CN102628599B - Air-cooling semiconductor refrigerating and humidity reducing air adjusting device - Google Patents
Air-cooling semiconductor refrigerating and humidity reducing air adjusting device Download PDFInfo
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- CN102628599B CN102628599B CN201210116878.2A CN201210116878A CN102628599B CN 102628599 B CN102628599 B CN 102628599B CN 201210116878 A CN201210116878 A CN 201210116878A CN 102628599 B CN102628599 B CN 102628599B
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Abstract
An air-cooling semiconductor refrigerating and humidity reducing air adjusting device comprises a refrigerating box, a semiconductor refrigerator assembly, a water collection tray, a condensate water drain thin tube, a water storage box, a seeped water evaporator, a forced air-cooling pipeline, an axial fan, a temperature and humidity sensor, a single chip microcomputer industrial control unit and the like, wherein the semiconductor refrigerator assembly serves as a refrigerating source, hot and humid air is processed in the refrigerating box through a pre-refrigerating chamber and a condensation chamber, liquid water is condensed and dissolved out, humidity and temperature of the air are reduced, and the dissolved condensate water is fed back to the forced air-cooling pipeline through the seeped water evaporator to be evaporated, guided to air-cooling flow for cooling and then discharged into the outer atmosphere. The whole device adopts the single chip microcomputer industrial control unit to be controlled automatically for operation. The air-cooling semiconductor refrigerating and humidity reducing air adjusting device is small in volume, light in weight, sturdy, durable, free of pollution and basically free of noise, adopts a monolithic structure, is suitable for meeting requirements of small specific spaces such as chariot cars, some cabins in naval vessels and storage and placing rooms of valuables and precision instruments, and can be used outdoors with solar energy and wind energy to supply electricity.
Description
Technical field
The present invention relates to a kind of air-cooled semiconductor refrigerating wet down conditioner, belong to the technical field of semiconductor refrigerating wet down air conditioning.
Background technology
Air humidity is an important ambient parameter physical quantity, closely related with mankind's activity, social development.For example, people lives, works under high humidity environment, can feel not quite the thing, haves the fidgets, refreshing tired power is weary, endurable.Higher humidity makes some biological pollutants as the breeding diffusion rapidly of fungi (comprising mould), bacterium, virus, very harmful.The preservation of many valuables, precision instrument and accommodation space have strict restriction to humidity.The production technology of many light industry, chemical products clearly stipulates existence on ambient humidity.Therefore, the too high air humidity of given environment space humid air being dropped in permissible value, is all important in a lot of fields.The wet down technology (some people is accustomed to claiming " dehumidifying ") of extensive use at present mainly contains two large classes: a class is that the hygroscopic agent made from solid or liquid hygroscopic materials adsorbs (or absorption) to pending airborne aqueous vapor, then by the method for heating, make hygroscopic agent desorption (separate and absorb), hygroscopic agent recover the moisture pick-up properties of aqueous vapor so-called " regeneration ", and circulation reaches wet down effect according to this; Another kind of mechanical compression refrigeration formula wet down is that to utilize lower boiling refrigeration working medium liquid absorption surrounding medium be the heat of pending air and evaporate pending air cooling-down.Compressor converts the refrigeration working medium of gasification to liquid again, and process of refrigerastion is constantly circulation in the system of a sealing.When pending air themperature drops to below dew point, liquid condensation elutriation goes out, and reaches wet down effect.
The dehumidifying equipment of producing according to above-mentioned wet down technology has been brought into play important function aspect numerous.But these conventional arts, except each own some deficiency, all exist equipment volume large, need take the larger installation site feature of indoor, off-premises station etc. even in addition.Depositing of some cabin, many valuables and the precision instrument of demand such as battlebus compartment, the naval vessels of some small-sized particular spaces, settle chamber and can take the application of the aspect such as some environment of field of solar wind-energy power supply, traditional absorption (absorptions) formula, mechanical compression refrigeration formula dehumidifying equipment is just difficult to use.
For overcoming the deficiencies in the prior art, adapt to the needs of these small-sized particular space scope wet down air conditionings, the invention provides a kind of new technical scheme, application semiconductor cooler assembly is refrigeration source, pending damp-heat air in refrigeration case through fore-cooling room, after the processing of condensation chamber, become the supersaturated air lower than dew point, aqueous water condenses and separates out, the cooling of air wet down, the condensed water of separating out feeds back to forced air cooled tube evaporation through infiltration evaporimeter, cause semiconductor refrigerator assembly heat-pipe type radiator to carry out the air-flow cooling of air blast cooling, and be discharged to ambient atmosphere thereupon.Full machine adopts single-chip microcomputer industry control unit autocontrol operation.What the present invention built is little, lightweight, sturdy and durable, pollution-free, the basic noiselessness of a kind of volume, the wet down conditioner of monomer structure.
Semiconductor cooling device (being commonly called as thermoelectric pile), it is the application aspect Refrigeration Technique of the back wash effect peltier effect (Peltier Effect) of Seebeck effect (Seeback Effect), along with the development of semi-conducting material technology, semiconductor refrigerating has become a kind of novel refrigeration modes, and user can be designed to semiconductor cooling device and peripheral components combination refrigerator assembly or the system of the different purposes of different structure.Semiconductor cooler is exactly in fact the electron heat pump of current-control type, without other refrigeration working medium.Semiconductor refrigeration structure is simple, machinery-free moving component, and volume is little, and reliability is strong, noiseless, friction, long-life.Semiconductor cooling device thermal inertia is very little, and the cooling and warming time is very fast, and exchanging electric current direction can realize refrigerated medium hot junction and exchange, and regulates size of current can change the output of refrigerated medium heat.
Summary of the invention
A kind of air-cooled semiconductor refrigerating wet down conditioner, include refrigeration case, semiconductor cooler assembly, pallet catchments, condensed water drainage tubule, storage tank, infiltration evaporimeter, air blast cooling pipeline, aerofoil fan, humidity temperature pickup, single-chip microcomputer industry control unit, refrigeration case is covered with polyurethane insulating outward, in refrigeration case, by two vertical partition plates that are parallel to each other, comply with and be horizontally separated into fore-cooling room, airflow-reversing passage, condensation chamber, dividing plate lower end, fore-cooling room has air stream outlet, condensation chamber dividing plate upper end has air flow inlet, narrower space between fore-cooling room's dividing plate and condensation chamber dividing plate is airflow-reversing passage, refrigeration case inner bottom part has the pallet of catchmenting, and there is storage tank refrigeration case outer bottom below, has condensed water drainage tubule to be communicated with storage tank on the pallet that catchments, and the condensed water generating in refrigeration case is drained into storage tank, at the air intake of fore-cooling room and the air outlet slit of condensation chamber, be provided with humidity temperature pickup, in fore-cooling room, condensation chamber, be provided with grid chip cooler, grid sheet direction is parallel with airflow direction, the identical semiconductor cooler assembly of two groups of structures is respectively to fore-cooling room, condensation chamber refrigeration cool-down, semiconductor cooler assembly is by semiconductor cooling device, trapezoidal cool guiding block, trapezoidal heat-conducting block, grid chip cooler, heat-pipe type radiator forms, the huyashi-chuuka (cold chinese-style noodles) close-coupled of the leptoprosopy of trapezoidal cool guiding block and semiconductor cooling device, wide be placed in fore-cooling room, grid chip cooler close-coupled in condensation chamber, the hot side close-coupled of the leptoprosopy of trapezoidal heat-conducting block and semiconductor cooling device, wide with the heat-pipe type radiator close-coupled being placed in air blast cooling pipeline, trapezoidal conduction cooling, heat-conducting block is made by red copper or aluminium, leptoprosopy size is identical with the cold and hot surface of semiconductor cooling device, wide is roughly 1.5 ︰ 1 with the every edge lengths ratio of leptoprosopy, trapezoidal height equals leptoprosopy Average Onesided length (on market, existing semiconductor cooling device is mainly square and two kinds of shapes of rectangle), such structure has good thermal diffusion effect, whole space between two wide of trapezoidal cool guiding block and trapezoidal heat-conducting block including semiconductor cooling device is filled adiabatic with rigid polyurethane foams, be provided with the air blast cooling pipeline of semiconductor cooler component heat tubular radiator, the port of air blast cooling pipeline has aerofoil fan, fore-cooling room in air blast cooling pipeline, pipe level section middle part between two groups of semiconductor cooler component heat tubular radiators of condensation chamber is mounted with infiltration evaporimeter, and its upper end has projection to be embedded into storage tank.
Infiltration evaporimeter is made by porous material, can adopt ceramic sintering process or bonding extrusion process manufacture, there is porosity high, good water permeability and the characteristic of higher mechanical strength, be alveolate texture, in parallel with air blast cooling pipeline multiple air-flow through holes, the similar honeycomb briquette shape of axially having.
The aerofoil fan (icon F2) of refrigeration case condensation chamber lower end air stream outlet is by when installing environment space of living in through reducing temperature and humidity Bas Discharged after treatment to this, pending air is sucked from the airflow inlet of upper end, fore-cooling room, in fore-cooling room, flow downward and lower the temperature, then through the air stream outlet of dividing plate lower end, fore-cooling room, enter airflow-reversing passage up, after airflow inlet by condensation chamber dividing plate upper end, enter condensation chamber descending and further cooling, the spatial volume of condensation chamber is greater than fore-cooling room, air slows down at condensation chamber flow velocity, there is sufficient heat exchange to make air continue cooling, when the temperature of air is below condensation chamber drops to dew point, oversaturated aqueous vapor will condense into aqueous water on the grid sheet at grid chip cooler, under Action of Gravity Field, drip the pallet that catchments of system ice chest inner bottom part.The condensed water drainage tubule of pallet of catchmenting drains into storage tank by condensed water.
In air, contained part vaporous water changes into aqueous water and separates from air in condensation chamber, the vapor content of air reduces, become wet down Cryogenic air, through the aerofoil fan F2 of condensation chamber lower stream of airflow outlet, be transported to this that need do air conditioning and install environment space of living in.It is to wish hot and humid air conditioning to become low temperature and low humidity air that people in most cases locates subenvironment space.For some only require wet down and do not wish cooling situation under apply, below condensation chamber semiconductor cooler component heat tubular radiator that can be in air blast cooling pipeline, a pipe heat exchanger is set, the wet down Cryogenic air that condensation chamber is discharged heats outflow through this heat exchanger.
Air blast cooling pipeline is to semiconductor refrigerator assembly (icon D1, D2) heat-pipe type radiator in hot junction carries out air blast cooling pipeline but, the cooling blast that aerofoil fan (icon F1) sucks from ambient atmosphere carries out heat exchange at the heat-pipe type radiator in air-cooled pipeline and semiconductor cooler assembly D1 hot junction, fore-cooling room, taking away heat air-flow heats up, the cellular infiltration evaporimeter of flowing through, condensate evaporation, air-flow is lowered the temperature and is taken away the condensed water of gasification, change into lower temperature high humidity air stream, the flow through heat-pipe type radiator pad exchange in condensation chamber semiconductor refrigerating assembly D2 hot junction, take away heat and become hot and humid air, through aerofoil fan F1, be discharged in this ambient atmosphere of installing environment space of living in.
For the application of wishing to reduce subenvironment space temperature in some high temperature low humidity situation, at this moment the condensed water forming at condensation chamber is less, for the normal performance of the evaporimeter that makes to seep water allows cooling air cooling, effectively take away heat-pipe type radiator heat, the refrigerating efficiency that improves semiconductor cooler assembly D2 can manually add a certain amount of water in storage tank.
At the air intake of fore-cooling room and the air outlet slit of condensation chamber, be provided with humidity temperature pickup (icon TR1, TR2), temperature, the humidity data of monitoring pending air and the rear air of reducing temperature and humidity processing are transported to single-chip microcomputer industry control unit and carry out analyzing and processing.On the single-chip microcomputer industry control unit being formed by chip microprocessor and peripheral circuit, ON-OFF control circuit etc., there are temperature, humidity information input bus, semiconductor cooler assembly power supply control bus, refrigeration case aerofoil fan, air blast cooling pipeline aerofoil fan power supply control bus; On single-chip microcomputer industry control unit, also have the fault warning of this wet down conditioner to show.When environment space temperature of living in, the humidity that TR1 measures exceedes setting threshold, the full machine work of single-chip microcomputer industry control unit starting, also can manually control.If by the pole reversal to semiconductor refrigerator assembly D1, D2 direct current supply, this device becomes the equipment that hot blast is provided to settled environment space.
Accompanying drawing explanation
Accompanying drawing 1 is the technology schematic diagram of air-cooled semiconductor refrigerating wet down conditioner.
As shown in Figure 1: pending air intake 1, fore-cooling room 2, fore-cooling room's dividing plate 3, airflow-reversing passage 4, condensation chamber dividing plate 5, refrigeration case 6, condensation chamber 7, grid chip cooler 8, aerofoil fan 9(icon F1), air blast cooling pipeline 10, trapezoidal cool guiding block 11, semiconductor cooling device 12, trapezoidal heat-conducting block 13, heat-pipe type radiator 14, the adiabatic packed layer 15 of rigid polyurethane foams, humidity temperature pickup 16(icon TR1, TR2), aerofoil fan 17(icon F2), condensed water drainage tubule 18, pallet 19 catchments, storage tank 20, infiltration evaporimeter 21, single-chip microcomputer industry control unit 22.
The specific embodiment
According to the required space size that carries out wet down air conditioning, humidity, temperature, the atmospheric pressure scope of conventional micro climate, target humidity after wet down air conditioning, temperature range, estimate the refrigerating capacity of fore-cooling room and condensation chamber, selects semiconductor cooling device accordingly by certain surplus.According to setting refrigerating capacity, the supplying DC voltage that this appliance arrangement is given, such as DC12 volt, 24 volts, 48 volts etc. determine that the semiconductor cooling device of selected model specification is built into the semiconductor cooler assembly of fore-cooling room, condensation chamber by several monolithic serial or parallel connections.On market, existing semiconductor cooling device monolithic is mainly square and two kinds of shapes of rectangle; Trapezoidal conduction cooling, heat-conducting block are processed into by red copper or aluminium material casting milling.According to air velocity, temperature, theoretical cryogenic temperature, heat exchange amount, the grid sheet area physical dimension that estimates fore-cooling room, condensation chamber grid chip cooler selects approved product to use, and conventionally dying black or oxidation technology aluminum finished product can.Semiconductor cooler is exactly in fact the electron heat pump of current-control type, at hot junction liberated heat Qh, equals input electric power P and cold junction refrigeratory capacity Qc sum: Qh=P+Qc; According to the refrigeratory capacity of fore-cooling room, condensation chamber and input electric power, determine that the hot junction liberated heat that need fall apart selects the specification of heat-pipe type radiator, can select approved product.According to parameters such as the rated wind speed requirement of selected heat-pipe type radiator, the sectional areas of air blast cooling pipeline, select the air-cooled aerofoil fan F1 approved product of direct current supply.Air stream outlet aerofoil fan F2 after the technical conditions selection condensation chamber wet down of the applied environment of aforementioned wet down conditioner of foundation, it is the direct current supply aerofoil fan approved product that air quantity can be automatically controlled.Humidity temperature pickup TR1, TR2 can be the combination sensors of temperature and humidity, can be also discrete sensor, select market standard product, medium accuracy.Onechipmicroprocessor (machine) is called for short single-chip microcomputer, and on market, specification is more, and the present invention can select 8 single-chip microcomputers to join corresponding peripheral components formation industry control unit.Programme according to a conventional method in single-chip microcomputer industry control unit.Infiltration evaporimeter is made by porous material, can adopt alumina porous ceramic high-temperature electric resistance furnace sintering forming process, also can be with porous materials such as natural zeolite or Granular gelatins through bonding extrusion process manufacture, it is high that manufactured goods should have porosity, good water permeability and the characteristic of higher mechanical strength, be alveolate texture, in parallel with cooling air pipeline multiple air-flow through holes, the similar honeycomb briquette shape of axially having.
Claims (3)
1. an air-cooled semiconductor refrigerating wet down conditioner, include refrigeration case, semiconductor cooler assembly, pallet catchments, condensed water drainage tubule, storage tank, infiltration evaporimeter, air blast cooling pipeline, aerofoil fan, humidity temperature pickup, single-chip microcomputer industry control unit, it is characterized in that refrigeration case is covered with polyurethane insulating outward, in refrigeration case, by two vertical partition plates that are parallel to each other, comply with and be horizontally separated into fore-cooling room, airflow-reversing passage, condensation chamber, dividing plate lower end, fore-cooling room has air stream outlet, condensation chamber dividing plate upper end has air flow inlet, narrower space between fore-cooling room's dividing plate and condensation chamber dividing plate is airflow-reversing passage, refrigeration case inner bottom part has the pallet of catchmenting, and there is storage tank refrigeration case outer bottom below, has condensed water drainage tubule to be communicated with storage tank on the pallet that catchments, and the condensed water generating in refrigeration case is drained into storage tank, at the air intake of fore-cooling room and the air outlet slit of condensation chamber, be provided with humidity temperature pickup, in fore-cooling room, condensation chamber, be provided with grid chip cooler, grid sheet direction is parallel with airflow direction, the identical semiconductor cooler assembly of two groups of structures is respectively to fore-cooling room, condensation chamber refrigeration cool-down, semiconductor cooler assembly is by semiconductor cooling device, trapezoidal cool guiding block, trapezoidal heat-conducting block, grid chip cooler, heat-pipe type radiator forms, the huyashi-chuuka (cold chinese-style noodles) close-coupled of the leptoprosopy of trapezoidal cool guiding block and semiconductor cooling device, wide be placed in fore-cooling room, grid chip cooler close-coupled in condensation chamber, the hot side close-coupled of the leptoprosopy of trapezoidal heat-conducting block and semiconductor cooling device, wide with the heat-pipe type radiator close-coupled being placed in air blast cooling pipeline, trapezoidal conduction cooling, heat-conducting block is made by red copper or aluminium, whole space between two wide of trapezoidal cool guiding block and trapezoidal heat-conducting block including semiconductor cooling device is filled adiabatic with rigid polyurethane foams, be provided with the air blast cooling pipeline of semiconductor cooler component heat tubular radiator, the port of air blast cooling pipeline has aerofoil fan, fore-cooling room in air blast cooling pipeline, pipe level section middle part between two groups of semiconductor cooler component heat tubular radiators of condensation chamber is mounted with infiltration evaporimeter, and its upper end has projection to be embedded into storage tank.
2. air-cooled semiconductor refrigerating wet down conditioner as claimed in claim 1, the evaporimeter that it is characterized in that seeping water is made by porous material, there is porosity high, good water permeability and the characteristic of higher mechanical strength, be alveolate texture, parallel with air blast cooling pipeline, axially have multiple air-flow through holes.
3. air-cooled semiconductor refrigerating wet down conditioner as claimed in claim 1, on the single-chip microcomputer industry control unit that it is characterized in that being formed by chip microprocessor and peripheral circuit, ON-OFF control circuit, there are temperature, humidity information input bus, semiconductor cooler assembly power supply control bus, refrigeration case aerofoil fan, air blast cooling pipeline aerofoil fan power supply control bus; On single-chip microcomputer industry control unit, also have the fault warning of this wet down conditioner to show.
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| CN201210116878.2A CN102628599B (en) | 2012-04-20 | 2012-04-20 | Air-cooling semiconductor refrigerating and humidity reducing air adjusting device |
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| CN201210116878.2A CN102628599B (en) | 2012-04-20 | 2012-04-20 | Air-cooling semiconductor refrigerating and humidity reducing air adjusting device |
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| CN85200031U (en) * | 1985-04-01 | 1985-10-10 | 清华大学 | Theremal-electric air condition with heat tube |
| CN2191701Y (en) * | 1994-02-16 | 1995-03-15 | 姜忠生 | Air moisture separator for semi-conductor |
| CN201795564U (en) * | 2010-08-24 | 2011-04-13 | 浙江大学 | Central air conditioning system based on combination of solar energy technique and heat pump technique |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0719561A (en) * | 1993-06-30 | 1995-01-20 | Kazutaro Oyabu | Temperature control method in lower air blowing type air conditioning system |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85200031U (en) * | 1985-04-01 | 1985-10-10 | 清华大学 | Theremal-electric air condition with heat tube |
| CN2191701Y (en) * | 1994-02-16 | 1995-03-15 | 姜忠生 | Air moisture separator for semi-conductor |
| CN201795564U (en) * | 2010-08-24 | 2011-04-13 | 浙江大学 | Central air conditioning system based on combination of solar energy technique and heat pump technique |
Non-Patent Citations (1)
| Title |
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| JP特开平7-19561A 1995.01.20 |
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