CN209929281U - Wafer conveying device - Google Patents
Wafer conveying device Download PDFInfo
- Publication number
- CN209929281U CN209929281U CN201920535592.5U CN201920535592U CN209929281U CN 209929281 U CN209929281 U CN 209929281U CN 201920535592 U CN201920535592 U CN 201920535592U CN 209929281 U CN209929281 U CN 209929281U
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- Prior art keywords
- wafer
- positioning unit
- limiting
- conveying device
- bearing part
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- 230000000712 assembly Effects 0.000 claims description 13
- 238000000429 assembly Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 125
- 230000005540 biological transmission Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000012634 fragment Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a wafer conveyer, include: the bearing part and at least one group of fixing components; the fixing assembly includes: a positioning unit and a limiting unit; the spacing unit includes: the limiting part can move on the rail from a first position and stop at a second position when the sensor senses the wafer, and the limiting part is matched with the positioning unit to effectively fix the wafer, so that the wafer can be kept fixed relative to the wafer conveying device in the conveying process, the condition that the wafer deviates from the original position on the wafer conveying device and even breaks away from the wafer conveying device and falls into the vacuum cavity is avoided, the wafer breakage accident rate is reduced, and the product yield and quality are improved.
Description
Technical Field
The utility model relates to a semiconductor manufacturing equipment technical field, in particular to wafer conveyer.
Background
Silicon wafers (wafers) having a diameter of 300mm (i.e., 12 inches) or more are transported on a production line by a wafer transport device in a vacuum chamber of a semiconductor machine. The existing wafer transmission device is provided with four rubber rings which are distributed in a square shape, and when a wafer is transmitted, the wafer is fixed by means of friction force generated by contact of the rubber rings and the wafer, so that the wafer is kept fixed relative to the wafer transmission device in the transmission process. However, when the wafer is transported by using the conventional wafer transport apparatus, the wafer is likely to be displaced on the wafer transport apparatus, and even the wafer is thrown off the wafer transport apparatus and falls into the vacuum chamber, which may cause chipping. Therefore, it is necessary to develop a transfer apparatus capable of preventing the wafer from being displaced during the transfer process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer conveyer to solve the problem that the wafer squinted on wafer conveyer in data send process.
In order to solve the above technical problem, the utility model provides a wafer conveyer, include: the bearing part and at least one group of fixing components are arranged on the bearing part;
the fixing assembly includes: the positioning unit and the limiting unit are oppositely arranged on the bearing part, and the positioning unit and the limiting unit can limit a wafer bearing area;
the spacing unit includes: the wafer fixing device comprises a limiting part, a track and a sensor, wherein the sensor is installed on the limiting part, the limiting part is installed on the track, the track is arranged on the bearing part, the limiting part can move from a first position on the track, and stops at a second position when the sensor senses a wafer, and the limiting part is matched with the positioning unit to fix the wafer.
Optionally, in the wafer transferring apparatus, the number of the fixing assemblies is multiple, and the multiple fixing assemblies are disposed on the carrying portion at equal intervals.
Optionally, in the wafer transfer apparatus, the fixing assembly further includes: the supporting structures are arranged in an array and are arranged on the bearing part between the positioning unit and the track.
Optionally, in the wafer transfer device, in each group of the fixing assemblies, the number of the support structures is greater than or equal to 4, and the top surfaces of the support structures have an anti-slip structure.
Optionally, in the wafer transfer device, the positioning unit has an arc-shaped side surface, and the arc-shaped side surface is opposite to the position-limiting members of the same group.
Optionally, in the wafer transfer device, the positioning unit includes: the angle guiding structure comprises a plurality of angle guiding structures, wherein each angle guiding structure is provided with an arc-shaped side surface, and the arc-shaped side surfaces of the angle guiding structures correspond to the same circle center.
Optionally, in the wafer transfer device, the degree of the central angle corresponding to the arc-shaped side surface of each of the chamfering structures is between 20 ° and 25 °.
Optionally, in the wafer transfer device, the position limiting unit further includes: and the driving motor is arranged on the bearing part and is electrically connected with the limiting part and the sensor.
Optionally, in the wafer transfer device, the length of the rail is between 20mm and 40mm, and in each set of the fixing assemblies, the distance between one end of the rail close to the positioning unit and the positioning unit is between 300mm and 340 mm.
Optionally, in the wafer transfer device, the height of the limiting member is between 2mm and 9 mm; the height of the positioning unit is between 2mm and 9 mm.
Optionally, in the wafer transfer device, the wafer transfer device further includes: the handle part is connected with the bearing part, the movable rod is connected with the handle part, and the movable rod can drive the bearing part to move.
The utility model provides an among the wafer conveyer, include: the bearing part and at least one group of fixing components; the fixing assembly includes: a positioning unit and a limiting unit; the spacing unit includes: the limiting piece can move on the rail from a first position, stops at a second position when the sensor senses a wafer, and is matched with the positioning unit to fix the wafer, so that the wafer can be kept fixed relative to the wafer conveying device in the conveying process, the condition that the wafer deviates from an original position and even is separated from the wafer conveying device and falls into a vacuum cavity is avoided, the wafer breakage accident rate is reduced, and the product yield and quality are improved; furthermore, the sensor is installed on the limiting part, so that the limiting part can be stopped in time on the way of moving towards the wafer direction by effectively sensing the placed wafer, the risk that the limiting part damages the wafer is avoided, and the reliability and the safety of the wafer conveying device are improved. In addition, the number of wafers which can be transmitted by the wafer transmission device at one time is increased by the multiple groups of fixing assemblies on the bearing part, and the working efficiency of the wafer transmission device is improved.
Drawings
Fig. 1 is a schematic view of a wafer transfer apparatus according to an embodiment of the present invention;
fig. 2 is a schematic view of another wafer transfer apparatus according to an embodiment of the present invention;
wherein,
11-bearing part, 12-fixing component, 121-positioning unit, 122-limiting part, 123-track, 124-sensor, 125-supporting structure, 15-holding part, 16-movable rod.
Detailed Description
The wafer transfer apparatus according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more fully apparent from the following description and appended claims. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.
The conventional wafer conveying device is provided with the anti-slip rubber ring, but after the anti-slip rubber ring is used for a long time, the friction force between the anti-slip rubber ring and the wafer is gradually reduced, so that the position of the wafer on the wafer conveying device is easily deviated, and even the dangerous condition that the wafer is thrown out of the wafer conveying device and falls into a vacuum cavity to cause fragment occurs.
Referring to fig. 1, fig. 1 is a schematic view of a wafer transferring apparatus according to an embodiment of the present invention. As shown in fig. 1, the wafer transfer apparatus includes: the bearing part 11 and at least one group of fixing components 12 are arranged on the bearing part 11.
Wherein the fixing assembly 12 comprises: the positioning unit 12 and the limiting unit can limit a wafer carrying area by being opposite to the positioning unit 121 and the limiting unit arranged on the carrying part.
Further, the spacing unit includes: the sensor is mounted on the limiting member 122, the limiting member 122 is mounted on the rail 123, the rail 123 is disposed on the bearing portion 11, the limiting member 122 can move on the rail 123 from a first position and stop at a second position when the sensor 122 senses a wafer, and the limiting member 122 cooperates with the positioning unit 121 to fix the wafer, so that the wafer can be kept fixed relative to the wafer conveying device in the conveying process, the situation that the wafer deviates from an original position and even breaks away from the wafer conveying device and falls into a vacuum chamber is avoided, the wafer breakage accident rate is reduced, and the product yield and quality are improved.
Preferably, the height of the limiting member 122 is between 2mm and 9 mm; the height of the positioning unit 121 is between 2mm and 9mm, and the height of the limiting member 122 and the height of the positioning unit 121 may be set according to the actual thickness of the wafer to be transferred, and preferably set to be 2mm to 3mm higher than the upper surface of the wafer, so as to facilitate the taking and placing of the wafer. Relatively speaking, the height of the limiting member 122 and the height of the positioning unit 121 should not be designed to be too large, and if the height of the limiting member 122 and the height of the positioning unit 121 are designed to be too large, a long alignment placing or taking distance is required when the wafer is placed or taken, which may increase the time and difficulty when the wafer is placed or taken, and reduce the working efficiency; on the contrary, if the height of the limiting member 122 and the height of the positioning unit 121 are reasonably designed, the wafer can be effectively fixed, the time for taking and placing can be shortened, and the working efficiency can be improved.
Furthermore, the number of the fixing assemblies 12 is multiple, and the multiple fixing assemblies 12 are disposed on the bearing portion 11 at equal intervals. It can be seen that the number of said fixing assemblies 12 in figure 1 is 2 groups. Referring to fig. 2, fig. 2 is a schematic view of another wafer transferring apparatus according to an embodiment of the present invention, and it can be seen that the number of the fixing members 12 in fig. 2 is 4. The number of wafers which can be transferred by the wafer transfer device at one time is increased by the multiple groups of fixing components 12 on the bearing part 11, the working efficiency of the wafer transfer device is improved, and the number of the fixing components is not limited in the application.
Preferably, the fixing assembly 12 further comprises: a plurality of supporting structures 125, wherein the supporting structures 125 are arranged in an array and are disposed on the bearing part 11 between the positioning unit 121 and the rail 123. Specifically, in each set of the fixing assemblies 12, the number of the support structures 125 is greater than or equal to 4, the support structures 125 have a specific height, and the height of the support structures 125 may be selected to be between 3mm and 6mm, so that the wafer does not need to contact the carrier part 11, and impurities adhering to the carrier part 11 are avoided. Here, if the height of the supporting structure 125 is 3mm, the heights of the limiting member 122 and the positioning unit 121 are preferably 5mm to 6 mm; if the height of the supporting structure 125 is 4.5mm, the heights of the limiting member 122 and the positioning unit 121 are preferably 6.5mm to 7.5 mm. Preferably, the top surface of the supporting structure 125 has an anti-slip structure (not shown), which can effectively increase the friction between itself and the wafer, so as to avoid the situation that the wafer deviates from the original position and even breaks away from the wafer conveying device and falls into the vacuum chamber, and reduce the wafer breakage accident rate.
Further, the positioning unit 121 has an arc-shaped side surface, the arc-shaped side surface is opposite to the limiting members 121 in the same group, and the arc-shaped side surface of the positioning unit 121 corresponds to an edge of a wafer to be transferred. Preferably, the arc-shaped side surface of the positioning unit 121 is provided with a buffer structure (not shown), which can effectively prevent the edge and the surface of the wafer from being damaged by the positioning unit 121 during the process of placing or transferring, thereby further reducing the accident rate of wafer breakage.
In this embodiment, the positioning unit 121 includes: each of the plurality of chamfering structures has an arc-shaped side surface, and the arc-shaped side surfaces of the chamfering structures correspond to the same center of circle, which coincides with the center of circle of the wafer to be transferred, which is placed between the positioning unit 121 and the limiting member 122. Specifically, the degree of the central angle corresponding to the arc-shaped side surface of each lead angle structure is between 20 degrees and 25 degrees.
Further, the limiting unit further comprises: a driving motor (not shown) installed on the bearing portion 11 and electrically connected to the limiting member 122, wherein the sensor 122 can drive the limiting member 122 to move in the track 123. In an embodiment of the present invention, the wafer transferring apparatus further includes a controller, the controller is electrically connected to the sensor 124 and the driving motor, the sensor 124 sends an obstacle meeting signal to the controller when sensing a wafer, the controller sends a stop motion signal to the driving motor after receiving the obstacle meeting signal, and the driving motor stops moving immediately after receiving the stop motion signal. At this time, the limiting member 122 and the positioning unit 121 cooperatively define an immovable carrying region for the wafer, so that the wafer can be kept fixed relative to the wafer transferring apparatus during the transferring process, thereby improving the safety and reliability of the wafer apparatus. Furthermore, the sensor 124 can effectively sense the wafer being placed, so that the limiting member 122 stops moving in the wafer direction in time, thereby avoiding the risk that the limiting member 122 damages the wafer, and further improving the reliability and safety of the wafer conveying apparatus.
In this embodiment, the length of the rail 123 is preferably between 20mm and 40mm, in each set of the fixing assemblies 12, the distance between one end of the rail 123 close to the positioning unit 121 and the positioning unit 121 is between 300mm and 340mm, in this embodiment, the diameter of the silicon wafer (wafer) transferred by the wafer transfer device is 300mm (i.e. 12 inches) or more, the distance between one end of the rail 123 close to the positioning unit 121 and the positioning unit 121 may be set according to the actual diameter of the wafer transferred by the tape, and the distance between one end of the rail 123 close to the positioning unit 121 and the positioning unit 121 is not limited in this application. Further, in the embodiment, the width of the limiting member 122 is between 10mm and 30mm, and the wider limiting member 122 can increase the area of contact with the wafer, thereby reducing the pressure on the wafer when the limiting member 122 contacts with the wafer.
Preferably, the wafer transfer apparatus further includes: a holding part 15 and a movable rod 16, wherein the holding part 15 is connected with the bearing part 11, and the movable rod 16 is connected with the holding part 15. Preferably, the number of the fixing components 12 on the carrying part 11 on both sides of the holding part 15 is symmetrical, which improves the balance of the wafer conveying device. The movable rod 16 can drive the bearing part 11 and the fixed components on the bearing part 11 to move, the movable rod 16 and the holding part 15 which are used in a matched mode can take the bearing part 11 on the first station and place the bearing part 11 on the second station according to operation requirements, the holding part 15 can hold or loosen the bearing part 11, and flexibility of the wafer conveying device is improved.
To sum up, the utility model provides a wafer conveyer, include: the bearing part and at least one group of fixing components; the fixing assembly includes: a positioning unit and a limiting unit; the spacing unit includes: the limiting part can move on the rail from a first position, stops at a second position when the sensor senses a wafer, and is matched with the positioning unit to fix the wafer, so that the wafer can be kept fixed relative to the wafer conveying device in the conveying process, the condition that the wafer deviates from an original position and even breaks away from the wafer conveying device and falls into a vacuum cavity is avoided, the wafer breakage accident rate is reduced, and the product yield and quality are improved; furthermore, the sensor is arranged on the limiting piece, so that the limiting piece can be effectively induced to the placed wafer to be stopped in time on the way of moving towards the wafer direction, the risk that the limiting piece damages the wafer is avoided, and the reliability and the safety of the wafer conveying device are improved; in addition, the number of wafers which can be transmitted by the wafer transmission device at one time is increased by the multiple groups of fixing assemblies on the bearing part, and the working efficiency of the wafer transmission device is improved.
Claims (11)
1. A wafer transfer apparatus, comprising: the bearing part and at least one group of fixing components are arranged on the bearing part;
the fixing assembly includes: the positioning unit and the limiting unit are oppositely arranged on the bearing part, and the positioning unit and the limiting unit can limit a wafer bearing area;
the spacing unit includes: the wafer fixing device comprises a limiting part, a track and a sensor, wherein the sensor is installed on the limiting part, the limiting part is installed on the track, the track is arranged on the bearing part, the limiting part can move from a first position on the track, and stops at a second position when the sensor senses a wafer, and the limiting part is matched with the positioning unit to fix the wafer.
2. The wafer conveying device according to claim 1, wherein the number of the fixing elements is plural, and the plural fixing elements are disposed on the carrying portion at equal intervals.
3. The wafer transfer device of claim 1, wherein the retaining assembly further comprises: the supporting structures are arranged in an array and are arranged on the bearing part between the positioning unit and the track.
4. The wafer conveying device as claimed in claim 3, wherein in each set of the fixing assemblies, the number of the supporting structures is greater than or equal to 4, and the top surfaces of the supporting structures are provided with anti-slip structures.
5. The wafer transfer device of claim 1, wherein the positioning unit has an arc-shaped side surface, and the arc-shaped side surface is opposite to the position-limiting members of the same group.
6. The wafer transfer device of claim 5, wherein the positioning unit comprises: the angle guiding structure comprises a plurality of angle guiding structures, wherein each angle guiding structure is provided with an arc-shaped side surface, and the arc-shaped side surfaces of the angle guiding structures correspond to the same circle center.
7. The wafer transfer device of claim 6, wherein the degree of the central angle corresponding to the arc-shaped side surface of each lead angle structure is between 20 ° and 25 °.
8. The wafer conveying device according to any of claims 1 to 7, wherein the limiting unit further comprises: and the driving motor is arranged on the bearing part and is electrically connected with the limiting part and the sensor.
9. The wafer conveying device according to any one of claims 1 to 7, wherein the length of the rail is between 20mm and 40mm, and in each set of the fixing assemblies, the distance between one end of the rail close to the positioning unit and the positioning unit is between 300mm and 340 mm.
10. The wafer conveying device according to any of claims 1 to 7, wherein the height of the position-limiting member is between 2mm and 9 mm; the height of the positioning unit is between 2mm and 9 mm.
11. The wafer transfer device of claim 1, further comprising: the handle part is connected with the bearing part, the movable rod is connected with the handle part, and the movable rod can drive the bearing part to move.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920535592.5U CN209929281U (en) | 2019-04-18 | 2019-04-18 | Wafer conveying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920535592.5U CN209929281U (en) | 2019-04-18 | 2019-04-18 | Wafer conveying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209929281U true CN209929281U (en) | 2020-01-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920535592.5U Expired - Fee Related CN209929281U (en) | 2019-04-18 | 2019-04-18 | Wafer conveying device |
Country Status (1)
| Country | Link |
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| CN (1) | CN209929281U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013082A (en) * | 2021-03-01 | 2021-06-22 | 晋美玉 | Fixture mechanism for wafer detection |
-
2019
- 2019-04-18 CN CN201920535592.5U patent/CN209929281U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113013082A (en) * | 2021-03-01 | 2021-06-22 | 晋美玉 | Fixture mechanism for wafer detection |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200110 |