CN207378968U - A kind of high efficiency semiconductor dehumidifier - Google Patents

A kind of high efficiency semiconductor dehumidifier Download PDF

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Publication number
CN207378968U
CN207378968U CN201721474695.2U CN201721474695U CN207378968U CN 207378968 U CN207378968 U CN 207378968U CN 201721474695 U CN201721474695 U CN 201721474695U CN 207378968 U CN207378968 U CN 207378968U
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air
inner casing
high efficiency
shell
main body
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CN201721474695.2U
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段赞辉
王建方
沈春荣
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Ningbo Taiweite Electric Appliance Co Ltd
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Ningbo Taiweite Electric Appliance Co Ltd
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  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)

Abstract

The utility model belongs to dehumidifier technical field, and in particular to a kind of high efficiency semiconductor dehumidifier only has one or two air intake surfaces for existing semiconductor demoistener, and intake is small, and the low deficiency of dehumidification efficiency, the utility model adopts the following technical solution:A kind of high efficiency semiconductor dehumidifier, including dehumidifying main body, the shell being located at outside dehumidifying main body, the dehumidifying main body includes erectting the inner casing set and semiconductor heat exchanger assembly, the region of the inner housing inner forms air-out chamber, region between the inner casing and shell forms air-inlet cavity, the shell is equipped with circumferentially distributed air inlet, the top of the shell is equipped with the air outlet of the corresponding air-out chamber, fan is equipped with below the inner casing, air inlet, top outlet air around dehumidifier are realized under the suction of the fan.The utility model advantageous effect is:Circumferential air inlet, top outlet air increase intake, improve dehumidification efficiency;A fan can be only used, reduces noise.

Description

A kind of high efficiency semiconductor dehumidifier
Technical field
The utility model belongs to dehumidifier technical field, and in particular to a kind of high efficiency semiconductor dehumidifier.
Background technology
Semiconductor demoistener is a kind of novel dehumidifier to be dehumidified by semiconductor refrigerating technology, is removed compared to compressor-type Wet machine has many advantages, such as that production cost is low, power consumption is small, simple in structure, failure rate is low, small, weight is small, low noise. The principle of semiconductor refrigerating is:Semiconductor chilling plate is the instrument of a heat transfer, when one piece of N-type semiconductor material and one piece of P Have in the thermocouple pair that type semi-conducting material is coupled to electric current by when, heat transfer will be generated between both ends, heat will The other end is transferred to from one end, hot and cold side is formed so as to generate the temperature difference.
Existing semiconductor demoistener still has following shortcoming:1. there is usually one or two air intake surfaces, intake Smaller, dehumidification efficiency is relatively low;2. air intake surface and the difference of non-air intake surface are apparent in appearance, when displaying, needs direction specific;3. it uses Electronic type water level detecting, detection is less reliable, and the service life is relatively low;4. noise is still larger.
The content of the invention
The utility model only has one or two air intake surfaces for existing semiconductor demoistener, and intake is small, dehumidifying The low deficiency of efficiency provides a kind of high efficiency semiconductor dehumidifier, increases intake, improves dehumidification efficiency.Further, the back of the body is solved The other deficiencies referred in scape technology.
To achieve the above object, the utility model adopts the following technical solution:A kind of high efficiency semiconductor dehumidifier, including removing Wet main body, the shell being located at outside dehumidifying main body, the dehumidifying main body include erectting the inner casing set and semiconductor heat exchange group Part, the region of the inner housing inner form air-out chamber, and the region between the inner casing and shell forms air-inlet cavity, and described partly leads Body heat exchanger assembly includes being distributed in the conduction cooling part of the air-inlet cavity, is distributed in the radiating piece of the air-out chamber and and is located at The semiconductor chilling plate to conduct heat between conduction cooling part and radiating piece and with conduction cooling part, radiating piece, the shell is equipped with circumferentially distributed Air inlet, the top of the shell are equipped with the air outlet of the corresponding air-out chamber, fan are equipped with below the inner casing, in the wind Air inlet, top outlet air around realization dehumidifier under the suction of fan.
The dehumidifier of the utility model, the interior shell side wall of dehumidifying main body are equipped with circumferentially distributed semiconductor heat exchange group Part, shell correspond to inner casing equipped with circumferentially distributed air inlet, and surrounding enters the wind, increases intake, improve dehumidification efficiency, wind Fan is arranged at below inner casing, top outlet air;A fan can be only used while exchange Component service for multigroup semiconductor heat, reduced Noise.The dehumidification principle of semiconductor demoistener is:Air enters from air inlet in dehumidifier, when flowing through conduction cooling part, works as conduction cooling When the temperature of piece is down to dew-point temperature, contained vaporous water reaches saturation and condenses into liquid water in air, and air is through passing through fan Radiating piece is flowed through, air absorbs the heat in radiating piece, ensures the temperature difference between the air of discharge and the air of sucking certain In the range of, last air is discharged from air outlet.
Preferably, the inner casing, shell are hollow four-side body structure or are cylinder-like structure.Inner casing, shell are cut Face can be in that annular shape, ellipticity, polyhedral etc. are variously-shaped.Tetrahedral structure or cylindrical shape, easy to process, space utilization Rate is high.
Preferably, the quantity of the fan is one, only using a fan can hand over for multigroup semiconductor heat simultaneously Component service is changed, reduces noise.
Preferably, the radiating piece, by the way of inner ventilation heat dissipation, the radiating piece includes radiating bottom plate and divides The vertical cooling fin of multi-disc of the cloth on annular radiating bottom plate, each cooling fin undulate.Cooling fin undulate, increase with it is cold The contact area of air, so as to ensure the temperature difference of the air of discharge and leaked-in air in allowed band.
Preferably, the radiating bottom plate of each radiating piece is connected as a single entity and surrounds closed loop, in the closed loop that each radiating bottom plate surrounds Equipped with heat dissipating ring muscle, the heat dissipating ring muscle is connected as a single entity by radiating ribs and part heat sink.Each group semiconductor heat exchanger assembly Radiating piece be connected as a single entity rather than multiple individual radiating pieces, improve the structural strength of radiating piece, improve heat dissipation effect.
Preferably, the radiating bottom plate is bonded with the inner wall of the inner casing, through hole is opened up on the inner casing, it is described Semiconductor chilling plate be located in the through hole and be connected with the radiating bottom plate, conduction cooling part heat conduction.
Preferably, the dehumidifier further includes pedestal, water tank is equipped in the pedestal, the dehumidifying main body is installed on pedestal On, the pedestal and dehumidifying main body are superimposed up and down.Dehumidifier uses the structure being superimposed up and down, makes dehumidifier compact overall structure, Small volume.
Preferably, the conduction cooling part includes the cool guide sheet that multi-disc is vertically arranged, each cool guide sheet is tilted compared with the side of inner casing. Cool guide sheet is tilted with respect to the side of inner casing, increases the contact area with humid air, improves effect on moisture extraction.Cool guide sheet is usually vertical It sets.Cool guide sheet is vertically arranged so that air inlet is smooth, and each cool guide sheet of same conduction cooling part is mutually parallel.
As an improvement, the air outlet have arc more arc ribs, each arc rib from center to fringe radiation, Gap between arc rib forms exhaust vent.Arc arc rib play the guiding role to wind, makes to spread around wind direction, increases outlet air Profile.
Preferably, the center of each arc rib is low, edge is high.Arc rib is distributed in swirl shape, and air-out effect is good.
As an improvement, the center of the air outlet is equipped with out vane muscle, each arc rib inner end connects out vane muscle, outlet air Ring muscle upper surface is equipped with cover board.Arc rib inner end is connected by going out vane muscle, arc rib is unlikely to deform, and ensures that structure is strong Degree.Go out vane muscle upper surface equipped with cover board, ensure that dehumidifier appearance and modeling is beautiful, and prevent sundries from falling into.
As an improvement, the shell is connected with air outlet by a connecting seat.Shell and air outlet are separately set, convenient for each From processing.Shell is connected with air outlet by connecting seat, convenient for assembly.
As an improvement, the dehumidifying main body further includes the seat that keeps out the wind being arranged at below fan, the company of opening up on the seat that keeps out the wind The water hole of water flowing case.The seat that keeps out the wind being located at below fan is set, and the seat that keeps out the wind is oriented to wind so that the wind after refrigeration is via wind Fan flows up.It keeps out the wind and the water hole of joining water box is opened up on seat, ponding can drain into water tank from water hole.
As an improvement, the inner casing lower end, which is equipped with, is tilted towards outer Diversion Plate, connection drip tray, institute below the Diversion Plate It states drip tray and drainage gallery is equipped between the seat that keeps out the wind.Diversion Plate and drainage gallery are set, condensed water is avoided to gather.
As an improvement, the magnetic reed switch for sensed water level is equipped in the water tank.Magnetic reed switch detection is accurate, uses the longevity Life length.
The utility model advantageous effect is:Shell is equipped with circumferential air inlet, and surrounding is entered the wind, top outlet air, increase into Air quantity improves dehumidification efficiency;A fan, which can be only used, to exchange Component service simultaneously for multigroup semiconductor heat, and reduction is made an uproar Sound.
Description of the drawings
Fig. 1 is the stereogram of the utility model embodiment one.
Fig. 2 is the exploded view of the utility model embodiment one.
Fig. 3 is the front view of the utility model embodiment one.
In Fig. 4 A-A to sectional view.
Fig. 5 is the structure diagram of the dehumidifying main body of the utility model embodiment one.
Fig. 6 is the structure diagram of the air outlet of the utility model embodiment one.
Fig. 7 is the structure diagram of the connecting seat of the utility model embodiment one.
Fig. 8 is the wind direction flow schematic diagram of the dehumidifier of the utility model embodiment one.
Fig. 9 is the schematic cross-section of the radiating piece of the utility model embodiment two.
In figure, 1, pedestal, 11, water tank;
2nd, dehumidifying main body, 21, inner casing, 22, conduction cooling part, 221, cool guide sheet, 23, radiating piece, 230, radiating bottom plate, 231, dissipate Backing, 232, heat dissipating ring muscle, 233, radiating ribs, 24, semiconductor chilling plate, 25, Diversion Plate, 26, drip tray, 27, keep out the wind seat, 28th, drainage gallery,
3rd, shell;
4th, air outlet, 41, arc rib, 411, exhaust vent, 42, ring muscle, 43, cover board;
5th, air inlet;
6th, connecting seat;
7th, fan.
Specific embodiment
With reference to the attached drawing of the utility model embodiment, the technical solution of the utility model embodiment is explained and Illustrate, but following embodiments are only the preferred embodiment of the utility model, and it is not all.Based on the embodiment in embodiment, The other embodiment that those skilled in the art are obtained on the premise of creative work is not made, belongs to the utility model Protection domain.
Referring to Fig. 1 to Fig. 9, a kind of high efficiency semiconductor dehumidifier, including dehumidifying main body, be located at it is outer outside dehumidifying main body Shell, the dehumidifying main body includes erectting the inner casing set and semiconductor heat exchanger assembly, the region of the inner housing inner are formed out Wind chamber, the region between the inner casing and shell form air-inlet cavity, and the semiconductor heat exchanger assembly includes being distributed in described The conduction cooling part of air-inlet cavity, the radiating piece for being distributed in the air-out chamber and and between conduction cooling part and radiating piece and and conduction cooling Part, the semiconductor chilling plate of radiating piece heat transfer, the shell are equipped with circumferentially distributed air inlet, and the top of the shell is equipped with pair Answer the air outlet of the air-out chamber, fan be equipped with below the inner casing, realized under the suction of the fan around dehumidifier into Wind, top outlet air.
The dehumidifier of the utility model, the shell of dehumidifying main body are circumferentially entered the wind, and increase intake, improve dehumidifying effect Rate;Air outlet is arranged at cover top portion, and top outlet air can avoid wind from directly blowing to human body.
Embodiment one
Referring to Fig. 1 to Fig. 8, a kind of high efficiency semiconductor dehumidifier, the dehumidifying main body 2 installed including pedestal 1,1 top of pedestal, The shell 3 being provide with outside dehumidifying main body 2 is equipped with water tank 11 in pedestal 1, fan 7 is equipped in dehumidifying main body 2, dehumidifying main body 2 includes interior Semiconductor heat exchanger assembly on shell 21 and inner casing 21, semiconductor heat exchanger assembly include conduction cooling part 22, radiating piece 23 and lead Semiconductor chilling plate 24 between cold part 22 and radiating piece 23, the top of shell 3 are equipped with air outlet 4, and the inner casing 21 is hollow Polyhedral structure, each side of the inner casing 21 are equipped with semiconductor heat exchanger assembly, and the conduction cooling part 22 is located at inner casing 21 Outside, the radiating piece 23 are located at 21 inside of inner casing, and each side of the shell 3 is equipped with air inlet 5, in the pumping of fan 7 Under suction, air enters from air inlet 5, followed by conduction cooling part 22, fan 7, radiating piece 23, then discharges from air outlet 4.
After tested, the moisture removal of the dehumidifier of the utility model can reach 1000ml/24h, and currently on the market half The moisture removal of conductor dehumidifier is generally all between 100ml/24h-600ml/24h.
The quantity of the fan 7 is one.One fan 7 can exchange Component service for multigroup semiconductor heat simultaneously, only make With a fan 7, noise is reduced.
Referring to Fig. 2 to Fig. 4, a kind of high efficiency semiconductor dehumidifier, including pedestal 1, dehumidifying main body 2, shell 3, air inlet 5, Fan 7, air outlet 4.Water tank 11 is equipped in pedestal 1.Dehumidifying main body 2 includes inner casing 21 and semiconductor heat exchanger assembly.7 water of fan Safety fills, and generates wind straight up.Pedestal 1 is assembled by multiple components.Air inlet hole, air inlet hole are opened up on air inlet 5 In window-like so that air inlet 5 is handsome in appearance.
The inner casing 21 is hollow four-side body structure.Compared to trihedral, tetrahedral structure space availability ratio is high.Compared to five faces Body and more multiaspect or circle, tetrahedral structure are easy to process.Inner casing 21 be hollow rectangular parallelepiped structure, in-between up/down perforation. Shell 3 is engaged with inner casing 21, therefore shell 3 is also tetrahedral structure, and four sides is entered the wind, top outlet air, one integrated mass, without distinguishing All around, it is front and rear to solve the problems, such as that dehumidifier is distinguished in appearance.
Shell 3 is inserted into dehumidifying main body 2, and 2 inner wall of dehumidifying main body is equipped with fixture block, and card slot, dehumidifying main body 2 are opened up on shell 3 It is connected with shell 3 by fixture block with card slot.2 bottom of dehumidifying main body opens up the water hole of joining water box 11.
Four side walls of inner casing 21 open up through hole, and semiconductor chilling plate 24 is installed in through hole.The conduction cooling part in 21 outside of inner casing 22 contact with semiconductor chilling plate 24, and the radiating piece 23 of 21 inside of inner casing is contacted with semiconductor chilling plate 24.
Referring to Fig. 5, the conduction cooling part 22 includes the cool guide sheet 221 that multi-disc is vertically arranged, and each cool guide sheet 221 is compared with inner casing 21 Side tilts, and each cool guide sheet 221 is mutually parallel.Cool guide sheet 221 is tilted with respect to the side of inner casing 21, is increased and is connect with humid air Contacting surface is accumulated, and improves effect on moisture extraction.Cool guide sheet 221 is vertically arranged so that air inlet is smooth.Conduction cooling part 22 is integrally formed.Conduction cooling part 22 It is fixed by fastener and inner casing 21, gap is more than other phases between the cool guide sheet 221 at both ends and cool guide sheet 221 adjacent thereto Gap between adjacent cool guide sheet 221 reserves installation space for fastener.
The radiating piece 23 includes the cooling fin 231 that multi-disc is vertically arranged, each 231 undulate of cooling fin, each 231 phase of cooling fin It is mutually parallel.231 undulate of cooling fin, increase and the contact area of cold air, so as to ensure the air of discharge and the sky flowed into The temperature difference of gas is in allowed band.Cooling fin 231 is vertically arranged so that outlet air is smooth.Cooling fin 231 is perpendicular to the inner wall of inner casing 21.It dissipates Warmware 23 is integrally formed.
The radiating bottom plate 230 is bonded with the inner wall of the inner casing 21, and through hole is opened up on the inner casing 21, described Semiconductor chilling plate 24 is located in the through hole and is connected with the radiating bottom plate 230,22 heat conduction of conduction cooling part.
21 lower end of inner casing, which is equipped with, is tilted towards outer Diversion Plate 25.By setting Diversion Plate 25, water droplet is avoided to float towards wind Fan 7.25 both sides of Diversion Plate are equipped with water fender, and Diversion Plate 25 and water fender are above 21 lower face of inner casing.25 lower section of Diversion Plate is also Equipped with drip tray 26, the lower section of fan 7 is equipped with the seat 27 that keeps out the wind, and the water in drip tray 26 keeps out the wind seat 27 through the flow direction of drainage gallery 28, gear Water hole is opened up in wind seat 27, water is flow to from water hole in water tank 11.The drainage gallery 28 of connection drip tray 26 and the seat 27 that keeps out the wind is located at Corner, drainage gallery 28 are formed by pipeline, have gap below pipeline between the seat 27 that keeps out the wind, so that current pass through.
Seat 27 keep out the wind in addition to for being oriented to wind, is additionally operable to installation 21 grade components of drip tray 26 and inner casing.Keep out the wind seat 27 are equipped with the mounting base erect, and 26 lower section of drip tray is equipped with the mounting post that can be inserted into mounting base.
Referring to Fig. 6, the air outlet 4 has more arc ribs 41 of arc, and each arc rib 41 is from center to edge It radiates, the gap between arc rib 41 forms exhaust vent 411.Arc arc rib 41 play the guiding role to wind, makes around wind direction Diffusion increases outlet air profile.
The center of each arc rib 41 is low, edge is high.Arc rib 41 is distributed in swirl shape, and air-out effect is good.
Referring to Fig. 4, the center of the air outlet 4 is equipped with ring muscle, and each 41 inner end of arc rib connects out vane muscle 42, described Go out 42 upper surface of vane muscle equipped with cover board 43.41 inner end of arc rib is connected by going out vane muscle 42, arc rib 41 is not variable Shape ensures structural strength.Go out 42 upper surface of vane muscle equipped with cover board 43, ensure that dehumidifier appearance and modeling is beautiful, and prevent sundries It falls into.
Referring to Fig. 7, the shell 3 and air outlet 4 are connected by a connecting seat 6.Shell 3 and air outlet 4 are separately set, just In respective processing.Shell 3 and air outlet 4 are connected by connecting seat 6, convenient for assembly.Connecting seat 6 has the wind-guiding face of arc, Wind-guiding face is upper.Connecting seat 6 is caught in inner casing 21, and air outlet 4 is caught in connecting seat 6.
The magnetic reed switch (not shown) for sensed water level is equipped in the water tank 11.Magnetic reed switch detection is accurate, makes Use long lifespan.
Referring to Fig. 8, the operation principle of the utility model embodiment:Semiconductor chilling plate 24 is powered, inside temperature liter Height, temperature outside reduce, after fan 7 starts, during indoor humid air is from the air inlet 5 on shell 3 into dehumidifier, and humid air First time heat exchange occurs with conduction cooling part 22, heat absorbed by conduction cooling part 22, and temperature is reduced to dew point, and the water in humid air steams Droplet is formed in airsetting, below spatial flow of the cold air after first time heat exchange between inner casing 21 and shell 3 to fan 7, Due to the stop for the seat 27 that keeps out the wind, cold air can only be flowed in inner casing 21 by fan 7 and second of heat occurs with radiating piece 23 It exchanges, cold air is absorbed after heat recovers to room temperature discharges from the air outlet 4 at the top of dehumidifier.It is generated during dehumidifying Droplet is flow to via Diversion Plate 25, drip tray 26, drainage gallery 28, the seat 27 that keeps out the wind in water tank 11.
Embodiment two
Embodiment two and the difference of embodiment one are radiating piece 23.
Referring to Fig. 9, what multi-disc that the radiating piece 23 includes setting on radiating bottom plate 230 and radiating bottom plate 230 was vertically arranged dissipates Backing 231, each 231 undulate of cooling fin.Radiating bottom plate 230 is bonded with the inside of semiconductor refrigerating part 22.Each radiating piece 23 Radiating bottom plate 230 be connected as a single entity and surround closed loop, heat dissipating ring muscle 232 is equipped in the closed loop that each radiating bottom plate 230 surrounds, it is described Heat dissipating ring muscle 232 is connected as a single entity by radiating ribs 233 and part heat sink 231.
Four radiating pieces 23 of four groups of semiconductor heat exchanger assemblies are connected as a single entity rather than four individual radiating pieces 23, carry High structural strength, improving radiating effect.The cooling fin of auxiliary also is provided in four corners of rectangle closed loop.Cooling fin 231 dissipates The setting of hot ring muscle 232, radiating ribs 233 and auxiliary heat dissipation piece, greatly promotes heat dissipation effect.
The above is only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to In this, it is familiar with the those skilled in the art and should be understood that the utility model includes but not limited to attached drawing and above specific embodiment party Content described in formula.The modification of any function and structure principle without departing from the utility model is intended to be included in claims Scope in.

Claims (10)

1. a kind of high efficiency semiconductor dehumidifier, it is characterised in that:Including dehumidifying main body (2), it is located at dehumidifying main body (2) outside outer Shell (3), the dehumidifying main body (2) include erectting the inner casing (21) set and semiconductor heat exchanger assembly, and the inner casing (21) is interior The region in portion forms air-out chamber, and the region between the inner casing (21) and shell (3) forms air-inlet cavity, and the semiconductor heat is handed over Changing component includes being distributed in conduction cooling part (22), the radiating piece (23) for being distributed in the air-out chamber and and the position of the air-inlet cavity The semiconductor chilling plate (24) to conduct heat between conduction cooling part (22) and radiating piece (23) and with conduction cooling part (22), radiating piece (23), The shell (3) is equipped with circumferentially distributed air inlet (5), and the top of the shell (3) is equipped with the outlet air of the corresponding air-out chamber Mouth (4), inner casing (21) lower section are equipped with fan (7), enter the wind, push up around realization dehumidifier under the suction of the fan (7) Portion's outlet air.
2. a kind of high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that:The inner casing (21), shell (3) It is hollow four-side body structure or is cylinder-like structure.
3. a kind of high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that:The quantity of the fan (7) is One.
4. a kind of high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that:In the radiating piece (23) uses The mode of portion's ventilation and heat, the radiating piece (23) include radiating bottom plate (230) and the multi-disc being distributed on radiating bottom plate (230) Vertical cooling fin (231), each cooling fin (231) undulate.
5. a kind of high efficiency semiconductor dehumidifier according to claim 4, it is characterised in that:The heat dissipation bottom of each radiating piece (23) Plate (230) is connected as a single entity and surrounds closed loop, and heat dissipating ring muscle (232) is equipped in the closed loop that each radiating bottom plate (230) surrounds, described to dissipate Hot ring muscle (232) is connected as a single entity by radiating ribs (233) and part heat sink (231).
6. a kind of high efficiency semiconductor dehumidifier according to claim 4, it is characterised in that:The radiating bottom plate (230) It is bonded with the inner wall of the inner casing (21), through hole is opened up on the inner casing (21), the semiconductor chilling plate (24) is located at It is connected in the through hole and with the radiating bottom plate (230), conduction cooling part (22) heat conduction.
7. a kind of high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that:The dehumidifier further includes pedestal (1), water tank (11) is equipped in the pedestal (1), the dehumidifying main body (2) is installed on pedestal (1), the pedestal (1) and is removed Wet main body (2) is superimposed up and down.
8. a kind of high efficiency semiconductor dehumidifier according to claim 7, it is characterised in that:It is equipped with and uses in the water tank (11) In the magnetic reed switch of sensed water level.
9. a kind of high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that:The air outlet (4) has more Root arc rib (41), each arc rib (41) is from center to fringe radiation, and the center of each arc rib (41) is low, edge is high, Gap between arc rib (41) forms exhaust vent (411), and the center of the air outlet (4) is equipped with out vane muscle (42), each arc Shape rib (41) inner end connects out vane muscle (42), it is described go out vane muscle (42) upper surface be equipped with cover board (43).
10. a kind of high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that:The dehumidifying main body (2) is also wrapped The seat that keeps out the wind (27) being arranged at below fan (7) is included, osculum is opened up on the seat that keeps out the wind (27), inner casing (21) lower end is set Have and be tilted towards outer Diversion Plate (25), be equipped with drip tray (26) below the Diversion Plate (25), the drip tray (26) is with keeping out the wind Drainage gallery (28) is equipped between seat (27).
CN201721474695.2U 2017-11-08 2017-11-08 A kind of high efficiency semiconductor dehumidifier Active CN207378968U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107940619A (en) * 2017-11-08 2018-04-20 宁波泰威特电器有限公司 A kind of high efficiency semiconductor dehumidifier
CN113175708A (en) * 2021-04-16 2021-07-27 西安交通大学 Indoor air and outdoor fresh air purifying device capable of preventing haze, diminishing inflammation and preventing epidemic

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107940619A (en) * 2017-11-08 2018-04-20 宁波泰威特电器有限公司 A kind of high efficiency semiconductor dehumidifier
CN113175708A (en) * 2021-04-16 2021-07-27 西安交通大学 Indoor air and outdoor fresh air purifying device capable of preventing haze, diminishing inflammation and preventing epidemic

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