CN2191701Y

CN2191701Y - Air moisture separator for semi-conductor

Info

Publication number: CN2191701Y
Application number: CN 94204640
Authority: CN
Inventors: 姜忠生; 柳振芝
Original assignee: Individual
Current assignee: Individual
Priority date: 1994-02-16
Filing date: 1994-02-16
Publication date: 1995-03-15
Anticipated expiration: 2004-02-16

Abstract

The utility model discloses an air moisture separator, which adopts the electric cooling assembly of a semi-conductor temperature difference. The assembly is arranged between a heat radiation board and a condensed water board; the condensed water board is arranged on the front end part of a casing with holes of a ventilation window; the assembly is radiated in the forms of a heat radiator and forced air cooling; the bottom of the casing is provided with a collection box of water beads. The utility model has the advantages of small size, light weight, low noise and small power consumption. The price of the air moisture separator is reduced by 1/6-1/2 compared with a moisture separator using freon medium for cooling. The condensate quantity of the utility model can reach 0.7-1 liter per night under the condition of environment temperature over 10 DEG and B=90%.

Description

Air moisture separator for semi-conductor

The utility model belongs to the air humidity adjusting device, particularly relates to a kind of air dehumidifier that adopts thermoelectric refrigerating semiconductor component.

With F12, F20 is the air dehumidifier existing procucts sale of working medium, bring a high price, and also the big heaviness of volume, noise is big when operation, and power consumption is big, therefore need and installing and using, not have the extensive value of commodity basically except that special occasions.

The purpose of this utility model provides a kind of semiconductor air dehumidifier freon cycle fluid, function admirable that do not have.

The technical solution of the utility model is:

Thermoelectric refrigerating semiconductor component (1) places heat sink (2) and coagulates between the top of water plate (3), radiator (4) is fixed on the heat sink (2), axial flow blower (5) is located at the top in the middle of the radiator (4), the position of coagulating water plate (3) is that shell (6) bottom is provided with the globule and collects box (7) at the leading section of the shell (6) of band ventilation fenestra;

Coagulate water plate (3) outer surface and be provided with some water skiing wire casings (8), the sideline, bottom is horn shape;

The bonnet (9) of shell (6) is fixed with the after-poppet (11) of band hanging hole (10), and the bottom is provided with ventilation fenestra (12), and shell (6) front bezel is provided with web plate (13);

Heat sink (2) bottom or shell (6) bottom are provided with barge board (14).

Further describe the technical program with drawings and Examples below:

Description of drawings:

Fig. 1 the utility model structure side-looking part sectioned view

Fig. 2 coagulates water plate structure shape schematic diagram

Embodiment shown in Figure 1, thermoelectric refrigerating semiconductor component (1) (hereinafter to be referred as assembly) adopts the TEC1-12TO5 type, operating voltage DC-12V, the copper plate of 5 millimeters thick is done heat sink (2), with assembly (1) plane contact and fastening, it is " non-complete symmetrical centre radiant type radiator " that radiator (4) adopts the content of the inventor's 93224161.1 utility model patents, is aided with the axial flow blower (5) of top blast, and radiating effect is splendid.This machine uses outside the direct current ⁰⁰³Connecing power supply is assembly (1) and axial flow blower (5) power supply, and power is not more than 40W, and external power supply jack, indicator lamp, power switch are located at shell (6) one side (not shown)s, and this machine also can use the rectifier power source in the machine of being located at, and directly uses civil power.

The water plate (3) that coagulates shown in Fig. 2 also is fixed on the heat sink (2), and with assembly (1) plane contact, for guaranteeing its absorption and storage to the cold of assembly (1) generation, and to make its dew point be 5-10 ℃, design size is 120 * 150 * 5 millimeters (long * wide * thick), adopt red copper sheet material and do surperficial antirust processing, is coagulating on water plate (3) center line at least the lower end of assembly (1), its objective is and make with fixed attention that water plate surface temperature is "T"-shaped distribution, be that T shape top is divided into the lowest temperature district, the bottom is a time low-temperature space, coagulating water plate (3) top " fast with fixed attention earlier coagulating " in order to water in air vapour, with reduce droplet with coagulate water plate cold consumption in the gradual change constant temperature process when contacting,, the temperature difference of inferior low-temperature space can remain on about 5 ℃, when quality that the globule increases gradually greater than the globule and when coagulating between the water plate Molecular Adsorption power, the globule will move down along the water skiing wire casing (8) of 0.5 millimeters deep, and will be on the way other small globule and closing, form the accelerated motion that quality increases gradually, directly rush down water plate bottom with fixed attention, water skiing wire casing (8) be provided with the formation that is beneficial to said process, the sideline of coagulating water plate (3) bottom is horn shape, accelerate the gathering between the terminal globule of each water skiing wire casing (8), improve water pouring speed, reduce the cold of globule hyperabsorption.

This machine adopts wall-hanging, the ventilation fenestra (accompanying drawing is not shown) that has the setting of support (11) of hanging hole (10) and shell (6) both sides, top, the ventilation fenestra (12) of bonnet (9) bottom helps flowing of assembly (1) heat radiation and this machine surrounding air, increase the effect of drying, barge board (14) is located at heat sink (2) bottom and directly blows to water plate (2) with fixed attention to prevent air-flow, and cold is scattered and disappeared.

Present embodiment is applicable to that the common standard room uses, and changes and coagulates water board size and component power, can make this machine seriation, applicable to little spaces such as cabinets up to the various occasions of large spaces such as laboratory.

The utility model has the advantages that:

1. noise is less than 30db when moving, and power consumption is low, and volume is little, and weight only has 2kg, and long-term operation does not have fault, and price only reaches the 1/6-1/2 of freon dehumidifier.

2. it is effective to dry, and is higher than 10 ℃ in environment temperature, and condensate flow whenever can reach the 0.7-1 liter round the clock during B=90%.

Claims

1, a kind of semiconductor air dehumidifier, form by coagulating water plate (3), shell (6), radiator (4) etc., it is characterized in that: thermoelectric refrigerating semiconductor component (1) places heat sink (2) and coagulates between the top of water plate (3), radiator (4) is fixed on the heat sink (2), axial flow blower (5) is located at the top in the middle of the radiator (4), the position of coagulating water plate (3) is that shell (6) bottom is provided with the globule and collects box (7) at the leading section of the shell (6) of band ventilation fenestra.

2, a kind of semiconductor air dehumidifier as claimed in claim 1 is characterized in that: coagulate water plate (3) outer surface and be provided with some water skiing wire casings (8), the sideline, bottom is horn shape.

3, a kind of semiconductor air dehumidifier as claimed in claim 1 is characterized in that: the bonnet (9) of shell (6) is fixed with the after-poppet (11) of band hanging hole (10), and the bottom is provided with ventilation fenestra (12), and front bezel is provided with web plate (13).

4, a kind of semiconductor air dehumidifier as claimed in claim 1 is characterized in that: heat sink (2) bottom or shell (6) bottom are provided with barge board (14).