CN105805862B - Preparation method of semiconductor refrigeration module - Google Patents
Preparation method of semiconductor refrigeration module Download PDFInfo
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- CN105805862B CN105805862B CN201410853617.8A CN201410853617A CN105805862B CN 105805862 B CN105805862 B CN 105805862B CN 201410853617 A CN201410853617 A CN 201410853617A CN 105805862 B CN105805862 B CN 105805862B
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Abstract
The invention discloses a preparation method of a semiconductor refrigeration module, which mainly comprises a first heat exchange system (120), a second heat exchange system (121), semiconductor refrigeration sheets (106) and a shell (100), wherein the shell (100) encloses a hollow cavity (107), the semiconductor refrigeration sheets (106) comprise a first working surface and a second working surface, the first heat exchange system (120) comprises the first working surface and first fins (109) of the semiconductor refrigeration sheets (106), the second heat exchange system (121) comprises the second working surface and second fins (110) of the semiconductor refrigeration sheets (106), and the method comprises the step of dividing the hollow cavity (107) into an inner cavity (116) and an outer cavity. The semiconductor refrigeration module prepared by the invention physically isolates the two heat exchange systems, and effectively improves the utilization efficiency of energy.
Description
Technical Field
The invention relates to a preparation method of a semiconductor refrigeration module.
Background
Cooking at the kitchen range is a hard household work, and particularly in summer, the working environment in a kitchen is very harsh due to the heat generated by the kitchen range and the original hot weather.
In order to solve the problem of overhigh temperature of a kitchen, a fan or an air conditioner is installed in the kitchen, however, the fan has a general blowing refrigeration effect, normal work of the gas stove can be influenced, and potential safety hazards also exist. Due to the special oil fume environment of a kitchen, after a common fan is used for a period of time, a large amount of putty is attached to the fan, the fan is difficult to clean, and the environment of the kitchen is also polluted.
When the air conditioning equipment is installed in a kitchen, on one hand, the cost problem exists, on the other hand, the problem that the cleaning is difficult also exists, and after oil smoke is attached to the surface of an air conditioning heat exchanger, the refrigerating effect is reduced.
Disclosure of Invention
In order to solve the problems of high cost, difficult cleaning, low temperature regulation effect and the like of using an air conditioner in a kitchen in the prior art, the invention provides a preparation method of a semiconductor refrigeration module, which is used for preparing the semiconductor refrigeration module and installing and applying the semiconductor refrigeration module in a range hood.
As an aspect of the present invention, a method for manufacturing a semiconductor refrigeration module is provided, where the semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, semiconductor refrigeration sheets and a housing, the housing encloses a hollow cavity, the semiconductor refrigeration sheets include a first working surface and a second working surface, the first heat exchange system includes the first working surface and first fins of the semiconductor refrigeration sheets, the second heat exchange system includes the second working surface and second fins of the semiconductor refrigeration sheets, and the method includes a step of dividing the hollow cavity into an inner cavity and an outer cavity.
As one of the specific embodiments, the method comprises the steps of confining the semiconductor chilling plate to the inner chamber or the outer chamber, or confining a first working surface and a second working surface of the semiconductor chilling plate to the inner chamber and the outer chamber, respectively, and may further comprise the steps of confining the first fin to the inner chamber and confining the second fin to the outer chamber; and arranging an inner cavity air outlet, an inner cavity air inlet, an outer cavity air outlet and an outer cavity air inlet on the shell.
The preparation method specifically comprises the steps of limiting the semiconductor refrigeration piece to an inner cavity; the first working surface of the semiconductor refrigerating sheet, the first fin, the inner cavity air inlet channel, the first fan, the first air inlet nozzle, the first air outlet nozzle and the inner cavity air outlet form a first heat exchange system; and the second working surface of the semiconductor refrigerating sheet, the heat pipe, the second fin, the second fan, the outer cavity air inlet and the outer cavity air outlet form a second heat exchange system.
The preparation method specifically comprises the steps that an inner cavity air outlet is formed in the front side face of the shell; an outer cavity air outlet is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell; an inner cavity air inlet is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell; and an outer cavity air inlet is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell.
The preparation method specifically comprises the steps of assisting a first heat conduction substrate on a first working surface of the semiconductor refrigeration sheet, and enabling the first fin to be in thermal contact with the first heat conduction substrate; and a second heat-conducting substrate is arranged on the second working surface of the semiconductor chilling plate, and the second fin is in thermal contact with the second heat-conducting substrate.
The preparation method may specifically include that a support body is arranged in the inner cavity, an accommodating groove is formed in the top surface of the support body, and the second working surface of the semiconductor chilling plate is accommodated in the accommodating groove. The support body is provided with a heat pipe hole, so that the heat pipe penetrates through the heat pipe hole.
The manufacturing method may specifically include that the second fins, the second fan, the outer cavity air inlet and the outer cavity air outlet are respectively provided in two groups.
As one of specific embodiments, the method includes the step of limiting the semiconductor refrigeration sheet to an outer cavity, and may further include the step of enabling the first working surface of the semiconductor refrigeration sheet, the heat pipe, the first fin, the inner cavity air inlet duct, the first fan, the first air inlet nozzle, the first air outlet nozzle, and the inner cavity air outlet to form the first heat exchange system; and enabling the second working surface of the semiconductor refrigeration sheet, the second fin, the second fan, the outer cavity air inlet and the outer cavity air outlet to form a second heat exchange system.
The method can also specifically comprise that an outer cavity air outlet is arranged on the front side surface of the shell; an inner cavity air outlet is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell; an outer cavity air inlet is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell; and forming an inner cavity air inlet on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell.
The method may further specifically include providing a first heat conducting substrate attached to a first working surface of the semiconductor chilling plate such that the first fin is in thermal contact with the first heat conducting substrate; and a second heat-conducting substrate is arranged on the second working surface of the semiconductor refrigerating sheet, and the second fin is in thermal contact with the second heat-conducting substrate.
The method may further specifically include providing a support body in the outer chamber, providing an accommodating groove in a top surface of the support body, and accommodating the first working surface of the semiconductor chilling plate in the accommodating groove. The support body is provided with a heat pipe hole, and the heat pipe penetrates through the heat pipe hole.
As one specific embodiment, the method includes confining first and second working surfaces of the semiconductor chilling plate to the inner and outer chambers, respectively; the first working surface of the semiconductor refrigerating sheet, the first fin, the inner cavity air inlet channel, the first fan, the first air inlet nozzle, the first air outlet nozzle and the inner cavity air outlet form a first heat exchange system; and the second working surface of the semiconductor refrigerating sheet, the second fin, the second fan, the outer cavity air inlet and the outer cavity air outlet form a second heat exchange system.
The method can also specifically comprise that an inner cavity air outlet is arranged on the front side surface of the shell; an outer cavity air outlet is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell; an inner cavity air inlet is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell; and an outer cavity air inlet is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell.
The method may further specifically include providing a first heat conducting substrate attached to a first working surface of the semiconductor chilling plate such that the first fin is in thermal contact with the first heat conducting substrate; and a second heat-conducting substrate is arranged on the second working surface of the semiconductor chilling plate, so that the second fin is in thermal contact with the second heat-conducting substrate. The second fin is in thermal contact with the second heat conducting substrate with a heat pipe.
The method may further specifically include providing a support body in the outer chamber, providing an accommodating groove in a top surface of the support body, and accommodating the second working surface of the semiconductor chilling plate in the accommodating groove. The support body is provided with a heat pipe hole, and the heat pipe penetrates through the heat pipe hole.
The second fins, the second fan, the outer cavity air inlet and the outer cavity air outlet can be respectively divided into two groups.
The method may further specifically include the step of providing wind guide grids at the inner cavity air inlet, the inner cavity air outlet, the outer cavity air inlet and the outer cavity air outlet.
As another aspect of the present invention, the present invention relates to a semiconductor refrigeration module, which mainly comprises a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a housing, wherein the housing encloses a hollow cavity, and the semiconductor refrigeration sheet comprises a first working surface and a second working surface; the hollow cavity is divided into an inner cavity and an outer cavity; the semiconductor refrigeration piece is limited to the inner cavity, or limited to the outer cavity, or the first working surface and the second working surface of the semiconductor refrigeration piece are respectively limited to the inner cavity and the outer cavity; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the first fin is confined to the inner cavity and the second fin is confined to the outer cavity; the shell is provided with an inner cavity air outlet, an inner cavity air inlet, an outer cavity air outlet and an outer cavity air inlet.
As one of specific embodiments, the semiconductor refrigeration sheet is limited to the inner cavity, and the first heat exchange system includes a first working surface of the semiconductor refrigeration sheet, a first fin, an inner cavity air inlet channel, a first fan, a first air inlet nozzle, a first air outlet nozzle, and an inner cavity air outlet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet, a heat pipe, a second fin, a second fan, an outer cavity air inlet and an outer cavity air outlet.
As one specific implementation mode, the semiconductor refrigeration sheet is limited to the outer cavity, and the first heat exchange system comprises a first working surface of the semiconductor refrigeration sheet, a heat pipe, a first fin, an inner cavity air inlet channel, a first fan, a first air inlet nozzle, a first air outlet nozzle and an inner cavity air outlet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet, a second fin, a second fan, an outer cavity air inlet and an outer cavity air outlet.
As one specific embodiment, the first working surface and the second working surface of the semiconductor chilling plate are respectively limited to the inner cavity and the outer cavity; the first heat exchange system comprises a first working surface of the semiconductor refrigerating sheet, a first fin, an inner cavity air inlet channel, a first fan, a first air inlet nozzle, a first air outlet nozzle and an inner cavity air outlet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet, a second fin, a second fan, an outer cavity air inlet and an outer cavity air outlet.
As a third aspect of the present invention, there is provided a hood including any one of the semiconductor refrigeration modules described above.
As a fourth aspect of the present invention, a bottom mounting method for a semiconductor refrigeration module is provided, the semiconductor refrigeration module mainly includes a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a housing, the housing encloses a hollow cavity, and the semiconductor refrigeration sheet includes a first working surface and a second working surface; the hollow cavity is divided into an inner cavity and an outer cavity; the semiconductor refrigeration piece is limited to the inner cavity, or limited to the outer cavity, or the first working surface and the second working surface of the semiconductor refrigeration piece are respectively limited to the inner cavity and the outer cavity; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the first fin is confined to the inner cavity and the second fin is confined to the outer cavity; the housing is provided with an inner chamber air outlet, an inner chamber air inlet, an outer chamber air outlet and an outer chamber air inlet, and the method comprises the step of integrating the housing onto a horizontal housing of the range hood.
Specifically, the integration of the housing into the horizontal housing of the range hood means that the housing is integrated into the front of the horizontal housing of the range hood.
Specifically, the integration of the housing into the horizontal housing of the range hood means that an insert is provided between the housing and the horizontal housing of the range hood, and the housing and the horizontal housing of the range hood are respectively fixed to the upper and lower sides of the insert, so that a certain gap is left between the housing and the horizontal housing of the range hood. The insert may be a U-shaped bracket.
Specifically, the integration of the housing on the horizontal housing of the range hood means that support rods are arranged on two side walls of the housing of the semiconductor refrigeration module, and the lower ends of the support rods are fixed on the housing of the range hood, so that a certain gap is reserved between the housing of the semiconductor refrigeration module and the horizontal housing of the range hood.
As a fifth aspect of the present invention, a side mounting method of a semiconductor refrigeration module is provided, the semiconductor refrigeration module mainly includes a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a housing, the housing encloses a hollow cavity, and the semiconductor refrigeration sheet includes a first working surface and a second working surface; the hollow cavity is divided into an inner cavity and an outer cavity; the semiconductor refrigeration piece is limited to the inner cavity, or limited to the outer cavity, or the first working surface and the second working surface of the semiconductor refrigeration piece are respectively limited to the inner cavity and the outer cavity; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the first fin is confined to the inner cavity and the second fin is confined to the outer cavity; the housing is provided with an inner chamber air outlet, an inner chamber air inlet, an outer chamber air outlet and an outer chamber air inlet, and the method comprises the step of integrating the housing onto a main flue housing of the range hood.
Specifically, the integration of the housing into the range hood main flue housing means that the housing is integrated into the range hood main flue housing directly in front of the range hood main flue housing.
Specifically, the integration of the housing into the main flue housing of the range hood means that the housing is adhered to the main flue housing or that the semiconductor refrigeration module is secured to the main flue housing using a tension ring. The distance between the shell and the horizontal shell of the range hood is n, wherein n is larger than zero.
As a sixth aspect of the present invention, the present invention relates to a cold and hot air isolation method for a semiconductor refrigeration module, the semiconductor refrigeration module mainly comprises a first heat exchange system, a second heat exchange system, semiconductor refrigeration sheets and a housing, the housing encloses a hollow cavity, the semiconductor refrigeration sheets include a first working surface and a second working surface, and the first heat exchange system includes a first working surface and a first fin of the semiconductor refrigeration sheets; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the hollow cavity is divided into an inner cavity and an outer cavity; confining the first fin to an inner cavity and confining the second fin to an outer cavity; the shell is provided with an inner cavity air outlet, an inner cavity air inlet, an outer cavity air outlet and an outer cavity air inlet, so that cold and hot air separation of the semiconductor refrigeration module is realized.
In particular, it is possible to limit the semiconductor chilling plate to the inner chamber or the outer chamber, or to limit the first working surface and the second working surface of the semiconductor chilling plate to the inner chamber and the outer chamber, respectively.
Specifically, the first working surface of the semiconductor chilling plate and the first fin can be in thermal contact; and enabling the second working surface of the semiconductor refrigeration piece and the second fin to be in thermal contact.
The embodiment of the invention at least realizes the following beneficial effects:
1. the semiconductor refrigeration module prepared by the preparation method has simple and compact structural design, simple manufacture and low cost;
2. the semiconductor refrigeration module prepared by the preparation method is arranged on a horizontal shell of a smoke exhaust ventilator shell or a main flue shell, and does not occupy the volume of an inner cavity of the smoke exhaust ventilator shell, so that the internal structure of the smoke exhaust ventilator shell is not influenced.
3. The semiconductor refrigeration module prepared by the preparation method effectively improves the utilization efficiency of energy by physically isolating the two heat exchange systems.
Drawings
Fig. 1 is a schematic top view of a semiconductor refrigeration module according to an embodiment of the present invention;
FIG. 2 is a right side view of a semiconductor refrigeration module according to one embodiment of the present invention;
FIG. 3 is a front view of the internal structure of a semiconductor refrigeration module according to one embodiment of the present invention;
FIG. 4 is a three-dimensional schematic view of a semiconductor refrigeration module housing according to one embodiment of the present invention;
fig. 5 is a schematic top view of a semiconductor refrigeration module according to a second embodiment of the present invention;
fig. 6 is a right side view of a semiconductor refrigeration module according to a second embodiment of the present invention;
fig. 7 is a front view of the internal structure of a semiconductor refrigeration module according to a second embodiment of the present invention;
fig. 8 is a three-dimensional schematic view of a semiconductor refrigeration module housing according to a second embodiment of the present invention;
fig. 9 is a schematic top view of a semiconductor refrigeration module according to a third embodiment of the present invention;
fig. 10 is a right side view of a semiconductor refrigeration module according to a third embodiment of the present invention;
fig. 11 is a front view of the internal structure of a semiconductor refrigeration module according to a third embodiment of the present invention;
fig. 12 is a three-dimensional schematic view of a semiconductor refrigeration module housing according to a third embodiment of the present invention;
FIG. 13 is a perspective view of the semiconductor refrigeration module of the present invention mounted to a horizontal housing of a range hood;
fig. 14 is a perspective view of the present invention with a semiconductor refrigeration module mounted to the main flue housing of a range hood.
Detailed Description
The present invention is further described with reference to the following drawings and specific examples so that those skilled in the art can better understand the present invention and can practice the present invention, but the examples are not intended to limit the present invention.
The embodiment of the invention provides a semiconductor refrigeration module and a range hood externally integrated with the refrigeration module. And the semiconductor refrigeration module is based on the semiconductor refrigeration piece, is matched with the fin for heat exchange, and blows out cold or heat generated by electrifying the semiconductor refrigeration piece through the fan. Can generate a local cold environment or hot environment for users, and meets the requirement of comfort of people. The semiconductor refrigerating sheet is provided with two working surfaces, the upper end is a first working surface, the lower end is a second working surface, and when the first working surface is a hot end, the second working surface is a cold end; when the first working surface is a cold end, the second working surface is a hot end. The semiconductor refrigeration module can be integrated with the exterior of the range hood, can be integrated at the upper end of the horizontal part of the range hood housing or can be integrated on the front surface of the main flue housing of the range hood. The refrigeration module can work independently and also can be intelligently linked with the range hood.
The semiconductor refrigeration module provided by the invention has the outstanding characteristics that the first heat exchange system and the second heat exchange system realize partial or even complete physical isolation, the bidirectional flow of heat energy and cold energy generated by the semiconductor refrigeration sheet can be effectively prevented, the utilization efficiency of energy is improved, and the electric energy consumption is reduced.
In one embodiment, the cooling module has two modes, a cooling mode and a warming mode: when the cooling mode is pressed, the upper end of the semiconductor refrigerating sheet is a cold end, the lower end of the semiconductor refrigerating sheet is a hot end, and an air outlet in front of the module is used for discharging cold air; when the warm mode is pressed, the upper end of the semiconductor refrigerating sheet is a hot end, the lower end of the semiconductor refrigerating sheet is a cold end, and hot air is discharged from an air outlet right in front of the module. The cooling mode will be described below as an example.
The invention provides a semiconductor refrigeration module which mainly comprises a first heat exchange system 120, a second heat exchange system 121, semiconductor refrigeration pieces 106 and a shell 100, wherein the shell 100 encloses a hollow cavity 107, and the semiconductor refrigeration pieces 106 comprise a first working surface and a second working surface; the hollow cavity 107 is divided into an inner cavity 116 and an outer cavity; the semiconductor cooling plate 106 is confined to the inner chamber 116, or to the outer chamber, or the first and second working surfaces of the semiconductor cooling plate 106 are confined to the inner chamber 116 and the outer chamber, respectively; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fins 109 are confined to the inner cavity 116 and the second fins 110 are confined to the outer cavity; the housing 100 is provided with an inner cavity air outlet 101, an inner cavity air inlet 102, an outer cavity air outlet 114 and an outer cavity air inlet 113.
As embodiment 1, referring to fig. 1 to 4, the semiconductor chilling plate 106 is limited to the inner cavity 116, and the first heat exchanging system 120 includes a first working surface of the semiconductor chilling plate 106, a first fin 109, an inner cavity air inlet 102, an inner cavity air inlet duct 119, a first fan 108, a first air inlet nozzle 117, a first air outlet nozzle 118, and an inner cavity air outlet 101; the second heat exchanging system 121 includes a second working surface of the semiconductor cooling fins 106, a heat pipe 111, a second fin 110, a second fan 112, an outer cavity air inlet 113 and an outer cavity air outlet 114.
The inner cavity air outlet 101 is positioned on the front side surface of the shell 100; the outer cavity air outlet 114 can be located on the top surface, bottom surface, rear side surface, left side surface or right side surface of the housing 100; the inner cavity intake vent 102 may be located on a top surface, a bottom surface, a rear side surface, a left side surface, or a right side surface of the housing 100; the outer cavity intake 113 may be located on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100.
The first working surface of the semiconductor cooling plate 106 is supplemented by a first heat conducting substrate 104, and the first fin 109 is in thermal contact with the first heat conducting substrate 104. The second working surface of the semiconductor chilling plate 106 is supplemented by a second heat-conducting substrate 105, and the second fin 110 is in thermal contact with the second heat-conducting substrate 105.
The inner cavity 116 may be provided with a supporting body 115, a receiving groove is provided on a top surface of the supporting body 115, and the second working surface of the semiconductor chilling plate 106 is received in the receiving groove. The support 115 is preferably a poor thermal conductor, and the support 115 is provided with a heat pipe hole through which the heat pipe 111 passes.
The second fins 110, the second fan 112, the outer cavity air inlet 113 and the outer cavity air outlet 114 may be divided into two groups, so as to realize energy diffusion more rapidly.
As embodiment 2, referring to fig. 5 to 8, the semiconductor chilling plate 106 is limited to an outer cavity, and the first heat exchanging system 120 includes a first working surface of the semiconductor chilling plate 106, a heat pipe 111, a first fin 109, an inner cavity air inlet 102, an inner cavity air inlet duct 119, a first fan 108, a first air inlet nozzle 117, a first air outlet nozzle 118, and an inner cavity air outlet 101; the second heat exchanging system 121 includes a second working surface of the semiconductor cooling fins 106, second fins 110, a second fan 112, an outer cavity air inlet 113 and an outer cavity air outlet 114.
The outer cavity air outlet 114 is positioned on the front side surface of the shell 100; the inner cavity air outlet 101 may be located on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100; the outer cavity air inlet 113 may be located on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100; the cavity intake vent 102 may be located on a top, bottom, rear, left, or right side of the enclosure 100.
The first working surface of the semiconductor cooling plate 106 is supplemented by a first heat conducting substrate 104, and the first fin 109 is in thermal contact with the first heat conducting substrate 104. The second working surface of the semiconductor chilling plate 106 is supplemented by a second heat-conducting substrate 105, and the second fin 110 is in thermal contact with the second heat-conducting substrate 105.
The outer chamber may be provided with a supporting body 115, the top surface of the supporting body 115 is provided with a receiving groove, and the first working surface of the semiconductor chilling plate 106 is received in the receiving groove. The support 115 is preferably a poor thermal conductor, and the support 115 is provided with a heat pipe hole through which the heat pipe 111 passes.
As example 3, with reference to fig. 9-12, the first and second working surfaces of the semiconductor chilling plate 106 are confined to the inner cavity 116 and the outer cavity, respectively; the first heat exchange system 120 comprises a first working surface of the semiconductor refrigeration sheet 106, a first fin 109, an inner cavity air inlet 102, an inner cavity air inlet duct 119, a first fan 108, a first air inlet nozzle 117, a first air outlet nozzle 118 and an inner cavity air outlet 101; the second heat exchanging system 121 includes a second working surface of the semiconductor cooling fins 106, second fins 110, a second fan 112, an outer cavity air inlet 113 and an outer cavity air outlet 114.
The inner cavity air outlet 101 is positioned on the front side surface of the shell 100; the outer cavity air outlet 114 can be located on the top surface, bottom surface, rear side surface, left side surface or right side surface of the housing 100; the inner cavity intake vent 102 may be located on a top surface, a bottom surface, a rear side surface, a left side surface, or a right side surface of the housing 100; the outer cavity intake 113 may be located on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100.
The first working surface of the semiconductor cooling plate 106 is supplemented by a first heat conducting substrate 104, and the first fin 109 is in thermal contact with the first heat conducting substrate 104. The second working surface of the semiconductor chilling plate 106 is supplemented by a second heat-conducting substrate 105, and the second fin 110 is in thermal contact with the second heat-conducting substrate 105. Specifically, in this embodiment, the second fin 110 and the second heat conducting substrate 105 may be in thermal contact with a heat pipe 111.
The outer chamber may be provided with a supporting body 115, the top surface of the supporting body 115 is provided with a receiving groove, and the second working surface of the semiconductor chilling plate 106 is received in the receiving groove. The support body 115 is provided with a heat pipe hole through which the heat pipe 111 penetrates.
The second fins 110, the second fan 112, the outer cavity air inlet 113 and the outer cavity air outlet 114 may be divided into two groups, so as to achieve faster energy diffusion.
In the semiconductor refrigeration module provided in embodiments 1 to 3, the inner cavity air inlet 102, the inner cavity air outlet 101, the outer cavity air inlet 113, and the outer cavity air outlet 114 may be provided with the air guiding grid 103.
In the semiconductor refrigeration module provided in embodiments 1 to 3 above, the heat-conducting silicone grease 200 may be added between the first working surface of the semiconductor refrigeration sheet 106 and the first heat-conducting substrate 104; and a heat-conducting silicone grease 201 can be supplemented between the second working surface of the semiconductor chilling plate 106 and the second heat-conducting substrate 105.
The invention also provides a range hood which comprises the semiconductor refrigeration module provided by any one of the embodiments 1-3.
The invention also provides a preparation method of the semiconductor refrigeration module, the semiconductor refrigeration module mainly comprises a first heat exchange system 120, a second heat exchange system 121, semiconductor refrigeration sheets 106 and a shell 100, the shell 100 encloses a hollow cavity 107, the semiconductor refrigeration sheets 106 comprise a first working surface and a second working surface, the first heat exchange system 120 comprises the first working surface and first fins 109 of the semiconductor refrigeration sheets 106, the second heat exchange system 121 comprises the second working surface and second fins 110 of the semiconductor refrigeration sheets 106, and the method comprises the step of dividing the hollow cavity 107 into an inner cavity 116 and an outer cavity.
As embodiment 4, the method comprises the step of confining the semiconductor chilling plate 106 to the inner cavity 116 or the outer cavity, or confining the first and second working surfaces of the semiconductor chilling plate 106 to the inner cavity 116 and the outer cavity, respectively, and may further comprise the steps of confining the first fin 109 to the inner cavity 116 and confining the second fin 110 to the outer cavity; and arranging an inner cavity air outlet 101, an inner cavity air inlet 102, an outer cavity air outlet 114 and an outer cavity air inlet 113 on the shell 100.
The preparation method may specifically include limiting the semiconductor chilling plate 106 to the inner cavity 116; the first working surface of the semiconductor chilling plate 106, the first fin 109, the cavity air inlet 102, the cavity air inlet duct 119, the first fan 108, the first air inlet nozzle 117, the first air outlet nozzle 118 and the cavity air outlet 101 form the first heat exchange system 120; so that the second working surface of the semiconductor cooling plate 106, the heat pipe 111, the second fin 110, the second fan 112, the outer cavity air inlet 113 and the outer cavity air outlet 114 form the second heat exchange system 121.
The preparation method specifically comprises the steps that an inner cavity air outlet 101 is formed in the front side face of the shell 100; an outer cavity air outlet 114 is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100; an inner cavity air inlet 102 is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100; an external cavity air inlet 113 is formed on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100.
The preparation method specifically includes that a first heat conduction substrate 104 is attached to a first working surface of the semiconductor chilling plate 106, and the first fin 109 is in thermal contact with the first heat conduction substrate 104; a second heat conducting substrate 105 is attached to the second working surface of the semiconductor cooling plate 106, and the second fin 110 is in thermal contact with the second heat conducting substrate 105.
The preparation method may specifically include providing a support body 115 in the inner cavity 116, providing a receiving groove on a top surface of the support body 115, and receiving the second working surface of the semiconductor chilling plate 106 in the receiving groove. The support 115 is provided with a heat pipe hole so that the heat pipe 111 penetrates the heat pipe hole.
The preparation method may specifically include that the second fins 110, the second fan 112, the outer cavity air inlet 113 and the outer cavity air outlet 114 are respectively divided into two groups.
As embodiment 5, the method includes the step of limiting the semiconductor chilling plate 106 to an outer cavity, and may further include the step of enabling the first working surface of the semiconductor chilling plate 106, the heat pipe 111, the first fin 109, the inner cavity air inlet 102, the inner cavity air inlet duct 119, the first fan 108, the first air inlet nozzle 117, the first air outlet nozzle 118, and the inner cavity air outlet 101 to constitute the first heat exchange system 120; and a step of making the second working surface of the semiconductor chilling plate 106, the second fin 110, the second fan 112, the outer chamber air inlet 113 and the outer chamber air outlet 114 constitute the second heat exchange system 121.
The method may further specifically include that an outer cavity air outlet 114 is formed in the front side surface of the housing 100; an inner cavity air outlet 101 is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100; an outer cavity air inlet 113 is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100; and forming an inner cavity air inlet 102 on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100.
The method may further specifically include providing a first heat conducting substrate 104 on a first working surface of the semiconductor chilling plate 106, such that the first fin 109 is in thermal contact with the first heat conducting substrate 104; the second working surface of the semiconductor chilling plate 106 is supplemented with a second heat-conducting substrate 105, and the second fin 110 is in thermal contact with the second heat-conducting substrate 105.
The method may further specifically include providing a support body 115 in the outer chamber, providing a receiving groove on a top surface of the support body 115, and receiving the first working surface of the semiconductor chilling plate 106 in the receiving groove. A heat pipe hole is provided in the support body 115 such that the heat pipe 111 penetrates the heat pipe hole.
As embodiment 6, the method comprises confining first and second working surfaces of the semiconductor chilling plate 106 to the inner cavity 116 and the outer cavity, respectively; the first working surface of the semiconductor chilling plate 106, the first fin 109, the cavity air inlet 102, the cavity air inlet duct 119, the first fan 108, the first air inlet nozzle 117, the first air outlet nozzle 118 and the cavity air outlet 101 form the first heat exchange system 120; so that the second working surface of the semiconductor cooling plate 106, the second fins 110, the second fan 112, the outer cavity air inlet 113 and the outer cavity air outlet 114 form the second heat exchange system 121.
The method may further specifically include providing an inner cavity air outlet 101 on a front side of the housing 100; an outer cavity air outlet 114 is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100; an inner cavity air inlet 102 is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100; and an external cavity air inlet 113 is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100.
The method may further specifically include providing a first heat conducting substrate 104 on a first working surface of the semiconductor chilling plate 106, such that the first fin 109 is in thermal contact with the first heat conducting substrate 104; a second heat conducting substrate 105 is attached to the second working surface of the semiconductor cooling plate 106, so that the second fins 110 are in thermal contact with the second heat conducting substrate 105. The second fin 110 is in thermal contact with the second heat conducting substrate 105 with a heat pipe 111.
The method may further specifically include providing a support body 115 in the outer chamber, providing a receiving groove on a top surface of the support body 115, and receiving the second working surface of the semiconductor chilling plate 106 in the receiving groove. A heat pipe hole is provided in the support 115, and the heat pipe 111 is inserted through the heat pipe hole.
The second fins 110, the second fan 112, the outer cavity air inlet 113 and the outer cavity air outlet 114 may be respectively provided in two groups.
The method may further specifically include the step of providing the air guiding grids 103 at the inner cavity air inlet 102, the inner cavity air outlet 101, the outer cavity air inlet 113, and the outer cavity air outlet 114.
As embodiment 7, a bottom mounting method of a semiconductor refrigeration module is provided, where the semiconductor refrigeration module 150 is mainly composed of a first heat exchange system 120, a second heat exchange system 121, a semiconductor refrigeration sheet 106, and a housing 100, where the housing 100 encloses a hollow cavity 107, and the semiconductor refrigeration sheet 106 includes a first working surface and a second working surface; the hollow cavity 107 is divided into an inner cavity 116 and an outer cavity; the semiconductor cooling plate 106 is confined to the inner chamber 116, or to the outer chamber, or the first and second working surfaces of the semiconductor cooling plate 106 are confined to the inner chamber 116 and the outer chamber, respectively; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fins 109 are confined to the inner cavity 116 and the second fins 110 are confined to the outer cavity; the housing 100 is provided with an inner chamber air outlet 101, an inner chamber air inlet 102, an outer chamber air outlet 114 and an outer chamber air inlet 113, and the method includes the step of integrating the housing 100 into a horizontal housing 313 of the range hood.
Specifically, the integration of the housing 100 into the hood horizontal housing 313 means that the housing 100 is integrated directly in front of the hood horizontal housing 313.
Specifically, the integration of the housing 100 into the horizontal hood housing 313 means that an insert is provided between the housing 100 and the horizontal hood housing 313, and the housing 100 and the horizontal hood housing 313 are fixed to upper and lower sides of the insert, respectively, such that a certain gap is maintained between the housing 100 and the horizontal hood housing 313. The insert may be a U-shaped bracket 317.
Specifically, the integration of the housing 100 into the horizontal housing 313 of the range hood means that support rods are arranged on two side walls of the housing 100 of the semiconductor refrigeration module 150, and the lower ends of the support rods are fixed on the housing of the range hood, so that a certain gap is reserved between the housing 100 of the semiconductor refrigeration module and the horizontal housing 313 of the range hood.
Fig. 13 is a three-dimensional schematic view of the integration of a semiconductor refrigeration module with a horizontal housing of a range hood. It can be seen that the semiconductor refrigeration module can be integrated with the exterior of the range hood, can be integrated into the range hood housing, and is preferably integrated directly in front of the horizontal housing of the range hood.
The hood 151 housing includes a hood horizontal housing 313 and a hood main flue housing 310. The main flue of the range hood is 316. As shown in fig. 13, the semiconductor cooling module 150 is externally integrated with the horizontal housing 313 of the hood 151, but is not limited to be externally integrated directly in front. The control panel 315 of the smoke exhaust ventilator can send an electric control instruction to the semiconductor refrigeration module 150, or the semiconductor refrigeration module is provided with a control panel for automatic control. In one embodiment, the air inlets at the hot and cold ends are designed to be located at the lower end of the semiconductor refrigeration module 150, so that the module housing 100 is spaced from the horizontal housing 313 of the range hood rather than being in close contact with the horizontal housing to keep the air inlets open to the outside air. For example, the lower end of the module is welded or otherwise provided with a U-shaped bracket 317, and the left, the right and the front of the bracket are integrated or segmented, so that the rear section of the bracket is empty and air inlet is ensured. Or, two side walls of the semiconductor refrigeration module casing 100 are provided with support rods, and the lower ends of the support rods are fixed on the smoke exhaust ventilator casing, so that a certain gap is reserved between the semiconductor refrigeration module casing 100 and the smoke exhaust ventilator horizontal casing 313.
As embodiment 8, a side mounting method of a semiconductor refrigeration module is provided, where the semiconductor refrigeration module 150 is mainly composed of a first heat exchange system 120, a second heat exchange system 121, a semiconductor refrigeration sheet 106, and a housing 100, where the housing 100 encloses a hollow cavity 107, and the semiconductor refrigeration sheet 106 includes a first working surface and a second working surface; the hollow cavity 107 is divided into an inner cavity 116 and an outer cavity; the semiconductor cooling plate 106 is confined to the inner chamber 116, or to the outer chamber, or the first and second working surfaces of the semiconductor cooling plate 106 are confined to the inner chamber 116 and the outer chamber, respectively; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fins 109 are confined to the inner cavity 116 and the second fins 110 are confined to the outer cavity; the housing 100 is provided with an inner chamber air outlet 101, an inner chamber air inlet 102, an outer chamber air outlet 114 and an outer chamber air inlet 113, and the method includes the step of integrating the housing 100 into a range hood main flue housing 310.
Specifically, the integration of the housing 100 into the range hood main flue housing 310 means that the housing 100 is integrated into the range hood main flue housing 310 right in front.
Specifically, the integration of the housing 100 into the range hood main flue housing 310 means that the housing 100 is adhered to the main flue housing 310 or the semiconductor cooling module 150 is fixed to the main flue housing 310 using an elastic ring. The distance between the housing 100 and the horizontal range hood housing 313 is n, where n is greater than zero.
Fig. 14 is a three-dimensional schematic view of the integration of a semiconductor refrigeration module with a range hood main flue housing. It can be seen that the semiconductor refrigeration module 150 can be integrated externally with the range hood 151, can be integrated into the range hood main flue housing 310, and preferably is integrated directly in front of the main flue housing 310. Specifically, the semiconductor refrigeration module 150 may be adhered to the flue housing 310, the semiconductor refrigeration module 150 may be fixed to the flue housing 310 by using an elastic ring, or another method for fixing the semiconductor refrigeration module 150 to the flue housing 310 may be used. In one embodiment, when the semiconductor refrigeration module 150 is externally integrated into the main flue housing 310 of the range hood, hot and cold air from the module enters from below and hot air from above, it is necessary to keep a proper distance between the lower end of the semiconductor refrigeration module 150 and the horizontal housing 313 of the range hood so that the air inlet can communicate with the outside air.
The invention is characterized in that a cold and hot air isolation mode of a semiconductor refrigeration module is invented, the semiconductor refrigeration module mainly comprises a first heat exchange system 120, a second heat exchange system 121, semiconductor refrigeration sheets 106 and a shell 100, the shell 100 encloses a hollow cavity 107, the semiconductor refrigeration sheets 106 comprise a first working surface and a second working surface, and the first heat exchange system 120 comprises the first working surface and first fins 109 of the semiconductor refrigeration sheets 106; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; by dividing the hollow cavity 107 into an inner cavity 116 and an outer cavity; confining the first fin 109 to an inner cavity 116 and the second fin 110 to an outer cavity; the outer shell 100 is provided with an inner cavity air outlet 101, an inner cavity air inlet 102, an outer cavity air outlet 114 and an outer cavity air inlet 113, so that cold and hot air separation of the semiconductor refrigeration module is realized.
Specifically, the semiconductor cooling plate 106 may be limited to the inner cavity 116 or the outer cavity, or the first working surface and the second working surface of the semiconductor cooling plate 106 may be limited to the inner cavity 116 and the outer cavity, respectively.
Specifically, a first working surface of the semiconductor chilling plate 106 and a first fin 109 may be brought into thermal contact; the second working surface of the semiconductor chilling plate 106 and the second fin 110 are brought into thermal contact.
As one specific embodiment, the semiconductor chilling plates 106 are limited to the inner cavity 116, and the first heat exchanging system 120 includes a first working surface of the semiconductor chilling plates 106, a first fin 109, an inner cavity air inlet 102, an inner cavity air inlet duct 119, a first fan 108, a first air inlet nozzle 117, a first air outlet nozzle 118, and an inner cavity air outlet 101; the second heat exchanging system 121 includes a second working surface of the semiconductor cooling fins 106, a heat pipe 111, a second fin 110, a second fan 112, an outer cavity air inlet 113 and an outer cavity air outlet 114.
Specifically, the inner cavity air outlet 101 may be located on a front side surface of the housing 100; the outer cavity air outlet 114 is located on the top surface, bottom surface, rear side surface, left side surface or right side surface of the housing 100; the inner cavity air inlet 102 is located on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100; the outer cavity air inlet 113 is located on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100.
As one specific embodiment, the semiconductor cooling fins 106 are limited to the outer cavity, and the first heat exchanging system 120 includes a first working surface of the semiconductor cooling fins 106, a heat pipe 111, a first fin 109, an inner cavity air inlet 102, an inner cavity air inlet duct 119, a first fan 108, a first air inlet nozzle 117, a first air outlet nozzle 118, and an inner cavity air outlet 101; the second heat exchanging system 121 includes a second working surface of the semiconductor cooling fins 106, second fins 110, a second fan 112, an outer cavity air inlet 113 and an outer cavity air outlet 114.
Specifically, the outer cavity air outlet 114 may be located on the front side surface of the housing 100; the inner cavity air outlet 101 is positioned on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100; the outer cavity air inlet 113 is positioned on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100; the inner cavity intake vent 102 is located on a top surface, a bottom surface, a rear side surface, a left side surface, or a right side surface of the housing 100.
As one specific embodiment, the first and second working surfaces of the semiconductor cooling plate 106 are confined to the inner cavity 116 and the outer cavity, respectively; the first heat exchange system 120 comprises a first working surface of the semiconductor refrigeration sheet 106, a first fin 109, an inner cavity air inlet 102, an inner cavity air inlet duct 119, a first fan 108, a first air inlet nozzle 117, a first air outlet nozzle 118 and an inner cavity air outlet 101; the second heat exchanging system 121 comprises a second working surface of the semiconductor cooling fins 106, second fins 110, an outer cavity air inlet 113 and an outer cavity air outlet 114 of the second fan 112.
Specifically, the inner cavity air outlet 101 may be located on a front side surface of the housing 100; the outer cavity air outlet 114 is located on the top surface, bottom surface, rear side surface, left side surface or right side surface of the housing 100; the inner cavity air inlet 102 is located on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell 100; the outer cavity air inlet 113 is located on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100.
As a specific embodiment, the inner cavity air inlet 102, the inner cavity air outlet 101, the outer cavity air inlet 113, and the outer cavity air outlet 114 may be provided with air guiding grids 103.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (18)
1. A method for manufacturing a semiconductor refrigeration module, the semiconductor refrigeration module mainly comprising a first heat exchange system (120), a second heat exchange system (121), semiconductor refrigeration sheets (106) and a housing (100), the housing (100) enclosing a hollow cavity (107), the semiconductor refrigeration sheets (106) including a first working surface and a second working surface, the first heat exchange system (120) including the first working surface and first fins (109) of the semiconductor refrigeration sheets (106), the second heat exchange system (121) including the second working surface and second fins (110) of the semiconductor refrigeration sheets (106), the method being characterized in that: the method comprises the steps of dividing the hollow cavity (107) into an inner cavity (116) and an outer cavity; a step of confining the semiconductor chilling plate (106) to the inner chamber (116) or the outer chamber, or confining a first working surface and a second working surface of the semiconductor chilling plate (106) to the inner chamber (116) and the outer chamber, respectively; the step of confining said first fin (109) to an inner cavity (116), and confining said second fin (110) to an outer cavity; when the semiconductor chilling plate (106) is limited in the inner cavity (116), a support body (115) is arranged in the inner cavity (116), a containing groove is formed in the top surface of the support body (115), a second working surface of the semiconductor chilling plate (106) is contained in the containing groove, the support body (115) is a poor thermal conductor, a heat pipe hole is formed in the support body (115), and the second working surface is in thermal contact with the second fin (110) through a heat pipe (111) penetrating through the heat pipe hole; or when the semiconductor refrigeration piece (106) is limited in an outer cavity, the outer cavity is provided with the supporting body (115), the top surface of the supporting body (115) is provided with a containing groove, the first working surface of the semiconductor refrigeration piece (106) is contained in the containing groove, the supporting body (115) is a poor thermal conductor, the supporting body (115) is provided with a heat pipe hole, and the first working surface is in thermal contact with the first fin (109) through a heat pipe (111) penetrating through the heat pipe hole; or when the first working surface and the second working surface of the semiconductor refrigeration piece (106) are respectively limited to the inner cavity (116) and the outer cavity, a supporting body (115) is arranged on the outer cavity, a containing groove is arranged on the top surface of the supporting body (115), the second working surface of the semiconductor refrigeration piece (106) is contained in the containing groove, the supporting body (115) is a poor thermal conductor, a heat pipe hole is arranged on the supporting body (115), and the second working surface is in thermal contact with the second fin (110) through a heat pipe (111) penetrating through the heat pipe hole.
2. The method of claim 1, further comprising the step of providing the housing (100) with an inner chamber air outlet (101), an inner chamber air inlet (102), an outer chamber air outlet (114), and an outer chamber air inlet (113).
3. A method of manufacturing as claimed in claim 2, comprising, while confining the semiconductor chilling plate (106) to the interior cavity (116); enabling the first working surface of the semiconductor refrigeration sheet (106), the first fin (109), the inner cavity air inlet (102), the inner cavity air inlet channel (119), the first fan (108), the first air inlet nozzle (117), the first air outlet nozzle (118) and the inner cavity air outlet (101) to form a first heat exchange system (120); the second working surface of the semiconductor refrigeration sheet (106), the heat pipe (111), the second fin (110), the second fan (112), the outer cavity air inlet (113) and the outer cavity air outlet (114) form the second heat exchange system (121).
4. The preparation method of claim 3, comprising the steps of forming an inner cavity air outlet (101) in the front side surface of the shell (100); an outer cavity air outlet (114) is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); an inner cavity air inlet (102) is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); an outer cavity air inlet (113) is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100).
5. The method of claim 3, comprising providing a first heat conducting substrate (104) on the first working surface of the semiconductor chilling plate (106), and placing the first fin (109) in thermal contact with the first heat conducting substrate (104).
6. The method of claim 3, including providing a second heat conducting substrate (105) on a second working surface of the semiconductor chilling plate (106), and placing the second fin (110) in thermal contact with the second heat conducting substrate (105).
7. The manufacturing method according to claim 3, wherein the second fins (110), the second fan (112), the outer chamber air inlet (113) and the outer chamber air outlet (114) are provided in two sets.
8. The method of claim 2, comprising, while confining the semiconductor chilling plate (106) to an external chamber; enabling the first working surface of the semiconductor refrigeration sheet (106), the heat pipe (111), the first fin (109), the inner cavity air inlet (102), the inner cavity air inlet duct (119), the first fan (108), the first air inlet nozzle (117), the first air outlet nozzle (118) and the inner cavity air outlet (101) to form a first heat exchange system (120); and enabling the second working surface of the semiconductor refrigeration sheet (106), the second fin (110), the second fan (112), the outer cavity air inlet (113) and the outer cavity air outlet (114) to form the second heat exchange system (121).
9. The method of claim 8, comprising providing an external cavity outlet (114) in a front side of the housing (100); an inner cavity air outlet (101) is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); an outer cavity air inlet (113) is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); and forming an inner cavity air inlet (102) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100).
10. The method of claim 8, comprising providing a first heat conducting substrate (104) attached to the first working surface of the semiconductor chilling plate (106) such that the first fin (109) is in thermal contact with the first heat conducting substrate (104).
11. The method of claim 8, comprising providing a second heat conducting substrate (105) on a second working surface of the semiconductor chilling plate (106), wherein the second fin (110) is in thermal contact with the second heat conducting substrate (105).
12. The method of manufacturing as claimed in claim 2, comprising confining first and second working surfaces of the semiconductor chilling plate (106) to the inner chamber (116) and the outer chamber, respectively; enabling the first working surface of the semiconductor refrigeration sheet (106), the first fin (109), the inner cavity air inlet (102), the inner cavity air inlet channel (119), the first fan (108), the first air inlet nozzle (117), the first air outlet nozzle (118) and the inner cavity air outlet (101) to form a first heat exchange system (120); the second working surface of the semiconductor refrigeration sheet (106), the second fin (110), the second fan (112), the outer cavity air inlet (113) and the outer cavity air outlet (114) form the second heat exchange system (121).
13. The method of claim 12, including providing a cavity vent (101) in a front side of the housing (100); an outer cavity air outlet (114) is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); an inner cavity air inlet (102) is formed in the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); and an outer cavity air inlet (113) is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100).
14. The method of claim 12, including providing a first heat conducting substrate (104) attached to the first working surface of the semiconductor chilling plate (106) such that the first fin (109) is in thermal contact with the first heat conducting substrate (104).
15. The method of claim 12, including providing a second heat conducting substrate (105) attached to a second working surface of the semiconductor chilling plate (106) such that the second fin (110) is in thermal contact with the second heat conducting substrate (105).
16. The method of claim 15, including placing the second fin (110) in thermal contact with the second thermally conductive substrate (105) with a heat pipe (111).
17. The manufacturing method according to claim 12, comprising two sets of the second fins (110), the second fan (112), the outer chamber air inlet (113) and the outer chamber air outlet (114).
18. The method of claim 2, including the step of providing air guide grids (103) at the inner chamber inlet (102), the inner chamber outlet (101), the outer chamber inlet (113), and the outer chamber outlet (114).
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| DE10147818B4 (en) * | 2001-09-27 | 2004-09-02 | Rational Ag | Extractor hood for a cooking appliance |
| KR20100134994A (en) * | 2009-06-16 | 2010-12-24 | 엘지이노텍 주식회사 | Hood system for cooking |
| CN204006211U (en) * | 2014-06-30 | 2014-12-10 | 青岛海尔洗碗机有限公司 | A kind of lampblack absorber with refrigerating function |
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| CN101101159A (en) * | 2006-07-05 | 2008-01-09 | 骆俊光 | Cooling/heating device |
| CN103591730A (en) * | 2013-12-02 | 2014-02-19 | 广东富信科技股份有限公司 | Integrated semiconductor refrigeration system |
| CN103838334A (en) * | 2014-01-17 | 2014-06-04 | 东华理工大学 | Heat dissipation base of notebook computer |
| CN203744338U (en) * | 2014-02-26 | 2014-07-30 | 海尔集团公司 | Air supply module of range hood and range hood |
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