023-03-28 环旭电子股份有限公司 芯片位置正确性的机器学习系统及机器学习方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2905762B2 (ja) * 1997-10-31 1999-06-14 株式会社金田機械製作所 傾斜歪打消信号を利用した印刷用刷版露光装置
JP2003115449A (ja) * 2001-02-15 2003-04-18 Nsk Ltd 露光装置
JP2004272167A (ja) * 2003-03-12 2004-09-30 Dainippon Printing Co Ltd パターン形成装置、パターン形成方法、基材
JP4413036B2 (ja) * 2004-02-25 2010-02-10 新光電気工業株式会社 描画装置、描画データ生成装置、描画方法、および描画データ生成方法
US7045771B2 (en) * 2004-03-16 2006-05-16 Kabushiki Kaisha Toshiba Light beam scanning apparatus and image forming apparatus
JP4338577B2 (ja) * 2004-04-28 2009-10-07 株式会社ブイ・テクノロジー 露光装置
JP2006098727A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 伸縮状態の検出手段を設けた長尺の可撓性記録媒体と、この可撓性記録媒体に伸縮状態を補正して画像を描画可能な描画方法及び装置
KR101261353B1 (ko) * 2005-03-31 2013-05-09 후지필름 가부시키가이샤 묘화점 데이터 취득 방법 및 장치, 묘화 방법 및 장치
JP2007025394A (ja) * 2005-07-19 2007-02-01 Fujifilm Holdings Corp パターン形成方法
JP2010026465A (ja) * 2008-07-24 2010-02-04 Dainippon Screen Mfg Co Ltd パターン描画装置
JP5406510B2 (ja) * 2008-11-18 2014-02-05 キヤノン株式会社 走査露光装置およびデバイス製造方法
US8335999B2 (en) * 2010-06-11 2012-12-18 Orbotech Ltd. System and method for optical shearing
JP6074898B2 (ja) * 2012-03-26 2017-02-08 株式会社ニコン 基板処理装置
JP6013097B2 (ja) * 2012-09-14 2016-10-25 株式会社Ｓｃｒｅｅｎホールディングス パターン描画装置、パターン描画方法
JP2015145990A (ja) * 2014-02-04 2015-08-13 株式会社ニコン 露光装置
TWI661280B (zh) * 2014-04-01 2019-06-01 日商尼康股份有限公司 Substrate processing method and substrate processing device
KR102377751B1 (ko) * 2014-04-01 2022-03-24 가부시키가이샤 니콘 기판 처리 장치, 및 디바이스 제조 방법
JP6349924B2 (ja) * 2014-04-28 2018-07-04 株式会社ニコン パターン描画装置
JP6361273B2 (ja) * 2014-05-13 2018-07-25 株式会社ニコン 基板処理装置及びデバイス製造方法
CN105137721B (zh) * 2015-09-24 2017-04-12 山东科技大学 扫描工作台各速度段进行激光直写二值图案的方法与装置
CN109478018B (zh) * 2015-12-17 2020-11-24 株式会社尼康 图案描绘装置

Also Published As

Publication number Publication date
CN110221527A (zh) 2019-09-10
KR20180095812A (ko) 2018-08-28
TWI722074B (zh) 2021-03-21
JPWO2017104717A1 (ja) 2018-10-04
JP2019197219A (ja) 2019-11-14
JP6708217B2 (ja) 2020-06-10
JP6753493B2 (ja) 2020-09-09
JP6828766B2 (ja) 2021-02-10
WO2017104717A1 (ja) 2017-06-22
JP2019148825A (ja) 2019-09-05
KR102641407B1 (ko) 2024-02-28
CN109478018A (zh) 2019-03-15
TW201730689A (zh) 2017-09-01

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