CN219811477U

CN219811477U - Wafer bearing device and wafer film tearing machine

Info

Publication number: CN219811477U
Application number: CN202320938072.5U
Authority: CN
Inventors: 彭跃
Original assignee: Semiconductor Manufacturing Electronics Shaoxing Corp SMEC
Current assignee: Semiconductor Manufacturing Electronics Shaoxing Corp SMEC
Priority date: 2023-04-19
Filing date: 2023-04-19
Publication date: 2023-10-10
Anticipated expiration: 2033-04-19

Abstract

The utility model provides a wafer bearing device and a wafer film tearing machine table, wherein the wafer bearing device comprises a base, an adsorption ring, a sucker and a lifting assembly, and a through hole is formed in the surface of the base; the adsorption ring is arranged in the through hole around the inner wall of the through hole, and is connected with the base; the sucking disc is arranged in an inner cavity formed by encircling the sucking ring; the lifting assembly is connected with the sucker and can move along a first direction perpendicular to the surface of the sucker; the suction ring is used for sucking the edge part of the back surface of the wafer, and the suction disc is used for sucking the back surface of the wafer. The wafer bearing device and the wafer film tearing machine provided by the utility model can solve the problem that the bearing table plate needs to be frequently replaced when different types of wafers are borne in the prior art.

Description

Wafer bearing device and wafer film tearing machine

Technical Field

The present utility model relates to the field of semiconductor devices, and in particular, to a wafer carrier and a wafer film tearing machine.

Background

In the process of manufacturing a semiconductor, for various purposes, film pasting or film tearing operations are often required to be performed on a wafer, for example, in the process of thinning the wafer, thinning is required to be performed on the back surface of the wafer, in a specific process, a protective film is firstly attached to the front surface of the wafer, then grinding and thinning are performed on the back surface of the wafer, and in the grinding process, the film pasting can protect the front surface of the wafer. After the thinning process is completed, the film on the front surface of the wafer needs to be torn off.

In the film pasting or film tearing process, the back surface of the wafer is required to be placed on the table disc downwards, so that the back surface of the wafer is closely attached to the upper surface of the table disc, the front surface of the wafer is exposed, and at the moment, the film pasting operation can be carried out on the front surface of the wafer, or the protective film attached to the front surface of the wafer is torn off.

However, the method is only suitable for wafers with traditional shapes, is not suitable for wafers obtained by the Taiko thinning process, remains the edge part of the wafer when the back surface of the wafer is subjected to grinding treatment in the Taiko thinning process, only grinds and thins the middle part of the wafer, and can reduce the warpage of the wafer. The wafer thus obtained has a ring of annular projections formed on the back edge portion of the wafer. The thinned wafer cannot be closely attached to a common table due to the grooves on the back surface, and a special non-contact table is required to be used for bearing the wafer processed by the Taiko process.

Therefore, in the prior art, when performing the film tearing operation on different types of wafers, the wafer carrying table of the film tearing machine needs to be replaced in a targeted manner according to the types of the wafers, and even different types of wafers need to be processed by using different types of film tearing machines. The bearing table plate is repeatedly replaced, so that on one hand, the bearing table plate needs to be detached and installed for a long time, the process time is prolonged, and the production efficiency is low; on the other hand, frequent replacement may cause abrasion of the carrying table, or during the replacement, carry in contaminating particles on the carrying table, resulting in particle contamination to the wafer when the wafer is subsequently adsorbed.

Disclosure of Invention

The utility model aims to provide a wafer bearing device and a wafer film tearing machine table, which are used for solving the problem that a bearing table plate needs to be frequently replaced when different types of wafers are borne in the prior art.

In order to solve the technical problems, the utility model provides a wafer bearing device, which comprises a base, an adsorption ring, a sucker and a lifting assembly, wherein a through hole is formed in the surface of the base; the adsorption ring is arranged in the through hole around the inner wall of the through hole, and is connected with the base; the sucking disc is arranged in an inner cavity formed by encircling the sucking ring; the lifting assembly is connected with the sucker and can move along a first direction perpendicular to the surface of the sucker; the suction ring is used for sucking the edge part of the back surface of the wafer, and the suction disc is used for sucking the back surface of the wafer.

Further, the lifting assembly drives the sucker to move to a first position and a second position along a first direction; the upper surface of the sucker is flush with the upper end surface of the adsorption ring when the sucker moves to the first position; when the sucker moves to the second position, the upper surface of the sucker is lower than the upper end surface of the adsorption ring.

Further, a plurality of first vacuum adsorption holes are formed in the upper end face of the adsorption ring.

Further, a plurality of first vacuum adsorption holes are circumferentially arranged on the upper end face of the adsorption ring at intervals.

Further, a plurality of second vacuum adsorption holes are formed in the upper surface of the sucker.

Further, the annular outer wall of the adsorption ring is connected with the inner wall of the through hole of the base.

Further, a gap exists between the annular outer wall of the sucker and the annular inner wall of the adsorption ring.

Further, the lifting assembly comprises a plurality of sliding rails and a sleeve matched with the sliding rails, one end of the sleeve is fixed, one end of the sliding rail is connected with the sucker, the other end of the sliding rail penetrates through the corresponding other end of the sleeve to be arranged in the sleeve in a sliding mode, and the sliding rail can slide relative to the sleeve along the first direction.

Further, the number of the sliding rails is 4, one end of each sliding rail is connected with the lower end face of each sucker, and the connection points of the 4 sliding rails and the sucker are uniformly distributed on the lower end face of each sucker along the circumferential direction.

The utility model also provides a wafer film tearing machine, which comprises the wafer bearing device.

In summary, the utility model provides a wafer carrying device, by matching the suction ring with the suction cup, the suction cup can move up and down in the suction ring, when the suction cup and the suction ring jointly suck a wafer, the suction cup can suck the central part of the back of the wafer, and the suction ring sucks the edge part of the back of the wafer, and the suction ring are matched with each other, so that the suction carrying of a general wafer can be effectively realized; when a wafer obtained by a special process, such as a wafer obtained by a Taiko thinning process, or other wafers needing non-contact operation is needed to be carried, the suction cup is lowered, so that the suction ring can be used for singly sucking the edge part of the back surface of the wafer, for example, the edge of the back surface of the wafer obtained by the Taiko thinning process is annular and convex and is in a middle concave shape, and at the moment, the suction ring can be used for exactly sucking the edge part of the back surface of the wafer and the center part of the back surface of the wafer is basically suspended by the suction carrying mode, so that non-contact operation is realized. Therefore, by means of ascending and descending of the sucker, wafers of different types can be loaded and adsorbed according to requirements, common wafers can be adsorbed and loaded in a full-contact adsorption mode, and wafers with special processes can be adsorbed and loaded in a non-contact adsorption mode. In addition, when the scheme of the utility model is used for adsorbing and carrying wafers of different types, the sucker does not need to be replaced, so that the time of subsequent operation is reduced, the problem of abrasion of the sucker caused by frequent replacement of the sucker is avoided, and particle pollution is not introduced.

Drawings

FIG. 1 is a schematic view of a wafer carrier according to an embodiment of the present utility model;

FIG. 2 is a schematic view of a susceptor in a wafer carrier according to an embodiment of the present utility model;

fig. 3 and 4 are schematic structural views of an adsorption ring in a wafer carrier according to an embodiment of the utility model;

FIG. 5 is a schematic view of a chuck in a wafer carrier according to an embodiment of the utility model;

fig. 6-8 are schematic views illustrating a wafer carrier apparatus for adsorbing a wafer according to an embodiment of the utility model.

Wherein, the reference numerals are as follows:

10-a base; 20-an adsorption ring; 30-sucking discs; 40-lifting assembly; 50-wafer; 11-through holes; 21-a first vacuum adsorption hole; 31-a second vacuum adsorption hole; 41-sliding rails; 42-sleeve.

Detailed Description

The wafer carrying device and the wafer film tearing machine provided by the utility model are further described in detail below with reference to the accompanying drawings and the detailed description. The advantages and features of the present utility model will become more apparent from the following description.

It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for the purpose of facilitating and clearly aiding in the description of embodiments of the utility model. For a better understanding of the utility model with objects, features and advantages, refer to the drawings. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that any modifications, changes in the proportions, or adjustments of the sizes of structures, proportions, or otherwise, used in the practice of the utility model, are included in the spirit and scope of the utility model which is otherwise, without departing from the spirit or essential characteristics thereof.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and to simplify the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

In this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

As shown in fig. 1 to 8, the wafer carrying device provided by the utility model comprises a base 10, an adsorption ring 20, a sucker 30 and a lifting assembly 40, wherein a through hole 11 is formed on the surface of the base 10; the adsorption ring 20 is arranged in the through hole 11 around the inner wall of the through hole 11, and the adsorption ring 20 is connected with the base 10; the sucking disc 30 is arranged in an inner cavity formed by enclosing the sucking ring 20; the lifting assembly 40 is connected with the sucker 30, and the lifting assembly 40 is movable along a first direction perpendicular to the surface of the sucker 30; the suction ring 20 is used for sucking the edge portion of the back surface of the wafer 50, and the suction cup 30 is used for sucking the back surface of the wafer 50. In the embodiment of the utility model, the suction cup 30 can move up and down in the suction cup 20 by matching the suction cup 30 with the suction cup 20, when the suction cup 30 and the suction cup 20 jointly suck the wafer 50, the suction cup 30 can suck the central part of the back surface of the wafer 50, and the suction cup 20 sucks the edge part of the back surface of the wafer 50, and the suction cup are matched with each other, so that the suction load of the general wafer 50 can be effectively realized, as shown in fig. 6; when the wafer obtained by the special process is required to be carried, as shown in fig. 7 and 8, for example, a wafer obtained by the Taiko thinning process, or other wafers required to be subjected to non-contact operation, the suction cup 30 is lowered to enable the suction ring 20 to individually suck the edge portion of the back surface of the wafer 50, for example, a wafer obtained by the Taiko thinning process, the edge of the back surface of the wafer 50 is in a ring-shaped bulge and takes on a shape of a middle recess, and at this time, by adopting the suction carrying manner, the suction ring 20 can exactly suck the edge portion of the back surface of the wafer 50, and the center portion of the back surface of the wafer 50 is basically suspended, so that the non-contact operation is realized. In this way, by the ascending and descending of the sucker 30, different types of wafers can be loaded and absorbed according to the requirement, and the wafer with special process can be absorbed and carried in a full contact absorption mode or a non-contact absorption mode. In addition, when the scheme of the utility model is used for adsorbing and carrying wafers of different types, the sucker does not need to be replaced, so that the time of subsequent operation is reduced, the problem of abrasion of the sucker caused by frequent replacement of the sucker is avoided, and particle pollution is not introduced.

In the solution of the present utility model, the lifting assembly 40 moves to drive the suction cup 30 to move to the first position and the second position along the first direction; when the suction cup 30 moves to the first position, the upper surface of the suction cup 30 is flush with the upper end surface of the suction ring 20, so as to realize full contact suction bearing on the back surface of the wafer 50; when the suction cup 30 moves to the second position, the upper surface of the suction cup 30 is lower than the upper end surface of the suction ring 20, so that a concave groove is formed in the middle, and when the wafer 50 is carried, only the upper end surface of the suction ring 20 sucks the edge part of the back surface of the wafer 50, and the center part of the back surface of the wafer 50 is suspended, so that the non-contact suction bearing of the wafer with special process is realized.

Further, a plurality of first vacuum adsorption holes 21 are formed on the upper end surface of the adsorption ring 20. A plurality of first vacuum adsorption holes 21 are circumferentially arranged on the upper end surface of the adsorption ring 20 at intervals. The bottoms of the plurality of first vacuum adsorption holes 21 can be communicated with each other through a channel formed in the adsorption ring 20, and then are communicated with an external vacuumizing device, so that the plurality of first vacuum adsorption holes 21 can be kept in a vacuum state through the operation of the external vacuumizing device, and when the wafer 50 is placed on the adsorption ring 20, the edge part of the back surface of the wafer 50 is firmly adsorbed on the upper end surface of the adsorption ring 20 through the first vacuum adsorption holes 21. The shape of the first vacuum suction hole 21 is not limited in the present utility model, and may be a circular hole, or a bar-shaped hole, for example, an arc-shaped waist-shaped hole matching the shape of the suction ring 20, or the like.

Similarly, a plurality of second vacuum adsorption holes 31 are formed in the upper surface of the sucker 30, the bottoms of the second vacuum adsorption holes 31 are mutually communicated and then connected with an external vacuumizing device, and the sucker 30 is used for adsorbing the center part of the back surface of the wafer 50. Wherein, the second vacuum adsorption holes 31 are uniformly distributed on the upper surface of the chuck 30 to ensure uniformity of the wafer adsorption force everywhere.

The external vacuumizing device used by the adsorption ring 20 and the sucker 30 can be shared by one device, or can be respectively and independently connected with one vacuumizing device, so that independent control of the adsorption ring 20 and the sucker 30 is realized.

As an implementation manner of the present utility model, the through hole 11 on the base 10 is a cylindrical through hole, the adsorption ring 20 is a matched circular ring with a certain thickness, and the annular outer wall of the adsorption ring 20 is directly connected with the inner wall of the through hole 11 of the base 10. For example, the annular outer wall of the suction ring 20 and the annular inner wall of the through hole 11 may be connected together by welding, bonding, bolting, or the like, thereby fixing the suction ring 20 to the base 10.

Preferably, a gap exists between the annular outer wall of the suction cup 30 and the annular inner wall of the suction ring 20. This allows the suction cup 30 to be lifted up and down freely without being affected by the suction ring 20. Taking the conventional wafer size of about 200mm as an example, the diameter of the through hole 11 formed on the base 10 may be 203-205mm, and the diameter of the adsorbing ring 20 may be 194-195mm, which is slightly smaller than the size of the wafer, so that when the wafer is placed on the adsorbing ring 20, the first adsorbing hole 21 on the adsorbing ring 20 can be ensured to effectively adsorb the edge portion of the back surface of the wafer. The size of the middle sucking disc 30 can be 190-192mm, so that a certain gap is kept between the sucking disc 30 and the sucking ring 20 on one hand, and enough sucking and supporting sites can be provided for the back of the wafer on the other hand.

Further, in the present utility model, the lifting assembly 40 may include a plurality of sliding rails 41 and a sleeve 42 matched with the sliding rails 41, one end of the sleeve 42 is fixed, one end of the sliding rail 41 is connected with the suction cup 30, the other end of the sliding rail 41 is slidably disposed in the sleeve 42 through the other end of the corresponding sleeve 42, and the sliding rail 41 is slidable relative to the sleeve 42 along the first direction. By this design, the sliding rail 41 can drive the sucking disc 30 to do lifting movement when sliding. The sliding rail 41 can be directly driven by a motor to realize lifting motion, for example, a high-precision servo motor can be used for driving the sliding rail 41 to move to a specified path, so that the accurate adjustment of the lifting position of the sucker 30 is realized.

Preferably, the number of the sliding rails 41 is 4, one end of the sliding rail 41 is connected with the lower end face of the sucker 30, and connection points of the 4 sliding rails 41 and the sucker 30 are circumferentially and uniformly distributed on the lower end face of the sucker so as to stably support the sucker 30.

The wafer bearing device provided by the utility model can be applied to a wafer film tearing machine, so the utility model also provides the wafer film tearing machine, which comprises the wafer bearing device.

The above description is only illustrative of the preferred embodiments of the present utility model and is not intended to limit the scope of the present utility model, and any changes and modifications made by those skilled in the art in light of the above disclosure are intended to fall within the scope of the appended claims. It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. The wafer carrying device is characterized by comprising a base, an adsorption ring, a sucker and a lifting assembly,

the surface of the base is provided with a through hole;

the adsorption ring is arranged in the through hole around the inner wall of the through hole, and is connected with the base;

the sucking disc is arranged in an inner cavity formed by encircling the sucking ring;

the lifting assembly is connected with the sucker and can move along a first direction perpendicular to the surface of the sucker;

the suction ring is used for sucking the edge part of the back surface of the wafer, and the suction disc is used for sucking the back surface of the wafer.

2. The wafer carrier of claim 1, wherein the lift assembly moves the chuck in a first direction to a first position and a second position;

the upper surface of the sucker is flush with the upper end surface of the adsorption ring when the sucker moves to the first position; when the sucker moves to the second position, the upper surface of the sucker is lower than the upper end surface of the adsorption ring.

3. The wafer carrier of claim 1, wherein a plurality of first vacuum suction holes are formed in an upper end surface of the suction ring.

4. A wafer carrier apparatus according to claim 3, wherein a plurality of the first vacuum suction holes are circumferentially spaced apart on an upper end face of the suction ring.

5. The wafer carrier of claim 1, wherein the upper surface of the chuck is provided with a plurality of second vacuum suction holes.

6. The wafer carrier of claim 1, wherein the annular outer wall of the suction ring is connected to an inner wall of the through-hole of the susceptor.

7. The wafer carrier of claim 1, wherein a gap exists between an annular outer wall of the chuck and an annular inner wall of the suction ring.

8. The wafer carrier of claim 1, wherein the lifting assembly comprises a plurality of slide rails and a sleeve mated with the slide rails, one end of the sleeve is fixed, one end of the slide rail is connected to the suction cup, the other end of the slide rail is slidably disposed in the sleeve through the corresponding other end of the sleeve, and the slide rail is slidable relative to the sleeve along the first direction.

9. The wafer carrier of claim 8, wherein the number of the sliding rails is 4, one end of the sliding rails is connected with the lower end surface of the suction cup, and connection points of the 4 sliding rails and the suction cup are uniformly distributed on the lower end surface of the suction cup along the circumferential direction.

10. A wafer film tearing apparatus comprising the wafer carrier of any one of claims 1-9.