CN102818324A - Semiconductor fan - Google Patents
Semiconductor fan Download PDFInfo
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- CN102818324A CN102818324A CN2012102818044A CN201210281804A CN102818324A CN 102818324 A CN102818324 A CN 102818324A CN 2012102818044 A CN2012102818044 A CN 2012102818044A CN 201210281804 A CN201210281804 A CN 201210281804A CN 102818324 A CN102818324 A CN 102818324A
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Abstract
The invention discloses a semiconductor fan comprising a casing, a draught fan I and a refrigeration component. The refrigeration component at least comprises a semiconductor refrigeration plate which is arranged in the casing, and a refrigeration cavity is formed between the cold end surface of the semiconductor refrigeration plate and the internal wall of the casing; and the refrigeration cavity is provided with an air inlet for air intake through air blowing by the draught fan I and an air outlet for air exhaust. The semiconductor fan provided by the invention has the advantages of refrigeration by using the Peltier effect of a semiconductor material, wide refrigeration temperature range, capability of meeting the needs of people without using any gas and liquid working mediums, no pollution to the environment, simple structure, few parts and low manufacture cost, thereby being a safe and reliable cold-hot air fan.
Description
Technical field
The present invention relates to a kind of cold and hot wind devices, relate in particular to a kind of semiconductor fan.
Background technology
Along with improving constantly of living standard; The higher requirement that people also propose the life living environment, cold and hot wind devices is to improve the requisite a kind of apparatus of people's living environment, like cold/hot air-conditioning and fan comparatively commonly used; Be significant for optimizing the environment; The fan that wherein is used to freeze is through promoting the air augmented surface of flowing to freeze with the heat exchange of air, and refrigeration depends on air themperature and flow velocity, and the little and action space of cryogenic temperature scope is limited in scope usually; Operating noise is big, and long-time air-flow flow at high speed also causes human body uncomfortable easily; Hot-air fan generally is to be the basis with the refrigerating fan, electric network is installed on the air draft path is realized heating, and electric network is generally processed by thermal resistance; Power is bigger, and energy consumption is high, and use cost is high; Operating noise is big, and hot and cold fan functionality is single, and the cooling and warming of can not holding concurrently is in one; Fragile, service life is generally shorter, has the limitation in the use; And the cooling and warming of air-conditioning is to utilize under the normal temperature to gas but the conversion of the gas-liquid attitude of the cold-producing medium that can liquefy at a lower temperature realizes; Generally comprise compressor, condenser, throttle part and four essential parts of evaporimeter, connect successively with pipeline between them, form an airtight system; Cold-producing medium constantly circulates in system; Generating change of state, and then carry out exchange heat with the external world at present adopts freon as cold-producing medium more; Freon is the cold-producing medium of a kind of colourless, odorless, transparent, almost non-toxic property, but content surpasses at 80% o'clock and can cause suffocating of people in the air; Can not burn and can not explode yet in fluorine Lyons, but contact with naked light or temperature when reaching more than 400 ℃, can decomposite harmful hydrogen fluoride, hydrogen chloride photoreactive gas; If because the air-conditioning cause for quality causes contingencies such as cold-producing medium leakage or breaking out of fire to cause cold-producing medium to decompose the life security that then not only can cause environmental pollution but also very easily injure people, moreover, the refrigeration of air-conditioning is to transform through the generation state that cold-producing medium does not stop in the circulatory system of sealing to realize; Energy consumption is high; Operating noise is arranged, complex structure, precise part is many; Manufacturing cost is high, and price is generally more expensive.
Therefore, need a kind of safe, reliable, refrigeration plant that temperature regulating range is big,, fill up the vacancy of cooling and warming technology, improve people's life living environment more reliably, satisfy demands of social development to remedy existing cold and hot wind devices deficiency in the use.
Summary of the invention
In view of this, the purpose of this invention is to provide a kind of semiconductor fan, utilize the peltier effect of semi-conducting material to freeze and heat, temperature regulating range is big, can satisfy needs of people, and is free from environmental pollution, simple in structure, low cost of manufacture, long service life.
Semiconductor fan of the present invention; Comprise housing, blower fan I and cooling assembly; Said cooling assembly comprises semiconductor chilling plate at least; Said semiconductor chilling plate is installed in the housing and between its cold end surface and the inner walls and forms refrigerating chamber, and said refrigerating chamber is provided with by the air blast of blower fan I and promotes the air inlet of air intake and the air outlet of air-out.
Further; The cold end surface of semiconductor chilling plate is provided with fin side by side along the wind flow direction; Form a plurality of refrigerating channels between the cold end surface of said fin, inner walls and semiconductor chilling plate; Also be distributed with air vent on the said fin, the low spot that is positioned at refrigerating chamber is provided with the header tank that is used to collect condensed water that communicates with refrigerating chamber; Said blower fan I is fixedly set in the refrigerating chamber;
Further, said semiconductor chilling plate is provided with the cold and hot switch that changeable its electric current inserts direction;
Further, said semiconductor chilling plate integral body is built in the housing, also forms the heat radiation chamber between the hot end surface of semiconductor chilling plate and the inner walls;
Further, said cooling assembly also comprises water-cooling system, and said water-cooling system comprises water pump at least, and the water inlet of said water pump is communicated in header tank, and the delivery port of water pump is communicated in the heat radiation chamber;
Further, said semiconductor chilling plate hot end surface vertically is provided with fin side by side, forms a plurality of heat dissipation channels between the hot end surface of said fin, inner walls and semiconductor chilling plate, also is distributed with through hole on the said fin;
Further, said water-cooling system also comprise through water-supply-pipe be communicated in pump outlet be used for water is sprayed on the spraying pack unit of semiconductor chilling plate fin surface and is arranged at the storage tank that is used to collect cooling water that heat radiation chamber low spot communicates with the chamber of dispelling the heat;
Further, said cooling assembly also comprises air cooling system, and said air cooling system comprises the blower fan II at least, and said blower fan II is fixedly set in the heat radiation chamber, and the heat radiation chamber is provided with by the air blast of blower fan II and promotes the air intake passage of air intake and the air-out passage of air-out;
Further; Said air intake passage and air-out passage are and are communicated with the heat radiation chamber to outdoor ventilation duct; Said semiconductor chilling plate hot end surface is provided with fin along air intake passage to the air-out channel direction side by side; Form a plurality of heat dissipation channels between the hot end surface of said fin, inner walls and semiconductor chilling plate, also be distributed with through hole on the said fin;
Further, said cooling assembly comprises also and is connected with the heat conduction of semiconductor chilling plate hot junction and extends outdoor heat pipe and heat conduction is connected in the radiator that heat pipe is positioned at outdoor end that said radiator outside is provided with case.
The invention has the beneficial effects as follows: semiconductor fan of the present invention, utilize the peltier effect of semi-conducting material to freeze and heat, promptly when the galvanic couple of direct current through being in series by different semi-conducting materials; Two ends in an idol can absorb and emit heat respectively, can realize subzero 130 ℃ of adjustings to 90 ℃ of temperature ranges above freezing, and temperature regulating range is big; Needs of people be can satisfy, any gas, liquid working media need not, free from environmental pollution; Simple in structure; Parts are few, and low cost of manufacture is a kind of safe and reliable Cold-warm fan.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further described:
Fig. 1 is a semiconductor fan integral type water-cooling structure sketch map of the present invention;
Fig. 2 is a semiconductor fan integral type air-cooled structure sketch map of the present invention;
Fig. 3 is the inside and outside separate type sketch map of semiconductor fan room of the present invention;
Fig. 4 is a semiconductor chilling plate cold junction fin structure sketch map
Fig. 5 is semiconductor chilling plate place in circuit and cold and hot on-off circuit figure.
The specific embodiment
Embodiment one:
Fig. 1 is a semiconductor fan integral type water-cooling structure sketch map of the present invention, and Fig. 4 is a semiconductor chilling plate cold junction fin structure sketch map, and Fig. 5 is semiconductor chilling plate place in circuit and cold and hot on-off circuit figure; As shown in the figure: the semiconductor fan of present embodiment, comprise housing 1, blower fan I 2 and cooling assembly 3, said cooling assembly 3 comprises semiconductor chilling plate 31 at least; Said semiconductor chilling plate 31 is installed in the housing 1 and forms refrigerating chamber 13 between its cold end surface and housing 1 inwall, and said refrigerating chamber 13 is provided with by 2 air blast of blower fan I and promotes the air inlet 11 of air intake and the air outlet 12 of air-out, and semiconductor chilling plate 31 is sealingly fastened in the housing 1 with what cool and heat ends was separated through seal diaphragm 4; Be positioned at the gauge tap that is provided for controlling semiconductor chilling plate 31 on/offs on the housing 1 and inserts the sense of current; Change the sense of current that inserts semiconductor chilling plate 31 through gauge tap and can realize freezing or heating, control is convenient, can realize subzero 130 ℃ of adjustings to 90 ℃ of temperature ranges above freezing; Temperature regulating range is big; Can satisfy needs of people, free from environmental pollution, simple in structure; Low cost of manufacture; Long service life is positioned at refrigerating chamber 13 and can be provided for air is filtered the damping device 5 of humidification near air outlet 12 1 ends, can keep the humidity through refrigerating chamber 13 hydronic room airs; Avoid because of the too dry human body sense of discomfort that causes of room air; Damping device 5 can be the suction hole cotton that is arranged at refrigerating chamber 13 interior air outlet 12 places and immerses condensed water, through suction hole cotton the filtration of air is moistened and does in order to the increase air humidity, and also can adopt with the condensed water is the negative oxygen ion air wetting machine of humidification water.
In the present embodiment; The cold end surface of semiconductor chilling plate 31 is provided with fin 32 side by side along the wind flow direction; Form a plurality of refrigerating channels between the cold end surface of said fin 32, housing 1 inwall and semiconductor chilling plate 31, also be distributed with air vent 321 on the said fin 32, the low spot that is positioned at refrigerating chamber 13 is provided with the header tank 15 that is used to collect condensed water that communicates with refrigerating chamber 13; As shown in Figure 4; Air vent 321 be positioned on adjacent two fins 32 respectively near be provided with away from semiconductor chilling plate cold junction 311, the air vent 321 of each fin 32 can be set to a plurality of and evenly arrange along the straight lines that are parallel to semiconductor chilling plate cold junction 311 surfaces, air vent 321 apertures and quantity can unobstructed flow under the promotion of blower fan I 2 be crossed with air and are as the criterion; After air gets into refrigerating chamber 13 by air inlet 11; Zigzag channel along gap between each fin 32 and air vent 321 formations flows to the discharge of air outlet 12 places, air and each fin 32 surperficial full contacts, and the heat exchange action area is big; The cold of semiconductor chilling plate 31 or heat utilization ratio are high, and cooling or heating effect is good.
In the present embodiment; Said semiconductor chilling plate 31 is provided with the cold and hot switch 16 that changeable its electric current inserts direction, and cold and hot switch 16 is installed on housing 1, is provided with a pair of movable contact electrode 161 that is connected with power supply and oppositely inserts two pairs of fixed contact electrodes (being respectively 162a among Fig. 5,162b) that semiconductor chilling plate 31 changeable electric currents insert direction each other; Simple in structure; Low cost of manufacture, said power supply are dc source, and civil power is realized through rectifier rectification; Cold and hot switch 16 also can be provided with one and cut off the disconnection shelves 163 that semiconductor chilling plate 31 is connected with power supply with two pairs of arranged side by side being used to of fixed contact electrode, and the on/off of collection semiconductor chilling plate is arranged at one, controls more convenient.
In the present embodiment; Said semiconductor chilling plate 31 integral body are built in the housing 1; Also form heat radiation chamber 14 between the hot end surface of semiconductor chilling plate 31 and housing 1 inwall, semiconductor chilling plate 31 cold and hot two ends isolate the portion temperature that can effectively avoid because of the environment infiltration causes and neutralize, and guarantee making full use of of semiconductor chilling plate 31 cold that produces or heat; Water-cooled or air cooling system 35 also can be set to be come semiconductor chilling plate hot junction 312 generation heats are concentrated cooling; Mode through active heat removal reduces hot-side temperature, makes further to reduce cold junction temperature under the constant situation of dc source electric current, improves its refrigeration.
In the present embodiment, said cooling assembly 3 also comprises water-cooling system 34, and said water-cooling system 34 comprises water pump 341 at least; The water inlet of said water pump 341 is communicated in header tank 15, and the delivery port of water pump 341 is communicated in heat radiation chamber 14, and the temperature difference of semiconductor chilling plate cool and heat ends can reach between 40 ℃～65 ℃ usually; When semiconductor fan of the present invention is used to freeze, can open the take the initiative mode of heat radiation of water-cooling system 34 and reduce hot-side temperature, under the constant situation of dc source electric current, can further reduce cold junction temperature; And then reaching lower temperature, refrigerating capacity is big, can satisfy needs of people; Water-cooling system 34 reliabilities are high, good heat dissipation effect.
In the present embodiment; 312 surfaces, said semiconductor chilling plate hot junction vertically are provided with fin 33 side by side; Form a plurality of heat dissipation channels between the hot end surface of said fin 33, housing 1 inwall and semiconductor chilling plate 31; Also be distributed with through hole 331 on the said fin 33, can increase semiconductor chilling plate hot junction 312 surface areas and with the contact area of cooling water, cooling effectiveness is high.
In the present embodiment; Said water-cooling system 34 also comprise through water-supply-pipe 342 be communicated in water pump 341 delivery ports be used for water is sprayed on the spraying pack unit 343 on semiconductor chilling plate 31 fin 33 surface and is arranged at the storage tank 344 that is used to collect cooling water that heat radiation chamber 14 low spots communicate with the chamber 14 of dispelling the heat; Water-supply-pipe is fixed in seal diaphragm 4; Reasonable in design; Be beneficial to fully contacting of cooling water and fin 33, storage tank 344 can be provided with liquid level meter and draining valve so that observe its water level inside and draining timely.
Embodiment two:
Fig. 2 is a semiconductor fan integral type air-cooled structure sketch map of the present invention, and Fig. 4 is a semiconductor chilling plate cold junction fin structure sketch map, and Fig. 5 is semiconductor chilling plate place in circuit and cold and hot on-off circuit figure; As shown in the figure: the semiconductor fan of present embodiment, comprise housing 1, blower fan I 2 and cooling assembly 3, said cooling assembly 3 comprises semiconductor chilling plate 31 at least; Said semiconductor chilling plate 31 is installed in the housing 1 and forms refrigerating chamber 13 between its cold end surface and housing 1 inwall, and said refrigerating chamber 13 is provided with by 2 air blast of blower fan I and promotes the air inlet 11 of air intake and the air outlet 12 of air-out, and semiconductor chilling plate 31 is sealingly fastened in the housing 1 with what cool and heat ends was separated through seal diaphragm 4; Be positioned at the gauge tap that is provided for controlling semiconductor chilling plate 31 on/offs on the housing 1 and inserts the sense of current; Change the sense of current that inserts semiconductor chilling plate 31 through gauge tap and can realize freezing or heating, control is convenient, can realize subzero 130 ℃ of adjustings to 90 ℃ of temperature ranges above freezing; Temperature regulating range is big; Can satisfy needs of people, free from environmental pollution, simple in structure; Low cost of manufacture; Long service life is positioned at refrigerating chamber 13 and can be provided for air is filtered the damping device 5 of humidification near air outlet 12 1 ends, can keep the humidity through refrigerating chamber 13 hydronic room airs; Avoid because of the too dry human body sense of discomfort that causes of room air; Damping device 5 can be the suction hole cotton that is arranged at refrigerating chamber 13 interior air outlet 12 places and immerses condensed water, through suction hole cotton the filtration of air is moistened and does in order to the increase air humidity, and also can adopt with the condensed water is the negative oxygen ion air wetting machine of humidification water.
In the present embodiment; The cold end surface of semiconductor chilling plate 31 is provided with fin 32 side by side along the wind flow direction; Form a plurality of refrigerating channels between the cold end surface of said fin 32, housing 1 inwall and semiconductor chilling plate 31, also be distributed with air vent 321 on the said fin 32, the low spot that is positioned at refrigerating chamber 13 is provided with the header tank 15 that is used to collect condensed water that communicates with refrigerating chamber 13; Header tank 15 is a hexahedron structure in the present embodiment; Header tank 15 is fixedly connected through its end face and housing 1 bottom surface and is positioned at header tank 15 end faces with housing 1 bottom surface offers the hole that header tank 15 is communicated with refrigerating chamber 13, and is as shown in Figure 4, air vent 321 be positioned on adjacent two fins 32 respectively near with away from 311 settings of semiconductor chilling plate cold junction; The air vent 321 of each fin 32 can be set to a plurality of and evenly arrange along the straight line that is parallel to semiconductor chilling plate cold junction 311 surfaces; Air vent 321 apertures and quantity can unobstructed flow under the promotion of blower fan I 2 be crossed with air and are as the criterion, and after air got into refrigerating chambers 13 by air inlet 11, the zigzag channel that constitutes along gap between each fin 32 and air vent 321 flowed to the discharge of air outlet 12 places; Air and each fin 32 surperficial full contacts; The heat exchange action area is big, and the cold of semiconductor chilling plate 31 or heat utilization ratio are high, and cooling or heating effect is good.
In the present embodiment; Said semiconductor chilling plate 31 is provided with the cold and hot switch 16 that changeable its electric current inserts direction, and cold and hot switch 16 is installed on housing 1, is provided with a pair of movable contact electrode 161 that is connected with power supply and oppositely inserts two pairs of fixed contact electrodes (being respectively 162a among Fig. 5,162b) that semiconductor chilling plate 31 changeable electric currents insert direction each other; Simple in structure; Low cost of manufacture, said power supply are dc source, and civil power is realized through rectifier rectification; Cold and hot switch 16 also can be provided with one and cut off the disconnection shelves 163 that semiconductor chilling plate 31 is connected with power supply with two pairs of arranged side by side being used to of fixed contact electrode, and the on/off of collection semiconductor chilling plate is arranged at one, controls more convenient.
In the present embodiment; Said semiconductor chilling plate 31 integral body are built in the housing 1; Also form heat radiation chamber 14 between the hot end surface of semiconductor chilling plate 31 and housing 1 inwall, semiconductor chilling plate 31 cold and hot two ends isolate the portion temperature that can effectively avoid because of the environment infiltration causes and neutralize, and guarantee making full use of of semiconductor chilling plate 31 cold that produces or heat; Water-cooled or air cooling system 35 also can be set to be come semiconductor chilling plate hot junction 312 generation heats are concentrated cooling; Mode through active heat removal reduces hot-side temperature, makes further to reduce cold junction temperature under the constant situation of dc source electric current, improves its refrigeration.
In the present embodiment; Said cooling assembly 3 also comprises air cooling system 35, and said air cooling system 35 comprises blower fan II 351 at least, and said blower fan II 351 is fixedly set in the heat radiation chamber 14; Heat radiation chamber 14 is provided with by 351 air blast of blower fan II and promotes the air intake passage 352 of air intake and the air-out passage 353 of air-out; Usually the temperature difference of semiconductor chilling plate cool and heat ends can reach between 40 ℃～65 ℃, when semiconductor fan of the present invention is used to freeze, opens the take the initiative mode of heat radiation of air cooling system 35 and reduces hot-side temperature; Under the constant situation of dc source electric current, can further reduce cold junction temperature; And then reaching lower temperature, refrigerating capacity is big, can satisfy needs of people.
In the present embodiment; Said air intake passage 352 is with air-out passage 353 and is communicated with heat radiation chamber 14 to outdoor ventilation duct, and 312 surfaces, said semiconductor chilling plate hot junction are provided with fin 33 along air intake passage 352 to air-out passage 353 directions side by side, a plurality of heat dissipation channels of formation between the hot end surface of said fin 33, housing 1 inwall and semiconductor chilling plate 31; Also be distributed with through hole 331 on the said fin 33; Can increase semiconductor chilling plate hot junction 312 surface areas and with the cross-ventilation area, cooling effectiveness is high, radiating tube and blast pipe are and can extend outdoor long tube structure; Being positioned at the blast pipe tube wall also is provided with and the indoor fresh air inlet that communicates 354; Indoor-outdoor air cools off semiconductor chilling plate hot junction 312 and it is outdoor that in the temperature and back gas is drained into to make full use of, and is unlikely to influence indoor temperature, and is simple in structure; Reasonable in design, low cost of manufacture.
Embodiment three:
Fig. 3 is the inside and outside separate type sketch map of semiconductor fan room of the present invention, and Fig. 4 is a semiconductor chilling plate cold junction fin structure sketch map, and Fig. 5 is semiconductor chilling plate place in circuit and cold and hot on-off circuit figure; As shown in the figure: the semiconductor fan of present embodiment, comprise housing 1, blower fan I 2 and cooling assembly 3, said cooling assembly 3 comprises semiconductor chilling plate 31 at least; Said semiconductor chilling plate 31 is installed in the housing 1 and forms refrigerating chamber 13 between its cold end surface and housing 1 inwall, and said refrigerating chamber 13 is provided with by 2 air blast of blower fan I and promotes the air inlet 11 of air intake and the air outlet 12 of air-out, and semiconductor chilling plate 31 is sealingly fastened in the housing 1 with what cool and heat ends was separated through seal diaphragm 4; Be positioned at the gauge tap that is provided for controlling semiconductor chilling plate 31 on/offs on the housing 1 and inserts the sense of current; Change the sense of current that inserts semiconductor chilling plate 31 through gauge tap and can realize freezing or heating, control is convenient, can realize subzero 130 ℃ of adjustings to 90 ℃ of temperature ranges above freezing; Temperature regulating range is big; Can satisfy needs of people, free from environmental pollution, simple in structure; Low cost of manufacture; Long service life is positioned at refrigerating chamber 13 and can be provided for air is filtered the damping device 5 of humidification near air outlet 12 1 ends, can keep the humidity through refrigerating chamber 13 hydronic room airs; Avoid because of the too dry human body sense of discomfort that causes of room air; Damping device 5 can be the suction hole cotton that is arranged at refrigerating chamber 13 interior air outlet 12 places and immerses condensed water, through suction hole cotton the filtration of air is moistened and does in order to the increase air humidity, and also can adopt with the condensed water is the negative oxygen ion air wetting machine of humidification water.
In the present embodiment; The cold end surface of semiconductor chilling plate 31 is provided with fin 32 side by side along the wind flow direction; Form a plurality of refrigerating channels between the cold end surface of said fin 32, housing 1 inwall and semiconductor chilling plate 31, also be distributed with air vent 321 on the said fin 32, the low spot that is positioned at refrigerating chamber 13 is provided with the header tank 15 that is used to collect condensed water that communicates with refrigerating chamber 13; As shown in Figure 4; Air vent 321 be positioned on adjacent two fins 32 respectively near be provided with away from semiconductor chilling plate cold junction 311, the air vent 321 of each fin 32 can be set to a plurality of and evenly arrange along the straight lines that are parallel to semiconductor chilling plate cold junction 311 surfaces, air vent 321 apertures and quantity can unobstructed flow under the promotion of blower fan I 2 be crossed with air and are as the criterion; After air gets into refrigerating chamber 13 by air inlet 11; Zigzag channel along gap between each fin 32 and air vent 321 formations flows to the discharge of air outlet 12 places, air and each fin 32 surperficial full contacts, and the heat exchange action area is big; The cold of semiconductor chilling plate 31 or heat utilization ratio are high, and cooling or heating effect is good.
In the present embodiment; Said semiconductor chilling plate 31 is provided with the cold and hot switch 16 that changeable its electric current inserts direction, and cold and hot switch 16 is installed on housing 1, is provided with a pair of movable contact electrode 161 that is connected with power supply and oppositely inserts two pairs of fixed contact electrodes (being respectively 162a among Fig. 5,162b) that semiconductor chilling plate 31 changeable electric currents insert direction each other; Simple in structure; Low cost of manufacture, said power supply are dc source, and civil power is realized through rectifier rectification; Cold and hot switch 16 also can be provided with one and cut off the disconnection shelves 163 that semiconductor chilling plate 31 is connected with power supply with two pairs of arranged side by side being used to of fixed contact electrode, and the on/off of collection semiconductor chilling plate is arranged at one, controls more convenient.
In the present embodiment; Said cooling assembly 3 also comprises being connected with 312 heat conduction of semiconductor chilling plate hot junction and extending outdoor heat pipe 36 and is connected in the radiator 37 that heat pipe 36 is positioned at outdoor end with heat conduction, and said radiator 37 outsides are provided with case 6, and the indoor and outdoor separate type can be dwindled the indoor set volume and then reduced floor space; Conserve space; Radiator 37 can be set to radiating fin 32 structures that heat is derived of being used for that heat-conducting plate and heat conduction are connected and fixed on the heat-conducting plate two sides, can make full use of outdoor air free convection effect through radiator 37 and dispel the heat, and guarantees that semiconductor chilling plate hot junction 312 temperature are unlikely too high; Make semiconductor chilling plate cold junction 311 be in lower temperature; Can satisfy the refrigeration needs of people's living and working environment, energy consumption is lower, is beneficial to promote the use of.
Explanation is at last; Above embodiment is only unrestricted in order to technical scheme of the present invention to be described; Although with reference to preferred embodiment the present invention is specified, those of ordinary skill in the art should be appreciated that and can make amendment or be equal to replacement technical scheme of the present invention; And not breaking away from the aim and the scope of technical scheme of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (10)
1. semiconductor fan; It is characterized in that: comprise housing, blower fan I and cooling assembly; Said cooling assembly comprises semiconductor chilling plate at least; Said semiconductor chilling plate is installed in the housing and between its cold end surface and the inner walls and forms refrigerating chamber, and said refrigerating chamber is provided with by the air blast of blower fan I and promotes the air inlet of air intake and the air outlet of air-out.
2. semiconductor fan according to claim 1; It is characterized in that: the cold end surface of semiconductor chilling plate is provided with fin side by side along the wind flow direction; Form a plurality of refrigerating channels between the cold end surface of said fin, inner walls and semiconductor chilling plate; Also be distributed with air vent on the said fin, the low spot that is positioned at refrigerating chamber is provided with the header tank that is used to collect condensed water that communicates with refrigerating chamber; Said blower fan I is fixedly set in the refrigerating chamber.
3. semiconductor fan according to claim 2 is characterized in that: said semiconductor chilling plate is provided with the cold and hot switch that changeable its electric current inserts direction.
4. semiconductor fan according to claim 3 is characterized in that: said semiconductor chilling plate integral body is built in the housing, also forms the heat radiation chamber between the hot end surface of semiconductor chilling plate and the inner walls.
5. semiconductor fan according to claim 4 is characterized in that: said cooling assembly also comprises water-cooling system, and said water-cooling system comprises water pump at least, and the water inlet of said water pump is communicated in header tank, and the delivery port of water pump is communicated in the heat radiation chamber.
6. semiconductor fan according to claim 5; It is characterized in that: said semiconductor chilling plate hot end surface vertically is provided with fin side by side; Form a plurality of heat dissipation channels between the hot end surface of said fin, inner walls and semiconductor chilling plate, also be distributed with through hole on the said fin.
7. semiconductor fan according to claim 6 is characterized in that: said water-cooling system also comprise through water-supply-pipe be communicated in pump outlet be used for water is sprayed on the spraying pack unit of semiconductor chilling plate fin surface and is arranged at the storage tank that is used to collect cooling water that heat radiation chamber low spot communicates with the chamber of dispelling the heat.
8. semiconductor fan according to claim 4; It is characterized in that: said cooling assembly also comprises air cooling system; Said air cooling system comprises the blower fan II at least; Said blower fan II is fixedly set in the heat radiation chamber, and the heat radiation chamber is provided with by the air blast of blower fan II and promotes the air intake passage of air intake and the air-out passage of air-out.
9. semiconductor fan according to claim 8; It is characterized in that: said air intake passage and air-out passage are and are communicated with the heat radiation chamber to outdoor ventilation duct; Said semiconductor chilling plate hot end surface is provided with fin along air intake passage to the air-out channel direction side by side; Form a plurality of heat dissipation channels between the hot end surface of said fin, inner walls and semiconductor chilling plate, also be distributed with through hole on the said fin.
10. semiconductor fan according to claim 3; It is characterized in that: said cooling assembly comprises also and is connected with the heat conduction of semiconductor chilling plate hot junction and extends outdoor heat pipe and heat conduction is connected in the radiator that heat pipe is positioned at outdoor end that said radiator outside is provided with case.
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| CN201210281804.4A CN102818324B (en) | 2012-08-09 | 2012-08-09 | Semiconductor fan |
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| CN201210281804.4A CN102818324B (en) | 2012-08-09 | 2012-08-09 | Semiconductor fan |
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| CN110662924A (en) * | 2017-12-14 | 2020-01-07 | 周兆泰 | Semiconductor refrigerating and heating air conditioner |
| US11841166B2 (en) | 2017-12-14 | 2023-12-12 | Siu Tai Chau | Semiconductor refrigeration and heating air conditioner |
| CN109159637A (en) * | 2018-07-12 | 2019-01-08 | 湖南人文科技学院 | Vehicle-mounted refrigeration semiconductor blower system and its control method, vehicle-mounted refrigeration semiconductor device |
| CN109159637B (en) * | 2018-07-12 | 2020-04-28 | 湖南人文科技学院 | Vehicle-mounted refrigeration semiconductor air blowing system, control method thereof and vehicle-mounted refrigeration semiconductor device |
| CN111463521A (en) * | 2020-04-23 | 2020-07-28 | 云南农业大学 | Heat abstractor for new energy automobile |
| CN111780299A (en) * | 2020-07-13 | 2020-10-16 | 广东海洋大学 | Handheld fan with refrigeration effect |
| CN111964199A (en) * | 2020-09-18 | 2020-11-20 | 王煊博 | Protective clothing with disinfection, deodorization, moisture absorption and refrigeration air purification functions |
| CN112535570A (en) * | 2020-12-02 | 2021-03-23 | 延安大学附属医院 | Medical physical cooling device for pediatrics |
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