CN114893828A - Air conditioner - Google Patents
Air conditioner Download PDFInfo
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- CN114893828A CN114893828A CN202210324187.5A CN202210324187A CN114893828A CN 114893828 A CN114893828 A CN 114893828A CN 202210324187 A CN202210324187 A CN 202210324187A CN 114893828 A CN114893828 A CN 114893828A
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- air
- temperature
- air conditioner
- module
- semiconductor refrigerating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/0007—Indoor units, e.g. fan coil units
- F24F1/0071—Indoor units, e.g. fan coil units with means for purifying supplied air
- F24F1/0076—Indoor units, e.g. fan coil units with means for purifying supplied air by electric means, e.g. ionisers or electrostatic separators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F8/00—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying
- F24F8/30—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by ionisation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A50/00—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
- Y02A50/20—Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
The invention discloses an air conditioner, wherein an air return port and an air outlet are arranged on an indoor unit shell, an indoor heat exchanger is arranged on an air duct communicated with the air return port and the air outlet, a negative oxygen water ion generation module is arranged at the air outlet and comprises an emission electrode and a semiconductor refrigeration part, the semiconductor refrigeration part is used for generating condensed water used for ionization of the emission electrode, an air pretreatment module is arranged on an air flow path of air in the air duct flowing to the negative oxygen water ion generation module and used for preheating or precooling the air passing through the semiconductor refrigeration part so as to improve the temperature difference of the ambient air of the semiconductor refrigeration part, improve the water condensation capacity of the semiconductor refrigeration part, ensure that the emission electrode can still obtain enough moisture used for point discharge to generate negative oxygen water ions even under the condition of lower humidity, and improve the air purification effect of the air conditioner.
Description
Technical Field
The invention relates to the technical field of air conditioners, in particular to an air conditioner with an air purification function.
Background
In the air conditioner using the nano water ions as the air purification principle, on one hand, the main purification factor of the nano water ions module is hydroxyl radical, so that the sterilization effect is better, but the particle purification effect is poorer; on the other hand, the nano water ion module is integrally arranged in the air conditioner, the nano water ion outlet is connected to the air conditioner air outlet through a pipeline, the module does not have a power system, nano water ions are sucked to the air conditioner air outlet from the module only by virtue of a trace negative pressure generated by the air speed of the air conditioner air outlet, and due to the instability of hydroxyl radicals, the nano water ions are decomposed more in the transmission process and do not reach the indoor air to play a role in purifying the air.
The technology is to discharge water drops on a tip electrode at high voltage to gradually split the water drops into water mist and decompose the water mist into high-activity nano-scale water ions, wherein the water ions contain a large amount of high-activity hydroxyl free radicals which have extremely high oxidability and can decompose and remove bacteria, microorganisms, formaldehyde, VOC and other components in the air.
The negative oxygen water ion can consume water gradually in the production process, one of the existing negative oxygen water ion technologies is to use a semiconductor refrigeration technology, a semiconductor refrigeration part is used for cooling an emitting electrode, the emitting electrode has hydrophilicity, the cooled emitting electrode absorbs water from the surrounding air, and then point discharge is generated at the emitting point of the emitting electrode by negative high voltage to generate negative oxygen water ions. According to the water supply mode for generating the condensed water by cooling the emitter electrode, under the condition that the air humidity is low, the emitter electrode is difficult to generate the condensed water, negative oxygen water ions cannot be generated, and the emitter electrode is used as the grounding electrode to emit under the influence of semiconductor refrigeration, and positive high voltage is used for the counter electrode, so that the generated negative oxygen water ions do not contain negative ion components, and the functional effect of the negative ions is lacked.
The above information disclosed in this background section is only for enhancement of understanding of the background section of the application and therefore it may contain prior art that does not constitute known technology to those of ordinary skill in the art.
Disclosure of Invention
The invention provides an air conditioner aiming at the problems pointed out in the background technology, a semiconductor refrigerating part is not used for cooling an emitter electrode any more, but is used for generating condensed water, then the condensed water is led to the emitter tip by utilizing the hydrophilicity of the emitter electrode, the temperature difference of the semiconductor refrigerating part is improved through an air preprocessing module, the capability of the semiconductor refrigerating part for generating the condensed water is improved, and therefore the emitter electrode can still obtain enough moisture for tip discharge to generate negative oxygen water ions even under the condition of lower humidity, and the air purifying effect of the air conditioner is improved.
In order to realize the purpose of the invention, the invention is realized by adopting the following technical scheme:
in some embodiments of the present application, there is provided an air conditioner including:
the indoor heat exchanger is arranged on an air duct communicated with the air outlet;
the negative oxygen water ion generating module is arranged at the air outlet and comprises an emitting electrode and a semiconductor refrigerating part, and the semiconductor refrigerating part is used for generating condensed water for ionization of the emitting electrode;
and the air pretreatment module is arranged on an air flow path of the air in the air duct flowing to the negative oxygen water ion generation module and is used for preheating or precooling the air flowing through the semiconductor refrigerating part so as to improve the temperature difference of the ambient air of the semiconductor refrigerating part.
In some embodiments of the present application, the negative oxygen ion generating module further includes a housing, the emitter electrode and the semiconductor refrigerating portion are both disposed in the housing, the housing is provided with a negative oxygen ion releasing port through which the emitting tip of the emitter electrode is exposed, and the negative oxygen ion releasing port faces the air outlet;
the shell is also provided with a vent, a flow guide channel is arranged in the air duct, an inlet of the flow guide channel is positioned at the upstream of the indoor heat exchanger, and an outlet of the flow guide channel is communicated with the vent;
the air pretreatment module is arranged on an air flow channel between the inlet of the flow guide channel and the semiconductor refrigerating part.
In some embodiments of the present application, the system obtains the humidity Rh at the air outlet;
when Rh is larger than or equal to Rh1, the air pretreatment module is closed;
when Rh is less than Rh1, if the indoor unit of the air conditioner is in a refrigeration working mode, the air pretreatment module starts a preheating mode; and if the indoor unit of the air conditioner is in a heating working mode, the air pre-processing module starts a pre-cooling mode.
In some embodiments of the present application, the heating/cooling capacity of the air pretreatment module is inversely proportional to Rh.
In some embodiments of the present application, the temperature T of the air outlet 0 The difference between the temperature T and the temperature T in the flow guide channel is delta T;
the heating capacity/cooling capacity of the air pretreatment module is inversely proportional to delta t.
In some embodiments of the present application, the temperature T of the outlet 0 When the difference delta T between the temperature T in the diversion channel and the temperature T is smaller than a first set threshold value T1, the air pretreatment module is started;
temperature T of the air outlet 0 And the difference delta T between the temperature T in the diversion channel and the temperature T is larger than a second set threshold value T2, the air pretreatment module is closed.
In some embodiments of the present application, the temperature T of the outlet 0 When the difference delta T between the temperature T in the flow guide channel and the temperature T in the flow guide channel is larger than 0, the air pre-processing module pre-cools the air flowing through the semiconductor refrigerating part;
temperature T of the air outlet 0 And when the difference delta T between the temperature delta T and the temperature T in the flow guide channel is less than 0, the air pre-processing module preheats the air flowing through the semiconductor refrigerating part.
In some embodiments of the present application, the air pretreatment module includes a semiconductor refrigeration sheet, one side of the semiconductor refrigeration sheet is provided with a first heat exchange plate, and the other side of the semiconductor refrigeration sheet is provided with a second heat exchange plate;
the first heat exchange plate is positioned in an air flow channel between an inlet of the flow guide channel and the semiconductor refrigerating part;
the second heat exchange plate is positioned outside an air flow channel between the inlet of the flow guide channel and the semiconductor refrigerating part.
In some embodiments of the present application, the first heat exchange plate has a plurality of first heat exchange plates arranged at intervals, and a first ventilation gap is formed between two adjacent first heat exchange plates;
the second heat exchange plates are arranged at intervals, and a second ventilation gap is formed between every two adjacent second heat exchange plates.
In some embodiments of the present application, one end of the emitter electrode and a water storage gap is arranged between the semiconductor refrigeration part, the emitter electrode has hydrophilicity, condensed water generated by the semiconductor refrigeration part is stored in the water storage gap, and the emitter electrode leads the condensed water in the water storage gap to the emission tip end of the emitter electrode.
Compared with the prior art, the invention has the advantages and positive effects that:
in the air conditioner disclosed in the application, a water conservancy diversion passageway is divided in indoor wind channel, the negative oxygen water ion who specially supplies to locating air outlet department in the flow direction takes place the module, set up air pretreatment module in the water conservancy diversion passageway, be used for preheating or the precooling to the air that flows through semiconductor refrigeration portion, with the difference in temperature of the surrounding air that improves semiconductor refrigeration portion, improve the ability that semiconductor refrigeration portion produced the comdenstion water, and then guarantee that emitter electrode still can acquire sufficient moisture that is used for point discharge under the lower condition of humidity in order to produce negative oxygen water ion, improve the air purification effect of air conditioner.
Other features and advantages of the present invention will become more apparent from the following detailed description of the invention when taken in conjunction with the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an air conditioner indoor unit according to an embodiment;
fig. 2 is a schematic structural view of the indoor unit of the air conditioner according to the embodiment, with a top cover plate omitted;
fig. 3 is a schematic view illustrating a gas flow path in an indoor unit of an air conditioner according to an embodiment;
FIG. 4 is a schematic diagram of a negative oxygen water ion generating module and an air pre-treatment module of an air conditioner according to an embodiment;
FIG. 5 is a control flowchart of a negative oxygen water ion generating module and an air pre-treatment module of an air conditioner according to an embodiment;
FIG. 6 is a schematic diagram of a gas flow path of an air pre-processing module disposed in a piping box according to a first embodiment;
FIG. 7 is a schematic structural diagram of an air pretreatment module according to a first embodiment, which is disposed in a piping box;
FIG. 8 is a schematic view of an installation structure of an air pretreatment module and a negative oxygen water ion generation module according to a first embodiment;
FIG. 9 is a schematic structural diagram of a negative oxygen water ion generating module according to a first embodiment;
FIG. 10 is an exploded view of a negative oxygen water ion generating module according to a first embodiment;
FIG. 11 is a schematic view of a gas flow path of the air pretreatment module in the negative oxygen ion module according to the second embodiment;
FIG. 12 is a schematic structural diagram of a negative oxygen water ion generating module according to the second embodiment;
FIG. 13 is an exploded view of a negative oxygen water ion generating module according to the second embodiment;
FIG. 14 is a schematic structural diagram of a connection plate according to an embodiment;
FIG. 15 is a schematic structural diagram of an air pretreatment module, according to an embodiment.
Reference numerals:
100-indoor unit shell, 110-air return opening, 120-air outlet, 130-indoor heat exchanger, 140-fan, 150-partition plate, 161-front cavity, 162-rear cavity, 170-piping box, 171-air inlet, 180-connecting plate, 181-second air inlet, 182-mounting part and 190-inner bottom wall;
200-negative oxygen water ion generation module, 210-emission electrode, 220-semiconductor refrigeration part, 230-negative high-voltage power supply part, 240-shell, 241-first installation cavity, 242-second installation cavity, 243-partition plate, 244-negative oxygen water ion release port, 245-wiring port, 246-lug, 247-bottom shell, 2471-boss, 248-cover body, 2481-buckle, 250-conductive plate, 260-water storage gap, 270-electrode fixing seat and 280-first ventilation port;
300-an air pretreatment module, 310-a semiconductor refrigeration sheet, 320-a first heat exchange plate, 321-a first ventilation gap, 330-a second heat exchange plate, 331-a second ventilation gap;
400-flow guide channel.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
[ basic operation principle of air conditioner ]
The air conditioner performs a refrigeration cycle of the air conditioner by using a compressor, a condenser, an expansion valve, and an evaporator. The refrigeration cycle includes a series of processes involving compression, condensation, expansion, and evaporation to cool or heat an indoor space.
The low-temperature and low-pressure refrigerant enters the compressor, the compressor compresses the refrigerant gas in a high-temperature and high-pressure state, and the compressed refrigerant gas is discharged. The discharged refrigerant gas flows into the condenser. The condenser condenses the compressed refrigerant into a liquid phase, and heat is released to the surrounding environment through the condensation process.
The expansion valve expands the high-temperature and high-pressure liquid-phase refrigerant condensed in the condenser into a low-pressure liquid-phase refrigerant. The evaporator evaporates the refrigerant expanded in the expansion valve and returns the refrigerant gas in a low-temperature and low-pressure state to the compressor. The evaporator can achieve a cooling effect by heat-exchanging with a material to be cooled using latent heat of evaporation of a refrigerant. The air conditioner can adjust the temperature of the indoor space throughout the cycle.
The outdoor unit of the air conditioner refers to a portion of a refrigeration cycle including a compressor and an outdoor heat exchanger, the indoor unit of the air conditioner includes an indoor heat exchanger, and an expansion valve may be provided in the indoor unit or the outdoor unit.
The indoor heat exchanger and the outdoor heat exchanger serve as a condenser or an evaporator. When the indoor heat exchanger serves as a condenser, the air conditioner performs a heating mode; when the indoor heat exchanger is used as an evaporator, the air conditioner performs a cooling mode.
The indoor heat exchanger and the outdoor heat exchanger are switched to be used as a condenser or an evaporator, a four-way valve is generally adopted, and specific reference is made to the arrangement of a conventional air conditioner, which is not described herein again.
The refrigeration working principle of the air conditioner is as follows: the compressor works to enable the interior of the indoor heat exchanger (in the indoor unit, the evaporator at the moment) to be in an ultralow pressure state, liquid refrigerant in the indoor heat exchanger is rapidly evaporated to absorb heat, air blown out by the indoor fan is cooled by the coil pipe of the indoor heat exchanger to become cold air which is blown into a room, the evaporated and vaporized refrigerant is compressed by the compressor, is condensed into liquid in a high-pressure environment in the outdoor heat exchanger (in the outdoor unit, the condenser at the moment) to release heat, and the heat is dissipated into the atmosphere through the outdoor fan, so that the refrigeration effect is achieved by circulation.
The heating working principle of the air conditioner is as follows: the gaseous refrigerant is pressurized by the compressor to become high-temperature and high-pressure gas, and the high-temperature and high-pressure gas enters the indoor heat exchanger (the condenser at the moment), is condensed, liquefied and released heat to become liquid, and simultaneously heats indoor air, so that the aim of increasing the indoor temperature is fulfilled. The liquid refrigerant is decompressed by the throttling device, enters the outdoor heat exchanger (an evaporator at the moment), is evaporated, gasified and absorbs heat to form gas, absorbs the heat of outdoor air (the outdoor air becomes cooler) to form gaseous refrigerant, and enters the compressor again to start the next cycle.
[ indoor machine ]
The outer contour of the indoor unit is formed by an indoor casing 100, referring to fig. 1 to 3, the indoor casing 100 is a rectangular structure, one side of the indoor casing 100 is provided with an air return opening 110, the other side is provided with an air outlet 120, the air return opening 110 and the air outlet 120 are in front-back opposite communication to form an air duct, and an indoor heat exchanger 130 is arranged on the air duct through which the air return opening 110 and the air outlet 120 are communicated.
Indoor air flows into the inner cavity of the indoor housing 100 through the air return opening 110, exchanges heat through the indoor heat exchanger 130, and then flows into the indoor through the air outlet 120, so that the indoor air is cooled or heated.
A partition plate 150 is provided in the indoor unit case 100, and the partition plate 150 partitions an inner cavity of the indoor unit case 100 into a rear cavity 162 and a front cavity 161.
The fan 140 is disposed in the rear cavity 1602, and the return air inlet 110 is communicated with the rear cavity 162. An indoor heat exchanger 130 is arranged in the front cavity 161, and the air outlet 120 is communicated with the front cavity 161.
[ negative oxygen water ion generating Module ]
With continued reference to fig. 1-3, the negative oxygen water ion generating module 200 is configured to generate negatively charged nano water ions, which have negative charges and hydroxyl radicals generated by ionized water.
The negative charge can charge the particulate matters in the air and promote the particulate matters in the air to agglomerate, and the particulate matters after volume and weight increase are settled to the ground or the charged particulate matters are adsorbed to the nearby zero potential (earth), so that the particulate matters such as PM2.5 in the air are removed.
Hydroxyl free radicals generated by high-pressure ionization in nano water ions have extremely strong oxidability, and when the hydroxyl free radicals are contacted with bacterial viruses on the surface of particulate matters or bacterial viruses in the air, the hydroxyl free radicals deprive hydrogen elements from cell walls of the bacteria, so that the cell wall structure is damaged, cells are inactivated, and proteins are denatured due to strong oxidation of the hydroxyl free radicals, so that the effects of sterilization and disinfection are achieved.
The negative oxygen water ion generating module 200 is arranged at the air outlet 120, and the generated nano water ions are directly blown into the room, so that the air purification effect is improved.
Referring to fig. 4, the negative oxygen water ion generating module 200 includes an emitter electrode 210, a semiconductor cooling part 220, and a negative high voltage power supply part 230.
The semiconductor refrigeration part 220 is used for generating condensed water for ionization of the emitter electrode 210, and the negative high voltage power supply part 230 provides negative high voltage for the emitter electrode 210, so that moisture on the emitter electrode 210 is excited by high voltage ionization to generate negatively charged nano water ions.
In some embodiments of the present application, the emitter electrode 210 has hydrophilicity so as to guide the condensed water generated by the semiconductor refrigeration portion 220 to the emitter tip thereof, and after the emitter electrode 210 is energized with negative high voltage electricity, the negatively charged nano water ions can be ionized and excited at the emitter tip.
The emitter electrode 210 may be made of a water-absorbing material, and a silver ion sterilization material may be added in the water-absorbing material to kill bacteria and viruses, etc. which are bred in the water-absorbing material after long-term use.
The semiconductor cooling portion 220 is used for generating condensed water, referring to fig. 11, a water storage gap 260 is formed between one end of the emitter electrode 210 and the semiconductor cooling portion 220, the condensed water generated by the semiconductor cooling portion 220 is stored in the water storage gap 260, and the emitter electrode 210 guides the condensed water in the water storage gap 260 to an emitting tip thereof by using hydrophilicity.
The ability of the semiconductor refrigerating unit 220 to generate condensed water is related to the temperature difference of the air around the semiconductor refrigerating unit, and the greater the temperature difference is, the stronger the ability to generate condensed water is; conversely, the smaller the temperature difference, the weaker the ability to generate condensed water.
In some embodiments of the present application, referring to fig. 9 and 10, the negative oxygen ion generating module 200 further includes a housing 240, and the emitter electrode 210, the semiconductor cooling portion 220, and the negative high voltage power supply portion 230 are disposed in the housing 240.
The casing 240 may be made of an insulating material such as PP, PVC, nylon, PTFE, etc., and the casing 240 is provided with a negative oxygen ion release opening 244 through which the emission tip of the emitter electrode 210 is exposed, wherein the negative oxygen ion release opening 244 faces the air outlet 120.
The negative oxygen water ion release opening 244 is in a bell mouth shape, and the static accumulation on the shell 240 can be effectively avoided by gradually amplifying the ion emission opening, so that the negative oxygen ions with higher concentration can be released.
When the air in the air duct flows out through the air outlet 120, the air cannot directly blow the emitter electrode 210, and the influence of the air outlet temperature on the condensation effect of the semiconductor refrigeration part 220 on the air is avoided.
In some embodiments of the present application, a partition plate 243 is disposed in the inner cavity of the casing 240, the partition plate 243 divides the inner cavity of the casing 240 into a first installation cavity 241 and a second installation cavity 242, and an opening (not labeled) for gas to flow through is disposed on the partition plate 243.
The emitter electrode 210 and the semiconductor cooling part 220 are disposed in the first mounting chamber 241, and the negative high voltage power supply part 230 is disposed in the second mounting chamber 242.
A vent (referred to as a first vent 280) is formed in the housing 240, and the first vent 280 is communicated with the second mounting cavity 242.
Air outside the negative oxygen ion generating module 200 flows into the inner cavity of the housing 240 through the first ventilation opening 280, sequentially flows through the second mounting cavity 242 and the first mounting cavity 241 to reach the semiconductor refrigerating part 220, condensed water is generated at the semiconductor refrigerating part 220 and is supplied to the emission tip of the emission electrode 210, negative oxygen ions excited by high-voltage ionization flow out through the release opening 244, and the air outlet 120 flows into the indoor space.
In some embodiments of the present application, referring to fig. 10, the housing 240 includes a bottom case 247 and a cover 248, a boss 2471 is disposed on the bottom case 247, a buckle 2481 is disposed on the cover 248, and the bottom case 247 and the cover 248 are fixedly connected by clamping the buckle 2481 and the boss 2471.
The side edge of the bottom shell 247 is provided with a wiring port 245, and the cover 248 is provided with a negative oxygen ion release port 244.
In some embodiments of the present application, referring to fig. 11, an insulating electrode fixing seat 270 is disposed in the first mounting cavity 241, a jack (not labeled) is disposed on the electrode fixing seat 270, and the emitter electrode 210 is inserted into the jack.
The top of the electrode fixing base 270 is provided with a conductive plate 250, the conductive plate 250 is provided with a contact claw (not shown) extending into the jack and contacting with the emitter electrode 210, and the conductive plate 250 is electrically connected with the negative high voltage power supply part 230.
The semiconductor refrigerating part 220 is arranged at the bottom of the electrode fixing seat 270 and is opposite to the jack, and the water storage gap 260 is formed between the semiconductor refrigerating part 220 and the bottom of the jack.
In some embodiments of the present application, referring to fig. 7 to 9, a connection plate 180 is disposed in an inner cavity of the indoor unit casing 100, and is connected to one end of the indoor heat exchanger 130, a lug 246 is disposed on the casing 240, and the lug 246 is fixedly disposed on the connection plate 180 through a connector such as a screw, so as to achieve the fixed installation of the negative oxygen ion generating module 200 at the air outlet 120.
[ air Pre-treatment Module ]
Because negative oxygen water ion generation module 200 locates air outlet 120, the temperature of its surrounding air is influenced by the air-out temperature of air outlet greatly, can influence the water condensing capacity of semiconductor refrigeration portion 220, and this problem is solved through air pretreatment module 300 to this embodiment.
In some embodiments of the present application, an air pre-processing module 300 is disposed on an air flow path of air flowing from air in the air duct to the negative oxygen ion generating module 200, and is configured to preheat or pre-cool air flowing through the semiconductor refrigerating portion 220, so as to improve a temperature difference of ambient air of the semiconductor refrigerating portion 220, and improve an ability of the semiconductor refrigerating portion 220 to generate condensed water, thereby ensuring that the emitter electrode 210 can still obtain sufficient moisture for point discharge to generate negative oxygen ions even under a condition of low humidity, and improving an air purification effect of the air conditioner.
A diversion channel 400 is divided in the air duct and is specially used for flowing to the negative oxygen ion generating module 200, and the air pre-processing module 300 is used for pre-heating or pre-cooling the air in the diversion channel 400.
The inlet of the guide channel 400 is located at the upstream of the indoor heat exchanger 130, and the outlet of the guide channel 400 is communicated with the first ventilation opening 280 on the shell;
the air pre-treatment module 300 is disposed on an air flow path between an inlet of the guide passage 400 and the semiconductor cooling part 220.
A part of the air flowing into the air duct from the air return opening 110 exchanges heat with the indoor heat exchanger 130, and then flows out from the air outlet 120; the other part of the air does not pass through the indoor heat exchanger 130, but flows into the flow guide channel 400, and then flows into the inner cavity of the housing 240 through the first vent 280, and the air flows through the air pre-treatment module 300 to be pre-heated or pre-cooled in the process of flowing from the flow guide channel 400 to the semiconductor refrigerating part 220, so that the air temperature difference at the semiconductor refrigerating part 220 is increased, and the capability of the semiconductor refrigerating part 220 to generate condensed water is improved.
In some embodiments of the present application, referring to fig. 15, the air pre-treatment module 300 includes a semiconductor chilling plate 310, and two opposite sides of the semiconductor chilling plate 310 are referred to as a first side and a second side.
The semiconductor chilling plate 310 is provided with a first heat exchange plate 320 on a first side and a second heat exchange plate 330 on a second side.
The first heat exchange plate 320 is located within an air flow passage between an inlet of the flow guide passage 400 and the semiconductor cooling part 220.
The second heat exchange plate 330 is located outside the air flow passage between the inlet of the flow guide channel 400 and the semiconductor cooling part 220.
When the first side of the semiconductor cooling plate 310 cools and the second side heats, the first heat exchange plate 320 is a heat absorbing plate, and the second heat exchange plate 330 is a heat dissipating plate.
When the first side of the semiconductor cooling plate 310 heats and the second side cools, the first heat exchange plate 320 is a heat dissipation plate, and the second heat exchange plate 330 is a heat absorption plate.
When the air conditioner executes the refrigeration working mode, the temperature at the air outlet 120 is low, at the moment, the air pretreatment module 300 starts the preheating mode to preheat the air flowing from the diversion channel 400 to the semiconductor refrigeration part 220, at the moment, the first heat exchange plate 320 is a heat dissipation plate, the second heat exchange plate 330 is a heat absorption plate, and when the air flows through the air pretreatment module 300, the air is heated by the heat dissipated by the first heat exchange plate 320, so that the temperature is increased, the temperature difference at the semiconductor refrigeration part 220 is further improved, and the water condensation capacity of the air is improved.
When the air conditioner executes a heating working mode, the temperature at the air outlet 120 is high, at this time, the air pre-treatment module 300 starts a pre-cooling mode to pre-cool the air flowing from the flow guide channel 400 to the semiconductor refrigerating part 220, at this time, the first heat exchange plate 320 is a heat absorbing plate, the second heat exchange plate 330 is a heat dissipating plate, when the air flows through the air pre-treatment module 300, the heat is absorbed by the first heat exchange plate 320, the temperature is reduced, the temperature difference at the semiconductor refrigerating part 220 is further improved, and the water condensing capacity of the semiconductor refrigerating part is improved.
In some embodiments of the present application, with reference to fig. 15, the first heat exchange plates 320 are arranged at intervals, a first ventilation gap 321 is formed between two adjacent first heat exchange plates 320, and air flows through the first ventilation gap 321, so that heat exchange efficiency is improved.
The second heat exchange plates 330 are arranged at intervals, and a second ventilation gap 331 is formed between two adjacent second heat exchange plates 330, so that the heat exchange efficiency is improved.
[ diversion passage ]
In some embodiments of the present application, referring to fig. 3 and 7, a pipe box 170 is disposed in the inner cavity of the indoor housing 110, and the pipe box 170 is used for installing a suction pump, a water pipe, a float switch, and the like.
The piping box 170 is a common component in the existing indoor unit, in the prior art, the rear of the piping box 170 is communicated with an upstream air duct of the indoor heat exchanger 130, the front side of the piping box 170 is closed, a part of air flowing in from the air return opening 110 does not pass through the indoor heat exchanger 130, but flows into the piping box 170 on the side, because the front side of the piping box 170 is closed, the air in the piping box 170 does not continuously flow out to the outside, and most of the air filled in the piping box 170 is air before heat exchange.
The present application makes full use of the space area of the piping box 170, the front side of the piping box 170 is provided with a vent to communicate the front side of the piping box 170 with the air outlet 120, so that a part of the air flowing from the air return 110 and not exchanging heat with the indoor heat exchanger 130 flows into the piping box 170, and then flows to the negative oxygen water ion generating module 200 at the air outlet 120 through the vent, and the gas flowing space formed in the piping box 170 is the above-mentioned diversion channel 400.
Referring to fig. 7, the pipe box 170 is disposed near the side of the indoor housing 110 and located in the front chamber 161, and the rear of the pipe box 170 is open to the air duct, and an air inlet 171 of the pipe box 170 is formed in a region between the open end and the indoor heat exchanger 130 and the partition plate 150.
The connection plate 180 is disposed at the front side of the indoor heat exchanger 130, the connection plate 180 is connected to both an inner bottom wall 190 (actually, an indoor water pan for receiving condensed water generated by the indoor heat exchanger 130) of the indoor unit casing and the front side wall of the indoor unit casing 110 to separate the pipe box 170 from a downstream air duct of the indoor heat exchanger 130, and the negative oxygen water ion generating module 200 is disposed on the connection plate 180.
In some embodiments of the present application, with continued reference to fig. 7, the indoor heat exchanger 130 is disposed obliquely in the air duct, an upper portion of the indoor heat exchanger 130 extends obliquely toward the air outlet 120 side, and the connection plate 180 is disposed in a triangular region formed between the indoor heat exchanger 130, the inner bottom wall 190 of the indoor cabinet, and the front side wall of the indoor cabinet 110.
[ mounting of air Pre-treatment Module ]
In some embodiments of the present application, referring to fig. 6-10, an air pre-treatment module 300 is disposed within the tube box 170.
Referring to fig. 14, a second ventilation opening 181 is formed in the connecting plate 180, a mounting portion 182 having two ends penetrating is formed at the second ventilation opening 181, a portion of the mounting portion 182 is located in the pipe box 170, and the other portion is in direct communication with the first ventilation opening 280, so as to communicate the inner cavity of the pipe box 170 with the inner cavity of the housing 240.
The semiconductor cooling fins 310 are disposed on the mounting portion 182, and specifically, the mounting portion 182 is disposed on a portion of the pipe box 170, the first heat exchanging plate 320 is disposed in an inner cavity of the mounting portion 182, and the second heat exchanging plate 330 is disposed outside the mounting portion 182.
The air in the pipe box 170 flows into the inner cavity of the housing 240 through the inner cavity of the mounting portion 182, contacts the first heat exchange plate 320 while flowing through the inner cavity of the mounting portion 282, and flows through the first ventilation gap 321 to achieve pre-heating or pre-cooling of the air.
In some embodiments of the present application, referring to fig. 11 to 13, the air pre-treatment module 300 is disposed in the negative oxygen water ion generation module 200.
The semiconductor chilling plate 310 is disposed on the housing 240, specifically on the cover 248, the first heat exchange plate 320 is located in an inner cavity of the housing 240, specifically in the second mounting cavity 242, and the second heat exchange plate 330 is located outside the housing 240.
The air in the pipe box 170 flows into the second mounting cavity 242 of the housing through the inner cavity of the mounting portion 182, and then continues to flow toward the first mounting cavity 241, and in the process, the air contacts the first heat exchange plate 320 and flows through the first ventilation gap 321, so as to achieve pre-heating or pre-cooling of the air.
[ control of air Pre-treatment Module ]
In some embodiments of the present application, referring to FIG. 5, the temperature T at the outlet 120 is 0 When the difference Δ T between the temperature T in the diversion passage 400 and the temperature T in the air conditioner is greater than 0, it indicates that the air conditioner is in the heating operation mode, and the air pre-processing module 300 pre-cools the air flowing through the semiconductor cooling unit 220.
Temperature T at the outlet 120 0 When the difference Δ T from the temperature T in the flow guide passage 400 is less than 0, it indicates that the air conditioner is in the cooling operation mode, and the air pre-processing module 300 pre-heats the air flowing through the semiconductor cooling part 220.
In other embodiments, the control system may also directly read a cooling or heating control command of the air conditioner to directly determine whether the air conditioner is in the cooling or heating operation mode.
In some embodiments of the present application, the system obtains the humidity Rh at the air outlet 120, and adjusts the switch of the air pre-processing module 300 according to the humidity, and adjusts the temperature T of the air outlet 120 0 And the flow guide channel 4The difference Δ T between the temperatures T in 00 controls the air pre-treatment module 300 to switch between the pre-cooling and pre-heating modes, and adjusts the cooling/heating capacity by adjusting the operating power of the pre-cooling/pre-heating mode of the air pre-treatment module 300, so as to pre-cool/pre-heat the air flowing through, thereby increasing the temperature difference at the semiconductor cooling part 220 and improving the water condensation capacity thereof.
Specifically, (1) when Rh is greater than or equal to Rh1, the air pre-processing module 300 is turned off, the humidity is high, and moisture can be condensed from the air only by the cooling capacity of the semiconductor cooling portion 220.
(2) When Rh is less than Rh1, if the indoor unit of the air conditioner is in a cooling working mode, the air pre-processing module 300 starts a preheating mode; if the indoor unit of the air conditioner is in the heating operation mode, the air pre-processing module 300 starts the pre-cooling mode.
And, the heating/cooling capacity of the air pre-treatment module 300 is inversely proportional to Rh.
For ease of understanding, Rh2 < Rh1 is set:
when Rh2 < Rh1,
firstly, if the indoor unit is in a refrigeration working mode, the air pretreatment module 300 starts a preheating mode, and the heating capacity is Q01;
if the indoor unit is in a heating working mode, the air pretreatment module 300 starts a cooling mode, and the refrigerating capacity is Q02;
when Rh is less than or equal to Rh2,
firstly, if the indoor unit is in a refrigeration working mode, the air pretreatment module 300 starts a preheating mode, and the heating capacity is Q03;
if the indoor unit is in a heating working mode, the air pretreatment module 300 starts a cooling mode, and the refrigerating capacity is Q04;
Q03＞Q01，Q04＞Q02。
in some embodiments of the present application, the temperature T at the outlet 120 is 0 When the difference Δ T between the temperature T in the diversion passage 400 and the temperature T in the semiconductor refrigeration unit 400 is smaller than the first set threshold T1, the temperature difference is small, and at this time, the air pretreatment module 300 is turned on, and the air flowing from the diversion passage 400 to the semiconductor refrigeration unit 220 needs to be pretreated.
Temperature at the outlet 120T 0 When the difference Δ T between the temperature T in the diversion passage 400 and the temperature T in the diversion passage 400 is greater than the second set threshold T2, the temperature difference is large, the air preprocessing module 300 is closed, and moisture can be condensed from the air only by the cooling capacity of the semiconductor cooling portion 220.
In some embodiments of the present application, the heating/cooling capacity of the air pre-processing module 300 and the temperature T of the air outlet 120 0 Inversely proportional to the difference Δ T between the temperatures T in the flow-guiding channels 400.
For ease of understanding, t1 < t2 (t being positive) is set as follows:
(1) when Rh2 < Rh1 and Δ t is positive,
when the delta t is larger than or equal to t2, the air pretreatment module 300 is closed;
when t2 is not less than Δ t not less than t1, the air pre-treatment module 300 starts a pre-cooling mode, and the refrigerating capacity is Q11;
when delta t is more than or equal to 0 and less than or equal to t1, the air pretreatment module 300 starts a precooling mode, and the refrigerating capacity is Q12;
refrigeration capacity Q12> Q11;
when Δ t is less than or equal to-t 2, the air pretreatment module 300 is closed;
when delta t is more than or equal to-t 2 and less than or equal to-t 1, the air pretreatment module 300 starts a preheating mode, and the heating quantity is Q21; when the temperature is 0 ≧ Δ t ≧ t1, the air pretreatment module 300 starts a preheating mode, and the heating quantity is Q22;
the heating capacity Q22 is more than Q21;
(2) when Rh is less than or equal to Rh2 and Δ t is a positive value,
when the delta t is larger than or equal to t2, the air pretreatment module 300 is closed;
when t2 is not less than Δ t not less than t1, the air pre-treatment module 300 starts a pre-cooling mode, and the refrigerating capacity is Q31;
when delta t is more than or equal to 0 and less than or equal to t1, the air pretreatment module 300 starts a precooling mode, and the refrigerating capacity is Q32;
refrigerating capacity Q32 & gt Q31 & gt Q12 & gt Q11;
when Δ t is less than or equal to-t 2, the air pretreatment module 300 is closed;
when delta t is more than or equal to-t 2 and less than or equal to-t 1, the air pretreatment module 300 starts a preheating mode, and the heating quantity is Q41; when the temperature is 0 ≧ t1, the air preprocessing module 300 starts a preheating mode, and the heating quantity is Q42;
the heating quantity Q42 is more than Q4 is more than Q22 is more than Q21.
The control of the air pre-processing module 300 can not only prevent the excessive condensation of the semiconductor refrigerating unit 220, but also improve the condensation capacity of the semiconductor refrigerating unit 220 under dry conditions.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. An air conditioner comprising:
the indoor heat exchanger is arranged on an air duct communicated with the air outlet;
it is characterized by also comprising:
the negative oxygen water ion generating module is arranged at the air outlet and comprises an emitting electrode and a semiconductor refrigerating part, and the semiconductor refrigerating part is used for generating condensed water for ionization of the emitting electrode;
and the air pretreatment module is arranged on an air flow path of the air in the air duct flowing to the negative oxygen water ion generation module and is used for preheating or precooling the air flowing through the semiconductor refrigerating part so as to improve the temperature difference of the ambient air of the semiconductor refrigerating part.
2. The air conditioner according to claim 1,
the negative oxygen water ion generating module also comprises a shell, the transmitting electrode and the semiconductor refrigerating part are arranged in the shell, a negative oxygen water ion releasing port for exposing the transmitting tip of the transmitting electrode is arranged on the shell, and the negative oxygen water ion releasing port faces the air outlet;
the shell is also provided with a vent, a flow guide channel is arranged in the air duct, an inlet of the flow guide channel is positioned at the upstream of the indoor heat exchanger, and an outlet of the flow guide channel is communicated with the vent;
the air pretreatment module is arranged on an air flow channel between the inlet of the flow guide channel and the semiconductor refrigerating part.
3. The air conditioner according to claim 2,
the system acquires the humidity Rh at the air outlet;
when Rh is larger than or equal to Rh1, the air pretreatment module is closed;
when Rh is less than Rh1, if the indoor unit of the air conditioner is in a refrigeration working mode, the air pretreatment module starts a preheating mode; and if the indoor unit of the air conditioner is in a heating working mode, the air pre-processing module starts a pre-cooling mode.
4. The air conditioner according to claim 3,
the heating capacity/cooling capacity of the air pretreatment module is inversely proportional to Rh.
5. The air conditioner according to claim 3,
temperature T of the air outlet 0 The difference between the temperature T and the temperature T in the flow guide channel is delta T;
the heating capacity/cooling capacity of the air pretreatment module is inversely proportional to delta t.
6. The air conditioner according to claim 3,
temperature T of the air outlet 0 When the difference delta T between the temperature T in the diversion channel and the temperature T is smaller than a first set threshold value T1, the air pretreatment module is started;
temperature T of the air outlet 0 And the difference delta T between the temperature T in the diversion channel and the temperature T is larger than a second set threshold value T2, the air pretreatment module is closed.
7. The air conditioner according to any one of claims 2 to 6,
temperature T of the air outlet 0 When the difference delta T between the temperature T in the flow guide channel and the temperature T in the flow guide channel is larger than 0, the air pre-processing module pre-cools the air flowing through the semiconductor refrigerating part;
temperature T of the air outlet 0 And when the difference delta T between the temperature delta T and the temperature T in the flow guide channel is less than 0, the air pre-processing module preheats the air flowing through the semiconductor refrigerating part.
8. The air conditioner according to claim 7,
the air pretreatment module comprises a semiconductor refrigeration piece, wherein a first heat exchange plate is arranged on one side of the semiconductor refrigeration piece, and a second heat exchange plate is arranged on the other side of the semiconductor refrigeration piece;
the first heat exchange plate is positioned in an air flow channel between an inlet of the flow guide channel and the semiconductor refrigerating part;
the second heat exchange plate is positioned outside an air flow channel between the inlet of the flow guide channel and the semiconductor refrigerating part.
9. The air conditioner according to claim 8,
the first heat exchange plates are arranged at intervals, and a first ventilation gap is formed between every two adjacent first heat exchange plates;
the second heat exchange plates are arranged at intervals, and a second ventilation gap is formed between every two adjacent second heat exchange plates.
10. The air conditioner according to claim 7,
a water storage gap is formed between one end of the emitting electrode and the semiconductor refrigerating portion, the emitting electrode is hydrophilic, condensed water generated by the semiconductor refrigerating portion is stored in the water storage gap, and the emitting electrode leads the condensed water in the water storage gap to an emitting tip end of the emitting electrode.
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| CN202210324187.5A CN114893828B (en) | 2022-03-30 | 2022-03-30 | Air conditioner |
| PCT/CN2022/136313 WO2023185063A1 (en) | 2022-03-30 | 2022-12-02 | Air conditioner |
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| CN202210324187.5A CN114893828B (en) | 2022-03-30 | 2022-03-30 | Air conditioner |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023185063A1 (en) * | 2022-03-30 | 2023-10-05 | 青岛海信日立空调系统有限公司 | Air conditioner |
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