CN101045232A

CN101045232A - Substrate treatment apparatus and substrate treatment method

Info

Publication number: CN101045232A
Application number: CN 200710093622
Authority: CN
Inventors: 平冈伸康; 奥村刚; 仲野彰义; 宇贺神肇
Original assignee: Sony Corp; Dainippon Screen Manufacturing Co Ltd
Current assignee: Sony Corp; Dainippon Screen Manufacturing Co Ltd
Priority date: 2006-03-30
Filing date: 2007-03-30
Publication date: 2007-10-03
Anticipated expiration: 2027-03-30
Also published as: JP4719051B2; JP2007273610A; CN101045232B

Abstract

A substrate treatment method and substrate treatment apparatus including a substrate holding mechanism for holding a substrate; a first brush made of an elastically deformable material and having a cleaning surface inclined with respect to a perpendicular direction perpendicular to one surface of the substrate held by the substrate holding mechanism; a first brush moving mechanism for moving the first brush with respect to the substrate held by the substrate holding mechanism; a controller for controlling the first brush moving mechanism so that the cleaning surface is made to contact with a peripheral area on the one surface and a peripheral end face of the substrate held by the substrate holding mechanism; and a first pushing pressure holding mechanism for holding a pushing pressure of the first brush in the perpendicular direction to the peripheral area on the one surface of the substrate at a preset pushing pressure.

Description

Substrate board treatment and substrate processing method using same

Technical field

The present invention relates to be used for substrate is carried out the substrate board treatment and the substrate processing method using same of cleaning treatment.The substrate that becomes pending object for example comprises semiconductor wafer, base plate for liquid crystal display device, plasma display substrate, FED (Field Emission Display: field-emitter display) with substrate, CD substrate, disk substrate, optomagnetic base-board for plate, base board for optical mask etc.

Background technology

In the manufacturing process of semiconductor device, the pollution of semiconductor wafer periphery sometimes brings very important influence can for the processing quality of semiconductor wafer.

In so-called batch processed operation, many semiconductor wafers are immersed in the treatment fluid with the vertical posture.Therefore, if be attached with polluter on the periphery of semiconductor wafer, then this polluter is diffused in the treatment fluid, thereby once more on the nmosfet formation region attached to semiconductor wafer surface.

Therefore, recently, the cleaning requirement of the periphery of substrates such as semiconductor wafer is uprised.

As prior art about the cleaning base plate periphery, for example, can list the structure that in document 1 (TOHKEMY 2003-197592 communique), document 2 (TOHKEMY 2003-151943 communique) and document 3 (No. 6550091 specification of United States Patent (USP)), proposes.

Following structure is proposed: cleaning brush cylindraceous is set, and the peripheral end face of the outer peripheral face of cleaning brush and this substrate is offseted fetch the pollution of removing the substrate peripheral end face in document 1.

Following structure is proposed: in the structure identical with the structure of proposition in the document 1 in document 2, by making cleaning brush cylindraceous by making the substrate peripheral end face enter into the outer peripheral face of cleaning brush on the peripheral end face that is pressed in substrate, thereby be not subjected to the influence of substrate peripheral end face shape and the pollution that can remove the substrate peripheral end face better.And, also proposed on the outer peripheral face of cleaning brush to form the groove corresponding and the scheme that makes substrate peripheral end face and this groove tabling with substrate peripheral end face shape.

Following structure is proposed in document 3: on the outer peripheral face of cylindric cleaning brush, form can with the groove of the periphery tabling of substrate, under the periphery that makes substrate is entrenched in state in this groove, be rotated by making substrate rotation and making cleaning brush center on its central axis, thereby the surface of substrate and each neighboring area at the back side annular section of each given width in outer circumference end limit (on the surface of substrate and the back side from) and peripheral end face are cleaned.

In the structure that in

document

1,2, proposes, the pollution that can remove the substrate peripheral end face.But, because cleaning brush does not reach the surface of substrate and each neighboring area at the back side, so can not remove the pollution of these neighboring areas.

On the other hand, in the structure that in document 3, is proposed, surface that can cleaning base plate and each neighboring area at the back side.But, can not easily change the cleaning width (contact width of cleaning brush) in each neighboring area at the substrate surface and the back side.At this problem, can consider by changing the cleaning width that inlet that substrate periphery portion enters into the groove of cleaning brush changes each neighboring area at the substrate surface and the back side.But less if substrate periphery portion enters into the inlet of groove of cleaning brush, then cleaning brush does not reach the peripheral end face of substrate, thus peripheral end face that can not cleaning base plate.Therefore, can not adopt substrate periphery portion is entered into the method that the inlet of the groove of cleaning brush changes.Therefore, when changing the cleaning width of each neighboring area, cleaning brush must be replaced with the different cleaning brush of gash depth, so need expensive artificial.

Also have,, then on the part and reclinate part that substrate is bent upwards, be subjected to the pressing force that cleaning brush pushes and difference occurs if substrate occurs bending and deformation.Therefore, can predict and exist to take place clean inhomogeneous or the cleaning width inhomogeneous problem that waits other that becomes.

Summary of the invention

The objective of the invention is to, a kind of neighboring area of at least one side surface that can cleaning base plate and peripheral end face are provided and can easily change the substrate board treatment and the substrate processing method using same of the cleaning width in this neighboring area.

First substrate board treatment of the present invention comprises: substrate holding mechanism, and it keeps substrate; First cleaning brush, its adopt can strain material form, and have the cleaning surface that tilts with respect to the vertical line direction, wherein, this vertical line direction be with remain on described substrate holding mechanism on the vertical direction of a side surface of substrate; The first cleaning brush travel mechanism, it makes described first cleaning brush move with respect to the substrate that remains on the described substrate holding mechanism; Control part, it is used for by controlling this first cleaning brush travel mechanism, and described cleaning surface and the neighboring area and the peripheral end face that remain on a described side surface of the substrate on the described substrate holding mechanism are connected; First pushes maintaining body (33), and it remains predefined pressing force with described first cleaning brush to the pressing force of neighboring area on the vertical line direction of a described side surface of substrate.

In this structure, the neighboring area and the peripheral end face of a side surface of the cleaning surface of first cleaning brush and substrate connect.At this moment, because first effect of pushing maintaining body,, cleaning surface can both be remained predefined pressing force to the pressing force of the neighboring area of a side surface of substrate no matter whether substrate exists flexural deformation.That is, even substrate occurs bending and deformation, during the neighboring area and peripheral end face butt of a side surface of the cleaning surface of first cleaning brush and substrate, first cleaning brush is always with on the neighboring area of predefined pressing force by a side surface that is pressed in substrate.Therefore, in the neighboring area of a side surface of substrate, can not occur cleaning inhomogeneous or phenomenon such as cleaning width is inhomogeneous, and the neighboring area and the peripheral end face of a side surface of cleaning base plate well.And, make the virtual contact width of neighboring area of a side surface of cleaning surface and substrate by the pressing force that changes first cleaning brush, thereby can change the cleaning width in the neighboring area of a side surface of substrate easily.

In first substrate board treatment, can exist as cleaning surface: first cleaning surface, it has the shape that narrows down towards a side of described vertical line direction; Second cleaning surface, it has the shape that the described side from the described side end edge of this first cleaning surface towards described vertical line direction enlarges.At this moment, preferred described control part is controlled the described first cleaning brush travel mechanism, described first cleaning surface and the neighboring area and the peripheral end face that remain on a described side surface of the substrate on the described substrate holding mechanism are connected, and, described second cleaning surface and the neighboring area and the peripheral end face that remain on the opposite side surface of the substrate on the described substrate holding mechanism are connected, wherein said opposite side surface be on substrate with the surface of the opposite side of a described side surface.So and the neighboring area and the peripheral end face on two-sided (side surface and opposite side surface) that can cleaning base plate.

In addition, the pressing quantity of substrate is changed the virtual contact width of the neighboring area on second cleaning surface and substrate opposite side surface, thereby can change the cleaning width in the neighboring area on opposite side surface of substrate easily by changing second cleaning surface.

In first substrate board treatment, described first cleaning brush can form towards a side of described vertical line direction and the shape that front end attenuates.At this moment, preferred first substrate board treatment comprises: second cleaning brush, it adopts material that can strain and forms towards the side opposite with a described side of described vertical line direction and the shape that front end attenuates, and has the cleaning surface that tilts with respect to described vertical line direction; The second cleaning brush travel mechanism, it makes described second cleaning brush move with respect to the substrate that remains on the described substrate holding mechanism.And then, preferred described control part is also controlled the described second cleaning brush travel mechanism, the cleaning surface of described second cleaning brush is connected with the neighboring area and the peripheral end face that remain on the opposite side surface of the substrate on the described substrate holding mechanism, wherein, described opposite side surface is the surface in the opposite side of the above side surface of substrate.So and the neighboring area and the peripheral end face on opposite side surface that can cleaning base plate.In addition, by the cleaning carrying out simultaneously the neighboring area and the peripheral end face of one side surface of substrate being carried out and the cleaning the neighboring area and the peripheral end face on the opposite side surface of substrate carried out by second cleaning brush by first cleaning brush, thereby compare with the situation of carrying out these operations in different timings, at short notice the two-sided neighboring area and the peripheral end face of cleaning base plate.

Preferably, first substrate board treatment comprises that second pushes maintaining body, and this second is pushed maintaining body described second cleaning brush is remained predefined pressing force to the pressing force of neighboring area on described vertical line direction on the described opposite side surface of substrate.Because second effect of pushing maintaining body, no matter whether flexural deformation of substrate, second cleaning brush can both be remained predefined pressing force to the pressing force of the neighboring area on the opposite side surface of substrate.Promptly, during the neighboring area and peripheral end face butt on the opposite side surface of the cleaning surface of second cleaning brush and substrate, even substrate occurs bending and deformation, second cleaning brush is also always with on the neighboring area of predefined pressing force by the opposite side surface that is pressed in substrate.Therefore, in the neighboring area on the opposite side surface of substrate, can not occur cleaning inhomogeneous or phenomenon such as cleaning width is inhomogeneous, and the neighboring area and the peripheral end face on the opposite side surface of cleaning base plate well.

Second substrate board treatment of the present invention comprises: substrate holding mechanism, and it keeps substrate; First cleaning brush, it adopts material that can strain and forms towards a side of vertical line direction and the shape that front end attenuates, and has the cleaning surface that tilts with respect to described vertical line direction, wherein, this vertical line direction be with remain on described substrate holding mechanism on the vertical direction of substrate one side surface; The first cleaning brush travel mechanism, it makes described first cleaning brush move with respect to the substrate that remains on the described substrate holding mechanism; Second cleaning brush, it adopts material that can strain and forms towards a described vertical line direction side opposite with a described side and the shape that front end attenuates, and has the cleaning surface that tilts with respect to described vertical line direction; The second cleaning brush travel mechanism, it makes described second cleaning brush move with respect to the substrate that remains on the described substrate holding mechanism; Control part, it is used to control described first cleaning brush travel mechanism and the described second cleaning brush travel mechanism, the cleaning surface of described first cleaning brush is connected with the neighboring area and the peripheral end face that remain on a described side surface of the substrate on the described substrate holding mechanism, and the neighboring area and the peripheral end face on the opposite side surface of the cleaning surface of described second cleaning brush and this substrate are connected, wherein, this opposite side surface be on the substrate with the surface of the opposite side of a described side surface.

In this structure, the neighboring area and the peripheral end face of a side surface of the cleaning surface of first cleaning brush and substrate connect.In addition, the neighboring area and the peripheral end face on the opposite side surface of the cleaning surface of second cleaning brush and substrate connect.Thus, can the two-sided neighboring area and the peripheral end face of substrate be cleaned.

In addition, cleaning surface by changing first cleaning brush changes the virtual contact width of the cleaning surface of the neighboring area of substrate one side surface and first cleaning brush to the pressing quantity of substrate (elastic deformation amount of this cleaning surface when cleaning surface of first cleaning brush and substrate are connected), thereby can change the cleaning width in the neighboring area of a side surface of substrate easily.And then, cleaning surface by changing second cleaning brush changes the virtual contact width of the cleaning surface of the neighboring area on substrate opposite side surface and second cleaning brush to the pressing quantity of substrate (elastic deformation amount of this cleaning surface when cleaning surface of second cleaning brush and substrate are connected), thereby can change the cleaning width in the neighboring area on opposite side surface of substrate easily.

Preferably in second substrate board treatment, when the neighboring area of the cleaning surface that described control part makes described first cleaning brush and a described side surface that remains on the substrate on the described substrate holding mechanism and peripheral end face connect, the neighboring area and the peripheral end face on the described opposite side surface of the described second cleaning brush cleaning surface and this substrate are connected.So, the cleaning that can carry out the cleaning the neighboring area and the peripheral end face of one side surface of substrate carried out by first cleaning brush simultaneously and the neighboring area and the peripheral end face on the opposite side surface of substrate be carried out by second cleaning brush.Therefore, compare, can clean substrate two-sided neighboring area and peripheral end face at short notice with the situation of carrying out these cleanings in different timing.

In first and second substrate board treatment, described first cleaning brush can have the upwardly extending central axis in described vertical line side of centering on and rotational symmetric shape.At this moment, preferred described substrate board treatment includes the first cleaning brush rotating mechanism that described first cleaning brush is rotated around described central axis.Under the cleaning surface of first cleaning brush state by the neighboring area of a side surface that is pressed in substrate and peripheral end face, by making first cleaning brush rotation by the first cleaning brush rotating mechanism, and can clean the periphery area and the peripheral end face of a side surface of substrate.Therefore, the neighboring area and the peripheral end face of a side surface of cleaning base plate better.

In addition, preferred first and second substrate board treatment comprises the first cleaning brush relative moving mechanism, and this first cleaning brush relative moving mechanism makes the substrate and described first cleaning brush that remain on the described substrate holding mechanism relatively move in the mode that described first cleaning brush upwards moved in the week of this substrate.By relatively moving of first cleaning brush and substrate, and the neighboring area and the peripheral end face of a side surface of cleaning base plate effectively.

In first and second substrate board treatment, described second cleaning brush can have the upwardly extending central axis in described vertical line side of centering on and rotational symmetric shape.At this moment, preferred described first and second substrate board treatment comprises the second cleaning brush rotating mechanism that described second cleaning brush is rotated around described central axis.Under the neighboring area and state peripheral end face on of cleaning surface by the opposite side surface that is pressed in substrate of second cleaning brush, by making second cleaning brush rotation by the second cleaning brush rotating mechanism, and can clean the neighboring area and the peripheral end face on the opposite side surface of substrate.Therefore, the neighboring area and the peripheral end face on the opposite side surface of cleaning base plate better.

In addition, preferred first and second substrate board treatment includes the second cleaning brush relative moving mechanism, and this second cleaning brush makes the substrate and described second cleaning brush that remain on the described substrate holding mechanism relatively move in the mode that described second cleaning brush upwards moved in the week of this substrate relative to mechanism.By relatively moving of second cleaning brush and substrate, and the neighboring area and the peripheral end face on the opposite side surface of cleaning base plate effectively.

The 3rd substrate board treatment of the present invention comprises: substrate holding mechanism, and it keeps substrate; Cleaning brush, its adopt can strain material form, and have first cleaning surface and second cleaning surface, wherein, this first cleaning surface has the shape that the side to the vertical line direction narrows down, this second cleaning surface has the shape that enlarges to the described side of described vertical line direction from the described side end edge of this first cleaning surface, wherein this vertical line direction be with remain on described substrate holding mechanism on the vertical direction of substrate one side surface; Cleaning brush travel mechanism, it makes described cleaning brush and moves with respect to the substrate that remains on the described substrate holding mechanism; Control part, it is used to control this cleaning brush travel mechanism, described first cleaning surface and the neighboring area and the peripheral end face that remain on a described side surface of the substrate on the described substrate holding mechanism are connected, and, described second cleaning surface and the neighboring area and the peripheral end face that remain on the opposite side surface of the substrate on the described substrate holding mechanism are connected, wherein, described opposite side surface be on substrate with the surface of the opposite side of a described side surface.

In this structure, the neighboring area and the peripheral end face of first cleaning surface of cleaning brush and a side surface of substrate connect.In addition, the neighboring area and the peripheral end face on the opposite side surface of second cleaning surface of cleaning brush and substrate connect.Thus, can two-sided neighboring area and the peripheral end face of cleaning base plate.

In addition, to the pressing quantity (elastic deformation amount of first cleaning surface when making first cleaning surface and substrate butt) of substrate the neighboring area of substrate one side surface and the virtual contact width of first cleaning surface are changed by changing first cleaning surface, thereby can easily change the cleaning width of neighboring area of a side surface of substrate.And then, to the pressing quantity (elastic deformation amount of second cleaning surface when making second cleaning surface and substrate butt) of substrate the neighboring area on substrate opposite side surface and the virtual contact width of second cleaning surface are changed by changing second cleaning surface, thereby can easily change the cleaning width of neighboring area on the opposite side surface of substrate.

In the 3rd substrate board treatment, described cleaning brush can have the upwardly extending central axis in described vertical line side of centering on and rotational symmetric shape.At this moment, preferred described the 3rd substrate board treatment includes the cleaning brush rotating mechanism that described cleaning brush is rotated around described central axis.Under the neighboring area and state peripheral end face on of first cleaning surface by a side surface that is pressed in substrate of cleaning brush, by making cleaning brush rotation by the cleaning brush rotating mechanism, thereby can clean the neighboring area and the peripheral end face of a side surface of substrate.In addition, under the neighboring area and state peripheral end face on of second cleaning surface by the opposite side surface that is pressed in substrate of cleaning brush, by making cleaning brush rotation by the cleaning brush rotating mechanism, thereby can clean the neighboring area and the peripheral end face on the opposite side surface of substrate.Thus, two-sided neighboring area and the peripheral end face of cleaning base plate better.

Preferred the 3rd substrate board treatment includes relative moving mechanism, and this relative moving mechanism makes the substrate and the described cleaning brush that remain on the described substrate holding mechanism relatively move in the mode that described cleaning brush upwards moved in the week of this substrate.By relatively moving of cleaning brush and substrate, and two-sided neighboring area and the peripheral end face of cleaning base plate effectively.

In addition, preferably, first～the 3rd substrate board treatment includes the treatment fluid feed mechanism, this treatment fluid feed mechanism is supplied with treatment fluid to the treatment fluid supply area that remains on the substrate on the described substrate holding mechanism, and wherein this treatment fluid supply area is the zone more in the inner part, ratio neighboring area of a described at least side surface on the substrate.Including this treatment fluid in structure of mechanism, can rinse out the polluter in zone more in the inner part, ratio neighboring area of a side surface of substrate by treatment fluid.

First substrate processing method using same of the present invention comprises: substrate keeps operation, utilizes substrate holding mechanism that substrate is kept; One side butt operation, by first cleaning brush with the cleaning surface that tilts with respect to the vertical line direction is moved, and the cleaning surface of described first cleaning brush and the neighboring area and the peripheral end face that remain on a described side surface of the substrate on the described substrate holding mechanism are connected, wherein, this vertical line direction be with remain on described substrate holding mechanism on the vertical direction of a side surface of substrate; One side is pushed the maintenance operation, in this side butt operation, described first cleaning brush is remained predefined pressing force to the pressing force of neighboring area on described vertical line direction of a described side surface of substrate.

In a side butt operation, the neighboring area of a side surface of the cleaning surface of first cleaning brush and substrate and peripheral end face butt.At this moment, first cleaning brush remains predefined pressing force to the neighboring area pressing force in vertical direction of a side surface of substrate.That is, during the neighboring area and peripheral end face butt of a side surface of first cleaning surface and substrate, first cleaning brush is always with on the neighboring area of predefined pressing force by a side surface that is pressed in substrate.Therefore, in the neighboring area of a side surface of substrate, can not occur cleaning inhomogeneous or phenomenon such as cleaning width is inhomogeneous, and the neighboring area and the peripheral end face of a side surface of cleaning base plate well.And, change the virtual contact width of neighboring area of a side surface of cleaning surface and substrate by the pressing force that changes first cleaning brush, thereby can easily change the cleaning width of neighboring area of a side surface of substrate.

In first substrate processing method using same, as the cleaning surface of described first cleaning brush and when having first cleaning surface and second cleaning surface, a described side butt operation can be to make described first cleaning surface and the neighboring area of a described side surface that remains on the substrate on the described substrate holding mechanism and the operation that peripheral end face connects, wherein, this first cleaning surface forms towards a side of described vertical line direction and the shape that narrows down; This second cleaning surface forms the described side from the described side end edge of this first cleaning surface towards described vertical line direction and the shape that enlarges, at this moment, preferred first substrate processing method using same comprises opposite side butt operation (S5), this opposite side butt operation is to make described second cleaning surface and the neighboring area (14) on the opposite side surface that remains on the substrate on the described substrate holding mechanism and the operation that peripheral end face connects by first cleaning brush is moved, wherein, this opposite side surface is an opposite side with a described side surface on the substrate.In a side butt operation, the neighboring area and the peripheral end face of first cleaning surface of first cleaning brush and a side surface of substrate connect.In opposite side butt operation, the neighboring area and the peripheral end face on second cleaning surface of first cleaning brush and the opposite side surface of substrate connect.Thus, neighboring area and peripheral end face that can cleaning base plate two-sided (side surface and opposite side surface).

In first substrate processing method using same, form towards a side of described vertical line direction and during the shape that front end attenuates at described first cleaning brush, preferred described substrate processing method using same comprises: opposite side butt operation, by second cleaning brush is moved the cleaning surface of this second cleaning brush and the neighboring area and the peripheral end face that remain on the opposite side surface of the substrate on the described substrate holding mechanism are connected, wherein, this second cleaning brush forms a side opposite with a described side on the described vertical line direction and shape that front end attenuates, and have the cleaning surface that tilts with respect to described vertical line direction, and described opposite side surface be on the substrate with the surface of the opposite side of a described side surface; Opposite side is pushed the maintenance operation, in this opposite side butt operation, described second cleaning brush is remained predefined pressing force to the pressing force of the described vertical line direction of the neighboring area on the described opposite side surface of substrate.In opposite side butt operation, by second cleaning brush is remained predefined pressing force to the pressing force of the neighboring area on the opposite side surface of substrate, thereby no matter whether flexural deformation of substrate, the neighboring area and the peripheral end face on the opposite side surface of cleaning base plate well, and in the neighboring area on the opposite side surface of substrate, can not occur cleaning inhomogeneous or phenomenon such as cleaning width is inhomogeneous.Therefore, by carrying out a side butt operation and opposite side butt operation, and the neighboring area and the peripheral end face of cleaning base plate two-sided (side surface and opposite side surface) well.And, come this virtual contact width that changes the neighboring area on the second cleaning brush cleaning surface and substrate opposite side surface by the pressing force that changes second cleaning brush, thereby can change the cleaning width in the neighboring area on opposite side surface of substrate easily.

In addition, in first substrate processing method using same, a described side butt operation and described opposite side butt operation can be carried out simultaneously.At this moment, compare with the situation of carrying out these operations in different timing, at short notice two-sided neighboring area and the peripheral end face of cleaning base plate.

Second substrate processing method using same of the present invention comprises: substrate keeps operation, utilizes substrate holding mechanism that substrate is kept; One side butt operation, by the cleaning brush with first cleaning surface and second cleaning surface is moved described first cleaning surface and the neighboring area and the peripheral end face that remain on a side surface of the substrate on the described substrate holding mechanism are connected, wherein, this first cleaning surface has the shape that narrows down towards a side of vertical line direction, and this vertical line direction be with remain on described substrate holding mechanism on the vertical direction of a described side surface of substrate, this second cleaning surface has the shape that enlarges to a described side of described vertical line direction from the end limit of a described side of this first cleaning surface; Opposite side butt operation, by described cleaning brush is moved described second cleaning surface and the neighboring area and the peripheral end face that remain on the opposite side surface of the substrate on the described substrate holding mechanism are connected, wherein, this opposite side surface be on the substrate with the surface of the opposite side of a described side surface.

In a side butt operation, the neighboring area and the peripheral end face of first cleaning surface of cleaning brush and a side surface of substrate connect.In opposite side butt operation, the neighboring area and the peripheral end face on second cleaning surface of cleaning brush and the opposite side surface of substrate connect.Thus, can two-sided neighboring area and the peripheral end face of cleaning base plate.

In addition, to the pressing quantity of substrate the neighboring area of substrate one side surface and the virtual contact width of first cleaning surface are changed, thereby can easily change the cleaning width of neighboring area of a side surface of substrate by changing first cleaning surface.And then, to the pressing quantity of substrate the neighboring area on substrate opposite side surface and the virtual contact width of second cleaning surface are changed by changing second cleaning surface, thereby can easily change the cleaning width of neighboring area on the opposite side surface of substrate.

The 3rd substrate board treatment of the present invention comprises: substrate keeps operation, utilizes substrate holding mechanism that substrate is kept; One side butt operation, by first cleaning brush is moved the cleaning surface of described first cleaning brush and the neighboring area and the peripheral end face that remain on a side surface of the substrate on the described substrate holding mechanism are connected, wherein, this first cleaning brush forms towards a side of vertical line direction and the shape that front end attenuates, and have the cleaning surface that tilts with respect to described vertical line direction, and this vertical line direction be with remain on described substrate holding mechanism on the vertical direction of a side surface of substrate; Opposite side butt operation, carry out simultaneously with this side butt operation, by second cleaning brush is moved the cleaning surface of described second cleaning brush and the neighboring area and the peripheral end face that remain on the opposite side surface of the substrate on the described substrate holding mechanism are connected, wherein, described second cleaning brush forms a side opposite with a described side on the described vertical line direction and shape that front end attenuates, and have the cleaning surface that tilts with respect to described vertical line direction, and described opposite side surface be on the substrate with the surface of the opposite side of a described side surface.

In a side butt operation, the neighboring area and the peripheral end face of a side surface of the cleaning surface of first cleaning brush and substrate connect.In opposite side butt operation, the neighboring area and the peripheral end face on the opposite side surface of the cleaning surface of second cleaning brush and substrate connect.Thus, neighboring area and peripheral end face that can cleaning base plate two-sided (side surface and opposite side surface).

And, because a described side butt operation and described opposite side butt operation are carried out simultaneously, so can realize the cleaning the neighboring area and the peripheral end face of one side surface of substrate carried out by first cleaning brush and the cleaning of the neighboring area and the peripheral end face on the opposite side surface of substrate being carried out by second cleaning brush simultaneously.Therefore, compare with the situation of carrying out these operations in different timing, at short notice two-sided neighboring area and the peripheral end face of cleaning base plate.

In addition, cleaning surface by changing first cleaning brush changes the virtual contact width of the cleaning surface of the neighboring area of substrate one side surface and first cleaning brush to the pressing quantity of substrate (elastic deformation amount of this cleaning surface when making the cleaning surface of first cleaning brush and substrate butt), thereby can easily change the cleaning width of neighboring area of a side surface of substrate.On the other hand, cleaning surface by changing second cleaning brush changes the virtual contact width of the cleaning surface of the neighboring area on substrate opposite side surface and second cleaning brush to the pressing quantity of substrate (elastic deformation amount of this cleaning surface when making the cleaning surface of second cleaning brush and substrate butt), thereby can easily change the cleaning width of neighboring area on the opposite side surface of substrate.

The explanation of the following embodiment that is undertaken by the reference accompanying drawing, above-mentioned or other purpose feature of the present invention and effect become clearer and more definite.

Description of drawings

Fig. 1 is the vertical view of schematic configuration of the substrate board treatment of expression one embodiment of the present invention.

Fig. 2 is the side view that the inside to substrate board treatment shown in Figure 1 illustrates.

Fig. 3 is the cutaway view of the structure of expression cleaning brush and swing arm.

Fig. 4 is the block diagram that is used to illustrate the electrical structure of substrate board treatment shown in Figure 1.

Fig. 5 is the process chart that is used for illustrating the processing of substrate board treatment shown in Figure 1.

Fig. 6 is the side view of the state (second cleaning surface is connected to the state of substrate periphery portion) of cleaning brush during expression is handled.

Fig. 7 is the side view of the state (first cleaning surface is connected to the state of substrate periphery portion) of cleaning brush during expression is handled.

Fig. 8 is the vertical view of schematic configuration of the substrate board treatment of expression the present invention other embodiment.

Fig. 9 is the side view that the inside to substrate board treatment shown in Figure 8 illustrates.

Figure 10 is the cutaway view of the structure of expression first cleaning brush.

Figure 11 is the block diagram that is used to illustrate the electrical structure of substrate board treatment shown in Figure 8.

Figure 12 is the process chart that is used for illustrating the processing of substrate board treatment shown in Figure 8.

Figure 13 is the side view of the state of first cleaning brush and second cleaning brush during expression is handled.

Figure 14 is the result's of expression test a chart, and wherein this test is used to confirm the cleaning performance of the cleaning brush of different shape.

Figure 15 is the chart of the relation between the contact width (cleaning width) of the cleaning brush in the neighboring area of expression pressing force of cleaning brush and wafer surface.

The specific embodiment

Below, the embodiment that present invention will be described in detail with reference to the accompanying.

Fig. 1 is the vertical view of schematic configuration of the substrate board treatment of expression one embodiment of the present invention.In addition, Fig. 2 is the side view that the inside to substrate board treatment shown in Figure 1 illustrates.

This substrate board treatment 1 is individual type device of handling one by one as the semiconductor wafer W (being designated hereinafter simply as " wafer W ") of an example of substrate.Substrate board treatment 1 has in the process chamber of opening with the spaced walls zoning 2: rotary chuck 3, and it is used for wafer W being remained level of approximation and making the wafer W rotation; Surface nozzle 4, it is used for supplying with treatment fluid to wafer W surface (being formed with the surface of device one side); Back side nozzle 5, it is used for supplying with treatment fluid to the back side of wafer W; Cleaning brush mechanism 6, it is used for the periphery of clean wafers W.

Rotary chuck 3 is vacuum adsorption type chucks.This rotary chuck 3 has: rotating shaft 7, and it extends on the direction of approximate vertical; Absorptive table 8, it is installed on the upper end of this rotating shaft 7, and adsorbs the back side (lower surface) of wafer W and keep this wafer W with the posture of level of approximation; Rotation motor 9, it has and the rotating shaft 7 coaxial rotating shafts that combine.Thus, be adsorbed under the state that remains on the absorptive table 8 at the back side of wafer W, if rotation motor 9 drives, then wafer W is rotated around the central axis of rotating shaft 7.

On surface nozzle 4 and back side nozzle 5, be connected with treatment

fluid supply pipe

10,11 respectively.Treatment fluid from not shown treatment fluid supply source supplies to these treatment

fluid supply pipes

10,11 via treatment fluid valve 12.The treatment fluid that surface nozzle 4 will be supplied with via treatment fluid supply pipe 10 is to the central authorities' ejection that remains on the wafer W surface on the rotary chuck 3.In addition, the treatment fluid that will supply with via treatment fluid supply pipe 11 of back side nozzle 5 sprays between outer circumference end limit that remains on the wafer W back side on the rotary chuck 3 and absorptive table 8.

In addition, adopt pure water as treatment fluid.But be not limited in pure water,, also can adopt function water such as carbonated water, ionized water, Ozone Water, recycled water (hydrogeneous water) or magnetized drinking water as treatment fluid.In addition, as treatment fluid, also can adopt the soups such as mixed liquor of ammoniacal liquor or ammoniacal liquor and hydrogen peroxide.

Cleaning brush mechanism 6 has: cleaning brush 16, and its each neighboring area 13,14 (for example the outer circumference end limit width from wafer W is the annular section of 1～4mm) and peripheral end face 15 that is used for the wafer W surface and the back side cleans; Swing arm 17, it keeps this cleaning brush 16 at front end; Wobble drive mechanism 18, it makes this swing arm 17 swing along horizontal direction around being set in the outer vertical axis of wafer W rotating range; Lift drive mechanism 19, it makes swing arm 17 liftings.

In addition, the periphery of so-called wafer W is meant each neighboring

area

13,14 that comprises the wafer W surface and the back side and the part of peripheral end face 15.

Fig. 3 is the cutaway view of the structure of expression cleaning brush 16 and swing arm 17.

Cleaning brush remains on the brush holder 20.Brush holder 20 is installed on the brush holder installation portion 36 described later.Brush holder 20 has: approximate columned resin mass 21; Core 22, it is configured on the central axis of resin mass 21, and the upper end is inserted in the lower surface of resin mass 21 and is fixed; Plate (Plate) 23, it is installed on the lower end of this core 22.Be formed with threaded portion 24 on the upper surface of resin mass 21, this threaded portion 24 is processed with screw thread at outer peripheral face.In addition, be formed with screwed hole in the bottom of core 22.Be screwed in this screwed hole by bolt 25, and plate 23 is installed on the core 22 in mode removably run-through board 23 centers.

Cleaning brush 16 for example is made of PVA sponge materials such as (polyvinyl alcohol).Cleaning brush 16 outer being embedded on the core 22, and be clamped between resin mass 21 and the plate 23.Cleaning brush 16 forms around the rotational symmetric approximate drum type of vertical axis.Cleaning brush 16 has up and down integratedly: first cleaning part 26, and it is used for the neighboring area 13 and the peripheral end face 15 on clean wafers W surface; Second cleaning part 27, it is used for the neighboring area 14 and the peripheral end face 15 at the clean wafers W back side.

The top 26a of first cleaning part 26 forms the approximate circle tubular, and its underpart 26b forms the approximate circle frustum that narrows down downwards.The limit, upper end of 26b side, first cleaning part, 26 bottom is mutually continuous with the limit, lower end of 26a side, top, and the side of bottom 26b relatively its central axis have 45 degree inclinations angle, and tilt in mode more down the closer to central axis.In this first cleaning part 26, the side of bottom 26b constitutes first cleaning surface 28 that neighboring area 13 and peripheral end face 15 with the wafer W surface connect.

Second cleaning part 27 is connected on the lower end of first cleaning part 26 integratedly, and to dispose with the mode of first cleaning part, 26 total central axis.The top 27a of this second cleaning part 27 forms the approximate circle frustum that enlarges downwards, and its underpart 27b forms the approximate circle tubular.The limit, upper end of 27a side, second cleaning part, 27 top is mutually continuous with the limit, lower end of 26b side, first cleaning part, 26 bottom, and the side of top 27a relatively its central axis have 45 degree inclinations angle, and more down to tilt away from the mode of central axis more.In addition, the limit, lower end of top 27a side is mutually continuous with the limit, upper end of 27b side, bottom.In this second cleaning part 27, the side of top 27b constitutes second cleaning surface 29 that neighboring area 14 and peripheral end face 15 with the wafer W back side connect.

Swing arm 17 has: lower house 30; Upper shell 31, itself and this lower house 30 is entrenched togather; Cleaning brush free-wheeling system 32, it is configured in the inner space that is formed by lower house 30 and upper shell 31, is used to make cleaning brush 16 to be rotated (rotation) around the vertical axis; Push maintaining body 33, it is configured in the inner space that is formed by lower house 30 and upper shell 31, is used for the pressing force (pressure when cleaning brush 16 is pushed neighboring area 13) in 16 pairs of wafer W surface perimeter of cleaning brush zone 13 is remained predefined pressing force.

The upper end that on an end (base end part) of lower house 30, is connecting the arm back shaft 34 that on vertical, extends.The driving force of wobble drive mechanism 18 (with reference to Fig. 2) is imported into this arm back shaft 34.Being input to arm back shaft 34 by the driving force with wobble drive mechanism 18 arm back shaft 34 is back and forth rotated, is that fulcrum is swung thereby can make swing arm 17 with arm back shaft 34.In addition, on arm back shaft 34, be connected with lift drive mechanism 19 (with reference to Fig. 2).By lift drive mechanism 19 arm back shaft 34 is moved up and down, thereby swing arm 17 and this arm back shaft 34 are moved up and down integratedly.

Upward be provided with the rotating shaft 35 that on vertical, extends in the other end of lower house 30 (free end) in mode rotatable and moving up and down.Protrude downwards from the other end of lower house 30 lower end of this rotating shaft 35, near the central authorities on the vertical of its upper end arrival upper shell 31.

From the bottom that lower house 30 protrudes brush holder installation portion 36 is set at rotating shaft 35, brush holder 20 is installed on brush holder installation portion 36.This brush holder installation portion 36 has integratedly: the discoid face 37 of going up, and it is slotting logical that it is rotated axle 35, and be fixed on the rotating shaft 35; Side surface part 38 cylindraceous, its periphery of facial 37 on this extends downwards.On the inner peripheral surface of side surface part 38, be processed with screw thread.Be screwed by the screw thread that makes this screw thread and on the threaded portion 24 of brush holder 20, form, and brush holder 20 can be installed on the brush holder installation portion 36.

In addition, be embedded with outside on rotating shaft 35 lower guide roll supporting member 39, on guide rolls support member 40 and spring fastening member 41.

Separating between the outer peripheral face of lower guide roll supporting member 39 and rotating shaft 35 has small interval and is embedded in outward on the rotating shaft 35 with contactless state.This lower guide roll supporting member 39 has around the central axis of rotating shaft 35 and rotational symmetric shape.Lower guide roll supporting member 39 via two bearings 42 that are spaced from each other arranged spaced, but is supported on free rotation mode on the other end of lower house 30.In addition, the upper end of lower guide roll supporting member 39 forms littler cylindric of section diameter of comparing its below.On this upper end cylindraceous can not counterrotating mode to be embedded with the belt wheel described later 54 of cleaning brush free-wheeling system 32 outward.

Last guide rolls support member 40 is arranged on the top of lower guide roll supporting member 39.Upward be embedded in outside with contactless state on the rotating shaft 35 across small interval between the outer peripheral face of guide rolls support member 40 and rotating shaft 35.In addition, guide rolls support member 40 is connected with belt wheel 54 by bolt 43 on this.

Spring fastening member 41 is arranged on guide rolls support member 40 tops with last guide rolls support member 40 devices spaced apart, and is fixed on the rotating shaft 35.Fastening has an end (upper end) of helical spring 44 on this spring fastening member 41.Helical spring 44 is clipped between spring fastening member 41 and the last guide rolls support member 40.The other end of helical spring 44 (lower end) fastening is on last guide rolls support member 40.

In addition, supporting a pair of

deflector roll

45,46 respectively on lower guide roll supporting member 39 and the last guide rolls support member 40.Each

deflector roll

45,46 is so that upwardly extending axle is a fulcrum and can rotating freely in the side that intersects vertically with rotating shaft 35, and its outer peripheral face contacts with the outer peripheral face of rotating shaft 35.Thus, can guide moving up and down of rotating shaft 35 by each

deflector roll

45,46, and the resistance can alleviate it and move up and down the time.

On the other hand, the outer bearing 47 that is embedded with on the upper end of rotating shaft 35, the abutting member 48 of lid shape can counterrotating mode be arranged on the rotating shaft 35 with relative rotation axi 35 via this bearing 47.

In addition, seal by magnetic fluid seal circle 49 between the outer peripheral face of lower guide roll supporting member 39 and the lower house 30.In addition, seal by bellows 50 between the inner peripheral surface of lower guide roll supporting member 39 and the rotating shaft 35.Thus, prevent that the air that contains treatment fluid or cleaning fluid from invading in the inner space that is formed by lower house 30 and upper shell 31 at interval by these.In addition, prevent that the rubbish that produces is diffused into the inside of process chamber 2 in this inner space.

Cleaning brush free-wheeling system 32 has cleaning brush motor 52, and the mode that this cleaning brush motor 52 extends to the vertical below with its output shaft 51 is arranged in the upper shell 31 near on the position of base end part.In addition, cleaning brush free-wheeling system 32 has: belt wheel 53, and it is fixed on the output shaft 51 of cleaning brush motor 52; Belt wheel 54, its outer being embedded on the lower guide roll supporting member 39; Wheel is with 55, and it is wound on the outer peripheral face of belt wheel 53 and belt wheel 54.Thus, if drive cleaning brush motor 52, then be with 55 and be delivered on the belt wheel 54 via belt wheel 53 and wheel from the revolving force of cleaning brush motor 52.By this revolving force, lower guide roll supporting member 39 and last guide rolls support member 40 are with belt wheel 54 rotations.And helical spring 44 and spring fastening member 41 are accompanied by the rotation of guide rolls support member 40 and rotate.Consequently rotating shaft 35 rotations, thus the cleaning brush 16 that is installed on rotating shaft 35 lower ends rotates.

Push the cylinder 56 that maintaining body 33 has the abutting member of being disposed at 48 tops.This cylinder 56 makes bar 57 towards the below, and this bar 57 is advanced and retreat along vertical.More particularly, the approximate gripper shoe 58 that is the L word shape is extended upward from the bottom surface of lower house 30 when side-looking.The cylinder mounting plate 59 that above abutting member 48, extends in these gripper shoe 58 upper supports.Cylinder 56 is fixed on the upper surface of cylinder mounting plate 59.The bar 57 of cylinder 56 is inserted and is led in the bar inserting hole 60 that forms on cylinder mounting plate 59.The lower end of bar 57 and abutting member 48 connect.

The inside of cylinder 56 is divided into two spaces by the piston (not shown) that is fixed on bar 57 cardinal extremities on the advance and retreat direction (vertical) of bar 57.In the space of relative piston rod 57 sides, be connected with the first air supplying tubing 61, wherein, on this first air supplying tubing 61 proportional valve (not shown) be installed.On the other hand, relative piston by with the space of bar 57 opposite sides in be connected with the second air supplying tubing 63, wherein, on this second air supplying tubing 63, be equipped with and can change overflow valve (Relief Valve) 62 (with reference to Fig. 4) that release pressure is set.If improve the release pressure of overflow valve 62, then the air pressure of supplying with to cylinder 56 from the second air supplying tubing 63 rises, thereby bar 57 stretches out from cylinder 56.On the contrary, if reduce the release pressure of overflow valve 62, then the air pressure of supplying with to cylinder 56 from the second air supplying tubing 63 descends, thereby bar 57 is because of returning to the cylinder 56 to the air pressure of cylinder 56 supplies and the loading force of helical spring 44 from the first air supplying tubing 61.

In addition, the sensor installing plate 64 that extends to opposite sides in gripper shoe 58 upper supports with cylinder mounting plate 59.Strain gauge type pressure sensor 65 is installed on the upper surface of this sensor installing plate 64.

On the other hand, on abutting member 48, be fixed with pressing detection arm 66.This pressing detection is extended to the top of pressure sensor 65 from abutting member 48 with arm 66.In cleaning brush 16 and wafer W not under the state of contact, pressing detection contacts on pressure sensor 65 with the pressing force that rotating shaft 35 is pushed to the vertical below that produced by cylinder 56 (neighboring area 13 that is equivalent to 16 pairs of wafer W surfaces of cleaning brush to pressing force that vertical is pushed) with arm 66.Thus, pressure sensor 65 can detect the pressing force that rotating shaft 35 is pushed to the vertical below that is produced by cylinder 56.

Fig. 4 is the block diagram that is used to illustrate the electrical structure of substrate board treatment 1.

Substrate board treatment 1 has the control part 67 that comprises microcomputer.The detection signal of pressure sensor 65 is input in this control part 67.In addition, be connected with technical parameter enter key 68 on the control part 67, this technical parameter enter key 68 is used for importing processing technical parameter (Recipe) (being used to handle the various conditions of wafer W) by the user.And then, be connected with rotation motor 9, treatment fluid valve 12, wobble drive mechanism 18, lift drive mechanism 19, cleaning brush motor 52 and overflow valve 62 etc. on the control part 67 as the control object.

Fig. 5 is used for illustrating the process chart of handling wafer W at substrate board treatment 1.In addition, Fig. 6 and Fig. 7 are the side views of the state of cleaning brush 16 during the expression wafer W is handled.

Handle before the wafer W, by user's operating technology parameter enter key 68, the pressing force of the neighboring area 13 on 28 pairs of wafer W surfaces of first cleaning surface of input cleaning brush 16.According to input, set the release pressure (step S1: set pressing force) of overflow valve 62 by control part 67 from this technical parameter enter key 68.Specifically, in cleaning brush 16 and wafer W not under the state of contact, because pressing detection contacts with pressure sensor 65 with arm 66, so can detect the pressing force that rotating shaft 35 is pushed that produces by cylinder below vertical by pressure sensor 65.Control part 67 changes the release pressure of overflow valve 62, and to comparing by pressure sensor 65 detected pressing forces and the pressing force of importing from technical parameter enter key 68, in the moment of both unanimities, the release pressure when release pressure at this moment is set at the processing wafer W.

The wafer W of moving in the process chamber 2 remains on (step S2) on the rotary chuck 3.Then, control rotation motors 9, and make wafer W begin rotation (step 3) by rotary chuck 3 by control part 67.Then, open treatment fluid valve 12, and begin respectively to supply with treatment fluid (step 4) to the surface and the back side of wafer W from surface nozzle 4 and back side nozzle 5 by control part 67.

In addition, by control part 67 control cleaning brush motors 52, make cleaning brush 16 towards the direction rotation identical with the direction of rotation of wafer W.Then, by control part 67 control wobble drive mechanism 18 and lift drive mechanisms 19, and the neighboring area 14 at second cleaning surface 29 that makes cleaning brush 16 and the wafer W back side and peripheral end face 15 contact (step S5).Specifically, at first, control lift drive mechanism 19, and cleaning brush 16 is moved on the position with by the corresponding height of pressing quantity of technical parameter enter key 68 settings.Move by this, second cleaning surface 29 of cleaning brush 16 is opposed with the peripheral end face 15 of wafer W.Then, control wobble drive mechanism 18 makes swing arm 17 rotations, thereby cleaning brush 16 is moved horizontally.Move horizontally by this, the wafer W periphery enters into second cleaning surface 29 of cleaning brush 16, thereby as shown in Figure 6, second cleaning surface 29 of cleaning brush 16 is by on neighboring area 14 that is pressed in the wafer W back side and the peripheral end face 15.Thus, neighboring area 14 and the peripheral end face 15 to the wafer W back side cleans.

When second cleaning surface 29 of cleaning brush 16 passes through preset time afterwards with the wafer W butt,, make cleaning brush 16 rise to given height by control part 67 control lift drive mechanisms 19.By this rising, the periphery of wafer W enters into first cleaning surface 28 (step S6: with the first cleaning surface butt) of cleaning brush 16, thereby as shown in Figure 7, first cleaning surface 28 of cleaning brush 16 is by on neighboring area 13 that is pressed in the wafer W back side and the peripheral end face 15.Thus, neighboring area 13 and the peripheral end face 15 to the wafer W surface cleans.

At this moment, by pushing the effect of maintaining body 33, the certain pressing force of cleaning brush 16 to set by technical parameter key 68 is on the neighboring area 13 that is pressed in the wafer W surface.For example, when wafer W occured bending and deformation, if cleaning brush 16 contacts with the part that is bent upwards of wafer W, the power of then pushing cleaning brush 16 upward played a role.So, in the cylinder 56 relatively pistons by with the increased pressure in the space of bar 57 opposite sides, follow in this increased pressure in second air supplying tubing 63.If the pressure in the second air supplying tubing 63 is more than the release pressure of overflow valve 62, then discharges the air in the second air supplying tubing 63, and the pressure in the second air supplying tubing 63 is remained release pressure.Therefore, during the neighboring area 13 on first cleaning surface 28 of cleaning brush 16 and wafer W surface and peripheral end face 15 butts, the pressing force of neighboring area 13 on vertical on cleaning brush 16 relative wafer W surfaces remained predefined pressing force.

In addition, during such clean wafers W periphery, can wash attached to the polluter on the middle section (nmosfet formation region) on wafer W surface by the treatment fluid of supplying with to the wafer W surface.

When after first cleaning surface 28 of cleaning brush 16 and the wafer W butt during through preset time, by control part 67 control wobble drive mechanism 18 and lift drive mechanisms 19, the initial position (step S7) before cleaning brush 16 being returned to begin to handle.In addition, cleaning brush 16 get back to initial position during, cleaning brush motor 52 is stopped, thereby stops the rotation of cleaning brush 16.And then, close treatment fluid valve 12 by control part 67, thereby stop to supply with treatment fluid (step S8) from surface nozzle 4 and back side nozzle 5.

Then, by control part 67 control rotation motors 9, make wafer W (for example 3000rpm) rotation (step S9) at a high speed.Thus, can get rid of attached to the treatment fluid on the wafer W and make the wafer W drying.

When the high speed rotation of wafer W has continued preset time, rotation motor 9 is stopped, thereby stop rotation (step S10) by the wafer W of rotary chuck 3 controls.And, after wafer W is static, this wafer W of handling is taken out of (step S11) from process chamber 2.

As mentioned above, second cleaning surface 29 by making cleaning brush 16 connects with the neighboring area 14 and the peripheral end face 15 at the wafer W back side, and can clean this neighboring area 14 and peripheral end face 15.In addition, first cleaning surface 28 by making cleaning brush 16 connects with the neighboring area 13 and the peripheral end face 15 on wafer W surface, and can clean this neighboring area 13 and peripheral end face 15.

The neighboring area 13 on first cleaning surface 28 of cleaning brush 16 and wafer W surface and peripheral end face 15 connect during, by pushing the effect of maintaining body 33, and the pressing force of neighboring area 13 on vertical on 16 pairs of wafer W surfaces of cleaning brush remained predefined pressing force.Therefore,, in the neighboring area 13 on wafer W surface, do not occur cleaning inhomogeneous or phenomenon such as cleaning width is inhomogeneous even wafer W occurs bending and deformation yet, and the neighboring area 13 on clean wafers W surface and peripheral end face 15 well.

In addition, the pressing quantity (elastic deformation amount of first cleaning surface 28 when making first cleaning surface 28) of the 28 pairs of wafer W of first cleaning surface by changing cleaning brush 16 with the wafer W butt, and change the neighboring area 13 of wafer W one side surface and the virtual contact width of first cleaning surface 28, and can easily change the cleaning width of this neighboring area 13.And then, the pressing quantity (elastic deformation amount of second cleaning surface 29 when making second cleaning surface 29) of the 29 pairs of wafer W of second cleaning surface by changing cleaning brush 16 with the wafer W butt, and change the neighboring area 14 at the wafer W back side and the virtual contact width of second cleaning surface 29, and can easily change the cleaning width of this neighboring area 14.

In addition, after utilizing second cleaning surface 29 to clean, utilize first cleaning surface 28 to clean, thereby when utilizing second cleaning surface 29 to clean, even the polluter of removing from the neighboring area 14 or the peripheral end face 15 at the wafer W back side is stretched once more attached on the wafer W surface, also can when utilizing first cleaning surface 28 to clean, remove the polluter that on this wafer W, adheres to once more.Therefore, can provide wafer W with clean surface.

In addition, for the pollution (absorption vestige) of absorptive table 8 contact portions of removing the wafer W back side and rotary chuck 3, after the processing in this substrate board treatment 1 finishes, substrate board treatment (treatment chamber) the clean wafers W back side of adopting other.Therefore, though the polluter of when utilizing first cleaning surface 28 to clean, removing from the neighboring area 13 or the peripheral end face 15 on wafer W surface stretch and on once more attached to the wafer W back side, also can not become problem.

In addition, during first cleaning surface 28 of cleaning brush 16 and wafer W butt and during second cleaning surface 29 of cleaning brush 16 and the wafer W butt, rotate wafer W by rotary chuck 3, thereby the cleaning brush 16 and the periphery of wafer W are relatively moved, so the periphery of clean wafers W effectively.

And then during first cleaning surface 28 of cleaning brush 16 and wafer W butt and during second cleaning surface 29 of cleaning brush 16 and the wafer W butt, cleaning brush 16 rotates to identical direction with wafer W.Thus, can clean the periphery of wafer W, and clean wafers W periphery more well.In addition, the direction of rotation of cleaning brush 16 also can be opposite with the direction of rotation of wafer W, but under the situation identical with the direction of rotation of wafer W, because wafer W and cleaning brush 16 are rubbed mutually, thus can realize more high-quality cleaning.

Fig. 8 is the vertical view of schematic configuration of the substrate board treatment of expression the present invention other embodiment.In addition, Fig. 9 is the side view that the inside to substrate board treatment shown in Figure 8 illustrates.In each later figure of Fig. 8, the part suitable with each parts shown in Fig. 1～Fig. 7 put on the Reference numeral identical with these each parts.

This substrate board treatment 81 has in process chamber 2: rotary chuck 3, and it is used for wafer W being remained level of approximation and making the wafer W rotation; Surface nozzle 4, it is used for supplying with treatment fluid to the surface of wafer W; Back side nozzle 5, it is used for supplying with treatment fluid to the back side of wafer W; The first cleaning brush mechanism 82, it is used for the neighboring area 13 and the peripheral end face 15 on clean wafers W surface; The second cleaning brush mechanism 83, it is used for the neighboring area 14 and the peripheral end face 15 at the clean wafers W back side.

The first cleaning brush mechanism 82 has: first cleaning brush 84, and it is used for the neighboring area 13 and the peripheral end face 15 on clean wafers W surface; First swing arm 85, it keeps this first cleaning brush 84 at front end; The first wobble drive mechanism 86, it makes this first swing arm 85 swing along horizontal direction around the outer vertical axis of the rotating range that is set in wafer W; First lift drive mechanism 87, it makes 85 liftings of first swing arm.

The second cleaning brush mechanism 83 has: second cleaning brush 88, and it is used for the neighboring area 14 and the peripheral end face 15 at the clean wafers W back side; Second swing arm 89, it keeps this second cleaning brush 88 at front end; The second wobble drive mechanism 90, it makes this second swing arm 89 swing along horizontal direction around the outer vertical axis of the rotating range that is set in wafer W; Second lift drive mechanism 91, it makes 89 liftings of second swing arm.

In addition, the structure of first swing arm 85 is identical with the structure of above-mentioned swing arm 17.In addition, the structure of second swing arm 89 is structures that above-mentioned swing arm 17 is reversed up and down.Therefore, omission is about the detailed description of first swing arm 85 and second swing arm 89, in the following description, to the part suitable in first swing arm 85 and second swing arm 89, adopt the Reference numeral identical with these each parts with each parts of swing arm 17.

Figure 10 is the cutaway view of the structure of expression first cleaning brush 84.

First cleaning brush 84 and second cleaning brush 88 have identical structure, and the state to reverse up and down mutually, remain on respectively on first swing arm 85 and second swing arm 89.In addition, below for convenience of explanation, stress the structure of first cleaning brush 84, and with the Reference numeral of part suitable in second cleaning brush 88, enclose bracket and be illustrated in after the Reference numeral of first cleaning brush, 84 each parts with each parts of first cleaning brush 84.

First cleaning brush 84 (second cleaning brush 88) for example is made of PVA sponge materials such as (polyvinyl alcohol), and has integratedly: the base portion 92 (93) that approximate circle is tabular; The main part 94 (95) of approximate circle tabular (flat is cylindric), it is arranged on the side of this base portion 92 (93), and its diameter is less than the diameter of base portion 92 (93); Approximate cone shape leading section 96 (97), it is arranged on the front end of this main part 94.Each central axis of base portion 92 (93), main part 94 (95) and leading section 96 (97) is consistent, and first cleaning brush 84 has around this central axis and rotational symmetric shape.In addition, the side of leading section 96 (97) forms the consecutive taper seat in side with main part 94 (95), thereby constitutes the cleaning surface 98 (99) that neighboring area 13 (14) and peripheral end face 15 with wafer W connect.

First cleaning brush 84 (second cleaning brush 88) remains on the brush holder 100, and is installed on the brush holder installation portion 36 of first swing arm 85 (second swing arm 89) via this brush holder 100.Brush holder 100 has: approximate columned resin mass 101; Fixed component 102, it is used for first cleaning brush 84 (second cleaning brush 88) is fixed on this resin mass 101.

On the whole outer peripheral face of a side end of resin mass 101, be formed with section and be approximately rectangular-shaped embeded slot 103.In addition, on a side end of resin mass 101, relatively embeded slot 103 separates to radially inner side on the position of slight gap, along upwards being formed with the grooving 104 that section is approximately U word shape whole week.Thus, the part between embeded slot 103 and the grooving 104 constitutes has given flexible flexure strip 105, and wherein this elasticity is the flexible elasticity that produces by resin.On the outer peripheral face of this flexure strip 105, be formed with a plurality of hemispheric engaging protrusion 106.On the other hand, on the end face of resin mass 101 opposite sides, be formed with flat columned threaded portion 107.On the outer peripheral face of this threaded portion 107, be processed with screw thread and can be screwed with the screw thread that is formed on the brush holder installation portion 36.

Fixed component 102 one have: plectane portion 108, and it has the profile of sub-circular; The cylindrical portion 109 of approximate circle tubular, its periphery from this plectane portion 108 extends to a side.Be formed with the inserting hole 110 of the main part 94 (95) that can insert logical first cleaning brush 84 (second cleaning brush 88) at the central portion of plectane portion 108.The internal diameter of cylindrical portion 109 is approximate identical with the external diameter of the base portion 92 (93) of first cleaning brush 84 (second cleaning brush 88).In addition, be not subjected at flexure strip 105 under the state of external force effect, the internal diameter of cylindrical portion 109 is slightly less than the external diameter of this flexure strip 105.On the inner peripheral surface of cylindrical portion 109, be formed with a plurality of engaging recessed parts 111 that can fasten with each engaging protrusion 106.

With first cleaning brush 84 (second cleaning brush 88) when being installed in brush holder installation portion 36, at first, with first cleaning brush 84 (second cleaning brush 88) so that main part 94 (95) insert and lead in the inserting hole 110 and modes that base portion 92 (93) is contained in the cylindrical portion 109 are installed on the fixed component 102, then, the cylindrical portion 109 of fixed component 102 is fitted in the embeded slot of resin mass 101, and each engaging protrusion 106 is fastened with each engaging recessed part 111.Thus, first cleaning brush 84 (second cleaning brush 88) is maintained on the brush holder 100.Then, screw togather by threaded portion 107 and to be installed on the brush holder installation portion 36, first cleaning brush 84 (second cleaning brush 88) is installed in the operation on the brush holder installation portion 36 and finish with brush holder 100.

Figure 11 is the block diagram that is used to illustrate the electrical structure of substrate board treatment 81.

On the control part 67 of substrate board treatment 81, be connected with rotation motor 9, treatment fluid valve 12, the first wobble drive mechanism 86, first lift drive mechanism 87, the second wobble drive mechanism 90, second lift drive mechanism 91, the first cleaning brush mechanism 82 and each cleaning brush motor 52 of the second cleaning brush mechanism 83 and each overflow valve 62 of the first cleaning brush mechanism 82 and the second cleaning brush mechanism 83 etc. as the control object.

Figure 12 is the process chart that is used for illustrating substrate board treatment 81 processing wafer W.In addition, Figure 13 be illustrated in wafer W handle in the side view of state of first cleaning brush 84 and second cleaning brush 88.

Before handling wafer W, import neighboring area 14 the pressing force on vertical of the neighboring area 13 on 84 pairs of wafer W surfaces of first cleaning brush by user's operating technology parameter enter key 68 at the pressing force on the vertical and 88 pairs of wafer W back sides of second cleaning brush.According to input, set the release pressure (step T1: set pressing force) of each overflow valve 62 of the first cleaning brush mechanism 82 and the second cleaning brush mechanism 83 by control part 67 from this technical parameter enter key 68

The wafer W of being moved in the process chamber 2 remains on (step T2) on the rotary chuck 3.Then, by control part 67 control rotation motors 9, thereby beginning is by rotary chuck 3 rotation wafer W (step T3).Then, open treatment fluid valve 12, thereby begin to supply with treatment fluid (step T4) to the wafer W surface and the back side respectively from surface nozzle 4 and back side nozzle 5 by control part 67.

In addition, by each cleaning brush motor 52 of the control part 67 control first cleaning brush mechanisms 82 and the second cleaning brush mechanism 83, make first cleaning brush 84 and second cleaning brush 88 respectively towards the direction rotation identical with the wafer W direction of rotation.

Then, by the control part 67 control first wobble drive mechanism 86 and first lift drive mechanisms 87, thereby the cleaning surface 98 of first cleaning brush 84 and the neighboring area 13 and the peripheral end face 15 on wafer W surface are connected.In addition, meanwhile, by the control part 67 control second wobble drive mechanism 90 and second lift drive mechanisms 91, thereby the neighboring area 14 at the cleaning surface 99 that makes second cleaning brush 88 and the wafer W back side and peripheral end face 15 connect (step T5).The cleaning surface 98 of first cleaning brush 84 and the cleaning surface 99 of second cleaning brush 88 are across the center of wafer W and connect with wafer W on the position near symmetrical.

Specifically, at first, make first cleaning brush 84 rise or descend by controlling first lift drive mechanism 87, so that the cleaning surface 98 of first cleaning brush 84 is opposed with the peripheral end face 15 of wafer W.Then, make 85 rotations of first swing arm by controlling the first wobble drive mechanism 86, thereby first cleaning brush 84 moves horizontally.Because this moves horizontally, make the periphery of wafer W enter into the cleaning surface 98 of first cleaning brush 84, as shown in figure 13, with the cleaning surface 98 of first cleaning brush 84 by on neighboring area 13 that is pressed in the wafer W surface and the peripheral end face 15.In addition, when moving this first cleaning brush 84, make second cleaning brush 88 rise or descend by controlling second lift drive mechanism 91, so that the cleaning surface 99 of second cleaning brush 88 is opposed with the peripheral end face 15 of wafer W.Then, make 89 rotations of second swing arm by controlling the second wobble drive mechanism 90, thereby second cleaning brush 88 moves horizontally.Because this moves horizontally, make the periphery of wafer W enter into the cleaning surface 99 of second cleaning brush 88, as shown in figure 13, with the cleaning surface 99 of second cleaning brush 88 by on neighboring area 14 that is pressed in the wafer W back side and the peripheral end face 15.Thus, simultaneously each neighboring area 13,14 and the peripheral end face 15 at the wafer W surface and the back side cleaned.

At this moment because the effect of pushing maintaining body 33 that had of first swing arm 85, first cleaning brush 84 with the pressing force of setting by technical parameter enter key 68 by on the neighboring area 13 that is pressed in the wafer W surface.Thus, peripheral end face 15 that can clean wafers W, and can come with the pressing force corresponding cleaning width with first cleaning brush 84 neighboring area 13 on wafer W surface is cleaned.In addition because the effect of pushing maintaining body 33 that had of second swing arm 89, second cleaning brush 88 with the pressing force of setting by technical parameter enter key 68 by on the neighboring area 14 that is pressed in the wafer W back side.Thus, peripheral end face 15 that can clean wafers W, and can the neighboring area 14 at the wafer W back side be cleaned with the pressing force corresponding cleaning width with second cleaning brush 88.

In addition, during such clean wafers W periphery, can rinse out attached to the polluter on the middle section (nmosfet formation region) on wafer W surface by the treatment fluid that supplies to the wafer W surface.

When beginning to clean by first cleaning brush 84 and second cleaning brush 88 and, controlling the first wobble drive mechanism 86, first lift drive mechanism 87, the second wobble drive mechanism 90 and second lift drive mechanism 91 by control part 67 through after preset time.By this control, first cleaning brush 84 and second cleaning brush 88 return to handles the preceding initial position (step T6) of beginning.In addition, first cleaning brush 84 and second cleaning brush 88 turn back to respectively initial position during, each cleaning brush motor 52 of the first cleaning brush mechanism 82 and the second cleaning brush mechanism 82 is stopped, thereby first cleaning brush 84 and second cleaning brush 88 stop the rotation.And then, close treatment fluid valve 12 by control part 67, thereby stop to supply with treatment fluid (step T7) from surface nozzle 4 and back side nozzle 5.

Then, by control part 67 control rotation motors 9, thus wafer W (for example 3000rpm) rotation (step T8) at a high speed.Thus, can get rid of attached to the treatment fluid on the wafer W and make the wafer W drying.

After the high speed rotation of wafer W continued preset time, rotation motor 9 was stopped, thereby stopped the rotation (step T9) by the wafer W of rotary chuck 3 drives.And, after wafer W is static, this wafer W of handling is taken out of (step T10) from process chamber 2.

As mentioned above, the cleaning surface 98 by making first cleaning brush 84 connects with the neighboring area 13 and the peripheral end face 15 on wafer W surface, and can clean this neighboring area 13 and peripheral end face 15.In addition, the cleaning surface 99 by making second cleaning brush 88 connects with the neighboring area 14 and the peripheral end face 15 at the wafer W back side, and can clean this neighboring area 14 and peripheral end face 15.

The neighboring area 13 on the cleaning surface 98 of first cleaning brush 84 and wafer W surface and peripheral end face 15 connect during, by the effect of pushing maintaining body 33 that first swing arm 85 is had, the pressing force of neighboring area 13 on vertical on 84 pairs of wafer W surfaces of first cleaning brush remains predefined pressing force.Therefore,, in the neighboring area 13 on wafer W surface, can not occur cleaning inhomogeneous or phenomenon such as cleaning width is inhomogeneous even wafer W occurs bending and deformation yet, and the neighboring area 13 on clean wafers W surface and peripheral end face 15 well.

In addition, the neighboring area 14 at the cleaning surface 99 of second cleaning brush 88 and the wafer W back side and peripheral end face 15 connect during, by the effect of pushing maintaining body 33 that second swing arm 89 is had, the pressing force of neighboring area 14 on vertical at 88 pairs of wafer W back sides of second cleaning brush remains predefined pressing force.Therefore,, in the neighboring area 14 at the wafer W back side, can not occur cleaning inhomogeneous or phenomenon such as cleaning width is inhomogeneous even wafer W occurs bending and deformation yet, and the neighboring area 14 at the clean wafers W back side and peripheral end face 15 well.

In addition, by technical parameter enter key 68 being operated the pressing force of the neighboring area 13 that changes 84 pairs of wafer W surfaces of first cleaning brush, thereby can change the pressing quantity of 84 pairs of these neighboring areas 13 of first cleaning brush on vertical (cleaning surface 98 that makes first cleaning brush 84 with the wafer W butt time this cleaning surface 98 elastic deformation amount on vertical).According to the change of this pressing quantity, and can change the virtual contact width of the cleaning surface 98 of the neighboring area 13 and first cleaning brush 84.Therefore, can easily change the cleaning width of the neighboring area 13 on wafer W surface.

On the other hand, by technical parameter enter key 68 being operated the pressing force of neighboring area 14 on vertical that changes 88 pairs of wafer W back sides of second cleaning brush, thereby can change the pressing quantity (cleaning surface 99 that makes second cleaning brush 88 with the wafer W butt time this cleaning surface 99 elastic deformation amount on vertical) of 88 pairs of these neighboring areas 14 of second cleaning brush.According to the change of this pressing quantity, and can change the virtual contact width of the cleaning surface 99 of the neighboring area 14 and second cleaning brush 88.Therefore, can easily change the cleaning width of the neighboring area 14 at the wafer W back side.

In addition, because the cleaning of being undertaken by the neighboring area 13 and the peripheral end face 15 on 84 pairs of wafer W surfaces of first cleaning brush and carry out simultaneously by the cleaning that the neighboring area 14 and the peripheral end face 15 at 88 pairs of wafer W back sides of second cleaning brush carries out, so compare with the situation of carrying out these operations in different timings, two-sided neighboring

area

13,14 and the peripheral end face 15 of clean wafers W at short notice.

In addition, the cleaning of being undertaken by the neighboring area 13 and the peripheral end face 15 on 84 pairs of wafer W surfaces of first cleaning brush and by the cleaning that the neighboring area 14 and the peripheral end face 15 at 88 pairs of wafer W back sides of second cleaning brush carries out can be carried out in other timing.

In addition, first cleaning brush 84 and second cleaning brush 88 and wafer W connect during, drive the wafer W rotation by rotary chuck 3, therefore first cleaning brush 84 and second cleaning brush 88 relatively move with the periphery of wafer W, thus the periphery of clean wafers W effectively.

And then, first cleaning brush 84 and second cleaning brush 88 and wafer W connect during, first cleaning brush 84 and second cleaning brush 88 thus, can be cleaned the periphery of wafer W towards the direction of rotation rotation identical with wafer W.Therefore, the periphery of clean wafers W more well.In addition, the direction of rotation of first cleaning brush 84 and second cleaning brush 88 can be opposite with the direction of rotation of wafer W, but, under the situation identical with the direction of rotation of wafer, owing to the wafer W and first cleaning brush 84 and second cleaning brush 88 are rubbed mutually, thereby can finish more high-quality cleaning.

The test of＜affirmation cleaning performance 〉

Figure 14 is the result's of expression test a chart, and this test is used to confirm the cleaning performance of the cleaning brush of different shape.

The present inventor adopts PVA to make cleaning brush A, B, C, D, the E of 5 kinds of shapes, and these cleaning brush A～E selectivity is installed on the cleaning brush swaging machine (Brush Scrubber) (trade name " SS-3000 ") of Dainippon Screen Mfg. Co., Ltd.'s manufacturing, and, in this cleaning brush swaging machine, the wafer W periphery is cleaned by each cleaning brush A～E.In the front and back of this cleaning, adopt the marginal check machine (trade name " RXW-800 ") that Co., Ltd. thunder Thailand (レイテ Star Network ス) makes and count the neighboring area 13 attached to the wafer W surface, the neighboring area 14 at the back side and the granule number on the peripheral end face 15.Statistics (Pre) before cleaning is represented with the bar chart of oblique line form in Figure 14.Statistics (Post) after cleaning is represented with the bar chart of ruling form in Figure 14.Also have, the particle that the statistics before and after cleaning calculates is removed rate (PRE) and is represented with broken line graph among Figure 14.In addition, particle is removed rate (PRE) is derived by mathematical expression (PRE)=(Pre-Post) ÷ Pre * 100 (%).

Cleaning brush A is the cylindric cleaning brush that is configured on the side of wafer W and has central shaft, and wherein, this central axes is in the axle that intersects vertically with the wafer W surface.In the cleaning of adopting cleaning brush A, with the side of cleaning brush A by on the peripheral end face 15 that is pressed in wafer W.By this cleaning, the particle rate of removing is about 20%.

Cleaning brush B be the neighboring area 13 on lower surface and wafer W surface opposed and with the discoideus cleaning brush of the approximate configured in parallel in surface of wafer W.In the cleaning of adopting cleaning brush B, with the lower surface of cleaning brush B from the top by on the neighboring area 13 that is pressed in the wafer W surface.But particle almost is not removed, and by this cleaning, the particle rate of removing is almost 0%.

Cleaning brush C is the cylindric cleaning brush (reference literature 3) that is configured on the side of wafer W and has groove that can chimeric wafer W on side face.In the cleaning of adopting cleaning brush C, the periphery of wafer W is entrenched in the groove of cleaning brush C.The particle rate of removing of this cleaning is about 10%.

Cleaning brush D is two cleaning brush, and these two cleaning brush have respectively and first cleaning brush 84 of above-mentioned second embodiment and the identical shape of second cleaning brush 88.In the cleaning of adopting these cleaning brush D, with the neighboring area 13 on the mode clean wafers W surface identical, the neighboring area 14 and the peripheral end face 15 at the back side with second embodiment.By this cleaning, the particle rate of removing is about 80%.

Cleaning brush E has the cleaning brush identical shaped with the cleaning brush 16 of above-mentioned first embodiment.In the cleaning of adopting this cleaning brush E, with the neighboring area 13 on the mode clean wafers W surface identical, the neighboring area 14 and the peripheral end face 15 at the back side with first embodiment.By this cleaning, the particle rate of removing has surpassed 80%.

From this result as can be known, the cleaning brush E suitable with the cleaning brush 16 of first embodiment and with first cleaning brush 84 of second embodiment and the suitable cleaning brush D of second cleaning brush 88, compare with the cleaning brush A～C that proposed in the past, high a lot of to the neighboring area 14 at the neighboring area 13 on wafer W surface, the back side and performance that peripheral end face 15 cleans.

Figure 15 be the pressing force of expression cleaning brush 16 and first cleaning brush 84 and in the neighboring area 13 of wafer surface the chart of the relation between the contact width of cleaning brush 16.

Photoresist is infiltrated in the cleaning brush 16, and make cleaning brush 16 with given pressing force by on the periphery that is pressed in this wafer W.Then, determine width attached to the photoresist on the neighboring area 13 on wafer W surface.In addition, photoresist is penetrated in first cleaning brush 84, and make first cleaning brush 84 with given pressing force by on the periphery that is pressed in this wafer W.Then, determine width attached to the photoresist on the neighboring area 13 on wafer W surface.In addition, because the angle of inclination of the cleaning surface 98 of first cleaning surface 28 of cleaning brush 16 and first cleaning brush 84 all is 45 degree,, this result is illustrated among Figure 15 with broken line graph so two result of the tests are identical.

That is, when the pressing force of the cleaning brush 16 and first cleaning brush 84 is a 1[relative pressure value] time, the contact width of the cleaning brush 16 and first cleaning brush 84 is about 1.2mm in the neighboring area 13 on wafer W surface.When the pressing force of the cleaning brush 16 and first cleaning brush 84 is a 2[relative pressure value] time, the cleaning brush 16 in the neighboring area 13 on wafer W surface and the contact width of first cleaning brush 84 are about 1.8mm.In addition, when the pressing force of the cleaning brush 16 and first cleaning brush 84 is a 3[relative pressure value] time, the cleaning brush 16 in the neighboring area 13 on wafer W surface and the contact width of first cleaning brush 84 are about 2.4mm.In addition, be meant that in this so-called relative pressure value the setting pressure value of pressing force is 1 o'clock a relative pressure value.

From this result as can be known, the contact width of the pressing force of the cleaning brush 16 and first cleaning brush 84 and cleaning brush 16 and first cleaning brush 84 is approximated to direct ratio.Thereby can be controlled at as can be known, the cleaning width in the neighboring area 13 on wafer W surface well by the pressing force of the cleaning brush 16 and first cleaning brush 84.And, measurable from this result: also identical about second cleaning brush 88 with first cleaning brush 84, can be controlled at the cleaning width in the neighboring area 14 at the wafer W back side well by its pressing force.

Two embodiments of the present invention more than have been described, but the present invention can also implement otherwise.For example, cleaning brush 16, first cleaning brush 84 and second cleaning brush 88 and wafer W connect during, cleaning brush 16, first cleaning brush 84 and second cleaning brush 88 are not rotated and static.

Also have, though enumerated structure by making the wafer W rotation that the periphery of cleaning brush 16, first cleaning brush 84 and second cleaning brush 88 and wafer W is relatively moved, but, for example under, also can adopt to make static and the structure that cleaning brush is moved along the periphery of substrate of substrate with the situation of square substrate as pending object.Certainly, also can cleaning brush be relatively moved along the periphery of substrate by substrate and cleaning brush are all moved.

In addition, the concrete example that these embodiments only adopt in order clearly to represent technology contents of the present invention, thereby can not only be defined in these specific embodiments and explain the present invention, spirit of the present invention and scope are limited by the scope of additional claims.

The special hope of JP 2006-95552 number that the application proposed to Japan Patent office corresponding on March 30th, 2006, the special hope of JP 2006-95553 number and the special patent application of being willing to 2006-95554 number of JP, whole disclosures of these applications are enrolled in this application by reference.

Claims

1. a substrate board treatment is characterized in that, comprising:

Substrate holding mechanism, it keeps substrate;

First cleaning brush, its adopt can strain material make, and have the cleaning surface that tilts with respect to the vertical line direction, wherein, this vertical line direction be with described substrate holding mechanism on the vertical direction of a side surface of the substrate that keeps;

The first cleaning brush travel mechanism, it makes described first cleaning brush move with respect to the substrate that keeps on the described substrate holding mechanism;

Control part, it is used to control this first cleaning brush travel mechanism, so that the neighboring area and the peripheral end face of a described side surface of the substrate that keeps on described cleaning surface and the described substrate holding mechanism connect;

First pushes maintaining body, and it remains predefined pressing force with described first cleaning brush to the pressing force of neighboring area on the vertical line direction of a described side surface of substrate.

2. substrate board treatment as claimed in claim 1 is characterized in that,

Described first cleaning brush has the upwardly extending central axis in described vertical line side of centering on and rotational symmetric shape,

Described substrate board treatment comprises the first cleaning brush rotating mechanism that described first cleaning brush is rotated around described central axis.

3. substrate board treatment as claimed in claim 1, it is characterized in that, this device includes the first cleaning brush relative moving mechanism, and this first cleaning brush relative moving mechanism makes the substrate that keeps on the described substrate holding mechanism and described first cleaning brush so that the mode that described first cleaning brush upwards moved in the week of this substrate relatively moves.

4. substrate board treatment as claimed in claim 1 is characterized in that,

Described cleaning surface comprises: first cleaning surface, and it has the shape that narrows down towards a side of described vertical line direction; Second cleaning surface, it has the shape that enlarges towards a described side of described vertical line direction from the end limit of a described side of this first cleaning surface,

Described control part is controlled the described first cleaning brush travel mechanism, the neighboring area and the peripheral end face of a described side surface of the substrate that keeps on described first cleaning surface and the described substrate holding mechanism are connected, and, the neighboring area and the peripheral end face on the opposite side surface of the substrate that keeps on described second cleaning surface and the described substrate holding mechanism are connected, wherein, described opposite side surface be on the substrate, with the surface of the opposite side of a described side surface.

5. substrate board treatment as claimed in claim 1 is characterized in that,

Described first cleaning brush forms towards a side of described vertical line direction and the shape that front end attenuates,

Described substrate board treatment comprises:

Second cleaning brush, it adopts material that can strain and forms towards the side opposite with a described side of described vertical line direction and the shape that front end attenuates, and has the cleaning surface that tilts with respect to described vertical line direction;

The second cleaning brush travel mechanism, it makes described second cleaning brush move with respect to the substrate that keeps on the described substrate holding mechanism,

Described control part is also controlled the described second cleaning brush travel mechanism, the neighboring area and the peripheral end face on the opposite side surface of the substrate that keeps on the cleaning surface of described second cleaning brush and the described substrate holding mechanism are connected, wherein, described opposite side surface be on the substrate, with the surface of the opposite side of a described side surface.

6. substrate board treatment as claimed in claim 5, it is characterized in that, this device includes second and pushes maintaining body, and this second is pushed maintaining body described second cleaning brush is remained predefined pressing force to the pressing force of neighboring area on described vertical line direction on the described opposite side surface of substrate.

7. substrate board treatment as claimed in claim 5 is characterized in that,

Described second cleaning brush has the upwardly extending central axis in described vertical line side of centering on and rotational symmetric shape,

Described substrate board treatment includes the second cleaning brush rotating mechanism that described second cleaning brush is rotated around described central axis.

8. substrate board treatment as claimed in claim 5 is characterized in that,

This device includes the second cleaning brush relative moving mechanism, and this second cleaning brush relative moving mechanism makes the substrate that keeps on the described substrate holding mechanism and described second cleaning brush so that the mode that described second cleaning brush upwards moved in the week of this substrate relatively moves.

9. substrate board treatment as claimed in claim 1 is characterized in that,

This device includes the treatment fluid feed mechanism, treatment fluid is supplied with in the treatment fluid supply area of the substrate that this treatment fluid feed mechanism keeps on described substrate holding mechanism, wherein this treatment fluid supply area be on the substrate, the zone more in the inner part, ratio neighboring area of a described at least side surface.

10. a substrate board treatment is characterized in that, comprising:

Substrate holding mechanism, it keeps substrate;

Cleaning brush, its adopt can strain material make, and have first cleaning surface and second cleaning surface, wherein, this first cleaning surface has the shape that the side to the vertical line direction narrows down, this second cleaning surface has the shape that enlarges to the described side of described vertical line direction from the described side end edge of this first cleaning surface, wherein this vertical line direction be with described substrate holding mechanism on the vertical direction of substrate one side surface that keeps;

Cleaning brush travel mechanism, it makes described cleaning brush move with respect to the substrate that keeps on the described substrate holding mechanism;

Control part, it is used to control this cleaning brush travel mechanism, so that the neighboring area and the peripheral end face of a described side surface of the substrate that keeps on described first cleaning surface and the described substrate holding mechanism connect, and, the neighboring area and the peripheral end face on the opposite side surface of the substrate that keeps on described second cleaning surface and the described substrate holding mechanism are connected, wherein, described opposite side surface be on the substrate, with the surface of the opposite side of a described side surface.

11. substrate board treatment as claimed in claim 10 is characterized in that,

Described cleaning brush has the upwardly extending central axis in described vertical line side of centering on and rotational symmetric shape,

Described substrate board treatment includes the cleaning brush rotating mechanism that described cleaning brush is rotated around described central axis.

12. substrate board treatment as claimed in claim 10 is characterized in that,

This device includes relative moving mechanism, and this relative moving mechanism makes the substrate that keeps on the described substrate holding mechanism and described cleaning brush so that the mode that described cleaning brush upwards moved in the week of this substrate relatively moves.

13. substrate board treatment as claimed in claim 10 is characterized in that,

14. a substrate board treatment is characterized in that, comprising:

Substrate holding mechanism, it keeps substrate;

First cleaning brush, it adopts material that can strain and forms towards a side of vertical line direction and the shape that front end attenuates, and has the cleaning surface that tilts with respect to described vertical line direction, wherein, this vertical line direction be with described substrate holding mechanism on the vertical direction of substrate one side surface that keeps;

Second cleaning brush, it adopts material that can strain and forms a side opposite with a described side on the described vertical line direction and shape that front end attenuates, and has the cleaning surface that tilts with respect to described vertical line direction;

The second cleaning brush travel mechanism, it makes described second cleaning brush move with respect to the substrate that keeps on the described substrate holding mechanism;

Control part, it is used to control described first cleaning brush travel mechanism and the described second cleaning brush travel mechanism, the neighboring area and the peripheral end face of a described side surface of the substrate that keeps on the cleaning surface of described first cleaning brush and the described substrate holding mechanism are connected, and the neighboring area and the peripheral end face on the opposite side surface of the cleaning surface of described second cleaning brush and this substrate are connected, wherein, this opposite side surface be on the substrate, with the surface of the opposite side of a described side surface.

15. substrate board treatment as claimed in claim 14 is characterized in that,

When described control part connects the neighboring area of a described side surface of the substrate that keeps on the cleaning surface of described first cleaning brush and the described substrate holding mechanism and peripheral end face, the neighboring area and the peripheral end face on the described opposite side surface of the cleaning surface of described second cleaning brush and this substrate are connected.

16. substrate board treatment as claimed in claim 14 is characterized in that,

Described substrate board treatment includes the first cleaning brush rotating mechanism that described first cleaning brush is rotated around described central axis.

17. substrate board treatment as claimed in claim 14 is characterized in that,

18. substrate board treatment as claimed in claim 14 is characterized in that,

This device includes first relative moving mechanism, and this first relative moving mechanism makes the substrate that keeps on the described substrate holding mechanism and described first cleaning brush so that the mode that described first cleaning brush upwards moved in the week of this substrate relatively moves.

19. substrate board treatment as claimed in claim 14 is characterized in that,

This device includes second relative moving mechanism, and this second relative moving mechanism makes the substrate that keeps on the described substrate holding mechanism and described second cleaning brush so that the mode that described second cleaning brush upwards moved in the week of this substrate relatively moves.

20. substrate board treatment as claimed in claim 14 is characterized in that,

21. a substrate processing method using same is characterized in that, comprising:

Substrate keeps operation, utilizes substrate holding mechanism that substrate is kept;

One side butt operation, by first cleaning brush with the cleaning surface that tilts with respect to the vertical line direction is moved, and the neighboring area and the peripheral end face of a described side surface of the substrate that keeps on the cleaning surface of described first cleaning brush and the described substrate holding mechanism are connected, wherein, this vertical line direction be with described substrate holding mechanism on the vertical direction of a side surface of the substrate that keeps;

One side is pushed the maintenance operation, in this side butt operation, described first cleaning brush is remained predefined pressing force to the pressing force of neighboring area on described vertical line direction of a described side surface of substrate.

22. substrate processing method using same as claimed in claim 21 is characterized in that,

The described first cleaning brush cleaning surface comprises: first cleaning surface, and it has the shape that narrows down towards a side of described vertical line direction; Second cleaning surface, it has from the end limit of a described side of this first cleaning surface to a described side of described vertical line direction and the shape that enlarges,

A described side butt operation is to make the neighboring area of a described side surface of the substrate that keeps on described first cleaning surface and the described substrate holding mechanism and the operation that peripheral end face connects,

Described substrate processing method using same comprises opposite side butt operation, this opposite side butt operation is by the neighboring area on the opposite side surface that first cleaning brush is moved make the substrate that keeps on described second cleaning surface and the described substrate holding mechanism and the operation that peripheral end face connects, wherein, this opposite side surface be on the substrate, with the surface of the opposite side of a described side surface.

23. substrate processing method using same as claimed in claim 21 is characterized in that,

Described substrate processing method using same comprises:

Opposite side butt operation, the neighboring area and the peripheral end face on the opposite side surface of the substrate that keeps on cleaning surface by second cleaning brush being moved make this second cleaning brush and the described substrate holding mechanism connect, wherein, this second cleaning brush forms a side opposite with a described side on the described vertical line direction and shape that front end attenuates, and have the cleaning surface that tilts with respect to described vertical line direction, and described opposite side surface is on the substrate, with the surface of the opposite side of a described side surface;

Opposite side is pushed the maintenance operation, in this opposite side butt operation, described second cleaning brush is remained predefined pressing force to the pressing force of neighboring area on described vertical line direction on the described opposite side surface of substrate.

24. a substrate processing method using same is characterized in that, comprising:

One side butt operation, by the cleaning brush with first cleaning surface and second cleaning surface is moved the neighboring area and the peripheral end face of a side surface of the substrate that keeps on described first cleaning surface and the described substrate holding mechanism are connected, wherein, this first cleaning surface has the shape that narrows down towards a side of vertical line direction, and this vertical line direction be with described substrate holding mechanism on the vertical direction of a described side surface of the substrate that keeps, this second cleaning surface has the shape that enlarges to a described side of described vertical line direction from the end limit of a described side of this first cleaning surface;

Opposite side butt operation, by described cleaning brush is moved the neighboring area and the peripheral end face on the opposite side surface of the substrate that keeps on described second cleaning surface and the described substrate holding mechanism are connected, wherein, this opposite side surface be on the substrate, with the surface of the opposite side of a described side surface.

25. a substrate processing method using same is characterized in that, comprising:

One side butt operation, the neighboring area and the peripheral end face of one side surface of the substrate that keeps on cleaning surface by first cleaning brush being moved make described first cleaning brush and the described substrate holding mechanism connect, wherein, this first cleaning brush forms towards a side of vertical line direction and the shape that front end attenuates, and have the cleaning surface that tilts with respect to described vertical line direction, and this vertical line direction be with described substrate holding mechanism on the vertical direction of a side surface of the substrate that keeps;

Opposite side butt operation, carry out simultaneously with this side butt operation, the neighboring area and the peripheral end face on the opposite side surface of the substrate that keeps on cleaning surface by second cleaning brush being moved make described second cleaning brush and the described substrate holding mechanism connect, wherein, described second cleaning brush forms a side opposite with a described side on the described vertical line direction and shape that front end attenuates, and have the cleaning surface that tilts with respect to described vertical line direction, and described opposite side surface is on the substrate, with the surface of the opposite side of a described side surface.