CN105987467B

CN105987467B - Air conditioner mounting method

Info

Publication number: CN105987467B
Application number: CN201510060114.XA
Authority: CN
Inventors: 高希成; 王定远; 刘杰
Original assignee: Qingdao Haier Smart Technology R&D Co Ltd
Current assignee: Qingdao Haier Smart Technology R&D Co Ltd
Priority date: 2015-02-05
Filing date: 2015-02-05
Publication date: 2020-10-02
Anticipated expiration: 2035-02-05
Also published as: CN105987467A

Abstract

The invention discloses an installation method of an air conditioner, the air conditioner comprises a first heat exchange system, a second heat exchange system and a semiconductor refrigeration sheet, the semiconductor refrigerating sheet comprises a first working surface and a second working surface, the first heat exchange system exchanges heat with the first working surface of the semiconductor refrigerating sheet, the second heat exchange system exchanges heat with the second working surface of the semiconductor chilling plate, the air conditioner comprises a first module and a second module, the first heat exchange system and the semiconductor refrigeration piece are positioned in the first module, the first heat exchange system comprises first fins, the second heat exchange system comprises an end A and an end B which are connected by a liquid cooling pipe, the end A is positioned at the first module, the end B is located on the second module and comprises a second fin, and the installation method comprises the step of integrating the first module into the front of the range hood. The energy utilization efficiency is improved by physically isolating the two heat exchange systems.

Description

Air conditioner mounting method

Technical Field

The invention relates to an air conditioner installation method.

Background

Cooking at the kitchen range is a hard household work, and particularly in summer, the working environment in a kitchen is very harsh due to the heat generated by the kitchen range and the original hot weather.

In order to solve the problem of overhigh temperature of a kitchen, a fan or an air conditioner is installed in the kitchen, however, the fan has a general blowing refrigeration effect, normal work of the gas stove can be influenced, and potential safety hazards also exist. Due to the special oil fume environment of a kitchen, after a common fan is used for a period of time, a large amount of putty is attached to the fan, the fan is difficult to clean, and the environment of the kitchen is also polluted.

When the air conditioning equipment is installed in a kitchen, on one hand, the cost problem exists, on the other hand, the problem that the cleaning is difficult also exists, and after oil smoke is attached to the surface of an air conditioning heat exchanger, the refrigerating effect is reduced.

Disclosure of Invention

In order to solve the problems of high cost, difficult cleaning, low temperature adjusting effect and the like of using an air conditioner in a kitchen in the prior art, the invention provides an air conditioner installation method, and the air conditioner is installed and applied to a smoke exhaust ventilator.

As an aspect of the present invention, an air conditioner installation method is provided, the air conditioner including a first heat exchange system, a second heat exchange system, and semiconductor chilling plates, the semiconductor chilling plates including a first working surface and a second working surface, the first heat exchange system exchanging heat with the first working surface of the semiconductor chilling plate, the second heat exchange system exchanging heat with the second working surface of the semiconductor chilling plate, the air conditioner including a first module and a second module, the first heat exchange system and the semiconductor chilling plates being located in the first module, the first heat exchange system including first fins, the second heat exchange system including an a end and a B end connected by a liquid cooling pipe, the a end being located in the first module, the B end being located in the second module, the B end including second fins, the installation method including, integrating the first module to a front of a range hood.

The first module is integrated in front of the range hood, namely, the first module is integrated in front of the range hood.

The method may further comprise the step of integrating the first module into front of a range hood horizontal housing.

Specifically, the integration of the first module into the front of the horizontal housing of the range hood may be performed by bonding the first module housing to the front of the horizontal housing of the range hood, or by providing an insert between the front of the horizontal housing of the range hood and the first module housing, where the first module housing and the horizontal housing of the range hood are respectively located at the upper and lower sides of the insert, or by providing support rods on the two sides of the first module housing, and the support rods are fixed to the front of the horizontal housing of the range hood.

The method may further comprise the step of integrating the first module into front of a range hood main flue housing.

Specifically, the integration of the first module in front of the main flue housing of the range hood may be performed by adhering the first module housing in front of the main flue housing of the range hood, or by fixing the first module to the front of the main flue housing of the range hood using an elastic ring.

More specifically, the first module housing can be integrated forward of a range hood main flue housing at a distance n from the range hood horizontal housing, where n is greater than zero.

The method may further comprise the step of integrating the second module into a range hood horizontal housing.

Specifically, the second module may be integrated into the horizontal housing of the range hood, that is, the second module may be integrated into the left or right part of the horizontal housing of the range hood.

Specifically, the integration of the second module into the horizontal housing of the range hood may be performed by bonding the second module housing to the horizontal housing of the range hood, or by providing an insert between the horizontal housing of the range hood and the second module housing, where the second module housing and the horizontal housing of the range hood are respectively located at the upper and lower sides of the insert, or by providing support rods at both sides of the second module housing, and the support rods are fixed to the horizontal housing of the range hood.

The method may further comprise the step of integrating the second module into a range hood main flue housing.

Specifically, the second module may be integrated into the range hood main flue housing by integrating the second module into the range hood main flue housing on the left side or the right side.

Specifically, the integration of the second module into the main flue housing of the range hood may be performed by adhering the second module housing to the main flue housing of the range hood, or by fixing the second module to the main flue housing of the range hood using an elastic ring.

More specifically, the second module can be integrated into a range hood main flue housing at a distance n from the range hood horizontal housing, where n is greater than zero.

Specifically, the first module is surrounded by a first module shell to form a first module hollow cavity, and the first heat exchange system, the semiconductor refrigeration sheet and the A end of the second heat exchange system are located in the first module hollow cavity. The first heat exchange system comprises a first fin, a first fan, a first module air inlet and a first module air outlet.

And the second module is a second module hollow cavity surrounded by a second module shell, and the B end of the second heat exchange system is positioned in the second module hollow cavity. The second heat exchange system comprises a second fin, a second fan, a water pump, a liquid cooling pipe, a second module air inlet and a second module air outlet.

As one specific implementation manner, the cavity in the first module may be provided with a support body, the second working surface of the semiconductor chilling plate is embedded in the support body, the first module is provided with a first module liquid cooling pipe hole, a first module air inlet and a first module air outlet, and the second module is provided with a second module liquid cooling pipe hole, a second module air inlet and a second module air outlet.

Specifically, may be, the supporter is the bad conductor of heat, the supporter is equipped with the liquid cooling pipe hole, the liquid cooling pipe runs through the liquid cooling pipe hole.

The first module air outlet is located on the front side face of the first module shell, the first module air inlet is located on the rear side face, the left side face, the right side face, the top face or the bottom face of the first module shell, the second module air inlet is located on the front side face, the rear side face, the left side face, the right side face, the top face or the bottom face of the second module shell, and the second module air outlet is located on the top face, the bottom face, the front side face, the rear side face, the left side face or the right side face of the second module shell. Preferably, the first fan of the first heat exchange system is disposed between the first module air outlet and the first fin.

As one of specific implementation manners, the cavity may be provided with a heat preservation chamber in the first module, the semiconductor refrigeration sheet participates in forming the wall surface of the heat preservation chamber, the first fin is located in the heat preservation chamber, the first module is provided with a first module liquid cooling tube hole, a first module air inlet, a first module air outlet, a heat preservation chamber air inlet and a heat preservation chamber air outlet, and the second module is provided with a second module liquid cooling tube hole, a second module air inlet and a second module air outlet.

Specifically, the first working surface of the semiconductor refrigeration piece participates in forming the bottom surface of the heat preservation cavity, the first heat exchange system comprises a first fin, a first fan, a first module air inlet, a first module air outlet, a first air outlet duct, a heat preservation cavity air inlet and a heat preservation cavity air outlet, and the second heat exchange system comprises a second fin, a second fan, a water pump, a liquid cooling pipe, a second module air inlet and a second module air outlet.

The first module air outlet is located on the front side face of the first module shell, the first module air inlet is located on the rear side face, the left side face, the right side face, the top face or the bottom face of the first module shell, the first module heat preservation cavity air inlet is located on the rear side face, the left side face, the right side face, the top face or the bottom face of the heat preservation cavity, the first module heat preservation cavity air outlet is located on the left side face, the right side face, the top face, the bottom face or the front side face of the heat preservation cavity, the second module air inlet is located on the front side face, the rear side face, the left side face, the right side face, the top face or the bottom face of the second module shell, and the second module air outlet is located on the top face, the bottom face, the. The first heat exchange system heat preservation cavity air inlet corresponds to the first module air inlet, the heat preservation cavity air outlet corresponds to the first module air outlet, and the first fan is arranged between the heat preservation cavity air outlet and the first module air outlet.

As another aspect of the present invention, an air conditioner is related to, the air conditioner includes a first heat exchange system, a second heat exchange system, and semiconductor chilling plates, the semiconductor chilling plates include a first working surface and a second working surface, the first heat exchange system exchanges heat with the first working surface of the semiconductor chilling plate, the second heat exchange system exchanges heat with the second working surface of the semiconductor chilling plate, the air conditioner includes a first module and a second module, the first heat exchange system and the semiconductor chilling plates are located in the first module, and the first heat exchange system includes first fins; the second heat exchange system comprises an end A and an end B which are connected through a liquid cooling pipe, the end A is located in the first module, the end B is located in the second module, and the end B comprises second fins.

The first module is a first module hollow cavity surrounded by a first module shell, and the A ends of the first heat exchange system, the semiconductor refrigeration sheet and the second heat exchange system are positioned in the first module hollow cavity. The first heat exchange system comprises a first fin, a first fan, a first module air inlet and a first module air outlet.

And the second module is a second module hollow cavity surrounded by a second module shell, and the A end of the second heat exchange system is positioned in the second module hollow cavity. The second heat exchange system comprises a second fin, a second fan, a water pump, a liquid cooling pipe, a second module air inlet and a second module air outlet.

The first working surface of the semiconductor chilling plate may be supplemented by a first heat conducting substrate, the first working surface being in thermal contact with the first heat conducting substrate. The first heat-conducting silicone grease can be used for assisting between the first working surface of the semiconductor refrigeration piece and the first heat-conducting substrate.

The second working surface of the semiconductor chilling plate may be supplemented by a second heat conducting substrate, the second working surface being in thermal contact with the second heat conducting substrate. And a second heat-conducting silicone grease can be assisted between the second working surface of the semiconductor chilling plate and the second heat-conducting substrate.

The second heat conducting substrate can be a liquid cooling plate, and is provided with a second heat conducting substrate liquid cooling pipe interface, and the liquid cooling pipe is connected with the second heat conducting substrate liquid cooling pipe interface.

The second heat exchange system may further comprise a metal tube.

Or the second heat exchange system can also comprise heat dissipation microtubes, and the heat dissipation microtubes comprise parallel flow pipes and collecting pipes.

The metal pipe or the radiating micro-pipe is provided with a second module liquid cooling pipe interface, and the liquid cooling pipe is connected with the second module liquid cooling pipe interface.

The second heat conducting substrate can be a liquid cooling plate, and is provided with a second heat conducting substrate liquid cooling pipe interface, and the liquid cooling pipe is connected with the second heat conducting substrate liquid cooling pipe interface. Further, the liquid cooling pipe is connected with the liquid cooling pipe interface of the second module.

As a specific implementation manner, the first module air outlet may be provided with an air deflector or an air deflector grid. Preferably, the cavity first module air inlet, the cavity second module air inlet and the cavity second module air outlet may be provided with air deflectors or air guiding grids.

As a third aspect of the present invention, there is provided a hood including any one of the air conditioners described above.

As a fourth aspect of the present invention, a method for manufacturing an air conditioner is provided, the air conditioner includes a first heat exchange system, a second heat exchange system, and semiconductor chilling plates, the semiconductor chilling plates include a first working surface and a second working surface, the first heat exchange system performs heat exchange with the first working surface of the semiconductor chilling plate, the second heat exchange system performs heat exchange with the second working surface of the semiconductor chilling plate, the air conditioner includes a first module and a second module, the first heat exchange system includes a first fin, the second heat exchange system includes an a-side and a B-side, the B-side includes a second fin, the method includes limiting the a-sides of the first heat exchange system, the semiconductor chilling plates, and the second heat exchange system in the first module, limiting the B-side of the second heat exchange system in the second module, and connecting the end A and the end B of the second heat exchange system by a liquid cooling pipe.

The method can further comprise the steps of enclosing a first module hollow cavity by a first module shell, limiting the A ends of the first heat exchange system, the semiconductor chilling plates and the second heat exchange system in the first module hollow cavity, and enabling the first fins, the first fan, the first module air inlet and the first module air outlet to form the first heat exchange system.

And a second module hollow cavity is formed by surrounding a second module shell, the B end of the second heat exchange system is limited in the second module hollow cavity, and a second fin, a second fan, a water pump, a liquid cooling pipe, a second module air inlet and a second module air outlet form the second heat exchange system.

As one specific implementation manner, the method may further include the step of providing a supporting body in the cavity of the first module, embedding the second working surface of the semiconductor chilling plate in the supporting body, providing a first module liquid cooling pipe hole, a first module air inlet and a first module air outlet in the first module, and providing a second module liquid cooling pipe hole, a second module air inlet and a second module air outlet in the second module, and the method may further include the step of providing a liquid cooling pipe hole in the supporting body so that the liquid cooling pipe penetrates through the liquid cooling pipe hole.

The manufacturing method may specifically include the steps of forming a first module air outlet in the front side surface of the first module housing, forming a first module air inlet in the rear side surface, the left side surface, the right side surface, the top surface or the bottom surface of the first module housing, forming a second module air inlet in the front side surface, the rear side surface, the left side surface, the right side surface, the top surface or the bottom surface of the second module housing, and forming a second module air outlet in the top surface, the bottom surface, the front side surface, the rear side surface, the left side surface or the right side surface of the second module housing. The method can further comprise the step of arranging a first fan of the first heat exchange system between the first module air outlet and the first fin.

The preparation method specifically comprises the steps of arranging a first heat-conducting substrate on the first working surface of the semiconductor chilling plate, and enabling the first fin to be in thermal contact with the first heat-conducting substrate. The method can further comprise the step of assisting the first heat-conducting silicone grease between the first working surface of the semiconductor chilling plate and the first heat-conducting substrate.

The preparation method may specifically include the steps of providing a second heat conducting substrate on a second working surface of the semiconductor chilling plate, and bringing the second fin into thermal contact with the second heat conducting substrate. The step of assisting the second heat-conducting silicone grease between the second working surface of the semiconductor chilling plate and the second heat-conducting substrate can also be included.

The preparation method specifically comprises the steps of arranging a second heat conduction substrate liquid cooling pipe interface on the second heat conduction substrate and connecting the liquid cooling pipe with the second heat conduction substrate liquid cooling pipe interface.

The manufacturing method may specifically include connecting a metal pipe to an end of the liquid cooling pipe, and thermally contacting the metal pipe with the second fin.

Or the tail end of the liquid cooling pipe is connected with a radiating micro-pipe, and the radiating micro-pipe is in thermal contact with the second fin, wherein the radiating micro-pipe is composed of a parallel flow pipe and a current collecting pipe.

The method can also comprise the step of arranging a second module liquid cooling pipe interface on the metal pipe or the radiating micro-pipe and connecting the liquid cooling pipe with the second module liquid cooling pipe interface.

As one of the specific embodiments, the method may further include the step of forming a heat preservation chamber in the cavity of the first module, and confining the first fin in the heat preservation chamber by the semiconductor chilling plate, and may further include the step of forming a first module liquid cooling tube hole, a first module air inlet, a first module air outlet, a heat preservation chamber air inlet, and a heat preservation chamber air outlet in the first module, and forming a second module liquid cooling tube hole, a second module air inlet, and a second module air outlet in the second module, and may further include the step of forming a bottom surface of the heat preservation chamber by the first working surface of the semiconductor chilling plate, so that the first fin, the first fan, the first module air inlet, the first module air outlet, the first air outlet duct, the heat preservation chamber air inlet, and the heat preservation chamber air outlet constitute the first heat exchange system, and enabling the second fin, the second fan, the water pump, the liquid cooling pipe, the second module air inlet and the second module air outlet to form the second heat exchange system.

The manufacturing method may specifically include the steps of forming a first module air outlet in the front side surface of the first module housing, forming a first module air inlet in the rear side surface, the left side surface, the right side surface, the top surface or the bottom surface of the first module housing, forming a first module heat-preservation chamber air inlet in the rear side surface, the left side surface, the right side surface, the top surface, the bottom surface or the bottom surface of the heat-preservation chamber, forming a first module heat-preservation chamber air outlet in the left side surface, the right side surface, the top surface or the front side surface of the heat-preservation chamber, forming a second module air inlet in the front side surface, the rear side surface, the left side surface, the right side surface, the top surface or the bottom surface of the second module housing, and forming a second module air outlet in the top surface, the bottom surface, the front side surface, the rear side surface. The method can further comprise the step of disposing the first fan between the insulating cavity outlet and the first module outlet.

The preparation method specifically comprises the steps of arranging a second heat conduction substrate liquid cooling pipe interface on the second heat conduction substrate and connecting the liquid cooling pipe with the second heat conduction substrate liquid cooling pipe interface. The method may further include the step of interfacing the liquid cooled tube with a second module liquid cooled tube.

As a specific implementation manner, the method further includes a step of providing an air deflector or an air guiding grid at the first module air outlet, and further may include a step of providing an air deflector or an air guiding grid at each of the first module air inlet, the second module air inlet, and the second module air outlet.

The embodiment of the invention at least realizes the following beneficial effects:

1. the air conditioner provided by the invention has the advantages of simple and compact structural design, simple manufacture and low cost.

2. The air conditioner is divided into the first module and the second module, the first module is integrated in front of the range hood, and the second module can be integrated at any position of the range hood, so that the installation volume in front of the range hood is reduced, and the air conditioner can be suitable for range hoods of different types.

3. The module shell provided with the air conditioner module is arranged on the horizontal shell of the smoke exhaust ventilator shell or the main flue shell, and does not occupy the volume of the inner cavity of the smoke exhaust ventilator shell, so that the internal structure of the smoke exhaust ventilator shell is not influenced.

4. The two heat exchange systems are physically isolated, so that the utilization efficiency of energy is effectively improved.

Drawings

FIG. 1 is a schematic view of an overall structure of an air conditioner according to the present invention;

FIG. 2 is a top view of a first module according to one embodiment of the present invention;

FIG. 3 is a side view of a first module according to one embodiment of the present invention;

FIG. 4 is a side view of a first form of a second module of the present invention;

FIG. 5 is a top plan view of a first form of the second module of the present invention;

FIG. 6 is a side view of a second module according to the invention in a second form;

FIG. 7 is a top plan view of a second form of the second module of the present invention;

FIG. 8 is a schematic structural view of a second module housing according to the present invention;

FIG. 9 is a top view of the first module according to a second embodiment of the present invention;

FIG. 10 is a side view of a first module according to a second embodiment of the present invention;

FIG. 11 is a schematic view of a first installation form of the air conditioner of the present invention;

FIG. 12 is a schematic view of a second installation form of the air conditioner of the present invention;

FIG. 13 is a schematic view of a third installation form of the air conditioner of the present invention;

fig. 14 is a schematic view showing a fourth installation form of the air conditioner of the present invention.

Detailed Description

The present invention is further described with reference to the following drawings and specific examples so that those skilled in the art can better understand the present invention and can practice the present invention, but the examples are not intended to limit the present invention.

The embodiment of the invention provides an air conditioner and a range hood externally integrated with the air conditioner. The air conditioner is based on the semiconductor refrigeration piece, is matched with the fin for heat exchange, and blows out cold or heat generated by electrifying the semiconductor refrigeration piece through the fan. Can generate a local cold environment or hot environment for users, and meets the requirement of comfort of people. The air conditioner mainly comprises a first module and a second module, wherein a first heat exchange system and a second heat exchange system A end are mainly installed in the first module, a second heat exchange system B end is mainly installed in the second module, and the two modules are connected through a liquid cooling pipe. The semiconductor refrigerating sheet is provided with two working surfaces, the upper end is a first working surface, the lower end is a second working surface, and when the first working surface is a hot end, the second working surface is a cold end; when the first working surface is a cold end, the second working surface is a hot end. The air conditioner may be integrated with the exterior of the range hood, and the first module may be integrated into the upper end of the horizontal portion of the range hood housing or into the front of the range hood main flue housing. The air conditioner can work independently and can also be linked with the smoke exhaust ventilator intelligently.

The air conditioner provided by the invention has the outstanding characteristics that the first heat exchange system and the second heat exchange system realize partial or even complete physical isolation, the bidirectional flow of heat energy and cold energy generated by the semiconductor refrigeration sheet can be effectively prevented, the utilization efficiency of energy is improved, and the electric energy consumption is reduced.

In one embodiment, the air conditioner operates in both a cooling mode and a warming mode: when the cooling mode is pressed, the upper end of the semiconductor refrigerating sheet is a cold end, the lower end of the semiconductor refrigerating sheet is a hot end, and cold air is discharged from an air outlet in front of the first module; when the warm mode is pressed, the upper end of the semiconductor refrigerating sheet is a hot end, the lower end of the semiconductor refrigerating sheet is a cold end, and hot air is discharged from an air outlet right in front of the first module. The cooling mode will be described below as an example.

The invention provides an air conditioner, which comprises a first heat exchange system 122, a second heat exchange system 123 and semiconductor refrigeration sheets 109, wherein the semiconductor refrigeration sheets 109 comprise a first working surface and a second working surface, the first heat exchange system 122 exchanges heat with the first working surface of the semiconductor refrigeration sheets 109, the second heat exchange system 123 exchanges heat with the second working surface of the semiconductor refrigeration sheets 109, the air conditioner comprises a first module 127 and a second module 128, the first heat exchange system 122 and the semiconductor refrigeration sheets 109 are positioned in the first module 127, and the first heat exchange system 122 comprises first fins 112; the second heat exchange system 123 comprises an a-end 138 and a B-end 139 connected by a liquid cooling tube 129, the a-end 138 is located in the first module 127, the B-end 139 is located in the second module 128, and the B-end 139 comprises the second fin 121.

The first module 127 is enclosed by a first module housing 100 to form a first module hollow cavity 110, the first heat exchange system 122, the semiconductor chilling plates 109 and an a end 138 of the second heat exchange system 123 are located in the first module hollow cavity 110, and specifically, the first heat exchange system 122 includes a first fin 112, a first fan 106, a first module air inlet 102 and a first module air outlet 101.

The second module 128 is enclosed by the second module housing 126 to form a second module hollow cavity 115, the B end 139 of the second heat exchange system 123 is located in the second module hollow cavity 115, and specifically, the second heat exchange system 123 includes a second fin 121, a second fan 114, a water pump 137, a liquid cooling pipe 129, a second module air inlet 124, and a second module air outlet 125.

As embodiment 1, referring to fig. 1 to 8, the first module hollow cavity 110 may be provided with a supporting body 116, the second working surface of the semiconductor chilling plate 109 is embedded in the supporting body 116, the first module 127 is provided with a first module liquid cooling pipe hole 134, a first module air inlet 102 and a first module air outlet 101, and the second module 128 is provided with a second module liquid cooling pipe hole 133, a second module air inlet 124 and a second module air outlet 125.

Specifically, the supporting body 116 may be a hot poor conductor, the supporting body 116 may be provided with a liquid cooling pipe hole, and the liquid cooling pipe 129 may penetrate through the liquid cooling pipe hole.

The first module air outlet 101 is located on a front side surface of the first module housing 100, the first module air inlet 102 is located on a rear side surface, a left side surface, a right side surface, a top surface or a bottom surface of the first module housing 100, the second module air inlet 124 is located on a front side surface, a rear side surface, a left side surface, a right side surface, a top surface or a bottom surface of the second module housing 126, and the second module air outlet 125 is located on a top surface, a bottom surface, a front side surface, a rear side surface, a left side surface or a right side surface of the second module housing 126. Preferably, the first fan 106 of the first heat exchange system 122 is disposed between the first module air outlet 101 and the first fin 112.

The first working surface of the semiconductor chilling plate 109 may be supplemented by a first heat conducting substrate 107, the first working surface being in thermal contact with the first heat conducting substrate 107. The first heat-conducting silicone grease 113 may be added between the first working surface of the semiconductor chilling plate 109 and the first heat-conducting substrate 107.

The second working surface of the semiconductor chilling plate 109 may be supplemented by a second heat conducting substrate 108, the second working surface being in thermal contact with the second heat conducting substrate 108. The second heat-conducting silicone grease 120 may be assisted between the second working surface of the semiconductor chilling plate 109 and the second heat-conducting substrate 108.

Alternatively, the second heat conducting substrate 108 is a liquid cooling plate, and is provided with a second heat conducting substrate liquid cooling pipe interface 135, and the liquid cooling pipe 129 is connected to the second heat conducting substrate liquid cooling pipe interface 135.

The second heat exchange system 123 may further include a metal tube 117.

Alternatively, the second heat exchange system 123 may further include heat sink microtubes 131, and the heat sink microtubes 131 include parallel flow tubes 130 and collector tubes 132.

The metal tube 117 or the heat dissipation micro tube 131 is provided with a second module liquid cooling tube interface 136, and the liquid cooling tube 129 is connected with the second module liquid cooling tube interface 136.

As embodiment 2, referring to fig. 1, 4 to 10, a heat preservation chamber 103 may be disposed in the first module hollow cavity 110, the semiconductor chilling plate 109 participates in forming a wall surface of the heat preservation chamber 103, the first fin 112 is located in the heat preservation chamber 103, the first module 127 is disposed with a first module liquid cooling pipe hole 134, a first module air inlet 102, a first module air outlet 101, a heat preservation chamber air inlet 104, and a heat preservation chamber air outlet 105, and the second module 128 is disposed with a second module liquid cooling pipe hole 133, a second module air inlet 124, and a second module air outlet 125.

Specifically, the first working surface of the semiconductor chilling plate 109 participates in forming the bottom surface of the heat preservation cavity 103, the first heat exchanging system 122 includes a first fin 112, a first fan 106, a first module air inlet 102, a first module air outlet 101, a first air outlet duct 111, a heat preservation cavity air inlet 104 and a heat preservation cavity air outlet 105, and the second heat exchanging system 123 includes a second fin 121, a second fan 114, a water pump 137, a liquid cooling pipe 129, a second module air inlet 124 and a second module air outlet 125.

The first module air outlet 101 is located on the front side of the first module housing 100, the first module air inlet 102 is located on the rear side, left side, right side, top surface or bottom surface of the first module housing 100, the first module heat-preservation chamber air inlet 104 is located on the rear side, left side, right side, top surface or bottom surface of the heat-preservation chamber 103, the first module heat-preservation chamber air outlet 105 is located on the left side, right side, top surface, bottom surface or front side surface of the heat-preservation chamber 103, the second module air inlet 124 is located on the front side, rear side, left side, right side, top surface or bottom surface of the second module housing 126, and the second module air outlet 125 is located on the top surface, bottom surface, front side, rear side, left side or right side surface of the second module housing 126. The first heat exchange system 122 may further include a heat preservation chamber air inlet 104 corresponding to the first module air inlet 102, a heat preservation chamber air outlet 105 corresponding to the first module air outlet 101, and the first fan 106 disposed between the heat preservation chamber air outlet 105 and the first module air outlet 101.

Alternatively, the second heat conducting substrate 108 is a liquid cooling plate, and is provided with a second heat conducting substrate liquid cooling pipe interface 135, and the liquid cooling pipe 129 is connected to the second heat conducting substrate liquid cooling pipe interface 135. Further, the liquid cooling tube 129 is connected to the second module liquid cooling tube interface 136.

In the air conditioner provided in the above embodiment, the first module air outlet 101 may be provided with an air deflector or an air guiding grid. Preferably, the first module air inlet 102, the second module air inlet 124 and the second module air outlet 125 may be provided with air deflectors or air guiding grids.

In the air conditioner provided in the above embodiment, the liquid cooling pipe 129 may be a water pipe.

In one embodiment, as shown in fig. 8, two liquid cooling pipe holes are formed right in front of the second module housing 126, one air inlet is formed at each of the left and right sides, and an air outlet is formed at the upper side.

The invention also provides a range hood, which comprises the air conditioner provided by any one of the embodiments 1 and 2.

The invention also provides a preparation method of the air conditioner, the air conditioner comprises a first heat exchange system 122, a second heat exchange system 123 and semiconductor refrigeration sheets 109, the semiconductor refrigeration sheets 109 comprise a first working surface and a second working surface, the first heat exchange system 122 is in heat exchange with the first working surface of the semiconductor refrigeration sheets 109, the second heat exchange system 123 is in heat exchange with the second working surface of the semiconductor refrigeration sheets 109, the air conditioner comprises a first module 127 and a second module 128, the first heat exchange system 122 comprises first fins 112, the second heat exchange system comprises an A end 138 and a B end 139, the B end 139 comprises second fins 121, the method comprises the steps of limiting the A ends 138 of the first heat exchange system 122, the semiconductor refrigeration sheets 109 and the second heat exchange system 123 in the first module 127, the step of constraining the B-side 139 of the second heat exchange system 123 to the second module 128 and connecting the a-side 138 and the B-side 139 of the second heat exchange system 123 by liquid cooled tubes 129.

The method may further include the steps of enclosing a first module hollow 110 by the first module housing 100, and limiting the first heat exchanging system 122, the semiconductor chilling plates 109 and the a-side 138 of the second heat exchanging system 123 within the first module hollow 110, such that the first fins 112, the first fan 106, the first module air inlet 102 and the first module air outlet 101 form the first heat exchanging system 122.

And a second module hollow cavity 115 is defined by the second module housing 126, the B end 139 of the second heat exchange system 123 is limited in the second module hollow cavity 115, and the second fin 121, the second fan 114, the water pump 137, the liquid cooling pipe 129, the second module air inlet 124 and the second module air outlet 125 form the second heat exchange system 123.

As embodiment 3, the method may further include the step of providing a supporting body 116 in the first module cavity 110 and embedding the second working surface of the semiconductor chilling plate 109 in the supporting body 116, and may further include the step of providing a first module liquid cooling pipe hole 134, a first module air inlet 102 and a first module air outlet 101 in the first module 127, and providing a second module liquid cooling pipe hole 133, a second module air inlet 124 and a second module air outlet 125 in the second module 128.

The above-mentioned preparation method may specifically include the step of providing a liquid cooling pipe hole in the support body 116, so that the liquid cooling pipe 129 penetrates through the liquid cooling pipe hole.

The preparation method may specifically include forming a first module air outlet 101 on a front side surface of the first module housing 100, forming a first module air inlet 102 on a rear side surface, a left side surface, a right side surface, a top surface, or a bottom surface of the first module housing 100, forming a second module air inlet 124 on a front side surface, a rear side surface, a left side surface, a right side surface, a top surface, or a bottom surface of the second module housing 126, forming a second module air outlet 125 on a top surface, a bottom surface, a front side surface, a rear side surface, a left side surface, or a right side surface of the second module housing 126, and further including disposing the first fan 106 of the first heat exchange system 122 between the first module air outlet 101 and the first fin 112.

The preparation method may specifically include that a first heat conducting substrate 107 is attached to the first working surface of the semiconductor chilling plate 109, and the first fin 112 is in thermal contact with the first heat conducting substrate 107. The method can further comprise the step of supplementing a first heat-conducting silicone grease 113 between the first working surface of the semiconductor chilling plate 109 and the first heat-conducting substrate 107.

The preparation method may specifically include attaching a second heat conducting substrate 108 to a second working surface of the semiconductor chilling plate 109, and bringing the second fin 121 into thermal contact with the second heat conducting substrate 108. And a second heat-conducting silicone grease 120 is supplemented between the second working surface of the semiconductor chilling plate 109 and the second heat-conducting substrate 108.

The above-mentioned preparation method may specifically include that the second heat conducting substrate 108 is provided with a second heat conducting substrate liquid cooling pipe interface 135, and the liquid cooling pipe 129 is connected to the second heat conducting substrate liquid cooling pipe interface 135.

The manufacturing method may specifically include connecting the metal tube 117 to the end of the liquid cooling tube 129, and thermally contacting the metal tube 117 with the second fin 121.

Alternatively, the end of the liquid cooling pipe 129 is connected with a heat sink microtube 131, and the heat sink microtube 131 is in thermal contact with the second fin 121, wherein the heat sink microtube 131 is composed of a parallel flow pipe 130 and a collecting pipe 132.

The method can further comprise the steps of forming a second module liquid cooling pipe interface 136 in the metal pipe 117 or the heat sink micro pipe 131, and connecting the liquid cooling pipe 129 with the second module liquid cooling pipe interface 136.

As embodiment 4, the method may further include the step of providing a heat preservation chamber 103 in the cavity 110 of the first module, forming a wall surface of the heat preservation chamber 103 by the semiconductor chilling plate 109, and limiting the first fin 112 in the heat preservation chamber 103, and may further include the step of providing a first module liquid cooling pipe hole 134, a first module air inlet 102, a first module air outlet 101, a heat preservation chamber air inlet 104, and a heat preservation chamber air outlet 105 in the first module 127, and providing a second module liquid cooling pipe hole 133, a second module air inlet 124, and a second module air outlet 125 in the second module 128.

The preparation method may specifically include the step of forming the bottom surface of the heat preservation cavity 103 by the first working surface of the semiconductor chilling plate 109, so that the first fin 112, the first fan 106, the first module air inlet 102, the first module air outlet 101, the first air outlet duct 111, the heat preservation cavity air inlet 104, and the heat preservation cavity air outlet 105 form the first heat exchange system 122, and the second fin 121, the second fan 114, the water pump 137, the liquid cooling pipe 129, the second module air inlet 124, and the second module air outlet 125 form the second heat exchange system 123.

The preparation method may specifically include that a first module air outlet 101 is formed on a front side surface of the first module housing 100, a first module air inlet 102 is formed on the rear side, left side, right side, top or bottom of the first module housing 100, a first module heat preservation cavity air inlet 104 is arranged on the rear side surface, the left side surface, the right side surface, the top surface or the bottom surface of the heat preservation cavity 103, a first module heat preservation cavity air outlet 105 is arranged on the left side surface, the right side surface, the top surface, the bottom surface or the front side surface of the heat preservation cavity 103, a second module air inlet 124 is formed on the front side, the rear side, the left side, the right side, the top or the bottom of the second module housing 126, the step of forming the second module outlet 125 on the top surface, the bottom surface, the front side surface, the rear side surface, the left side surface, or the right side surface of the second module housing 126 may further include the step of disposing the first fan 106 between the insulating cavity outlet 105 and the first module outlet 101.

The above-mentioned preparation method may specifically include that the second heat conducting substrate 108 is provided with a second heat conducting substrate liquid cooling pipe interface 135, and the liquid cooling pipe 129 is connected to the second heat conducting substrate liquid cooling pipe interface 135. It may also be included to interface the liquid cooled tube 129 with the second module liquid cooled tube interface 136.

The method in embodiments 3 and 4 may further specifically include a step of providing an air deflector or an air guiding grid at the first module air outlet 101, and further may include a step of providing an air deflector or an air guiding grid at each of the first module air inlet 102, the second module air inlet 124, and the second module air outlet 125.

The present invention also provides an installation method of an air conditioner, which includes a first heat exchange system 122, a second heat exchange system 123 and semiconductor chilling plates 109, the semiconductor chilling plates 109 comprise a first working surface and a second working surface, the first heat exchange system 122 exchanges heat with the first working surface of the semiconductor chilling plates 109, the second heat exchanging system 123 exchanges heat with the second working surface of the semiconductor chilling plate 109, the air conditioner comprises a first module 127 and a second module 128, the first heat exchange system 122 and the semiconductor chilling plates 109 are located in the first module 127, the second heat exchange system 123 comprises a hot side and a cold side connected by a liquid-cooled tube 129, the hot and cold sides being located in a first module 127 and a second module 128 respectively, the installation method includes the step of integrating the first module 127 to the front of the range hood.

The first module 127 is integrated in front of the range hood, that is, the first module 127 is integrated in front of the range hood.

The method may further include the step of integrating the first module 127 in front of the range hood horizontal housing 313.

Specifically, the integration of the first module 127 in front of the horizontal housing 313 of the range hood may be performed by adhering the first module housing 100 in front of the horizontal housing 313 of the range hood, or by providing an insert between the front of the horizontal housing 313 of the range hood and the first module housing 100, where the first module housing 100 and the horizontal housing 313 of the range hood are respectively located at the upper and lower sides of the insert, or by providing support rods at both sides of the first module housing 100, and fixing the support rods in front of the horizontal housing 313 of the range hood.

The method may further include the step of integrating the first module 127 to the front of the range hood main flue housing 310.

Specifically, the first module 127 may be integrated in front of the range hood main flue housing 310 by adhering the first module housing 100 to the front of the range hood main flue housing 310 or by fixing the first module 127 to the front of the range hood main flue housing 310 using an elastic ring.

More specifically, the distance between the first module housing 100 and the range hood horizontal housing 313 can be n when the first module 127 is integrated in front of the range hood main flue housing 310, where n is greater than zero.

The method may further include the step of integrating the second module 128 into a range hood horizontal housing 313.

Specifically, the integration of the second module 128 into the range hood horizontal housing 313 may mean the integration of the first module 127 into the left or right portion of the range hood horizontal housing 313.

Specifically, the integration of the second module 128 into the horizontal hood casing 313 may be performed by adhering the second module casing 126 to the horizontal hood casing 313, or by providing an insert between the horizontal hood casing 313 and the second module casing 126, where the second module casing 126 and the horizontal hood casing 313 are respectively located at upper and lower sides of the insert, or by providing support rods at two sides of the second module casing 126, and fixing the support rods to the horizontal hood casing 313.

The method can further include the step of integrating the second module 128 into a range hood main flue housing 310.

Specifically, the integration of the second module 128 into the range hood main flue housing 310 may refer to the integration of the second module 128 into the range hood main flue housing 310 on either the left or right side.

Specifically, integrating the second module 128 into the range hood main flue housing 310 may refer to adhering the second module housing 126 to the range hood main flue housing 310 or using a bungee ring to secure the second module 128 to the range hood main flue housing 310.

More specifically, it may be that when the second module 128 is integrated into the range hood main flue housing 310, the distance between the second module housing 126 and the range hood horizontal housing 313 is n, where n is greater than zero.

FIG. 11 is a first installation form of the air conditioner; FIG. 12 is a second installation form of the air conditioner; FIG. 13 is a third form of installation of the air conditioner; fig. 14 shows a fourth installation form of the air conditioner.

Fig. 11 is a three-dimensional schematic of the integration of an air conditioner with a horizontal housing of a range hood. It can be seen that the air conditioner can be integrated with the hood exterior, can be integrated into the hood housing, and the first module 127 of the air conditioner 118 is preferably integrated directly in front of the hood horizontal housing.

The range hood 119 housing includes a range hood horizontal housing 313 and a range hood main flue housing 310. The main flue of the range hood is 316. As shown in fig. 11, the first module 127 of the air conditioner 118 is externally integrated to the horizontal housing 313 of the hood 119, but is not limited to the external integration to the front, and the second module 128 is externally integrated to one side of the horizontal housing 313 of the hood, to the side and to the rear. The control panel 315 of the range hood can send an electrical control module to the air conditioner 118, or the air conditioner can be self-controlled by the control panel.

In one embodiment, the first module 127 and the second module 128 may be respectively bonded to the horizontal hood housing 313. In another embodiment, where the hot and cold side air intakes are designed to be located at the lower end of the module, it is desirable to maintain the air intakes in communication with the outside air by keeping the bottom surfaces of the first and

second module housings

100 and 126 spaced from the horizontal hood housing 313 rather than in close contact therewith. For example, the lower end of the module is provided with an embedded part in a welding or other mode, the left and right sides and the front of the embedded part are integrated or segmented, the rear section of the embedded part is empty, and air inlet is guaranteed. Or, two side walls of the first module housing 100 and the second module housing 126 are respectively provided with a support rod, and the lower ends of the support rods are fixed on the range hood housing, so that a certain gap is reserved between the first module housing 100 and the range hood horizontal housing 313 and between the second module housing 126 and the range hood horizontal housing.

Fig. 12 is a three-dimensional schematic view of the integration of an air conditioner with a range hood housing. It can be seen that the first module 127 of the air conditioner 118 can be integrated with the hood exterior, can be integrated into the hood horizontal housing, preferably right in front. The second module 128 is externally integrated to one side of the range hood main flue housing 310.

In one embodiment, the second module 128 may be configured to draw air from both lower ends and exhaust air from the top, and the second module liquid cooling tube holes 133 may be located at the bottom of the housing, with the lower end of the second module 128 being spaced a suitable distance from the horizontal housing 313 of the range hood. The first module 127 may be adhered to the horizontal housing 313 of the range hood, or an insert may be disposed between the horizontal housing 313 of the range hood and the first module housing 100, the first module housing 100 and the horizontal housing 313 of the range hood may be disposed on the upper and lower sides of the insert, or support rods may be disposed on the two sides of the first module housing 100, respectively, and the support rods may be fixed to the horizontal housing 313 of the range hood, and the second module 128 may be adhered to the main flue housing 310, or the second module 128 may be fixed to the main flue housing 310 by using elastic rings.

Fig. 13 is a three-dimensional schematic view of the integration of an air conditioner with a range hood housing. It can be seen that the first module 127 of the air conditioner 118 can be integrated with the hood exterior, can be integrated into the hood main flue housing, preferably directly in front. The second module 128 is externally integrated to one side, side rear, of the range hood horizontal housing 313.

In one embodiment, the first module 127 may be adhered to the main flue casing 310, or the first module 127 may be fixed to the main flue casing 310 by using an elastic ring, and the second module casing 126 may be adhered to the horizontal range hood casing 313, or an insert may be disposed between the horizontal range hood casing 313 and the second module casing 126, and the second module casing 126 and the horizontal range hood casing 313 may be disposed on the upper and lower sides of the insert, or support rods may be disposed on the two sides of the second module casing 126, and the support rods may be fixed to the horizontal range hood casing 313.

Fig. 14 is a three-dimensional schematic view of the integration of an air conditioner with a range hood housing. It can be seen that the first module 127 of the air conditioner 118 can be integrated with the hood exterior, can be integrated into the hood main flue housing, preferably directly in front. The second module 128 is externally integrated to one side of the range hood main flue housing 310.

In one embodiment, the second module 128 may be configured to draw air from both lower ends and exhaust air from the top, and the second module liquid cooling tube holes 133 may be located at the bottom of the housing, with the lower end of the second module 128 being spaced a suitable distance from the horizontal housing 313 of the range hood. The first and

second modules

127, 128 may be adhered to the flue housing 310, respectively, or the first and

second modules

127, 128 may be secured to the flue housing 310 using a bungee ring.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.

Claims

1. An air conditioner installation method, the air conditioner comprises a first heat exchange system (122), a second heat exchange system (123) and semiconductor chilling plates (109), the semiconductor chilling plates (109) comprise a first working surface and a second working surface, the first heat exchange system (122) is in heat exchange with the first working surface of the semiconductor chilling plates (109), the second heat exchange system (123) is in heat exchange with the second working surface of the semiconductor chilling plates (109), the air conditioner comprises a first module (127) and a second module (128), the first heat exchange system (122) and the semiconductor chilling plates (109) are located in the first module (127), the first heat exchange system (122) comprises first fins (112), the second heat exchange system (123) comprises an A end (138) and a B end (139) which are connected by liquid cooling pipes (129), the A end (138) is located in a first module (127), the B end (139) is located in a second module (128), the B end (139) comprises a second fin (121), the first module (127) is enclosed by a first module housing (100) to form a first module hollow cavity (110), and the A ends (138) of the first heat exchange system (122), the semiconductor chilling plates (109) and the second heat exchange system (123) are located in the first module hollow cavity (110); the cavity (110) in the first module is provided with a supporting body (116), the second working surface of the semiconductor chilling plate (109) is embedded in the supporting body (116), the first module (127) is provided with a first module liquid cooling pipe hole (134), a first module air inlet (102) and a first module air outlet (101), and the second module (128) is provided with a second module liquid cooling pipe hole (133), a second module air inlet (124) and a second module air outlet (125); the supporting body (116) is a hot poor conductor, the supporting body (116) is provided with a liquid cooling pipe hole, and the liquid cooling pipe (129) penetrates through the liquid cooling pipe hole; a second heat conduction substrate (108) is arranged on the second working surface of the semiconductor chilling plate (109), and a second heat conduction substrate liquid cooling pipe interface (135) is arranged on the second heat conduction substrate (108), so that the liquid cooling pipe (129) is connected with the second heat conduction substrate liquid cooling pipe interface (135); the method is characterized in that: the method of installation includes the step of integrating the first module (127) to the front of the range hood.

2. The air conditioner mounting method as set forth in claim 1, wherein: the first heat exchange system (122) includes a first fin (112), a first fan (106), a first module intake (102), and a first module outtake (101).

3. The air conditioner mounting method as set forth in claim 2, wherein: the second module (128) is surrounded by a second module housing (126) to form a second module hollow cavity (115), and the B end (139) of the second heat exchange system (123) is located in the second module hollow cavity (115).

4. The air conditioner mounting method as set forth in claim 3, wherein: the second heat exchange system (123) comprises a second fin (121), a second fan (114), a water pump (137), a liquid cooling pipe (129), a second module air inlet (124) and a second module air outlet (125).

5. The air conditioner mounting method as set forth in claim 4, wherein: the first module air outlet (101) is located on the front side face of the first module shell (100), the first module air inlet (102) is located on the rear side face, the left side face, the right side face, the top face or the bottom face of the first module shell (100), the second module air inlet (124) is located on the front side face, the rear side face, the left side face, the right side face, the top face or the bottom face of the second module shell (126), and the second module air outlet (125) is located on the top face, the bottom face, the front side face, the rear side face, the left side face or the right side face of the second module shell (126).

6. The air conditioner mounting method as set forth in claim 5, wherein: the first fan (106) of the first heat exchange system (122) is disposed between the first module outlet (101) and the first fin (112).

7. The air conditioner mounting method as set forth in claim 1, wherein: the first module (127) is integrated in front of the range hood, namely, the first module (127) is integrated in front of the range hood.

8. The air conditioner mounting method as set forth in claim 1, wherein: comprising integrating the first module (127) in front of a horizontal hood housing (313).

9. The air conditioner mounting method as set forth in claim 8, wherein: the first module (127) is integrated in front of a horizontal shell (313) of the range hood, namely, the first module shell (100) is bonded in front of the horizontal shell (313) of the range hood, or an embedded part is arranged between the front of the horizontal shell (313) of the range hood and the first module shell (100), the first module shell (100) and the horizontal shell (313) of the range hood are respectively positioned at the upper side and the lower side of the embedded part, or supporting rods are respectively arranged at the two sides of the first module shell (100), and the supporting rods are fixed in front of the horizontal shell (313) of the range hood.

10. The air conditioner mounting method as set forth in claim 1, wherein: including integrating the first module (127) in front of a range hood main flue housing (310).

11. The air conditioner mounting method as set forth in claim 10, wherein: the integration of the first module (127) in front of the range hood main flue housing (310) means that the first module housing (100) is bonded in front of the range hood main flue housing (310), or the first module (127) is fixed in front of the range hood main flue housing (310) using a snap ring.

12. The air conditioner mounting method as set forth in claim 11, wherein: when the first module (127) is integrated in front of a range hood main flue housing (310), the distance between the first module housing (100) and the range hood horizontal housing (313) is n, wherein n is greater than zero.

13. The air conditioner mounting method as set forth in claim 1, wherein: comprising integrating the second module (128) to a range hood horizontal housing (313).

14. The air conditioner mounting method as set forth in claim 13, wherein: integrating the second module (128) into a range hood horizontal housing (313) means that the second module (128) is integrated into the range hood horizontal housing (313) on the left or right.

15. The air conditioner mounting method as set forth in claim 13, wherein: the second module (128) is integrated into the horizontal range hood shell (313) by adhering the second module shell (126) to the horizontal range hood shell (313), or arranging an embedded piece between the horizontal range hood shell (313) and the second module shell (126), wherein the second module shell (126) and the horizontal range hood shell (313) are respectively positioned at the upper side and the lower side of the embedded piece, or supporting rods are respectively arranged at the two sides of the second module shell (126) and are fixed on the horizontal range hood shell (313).

16. The air conditioner mounting method as set forth in claim 1, wherein: including integrating the second module (128) into a range hood main flue housing (310).

17. The air conditioner mounting method as set forth in claim 16, wherein: integrating the second module (128) into the range hood main flue housing (310) means that the second module (128) is integrated into the range hood main flue housing (310) on either the left or right side.

18. The air conditioner mounting method as set forth in claim 16, wherein: integrating the second module (128) into the range hood main flue housing (310) means either adhering the second module housing (126) to the range hood main flue housing (310) or securing the second module (128) to the range hood main flue housing (310) using a bungee ring.

19. The air conditioner mounting method as set forth in claim 18, wherein: when the second module (128) is integrated into a range hood main flue housing (310), the distance between the second module housing (126) and the range hood horizontal housing (313) is n, wherein n is greater than zero.

20. An air conditioner, the air conditioner comprises a first heat exchange system (122), a second heat exchange system (123) and semiconductor chilling plates (109), the semiconductor chilling plates (109) comprise a first working surface and a second working surface, the first heat exchange system (122) exchanges heat with the first working surface of the semiconductor chilling plates (109), the second heat exchange system (123) exchanges heat with the second working surface of the semiconductor chilling plates (109), the air conditioner comprises a first module (127) and a second module (128), the first heat exchange system (122) and the semiconductor chilling plates (109) are located in the first module (127), the first heat exchange system (122) comprises first fins (112), the second heat exchange system (123) comprises an A end (138) and a B end (139) which are connected by liquid cooling pipes (129), the A end (138) is located in a first module (127), the B end (139) is located in a second module (128), the B end (139) comprises a second fin (121), the first module (127) is enclosed by a first module housing (100) to form a first module hollow cavity (110), and the A ends (138) of the first heat exchange system (122), the semiconductor chilling plates (109) and the second heat exchange system (123) are located in the first module hollow cavity (110); the cavity (110) in the first module is provided with a heat preservation cavity (103), the semiconductor refrigeration sheet (109) participates in forming the wall surface of the heat preservation cavity (103), the first fin (112) is positioned in the heat preservation cavity (103), the hollow cavity (110) of the first module is provided with a support body (116), the second working surface of the semiconductor refrigerating sheet (109) is embedded in the supporting body (116), the supporting body (116) is a poor thermal conductor, the supporting body (116) is provided with a liquid cooling pipe hole, the liquid cooling pipe (129) penetrates through the liquid cooling pipe hole, the second working surface of the semiconductor chilling plate (109) is assisted by a second heat conduction substrate (108), the second working surface is in thermal contact with a second heat conducting substrate (108), the second heat conducting substrate (108) is provided with a second heat conducting substrate liquid cooling pipe interface (135), the liquid cooling pipe (129) is connected with a liquid cooling pipe interface (135) of the second heat-conducting substrate; the method is characterized in that: integrating the first module (127) to a range hood front.

21. The air conditioner as set forth in claim 20, wherein: the first working surface of the semiconductor refrigeration sheet (109) participates in forming the bottom surface of the heat preservation cavity (103), and the first heat exchange system (122) comprises a first fin (112), a first fan (106), a first module air inlet (102), a first module air outlet (101), a first air outlet duct (111), a heat preservation cavity air inlet (104) and a heat preservation cavity air outlet (105);

the second heat exchange system (123) comprises a second fin (121), a second fan (114), a water pump (137), a liquid cooling pipe (129), a second module air inlet (124) and a second module air outlet (125).

22. The air conditioner as set forth in claim 21, wherein: the first module air outlet (101) is located on the front side face of the first module shell (100), the first module air inlet (102) is located on the rear side face, the left side face, the right side face, the top face or the bottom face of the first module shell (100), the first module heat preservation cavity air inlet (104) is located on the rear side face, the left side face, the right side face, the top face or the bottom face of the heat preservation cavity (103), the first module heat preservation cavity air outlet (105) is located on the left side face, the right side face, the top face, the bottom face or the front side face of the heat preservation cavity (103), the second module air inlet (124) is located on the front side face, the rear side face, the left side face, the right side face, the top face or the bottom face of the second module shell (126), and the second module air outlet (125) is located on the top face, the bottom face, the front side face, the rear side face.

23. The air conditioner as set forth in claim 22, wherein: the first heat exchange system (122) is characterized in that a heat preservation cavity air inlet (104) corresponds to the first module air inlet (102), a heat preservation cavity air outlet (105) corresponds to the first module air outlet (101), and the first fan (106) is arranged between the heat preservation cavity air outlet (105) and the first module air outlet (101).