CN102628599A - Air-cooling semiconductor refrigerating and humidity reducing air adjusting device - Google Patents
Air-cooling semiconductor refrigerating and humidity reducing air adjusting device Download PDFInfo
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- CN102628599A CN102628599A CN2012101168782A CN201210116878A CN102628599A CN 102628599 A CN102628599 A CN 102628599A CN 2012101168782 A CN2012101168782 A CN 2012101168782A CN 201210116878 A CN201210116878 A CN 201210116878A CN 102628599 A CN102628599 A CN 102628599A
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Abstract
An air-cooling semiconductor refrigerating and humidity reducing air adjusting device comprises a refrigerating box, a semiconductor refrigerator assembly, a water collection tray, a condensate water drain thin tube, a water storage box, a seeped water evaporator, a forced air-cooling pipeline, an axial fan, a temperature and humidity sensor, a single chip microcomputer industrial control unit and the like, wherein the semiconductor refrigerator assembly serves as a refrigerating source, hot and humid air is processed in the refrigerating box through a pre-refrigerating chamber and a condensation chamber, liquid water is condensed and dissolved out, humidity and temperature of the air are reduced, and the dissolved condensate water is fed back to the forced air-cooling pipeline through the seeped water evaporator to be evaporated, guided to air-cooling flow for cooling and then discharged into the outer atmosphere. The whole device adopts the single chip microcomputer industrial control unit to be controlled automatically for operation. The air-cooling semiconductor refrigerating and humidity reducing air adjusting device is small in volume, light in weight, sturdy, durable, free of pollution and basically free of noise, adopts a monolithic structure, is suitable for meeting requirements of small specific spaces such as chariot cars, some cabins in naval vessels and storage and placing rooms of valuables and precision instruments, and can be used outdoors with solar energy and wind energy to supply electricity.
Description
Technical field
The present invention relates to a kind of air-cooled semiconductor refrigerating and fall the humid air adjusting device, belong to semiconductor refrigerating and fall the technical field that humid air is regulated.
Background technology
Air humidity is an important ambient parameter physical quantity, and is closely related with mankind's activity, social development.For example, the people lives under high humidity environment, works, and can feel not quite the thing, haves the fidgets, refreshing tired power lacks, is difficult to stand.Higher humidity makes the breeding diffusion rapidly of some biological pollutants such as fungi (comprising mould), bacterium, virus, and is very harmful.The preservation of many valuables, precision instrument and accommodation space all have strict restriction to humidity.Many light industrys, production process of chemical product are clearly stipulated existence on the ambient humidity.Therefore, the too high air humidity of given environment space humid air being dropped in the permissible value, all is important in a lot of fields.The wet technology (some people is accustomed to claiming " dehumidifying ") of falling of extensive use at present mainly contains two big types: one type is with the hygroscopic agent that solid or liquid hygroscopic materials are processed pending airborne aqueous vapor to be adsorbed (or absorption); Method through heating makes hygroscopic agent desorption (separating absorption) then; Hygroscopic agent recovers the moisture pick-up properties promptly so-called " regeneration " to aqueous vapor, and circulation reaches and falls wet effect according to this; Another kind of mechanical compression refrigeration formula fall wetly, be that to utilize lower boiling refrigeration working medium liquid-absorbent surrounding medium be the heat of pending air and evaporate pending air cooling-down.Compressor converts the refrigeration working medium of gasification to liquid again, and process of refrigerastion is circulation constantly in the system of a sealing.When pending air themperature drops to below the dew point, the liquid condensation elutriation goes out, and reaches to fall wet effect.
According to the above-mentioned dehumidifying equipment that falls wet technology and produce, aspect numerous, brought into play important function.But these conventional arts all exist equipment volume big except that each own some deficiency, need take the characteristics of big installation site even indoor in addition, off-premises station etc.In the for example application of depositing the arrangement chamber and can take the aspects such as some environment of field of solar wind-energy power supply of some cabin, many valuables and the precision instrument of battlebus compartment, naval vessels of demand of some small-sized particular spaces, traditional absorption (absorption) formula, mechanical compression refrigeration formula dehumidifying equipment just are difficult to use.
For overcoming the deficiency of prior art; Adapt to these small-sized particular space scopes and fall the needs that humid air is regulated, the present invention provides a kind of new technical scheme, and using the semiconductor cooler assembly is refrigeration source; Pending damp-heat air becomes the supersaturated air that is lower than dew point after the processing of fore-cooling room, condensation chamber in refrigeration case; Aqueous water condenses and separates out, and wet cooling falls in air, and the condensed water of separating out feeds back to the forced air cooled tube evaporation through the infiltration evaporimeter; Be directed at the air-flow cooling of semiconductor refrigerator assembly heat-pipe type radiator being carried out air blast cooling, and be discharged to ambient atmosphere thereupon.Full machine adopts single-chip microcomputer industry control unit autocontrol operation.What the present invention made up is little, in light weight, sturdy and durable, pollution-free, the basic noiselessness of a kind of volume, monomer structure the humid air adjusting device falls.
Semiconductor cooling device (being commonly called as thermoelectric pile); Be the application of back wash effect peltier effect (Peltier Effect) aspect Refrigeration Technique of Seebeck effect (Seeback Effect); Development along with the semi-conducting material technology; Semiconductor refrigerating has become a kind of novel refrigeration modes, and the user can combine semiconductor cooling device and peripheral components to be designed to the refrigerator assembly or the system of the different purposes of different structure.Semiconductor cooler is exactly in fact the electron heat pump of current-control type, need not other refrigeration working medium.Semiconductor refrigerating is simple in structure, does not have mechanical moving component, and volume is little, good reliability, noiseless, friction, long-life.The semiconductor cooling device thermal inertia is very little, and the cooling and warming time is very fast, and the exchanging electric current direction can realize that the refrigerated medium hot junction exchanges, and regulates the output that size of current can change the refrigerated medium heat.
Summary of the invention
The humid air adjusting device falls in a kind of air-cooled semiconductor refrigerating; Include formations such as refrigeration case, semiconductor cooler assembly, the pallet that catchments, condensed water drainage tubule, storage tank, infiltration evaporimeter, air blast cooling pipeline, aerofoil fan, humidity temperature pickup, single-chip microcomputer industry control unit; Refrigeration case is covered with the polyurethane insulating outward; Interior being complied with by two vertical partition plates that are parallel to each other of refrigeration case horizontally is separated into fore-cooling room, airflow-reversing passage, condensation chamber; Dividing plate lower end, fore-cooling room has air stream outlet, and condensation chamber dividing plate upper end has air flow inlet, and the narrower space between fore-cooling room's dividing plate and the condensation chamber dividing plate is the airflow-reversing passage; The refrigeration case inner bottom part has the pallet of catchmenting, and there is storage tank refrigeration case outer bottom below, has condensed water drainage tubule to be communicated with storage tank on the pallet that catchments, and the condensed water that generates in the refrigeration case is drained into storage tank; Be provided with humidity temperature pickup at the air intake of fore-cooling room and the air outlet slit of condensation chamber; Be provided with grid chip cooler in fore-cooling room, the condensation chamber, grid sheet direction is parallel with airflow direction; The identical semiconductor cooler assembly of two groups of structures is respectively to fore-cooling room, condensation chamber refrigeration cool-down; The semiconductor cooler assembly is made up of semiconductor cooling device, trapezoidal cool guiding block, trapezoidal heat-conducting block, grid chip cooler, heat-pipe type radiator; The huyashi-chuuka (cold chinese-style noodles) close-coupled of the leptoprosopy of trapezoidal cool guiding block and semiconductor cooling device; Wide with the grid chip cooler close-coupled that is placed in the fore-cooling room, condensation chamber; The hot side close-coupled of the leptoprosopy of trapezoidal heat-conducting block and semiconductor cooling device; Wide the heat-pipe type radiator close-coupled interior with being placed in the air blast cooling pipeline, trapezoidal conduction cooling, heat-conducting block are processed by red copper or aluminium, and the leptoprosopy size is identical with the cold and hot surface of semiconductor cooling device; Wide was roughly 1.5: 1 with the every edge lengths ratio of leptoprosopy; Trapezoidal height equals the average monolateral length of leptoprosopy (the conventional semiconductor refrigeration device is mainly square and two kinds of shapes of rectangle on the market), and such structure has thermal diffusion effect preferably, comprises between two wide of trapezoidal cool guiding block and trapezoidal heat-conducting block that the whole space of semiconductor cooling device is filled adiabatic with rigid polyurethane foams; Be provided with the air blast cooling pipeline of semiconductor cooler component heat tubular radiator; The port of air blast cooling pipeline has aerofoil fan; Fore-cooling room in the air blast cooling pipeline; Pipe level section middle part between two groups of semiconductor cooler component heat tubular radiators of condensation chamber is mounted with the infiltration evaporimeter, and its upper end has projection to be embedded into storage tank.
The infiltration evaporimeter is processed by porous material; Can adopt ceramic sintering process or bonding extrusion process manufacturing; Have the porosity height, the good water permeability and the characteristic of higher mechanical strength are alveolate texture; In parallel with the air blast cooling pipeline a plurality of air-flow through holes, the similar honeycomb briquette shape of axially having.
The air that the aerofoil fan (icon F2) of refrigeration case condensation chamber lower end air stream outlet will pass through reducing temperature and humidity after handling is discharged to this when installing environment space of living in; The airflow inlet of pending air from the upper end, fore-cooling room sucked; Flow downward in the fore-cooling room and lower the temperature, then through the fore-cooling room air stream outlet of dividing plate lower end to get into the airflow-reversing passage up, through getting into the descending and further cooling of condensation chamber behind the airflow inlet of condensation chamber dividing plate upper end; The spatial volume of condensation chamber is greater than the fore-cooling room; Air slows down at the condensation chamber flow velocity, has sufficient heat exchange to make air continue cooling, when the temperature of air drops to dew point when following at condensation chamber; Oversaturated aqueous vapor will condense into aqueous water on the grid sheet of grid chip cooler, at the pallet that catchments of following system ice chest inner bottom part of gravity effect.The condensed water drainage tubule of pallet of catchmenting drains into storage tank with condensed water.
Contained part vaporous water changes into aqueous water and from air, separates in the air in condensation chamber; The vapor content of air reduces; Become and fall wet Cryogenic air, be transported to this that to do air conditioning through the aerofoil fan F2 of condensation chamber lower stream of airflow outlet and install environment space of living in.It is to hope hot and humid air conditioning is become the low temperature and low humidity air that people in most cases locates the subenvironment space.As long as for using under some situation that wets and do not hope to lower the temperature of begging to surrender; Can below the condensation chamber semiconductor cooler component heat tubular radiator in the air blast cooling pipeline, a pipe heat exchanger be set, the wet Cryogenic air of falling that condensation chamber is discharged heats outflow through this heat exchanger.
The air blast cooling pipeline is that the heat-pipe type radiator to semiconductor refrigerator assembly (icon D1, D2) hot junction carries out air blast cooling pipeline but; Aerofoil fan (icon F1) carries out heat exchange from the heat-pipe type radiator of cooling blast in air-cooled pipeline and semiconductor cooler assembly D1 hot junction, fore-cooling room that ambient atmosphere sucks; Taking away the heat air-flow heats up; The cellular infiltration evaporimeter of flowing through, condensate evaporation, the air-flow cooling is also taken away the condensed water of gasification; Change into the lower temperature high humidity air stream; The flow through heat-pipe type radiator pad exchange in condensation chamber semiconductor refrigerating assembly D2 hot junction is taken away heat and is become hot and humid air, is discharged in this ambient atmosphere of installing environment space of living in through aerofoil fan F1.
For the application of hoping to reduce subenvironment space temperature under some high temperature low humidity situation; At this moment less at the condensed water of condensation chamber formation; For making the normal performance of infiltration evaporimeter let cooling air lower the temperature; Effectively take away the heat-pipe type radiator heat, improve the refrigerating efficiency of semiconductor cooler assembly D2, can in storage tank, manual work add a certain amount of water.
Be provided with humidity temperature pickup (icon TR1, TR2) at the air intake of fore-cooling room and the air outlet slit of condensation chamber, temperature, the humidity data of monitoring pending air and reducing temperature and humidity processing back air are transported to single-chip microcomputer industry control unit and carry out analyzing and processing.On the single-chip microcomputer industry control unit that constitutes by chip microprocessor and peripheral circuit, ON-OFF control circuit etc. temperature, humidity information input bus are arranged; Semiconductor cooler assembly power supply control bus, refrigeration case aerofoil fan, air blast cooling pipeline aerofoil fan power supply control bus; Last repayment of principal refrigerating air conditioner fault warning shows.The environment space temperature of living in that TR1 measures, when humidity surpasses setting threshold, the full machine work of single-chip microcomputer industry control unit starting also can manually be controlled.If will be to the pole reversal of semiconductor refrigerator assembly D1, D2 direct current supply, this device becomes the equipment that hot blast is provided to the arrangement environment space.
Description of drawings
The technological sketch map of humid air adjusting device falls in accompanying drawing 1 for air-cooled semiconductor refrigerating.
As shown in Figure 1: pending air intake 1, fore-cooling room 2, fore-cooling room's dividing plate 3, airflow-reversing passage 4, condensation chamber dividing plate 5; Refrigeration case 6, condensation chamber 7, grid chip cooler 8, aerofoil fan 9 (icon F1), air blast cooling pipeline 10; Trapezoidal cool guiding block 11, semiconductor cooling device 12, trapezoidal heat-conducting block 13, heat-pipe type radiator 14; The adiabatic packed layer 15 of rigid polyurethane foams, humidity temperature pickup 16 (icon TR1, TR2), aerofoil fan 17 (icon F2), condensed water drainage tubule 18; The pallet 19 that catchments, storage tank 20, infiltration evaporimeter 21, single-chip microcomputer industry control unit 22.
The specific embodiment
According to required space size of falling the humid air adjusting; Humidity, temperature, the atmospheric pressure scope of conventional micro climate; Fall target humidity, temperature range after humid air is regulated, estimate the refrigerating capacity of fore-cooling room and condensation chamber, select semiconductor cooling device by certain surplus in view of the above.According to setting refrigerating capacity; The power supply DC voltage that this appliance arrangement is given, for example the semiconductor cooling device of definite selected model specifications such as DC12 volt, 24 volts, 48 volts is built into the semiconductor cooler assembly of fore-cooling room, condensation chamber by several monolithic serial or parallel connections.Existing semiconductor cooling device monolithic is mainly square and two kinds of shapes of rectangle on the market; Trapezoidal conduction cooling, heat-conducting block are processed into by red copper or aluminium material casting milling.According to air velocity, temperature, theoretical cryogenic temperature, heat exchange amount, the grid sheet area physical dimension that estimates fore-cooling room, condensation chamber grid chip cooler selects approved product to use, and dyes black usually or oxidation technology aluminum finished product can.Semiconductor cooler is exactly in fact the electron heat pump of current-control type, and liberated heat Qh equals input electric power P and cold junction refrigeratory capacity Qc sum: Qh=P+Qc in the hot junction; Confirm that according to the refrigeratory capacity of fore-cooling room, condensation chamber and input electric power the hot junction liberated heat that need loose selects the specification of heat-pipe type radiator, can select approved product for use.Rated wind speed according to selected heat-pipe type radiator requires, the parameters such as sectional area of air blast cooling pipeline are selected the air-cooled aerofoil fan F1 approved product of direct current supply.Select condensation chamber to fall wet back air stream outlet aerofoil fan F2 according to aforementioned technical conditions of falling the applied environment of humid air adjusting device, it is the direct current supply axial flow wind shoulder approved product that air quantity can be automatically controlled.Humidity temperature pickup TR1, TR2 can be the combination sensors of temperature and humidity, can be discrete sensor also, select the market standard product for use, and medium accuracy gets final product.Single-sheet miniature calculator (machine) is called for short single-chip microcomputer, and specification is more on the market, and the present invention can select for use 8 single-chip microcomputers to join corresponding peripheral components formation industry control unit.Single-chip microcomputer industry control unit is by the conventional method programming.The infiltration evaporimeter is processed by porous material; Can adopt alumina porous ceramic high-temperature electric resistance furnace sintering forming process, also can be with porous materials such as natural zeolite or particle gelatin through bonding extrusion process manufacturing, manufactured goods should have the porosity height; The good water permeability and the characteristic of higher mechanical strength; Be alveolate texture, in parallel with the cooling air pipeline a plurality of air-flow through holes, the similar honeycomb briquette shape of axially having.
Claims (3)
1. the humid air adjusting device falls in an air-cooled semiconductor refrigerating; Include formations such as refrigeration case, semiconductor cooler assembly, the pallet that catchments, condensed water drainage tubule, storage tank, infiltration evaporimeter, air blast cooling pipeline, aerofoil fan, humidity temperature pickup, single-chip microcomputer industry control unit; It is characterized in that refrigeration case is covered with the polyurethane insulating outward; Interior being complied with by two vertical partition plates that are parallel to each other of refrigeration case horizontally is separated into fore-cooling room, airflow-reversing passage, condensation chamber; Dividing plate lower end, fore-cooling room has air stream outlet, and condensation chamber dividing plate upper end has air flow inlet, and the narrower space between fore-cooling room's dividing plate and the condensation chamber dividing plate is the airflow-reversing passage; The refrigeration case inner bottom part has the pallet of catchmenting, and there is storage tank refrigeration case outer bottom below, has condensed water drainage tubule to be communicated with storage tank on the pallet that catchments, and the condensed water that generates in the refrigeration case is drained into storage tank; Be provided with humidity temperature pickup at the air intake of fore-cooling room and the air outlet slit of condensation chamber; Be provided with grid chip cooler in fore-cooling room, the condensation chamber, grid sheet direction is parallel with airflow direction; The identical semiconductor cooler assembly of two groups of structures is respectively to fore-cooling room, condensation chamber refrigeration cool-down; The semiconductor cooler assembly is made up of semiconductor cooling device, trapezoidal cool guiding block, trapezoidal heat-conducting block, grid chip cooler, heat-pipe type radiator; The huyashi-chuuka (cold chinese-style noodles) close-coupled of the leptoprosopy of trapezoidal cool guiding block and semiconductor cooling device; Wide with the grid chip cooler close-coupled that is placed in the fore-cooling room, condensation chamber; The hot side close-coupled of the leptoprosopy of trapezoidal heat-conducting block and semiconductor cooling device; Wide the heat-pipe type radiator close-coupled interior with being placed in the air blast cooling pipeline, trapezoidal conduction cooling, heat-conducting block are processed by red copper or aluminium, comprise between two wide of trapezoidal cool guiding block and trapezoidal heat-conducting block that the whole space of semiconductor cooling device is filled adiabatic with rigid polyurethane foams; Be provided with the air blast cooling pipeline of semiconductor cooler component heat tubular radiator; The port of air blast cooling pipeline has aerofoil fan; Fore-cooling room in the air blast cooling pipeline; Pipe level section middle part between two groups of semiconductor cooler component heat tubular radiators of condensation chamber is mounted with the infiltration evaporimeter, and its upper end has projection to be embedded into storage tank.
2. the humid air adjusting device falls in air-cooled semiconductor refrigerating as claimed in claim 1; The evaporimeter that it is characterized in that seeping water is processed by porous material; Has the porosity height; The good water permeability and the characteristic of higher mechanical strength are alveolate texture, axially have a plurality of air-flow through holes parallel with the air blast cooling pipeline.
3. the humid air adjusting device falls in air-cooled semiconductor refrigerating as claimed in claim 1; On the single-chip microcomputer industry control unit that it is characterized in that constituting temperature, humidity information input bus are arranged by chip microprocessor and peripheral circuit, ON-OFF control circuit; Semiconductor cooler assembly power supply control bus, refrigeration case aerofoil fan, air blast cooling pipeline aerofoil fan power supply control bus; Go up and originally fall humid air adjusting device fault warning demonstration in addition.
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| CN201210116878.2A CN102628599B (en) | 2012-04-20 | 2012-04-20 | Air-cooling semiconductor refrigerating and humidity reducing air adjusting device |
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| CN201210116878.2A CN102628599B (en) | 2012-04-20 | 2012-04-20 | Air-cooling semiconductor refrigerating and humidity reducing air adjusting device |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103115399A (en) * | 2013-02-27 | 2013-05-22 | 青岛海尔空调电子有限公司 | Low-static-pressure air duct machine with dehumidification module and method for controlling low-static-pressure air duct machine |
| CN103245021A (en) * | 2013-05-15 | 2013-08-14 | 北京科技大学 | Air conditioner for partial temperature regulation |
| CN103743018A (en) * | 2013-12-25 | 2014-04-23 | 王春 | Novel energy-saving TE module air conditioner |
| CN104930750A (en) * | 2015-06-10 | 2015-09-23 | 刘鸿飞 | Novel integrated refrigeration fan |
| CN105352075A (en) * | 2015-09-09 | 2016-02-24 | 南京中格科技发展有限公司 | Electronic air conditioner |
| CN107062687A (en) * | 2016-12-30 | 2017-08-18 | 重庆市大足区华盛环保设备有限公司 | A kind of changes in temperature fog generating means |
| CN107339784A (en) * | 2017-08-22 | 2017-11-10 | 合肥天鹅制冷科技有限公司 | The control system of Ka frequency range radar power amplifier wind-cooling heat dissipating equipment |
| CN109915423A (en) * | 2019-04-04 | 2019-06-21 | 大连理工大学 | It is a kind of based on semiconductor refrigerating element without leaf refrigerating fan |
| CN112696751A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Air conditioning device based on 3D temperature-uniforming plate module |
| CN114893828A (en) * | 2022-03-30 | 2022-08-12 | 青岛海信日立空调系统有限公司 | Air conditioner |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103115399A (en) * | 2013-02-27 | 2013-05-22 | 青岛海尔空调电子有限公司 | Low-static-pressure air duct machine with dehumidification module and method for controlling low-static-pressure air duct machine |
| CN103115399B (en) * | 2013-02-27 | 2015-09-02 | 青岛海尔空调电子有限公司 | A kind of low static pressure flue pipe with dehumidification module and control method thereof |
| CN103245021A (en) * | 2013-05-15 | 2013-08-14 | 北京科技大学 | Air conditioner for partial temperature regulation |
| CN103245021B (en) * | 2013-05-15 | 2015-06-03 | 北京科技大学 | Air conditioner for partial temperature regulation |
| CN103743018A (en) * | 2013-12-25 | 2014-04-23 | 王春 | Novel energy-saving TE module air conditioner |
| CN104930750A (en) * | 2015-06-10 | 2015-09-23 | 刘鸿飞 | Novel integrated refrigeration fan |
| CN105352075A (en) * | 2015-09-09 | 2016-02-24 | 南京中格科技发展有限公司 | Electronic air conditioner |
| CN107062687A (en) * | 2016-12-30 | 2017-08-18 | 重庆市大足区华盛环保设备有限公司 | A kind of changes in temperature fog generating means |
| CN107339784A (en) * | 2017-08-22 | 2017-11-10 | 合肥天鹅制冷科技有限公司 | The control system of Ka frequency range radar power amplifier wind-cooling heat dissipating equipment |
| CN109915423A (en) * | 2019-04-04 | 2019-06-21 | 大连理工大学 | It is a kind of based on semiconductor refrigerating element without leaf refrigerating fan |
| CN112696751A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Air conditioning device based on 3D temperature-uniforming plate module |
| CN114893828A (en) * | 2022-03-30 | 2022-08-12 | 青岛海信日立空调系统有限公司 | Air conditioner |
| CN114893828B (en) * | 2022-03-30 | 2023-08-18 | 青岛海信日立空调系统有限公司 | Air conditioner |
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| CN102628599B (en) | 2014-04-16 |
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