CN109461675B - Cleaning equipment for detecting position abnormality of silicon wafer and cleaning method thereof - Google Patents
Cleaning equipment for detecting position abnormality of silicon wafer and cleaning method thereof Download PDFInfo
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- CN109461675B CN109461675B CN201811216553.5A CN201811216553A CN109461675B CN 109461675 B CN109461675 B CN 109461675B CN 201811216553 A CN201811216553 A CN 201811216553A CN 109461675 B CN109461675 B CN 109461675B
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- silicon wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides cleaning equipment for detecting the position abnormality of a silicon wafer and a cleaning method thereof. In the cleaning equipment and the cleaning method for detecting the position abnormality of the silicon wafer, a certain adjustment can be provided for the position abnormality of the silicon wafer through the buffer structure arranged on the supporting part for supporting the silicon wafer in the cleaning process, the adaptability of the equipment is improved, and the torsion perpendicular to the surface of the silicon wafer is detected through the pressure sensor arranged on the supporting part, so that the position abnormality of the silicon wafer can be found in time, and the damage and the fragment of the silicon wafer are prevented.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to cleaning equipment for detecting position abnormality of a silicon wafer and a cleaning method thereof.
Background
In the field of semiconductor technology, with the continuous development of technology, the requirements for semiconductor devices are also higher and higher. For example, in the cleaning process after the CMP process, a brushing roller and a rolling shaft are used for cleaning a silicon wafer, the silicon wafer is clamped by two rollers of the brushing roller and is cleaned by reverse rotation, and the rolling shaft rotates the silicon wafer by same-direction rotation, so that the whole silicon wafer is continuously and circularly brushed to achieve the required cleaning effect.
However, in the cleaning process of the existing equipment, along with the increase of the service time of the equipment, the abrasion of parts and the like, the roller can cause the relative displacement difference of the silicon wafer in the transferring process, namely, a torque is generated on the silicon wafer, so that the silicon wafer can be damaged, and even fragments can be generated.
Therefore, the direction of efforts of those skilled in the art is how to solve the problem of silicon wafer position abnormality during the cleaning process.
Disclosure of Invention
The invention aims to provide a cleaning device for detecting position abnormality of a silicon wafer and a cleaning method thereof, so as to solve the problem of position abnormality of the silicon wafer in the cleaning process.
In order to solve the technical problem, the invention provides a cleaning device for detecting the position abnormality of a silicon wafer, which comprises a brushing roller and at least two rolling shafts positioned on one side of the brushing roller, wherein the brushing roller comprises two parallel rollers, the two rollers are used for clamping the silicon wafer and cleaning the silicon wafer through reverse rotation, a supporting part is arranged on each rolling shaft, the supporting part supports the silicon wafer and enables the silicon wafer to rotate through the same-direction rotation of the rolling shafts, the supporting part is provided with a pressure sensor and a buffer structure, the pressure sensor detects the torsion perpendicular to the surface of the silicon wafer, and the buffer structure supports the silicon wafer through telescopic adjustment.
Optionally, in the cleaning apparatus for detecting the position abnormality of the silicon wafer, the number of the pressure sensors is two, and the two pressure sensors are respectively disposed at two ends of the support portion.
Optionally, in the cleaning apparatus for detecting the position abnormality of the silicon wafer, the number of the buffer structures is two, and the two buffer structures are respectively disposed at two ends of the supporting portion.
Optionally, in the cleaning apparatus for detecting the position abnormality of the silicon wafer, the buffer structure includes a spring or rubber.
Optionally, in the cleaning apparatus for detecting the position abnormality of the silicon wafer, the support portion is narrow in the middle and wide at two ends.
The invention also provides a cleaning method for detecting the position abnormality of the silicon wafer, which comprises the following steps:
the silicon wafer is placed between two parallel rollers in a scrubbing roller and clamped, and the silicon wafer is supported by supporting parts respectively arranged on at least two rollers;
the two rollers clean the silicon wafer through reverse rotation, the silicon wafer is rotated through the same-direction rotation of the rollers, the supporting portion is provided with a pressure sensor and a buffer structure, the pressure sensor detects torsion perpendicular to the surface of the silicon wafer, and the buffer structure supports the silicon wafer through telescopic adjustment.
Optionally, in the cleaning method for detecting the position abnormality of the silicon wafer, the number of the pressure sensors is two, and the two pressure sensors are respectively arranged at two ends of the supporting portion.
Optionally, in the cleaning method for detecting the position abnormality of the silicon wafer, when the pressure sensor detects that the torque perpendicular to the surface of the silicon wafer is greater than a set value, an alarm is given.
Optionally, in the cleaning method for detecting the position abnormality of the silicon wafer, the number of the buffer structures is two, and the two buffer structures are respectively arranged at two ends of the supporting portion.
In summary, in the cleaning apparatus and the cleaning method for detecting the position abnormality of the silicon wafer according to the present invention, a buffer structure disposed on the supporting portion for supporting the wafer can be used to provide a certain adjustment for the position abnormality of the silicon wafer during the cleaning process, so as to improve the adaptability of the apparatus, and the pressure sensor disposed on the supporting portion can be used to detect the torsion perpendicular to the surface of the silicon wafer, so as to find the position abnormality of the silicon wafer in time, facilitate the handling of the abnormal condition, and prevent the silicon wafer from being damaged and broken.
Drawings
FIG. 1 is a top view of a cleaning apparatus for detecting positional abnormality of a silicon wafer according to an embodiment of the present invention;
FIG. 2 is a side view of a cleaning apparatus for detecting positional abnormality of a silicon wafer according to an embodiment of the present invention;
FIG. 3 is a flowchart of a cleaning method for detecting position abnormality of a silicon wafer according to an embodiment of the present invention.
Detailed Description
To make the objects, features and advantages of the present invention comprehensible, reference is made to the accompanying drawings. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.
As shown in fig. 1 and 2, the present invention provides a cleaning apparatus for detecting position abnormality of a silicon wafer, the cleaning apparatus for detecting position abnormality of a silicon wafer comprising:
a brushing roller 10, wherein the brushing roller 10 comprises two rollers 11 arranged in parallel, the two rollers 11 are used for clamping the silicon wafer 20 and cleaning the silicon wafer by rotating in opposite directions, and as shown in the figure, the two rollers 11 respectively clean two surfaces of the silicon wafer 20 in opposite rotating directions;
the silicon wafer cleaning device comprises at least two rolling shafts 30 positioned on one side of a scrubbing roller 10, wherein the rolling shafts 30 are provided with supporting parts 31, the supporting parts 31 support a silicon wafer 20 and enable the silicon wafer 20 to rotate through the same-direction rotation of the rolling shafts 30, the supporting parts 31 are provided with pressure sensors 311 and buffer structures 312, the pressure sensors 311 detect torsion perpendicular to the surface of the silicon wafer 20, and the buffer structures 312 support the silicon wafer 20 through telescopic adjustment, namely the torsion perpendicular to the surface of the silicon wafer is generated when the position of the silicon wafer is abnormal.
Correspondingly, as shown in fig. 3, the invention also provides a cleaning method for detecting the position abnormality of the silicon wafer, wherein the cleaning method for detecting the position abnormality of the silicon wafer comprises the following steps:
step S10, placing the silicon wafer between two parallel rollers in a brushing roller and clamping the silicon wafer, and supporting the silicon wafer through at least two supporting parts respectively arranged on the rollers positioned at one side of the brushing roller, namely realizing more than three supporting points of the silicon wafer through the brushing roller and the at least two rollers;
and S20, cleaning the silicon wafer by the two rollers through reverse rotation, enabling the silicon wafer to rotate by the same-direction rotation of the rollers, arranging a pressure sensor and a buffer structure on the supporting part, detecting the torsion perpendicular to the surface of the silicon wafer by the pressure sensor, brushing the silicon wafer by the buffer structure through telescopic adjustment and brushing the silicon wafer by the brushing rollers, and driving the silicon wafer to rotate through the rotation of the rollers to realize the circular brushing of the whole silicon wafer.
In a specific cleaning process, before cleaning, the two rollers are in a relatively separated state so as to put a silicon wafer in, the silicon wafer can be correspondingly conveyed to a set position through other equipment such as a conveyor belt, of course, the silicon wafer can be directly placed between the two rollers, and the position is determined under the support of the two rollers, wherein large arrows in fig. 2 indicate the rotating or moving direction of each part, the two rollers brush the silicon wafer through reverse rotation during cleaning, the two rollers can rotate the silicon wafer through same-direction rotation so as to brush the whole silicon wafer, and the rotating directions and the position relations of the rollers and the rollers are relatively determined in a limited manner, so that no need to be given by way of example. It is understood that the beneficial effects of the present invention can be produced when the silicon wafer is placed horizontally or vertically, and the definition of "end" in the present invention can be relative to the silicon wafer, and specifically can be the supporting point or the contact point of the silicon wafer.
In order to better detect the torque force, the number of the pressure sensors 311 is two, the two pressure sensors 311 are respectively arranged at two ends of the supporting portion 31, and the two pressure sensors 311 can respectively detect the stress conditions of two sides of the silicon wafer 20, so as to better detect the position abnormality of the silicon wafer 20, and the pressure sensors 311 are arranged at two ends of the supporting portion, that is, the stress conditions of two sides of the silicon wafer 20 are correspondingly detected.
In order to improve the adaptability of the cleaning equipment and the cleaning method, the number of the buffer structures 312 is two, the two buffer structures 312 are respectively arranged at two ends of the supporting part 31, and the supporting part 31 is made of rigid material in the prior art, but the buffer structures 312 are arranged at the supporting part 31, particularly the buffer structures 312 are arranged at two ends of the supporting part 31, so that the adjustment of the torsion force vertical to the surface of the silicon wafer 20 is provided when the supporting part 31 supports the silicon wafer 20, namely the torsion force can be buffered through the expansion and contraction of the buffer structures 312, and the silicon wafer 20 is effectively prevented from being damaged and broken. It can be understood that, the force direction of the buffer structure is perpendicular to the silicon wafer surface, and the support force direction of the support part is parallel to the silicon wafer.
In the cleaning apparatus for detecting the position abnormality of the silicon wafer in this embodiment, the buffer structure 312 includes a spring or rubber, and the spring or rubber can be stressed by a certain deformation, so as to achieve a buffer effect on the torsion on the silicon wafer.
In the cleaning apparatus for detecting the position abnormality of the silicon wafer in the embodiment, the supporting portion 31 is in a shape that the middle is narrow and the two ends are wide, as shown in the drawing, the top ends of the two cones are spliced together, the middle narrow portion mainly supports the wafer, and the two ends wide portion can better provide stress support for the pressure sensor and the buffer structure, that is, the torsion of the silicon wafer can be mainly applied to the two ends wide portion, and the position abnormality of the silicon wafer can be guided or directly observed before the cleaning starts.
In the cleaning method for detecting the position abnormality of the silicon wafer in the embodiment, when the pressure sensor detects that the torque force perpendicular to the surface of the silicon wafer is larger than a set value, an alarm is given, and the set value needs to be determined according to specifications such as the size, thickness and the like of the wafer, so that problems are found in time, the silicon wafer is prevented from being damaged or broken, and the like, that is, the silicon wafer can be monitored in real time in the cleaning process.
In summary, in the cleaning apparatus and the cleaning method for detecting the position abnormality of the silicon wafer according to the present invention, a buffer structure disposed on the supporting portion for supporting the wafer can be used to provide a certain adjustment for the position abnormality of the silicon wafer during the cleaning process, so as to improve the adaptability of the apparatus, and the pressure sensor disposed on the supporting portion can be used to detect the torsion perpendicular to the surface of the silicon wafer, so as to find the position abnormality of the silicon wafer in time, facilitate the handling of the abnormal condition, and prevent the silicon wafer from being damaged and broken.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (7)
1. A cleaning device for detecting the position abnormality of a silicon wafer is characterized by comprising: the cleaning device comprises a cleaning roller and a cleaning roller, wherein the cleaning roller comprises two rollers which are arranged in parallel, and the two rollers are used for clamping a silicon wafer and cleaning the silicon wafer through reverse rotation;
the silicon wafer cleaning device comprises at least two rolling shafts located on one side of a scrubbing roller, supporting portions are arranged on the rolling shafts and used for supporting a silicon wafer and enabling the silicon wafer to rotate through the same-direction rotation of the rolling shafts, pressure sensors and buffer structures are arranged on the supporting portions, the pressure sensors detect torsion perpendicular to the surface of the silicon wafer, the buffer structures are used for supporting the silicon wafer through telescopic adjustment, the number of the buffer structures is two, and the buffer structures are arranged at two ends of the supporting portions respectively.
2. The cleaning apparatus for detecting the position abnormality of the silicon wafer according to claim 1, wherein the number of the pressure sensors is two, and the two pressure sensors are respectively provided at both ends of the supporting portion.
3. The cleaning device for detecting the position abnormality of the silicon wafer according to claim 1 or 2, wherein the buffer structure comprises a spring or rubber.
4. The cleaning apparatus for detecting the position abnormality of the silicon wafer according to claim 1 or 2, wherein the support portion is shaped to be narrow in the middle and wide at both ends.
5. A cleaning method for detecting position abnormality of a silicon wafer is characterized by comprising the following steps: the method comprises the following steps of placing a silicon wafer between two parallel rollers in a brushing roller and clamping the silicon wafer, and supporting the silicon wafer through at least two supporting parts respectively arranged on the rollers positioned on one side of the brushing roller;
the silicon wafer cleaning device comprises two rollers, wherein the rollers rotate reversely to clean a silicon wafer, the rollers rotate in the same direction to enable the silicon wafer to rotate, the supporting part is provided with a pressure sensor and two buffering structures, the pressure sensor detects torsion perpendicular to the surface of the silicon wafer, and the buffering structures are used for supporting the silicon wafer through telescopic adjustment.
6. The cleaning method for detecting the position abnormality of the silicon wafer according to claim 5, wherein the number of the pressure sensors is two, and the two pressure sensors are respectively disposed at both ends of the supporting portion.
7. A cleaning method for detecting the position abnormality of a silicon wafer according to claim 5 or 6, characterized in that an alarm is issued when the pressure sensor detects that the torque force perpendicular to the surface of the silicon wafer is larger than a set value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811216553.5A CN109461675B (en) | 2018-10-18 | 2018-10-18 | Cleaning equipment for detecting position abnormality of silicon wafer and cleaning method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811216553.5A CN109461675B (en) | 2018-10-18 | 2018-10-18 | Cleaning equipment for detecting position abnormality of silicon wafer and cleaning method thereof |
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| CN109461675A CN109461675A (en) | 2019-03-12 |
| CN109461675B true CN109461675B (en) | 2020-10-16 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110544644B (en) * | 2019-09-12 | 2020-04-07 | 深圳市联润丰电子科技有限公司 | Semi-packaged stacked wafer detection and classification device |
| CN111146116B (en) * | 2019-11-28 | 2020-12-29 | 华海清科股份有限公司 | Wafer cleaning method and wafer post-processing device |
| CN115458471A (en) * | 2022-08-31 | 2022-12-09 | 北京北方华创微电子装备有限公司 | Chuck device and method for monitoring wafer state |
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| JPH11625A (en) * | 1997-06-13 | 1999-01-06 | Mitsubishi Materials Corp | Apparatus for washing wafer |
| CN203484361U (en) * | 2013-09-09 | 2014-03-19 | 中芯国际集成电路制造(北京)有限公司 | Device of adjusting cleaning brush pressure |
| CN103801536A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Wafer cleaning device |
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| US6119294A (en) * | 1999-01-14 | 2000-09-19 | United Microelectronics Corp. | Cleaning system with automatically controlled brush pressure |
| US6986185B2 (en) * | 2001-10-30 | 2006-01-17 | Applied Materials Inc. | Methods and apparatus for determining scrubber brush pressure |
| JP4719051B2 (en) * | 2006-03-30 | 2011-07-06 | ソニー株式会社 | Substrate processing apparatus and substrate processing method |
| CN201815947U (en) * | 2010-09-30 | 2011-05-04 | 上海华虹Nec电子有限公司 | Silicon chip rotating speed detection device and silicon chip cleaning device provided with silicon chip rotating speed detection device |
| CN104174601B (en) * | 2014-07-23 | 2016-03-09 | 上海华虹宏力半导体制造有限公司 | The brushing device of semiconductor crystal wafer and scrub methods |
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2018
- 2018-10-18 CN CN201811216553.5A patent/CN109461675B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11625A (en) * | 1997-06-13 | 1999-01-06 | Mitsubishi Materials Corp | Apparatus for washing wafer |
| CN103801536A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Wafer cleaning device |
| CN203484361U (en) * | 2013-09-09 | 2014-03-19 | 中芯国际集成电路制造(北京)有限公司 | Device of adjusting cleaning brush pressure |
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