CN107940619A - A kind of high efficiency semiconductor dehumidifier - Google Patents
A kind of high efficiency semiconductor dehumidifier Download PDFInfo
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- CN107940619A CN107940619A CN201711087908.0A CN201711087908A CN107940619A CN 107940619 A CN107940619 A CN 107940619A CN 201711087908 A CN201711087908 A CN 201711087908A CN 107940619 A CN107940619 A CN 107940619A
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- inner casing
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- shell
- main body
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 33
- 238000001816 cooling Methods 0.000 claims description 25
- 210000003205 muscle Anatomy 0.000 claims description 22
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 235000014676 Phragmites communis Nutrition 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims description 2
- 238000007791 dehumidification Methods 0.000 abstract description 9
- 230000007812 deficiency Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F3/1405—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification in which the humidity of the air is exclusively affected by contact with the evaporator of a closed-circuit cooling system or heat pump circuit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
- F24F2003/1446—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only by condensing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
The invention belongs to dehumidifier technical field, and in particular to a kind of high efficiency semiconductor dehumidifier, only has one or two air intake surfaces for existing semiconductor demoistener, and intake is small, and the low deficiency of dehumidification efficiency, the present invention adopts the following technical scheme that：A kind of high efficiency semiconductor dehumidifier, including dehumidifying main body, the shell being located at outside dehumidifying main body, the dehumidifying main body includes erectting the inner casing and semiconductor heat exchanger assembly set, the region of the inner housing inner forms air-out chamber, region between the inner casing and shell forms air-inlet cavity, the shell is equipped with circumferentially distributed air inlet, the top of the shell is equipped with the air outlet of the corresponding air-out chamber, fan is equipped with below the inner casing, inlet air around dehumidifier, top outlet air are realized under the suction of the fan.Present invention has the advantages that：Circumferential inlet air, top outlet air, increases intake, improves dehumidification efficiency；A fan can be only used, reduces noise.
Description
Technical field
The invention belongs to dehumidifier technical field, and in particular to a kind of high efficiency semiconductor dehumidifier.
Background technology
Semiconductor demoistener be it is a kind of by semiconductor refrigerating technology come the novel dehumidifier to dehumidify, removed compared to compressor-type
Wet machine, it has the advantages that, and production cost is low, power consumption is small, simple in structure, failure rate is low, small, weight is small, low noise.
The principle of semiconductor refrigerating is：Semiconductor chilling plate is the instrument of a heat transfer, when one piece of N-type semiconductor material and one piece of P
The thermocouple centering that type semi-conducting material is coupled to have electric current by when, heat transfer will be produced between both ends, heat will
The other end is transferred to from one end, so that producing the temperature difference forms hot and cold side.
Existing semiconductor demoistener still has following shortcoming：1. there is usually one or two air intake surfaces, intake
Smaller, dehumidification efficiency is relatively low；2. air intake surface and the difference of non-air intake surface are obvious in appearance, when displaying, needs direction specific；3. use
Electronic type water level detecting, detection is less reliable, and the service life is relatively low；4. noise is still larger.
The content of the invention
The present invention only has one or two air intake surfaces for existing semiconductor demoistener, and intake is small, dehumidification efficiency
Low deficiency, there is provided a kind of high efficiency semiconductor dehumidifier, increases intake, improves dehumidification efficiency.Further, background skill is solved
The other deficiencies referred in art.
To achieve the above object, the present invention adopts the following technical scheme that：A kind of high efficiency semiconductor dehumidifier, including dehumidifying master
Body, the shell being located at outside dehumidifying main body, the dehumidifying main body include erectting the inner casing and semiconductor heat exchanger assembly set, institute
The region for stating inner housing inner forms air-out chamber, and the region between the inner casing and shell forms air-inlet cavity, the semiconductor heat
Exchanging component includes being distributed in the conduction cooling part of the air-inlet cavity, is distributed in the radiating piece of the air-out chamber and and positioned at conduction cooling
The semiconductor chilling plate to conduct heat between part and radiating piece and with conduction cooling part, radiating piece, the shell are equipped with circumferentially distributed inlet air
Mouthful, the top of the shell is equipped with the air outlet of the corresponding air-out chamber, fan is equipped with below the inner casing, in the fan
Inlet air around dehumidifier, top outlet air are realized under suction.
The dehumidifier of the present invention, the interior shell side wall of its dehumidifying main body are equipped with circumferentially distributed semiconductor heat exchanger assembly, its
Shell corresponds to inner casing and is equipped with circumferentially distributed air inlet, and surrounding inlet air, increases intake, improves dehumidification efficiency, and fan is set
It is placed in below inner casing, top outlet air；Component service only can be exchanged for multigroup semiconductor heat at the same time using a fan, reduce and make an uproar
Sound.The dehumidification principle of semiconductor demoistener is：Air enters in dehumidifier from air inlet, when flowing through conduction cooling part, when cool guide sheet
Temperature as low as dew-point temperature when, contained vaporous water reaches saturation and condenses into liquid water in air, and air is flowed through by fan
Radiating piece, air absorb the heat in radiating piece, ensure the temperature difference between the air of discharge and the air of suction in a certain range
Interior, last air is discharged from air outlet.
Preferably, the inner casing, shell are hollow four-side body structure or are cylinder-like structure.Inner casing, shell are cut
Face can be in that annular shape, ellipticity, polyhedral etc. are variously-shaped.Tetrahedral structure or cylindrical shape, easy to process, space utilization
Rate is high.
Preferably, the quantity of the fan is one, can only be handed at the same time for multigroup semiconductor heat using a fan
Component service is changed, reduces noise.
Preferably, the radiating piece, by the way of inner ventilation heat dissipation, the radiating piece includes radiating bottom plate and divides
The vertical heat sink of multi-disc of the cloth on ring-type radiating bottom plate, each heat sink undulate.Heat sink undulate, increase with it is cold
The contact area of air, so as to ensure the temperature difference for the air and leaked-in air discharged in allowed band.
Preferably, the radiating bottom plate of each radiating piece is connected as a single entity and surrounds closed loop, in the closed loop that each radiating bottom plate surrounds
Equipped with heat dissipating ring muscle, the heat dissipating ring muscle is connected as a single entity by radiating ribs and part heat sink.Each group semiconductor heat exchanger assembly
Radiating piece be connected as a single entity, rather than multiple single radiating pieces, improve the structural strength of radiating piece, improve heat dissipation effect.
Preferably, the radiating bottom plate is bonded with the inner wall of the inner casing, through hole is opened up on the inner casing, it is described
Semiconductor chilling plate be located in the through hole and be connected with the radiating bottom plate, conduction cooling part heat conduction.
Preferably, the dehumidifier further includes base, water tank is equipped with the base, the dehumidifying main body is installed on base
On, the base and dehumidifying main body are superimposed up and down.Dehumidifier uses the structure being superimposed up and down, makes dehumidifier compact overall structure,
Small volume.
Preferably, the conduction cooling part includes the cool guide sheet that multi-disc is vertically arranged, each cool guide sheet is tilted relative to the side of inner casing.
Cool guide sheet is tilted with respect to the side of inner casing, increases the contact area with humid air, improves effect on moisture extraction.Cool guide sheet is usually vertical
Set.Cool guide sheet is vertically arranged so that inlet air is smooth, and each cool guide sheet of same conduction cooling part is parallel to each other.
As an improvement, the air outlet have arc more arc ribs, each arc rib from center to fringe radiation,
Gap between arc rib forms exhaust vent.Arc arc rib play the guiding role wind, makes to spread around wind direction, increases outlet air
Profile.
Preferably, the center of each arc rib is low, edge is high.Arc rib is distributed in swirl shape, and air-out effect is good.
As an improvement, the center of the air outlet is equipped with out vane muscle, each arc rib the inner connects out vane muscle, outlet air
Ring muscle upper surface is equipped with cover board.Arc rib the inner is connected by going out vane muscle, arc rib is unlikely to deform, and ensures that structure is strong
Degree.Go out vane muscle upper surface and be equipped with cover board, ensure that dehumidifier appearance and modeling is beautiful, and prevent debris from falling into.
As an improvement, the shell is connected with air outlet by a connecting seat.Shell and air outlet are separately set, easy to each
From processing.Shell is connected with air outlet by connecting seat, convenient for assembly.
As an improvement, the dehumidifying main body further includes the seat that keeps out the wind being arranged at below fan, the company of opening up on the seat that keeps out the wind
The water hole of water flowing case.The seat that keeps out the wind below fan is set, and the seat that keeps out the wind is oriented to wind so that the wind after refrigeration is via wind
Fan flows up.Keep out the wind and the water hole of joining water box is opened up on seat, ponding can drain into water tank from water hole.
As an improvement, the inner casing lower end, which is equipped with, is tilted towards outer Diversion Plate, connection drip tray, institute below the Diversion Plate
State drip tray and drainage gallery is equipped between the seat that keeps out the wind.Diversion Plate and drainage gallery are set, avoid condensed water from gathering.
As an improvement, the magnetic reed switch for sensed water level is equipped with the water tank.Magnetic reed switch detection is accurate, uses the longevity
Life length.
Present invention has the advantages that：Shell is equipped with circumferential air inlet, and surrounding inlet air, top outlet air, increases intake,
Improve dehumidification efficiency；Only Component service can be exchanged for multigroup semiconductor heat at the same time using a fan, reduce noise.
Brief description of the drawings
Fig. 1 is the stereogram of the embodiment of the present invention one.
Fig. 2 is the exploded view of the embodiment of the present invention one.
Fig. 3 is the front view of the embodiment of the present invention one.
In Fig. 4 A-A to sectional view.
Fig. 5 is the structure diagram of the dehumidifying main body of the embodiment of the present invention one.
Fig. 6 is the structure diagram of the air outlet of the embodiment of the present invention one.
Fig. 7 is the structure diagram of the connecting seat of the embodiment of the present invention one.
Fig. 8 is the wind direction flow schematic diagram of the dehumidifier of the embodiment of the present invention one.
Fig. 9 is the schematic cross-section of the radiating piece of the embodiment of the present invention two.
In figure, 1, base, 11, water tank；
2nd, dehumidifying main body, 21, inner casing, 22, conduction cooling part, 221, cool guide sheet, 23, radiating piece, 230, radiating bottom plate, 231, heat dissipation
Piece, 232, heat dissipating ring muscle, 233, radiating ribs, 24, semiconductor chilling plate, 25, Diversion Plate, 26, drip tray, 27, keep out the wind seat, 28,
Drainage gallery,
3rd, shell；
4th, air outlet, 41, arc rib, 411, exhaust vent, 42, ring muscle, 43, cover board；
5th, air inlet；
6th, connecting seat；
7th, fan.
Embodiment
With reference to the attached drawing of the embodiment of the present invention, the technical solution of the embodiment of the present invention is explained and illustrated, but
Following embodiments are merely a preferred embodiment of the present invention, and not all.Based on the embodiment in embodiment, people in the art
The other embodiment that member is obtained on the premise of creative work is not made, belongs to protection scope of the present invention.
Referring to Fig. 1 to Fig. 9, a kind of high efficiency semiconductor dehumidifier, including dehumidifying main body, be located at it is outer outside dehumidifying main body
Shell, the dehumidifying main body include erectting the inner casing and semiconductor heat exchanger assembly set, and the region of the inner housing inner is formed out
Wind chamber, the region between the inner casing and shell form air-inlet cavity, and the semiconductor heat exchanger assembly includes being distributed in described
The conduction cooling part of air-inlet cavity, the radiating piece for being distributed in the air-out chamber and and between conduction cooling part and radiating piece and and conduction cooling
Part, the semiconductor chilling plate of radiating piece heat transfer, the shell are equipped with circumferentially distributed air inlet, the top of the shell equipped with pair
Answer the air outlet of the air-out chamber, fan be equipped with below the inner casing, realized under the suction of the fan around dehumidifier into
Wind, top outlet air.
The dehumidifier of the present invention, the shell circumferential direction inlet air of its dehumidifying main body, increases intake, improves dehumidification efficiency；
Air outlet is arranged at cover top portion, and top outlet air, can avoid wind from directly blowing to human body.
Embodiment one
Referring to Fig. 1 to Fig. 8, a kind of high efficiency semiconductor dehumidifier, including base 1, the dehumidifying main body 2 of the top of base 1 installation, dehumidifying
The shell 3 being provide with outside main body 2, is equipped with water tank 11 in base 1, fan 7 is equipped with dehumidifying main body 2, dehumidifying main body 2 includes inner casing 21
With the semiconductor heat exchanger assembly on inner casing 21, semiconductor heat exchanger assembly includes conduction cooling part 22, radiating piece 23 and conduction cooling part
Semiconductor chilling plate 24 between 22 and radiating piece 23, the top of shell 3 are equipped with air outlet 4, and the inner casing 21 is hollow multiaspect
Body structure, each side of the inner casing 21 are equipped with semiconductor heat exchanger assembly, and the conduction cooling part 22 is located at the outside of inner casing 21,
The radiating piece 23 is located at the inner side of inner casing 21, and each side of the shell 3 is equipped with air inlet 5, under the suction of fan 7,
Air enters from air inlet 5, followed by conduction cooling part 22, fan 7, radiating piece 23, then discharges from air outlet 4.
After tested, the moisture removal of dehumidifier of the invention can reach 1000ml/24h, and semiconductor currently on the market
The moisture removal of dehumidifier is generally all between 100ml/24h-600ml/24h.
The quantity of the fan 7 is one.One fan 7 can exchange Component service for multigroup semiconductor heat at the same time, only make
With a fan 7, noise is reduced.
Referring to Fig. 2 to Fig. 4, a kind of high efficiency semiconductor dehumidifier, including base 1, dehumidifying main body 2, shell 3, air inlet 5,
Fan 7, air outlet 4.Water tank 11 is equipped with base 1.Dehumidifying main body 2 includes inner casing 21 and semiconductor heat exchanger assembly.7 water of fan
Safety fills, it produces wind straight up.Base 1 is assembled by multiple components.Air inlet hole, air inlet hole are opened up on air inlet 5
In window-like so that air inlet 5 is handsome in appearance.
The inner casing 21 is hollow four-side body structure.It is high compared to trihedral, tetrahedral structure space availability ratio.Compared to five faces
Body and more multiaspect or circle, tetrahedral structure are easy to process.Inner casing 21 is hollow rectangular parallelepiped structure, in-between up/down perforation.
Shell 3 is engaged with inner casing 21, therefore shell 3 is also tetrahedral structure, four sides inlet air, top outlet air, one integrated mass, without distinguishing
All around, it is front and rear to solve the problems, such as that dehumidifier is distinguished in appearance.
Shell 3 is inserted into dehumidifying main body 2, and 2 inner wall of dehumidifying main body is equipped with fixture block, and card slot, dehumidifying main body 2 are opened up on shell 3
Connected with shell 3 by fixture block with card slot.2 bottom of dehumidifying main body opens up the water hole of joining water box 11.
Four side walls of inner casing 21 open up through hole, and semiconductor chilling plate 24 is installed in through hole.The conduction cooling part in the outside of inner casing 21
22 contact with semiconductor chilling plate 24, and the radiating piece 23 of the inner side of inner casing 21 is contacted with semiconductor chilling plate 24.
Referring to Fig. 5, the conduction cooling part 22 includes the cool guide sheet 221 that multi-disc is vertically arranged, and each cool guide sheet 221 is relative to inner casing 21
Side tilts, and each cool guide sheet 221 is parallel to each other.Cool guide sheet 221 is tilted with respect to the side of inner casing 21, is increased and is connect with humid air
Contacting surface is accumulated, and improves effect on moisture extraction.Cool guide sheet 221 is vertically arranged so that inlet air is smooth.Conduction cooling part 22 is integrally formed.Conduction cooling part 22
Fixed by fastener and inner casing 21, gap is more than other phases between the cool guide sheet 221 at both ends and cool guide sheet 221 adjacent thereto
Gap between adjacent cool guide sheet 221, installation space is reserved for fastener.
The radiating piece 23 includes the heat sink 231 that multi-disc is vertically arranged, each 231 undulate of heat sink, each 231 phase of heat sink
It is mutually parallel.231 undulate of heat sink, increase and the contact area of cold air, so as to ensure the air of discharge and the sky flowed into
The temperature difference of gas is in allowed band.Heat sink 231 is vertically arranged so that outlet air is smooth.Inner wall of the heat sink 231 perpendicular to inner casing 21.Dissipate
Warmware 23 is integrally formed.
The radiating bottom plate 230 is bonded with the inner wall of the inner casing 21, and through hole is opened up on the inner casing 21, described
Semiconductor chilling plate 24 is located in the through hole and is connected with the radiating bottom plate 230,22 heat conduction of conduction cooling part.
21 lower end of inner casing, which is equipped with, is tilted towards outer Diversion Plate 25.By setting Diversion Plate 25, water droplet is avoided to float towards wind
Fan 7.25 both sides of Diversion Plate are equipped with water fender, and Diversion Plate 25 and water fender are above 21 lower face of inner casing.The lower section of Diversion Plate 25 is also
Equipped with drip tray 26, the lower section of fan 7 is equipped with the seat 27 that keeps out the wind, and the water in drip tray 26 keeps out the wind seat 27 through the flow direction of drainage gallery 28, gear
Water hole is opened up in wind seat 27, water is flow in water tank 11 from water hole.The drainage gallery 28 of connection drip tray 26 and the seat 27 that keeps out the wind is located at
Corner, drainage gallery 28 are formed by pipeline, have gap between the seat 27 that keeps out the wind below pipeline, so that current pass through.
Seat 27 keep out the wind in addition to for being oriented to wind, is additionally operable to installation drip tray 26 and the grade component of inner casing 21.Keep out the wind seat
27 are equipped with the mounting base erect, and the lower section of drip tray 26 is equipped with the mounting post that can be inserted into mounting base.
Referring to Fig. 6, the air outlet 4 has more arc ribs 41 of arc, and each arc rib 41 is from center to edge
Radiate, the gap between arc rib 41 forms exhaust vent 411.Arc arc rib 41 play the guiding role wind, makes around wind direction
Diffusion, increases outlet air profile.
The center of each arc rib 41 is low, edge is high.Arc rib 41 is distributed in swirl shape, and air-out effect is good.
Referring to Fig. 4, the center of the air outlet 4 is equipped with ring muscle, and each 41 the inner of arc rib connects out vane muscle 42, described
Go out 42 upper surface of vane muscle and be equipped with cover board 43.The inner of arc rib 41 is connected by going out vane muscle 42, arc rib 41 is not variable
Shape, ensures structural strength.Go out 42 upper surface of vane muscle and be equipped with cover board 43, ensure that dehumidifier appearance and modeling is beautiful, and prevent debris
Fall into.
Referring to Fig. 7, the shell 3 and air outlet 4 are connected by a connecting seat 6.Shell 3 and air outlet 4 are separately set, just
In respective processing.Shell 3 and air outlet 4 are connected by connecting seat 6, convenient for assembly.Connecting seat 6 has the wind-guiding face of arc,
Wind-guiding face is upper.Connecting seat 6 is caught in inner casing 21, and air outlet 4 is caught in connecting seat 6.
The magnetic reed switch (not shown) for sensed water level is equipped with the water tank 11.Magnetic reed switch detection is accurate, makes
Use long lifespan.
Referring to Fig. 8, the operation principle of the embodiment of the present invention：Semiconductor chilling plate 24 is powered, its inner side temperature rise, outside
Side temperature reduces, and after fan 7 starts, indoor humid air enters in dehumidifier from the air inlet 5 on shell 3, and humid air is with leading
First time heat exchange occurs for cold part 22, its heat is absorbed by conduction cooling part 22, and temperature is reduced to dew point, and the vapor in humid air coagulates
Form droplet, below spatial flow of the cold air after first time heat exchange between inner casing 21 and shell 3 to fan 7, due to
Keeping out the wind the stop of seat 27, cold air can only be flowed in inner casing 21 by fan 7 and second of heat exchange occurs with radiating piece 23,
Cold air is absorbed after heat recovers to room temperature discharges from the air outlet 4 at the top of dehumidifier.The droplet produced during dehumidifying,
It is flow to via Diversion Plate 25, drip tray 26, drainage gallery 28, the seat 27 that keeps out the wind in water tank 11.
Embodiment two
Embodiment two and the difference of embodiment one are radiating piece 23.
Referring to Fig. 9, what multi-disc that the radiating piece 23 includes setting on radiating bottom plate 230 and radiating bottom plate 230 was vertically arranged dissipates
Backing 231, each 231 undulate of heat sink.Radiating bottom plate 230 is bonded with the inner side of semiconductor refrigerating part 22.Each radiating piece 23
Radiating bottom plate 230 be connected as a single entity and surround closed loop, heat dissipating ring muscle 232 is equipped with the closed loop that each radiating bottom plate 230 surrounds, it is described
Heat dissipating ring muscle 232 is connected as a single entity by radiating ribs 233 and part heat sink 231.
Four radiating pieces 23 of four groups of semiconductor heat exchanger assemblies are connected as a single entity, rather than four single radiating pieces 23, carry
High structural strength, improving radiating effect.The heat sink of auxiliary also is provided with four corners of rectangle closed loop.Heat sink 231, dissipate
The setting of hot ring muscle 232, radiating ribs 233 and auxiliary heat dissipation piece, greatly promotes heat dissipation effect.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, and is familiar with
The those skilled in the art should be understood that the present invention includes but not limited to attached drawing and interior described in embodiment above
Hold.The modification of any function and structure principle without departing from the present invention is intended to be included in the scope of claims.
Claims (10)
- A kind of 1. high efficiency semiconductor dehumidifier, it is characterised in that：Including dehumidifying main body (2), it is located at dehumidifying main body (2) outside outer Shell (3), the dehumidifying main body (2) include erectting the inner casing (21) and semiconductor heat exchanger assembly set, and the inner casing (21) is interior The region in portion forms air-out chamber, and the region between the inner casing (21) and shell (3) forms air-inlet cavity, and the semiconductor heat is handed over Changing component includes being distributed in conduction cooling part (22), the radiating piece (23) for being distributed in the air-out chamber and and the position of the air-inlet cavity The semiconductor chilling plate (24) to conduct heat between conduction cooling part (22) and radiating piece (23) and with conduction cooling part (22), radiating piece (23), The shell (3) is equipped with circumferentially distributed air inlet (5), and the top of the shell (3) is equipped with the outlet air of the corresponding air-out chamber Mouth (4), inner casing (21) lower section are equipped with fan (7), inlet air around dehumidifier, top are realized under the suction of the fan (7) Portion's outlet air.
- A kind of 2. high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that：The inner casing (21), shell (3) It is hollow four-side body structure or is cylinder-like structure.
- A kind of 3. high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that：The quantity of the fan (7) is One.
- A kind of 4. high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that：In the radiating piece (23) uses The mode of portion's ventilation and heat, the radiating piece (23) include radiating bottom plate (230) and the multi-disc being distributed on radiating bottom plate (230) Vertical heat sink (231), each heat sink (231) undulate.
- A kind of 5. high efficiency semiconductor dehumidifier according to claim 4, it is characterised in that：The heat dissipation bottom of each radiating piece (23) Plate (230) is connected as a single entity and surrounds closed loop, and heat dissipating ring muscle (232) is equipped with the closed loop that each radiating bottom plate (230) surrounds, described to dissipate Hot ring muscle (232) is connected as a single entity by radiating ribs (233) and part heat sink (231).
- A kind of 6. high efficiency semiconductor dehumidifier according to claim 4, it is characterised in that：The radiating bottom plate (230) It is bonded with the inner wall of the inner casing (21), through hole is opened up on the inner casing (21), the semiconductor chilling plate (24) is located at It is connected in the through hole and with the radiating bottom plate (230), conduction cooling part (22) heat conduction.
- A kind of 7. high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that：The dehumidifier further includes base (1), water tank (11) is equipped with the base (1), the dehumidifying main body (2) is installed on base (1), the base (1) and is removed Wet main body (2) is superimposed up and down.
- A kind of 8. high efficiency semiconductor dehumidifier according to claim 7, it is characterised in that：It is equipped with and uses in the water tank (11) In the magnetic reed switch of sensed water level.
- A kind of 9. high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that：The air outlet (4) has more Root arc rib (41), each arc rib (41) is from center to fringe radiation, and the center of each arc rib (41) is low, edge is high, Gap between arc rib (41) forms exhaust vent (411), and the center of the air outlet (4) is equipped with out vane muscle (42), each arc Shape rib (41) the inner connects out vane muscle (42), it is described go out vane muscle (42) upper surface be equipped with cover board (43).
- A kind of 10. high efficiency semiconductor dehumidifier according to claim 1, it is characterised in that：The dehumidifying main body (2) is also wrapped The seat that keeps out the wind (27) being arranged at below fan (7) is included, osculum is opened up on the seat that keeps out the wind (27), inner casing (21) lower end is set Have and be tilted towards outer Diversion Plate (25), be equipped with drip tray (26) below the Diversion Plate (25), the drip tray (26) is with keeping out the wind Drainage gallery (28) is equipped between seat (27).
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| CN201711087908.0A CN107940619A (en) | 2017-11-08 | 2017-11-08 | A kind of high efficiency semiconductor dehumidifier |
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| CN201711087908.0A CN107940619A (en) | 2017-11-08 | 2017-11-08 | A kind of high efficiency semiconductor dehumidifier |
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| CN107940619A true CN107940619A (en) | 2018-04-20 |
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| CN113623893A (en) * | 2021-08-17 | 2021-11-09 | 杭州威联机电有限公司 | Energy-saving consumption-reducing type refrigeration equipment with double refrigeration sheets |
| CN115143547A (en) * | 2022-08-08 | 2022-10-04 | 珠海格力电器股份有限公司 | Dehumidifier and dehumidification method |
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Application publication date: 20180420 |