CN101382326A - Split type semiconductor air conditioner - Google Patents
Split type semiconductor air conditioner Download PDFInfo
- Publication number
- CN101382326A CN101382326A CNA2008102168406A CN200810216840A CN101382326A CN 101382326 A CN101382326 A CN 101382326A CN A2008102168406 A CNA2008102168406 A CN A2008102168406A CN 200810216840 A CN200810216840 A CN 200810216840A CN 101382326 A CN101382326 A CN 101382326A
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- air conditioner
- split type
- type semiconductor
- radiator
- heat
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Abstract
The invention provides a split type semiconductor air conditioner, comprising an indoor main machine, an outdoor main machine and a heat transfer pipeline which connects the indoor main machine and the outdoor main machine; circulating fluid is arranged in the heat transfer pipeline, the indoor main machine comprises an inner machine case, a semiconductor refrigeration piece which is arranged in the inner machine case, a front heat exchange radiator and a back heat conduction radiator which are connected with two energy ends of the semiconductor refrigeration piece, the front heat exchange radiator is used for regulating the temperature of gas which is flowed through, and the back heat conduction radiator is used for evacuating useless energy on the semiconductor refrigeration piece. The split type semiconductor air conditioner has the advantages that: the semiconductor refrigeration piece is used for replacing a compressed refrigerant for carrying out refrigeration, thereby being safe and reliable and having no environmental pollution; heat which is generated by the semiconductor refrigeration piece is transferred to the outdoor main machine through the heat transfer pipeline for carrying out heat radiation, thereby realizing the good heat radiation and ensuring the working stability of the semiconductor refrigeration piece.
Description
[technical field]
The present invention relates to the temperature control technology field, particularly a kind of split type semiconductor air conditioner.
[background technology]
Split-type air conditioner is divided into indoor units and outdoor unit two parts to air conditioner exactly, the bigger refrigerating fan of noise ratio, compressor and condenser etc. are installed in the outdoor unit, indoor obligato parts such as evaporimeter, control circuit are installed in the indoor units, and this air conditioner that is made of jointly indoor units and outdoor unit is separate type air conditioner.
Existing separate type air conditioner, it utilizes the compressor compresses cold-producing medium to freeze, and loss electric power is bigger, and the normal refrigerant external leakage that takes place pollutes environment in using.
[summary of the invention]
In order to solve existing technical problem, the invention provides a kind of split type semiconductor air conditioner, it uses the semiconductor chilling plate refrigeration, is dispelled the heat by outdoor main frame, thereby realizes good refrigeration, reduces energy waste simultaneously and improves environment-friendly quality.
The present invention solves the technical scheme that existing technical problem adopts, a kind of split type semiconductor air conditioner is provided, it comprises indoor host computer, outdoor main frame and connect the heat transfer of described indoor host computer and described outdoor main frame, establish circulation fluid in this heat transfer, described indoor host computer comprises interior cabinet, be located at the semiconductor chilling plate of described interior cabinet inside, connect described semiconductor chilling plate two energy ends before change temperature radiator and back heat conduction and heat radiation device, change the temperature that temperature radiator is used to regulate gas coming through before described, described back heat conduction and heat radiation device is used to evacuate the useless energy on the described semiconductor chilling plate.
The present invention further improves, and described heat transfer is arranged in described back heat conduction and heat radiation device and described outdoor main frame respectively; This heat transfer is in series with fluid box and hydraulic pump.
The present invention further improves, and has air intake vent and air outlet in described on the cabinet; By described air intake vent to the gas channel of described air outlet through changing the energy surface of temperature radiator before described.
The present invention further improves, and described indoor host computer comprises insulator, the fixing described semiconductor chilling plate of this insulator and separate before change temperature radiator and back heat conduction and heat radiation device.
The present invention further improves, and described indoor host computer is provided with inner control circuit, and this inner control circuit is connected in described semiconductor chilling plate.
The present invention further improves, and a reel fan blade is set in the inboard of air outlet, and this reel fan blade is by a reel motor drives.
The present invention further improves, before described, change temperature radiator below be horizontally set with a water receiving tank, this water receiving tank is outwards drawn a drainpipe.
The present invention further improves, and establishes an indoor temperature inductor and connects described inner control circuit.
The present invention further improves, and is in sinuous being embedded in a radiator of described heat transfer in the described outdoor main frame, over against this radiator one cooling fan is set.
The present invention further improves, and establishes control circuit outside in described outdoor main frame, and this outer control circuit links to each other with described fluid box, described hydraulic pump.
Compared with prior art, the invention has the beneficial effects as follows: use semiconductor chilling plate to replace compressed refrigerant refrigeration, safe and reliable non-environmental-pollution; The heat that semiconductor chilling plate is produced reaches outdoor main frame via heat transfer and dispels the heat, thereby realizes good heat radiating, guarantees the job stability of semiconductor chilling plate.
[description of drawings]
Fig. 1 is the structural representation of the split type semiconductor air conditioner of the present invention;
Fig. 2 is the front view of indoor host computer;
Fig. 3 is the elevational cross-sectional view of indoor host computer;
Fig. 4 is the side view of indoor host computer;
Fig. 5 is the front view of outdoor main frame;
Fig. 6 is the side view of outdoor main frame.
[specific embodiment]
The present invention is further described below in conjunction with description of drawings and the specific embodiment.
Extremely shown in Figure 6 as Fig. 1, a kind of split type semiconductor air conditioner, it comprises indoor host computer 1, outdoor main frame 2 and connects the heat transfer 3 of this indoor host computer 1 and outdoor main frame 2; This indoor host computer 1 is used for the temperature in the conditioning chamber, has circulation fluid in this heat transfer 3, and it is arranged in back heat conduction and heat radiation device 132 respectively and outdoor main frame 2 is used for both energy differences of balance.Indoor host computer 1 comprises interior cabinet 11, the semiconductor chilling plate 12 of cabinet 11 inside in being located at, change temperature radiator 131 and back heat conduction and heat radiation device 132 before 12 liang of energy ends of connection semiconductor chilling plate, this two radiator is the good material of thermal conductivity, as aluminium matter, semiconductor chilling plate 12 its two energy ends of energising back produce heat energy and cold energy respectively, before connecting respectively, changes at this two energy end temperature radiator 131 and back heat conduction and heat radiation device 132, institute changed temperature radiator 131 in the past and back heat conduction and heat radiation device 132 just becomes thermal source or low-temperature receiver, before change the temperature that temperature radiator 131 is used to regulate gas coming through, back heat conduction and heat radiation device 132 is used to evacuate the useless energy on the described semiconductor chilling plate 12.Wherein, and preceding change the available energy that is that temperature radiator 131 links to each other, what link to each other with back heat conduction and heat radiation device 132 is unavailable energy.
For indoor host computer 1, have air intake vent 111, air outlet 112, remote-controlled receiver 114, indicator lamp 115 and temperature display panel 116 within it on the cabinet 11, by air intake vent 111 to the gas channel 113 of air outlet 112 through before changing the energy surface 133 of temperature radiator 131, air-flow comes temperature adjustment through out-of-date temperature according to energy surface like this.In indoor host computer 1, be provided with insulator 14, this insulator 14 fixedly semiconductor chilling plate 12 and separate before change temperature radiator 131 and back heat conduction and heat radiation device 132, so before change temperature radiator 131 and just cannot directly carry out the transmission of energy with back heat conduction and heat radiation device 132, simultaneously, in the gap after this insulator 14 also is arranged between heat conduction and heat radiation device 132 and the mainframe box, the energy after being used for preventing on the heat conduction and heat radiation device 132 passes to room air influences room temperature.Indoor host computer 1 is provided with inner control circuit 15, and this inner control circuit 15 is connected in semiconductor chilling plate 12, and semiconductor chilling plate is a plurality of, according to the control of inner control circuit 15, can regulate the quantity of effective work cooling piece.One reel fan blade 16 is set in the inboard of air outlet 112, and this reel fan blade 16 is driven by a reel motor 17, like this can be so that flowing of air makes indoor air temperature more balanced.preceding change temperature radiator 131 below be horizontally set with a water receiving tank 18, this water receiving tank 18 is outwards drawn a drainpipe 181, thereby makes indoor host computer 1 no ponding.In addition, establish an indoor temperature inductor 19 and connect inner control circuit 15, in time the temperature in the sensing chamber.
For outdoor main frame 2, this heat transfer 3 is in series with fluid box 21, hydraulic pump 22 and pressure regulator 26; Be in heat transfer 3 sinuous being embedded in a radiator 23 in the outdoor main frame 2, over against this radiator 23 cooling fan 24 be set, the outer cabinet 28 of the outdoor main frame 2 in cooling fan 24 outsides is provided with safety guard net.Simultaneously, establish control circuit 25 outside in outdoor main frame 2, this outer control circuit 25 links to each other with fluid box 21, hydraulic pump 22.
The operation principle of the split type semiconductor air conditioner of the present invention is:
When this split type semiconductor air conditioner is used to freeze, semiconductor chilling plate under the control of control circuit, its with preceding change the end refrigeration that temperature radiator links to each other, the end that links to each other with back heat conduction and heat radiation device heats, so before changing temperature radiator just becomes low-temperature receiver, and back heat conduction and heat radiation device becomes thermal source.When reel motor drives reel fan blade rotated, through before changing temperature radiator, cooled air was blown out by following air outlet room air from last air intake vent inlet flow, thereby reaches the decline of indoor temperature.The semiconductor chilling plate of an indoor set has several to tens, make the volume of indoor host computer on the one hand according to different usage spaces, when the indoor temperature that detects when temperature sensor dropped to predetermined temperature on the other hand, inner control circuit can be controlled the active gage number that reduces semiconductor chilling plate.The a large amount of heat energy that absorb on the heat conduction and heat radiation device of this moment back are by the circulation fluid in the heat transfer, and promptly liquid oils or cooling fluid (water) radiator that brings to outdoor main frame carries out air-cooled cooling, patrols again after the cooling and encircles indoor host computer, reaches the good thermal effect that spreads.Work by central circuit plate control complete machine.When air conditioner will be to indoor heating, the electrode of inner control circuit control break semiconductor chilling plate reached automatic constant-temperature to heat up to indoor.
The present invention uses semiconductor chilling plate to replace compressed refrigerant refrigeration, safe and reliable non-environmental-pollution; The heat that semiconductor chilling plate is produced reaches outdoor main frame via heat transfer and dispels the heat, thereby realizes good heat radiating, guarantees the job stability of semiconductor chilling plate.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. split type semiconductor air conditioner, the heat transfer that it comprises indoor host computer, outdoor main frame and connects described indoor host computer and described outdoor main frame, establish circulation fluid in this heat transfer, it is characterized in that: described indoor host computer comprises interior cabinet, be located at described in cabinet inside semiconductor chilling plate, connect described semiconductor chilling plate two energy ends before change temperature radiator and back heat conduction and heat radiation device, change the temperature that temperature radiator is used to regulate gas coming through before described, described back heat conduction and heat radiation device is used to evacuate the useless energy on the described semiconductor chilling plate.
2. split type semiconductor air conditioner according to claim 1 is characterized in that: described heat transfer is arranged in described back heat conduction and heat radiation device and described outdoor main frame respectively; This heat transfer is in series with fluid box and hydraulic pump.
3. split type semiconductor air conditioner according to claim 2 is characterized in that: have air intake vent and air outlet in described on the cabinet; By described air intake vent to the gas channel of described air outlet through changing the energy surface of temperature radiator before described.
4. split type semiconductor air conditioner according to claim 3 is characterized in that: described indoor host computer comprises insulator, the fixing described semiconductor chilling plate of this insulator and separate before change temperature radiator and back heat conduction and heat radiation device.
5. split type semiconductor air conditioner according to claim 4 is characterized in that: described indoor host computer is provided with inner control circuit, and this inner control circuit is connected in described semiconductor chilling plate.
6. according to any described split type semiconductor air conditioner of claim 1 to 5, it is characterized in that: a reel fan blade is set in the inboard of air outlet, and this reel fan blade is by a reel motor drives.
7. according to any described split type semiconductor air conditioner of claim 1 to 5, it is characterized in that: before described, change temperature radiator below be horizontally set with a water receiving tank, this water receiving tank is outwards drawn a drainpipe.
8. split type semiconductor air conditioner according to claim 5 is characterized in that: establish an indoor temperature inductor and connect described inner control circuit.
9. according to any described split type semiconductor air conditioner of claim 1 to 5, it is characterized in that: be in sinuous being embedded in a radiator of described heat transfer in the described outdoor main frame, one cooling fan be set over against this radiator.
10. according to any described split type semiconductor air conditioner of claim 1 to 5, it is characterized in that: establish control circuit outside in described outdoor main frame, this outer control circuit links to each other with described fluid box, described hydraulic pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102168406A CN101382326A (en) | 2008-10-14 | 2008-10-14 | Split type semiconductor air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102168406A CN101382326A (en) | 2008-10-14 | 2008-10-14 | Split type semiconductor air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101382326A true CN101382326A (en) | 2009-03-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008102168406A Pending CN101382326A (en) | 2008-10-14 | 2008-10-14 | Split type semiconductor air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101382326A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102168873A (en) * | 2011-05-25 | 2011-08-31 | 刘亮 | Novel semiconductor water cooled air conditioner |
| CN102818324A (en) * | 2012-08-09 | 2012-12-12 | 邹兵 | Semiconductor fan |
| CN105987464A (en) * | 2015-02-05 | 2016-10-05 | 青岛海尔智能技术研发有限公司 | Air conditioner, preparation method thereof and range hood using air conditioner |
| CN105987467A (en) * | 2015-02-05 | 2016-10-05 | 青岛海尔智能技术研发有限公司 | Air conditioner installation method |
-
2008
- 2008-10-14 CN CNA2008102168406A patent/CN101382326A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102168873A (en) * | 2011-05-25 | 2011-08-31 | 刘亮 | Novel semiconductor water cooled air conditioner |
| CN102818324A (en) * | 2012-08-09 | 2012-12-12 | 邹兵 | Semiconductor fan |
| CN102818324B (en) * | 2012-08-09 | 2015-01-28 | 邹兵 | Semiconductor fan |
| CN105987464A (en) * | 2015-02-05 | 2016-10-05 | 青岛海尔智能技术研发有限公司 | Air conditioner, preparation method thereof and range hood using air conditioner |
| CN105987467A (en) * | 2015-02-05 | 2016-10-05 | 青岛海尔智能技术研发有限公司 | Air conditioner installation method |
| CN105987467B (en) * | 2015-02-05 | 2020-10-02 | 青岛海尔智能技术研发有限公司 | Air conditioner mounting method |
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Open date: 20090311 |