CN107062687A - A kind of changes in temperature fog generating means - Google Patents
A kind of changes in temperature fog generating means Download PDFInfo
- Publication number
- CN107062687A CN107062687A CN201611252180.8A CN201611252180A CN107062687A CN 107062687 A CN107062687 A CN 107062687A CN 201611252180 A CN201611252180 A CN 201611252180A CN 107062687 A CN107062687 A CN 107062687A
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- CN
- China
- Prior art keywords
- temperature
- pipe
- semiconductor chilling
- generating means
- changes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
Abstract
The present invention provides a kind of changes in temperature fog generating means, including the air inlet fan mouth of pipe, the air inlet fan mouth of pipe connects snake pipe, the semiconductor chilling plate that the U-shaped bending part of the snake pipe is set provided with two relative clampings, one piece of panel connecting pipe wall of the semiconductor chilling plate, retaining cavity is provided between two semiconductor chilling plates, the retaining cavity bottom is provided with attached water mechanism, and the attached water mechanism is stretched into snake pipe.The present invention is on blower fan, the problem of solving that tradition blowing cooling system cooling-down effect is poor, can not be warmed oneself.
Description
Technical field
The present invention relates to field of Environment Protection, more particularly, to a kind of changes in temperature fog generating means.
Background technology
In life, fan etc. is by the use of large area in life or processing factory building etc. place, and fan makes
With often in hot summer, fan is distinguished and admirable using driving rapid air movement to realize, distinguished and admirable to strengthen waving for human sweat
Hair, reaches the effect of cooling, when winter, fan is then abandoned, instead the system such as air-conditioning or floor heating is warmed oneself
With.For fan in itself for its mode for cooling only by formed it is distinguished and admirable cool, cooling-down effect is relatively low, and in the winter time can not
Realize the effect of heating.Therefore, the applicant has invented one kind and may be mounted on the basis of based on traditional blowing apparatus
The generating means of changes in temperature fog is produced on blowing apparatus.
The content of the invention
The present invention provides a kind of changes in temperature fog generating means, with solve tradition blowing cooling system cooling-down effect it is poor, can not
The problem of being warmed oneself.
To achieve these goals, the present invention is to realize by the following technical solutions：A kind of changes in temperature fog is filled
Put, including the air inlet fan mouth of pipe, the air inlet fan mouth of pipe connection snake pipe, the U-shaped bending part of the snake pipe is provided with two
The semiconductor chilling plate that relative clamping is set, one piece of panel connecting pipe wall of the semiconductor chilling plate, two described partly to lead
Retaining cavity is provided between body cooling piece, the retaining cavity bottom is provided with attached water mechanism, and the attached water mechanism stretches into coiled pipe
In road.
Further, the attached water mechanism is provided with the water diversion article after arranged in a crossed manner into several quadrangles, the water diversion article bag
Include and diversion tubule is provided with the middle part of the hydrophobic material layer mutually clamped and the spongy layer in the middle of clamping, the spongy layer, it is described
Diversion tubule is provided with the first apopore or through slot, and the hydrophobic material layer is provided with the second apopore.
Further, provided with immersion regulating part between the retaining cavity and attached water mechanism, the immersion regulating part is interior
The cock body structure of portion's insertion, the immersion regulating part bottom connects diversion tubule.
Further, in addition to temperature sensor, power supply, controller and temperature adjustment module, the temperature sensor is set
Put in snake pipe air outlet, the power supply connects semiconductor chilling plate, the controller connects temperature sensor, power supply respectively
And temperature adjustment module, wherein,
Temperature sensor, the temperature for detection air port；
Power supply, the electric current for conveying different size and direction to semiconductor chilling plate；
Temperature adjustment module, size of current and direction for adjusting semiconductor chilling plate carry out temperature adjustment；
Controller, the signal instruction for integrated treatment temperature sensor, power supply and temperature adjustment module.
The beneficial effects of the invention are as follows：
On the basis of the present invention is based on traditional blowing apparatus, introduced distinguished and admirable in a snake pipe, by semiconductor system
The refrigeration and heat generation characteristic of cold, two block semiconductor cooling pieces are arranged in the U-shaped bending of snake pipe, snake pipe is entered
Row refrigeration is heated, and cistern is set in the middle of two block semiconductor cooling pieces, and cistern coordinates the attached water mechanism of bottom to be supplied
Water, water is after attached water mechanism is adhered to, and water can form fog to the cold for cold wind and hot water or hot blast in the wind, so that shape
Into after device of the wind by the present invention of ordinary temp, hot blast or cold wind are formed, and carries fog, the effect of cooling can be strengthened
Or the effect of heating.In addition, setting temperature adjustment module, controller and temperature sensor on device, it is possible to achieve to refrigeration
Or the leaving air temp of heating is adjusted, with good practicality.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is a structural representation of attached water mechanism of the present invention；
Fig. 3 is a structural representation of water diversion article of the present invention；
As shown in FIG.：1- snake pipes, 2- semiconductor chilling plates, 3- retainings cavity, 4- attached waters mechanism, 31- immersions are adjusted
Save part, 41- water diversion articles, 411- hydrophobic material layers, 412- spongy layers, 413- diversion tubules.
Embodiment
In order that those skilled in the art more fully understand the technical scheme in the embodiment of the present invention, and make of the invention real
Applying the above-mentioned purpose of example, feature and advantage can be more obvious understandable, below in conjunction with the accompanying drawings to technical side in the embodiment of the present invention
Case is described in further detail.
As illustrated, a kind of changes in temperature fog generating means of the invention, including the air inlet fan mouth of pipe, the air inlet fan mouth of pipe connection
Snake pipe 1, semiconductor chilling plate 2 of the U-shaped bending part provided with two relative clamping settings of the snake pipe is described partly to lead
Retaining cavity 3, the storage chamber are provided between one piece of panel connecting pipe wall of body cooling piece, two semiconductor chilling plates
Body bottom is provided with attached water mechanism 4, and the attached water mechanism is stretched into snake pipe.When two block semiconductor cooling pieces are configured,
The heating face of two block semiconductor cooling pieces or chill surface contact in the both sides tube wall of U-shaped bending, make by the wind of snake pipe by
Heat or cooling, form cold wind or hot blast after distinguished and admirable bleeder, realize the function of room temperature lowering or heating.Two block semiconductor systems
The another side of cold carries out heat transfer with retaining cavity, the water in storage chamber body is cooled or heated, when the wind in snake pipe
By when formed after hot blast, be hot water in storage chamber body；On the contrary, when the wind in snake pipe by when formed cold wind after, retaining
It is hot water in cavity.Water in storage chamber body flows into attached water mechanism and adhered to, and attached water mechanism can be taken away when wind is blown
The water of upper attachment, the characteristic that can be atomized in cold and hot meet using moisture, no matter by after semiconductor refrigeration chip heating or refrigeration
Wind can produce fog by attached water mechanism, and be blown away with distinguished and admirable outside device.
As a further improvement on the present invention, the attached water mechanism is provided with the water diversion article after arranged in a crossed manner into several quadrangles
41, the water diversion article includes the hydrophobic material layer 411 mutually clamped and the spongy layer 412 in the middle of clamping, the spongy layer
Middle part is provided with diversion tubule 413, and the diversion tubule is provided with the first apopore or through slot, and the hydrophobic material layer is provided with second
Apopore.The structure can let in air attached water mechanism when, more preferable band is leaked out, and moisture is atomized.
As a further improvement on the present invention, provided with immersion regulating part 31, institute between the retaining cavity and attached water mechanism
The cock body structure that immersion regulating part is internal run-through is stated, the immersion regulating part bottom connects diversion tubule.The mechanism makes retaining
In the uniform entrance attached water mechanism at a slow speed of water in cavity, it is to avoid the moisture of retaining cavity largely flows into attached water under gravity
In mechanism, make to be full of water in snake pipe, so as to reduce the effect of atomization and distinguished and admirable by property.
As a further improvement on the present invention, in addition to temperature sensor, power supply, controller and temperature adjustment module, institute
State temperature sensor and be arranged on snake pipe air outlet, the power supply connects semiconductor chilling plate, and the controller is connected respectively
Temperature sensor, power supply and temperature adjustment module, wherein, temperature sensor, the temperature for detection air port；Power supply, is used for
The electric current in different size and direction is conveyed to semiconductor chilling plate；Temperature adjustment module, the electricity for adjusting semiconductor chilling plate
Flow size and Orientation and carry out temperature adjustment；Controller, the letter for integrated treatment temperature sensor, power supply and temperature adjustment module
Number instruction.By setting temperature adjustment module, controller and temperature sensor on device, it is possible to achieve to what is freezed or heat
Leaving air temp is adjusted, and can connect led display screens etc. by drawing on the controller airflow temperature is shown, to making
User provides more preferable temperature adjustment foundation, with good practicality.
The present invention principle be：On the basis of the present invention is based on traditional blowing apparatus, by one snake pipe of distinguished and admirable introducing
It is interior, by the refrigeration and heat generation characteristic of semiconductor chilling plate, two block semiconductor cooling pieces are arranged on to the U-shaped bending of snake pipe
It is interior, snake pipe is freezed or heated, cistern is set in the middle of two block semiconductor cooling pieces, cistern coordinates bottom
Attached water mechanism is supplied water, and water is after attached water mechanism is adhered to, and water can to the cold for cold wind and hot water or hot blast in the wind
Fog is formed, so as to be formed after device of the wind of ordinary temp by the present invention, hot blast or cold wind is formed, and carries fog, can
To strengthen the effect of cooling or the effect of heating.In addition, setting temperature adjustment module, controller and TEMP on device
Device, it is possible to achieve the leaving air temp for freezing or heating is adjusted, with good practicality.
Finally illustrate, the above embodiments are merely illustrative of the technical solutions of the present invention and it is unrestricted, although with reference to compared with
The present invention is described in detail good embodiment, it will be understood by those within the art that, can be to skill of the invention
Art scheme is modified or equivalent substitution, and without departing from the objective and scope of technical solution of the present invention, it all should cover at this
Among the right of invention.
Claims (4)
1. a kind of changes in temperature fog generating means, including the air inlet fan mouth of pipe, it is characterised in that：The air inlet fan mouth of pipe connects coiled pipe
Road, semiconductor chilling plate of the U-shaped bending part provided with two relative clamping settings of the snake pipe, the semiconductor chilling plate
One piece of panel connecting pipe wall, retaining cavity is provided between two semiconductor chilling plates, the retaining cavity bottom is set
There is attached water mechanism, the attached water mechanism is stretched into snake pipe.
2. a kind of changes in temperature fog generating means according to claim 1, it is characterised in that：The attached water mechanism is provided with intersection
Into the water diversion article of several quadrangles after setting, the water diversion article includes the hydrophobic material layer mutually clamped and positioned at clamping centre
Diversion tubule is provided with the middle part of spongy layer, the spongy layer, the diversion tubule is provided with the first apopore or through slot, described hydrophobic
Material layer is provided with the second apopore.
3. a kind of changes in temperature fog generating means according to claim 1, it is characterised in that：The retaining cavity and attached water machine
Provided with immersion regulating part between structure, the immersion regulating part is the cock body structure of internal run-through, and the immersion regulating part bottom connects
Logical diversion tubule.
4. a kind of changes in temperature fog generating means according to claim 3, it is characterised in that：Also include temperature sensor, electricity
Source, controller and temperature adjustment module, the temperature sensor are arranged on snake pipe air outlet, and the power supply connects semiconductor
Cooling piece, the controller connects temperature sensor, power supply and temperature adjustment module respectively, wherein,
Temperature sensor, the temperature for detection air port；
Power supply, the electric current for conveying different size and direction to semiconductor chilling plate；
Temperature adjustment module, size of current and direction for adjusting semiconductor chilling plate carry out temperature adjustment；
Controller, the signal instruction for integrated treatment temperature sensor, power supply and temperature adjustment module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611252180.8A CN107062687A (en) | 2016-12-30 | 2016-12-30 | A kind of changes in temperature fog generating means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611252180.8A CN107062687A (en) | 2016-12-30 | 2016-12-30 | A kind of changes in temperature fog generating means |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107062687A true CN107062687A (en) | 2017-08-18 |
Family
ID=59623557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611252180.8A Pending CN107062687A (en) | 2016-12-30 | 2016-12-30 | A kind of changes in temperature fog generating means |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107062687A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109869839A (en) * | 2017-12-01 | 2019-06-11 | 青岛海尔股份有限公司 | A kind of intelligent blowing device of all-in-one multifunctional machine |
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| CN102620363A (en) * | 2012-03-29 | 2012-08-01 | 广东美的环境电器制造有限公司 | Evaporation and electronic double-refrigeration cooling fan |
| CN102628599A (en) * | 2012-04-20 | 2012-08-08 | 程刚 | Air-cooling semiconductor refrigerating and humidity reducing air adjusting device |
| KR20120098007A (en) * | 2011-02-28 | 2012-09-05 | 주식회사 탑 엔지니어링 | Resin applying apparatus for manufacturing semi-conductor package |
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| CN103775358A (en) * | 2012-10-18 | 2014-05-07 | 徐州丙辰电子有限公司 | Cool fog spraying type electric fan |
| KR20150069873A (en) * | 2013-12-16 | 2015-06-24 | 장성호 | Dehumidifier using Themoelectric Modules |
| CN105308394A (en) * | 2013-06-19 | 2016-02-03 | 金光洙 | Energy-saving, four-season, smart, and safe cold/hot air blower |
| CN205783431U (en) * | 2016-05-26 | 2016-12-07 | 中国计量学院 | A kind of small air dehumidifying humidifying and purifying integrated apparatus |
-
2016
- 2016-12-30 CN CN201611252180.8A patent/CN107062687A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202005014260U1 (en) * | 2005-09-09 | 2005-11-24 | Lee, Ching-Yang, Heng Shan Hsiang | Temperature-regulating mat for heating or cooling system includes return pipe to form circulation duct and has temperature difference semi conductor chip and heat conductive element with hydraulic pump for pumping fluid from fluid box |
| KR20120098007A (en) * | 2011-02-28 | 2012-09-05 | 주식회사 탑 엔지니어링 | Resin applying apparatus for manufacturing semi-conductor package |
| CN102620363A (en) * | 2012-03-29 | 2012-08-01 | 广东美的环境电器制造有限公司 | Evaporation and electronic double-refrigeration cooling fan |
| CN102628599A (en) * | 2012-04-20 | 2012-08-08 | 程刚 | Air-cooling semiconductor refrigerating and humidity reducing air adjusting device |
| CN103775358A (en) * | 2012-10-18 | 2014-05-07 | 徐州丙辰电子有限公司 | Cool fog spraying type electric fan |
| CN203287796U (en) * | 2013-06-17 | 2013-11-13 | 北京科技大学 | Accurate control apparatus for low water-vapor gas humidity |
| CN105308394A (en) * | 2013-06-19 | 2016-02-03 | 金光洙 | Energy-saving, four-season, smart, and safe cold/hot air blower |
| KR101324720B1 (en) * | 2013-07-23 | 2013-11-05 | 김인봉 | Parallel micro-spray air conditioning apparatus |
| KR20150069873A (en) * | 2013-12-16 | 2015-06-24 | 장성호 | Dehumidifier using Themoelectric Modules |
| CN205783431U (en) * | 2016-05-26 | 2016-12-07 | 中国计量学院 | A kind of small air dehumidifying humidifying and purifying integrated apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109869839A (en) * | 2017-12-01 | 2019-06-11 | 青岛海尔股份有限公司 | A kind of intelligent blowing device of all-in-one multifunctional machine |
| CN109869839B (en) * | 2017-12-01 | 2020-09-29 | 青岛海尔股份有限公司 | Intelligent air supply device of multifunctional all-in-one machine |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170818 |