CN109442607A - Semiconductor dehumidifying device and its control method - Google Patents
Semiconductor dehumidifying device and its control method Download PDFInfo
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- CN109442607A CN109442607A CN201811542022.5A CN201811542022A CN109442607A CN 109442607 A CN109442607 A CN 109442607A CN 201811542022 A CN201811542022 A CN 201811542022A CN 109442607 A CN109442607 A CN 109442607A
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- dehumidifying device
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- temperature
- chilling plate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000009833 condensation Methods 0.000 claims abstract description 68
- 230000005494 condensation Effects 0.000 claims abstract description 68
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 59
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 238000007791 dehumidification Methods 0.000 claims abstract description 21
- 238000004891 communication Methods 0.000 claims abstract description 19
- 239000012530 fluid Substances 0.000 claims abstract description 19
- 238000003860 storage Methods 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 13
- 230000001276 controlling effect Effects 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 230000003044 adaptive effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000001914 filtration Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 230000005679 Peltier effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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- 230000008014 freezing Effects 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
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- 238000004659 sterilization and disinfection Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/64—Electronic processing using pre-stored data
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
- F24F11/80—Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/10—Temperature
Abstract
The invention discloses a kind of semiconductor dehumidifying device and its control method, which includes: inlet end and the outlet side of fluid communication；Dehumidification by condensation unit, including condensation end, semiconductor chilling plate, radiator and the cooling fan stacked gradually, the condensation end and the inlet end are in fluid communication, the cold end of the semiconductor chilling plate is connected to the condensation end, hot end is connected to the radiator, the radiator and/or the cooling fan and the outlet side is in fluid communication；Water collecting unit is set to the lower section of the semiconductor chilling plate, for gathering condensed water.The semiconductor dehumidifying device small volume and less weight is easy to the advantages of taking electricity, adapting to the needs of Portable movable application, have both excellent dehumidification efficiency, mute energy-saving；The control method of the semiconductor dehumidifying device can be such that semiconductor dehumidifying device adaptive environment temperature and humidity changes, and prevent the condensation end frosting of semiconductor dehumidifying device, reduce energy consumption, improve dehumidification efficiency.
Description
Technical field
The invention belongs to dehumidification device technical fields, are a kind of semiconductor dehumidifying device and its controlling party specifically
Method.
Background technique
Dehumidifier is also known as dehumidifier, drying machine, dehumidifier, is widely used in covering work to the occasion of humidity sensitive
Industry field and civil field, the former include all kinds of workshops, process manufacture and laboratory applications, the latter include plantation cultivation,
Domestic dehumidifying etc..
Current dehumidifier realizes that there are many deficiencies by using compressor refrigeration mode.For example, compressor arrangement is multiple
Miscellaneous, bulky, limited space is more and cannot achieve Portable movable application；For another example, energy consumption of compressor is very big, for power supply
Network requirement is high, takes the electric inconvenient and feature of environmental protection low；For another example, refrigerant is easy leakage, damages to atmospheric environment；In addition, pressure
Contracting machine transmission parts are numerous, and the accuracy of manufacture requires height, and easily send out mechanical oscillation and generate noise.With coming for movable living epoch
Face, existing dehumidifier has been difficult to meet using needs.
Summary of the invention
For overcome the deficiencies in the prior art, small the present invention provides a kind of semiconductor dehumidifying device and its control method
It is skilful it is light, be easy to the advantages of taking electricity, adapting to the needs of Portable movable application, have both excellent dehumidification efficiency, mute energy-saving.
The purpose of the present invention is achieved through the following technical solutions:
A kind of semiconductor dehumidifying device, comprising:
The inlet end of fluid communication and outlet side；
Dehumidification by condensation unit, it is described including condensation end, semiconductor chilling plate, radiator and the cooling fan stacked gradually
Condensation end and the inlet end are in fluid communication, and the cold end of the semiconductor chilling plate is connected to the condensation end, and hot end is connected to
The radiator, the radiator and/or the cooling fan and the outlet side are in fluid communication；
Water collecting unit is set to the lower section of the semiconductor chilling plate, for gathering condensed water.
As an improvement of the above technical solution, the condensation end has a plurality of condensate films of spacing setting, the plural number
A condensate film is connected to the cold end of the semiconductor chilling plate.
As a further improvement of the above technical scheme, the radiator has a plurality of radiating fins of spacing distribution,
There is through-flow turnpike, the through-flow turnpike and the condensation end are in fluid communication between adjacent radiating fin.
As a further improvement of the above technical scheme, the water collecting unit includes that the catch basin being in fluid communication and drainage are defeated
Outlet, the catch basin are set to the lower section of the semiconductor chilling plate, and the drainage output end exports the collection for draining
Condensed water in sink.
As a further improvement of the above technical scheme, the water collecting unit is connected with water storage container, the water storage container
For storing the condensed water.
It as a further improvement of the above technical scheme, further include liquid level float and limit switch, the liquid level float drift
Float on the condensation water surface of the water storage container, the limit switch is set to the upper limit of the stroke that floats up and down of the liquid level float
Position.
As a further improvement of the above technical scheme, the semiconductor dehumidifying device further includes device housing, the dress
Shell is set with accommodating chamber, the accommodating chamber is fluidly connected to the inlet end and the outlet side, the dehumidification by condensation respectively
Unit and the water collecting unit are respectively arranged in the accommodating chamber.
As a further improvement of the above technical scheme, described device shell has a plurality of outlet sides, described a plurality of
Outlet side is lived apart the side of the inlet end.
As a further improvement of the above technical scheme, the semiconductor dehumidifying device further includes that ambient temperature and humidity sensing is single
Member, for detecting ambient temperature and humidity；And/or the semiconductor dehumidifying device further includes condensation end temperature sensor, for detecting
The real time temperature of the condensation end.
A kind of control method of semiconductor dehumidifying device, for controlling semiconductor dehumidifying device described in any of the above item,
Include:
Obtain the real time temperature of the condensation end；
Judge whether the real time temperature is more than zero centigrade, otherwise closes the semiconductor chilling plate；
Current environment temperature and humidity value is obtained, determines the dew-point temperature of current working under dew-point temperature master pattern according to it,
Ideal dehumidifying temperature range is determined according to the dew-point temperature of the current working；
The temperature regulated quantity of the condensation end is determined according to the real time temperature and the ideal dehumidifying temperature range；
The input power of the semiconductor chilling plate is controlled according to the temperature regulated quantity of the condensation end, until described real-time
Temperature is in the ideal dehumidifying temperature range.
The beneficial effects of the present invention are:
Dehumidification by condensation unit is set between inlet end and outlet side, and dehumidification by condensation unit is only by condensation end, semiconductor system
Cold, radiator and cooling fan stack gradually composition, and gather condensed water in its lower setting water collecting unit, compact structure and it is easy
In carrying；
Condensation end is set to keep low temperature by the cold end of semiconductor chilling plate, condensation end continuingly acts on air and makes water therein
Vapour condenses and realizes dehumidifying, and the hot end of semiconductor chilling plate is cooled down by radiator, saves complicated machine driving and motion structure,
Realize mute refrigeration purpose；
The cold dry air formed after condensation end cooling and dehumidifying flows through radiator under the drainage of cooling fan and realizes
Cooling to radiator guarantees that condensation end stablizes low temperature and has excellent dehumidification by condensation efficiency, reuses to thermal energy multistage
And there is ideal Energy Efficiency Ratio, it realizes energy-saving and environment-friendly purpose, is easy to that electricity is taken to power and promote environmental suitability and cruising ability.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the axonometric schematic diagram for the semiconductor dehumidifying device that the embodiment of the present invention 1 provides；
Fig. 2 is the partial schematic sectional view for the semiconductor dehumidifying device that the embodiment of the present invention 1 provides；
Fig. 3 is the first axonometric schematic diagram after the semiconductor dehumidifying device removal device shell that the embodiment of the present invention 1 provides；
Fig. 4 is the schematic cross-sectional view after the semiconductor dehumidifying device removal device shell that the embodiment of the present invention 1 provides；
Fig. 5 is the second axonometric schematic diagram after the semiconductor dehumidifying device removal device shell that the embodiment of the present invention 1 provides；
Fig. 6 is the perspective diagram of the water storage container for the semiconductor dehumidifying device that the embodiment of the present invention 1 provides；
Fig. 7 is the axonometric schematic diagram of the control unit for the semiconductor dehumidifying device that the embodiment of the present invention 1 provides；
Fig. 8 is the step flow chart of the control method for the semiconductor dehumidifying device that the embodiment of the present invention 2 provides.
Main element symbol description:
1000- semiconductor dehumidifying device, 1100- device housing, 1110- inlet end, the outlet side 1120-, 1130- first shell
Body, 1140- second shell, 1150- hasp, 1200- dehumidification by condensation unit, 1210- condensation end, 1211- condensate film, 1212- are passed through
Passage flow duct, 1220- semiconductor chilling plate, 1221- cold end, the hot end 1222-, 1230- radiator, 1231- radiating fin, 1232-
Through-flow turnpike, 1240- cooling fan, the air duct 1250- shell, 1300- water collecting unit, 1310- catch basin, 1320- drainage output
End, 1400- water storage container, 1410- liquid level float, 1420- limit switch, 1500- ambient temperature and humidity sensing unit, 1600- are cold
Solidifying end temperature sensor, 1700- control unit, 1800- harness.
Specific embodiment
To facilitate the understanding of the present invention, semiconductor dehumidifying device and its control method are carried out below with reference to relevant drawings
A more complete description.The preferred embodiment of semiconductor dehumidifying device and its control method is given in attached drawing.But semiconductor removes
Wet device and its control method can be realized by many different forms, however it is not limited to embodiment described herein.Phase
Instead, purpose of providing these embodiments is make it is more thorough to the disclosure of semiconductor dehumidifying device and its control method complete
Face.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element "upper",
There is no intermediary elements.Term as used herein "vertical", "horizontal", "left" and "right" and similar statement are
For illustrative purposes.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Herein in the used in the description of semiconductor dehumidifying device and its control method
Term be only for the purpose of describing specific embodiments and be not intended to limit the present invention.Term as used herein " and/
Or " it include any and all combinations of one or more related listed items.
Embodiment 1
Fig. 1~3 are please referred to, the present embodiment discloses a kind of semiconductor dehumidifying device 1000, the semiconductor dehumidifying device
1000 include inlet end 1110, outlet side 1120, dehumidification by condensation unit 1200 and water collecting unit 1300, a kind of removable for providing
Dynamic application, energy-saving and environment-friendly dehumidification mode.
Wherein, inlet end 1110 is used to input the air for needing to dehumidify, and outlet side 1120 is for after exporting removal moisture drying
Do clean air.It is in fluid communication between inlet end 1110 and outlet side 1120, guarantees that the flow path of air is unimpeded.Exemplarily, air inlet
End 1110 is respectively provided with porous array construction with outlet side 1120.Exemplarily, extraction fan, outlet side is arranged in inlet end 1110
1120 setting scavenger fans, promote the flowing velocity of air.
Exemplarily, semiconductor dehumidifying device 1000 includes device housing 1100.Device housing 1100 has accommodating chamber, receives
Cavity is fluidly connected to inlet end 1110 and outlet side 1120 respectively.Meanwhile dehumidification by condensation unit 1200 and water collecting unit 1300
It is respectively arranged in accommodating chamber, realizes monoblock type encapsulation.Exemplarily, water collecting unit 1300 and the inner wall sealing of accommodating chamber are good
It is good.
Exemplarily, device housing 1100 includes first shell 1130 and second shell 1140, and the two splicing is surrounded and shape
At accommodating chamber.Different connection types can be used between first shell 1130 and second shell 1140 and realize splicing, such as screw thread
Connection, pin joint, snapping etc..
Fig. 3~5 are please referred to, dehumidification by condensation unit 1200 includes condensation end 1210, the semiconductor refrigerating stacked gradually
Piece 1220, radiator 1230 and cooling fan 1240 save complicated mechanical structure in a manner of semiconductor refrigerating condensation, simplify knot
Structure, compression volume promote portable performance.
It is pointed out initially that, semiconductor chilling plate 1220 has cold end 1221 and hot end 1222.Semiconductor chilling plate 1220
It is made using peltier effect, so-called peltier effect refers to when DC current passes through the galvanic couple that two kinds of semiconductor materials form
When, galvanic couple one end heat absorption, one end heat release the phenomenon that.In other words, semiconductor chilling plate 1220 is made of two kinds of semiconductor materials, shape
At cold end 1221 and hot end 1222.Cold end 1221 is persistently absorbed heat, and realizes refrigeration；Hot end 1222 continues heat release, by cold end 1221
Caloric receptivity issues together with Joule heat.
Condensation end 1210 and inlet end 1110 are in fluid communication, and are connected to the cold end 1221 of semiconductor chilling plate 1220.It changes
Yan Zhi, the heat of 1221 constant absorption condensation end 1210 of cold end make condensation end 1210 keep low temperature.Inlet end 1110 inputs outer
When boundary's air passes through condensation end 1210, makes moisture condensation liquid pearl therein from air separation because of sub-cooled, realize condensation
Dehumidify purpose.Condensation end 1210 and inlet end 1110 can be by pipeline connections, alternatively, the two keeps face and shortens stream therein
Road length is avoided extending and be lost.
Exemplarily, condensation end 1210 has a plurality of condensate films 1211 of spacing setting, and a plurality of condensate films 1211 divide
It is not connected to the cold end 1221 of semiconductor chilling plate 1220.There is gap between adjacent condensate film 1211, form perforation runner
1212 and diversion air.The setting structure of a plurality of condensate films 1211 can effectively increase contact of the condensation end 1210 with air
Area promotes dehumidification by condensation ability.Condensate film 1211 can be used each metalloid material and be made, exemplarily, condensate film 1211 by
Cold aluminium is made.
The hot end 1222 of semiconductor chilling plate 1220 is connected to radiator 1230, is carried out by radiator 1230 to hot end 1222
It is cooling.Radiator 1230 should have ideal thermal coefficient, guarantee sufficient heat-exchange capacity.Exemplarily, radiator 1230
It is made of metal material, metal material includes the types such as aluminium alloy, copper, silver.
It is appreciated that radiator 1230 realized by cooling fan 1240 it is air-cooled.Under the drainage of cooling fan 1240,
Cold dry air after 1210 cooling and dehumidifying of condensation end will flow through radiator 1230 and realize the cooling to the latter.
Wherein, radiator 1230 and/or cooling fan 1240 and outlet side 1120 are in fluid communication, and realize that flow path is unimpeded.Its
In, air can be in fluid communication along the axial direction flowing of cooling fan 1240, cooling fan 1240 and outlet side 1120；Alternatively, air
It can be flowed out along the radial direction of cooling fan 1240 from the side of radiator 1230, radiator 1230 and the circulation of outlet side 1120 connect
It is logical.
Exemplarily, device housing 1100 has a plurality of outlet sides 1120, a plurality of separation of outlet sides 1120 air inlets
The side at end 1110 makes the gas output end of radiator 1230 keep phase along the vertical and outlet side 1120 of air-flow direction
It is right, to be directly vented.
Hollow structure can be used for radiator 1230 or solid construction is realized or other different structure types.It is exemplary
Ground, radiator 1230 have a plurality of radiating fins 1231 of spacing distribution, have between adjacent radiating fin 1231 through-flow
Turnpike 1232.Through-flow turnpike 1232 is in fluid communication with condensation end 1210 (can be specially perforation runner 1212 therein), so as to sky
Air-flow is logical, to increase the contact area of cold dry air Yu radiator 1230, promotes air cooling effect.
Exemplarily, dehumidification by condensation unit 1200 further includes air duct shell 1250, for installing condensation end 1210, semiconductor
Cooling piece 1220, radiator 1230 and cooling fan 1240, and there is air duct and enable air in wherein along preset direction stream
It is dynamic.
Water collecting unit 1300 is set to the lower section of semiconductor chilling plate 1220, for gathering condensed water, realizes collecting for water
Water conservancy diversion or storage.Water collecting unit 1300 can realize that exemplarily, water collecting unit 1300 includes catch basin 1310 by different modes
With drainage output end 1320.Wherein, catch basin 1310 is set to the lower section of semiconductor chilling plate 1220, for collecting condensed water；
Drainage output end 1320 is fluidly connected to catch basin 1310, for draining the condensed water in output catch basin 1310.Exemplarily,
Draining output end 1320 has one-way conduction characteristic, for example, by using structures such as check valves, avoids condensed water adverse current to catch basin
In 1310.
Exemplarily, one end of catch basin 1310 close to drainage output end 1320 is gradually received along the flow direction of condensed water
Contracting applies acceleration to condensed water, and condensed water is made quickly to flow to drainage output end 1320.Exemplarily, catch basin 1310
There is terrace with edge or frustum cone structure, the small end and drainage output end of terrace with edge or frustum cone structure close to one end of drainage output end 1320
1320 are connected.
Fig. 1 and Fig. 6 is please referred to, exemplarily, water collecting unit 1300 is connected with water storage container 1400, water storage container
1400 for storing condensed water.Water storage container 1400 and drainage output end 1320 are in fluid communication, and receive drainage 1320 row of output end
Water out.
Exemplarily, water storage container 1400 is located at the lower section of water collecting unit 1300.Exemplarily, water storage container 1400 connects
In the lower section of device housing 1100, there is therebetween detachable structure, drained convenient for removing water storage container 1400.It is exemplary
Ground, water storage container 1400 and device housing 1100 realize tool-free dismounting by hasp 1150, promote application portability.
Exemplarily, semiconductor dehumidifying device 1000 further includes liquid level float 1410 and limit switch 1420.Liquid level float
1410 float on the condensation water surface of water storage container 1400, go up and down and float up and down with the liquid level in water storage container 1400.Limit is opened
The upper limit for the stroke that floats up and down that 1420 are set to liquid level float 1410 is closed, for realizing upper limit control.In other words, work as liquid
When position float 1410 rises to upper limit, limit switch 1420 is triggered and issues prompt information, has prompted water storage container 1400
Reach full load condition.Exemplarily, when limit switch 1420 is triggered, semiconductor dehumidifying device 1000 is closed, and avoids sending out
Unboiled water stream spill-over.
Exemplarily, semiconductor dehumidifying device 1000 further includes ambient temperature and humidity sensing unit 1500, for detecting environment
Temperature and humidity, to control operation.Ambient temperature and humidity sensing unit 1500 is set in device housing 1100, so as to external environment
Contact, can be made of temperature sensor and humidity sensor.Exemplarily, semiconductor dehumidifying device 1000 further includes condensation end temperature
Sensor 1600 is spent, for detecting the real time temperature of condensation end 1210, to control operation.
Referring to Fig. 7, exemplarily, semiconductor dehumidifying device 1000 further includes control unit 1700.Control unit 1700
The driving power in semiconductor chilling plate 1220, limit switch 1420, ambient temperature and humidity sensing unit 1500 is electrically connected
With condensation end temperature sensor 1600, for realizing the control to each unit.
Exemplarily, device housing 1100 is equipped with harness 1800, so that user bears carrying.
Exemplarily, semiconductor dehumidifying device 1000 further includes purification filtering unit, for purifying the dirt of the gaseous state in air
It contaminates object and microorganism and/or crosses the particulate matter of air filtering.The implementation of purification filtering unit is numerous, including ultraviolet sterilization
The types such as lamp, filter screen.
Embodiment 2
Referring to Fig. 8, the present embodiment discloses a kind of control method of semiconductor dehumidifying device, for controlling above embodiments
1 semiconductor dehumidifying device 1000 introduced, make semiconductor dehumidifying device 1000 can the variation of adaptive environment temperature and humidity, prevent half
1210 frosting of condensation end of conductor dehumidification device 1000 reduces energy consumption, improves dehumidification efficiency.The control method includes following
Step:
Step A: the real time temperature of condensation end 1210 is obtained.For example, the real time temperature is by condensation end temperature sensor 1600,
And by the latter by its detected value with the electric signal transmission for transmission in control unit 1700.
Step B: judge whether the real time temperature is more than zero centigrade, otherwise close the semiconductor chilling plate 1220.
For example, control unit 1700 compares the real time temperature with zero centigrade, if the former is less than or equal to the latter, judge
Freezing point is reached, control unit 1700 issues out code, and so that semiconductor chilling plate 1220 is closed and is avoided 1210 frosting of condensation end,
Guarantee that application is safe.
Step C: obtaining current environment temperature and humidity value, determines the dew point of current working under dew-point temperature master pattern according to it
Temperature determines ideal dehumidifying temperature range according to the dew-point temperature of the current working.
Dew-point temperature master pattern is under standard environment temperature and humidity, and the dew-point hygrometer or dew-point temperature of air calculate public
Formula reflects the relationship between the dew-point temperature of air and ambient temperature and humidity.Under dew-point hygrometer, according to current environment temperature and humidity
Value retrieves the table, so that it is determined that the corresponding dew-point temperature of current working；It is calculated under formula in dew-point temperature, current environment is warm and humid
Angle value substitutes into the calculation formula, so that the corresponding dew-point temperature of current working be calculated.
In turn, according to the work condition environment of practical application, point, side are prolonged on the basis of the dew-point temperature of obtained current working
It stretches or bilateral extends and forms a temperature range, as ideal dehumidifying temperature range.Exemplarily, ideal dehumidifying temperature range
Lower limit value is lower than the dew-point temperature of current working, and the difference of the two is 5 DEG C；The upper limit value of ideal dehumidifying temperature range is lower than current
The dew-point temperature of operating condition, the difference of the two are 3 DEG C.
Step D: determine that the temperature of condensation end 1210 is adjusted according to the real time temperature and the ideal dehumidifying temperature range
Amount.For example, the difference for calculating the real time temperature and the ideal dehumidifying temperature range is adjusted to get the temperature of condensation end 1210
Amount.
Step E: the input power of the semiconductor chilling plate 1220 is controlled according to the temperature regulated quantity of condensation end 1210, directly
It is in the ideal dehumidifying temperature range to the real time temperature.
Exemplarily, the control unit 1700 that above-mentioned control method can be introduced by embodiment 1 executes realization.
In all examples being illustrated and described herein, any occurrence should be construed as merely illustratively, without
It is as limitation, therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitation of the scope of the invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.Therefore, protection scope of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of semiconductor dehumidifying device characterized by comprising
The inlet end of fluid communication and outlet side；
Dehumidification by condensation unit, including condensation end, semiconductor chilling plate, radiator and the cooling fan stacked gradually, the condensation
End is in fluid communication with the inlet end, and the cold end of the semiconductor chilling plate is connected to the condensation end, and hot end is connected to described
Radiator, the radiator and/or the cooling fan and the outlet side are in fluid communication；
Water collecting unit is set to the lower section of the semiconductor chilling plate, for gathering condensed water.
2. semiconductor dehumidifying device according to claim 1, which is characterized in that the condensation end has answering for spacing setting
Several condensate films, a plurality of condensate films are connected to the cold end of the semiconductor chilling plate.
3. semiconductor dehumidifying device according to claim 1, which is characterized in that the radiator has answering for spacing distribution
Several radiating fins, have through-flow turnpike between adjacent radiating fin, and the through-flow turnpike and the condensation end are in fluid communication.
4. semiconductor dehumidifying device according to claim 1, which is characterized in that the water collecting unit includes being in fluid communication
Catch basin and drainage output end, the catch basin are set to the lower section of the semiconductor chilling plate, and the drainage output end is used for
Drainage exports the condensed water in the catch basin.
5. semiconductor dehumidifying device according to claim 1, which is characterized in that the water collecting unit is connected with water storage appearance
Device, the water storage container is for storing the condensed water.
6. semiconductor dehumidifying device according to claim 5, which is characterized in that it further include liquid level float and limit switch,
For the liquid level buoys float in the condensation water surface of the water storage container, the limit switch is set to the upper and lower of the liquid level float
The upper limit of floating stroke.
7. semiconductor dehumidifying device according to claim 1, which is characterized in that further include device housing, described device shell
Body has accommodating chamber, and the accommodating chamber is fluidly connected to the inlet end and the outlet side, the dehumidification by condensation unit respectively
It is respectively arranged in the accommodating chamber with the water collecting unit.
8. semiconductor dehumidifying device according to claim 7, which is characterized in that described device shell has a plurality of outlets
End, a plurality of outlet sides are lived apart the side of the inlet end.
9. semiconductor dehumidifying device according to claim 1, which is characterized in that the semiconductor dehumidifying device further includes ring
Border temperature and humidity sensing unit, for detecting ambient temperature and humidity；And/or the semiconductor dehumidifying device further includes that condensation end temperature passes
Sensor, for detecting the real time temperature of the condensation end.
10. a kind of control method of semiconductor dehumidifying device, for controlling the described in any item semi-conductor dehumidifyings of claim 1-9
Device characterized by comprising
Obtain the real time temperature of the condensation end；
Judge whether the real time temperature is more than zero centigrade, otherwise closes the semiconductor chilling plate；
Current environment temperature and humidity value is obtained, determines the dew-point temperature of current working under dew-point temperature master pattern according to it, according to
The dew-point temperature of the current working determines ideal dehumidifying temperature range；
The temperature regulated quantity of the condensation end is determined according to the real time temperature and the ideal dehumidifying temperature range；
The input power of the semiconductor chilling plate is controlled according to the temperature regulated quantity of the condensation end, until the real time temperature
In the ideal dehumidifying temperature range.
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| CN112856615A (en) * | 2021-01-07 | 2021-05-28 | 施斌卿 | Anti-icing control method for dehumidifier and dehumidifier |
| CN113138520A (en) * | 2020-01-17 | 2021-07-20 | 中强光电股份有限公司 | Projection device and heat dissipation control method |
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