CN102661618B - Closed water circulation semiconductor refrigeration dehumidifying air conditioning device - Google Patents
Closed water circulation semiconductor refrigeration dehumidifying air conditioning device Download PDFInfo
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- CN102661618B CN102661618B CN2012101552518A CN201210155251A CN102661618B CN 102661618 B CN102661618 B CN 102661618B CN 2012101552518 A CN2012101552518 A CN 2012101552518A CN 201210155251 A CN201210155251 A CN 201210155251A CN 102661618 B CN102661618 B CN 102661618B
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Abstract
The invention discloses a closed water circulation semiconductor refrigeration dehumidifying air conditioning device, which comprises a refrigeration box, a semiconductor refrigerator component, a water collecting tray, a condensate water drainage thin tube, a water storage tank, a closed water circulation radiator component, an axial fan, a temperature and humidity sensor, a singlechip industrial control unit and the like, wherein the semiconductor refrigerator component serves as a refrigeration source; hot humid air is treated in the refrigeration box through a precooling chamber and a condensing chamber to form liquid water, and the liquid water is condensed and separated out; the temperature and humidity of the air are reduced; a grid radiator of the semiconductor refrigerator component is subjected to forced water-cooling and cooling by the closed water circulation radiator component; and the whole device is automatically controlled and operated by the singlechip industrial control unit. The invention provides a dehumidifying air conditioning device which is small in size, light in weight, firm, durable, pollution-free and basically noiseless and has a monolithic structure. The dehumidifying air conditioning device is applied to small spaces which are isolated from outside atmospheric environment and are relatively independent and closed, and have requirements in specific aspects, such as cabins of armored car carriages, submarines and vessels and storage and placement rooms of valuables and precision meters.
Description
Technical field
The present invention relates to a kind of closed circuit water circulation semiconductor refrigerating wet down conditioner, belong to the technical field of semiconductor refrigerating wet down air conditioning.
Background technology
Air humidity be one with mankind's activity, the closely-related ambient parameter physical quantity of social development.For example, the people lives, works under high humidity environment, can feel not quite the thing, haves the fidgets, refreshing tired power is weary, endurable.Higher humidity makes some biological pollutants as the breeding diffusion rapidly of fungi (comprising mould), bacterium, virus, very harmful.The preservation of many valuables, precision instrument and accommodation space have strict restriction to humidity.The production technology of many light industry, chemical products is to existence clear on ambient humidity.Therefore, the too high air humidity of given environment space humid air being dropped in permissible value, is all important in a lot of fields.The wet down technology of extensive use at present (some people is accustomed to claiming " dehumidifying ") mainly contains two large classes: a class is that the hygroscopic agent made from solid or liquid hygroscopic materials is adsorbed (or absorption) to pending airborne aqueous vapor, then the method by heating makes hygroscopic agent desorption (separate and absorb), hygroscopic agent recovers the moisture pick-up properties so-called " regeneration " to aqueous vapor, and circulation reaches the wet down effect according to this; Another kind of mechanical compression refrigeration formula wet down is that to utilize lower boiling refrigeration working medium liquid absorption surrounding medium be the heat of pending air and evaporate pending air cooling-down.Compressor converts the refrigeration working medium of gasification to liquid again, and process of refrigerastion is constantly circulation in the system of a sealing.When pending air themperature drops to below dew point, the liquid condensation elutriation goes out, and reaches the wet down effect.
The dehumidifying equipment of producing according to above-mentioned wet down technology has been brought into play important function aspect numerous.But, these conventional arts are except each own some deficiency, all exist equipment volume large, need take the larger installation site characteristics of indoor, off-premises station etc. even in addition, the application of the relatively independent airtight small space of depositing of some cabin, some valuables and the precision instrument of demand such as armoring compartment, submarine and the ships of some particular aspects, settling chamber etc. and ambient atmosphere environment to cut off, traditional absorption (absorptions) formula, mechanical compression refrigeration formula dehumidifying equipment just are difficult to use; And these spaces are normally isolated by iron and steel housing and ambient atmosphere environment facies, thereby the heat that any wet down apparatus of air conditioning produces also is difficult to directly by the cooling mode of wind, through air-cooled pipeline, be discharged to ambient atmosphere.
For overcoming the deficiencies in the prior art, the needs that adapt to these small-sized particular space scope wet down air conditionings, the invention provides a kind of new technical scheme, application semiconductor cooler assembly is refrigeration source, pending damp-heat air is becoming the supersaturated air lower than dew point after the processing of fore-cooling room, condensation chamber in refrigeration case, aqueous water condenses and separates out, the cooling of air wet down, closed circuit water circulation heat sink assembly carries out the Forced water cooling cooling to the grid gilled radiator of semiconductor refrigerator assembly, and full machine adopts single-chip microcomputer industry control unit autocontrol operation.What the present invention built is little, lightweight, sturdy and durable, pollution-free, the basic noiselessness of a kind of volume, the wet down conditioner of monomer structure.
Semiconductor cooling device (being commonly called as thermoelectric pile), the application of back wash effect peltier effect (Peltier Effect) aspect Refrigeration Technique of Seebeck effect (Seeback Effect), development along with the semi-conducting material technology, semiconductor refrigerating has become a kind of novel refrigeration modes, and the user can be designed to semiconductor cooling device and peripheral components combination cooling assembly or the system of the different purposes of different structure.Semiconductor cooler is exactly in fact the electron heat pump of current-control type, without other refrigeration working medium.Semiconductor refrigeration structure is simple, the machinery-free moving component, and volume is little, and reliability is strong, noiseless, friction, long-life.The semiconductor cooling device thermal inertia is very little, and the cooling and warming time is very fast, and the exchanging electric current direction can realize that the refrigerated medium hot junction exchanges, and regulates the output that size of current can change the refrigerated medium heat.
Summary of the invention
A kind of closed circuit water circulation semiconductor refrigerating wet down conditioner, include refrigeration case, the semiconductor cooler assembly, pallet catchments, condensed water drainage tubule, storage tank, closed circuit water circulation heat sink assembly, aerofoil fan, humidity temperature pickup, the formations such as single-chip microcomputer industry control unit, refrigeration case is covered with the polyurethane insulating outward, comply with and horizontally be separated into fore-cooling room by two vertical partition plates that are parallel to each other in refrigeration case, the airflow-reversing passage, condensation chamber, dividing plate lower end, fore-cooling room has air stream outlet, condensation chamber dividing plate upper end has air flow inlet, narrower space between fore-cooling room's dividing plate and condensation chamber dividing plate is the airflow-reversing passage, the refrigeration case inner bottom part has the pallet of catchmenting, and there is storage tank refrigeration case outer bottom below, on the pallet that catchments, has condensed water drainage tubule to be communicated with storage tank, and the condensed water generated in refrigeration case is drained into to storage tank, be provided with humidity temperature pickup at the air intake of fore-cooling room and the air outlet slit of condensation chamber, be provided with grid chip cooler in fore-cooling room, condensation chamber, grid sheet direction is parallel with airflow direction, the identical semiconductor cooler assembly of two groups of structures is respectively to fore-cooling room, the condensation chamber refrigeration cool-down, the semiconductor cooler assembly is by semiconductor cooling device, trapezoidal cool guiding block, trapezoidal heat-conducting block, grid chip cooler, the grid type water cooling radiator forms, the huyashi-chuuka (cold chinese-style noodles) close-coupled of the leptoprosopy of trapezoidal cool guiding block and semiconductor cooling device, wide be placed in fore-cooling room, grid chip cooler close-coupled in condensation chamber, the hot side close-coupled of the leptoprosopy of trapezoidal heat-conducting block and semiconductor cooling device, wide with the water cooling case that is placed in closed circuit water circulation heat sink assembly in grid type water cooling radiator close-coupled, the trapezoidal conduction cooling that size shape is identical, heat-conducting block is made by red copper or aluminium, the leptoprosopy size is cold with semiconductor cooling device, hot side is identical, wide is roughly 1.5 ︰ 1 with the every edge lengths ratio of leptoprosopy, trapezoidal height equals leptoprosopy Average Onesided length (on market, existing semiconductor cooling device is mainly square and two kinds of shapes of rectangle), such structure has thermal diffusion effect preferably, the whole space that comprises semiconductor cooling device between two wide of trapezoidal cool guiding block and trapezoidal heat-conducting block is filled adiabatic with rigid polyurethane foams, closed circuit water circulation heat sink assembly includes two heat loss through conduction case H1 that structure is identical, H2, two water cooling case L1 that structure is identical, L2, micro pump, the water-flow circuit duct coupling, the priming valve door, Draw off valve forms, fore-cooling room, the grid type water cooling radiator of two groups of semiconductor cooler assemblies of condensation chamber is placed in respectively in two water cooling casees, grid sheet direction is parallel with water (flow) direction, the grid gilled radiator is arranged in the heat loss through conduction case, grid sheet direction is parallel with water (flow) direction, take water as heat-exchange carrier in the whole closed circuit of closed circuit water circulation heat sink assembly, micro pump provides Water circulation hydrodynamics, reference arrow indication water (flow) direction, the connection of water-flow circuit pipeline is the entrance that the outlet of water cooling case L1 is connected to heat loss through conduction case H2, the outlet of heat loss through conduction case H2 is connected to the entrance of water cooling case L2, the outlet of water cooling case L2 is connected to the entrance of heat loss through conduction case H1, the outlet of heat loss through conduction case H1 is connected to the entrance of water cooling case L1.
When the aerofoil fan (icon F) of refrigeration case condensation chamber lower end air stream outlet installs environment space of living in by the Bas Discharged after reducing temperature and humidity is processed to this, pending air is sucked from the airflow inlet of upper end, fore-cooling room, flow downward in fore-cooling room and lower the temperature, then to enter the airflow-reversing passage up for the air stream outlet through dividing plate lower end, fore-cooling room, enter the descending and further cooling of condensation chamber after airflow inlet by condensation chamber dividing plate upper end, the spatial volume of condensation chamber is greater than fore-cooling room, air slows down at the condensation chamber flow velocity, favourable heat exchange fully, make air continue cooling, when the temperature of air drops to dew point when following at condensation chamber, oversaturated aqueous vapor will condense into aqueous water on the grid sheet of grid chip cooler, drip the pallet that catchments of system ice chest inner bottom part under Action of Gravity Field.The condensed water drainage tubule of pallet of catchmenting drains into storage tank by condensed water, can add the cold recycling of a pipe heat exchanger to cryogenic condensation water, lowers the temperature for example to the air heat exchange entered before fore-cooling room.Condensed water in storage tank can be toppled at any time.
Part vaporous water contained in air changes into aqueous water and separates from air in condensation chamber, the vapor content of air reduces, become the wet down Cryogenic air, be transported to through the aerofoil fan of condensation chamber lower stream of airflow outlet this that need do the wet down air conditioning and install environment space of living in.It is to wish hot and humid air conditioning is become to the low temperature and low humidity air that people in most cases locates the subenvironment space.Only require wet down and do not wish in the situation of cooling to apply for some, a pipe heat exchanger can be set below water cooling case L2 entrance, the wet down Cryogenic air that condensation chamber is discharged exchanges after heating and discharges through this heat exchanger and circulating water heating.
Closed circuit water circulation heat sink assembly be take water as carrier, the grid type water cooling radiator in semiconductor refrigerator assembly D1, D2 hot junction is carried out to forced water cooling.The cold water that heat loss through conduction case H1 flows out enters into water cooling case L1, carry out heat exchange with the grid type water cooling radiator that is placed in the semiconductor cooler assembly D1 hot junction, fore-cooling room in L1, take away heat and become hot water, flow into heat loss through conduction case H2, the grid gilled radiator of settling in H2 carries out heat exchange, the cold water flowed out from heat loss through conduction case H2 enters water cooling case L2, with the grid type water cooling radiator pad exchange that is placed in the condensation chamber semiconductor cooler assembly D2 hot junction in L2, take away heat and become hot water, flow into heat loss through conduction case H1, the grid gilled radiator of settling in H1 carries out heat exchange and becomes the cold water outflow, circulation according to this.Grid gilled radiator heat-conducting base and this equipment accommodation space steel and iron wall interplanar in heat loss through conduction case H1, H2 have the heat-conducting silicone grease film, the heat conduction that closely hot water is carried in crimping diffuses to periphery, and the hot water that flows into the heat loss through conduction case becomes cold water and flows out from the outlet of heat loss through conduction case after conducting heat.The semiconductor cooler assembly is electron heat pump, the heat of air in refrigeration case is pumped to (causing air cooling-down condensation wet down), through the grid type water cooling radiator by transfer of heat to water carrier, water is diffused into periphery through the heat loss through conduction case by Steel Space iron-clad wall of living in conduction by heat again.
Be provided with humidity temperature pickup TR1, TR2 at the air intake of fore-cooling room and the air outlet slit of condensation chamber, temperature, the humidity data of monitoring pending air and the rear air of reducing temperature and humidity processing are transported to single-chip microcomputer industry control unit and carry out analyzing and processing.On the single-chip microcomputer industry control unit formed by one chip microcomputer and peripheral circuit, ON-OFF control circuit etc., temperature, humidity information input bus are arranged, semiconductor cooler assembly power supply control bus, refrigeration case aerofoil fan and closed circuit water circulation heat sink assembly micro pump power supply control bus; On single-chip microcomputer industry control unit, also have the alarm of this plant failure to show.When the environment space temperature of living in that TR1 measures, humidity surpass setting threshold, the full machine work of single-chip microcomputer industry control unit starting, also can manually control.If will be to the pole reversal of semiconductor refrigerator assembly D1, D2 direct current supply, this device becomes the equipment that hot blast is provided to settled environment space, and operation in the case should change the water in closed circuit water circulation heat sink assembly into anti-icing fluid with anti-freeze.
The accompanying drawing explanation
Accompanying drawing 1 is closed circuit water circulation semiconductor refrigerating wet down conditioner technology schematic diagram.
As shown in Figure 1: pending air intake 1, fore-cooling room 2, fore-cooling room's dividing plate 3, airflow-reversing passage 4, condensation chamber dividing plate 5, refrigeration case 6, condensation chamber 7, grid chip cooler 8, priming valve door 9, duct coupling 10, water cooling case 11(icon L1, L2), grid type water cooling radiator 12, trapezoidal cool guiding block 13, semiconductor cooling device 14, trapezoidal heat-conducting block 15, the adiabatic packed layer 16 of rigid polyurethane foams, humidity temperature pickup 17(icon TR1, TR2), aerofoil fan 18(icon F), micro pump 19(icon P), condensed water drainage tubule 20, pallet 21 catchments, storage tank 22, heat loss through conduction case 23(icon H1, H2), Draw off valve 24(icon K1, K2), grid gilled radiator 25, single-chip microcomputer industry control unit 26.
The specific embodiment
According to the required space size that carries out the wet down air conditioning, humidity, temperature, the atmospheric pressure scope of conventional micro climate, target humidity after the wet down air conditioning, temperature range, estimate the refrigerating capacity of fore-cooling room and condensation chamber, selects semiconductor cooling device by certain surplus accordingly.According to setting refrigerating capacity, the supplying DC voltage that this appliance arrangement is given, such as DC12 volt, 24 volts, 48 volts etc. determines that the semiconductor cooling device of selected model specification is built into the semiconductor cooler assembly of fore-cooling room, condensation chamber by several monolithic serial or parallel connections.On market, existing semiconductor cooling device monolithic is mainly square and two kinds of shapes of rectangle; Trapezoidal conduction cooling, heat-conducting block are processed into by red copper or aluminium material casting milling.According to air velocity, temperature, theoretical cryogenic temperature, heat exchange amount, the grid sheet area physical dimension that estimates fore-cooling room, condensation chamber grid chip cooler selects approved product to use, and usually dying black or oxidation technology aluminum finished product can.Semiconductor cooler is exactly in fact the electron heat pump of current-control type, at hot junction liberated heat Qh, equals input electric power P and cold junction refrigeratory capacity Qc sum: Qh=P+Qc; Determine that according to the refrigeratory capacity of fore-cooling room, condensation chamber and input electric power the hot junction liberated heat that need fall apart selects the specification of grid type water cooling radiator, can select approved product.The ambient temperature range used according to this device, the heat that the grid type water cooling radiator of fore-cooling room, condensation chamber semiconductor cooler assembly need be removed, water flow velocity and the steel heat coefficient of conductivity etc. estimate the structural area of the grid gilled radiator in the heat loss through conduction case, select approved product.Water cooling case, heat loss through conduction case, storage tank are stainless steel structure, and grid type water cooling radiator and the grid gilled radiator in the heat loss through conduction case in the water cooling case are antiseptic aluminum products or stainless steel products.The micro pump of low-voltage DC supply is approved product.Air stream outlet aerofoil fan F after the technical conditions selection condensation chamber wet down of the applied environment of aforementioned wet down conditioner of foundation, it is the direct current supply aerofoil fan approved product that air quantity can be automatically controlled.Humidity temperature pickup TR1, TR2 can be the combination sensors of temperature and humidity, can be also discrete sensor, select the market standard product, and medium accuracy gets final product.One chip microcomputer is called for short single-chip microcomputer, and on market, specification is more, and the present invention can select 8 single-chip microcomputers to join corresponding peripheral components formation industry control unit.Programme according to a conventional method in single-chip microcomputer industry control unit.
Claims (2)
1. a closed circuit water circulation semiconductor refrigerating wet down conditioner, include refrigeration case, the semiconductor cooler assembly, pallet catchments, condensed water drainage tubule, storage tank, closed circuit water circulation heat sink assembly, aerofoil fan, humidity temperature pickup, single-chip microcomputer industry control cell formation, it is characterized in that refrigeration case is covered with the polyurethane insulating outward, comply with and horizontally be separated into fore-cooling room by two vertical partition plates that are parallel to each other in refrigeration case, the airflow-reversing passage, condensation chamber, dividing plate lower end, fore-cooling room has air stream outlet, condensation chamber dividing plate upper end has air flow inlet, narrower space between fore-cooling room's dividing plate and condensation chamber dividing plate is the airflow-reversing passage, the refrigeration case inner bottom part has the pallet of catchmenting, and there is storage tank refrigeration case outer bottom below, on the pallet that catchments, has condensed water drainage tubule to be communicated with storage tank, be provided with humidity temperature pickup at the air intake of fore-cooling room and the air outlet slit of condensation chamber, be provided with grid chip cooler in fore-cooling room, condensation chamber, grid sheet direction is parallel with airflow direction, the identical semiconductor cooler assembly of two groups of structures is respectively to fore-cooling room, the condensation chamber refrigeration cool-down, the semiconductor cooler assembly is by semiconductor cooling device, trapezoidal cool guiding block, trapezoidal heat-conducting block, grid chip cooler, the grid type water cooling radiator forms, the huyashi-chuuka (cold chinese-style noodles) close-coupled of the leptoprosopy of trapezoidal cool guiding block and semiconductor cooling device, wide be placed in fore-cooling room, grid chip cooler close-coupled in condensation chamber, the hot side close-coupled of the leptoprosopy of trapezoidal heat-conducting block and semiconductor cooling device, wide with the water cooling case that is placed in closed circuit water circulation heat sink assembly in grid type water cooling radiator close-coupled, the whole space that comprises semiconductor cooling device between two wide of trapezoidal cool guiding block and trapezoidal heat-conducting block is filled adiabatic with rigid polyurethane foams, closed circuit water circulation heat sink assembly includes two heat loss through conduction case (H1 that structure is identical, H2), two water cooling case (L1 that structure is identical, L2), micro pump, the water-flow circuit duct coupling, the priming valve door, Draw off valve forms, fore-cooling room, the grid type water cooling radiator of two groups of semiconductor cooler assemblies of condensation chamber is placed in respectively in two water cooling casees, grid sheet direction is parallel with water (flow) direction, the grid gilled radiator is arranged in the heat loss through conduction case, grid sheet direction is parallel with water (flow) direction, the connection of water-flow circuit pipeline is the entrance that the outlet of water cooling case (L1) is connected to heat loss through conduction case (H2), the outlet of heat loss through conduction case (H2) is connected to the entrance of water cooling case (L2), the outlet of water cooling case (L2) is connected to the entrance of heat loss through conduction case (H1), the outlet of heat loss through conduction case (H1) is connected to the entrance of water cooling case (L1).
2. closed circuit water circulation semiconductor refrigerating wet down conditioner as claimed in claim 1, on the single-chip microcomputer industry control unit that it is characterized in that being formed by one chip microcomputer and peripheral circuit, ON-OFF control circuit, temperature, humidity information input bus are arranged, semiconductor cooler assembly power supply control bus, refrigeration case aerofoil fan and closed circuit water circulation heat sink assembly micro pump power supply control bus; On single-chip microcomputer industry control unit, also have the alarm of this plant failure to show.
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| CN2012101552518A CN102661618B (en) | 2012-05-18 | 2012-05-18 | Closed water circulation semiconductor refrigeration dehumidifying air conditioning device |
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| CN2012101552518A CN102661618B (en) | 2012-05-18 | 2012-05-18 | Closed water circulation semiconductor refrigeration dehumidifying air conditioning device |
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| CN104631553B (en) * | 2013-11-14 | 2016-08-24 | 中国人民解放军军械工程学院 | Air water equipment based on Peltier Refrigeration Technique |
| CN106288646B (en) * | 2016-08-18 | 2018-12-28 | 宁夏锐盛明杰知识产权咨询有限公司 | A kind of miniature water refrigerating plant for construction site |
| CN109542151B (en) * | 2018-12-18 | 2024-06-18 | 中国电子科技集团公司第十六研究所 | Environmental control equipment |
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| JPH05312456A (en) * | 1992-05-09 | 1993-11-22 | Frontier Fuiirudo Prod:Kk | Circulation and cooling mechanism for liquid in liquid cooling device using peltier element |
| JP2005257372A (en) * | 2004-03-10 | 2005-09-22 | Mitsubishi Electric Corp | Temperature testing device |
| CN102322704B (en) * | 2011-09-27 | 2013-04-10 | 程刚 | Semiconductor refrigerating and absorptive refrigerating interactive device |
| CN202598733U (en) * | 2012-05-18 | 2012-12-12 | 程刚 | Closed water circulation semiconductor refrigeration dehumidification air conditioning device |
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