CN109461675A - Detect the cleaning equipment and its cleaning method of position of silicon wafer exception - Google Patents
Detect the cleaning equipment and its cleaning method of position of silicon wafer exception Download PDFInfo
- Publication number
- CN109461675A CN109461675A CN201811216553.5A CN201811216553A CN109461675A CN 109461675 A CN109461675 A CN 109461675A CN 201811216553 A CN201811216553 A CN 201811216553A CN 109461675 A CN109461675 A CN 109461675A
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- CN
- China
- Prior art keywords
- silicon wafer
- support portion
- exception
- cleaning
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Abstract
The present invention provides a kind of cleaning equipments and its cleaning method for detecting position of silicon wafer exception, cleaning equipment includes scrubbing roller and at least two roller bearings positioned at the scrub roller side, support portion is provided on the roller bearing, the support portion provides for silicon wafer to be supported and rotates silicon wafer by rotating in same direction for roller bearing, support portion is provided with pressure sensor and buffer structure, pressure sensor detects the torsion perpendicular to silicon chip surface, and buffer structure passes through support of the telescopic adjustment to silicon wafer.In the cleaning equipment and its cleaning method of detection position of silicon wafer exception provided by the invention, in the process of cleaning can on the support portion by supporting chip the buffer structure that is arranged for providing certain adjusting when position of silicon wafer exception, improve the adaptability of equipment, the torsion perpendicular to silicon chip surface is also detected by the pressure sensor being arranged on support portion, so as to find position of silicon wafer exception in time, silicon wafer damage and the generation of fragment are prevented.
Description
Technical field
The present invention relates to technical field of semiconductors, in particular to a kind of cleaning equipment for detecting position of silicon wafer exception and its clearly
Washing method.
Background technique
In technical field of semiconductors, with the continuous development of technology, the requirement for semiconductor devices is also higher and higher.
It is directed to multiple tracks cleaning process, such as in clean cleaning after the cmp process, scrub roller and roller bearing can be used to silicon
Piece is cleaned, and two rollers by scrubbing roller are clamped silicon wafer and cleaned by rotating backward, and roller bearing passes through together
Make silicon wafer rotation to rotation to realize that full wafer silicon wafer constantly recycles brush clearly, reaches required cleaning effect.
However existing equipment, as equipment is using the increase and the abrasion of component etc. of time, is rolled in wash clean process
Axis may make silicon wafer generation relative displacement poor in transport process, i.e., generate a torque to silicon wafer, may cause silicon wafer damage
Wound, or even fragment can occur.
Therefore, how to solve the problems, such as that position of silicon wafer exception occurs in the process of cleaning in silicon wafer is that those skilled in the art exert
The direction of power.
Summary of the invention
The purpose of the present invention is to provide a kind of cleaning equipments and its cleaning method for detecting position of silicon wafer exception, to solve
The problem of silicon wafer appearance position exception in the process of cleaning.
In order to solve the above technical problems, the present invention provides a kind of cleaning equipment for detecting position of silicon wafer exception, the detection
The cleaning equipment of position of silicon wafer exception includes scrubbing roller and at least two roller bearings positioned at the scrub roller side, the brush
Washing roller includes two rollers disposed in parallel, and two rollers are cleaned for clamping silicon wafer and passing through to rotate backward,
Support portion is provided on the roller bearing, the support portion provides for silicon wafer to be supported and make silicon wafer by rotating in same direction for the roller bearing
Rotation, the support portion are provided with pressure sensor and buffer structure, and the pressure sensor detection is perpendicular to silicon chip surface
Torsion, the buffer structure pass through support of the telescopic adjustment to silicon wafer.
Optionally, in the cleaning equipment of the detection position of silicon wafer exception, the quantity of the pressure sensor is two,
Two pressure sensors are separately positioned on the both ends of the support portion.
Optionally, in the cleaning equipment of detection position of silicon wafer exception, the quantity of the buffer structure is two, two
A buffer structure is separately positioned on the both ends of the support portion.
Optionally, in the cleaning equipment of the detection position of silicon wafer exception, the buffer structure includes spring or rubber.
Optionally, in the cleaning equipment of the detection position of silicon wafer exception, the shape of the support portion is intermediate narrow by two
End is wide.
The present invention also provides a kind of cleaning method for detecting position of silicon wafer exception, the cleaning of the detection position of silicon wafer exception
Method includes:
Silicon wafer is placed in scrub roller between two rollers disposed in parallel and clamps silicon wafer, also passes through at least two
The support portion that roller bearing is respectively arranged is supported silicon wafer；
Two rollers rotate silicon wafer by rotating backward cleaning silicon chip, rotating in same direction for the roller bearing, the branch
Support part is provided with pressure sensor and buffer structure, and the pressure sensor detects the torsion perpendicular to silicon chip surface, described slow
It rushes structure and passes through support of the telescopic adjustment to silicon wafer.
Optionally, in the cleaning method of the detection position of silicon wafer exception, the quantity of the pressure sensor is two,
Two pressure sensors are separately positioned on the both ends of the support portion.
Optionally, in the cleaning method of the detection position of silicon wafer exception, when the pressure sensor detects vertically
When the torsion of silicon chip surface is greater than the set value, sound an alarm.
Optionally, in the cleaning method of detection position of silicon wafer exception, the quantity of the buffer structure is two, two
A buffer structure is separately positioned on the both ends of the support portion.
In conclusion in the cleaning equipment and its cleaning method of detection position of silicon wafer exception provided by the invention, clear
During washing can on the support portion by supporting chip the buffer structure that is arranged for providing certain tune when position of silicon wafer exception
Section improves the adaptability of equipment, also detects the torsion perpendicular to silicon chip surface by the pressure sensor being arranged on support portion, from
And position of silicon wafer exception can be found in time, convenient for the processing to abnormal conditions, prevent silicon wafer damage and the generation of fragment.
Detailed description of the invention
Fig. 1 is the top view of the cleaning equipment of the detection position of silicon wafer exception of the embodiment of the present invention；
Fig. 2 is the side view of the cleaning equipment of the detection position of silicon wafer exception of the embodiment of the present invention；
Fig. 3 is the flow chart of the cleaning method of the detection position of silicon wafer exception of the embodiment of the present invention.
Specific embodiment
In order to keep objects, features and advantages of the present invention more obvious and easy to understand, attached drawing is please referred to.It should be clear that this explanation
Book structure depicted in this specification institute accompanying drawings, ratio, size etc., only to cooperate the revealed content of specification, for being familiar with this
The personage of technology understands and reads, and is not intended to limit the invention enforceable qualifications, therefore does not have technical essence meaning
Justice, the modification of any structure, the change of proportionate relationship or the adjustment of size are not influencing the effect of present invention can be generated and institute
Under the purpose that can reach, should all still it fall in the range of disclosed technology contents obtain and can cover.
As depicted in figs. 1 and 2, the present invention provides a kind of cleaning equipment for detecting position of silicon wafer exception, the detection silicon wafer
The cleaning equipment of malposition includes:
Roller 10 is scrubbed, the scrub roller 10 includes two rollers 11 disposed in parallel, and two rollers 11 are used for
It clamps silicon wafer 20 and is cleaned by rotating backward, two rollers 11 as shown in the figure are along opposite rotation direction respectively to silicon
The two sides of piece 20 is cleaned；
Positioned at least two roller bearings 30 for scrubbing 10 side of roller, support portion 31, institute are provided on the roller bearing 30
Stating support portion 31 is that silicon wafer 20 provides support and rotates silicon wafer 20 by rotating in same direction for the roller bearing 30, the support portion 31
It is provided with pressure sensor 311 and buffer structure 312, the pressure sensor 311 detects the torsion perpendicular to 20 surface of silicon wafer,
The buffer structure 312 is by support of the telescopic adjustment to silicon wafer 20, that is, can generate when malposition occurs for silicon wafer vertical
Directly in the torsion on its surface.
It is corresponding, as shown in figure 3, the present invention also provides a kind of cleaning method for detecting position of silicon wafer exception, it is described
Detection position of silicon wafer exception washing methods include:
Step S10, silicon wafer is placed in scrub roller between two rollers disposed in parallel and clamps silicon wafer, also passed through
The support portion that at least two roller bearings for being located at the scrub roller side are respectively arranged is supported silicon wafer, that is, passes through scrub roller
Three or more the supporting points to silicon wafer are realized at least two roller bearings；
Step S20, two rollers turn silicon wafer by rotating backward cleaning silicon chip, rotating in same direction for the roller bearing
Dynamic, the support portion is provided with pressure sensor and buffer structure, torsion of the pressure sensor detection perpendicular to silicon chip surface
Power, the buffer structure scrub silicon wafer by scrubbing roller, pass through roller by support of the telescopic adjustment to silicon wafer
Rotation drives silicon wafer rotation to realize and scrubs to the circulation of full wafer silicon wafer.
In specific cleaning process, before cleaning starts, two rollers are in state that relative separation is opened so that silicon wafer is put
Enter, silicon wafer can also be directly placed by silicon wafer certainly by that can be transported to setting position by other equipment correspondences such as conveyer belt
Between two rollers, and under the support of two roller bearings determine position, wherein the big arrow in Fig. 2 show each section rotation or
Mobile direction, when being cleaned, two rollers scrub silicon wafer by rotating backward, and two roller bearings by turning in the same direction
Dynamic to make silicon wafer rotation to scrub full wafer silicon wafer, the rotation direction and positional relationship of roller and roller bearing are that relatively determining have
It limits several, this is not needed to illustrate one by one.Two kinds of feelings are horizontally arranged or are disposed vertically it is understood that usually having for silicon wafer
Condition does not influence implementation of the invention, can produce beneficial effects of the present invention, all may be used in the present invention for the definition at " end "
To be the concretely supporting point of silicon wafer or contact point relative to silicon wafer.
In order to preferably detect torsion, the quantity of the pressure sensor 311 is two, two pressure sensors
311 are separately positioned on the both ends of the support portion 31, by two pressure sensors 311 can detect respectively 20 two sides of silicon wafer by
Power situation, to preferably detect 20 malposition of silicon wafer, the both ends that support portion is arranged in pressure sensor 311 are namely corresponding
Detect the stress on 20 two sides of silicon wafer.
In order to improve the adaptability of cleaning equipment and cleaning method, the quantity of the buffer structure 312 is two, two institutes
The both ends that buffer structure 312 is separately positioned on the support portion 31 are stated, in the prior art for the support of silicon wafer using rigid material
Material, and buffer structure is especially arranged at 31 both ends of support portion by the way that buffer structure 312 is arranged in support portion 31 in the present invention
312, the adjusting perpendicular to 20 surface torsion of silicon wafer is provided in supporting silicon chip 20 for support portion 31, can pass through buffer structure
312 flexible buffers torsion, to effectively prevent silicon wafer 20 from damage and fragment occurs.It is understood that wherein buffering
The Impact direction of the setting of structure is the direction perpendicular to silicon chip surface, and the direction of the support stress of support portion is parallel to silicon wafer
's.
In the cleaning equipment of the detection position of silicon wafer exception of the present embodiment, the buffer structure 312 includes spring or rubber
Glue, spring or rubber can by certain deformation come stress, to realize the buffer function to torsion on silicon wafer, certainly its
Its similar material or structure can reach the purpose of the present invention, not make exhaustion herein.
In the cleaning equipment of the detection position of silicon wafer exception of the present embodiment, the shape of the support portion 31 is intermediate narrow by two
End is wide, is stitched together as shown in the drawing similar to the top of two cones, and intermediate narrow part mainly supports wafer, and
The wide part in both ends preferably can provide stress support for pressure sensor and buffer structure, i.e., the torsion of silicon wafer can mainly be made
Use the wide part in both ends, and can be with correcting position of silicon wafer before cleaning starts or whether observe directly position of silicon wafer different
Often.
The present embodiment detection position of silicon wafer exception cleaning method in, when the pressure sensor detect perpendicular to
It when the torsion of silicon chip surface is greater than the set value, sounds an alarm, setting value needs the size according to wafer, thickness equal-specification come really
It is fixed, to find the problem in time, prevent silicon wafer from occurring damaging or fragment etc., that is, can realize in real time in the process of cleaning
Monitoring to silicon wafer.
In conclusion in the cleaning equipment and its cleaning method of detection position of silicon wafer exception provided by the invention, clear
During washing can on the support portion by supporting chip the buffer structure that is arranged for providing certain tune when position of silicon wafer exception
Section improves the adaptability of equipment, also detects the torsion perpendicular to silicon chip surface by the pressure sensor being arranged on support portion, from
And position of silicon wafer exception can be found in time, convenient for the processing to abnormal conditions, prevent silicon wafer damage and the generation of fragment.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Range.
Claims (9)
1. a kind of cleaning equipment for detecting position of silicon wafer exception, which is characterized in that the cleaning of the detection position of silicon wafer exception is set
It is standby to include:
Roller is scrubbed, the scrub roller includes two rollers disposed in parallel, and two rollers are for clamping silicon wafer and leading to
It crosses to rotate backward and be cleaned；
Positioned at least two roller bearings for scrubbing roller side, support portion is provided on the roller bearing, the support portion is silicon
Piece, which provides, to be supported and rotates silicon wafer by rotating in same direction for the roller bearing, and the support portion is provided with pressure sensor and buffering
Structure, the pressure sensor detection is perpendicular to the torsion of silicon chip surface, and the buffer structure is by telescopic adjustment to silicon wafer
Support.
2. detecting the cleaning equipment of position of silicon wafer exception according to claim 1, which is characterized in that the pressure sensor
Quantity is two, and two pressure sensors are separately positioned on the both ends of the support portion.
3. the cleaning equipment of detection position of silicon wafer exception according to claim 1 or claim 2, which is characterized in that the buffer structure
Quantity be two, two buffer structures are separately positioned on the both ends of the support portion.
4. the cleaning equipment of detection position of silicon wafer exception according to claim 1 or claim 2, which is characterized in that the buffer structure
Including spring or rubber.
5. the cleaning equipment of detection position of silicon wafer exception according to claim 1 or claim 2, which is characterized in that the support portion
Shape is that intermediate narrow both ends are wide.
6. a kind of cleaning method for detecting position of silicon wafer exception, which is characterized in that the cleaning side of the detection position of silicon wafer exception
Method includes:
Silicon wafer is placed in scrub roller between two rollers disposed in parallel and clamps silicon wafer, is also located at by least two
The support portion that the roller bearing of the scrub roller side is respectively arranged is supported silicon wafer；
Two rollers rotate silicon wafer by rotating backward cleaning silicon chip, rotating in same direction for the roller bearing, the support portion
It is provided with pressure sensor and buffer structure, torsion of the pressure sensor detection perpendicular to silicon chip surface, the buffering knot
Structure passes through support of the telescopic adjustment to silicon wafer.
7. detecting the cleaning method of position of silicon wafer exception according to claim 6, which is characterized in that the pressure sensor
Quantity is two, and two pressure sensors are separately positioned on the both ends of the support portion.
8. detecting the cleaning method of position of silicon wafer exception described according to claim 6 or 7, which is characterized in that when the pressure passes
When sensor detects that the torsion perpendicular to silicon chip surface is greater than the set value, sound an alarm.
9. detecting the cleaning method of position of silicon wafer exception described according to claim 6 or 7, which is characterized in that the buffer structure
Quantity be two, two buffer structures are separately positioned on the both ends of the support portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811216553.5A CN109461675B (en) | 2018-10-18 | 2018-10-18 | Cleaning equipment for detecting position abnormality of silicon wafer and cleaning method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811216553.5A CN109461675B (en) | 2018-10-18 | 2018-10-18 | Cleaning equipment for detecting position abnormality of silicon wafer and cleaning method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109461675A true CN109461675A (en) | 2019-03-12 |
| CN109461675B CN109461675B (en) | 2020-10-16 |
Family
ID=65607925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811216553.5A Active CN109461675B (en) | 2018-10-18 | 2018-10-18 | Cleaning equipment for detecting position abnormality of silicon wafer and cleaning method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109461675B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110544644A (en) * | 2019-09-12 | 2019-12-06 | 深圳市联润丰电子科技有限公司 | semi-packaged stacked wafer detection and classification device |
| CN111146116A (en) * | 2019-11-28 | 2020-05-12 | 华海清科股份有限公司 | Wafer cleaning method and wafer post-processing device |
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| JPH11625A (en) * | 1997-06-13 | 1999-01-06 | Mitsubishi Materials Corp | Apparatus for washing wafer |
| US6119294A (en) * | 1999-01-14 | 2000-09-19 | United Microelectronics Corp. | Cleaning system with automatically controlled brush pressure |
| US20070221249A1 (en) * | 2001-10-30 | 2007-09-27 | Applied Materials, Inc. | Methods and apparatus for determining scrubber brush pressure |
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| CN104174601A (en) * | 2014-07-23 | 2014-12-03 | 上海华虹宏力半导体制造有限公司 | Device and method for scrubbing semiconductor wafer |
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2018
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|---|---|---|---|---|
| JPH11625A (en) * | 1997-06-13 | 1999-01-06 | Mitsubishi Materials Corp | Apparatus for washing wafer |
| US6119294A (en) * | 1999-01-14 | 2000-09-19 | United Microelectronics Corp. | Cleaning system with automatically controlled brush pressure |
| US20070221249A1 (en) * | 2001-10-30 | 2007-09-27 | Applied Materials, Inc. | Methods and apparatus for determining scrubber brush pressure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110544644A (en) * | 2019-09-12 | 2019-12-06 | 深圳市联润丰电子科技有限公司 | semi-packaged stacked wafer detection and classification device |
| CN111146116A (en) * | 2019-11-28 | 2020-05-12 | 华海清科股份有限公司 | Wafer cleaning method and wafer post-processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109461675B (en) | 2020-10-16 |
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