CN203622204U - Grinding pad adjuster - Google Patents
Grinding pad adjuster Download PDFInfo
- Publication number
- CN203622204U CN203622204U CN201320805343.6U CN201320805343U CN203622204U CN 203622204 U CN203622204 U CN 203622204U CN 201320805343 U CN201320805343 U CN 201320805343U CN 203622204 U CN203622204 U CN 203622204U
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- China
- Prior art keywords
- grinding pad
- pad adjuster
- underlayer
- adjuster
- depressed area
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Abstract
The utility model brings forward a grinding pad adjuster reconditioning a grinding pad. The grinding pad adjuster comprises an underlayer, a plurality of adjusting particles on the surface of the underlayer and a connecting piece fastening the particles onto the surface of the underlayer, wherein the edge of the underlayer is provided with a concave area; with the grinding pad adjuster in the concave area on the edge of the underlayer, adjusting particles in the concave area are placed in a low position, so the adjusting particles have a small contact with the grinding pad and excessive friction between the grinding pad and the adjusting particles due to excessive linear velocity of the underlayer edge is counteracted; and possibility that the adjusting particles on the edge of the underlayer fall is reduced, so scratch to a to-be-grinded wafer is avoided.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of grinding pad adjuster.
Background technology
In semiconductor fabrication process, after filling the films such as copper layer, conventionally need to carry out cmp (CMP) to it and process, grind and remove a part of film, or planarization is carried out in the surface of film.
Please refer to Fig. 1, Fig. 1 is the structure top view of chemical-mechanical grinding device, described chemical-mechanical grinding device comprises grinding pad 10, the grinding head 20 of being close to described grinding pad 10 surfaces and the grinding pad adjuster 30 of being close to described grinding pad 10 surfaces, wherein, wafer is fixed on described grinding head 20, and by be ground facing down, be close to the surface of described grinding pad 10, described grinding head 20 and described grinding pad 10 all rotate, described grinding pad adjuster 30 also can rotate, for the surface of described grinding pad 10 is repaired, and the lapping liquid that is coated in described grinding pad 10 surfaces is smeared evenly, to facilitate, described wafer is ground.
Please refer to Fig. 2, Fig. 2 is the structural representation of described grinding pad adjuster 30, described grinding pad adjuster 30 comprises substrate 31, adjust particle 33 and adjustment particle 33 is fixed on to the attachment 32 on described substrate 31 surfaces for many that are positioned on substrate 31, wherein, described adjustment particle 33 can be arranged in the surface of described substrate 31 uniformly, and described adjustment particle 33 is for adjusting the surface of described grinding pad 10, and described lapping liquid is smeared evenly.
But, because the External Cordon Line speed of described grinding pad adjuster 30 is greater than the linear velocity of inner ring, described grinding pad adjuster 30 is in the adjustment process of described grinding pad 10, the adjustment particle of grinding pad adjuster 30 outer rings is comparatively serious to the friction of described grinding pad 10, can cause the surface of described grinding pad 10 to the grinding rate difference of described wafer, and, the frictional force being subject to due to the adjustment particle 33 of outer ring is larger, the adjustment particle 33 of outer ring comparatively easily comes off, the adjustment particle 33 coming off remains in the surface of described grinding pad 10, can cause the defects such as scratch to the wafer grinding.
Utility model content
The purpose of this utility model is to provide a kind of grinding pad adjuster, can reduce the friction level of grinding pad adjuster outer ring to grinding pad, reduces the probability of outer ring adjustment particle detachment.
To achieve these goals, the utility model proposes a kind of grinding pad adjuster, for grinding pad is repaired, described grinding pad adjuster comprises substrate, be positioned at multiple adjustment particles of substrate surface and for described adjustment particle being fixed on to the attachment of described substrate surface, wherein, the edge of described substrate is provided with depressed area.
Further, described depressed area is annular regions.
Further, the cup depth scope of described depressed area is 0.5mm～1mm.
Further, the recess width scope of described depressed area is 0.5mm～8mm.
Further, total number of described adjustment particle is 1～1000.
Further, the number that is positioned at the adjustment particle of described depressed area is 1～100.
Compared with prior art, the beneficial effects of the utility model are mainly reflected in: use edges of substrate to be provided with the grinding pad adjuster of depressed area, because described edges of substrate exists depressed area, the adjustment particle position that is positioned at described depressed area is lower, less with the contact-making surface of grinding pad, can offset edges of substrate linear velocity excessive and cause and the excessive friction of grinding pad, can also reduce edges of substrate simultaneously and adjust the probability of particle detachment, avoid treating grinding crystal wafer and cause scratch.
Accompanying drawing explanation
Fig. 1 is the structure top view of chemical-mechanical grinding device in prior art;
Fig. 2 is the structural representation of grinding pad adjuster in prior art;
Fig. 3 is the structural profile schematic diagram of grinding pad adjuster in the utility model one embodiment;
Fig. 4 is the front view of grinding pad adjuster in the utility model one embodiment.
The specific embodiment
Below in conjunction with schematic diagram, grinding pad adjuster of the present utility model is described in more detail, wherein represent preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the utility model chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to about system or about the restriction of business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, with way of example, the utility model is more specifically described with reference to accompanying drawing.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Please refer to Fig. 3, in the present embodiment, a kind of grinding pad adjuster has been proposed, for grinding pad is repaired, described grinding pad adjuster comprises substrate 110, be positioned at multiple adjustment particles 130 on substrate 110 surfaces and for described adjustment particle 130 being fixed on to the attachment 120 on described substrate 110 surfaces, wherein, the edge of described substrate 110 is provided with depressed area.
Please refer to Fig. 3 and Fig. 4, in the present embodiment, described depressed area is annular regions, and the cup depth L scope of described depressed area is 0.5mm～1mm, for example, be 0.8mm; The recess width W scope of described depressed area is 0.5mm～8mm, for example, be 2mm; Total number of described adjustment particle 130 is 1～1000, for example, be 500; The number that is positioned at the adjustment particle 130 of described depressed area is 1～100, for example, be 50.
Wherein, described adjustment particle 130 is evenly distributed in the surface of described substrate 110, and it can be close to the surface of grinding pad, for described grinding pad is repaired.
In the present embodiment, described adjustment particle 130 can be diamond grains, its material is comparatively hard, be convenient to the surface of described grinding pad to repair, because its edge of grinding pad adjuster and described grinding pad contact-making surface that the present embodiment proposes are less, its center and described grinding pad contact-making surface are larger, therefore can offset center that described grinding pad adjuster center line velocity causes lower than edge line speed to the friction level of grinding pad compared with defect low and that edge is higher to the friction level of grinding pad, that is to say, can make described grinding pad adjuster even to the friction level of described grinding pad, unanimously.
To sum up, in the grinding pad adjuster providing at the utility model embodiment, use edges of substrate to be provided with the grinding pad adjuster of depressed area, because described edges of substrate exists depressed area, the adjustment particle position that is positioned at described depressed area is lower, less with the contact-making surface of grinding pad, can offset edges of substrate linear velocity excessive and cause and the excessive friction of grinding pad, can also reduce edges of substrate and adjust the probability of particle detachment, avoid treating grinding crystal wafer and cause scratch simultaneously.
Above are only preferred embodiment of the present utility model, the utility model is not played to any restriction.Any person of ordinary skill in the field; not departing from the scope of the technical solution of the utility model; the technical scheme that the utility model is disclosed and technology contents make any type of variations such as replacement or modification that are equal to; all belong to the content that does not depart from the technical solution of the utility model, within still belonging to protection domain of the present utility model.
Claims (6)
1. a grinding pad adjuster, for grinding pad is repaired, it is characterized in that, described grinding pad adjuster comprises substrate, be positioned at multiple adjustment particles of substrate surface and for described adjustment particle being fixed on to the attachment of described substrate surface, wherein, the edge of described substrate is provided with depressed area.
2. grinding pad adjuster as claimed in claim 1, is characterized in that, described depressed area is annular regions.
3. grinding pad adjuster as claimed in claim 2, is characterized in that, the cup depth scope of described depressed area is 0.5mm～1mm.
4. grinding pad adjuster as claimed in claim 2, is characterized in that, the recess width scope of described depressed area is 0.5mm～8mm.
5. grinding pad adjuster as claimed in claim 1, is characterized in that, total number of described adjustment particle is 1～1000.
6. grinding pad adjuster as claimed in claim 1, is characterized in that, the number that is positioned at the adjustment particle of described depressed area is 1～100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320805343.6U CN203622204U (en) | 2013-12-09 | 2013-12-09 | Grinding pad adjuster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320805343.6U CN203622204U (en) | 2013-12-09 | 2013-12-09 | Grinding pad adjuster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203622204U true CN203622204U (en) | 2014-06-04 |
Family
ID=50808722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320805343.6U Expired - Fee Related CN203622204U (en) | 2013-12-09 | 2013-12-09 | Grinding pad adjuster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203622204U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106625248A (en) * | 2017-01-26 | 2017-05-10 | 北京清烯科技有限公司 | High-flattening chemical mechanical grinding pad trimmer with large diamond monocrystals |
| CN106826601A (en) * | 2017-01-26 | 2017-06-13 | 北京清烯科技有限公司 | The method of CMP pad dresser of the manufacture with bitellos monocrystalline |
-
2013
- 2013-12-09 CN CN201320805343.6U patent/CN203622204U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106625248A (en) * | 2017-01-26 | 2017-05-10 | 北京清烯科技有限公司 | High-flattening chemical mechanical grinding pad trimmer with large diamond monocrystals |
| CN106826601A (en) * | 2017-01-26 | 2017-06-13 | 北京清烯科技有限公司 | The method of CMP pad dresser of the manufacture with bitellos monocrystalline |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140604 Termination date: 20191209 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |