CN102661618A - Closed water circulation semiconductor refrigeration dehumidifying air conditioning device - Google Patents
Closed water circulation semiconductor refrigeration dehumidifying air conditioning device Download PDFInfo
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- CN102661618A CN102661618A CN2012101552518A CN201210155251A CN102661618A CN 102661618 A CN102661618 A CN 102661618A CN 2012101552518 A CN2012101552518 A CN 2012101552518A CN 201210155251 A CN201210155251 A CN 201210155251A CN 102661618 A CN102661618 A CN 102661618A
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Abstract
The invention discloses a closed water circulation semiconductor refrigeration dehumidifying air conditioning device, which comprises a refrigeration box, a semiconductor refrigerator component, a water collecting tray, a condensate water drainage thin tube, a water storage tank, a closed water circulation radiator component, an axial fan, a temperature and humidity sensor, a singlechip industrial control unit and the like, wherein the semiconductor refrigerator component serves as a refrigeration source; hot humid air is treated in the refrigeration box through a precooling chamber and a condensing chamber to form liquid water, and the liquid water is condensed and separated out; the temperature and humidity of the air are reduced; a grid radiator of the semiconductor refrigerator component is subjected to forced water-cooling and cooling by the closed water circulation radiator component; and the whole device is automatically controlled and operated by the singlechip industrial control unit. The invention provides a dehumidifying air conditioning device which is small in size, light in weight, firm, durable, pollution-free and basically noiseless and has a monolithic structure. The dehumidifying air conditioning device is applied to small spaces which are isolated from outside atmospheric environment and are relatively independent and closed, and have requirements in specific aspects, such as cabins of armored car carriages, submarines and vessels and storage and placement rooms of valuables and precision meters.
Description
Technical field
The present invention relates to a kind of closed circuit water circulation semiconductor refrigerating and fall the humid air adjusting device, belong to semiconductor refrigerating and fall the technical field that humid air is regulated.
Background technology
Air humidity be one with mankind's activity, the closely-related ambient parameter physical quantity of social development.For example, the people lives under high humidity environment, works, and can feel not quite the thing, haves the fidgets, refreshing tired power lacks, is difficult to stand.Higher humidity makes the breeding diffusion rapidly of some biological pollutants such as fungi (comprising mould), bacterium, virus, and is very harmful.The preservation of many valuables, precision instrument and accommodation space all have strict restriction to humidity.Many light industrys, production process of chemical product are clearly stipulated existence on the ambient humidity.Therefore, the too high air humidity of given environment space humid air being dropped in the permissible value, all is important in a lot of fields.The wet technology (some people is accustomed to claiming " dehumidifying ") of falling of extensive use at present mainly contains two big types: one type is with the hygroscopic agent that solid or liquid hygroscopic materials are processed pending airborne aqueous vapor to be adsorbed (or absorption); Method through heating makes hygroscopic agent desorption (separating absorption) then; Hygroscopic agent recovers the moisture pick-up properties promptly so-called " regeneration " to aqueous vapor, and circulation reaches and falls wet effect according to this; Another kind of mechanical compression refrigeration formula is fallen wet, is that to utilize lower boiling refrigeration working medium liquid-absorbent surrounding medium be the heat of pending air and evaporate pending air cooling-down.Compressor converts the refrigeration working medium of gasification to liquid again, and process of refrigerastion is circulation constantly in the system of a sealing.When pending air themperature drops to below the dew point, the liquid condensation elutriation goes out, and reaches to fall wet effect.
According to the above-mentioned dehumidifying equipment that falls wet technology and produce, aspect numerous, brought into play important function.But; These conventional arts are except that each own some deficiency; All exist equipment volume big; Need take the characteristics of big installation site even indoor in addition, off-premises station etc., settle the application of the relatively independent airtight small space that chamber etc. and ambient atmosphere environment cut off depositing of some cabin, some valuables and the precision instrument of the for example armoring compartment of the demand of some particular aspects, submarine and ships, traditional absorption (absorptions) formula, mechanical compression refrigeration formula dehumidifying equipment just are difficult to use; And these spaces are normally isolated by iron and steel housing and ambient atmosphere environment facies, thereby anyly fall the heat that the humid air conditioning equipment produced and also be difficult to directly be discharged to ambient atmosphere with the air cooling mode through air-cooled pipeline.
For overcoming the deficiency of prior art; Adapt to these small-sized particular space scopes and fall the needs that humid air is regulated; The present invention provides a kind of new technical scheme, and using the semiconductor cooler assembly is refrigeration source, and pending damp-heat air becomes the supersaturated air that is lower than dew point after the processing of fore-cooling room, condensation chamber in refrigeration case; Aqueous water condenses and separates out; Wet cooling falls in air, and closed circuit water cycle heat radiation device assembly carries out the Forced water cooling cooling to the grid gilled radiator of semiconductor refrigerator assembly, and full machine adopts single-chip microcomputer industry control unit autocontrol operation.What the present invention made up is little, in light weight, sturdy and durable, pollution-free, the basic noiselessness of a kind of volume, monomer structure the humid air adjusting device falls.
Semiconductor cooling device (being commonly called as thermoelectric pile); Be the application of back wash effect peltier effect (Peltier Effect) aspect Refrigeration Technique of Seebeck effect (Seeback Effect); Development along with the semi-conducting material technology; Semiconductor refrigerating has become a kind of novel refrigeration modes, and the user can combine semiconductor cooling device and peripheral components to be designed to the cooling assembly or the system of the different purposes of different structure.Semiconductor cooler is exactly in fact the electron heat pump of current-control type, need not other refrigeration working medium.Semiconductor refrigerating is simple in structure, does not have mechanical moving component, and volume is little, good reliability, noiseless, friction, long-life.The semiconductor cooling device thermal inertia is very little, and the cooling and warming time is very fast, and the exchanging electric current direction can realize that the refrigerated medium hot junction exchanges, and regulates the output that size of current can change the refrigerated medium heat.
Summary of the invention
The humid air adjusting device falls in a kind of closed circuit water circulation semiconductor refrigerating; Include formations such as refrigeration case, semiconductor cooler assembly, the pallet that catchments, condensed water drainage tubule, storage tank, closed circuit water cycle heat radiation device assembly, aerofoil fan, humidity temperature pickup, single-chip microcomputer industry control unit; Refrigeration case is covered with the polyurethane insulating outward; Interior being complied with by two vertical partition plates that are parallel to each other of refrigeration case horizontally is separated into fore-cooling room, airflow-reversing passage, condensation chamber; Dividing plate lower end, fore-cooling room has air stream outlet, and condensation chamber dividing plate upper end has air flow inlet, and the narrower space between fore-cooling room's dividing plate and the condensation chamber dividing plate is the airflow-reversing passage; The refrigeration case inner bottom part has the pallet of catchmenting, and there is storage tank refrigeration case outer bottom below, has condensed water drainage tubule to be communicated with storage tank on the pallet that catchments, and the condensed water that generates in the refrigeration case is drained into storage tank; Be provided with humidity temperature pickup at the air intake of fore-cooling room and the air outlet slit of condensation chamber; Be provided with grid chip cooler in fore-cooling room, the condensation chamber, grid sheet direction is parallel with airflow direction; The identical semiconductor cooler assembly of two groups of structures is respectively to fore-cooling room, condensation chamber refrigeration cool-down; The semiconductor cooler assembly is made up of semiconductor cooling device, trapezoidal cool guiding block, trapezoidal heat-conducting block, grid chip cooler, grid chip water-filled radiator; The huyashi-chuuka (cold chinese-style noodles) close-coupled of the leptoprosopy of trapezoidal cool guiding block and semiconductor cooling device; Wide with the grid chip cooler close-coupled that is placed in the fore-cooling room, condensation chamber; The hot side close-coupled of the leptoprosopy of trapezoidal heat-conducting block and semiconductor cooling device; Wide with the water cooler bin that is placed in closed circuit water cycle heat radiation device assembly in grid chip water-filled radiator close-coupled, trapezoidal conduction cooling, heat-conducting block that size shape is identical are processed by red copper or aluminium, leptoprosopy size and semiconductor cooling device hot and cold is identical; Wide was roughly 1.5: 1 with the every edge lengths ratio of leptoprosopy; Trapezoidal height equals the average monolateral length of leptoprosopy (the conventional semiconductor refrigeration device is mainly square and two kinds of shapes of rectangle on the market), and such structure has thermal diffusion effect preferably, comprises between two wide of trapezoidal cool guiding block and trapezoidal heat-conducting block that the whole space of semiconductor cooling device is filled adiabatic with rigid polyurethane foams; Closed circuit water cycle heat radiation device assembly includes formations such as the identical water cooler bin L1 of the identical heat loss through conduction case H1 of two structures and H2, two structures and L2, micro pump, water-flow circuit duct coupling, priming valve door, Draw off valve; The grid chip water-filled radiator of fore-cooling room, two groups of semiconductor cooler assemblies of condensation chamber (icon D1, D2) is placed in respectively in water cooler bin L1, the L2; Grid sheet direction is parallel with water (flow) direction; In heat loss through conduction case H1, the H2 grid gilled radiator is arranged, grid sheet direction is parallel with water (flow) direction, is the heat exchange carrier with water in the whole circulation loop of closed circuit water cycle heat radiation device assembly; Micro pump provides the water circulation power; Reference arrow indication water (flow) direction, the connection of water-flow circuit pipeline is the inlet that the outlet of water cooler bin L1 is connected to heat loss through conduction case H2, the outlet of heat loss through conduction case H2 is connected to the inlet of water cooler bin L2; The outlet of water cooler bin L2 is connected to the inlet of heat loss through conduction case H1, and the outlet of heat loss through conduction case H1 is connected to the inlet of water cooler bin L1.
The air that the aerofoil fan (icon F) of refrigeration case condensation chamber lower end air stream outlet will pass through reducing temperature and humidity after handling is discharged to this when installing environment space of living in; The airflow inlet of pending air from fore-cooling room upper end sucked, flows downward in the fore-cooling room and lower the temperature, then through the fore-cooling room air stream outlet of dividing plate lower end to get into the airflow-reversing passage up; Through getting into the descending and further cooling of condensation chamber behind the airflow inlet of condensation chamber dividing plate upper end; The spatial volume of condensation chamber is greater than the fore-cooling room, and air slows down at the condensation chamber flow velocity, favourable heat exchange fully; Make air continue cooling; When the temperature of air drops to dew point when following at condensation chamber, oversaturated aqueous vapor will condense into aqueous water on the grid sheet of grid chip cooler, at the pallet that catchments of following system ice chest inner bottom part of gravity effect.The condensed water drainage tubule of pallet of catchmenting drains into storage tank with condensed water, can add a pipe heat exchanger cold of cryogenic condensation water is utilized again, lowers the temperature for example for the air heat exchange that gets into before the fore-cooling room.Condensed water in the storage tank can be toppled at any time.
Contained part vaporous water changes into aqueous water and from air, separates in the air in condensation chamber; The vapor content of air reduces; Become and fall wet Cryogenic air, be transported to through the aerofoil fan of condensation chamber lower stream of airflow outlet and need do this that fall that humid air regulates and install environment space of living in.It is to hope hot and humid air conditioning is become the low temperature and low humidity air that people in most cases locates the subenvironment space.As long as beg to surrender wet and use under the situation of not hoping to lower the temperature for some, can below water cooler bin L2 inlet, a pipe heat exchanger be set, with condensation chamber discharge fall wet Cryogenic air heat through this heat exchanger and recirculated water heat exchange after and discharge.
Closed circuit water cycle heat radiation device assembly is carrier with water, and the grid chip water-filled radiator in semiconductor refrigerator assembly D1, D2 hot junction is carried out Forced water cooling but.The cold water that heat loss through conduction case H1 flows out enters into water cooler bin L1, carries out heat exchange with the grid chip water-filled radiator that is placed in the semiconductor cooler assembly D1 hot junction, fore-cooling room in the L1, and taking away heat becomes hot water; Flow into heat loss through conduction case H2; The grid gilled radiator of in H2, settling carries out heat exchange, and the cold water that flows out from heat loss through conduction case H2 gets into water cooler bin L2, with the grid chip water-filled radiator pad exchange that is placed in the condensation chamber semiconductor cooler assembly D2 hot junction in the L2; Take away heat and become hot water; Flow into heat loss through conduction case H1, the grid gilled radiator of in H1, settling carries out heat exchange and becomes cold water outflow, circulation according to this.Grid gilled radiator heat-conducting base and this equipment accommodation space steel and iron wall interplanar in heat loss through conduction case H1, the H2 have the heat-conducting silicone grease film; Closely crimping diffuses to periphery with the heat conduction that hot water carries, and the hot water that flows into the heat loss through conduction case becomes cold water and flows out from the outlet of heat loss through conduction case after conducting heat.The semiconductor cooler assembly is an electron heat pump; The heat of air in the refrigeration case is pumped (it is wet to cause the air cooling-down condensation to be fallen); Give water carrier through grid chip water-filled radiator with transfer of heat, water is diffused into periphery through the heat loss through conduction case through spatial steel iron-clad wall conduction of living in heat again.
Be provided with humidity temperature pickup TR1, TR2 at the air intake of fore-cooling room and the air outlet slit of condensation chamber, temperature, the humidity data of monitoring pending air and reducing temperature and humidity processing back air are transported to single-chip microcomputer industry control unit and carry out analyzing and processing.On the single-chip microcomputer industry control unit that constitutes by one chip microcomputer and peripheral circuit, ON-OFF control circuit etc. temperature, humidity information input bus are arranged; Semiconductor cooler assembly power supply control bus, refrigeration case aerofoil fan and closed circuit water cycle heat radiation device assembly micro pump power supply control bus; Go up and also have the alarm of this plant failure to show.The environment space temperature of living in that TR1 measures, when humidity surpasses setting threshold, the full machine work of single-chip microcomputer industry control unit starting also can manually be controlled.If will be to the pole reversal of semiconductor refrigerator assembly D1, D2 direct current supply, this device becomes the equipment that hot blast is provided to the arrangement environment space, and operation in the case should change the water in the closed circuit water cycle heat radiation device assembly into anti-icing fluid with anti-freeze.
Description of drawings
Accompanying drawing 1 falls humid air adjusting device technology sketch map for closed circuit water circulation semiconductor refrigerating.
As shown in Figure 1: pending air intake 1, fore-cooling room 2, fore-cooling room's dividing plate 3, airflow-reversing passage 4, condensation chamber dividing plate 5; Refrigeration case 6, condensation chamber 7, grid chip cooler 8, priming valve door 9, duct coupling 10; Water cooler bin 11 (icon L1, L2), grid chip water-filled radiator 12, trapezoidal cool guiding block 13, semiconductor cooling device 14; Trapezoidal heat-conducting block 15, the adiabatic packed layer 16 of rigid polyurethane foams, humidity temperature pickup 17 (icon TR1, TR2), aerofoil fan 18 (icon F); Micro pump 19 (icon P), condensed water drainage tubule 20, the pallet 21 that catchments, storage tank 22; Heat loss through conduction case 23 (icon H1, H2), Draw off valve 24 (icon K1, K2), grid gilled radiator 25, single-chip microcomputer industry control unit 26.
The specific embodiment
According to required space size of falling the humid air adjusting; Humidity, temperature, the atmospheric pressure scope of conventional micro climate; Fall target humidity, temperature range after humid air is regulated, estimate the refrigerating capacity of fore-cooling room and condensation chamber, select semiconductor cooling device by certain surplus in view of the above.According to setting refrigerating capacity; The power supply DC voltage that this appliance arrangement is given, for example the semiconductor cooling device of definite selected model specifications such as DC12 volt, 24 volts, 48 volts is built into the semiconductor cooler assembly of fore-cooling room, condensation chamber by several monolithic serial or parallel connections.Existing semiconductor cooling device monolithic is mainly square and two kinds of shapes of rectangle on the market; Trapezoidal conduction cooling, heat-conducting block are processed into by red copper or aluminium material casting milling.According to air velocity, temperature, theoretical cryogenic temperature, heat exchange amount, the grid sheet area physical dimension that estimates fore-cooling room, condensation chamber grid chip cooler selects approved product to use, and dyes black usually or oxidation technology aluminum finished product can.Semiconductor cooler is exactly in fact the electron heat pump of current-control type, and liberated heat Qh equals input electric power P and cold junction refrigeratory capacity Qc sum: Qh=P+Qc in the hot junction; Confirm that according to the refrigeratory capacity of fore-cooling room, condensation chamber and input electric power the hot junction liberated heat that need loose selects the specification of grid chip water-filled radiator, can select approved product for use.Ambient temperature range according to the use of this device; Heat, water flow velocity and the steel heat coefficients of conductivity etc. that the grid chip water-filled radiator of fore-cooling room, condensation chamber semiconductor cooler assembly need be removed estimate the structural area of the grid gilled radiator in the heat loss through conduction case, select approved product for use.Water cooler bin, heat loss through conduction case, storage tank are stainless steel structure, and grid chip water-filled radiator and the grid gilled radiator in the heat loss through conduction case in the water cooler bin are antiseptic aluminum products or stainless steel products.The micro pump of low-voltage DC supply is an approved product.Select condensation chamber to fall wet back air stream outlet aerofoil fan F according to aforementioned technical conditions of falling the applied environment of humid air adjusting device, it is the direct current supply aerofoil fan approved product that air quantity can be automatically controlled.Humidity temperature pickup TR1, TR2 can be the combination sensors of temperature and humidity, can be discrete sensor also, select the market standard product for use, and medium accuracy gets final product.One chip microcomputer is called for short single-chip microcomputer, and specification is more on the market, and the present invention can select for use 8 single-chip microcomputers to join corresponding peripheral components formation industry control unit.Single-chip microcomputer industry control unit is by the conventional method programming.
Claims (2)
1. the humid air adjusting device falls in a closed circuit water circulation semiconductor refrigerating; Include refrigeration case, semiconductor cooler assembly, the pallet that catchments, condensed water drainage tubule, storage tank, closed circuit water cycle heat radiation device assembly, aerofoil fan, humidity temperature pickup, single-chip microcomputer industry control unit formation; It is characterized in that refrigeration case is covered with the polyurethane insulating outward; Interior being complied with by two vertical partition plates that are parallel to each other of refrigeration case horizontally is separated into fore-cooling room, airflow-reversing passage, condensation chamber; Dividing plate lower end, fore-cooling room has air stream outlet, and condensation chamber dividing plate upper end has air flow inlet, and the narrower space between fore-cooling room's dividing plate and the condensation chamber dividing plate is the airflow-reversing passage; The refrigeration case inner bottom part has the pallet of catchmenting, and there is storage tank refrigeration case outer bottom below, has condensed water drainage tubule to be communicated with storage tank on the pallet that catchments; Be provided with humidity temperature pickup at the air intake of fore-cooling room and the air outlet slit of condensation chamber; Be provided with grid chip cooler in fore-cooling room, the condensation chamber, grid sheet direction is parallel with airflow direction; The identical semiconductor cooler assembly of two groups of structures is respectively to fore-cooling room, condensation chamber refrigeration cool-down; The semiconductor cooler assembly is made up of semiconductor cooling device, trapezoidal cool guiding block, trapezoidal heat-conducting block, grid chip cooler, grid chip water-filled radiator; The huyashi-chuuka (cold chinese-style noodles) close-coupled of the leptoprosopy of trapezoidal cool guiding block and semiconductor cooling device; Wide with the grid chip cooler close-coupled that is placed in the fore-cooling room, condensation chamber; The hot side close-coupled of the leptoprosopy of trapezoidal heat-conducting block and semiconductor cooling device; Wide with the water cooler bin that is placed in closed circuit water cycle heat radiation device assembly in grid chip water-filled radiator close-coupled, thermal insulation is filled with rigid polyurethane foams in the whole space that comprises semiconductor cooling device between two wide of trapezoidal cool guiding block and trapezoidal heat-conducting block; Closed circuit water cycle heat radiation device assembly include the identical heat loss through conduction casees (H1) of two structures and (H2), the identical water cooler bin (L1) of two structures and (L2), micro pump, water-flow circuit duct coupling, priming valve door, Draw off valve constitute; The grid chip water-filled radiator of fore-cooling room, two groups of semiconductor cooler assemblies of condensation chamber (D1), (D2) is placed in respectively in water cooler bin (L1), (L2); Grid sheet direction is parallel with water (flow) direction; In heat loss through conduction case (H1), (H2) the grid gilled radiator is arranged; Grid sheet direction is parallel with water (flow) direction; The connection of water-flow circuit pipeline is the inlet that the outlet of water cooler bin (L1) is connected to heat loss through conduction case (H2); The outlet of heat loss through conduction case (H2) is connected to the inlet of water cooler bin (L2), and the outlet of water cooler bin (L2) is connected to the inlet of heat loss through conduction case (H1), and the outlet of heat loss through conduction case (H1) is connected to the inlet of water cooler bin (L1).
2. the humid air adjusting device falls in closed circuit water circulation semiconductor refrigerating as claimed in claim 1; On the single-chip microcomputer industry control unit that it is characterized in that constituting temperature, humidity information input bus are arranged by one chip microcomputer and peripheral circuit, ON-OFF control circuit; Semiconductor cooler assembly power supply control bus, refrigeration case aerofoil fan and closed circuit water cycle heat radiation device assembly micro pump power supply control bus; Go up and also have the alarm of this plant failure to show.
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| CN2012101552518A CN102661618B (en) | 2012-05-18 | 2012-05-18 | Closed water circulation semiconductor refrigeration dehumidifying air conditioning device |
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| CN2012101552518A CN102661618B (en) | 2012-05-18 | 2012-05-18 | Closed water circulation semiconductor refrigeration dehumidifying air conditioning device |
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| CN102661618A true CN102661618A (en) | 2012-09-12 |
| CN102661618B CN102661618B (en) | 2013-12-11 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104631553A (en) * | 2013-11-14 | 2015-05-20 | 中国人民解放军军械工程学院 | Air drinking water preparing device based on Peltier refrigerating technique |
| CN106288646A (en) * | 2016-08-18 | 2017-01-04 | 牟伟 | A kind of miniature water refrigerating plant for construction site |
| CN109542151A (en) * | 2018-12-18 | 2019-03-29 | 中国电子科技集团公司第十六研究所 | A kind of ring control equipment and control method |
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| JPH05312456A (en) * | 1992-05-09 | 1993-11-22 | Frontier Fuiirudo Prod:Kk | Circulation and cooling mechanism for liquid in liquid cooling device using peltier element |
| JP2005257372A (en) * | 2004-03-10 | 2005-09-22 | Mitsubishi Electric Corp | Temperature testing device |
| CN102322704A (en) * | 2011-09-27 | 2012-01-18 | 程刚 | Semiconductor refrigerating and absorptive refrigerating interactive device |
| CN202598733U (en) * | 2012-05-18 | 2012-12-12 | 程刚 | Closed water circulation semiconductor refrigeration dehumidification air conditioning device |
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2012
- 2012-05-18 CN CN2012101552518A patent/CN102661618B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05312456A (en) * | 1992-05-09 | 1993-11-22 | Frontier Fuiirudo Prod:Kk | Circulation and cooling mechanism for liquid in liquid cooling device using peltier element |
| JP2005257372A (en) * | 2004-03-10 | 2005-09-22 | Mitsubishi Electric Corp | Temperature testing device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104631553A (en) * | 2013-11-14 | 2015-05-20 | 中国人民解放军军械工程学院 | Air drinking water preparing device based on Peltier refrigerating technique |
| CN104631553B (en) * | 2013-11-14 | 2016-08-24 | 中国人民解放军军械工程学院 | Air water equipment based on Peltier Refrigeration Technique |
| CN106288646A (en) * | 2016-08-18 | 2017-01-04 | 牟伟 | A kind of miniature water refrigerating plant for construction site |
| CN106288646B (en) * | 2016-08-18 | 2018-12-28 | 宁夏锐盛明杰知识产权咨询有限公司 | A kind of miniature water refrigerating plant for construction site |
| CN109542151A (en) * | 2018-12-18 | 2019-03-29 | 中国电子科技集团公司第十六研究所 | A kind of ring control equipment and control method |
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| CN102661618B (en) | 2013-12-11 |
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