CN203484361U - Device of adjusting cleaning brush pressure - Google Patents
Device of adjusting cleaning brush pressure Download PDFInfo
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- CN203484361U CN203484361U CN201320558215.6U CN201320558215U CN203484361U CN 203484361 U CN203484361 U CN 203484361U CN 201320558215 U CN201320558215 U CN 201320558215U CN 203484361 U CN203484361 U CN 203484361U
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- pressure
- cleaning brush
- belt
- cylinder
- air pressure
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Abstract
The utility model provides a device of adjusting cleaning brush pressure. The device of adjusting the cleaning brush pressure comprises a control system, a pressure convertor, an air pressure valve, a gas pipeline, an air cylinder, a cleaning brush and a belt, wherein the pressure convertor is connected with the air pressure valve through the gas pipeline, the pressure convertor is communicated with the control system through signals, the air cylinder is connected with the air pressure valve through the gas pipeline, the cleaning brush is connected with the air cylinder through the belt, the control system can send the signals to the pressure convertor, the air pressure valve is controlled by the pressure convertor, the air pressure valve enables air pressure in the gas pipeline to reach preset air pressure, gas enters into the air cylinder and can drive the air cylinder to pull the belt, and accordingly the pressure on a semiconductor wafer applied by the cleaning brush can be accurately adjusted through the belt.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of device that regulates cleaning brush pressure.
Background technology
In semiconductor fabrication, usually need the surface of semiconductor crystal wafer to carry out chemical mechanical polish process (Chemical Mechanical Polishing, CMP), a part of thin-film grinding that is about to semiconductor wafer surface is removed.In polishing process, semiconductor wafer surface conventionally can the residual thing of much staining, and these stain the particle that thing comprises that abrasive grain, polished film bring and the chemistry bringing from abrasive material is stained thing.Therefore after carrying out chemical mechanical polish process, also need semiconductor wafer surface to carry out cleaning treatment.As everyone knows, the above-mentioned thing of staining is to be all stressed to be compressed in the surface of described semiconductor crystal wafer, because the needed polishing of different product is different, pressure is also just corresponding different, thereby cause, to stain the pressure that thing is subjected to also different, therefore,, during follow-up cleaning, also need to use different degree of cleanings to clean semiconductor crystal wafer.
Please refer to Fig. 1, Fig. 1 is the structural representation of cleaning brush in prior art, in prior art, cleaning brush 10 is cylinder, its surface is provided with some salient points, the surface of salient point and semiconductor crystal wafer 20 is close to, can adhere to and remove the thing of staining that remains in described semiconductor crystal wafer 20 surfaces, described cleaning brush 10 inside are provided with the axis of rolling 11, the described axis of rolling 11 can drive described cleaning brush 10 to roll on the surface of described semiconductor crystal wafer 20, the described axis of rolling 11 is provided with belt 12, described belt 12 can rotate along with the described axis of rolling 11, different degree of cleanings mean that described salient point is relevant with contact area and the degree of pressure on described semiconductor crystal wafer 20 surfaces, the pressure on described salient point and described semiconductor crystal wafer 20 surfaces is larger, the contact area on described salient point and described semiconductor crystal wafer 20 surfaces is also just larger, thereby the degree of cleaning is also just larger.Just as mentioned, different product needs different degree of cleanings, that is to say, needs the pressure of 10 pairs of described semiconductor crystal wafers 20 of described cleaning brush different.In prior art, be all by manually by virtue of experience pulling belt 12 to regulate the pressure of 10 pairs of semiconductor crystal wafers 20 of cleaning brush conventionally.Yet, manually pull belt 12 can not make pressure very accurate, also will cause degree of cleaning uncontrollable, or cause semiconductor crystal wafer 20 cleaning dirty, still there are many things of staining to exist; Cause semiconductor crystal wafer 20 surfaces to be crossed and clean, certain damage is caused in semiconductor crystal wafer 20 surfaces.
Utility model content
The purpose of this utility model is to provide a kind of device that regulates cleaning brush pressure, the pressure of adjusting cleaning brush that can be automatic accurate to semiconductor wafer surface.
To achieve these goals, the utility model proposes a kind of device that regulates cleaning brush pressure, for regulating the pressure of cleaning brush to semiconductor wafer surface, described device comprises:
Control system, pressure converter, air pressure valve, gas piping, cylinder, cleaning brush and belt; Wherein, described pressure converter is connected by gas piping with described air pressure valve, and described pressure converter is connected with described control system signal; Described cylinder is connected by gas piping with described air pressure valve; Described cleaning brush is connected by belt with described cylinder.
Further, described device also comprises pressure regulator and magnetic valve, and described pressure regulator and magnetic valve are all arranged on gas piping, and described magnetic valve is connected with described control system signal.
Further, described cylinder and cleaning brush are 2.
Further, described belt is 4.
Further, the two ends of described cylinder are equipped with stretching arm, and described belt one end is connected with described stretching arm.
Further, described cleaning brush two ends are equipped with the axis of rolling, and the other end of described belt is connected with the described axis of rolling.
Further, described semiconductor crystal wafer is placed between described cleaning brush.
Further, described cleaning brush surface is provided with some salient points.
Compared with prior art, the beneficial effects of the utility model are mainly reflected in: control system can be given pressure converter signal, by pressure converter, control air pressure valve, air pressure valve makes the air pressure in gas piping reach preset air pressure, gas enters cylinder and can be with dynamic air cylinder to pull belt, thereby can by belt, regulate the pressure of described cleaning brush to semiconductor crystal wafer accurately.
Accompanying drawing explanation
Fig. 1 is the structural representation of cleaning brush in prior art;
Fig. 2 regulates the device of cleaning brush pressure in the utility model one embodiment.
The specific embodiment
Below in conjunction with schematic diagram, the device of adjusting cleaning brush pressure of the present utility model is described in more detail, wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the utility model chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to the restriction of relevant system or relevant business, by an embodiment, change into another embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, with reference to accompanying drawing, with way of example, the utility model is more specifically described.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Please refer to Fig. 2, propose in the present embodiment a kind of device that regulates cleaning brush pressure, for regulating the pressure of cleaning brush to semiconductor wafer surface, described device comprises:
Control system, pressure converter, air pressure valve, gas piping 100, cylinder 500, cleaning brush 400 and belt 420; Wherein, described pressure converter is connected by gas piping 100 with described air pressure valve, and described pressure converter carries out signal with described control system by holding wire 200 and is connected; Described control system can be given described pressure converter signal, thereby can control described air pressure valve by pressure converter, makes the air pressure in described gas piping 100 reach preset air pressure, for example, be 3psi or 5psi.
In the present embodiment, described device also comprises pressure regulator and magnetic valve, described pressure regulator and magnetic valve are all arranged on gas piping 100, described pressure regulator can be controlled the gross pressure size that enters the gas in described gas piping 100, described magnetic valve also carries out signal by holding wire 200 with described control system and is connected, and described magnetic valve can open and close described gas piping 100.
In the present embodiment, described cylinder 500 is connected by gas piping 100 with described air pressure valve; Described cleaning brush 400 is connected by belt 420 with described cylinder 500, in the present embodiment, described cylinder 500 and cleaning brush 400 are 2, and described belt 420 is 4, described cleaning brush 400 two ends are equipped with the axis of rolling 410, and the described axis of rolling 410 is connected with one end of described belt 420 respectively; The two ends of described cylinder 500 are equipped with stretching arm 510, and the other end of described belt 420 is connected with described stretching arm 510; When described cylinder 500 is subject to the gas of predetermined pressure, described cylinder 500 can pull described belt 420 by described stretching arm 510, thereby can drive the described axis of rolling 410, and then can play the surperficial applied pressure size of 400 pairs of described semiconductor crystal wafers 300 of adjusting cleaning brush.
In the present embodiment, described semiconductor crystal wafer 300 is placed between described cleaning brush 400, a cleaning brush 400 is for cleaning the surface of described semiconductor crystal wafer 300, another cleaning brush 400 is for cleaning the back side of described semiconductor crystal wafer 300, wherein, the surface of described cleaning brush 400 is provided with some salient points, can better clean described semiconductor crystal wafer 300.
To sum up, in the device of the adjusting cleaning brush pressure providing at the utility model embodiment, control system can be given pressure converter signal, by pressure converter, control air pressure valve, air pressure valve makes the air pressure in gas piping reach preset air pressure, gas enters cylinder and can be with dynamic air cylinder to pull belt, thereby can by belt, regulate the pressure of described cleaning brush to semiconductor crystal wafer accurately.
Above are only preferred embodiment of the present utility model, the utility model is not played to any restriction.Any person of ordinary skill in the field; within not departing from the scope of the technical solution of the utility model; the technical scheme that the utility model is disclosed and technology contents are made any type of changes such as replacement or modification that are equal to; all belong to the content that does not depart from the technical solution of the utility model, within still belonging to protection domain of the present utility model.
Claims (8)
1. regulate a device for cleaning brush pressure, for regulating the pressure of cleaning brush to semiconductor wafer surface, it is characterized in that, described device comprises:
Control system, pressure converter, air pressure valve, gas piping, cylinder, cleaning brush and belt; Wherein, described pressure converter is connected by gas piping with described air pressure valve, and described pressure converter is connected with described control system signal; Described cylinder is connected by gas piping with described air pressure valve; Described cleaning brush is connected by belt with described cylinder.
2. the device of adjusting cleaning brush pressure as claimed in claim 1, is characterized in that, described device also comprises pressure regulator and magnetic valve, and described pressure regulator and magnetic valve are all arranged on gas piping, and described magnetic valve is connected with described control system signal.
3. the device of adjusting cleaning brush pressure as claimed in claim 1, is characterized in that, described cylinder and cleaning brush are 2.
4. the device of adjusting cleaning brush pressure as claimed in claim 3, is characterized in that, described belt is 4.
5. the device of adjusting cleaning brush pressure as claimed in claim 4, is characterized in that, the two ends of described cylinder are equipped with stretching arm, and described belt one end is connected with described stretching arm.
6. the device of adjusting cleaning brush pressure as claimed in claim 5, is characterized in that, described cleaning brush two ends are equipped with the axis of rolling, and the other end of described belt is connected with the described axis of rolling.
7. the device of adjusting cleaning brush pressure as claimed in claim 3, is characterized in that, described semiconductor crystal wafer is placed between described cleaning brush.
8. the device of adjusting cleaning brush pressure as claimed in claim 1, is characterized in that, described cleaning brush surface is provided with some salient points.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320558215.6U CN203484361U (en) | 2013-09-09 | 2013-09-09 | Device of adjusting cleaning brush pressure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320558215.6U CN203484361U (en) | 2013-09-09 | 2013-09-09 | Device of adjusting cleaning brush pressure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203484361U true CN203484361U (en) | 2014-03-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320558215.6U Expired - Fee Related CN203484361U (en) | 2013-09-09 | 2013-09-09 | Device of adjusting cleaning brush pressure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203484361U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106839123A (en) * | 2017-03-28 | 2017-06-13 | 美的集团武汉制冷设备有限公司 | Dust arrester and hanging air conditioner |
| CN109461675A (en) * | 2018-10-18 | 2019-03-12 | 上海华虹宏力半导体制造有限公司 | Detect the cleaning equipment and its cleaning method of position of silicon wafer exception |
-
2013
- 2013-09-09 CN CN201320558215.6U patent/CN203484361U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106839123A (en) * | 2017-03-28 | 2017-06-13 | 美的集团武汉制冷设备有限公司 | Dust arrester and hanging air conditioner |
| CN109461675A (en) * | 2018-10-18 | 2019-03-12 | 上海华虹宏力半导体制造有限公司 | Detect the cleaning equipment and its cleaning method of position of silicon wafer exception |
| CN109461675B (en) * | 2018-10-18 | 2020-10-16 | 上海华虹宏力半导体制造有限公司 | Cleaning equipment for detecting position abnormality of silicon wafer and cleaning method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140319 Termination date: 20190909 |
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| CF01 | Termination of patent right due to non-payment of annual fee |