CN204693887U - Semiconductor refrigerating module and smoke exhaust ventilator - Google Patents

Abstract

The utility model discloses a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing. The casing forms a hollow cavity. The semiconductor refrigeration sheet includes a first A working surface and a second working surface; the first heat exchange system includes the first working surface and the first fins of the semiconductor refrigeration sheet; the second heat exchange system includes the second working surface of the semiconductor refrigeration and the second fin; the hollow cavity is divided into at least two chambers by at least one partition arranged longitudinally, and the first heat exchange system is provided in some chambers; the chamber provided with the first heat exchange system is divided As an inner cavity and an outer cavity, the first working surface and the first fins of the peltier are confined to the inner cavity. The utility model also discloses a range hood using the semiconductor refrigeration module. By physically separating the two heat exchange systems, energy utilization efficiency is improved.

Description

Semiconductor refrigeration module and range hood

technical field

The utility model relates to a semiconductor refrigeration module and a range hood.

Background technique

Cooking by the kitchen stove is a hard housework, especially in summer, the original hot weather and the heat from the stove make the working environment in the kitchen very harsh.

In order to solve the problem of high temperature in the kitchen, some people install fans or air conditioners in the kitchen. However, the cooling effect of the fan is average, and it will affect the normal operation of the gas stove, and there are also potential safety hazards. Due to the special oil fume environment in the kitchen, after a period of use of the general fan, a large amount of putty is attached to the fan, which is difficult to clean and will also cause pollution to the kitchen environment.

Installing air-conditioning equipment in the kitchen, on the one hand, has the problem of cost, on the other hand, there will also be the problem that it is difficult to clean. After the surface of the air-conditioning heat exchanger is covered with oil fume, there is also the problem of a decline in the cooling effect.

Utility model content

In order to solve the problems existing in the prior art, such as the high cost of using an air conditioner in the kitchen, the difficulty in cleaning and the low temperature adjustment effect, the utility model provides a semiconductor refrigeration module, which is installed and applied in a range hood.

As one aspect of the present invention, it relates to a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing. The casing surrounds a hollow cavity. The semiconductor refrigeration sheet includes a first working surface and a second working surface; the first heat exchange system includes the first working surface and first fins of the semiconductor refrigeration sheet; the second heat exchange system includes the semiconductor refrigeration sheet The second working surface and the second fin; the hollow cavity is divided into at least two chambers by at least one partition arranged longitudinally, and the first heat exchange system is provided in some chambers; the first heat exchange system is provided The cavity is divided into an inner cavity and an outer cavity, and the first working surface and the first fins of the semiconductive cooling sheet are limited to the inner cavity.

Specifically, the second working surface of the semiconductive cooling sheet is limited to the inner cavity or the outer cavity; the first fin and the second fin are limited to different chambers; each limit For the chamber with the first fins or the second fins, an air outlet and an air inlet are correspondingly provided on the housing.

As one of the specific implementations, the hollow cavity is divided into two chambers by a partition arranged longitudinally, and one of the chambers is divided into an inner cavity and an outer cavity.

As one of the specific embodiments, the semiconductor cooling fin is limited to the inner cavity; the first heat exchange system includes the first working surface and the first fin of the semiconductor cooling fin; the second heat exchanging The system includes a second working surface of the peltier and a second fin; the first fin is confined to the inner chamber; the second fin is confined to another chamber; each chamber , an air outlet and an air inlet are correspondingly provided on the housing.

Specifically, it may be that the first heat exchange system includes the first working surface of the semiconductor cooling fin, the first fin, the first air inlet nozzle, the first air outlet nozzle, the first air inlet duct, the first An air inlet, a first fan, and a first air outlet; the second heat exchange system includes a second working surface of a peltier, a heat pipe, a second fin, a second fan, a second air inlet, and a second air outlet .

More specifically, it may be that the first air outlet is arranged on the front side of the housing; the second air outlet is arranged on the top surface, bottom surface, rear side, left side or right side of the housing. surface; the first air inlet is arranged on the top surface, bottom surface, rear side, left side or right side of the casing; the second air inlet is arranged on the top surface, bottom surface, rear surface of the casing Side, left or right side.

The first working surface of the peltier can be supplemented with a first heat-conducting substrate, and the first fins are in thermal contact with the first heat-conducting substrate. The second working surface of the peltier can be supplemented with a second heat-conducting substrate, and the second fins are in thermal contact with the second heat-conducting substrate.

The inner cavity may be provided with a supporting body, the top surface of the supporting body is provided with a receiving groove, and the second working surface of the semiconductor cooling chip is accommodated in the receiving groove. It may be that the support body is a poor conductor of heat, the support body is provided with a heat pipe hole, and the heat pipe passes through the heat pipe hole.

As one of the specific embodiments, the first working surface and the second working surface of the semiconductor cooling plate are respectively limited to the inner cavity and the outer cavity; the first heat exchange system includes the semiconductor cooling plate The first working surface and the first fin; the second heat exchange system includes the second working surface and the second fin of the peltier; the first fin is limited to the inner cavity; the The second fin is confined in another chamber; each chamber is correspondingly provided with an air outlet and an air inlet in the housing.

Specifically, it may be that the first heat exchange system includes the first working surface of the semiconductor cooling fin, the first fin, the first air inlet nozzle, the first air outlet nozzle, the first air inlet duct, the first An air inlet, a first fan, and a first air outlet; the second heat exchange system includes a second working surface of a peltier, a heat pipe, a second fin, a second fan, a second air inlet, and a second air outlet .

More specifically, it may be that the first air outlet is arranged on the front side of the housing; the second air outlet is arranged on the top surface, bottom surface, rear side, left side or right side of the housing. surface; the first air inlet is arranged on the top surface, bottom surface, rear side, left side or right side of the casing; the second air inlet is arranged on the top surface, bottom surface, rear surface of the casing Side, left or right side.

The first working surface of the peltier can be supplemented with a first heat-conducting substrate, and the first fins are in thermal contact with the first heat-conducting substrate. The second working surface of the peltier can be supplemented with a second heat-conducting substrate, and the second fins are in thermal contact with the second heat-conducting substrate.

The outer cavity may be provided with a support, and the top surface of the support is provided with a receiving groove, and the second working surface of the semiconductor cooling chip is accommodated in the receiving groove. It may be that the support body is a poor conductor of heat, the support body is provided with a heat pipe hole, and the heat pipe passes through the heat pipe hole.

As one of the specific implementation manners, the hollow cavity is divided into at least three chambers by at least two partitions arranged longitudinally, and some of the chambers are divided into an inner cavity and an outer cavity. Specifically, it may be that the hollow chamber is divided into three chambers by two partitions arranged longitudinally, and the middle chamber is divided into an inner chamber and an outer chamber.

As one of the specific embodiments, the semiconductor cooling fin is limited to the inner cavity of the intermediate chamber; the first heat exchange system includes the first working surface and the first fin of the semiconductor cooling fin; the second The heat exchange system includes the second working surface of the semi-conductor cooling fin and the second fin; the first fin is limited to the inner cavity of the intermediate chamber; the second fin includes two groups of fins, respectively Restricted in the chambers on both sides; each chamber is correspondingly provided with an air outlet and an air inlet in the housing.

Specifically, it may be that the first heat exchange system includes the first working surface of the semiconductor cooling fin, the first fin, the first air inlet nozzle, the first air outlet nozzle, the first air inlet duct, the first An air inlet, a first fan, and a first air outlet; the second heat exchange system includes a second working surface of a peltier, a heat pipe, a second fin, a second fan, a second air inlet, and a second air outlet .

More specifically, it may be that the first air outlet is arranged on the front side of the housing; the second air outlet is arranged on the top surface, bottom surface, rear side, left side or right side of the housing. surface; the first air inlet is arranged on the top surface, bottom surface, rear side, left side or right side of the casing; the second air inlet is arranged on the top surface, bottom surface, rear surface of the casing Side, left or right side.

The first working surface of the peltier can be supplemented with a first heat-conducting substrate, and the first fins are in thermal contact with the first heat-conducting substrate. The second working surface of the peltier can be supplemented with a second heat-conducting substrate, and the second fins are in thermal contact with the second heat-conducting substrate.

The inner cavity of the intermediate chamber may be provided with a support, and the top surface of the support is provided with a receiving groove, and the second working surface of the semiconductor cooling chip is accommodated in the receiving groove. It may be that the support body is a poor conductor of heat, the support body is provided with a heat pipe hole, and the heat pipe passes through the heat pipe hole.

As one of the specific embodiments, the first working surface and the second working surface of the semiconductor cooling plate are respectively limited to the inner cavity and the outer cavity of the intermediate chamber; the first heat exchange system includes the semiconductor cooling plate The first working surface and the first fin; the second heat exchange system includes the second working surface and the second fin of the peltier; the first fin is limited to the inner cavity; the The second fins include two groups of fins, which are respectively confined in the chambers on both sides; each chamber is correspondingly provided with an air outlet and an air inlet in the housing.

Specifically, it may be that the first heat exchange system includes the first working surface of the semiconductor cooling fin, the first fin, the first air inlet nozzle, the first air outlet nozzle, the first air inlet duct, the first An air inlet, a first fan, and a first air outlet; the second heat exchange system includes a second working surface of a peltier, a heat pipe, a second fin, a second fan, a second air inlet, and a second air outlet .

More specifically, it may be that the first air outlet is arranged on the front side of the housing; the second air outlet is arranged on the top surface, bottom surface, rear side, left side or right side of the housing. surface; the first air inlet is arranged on the top surface, bottom surface, rear side, left side or right side of the casing; the second air inlet is arranged on the top surface, bottom surface, rear surface of the casing Side, left or right side.

The first working surface of the peltier can be supplemented with a first heat-conducting substrate, and the first fins are in thermal contact with the first heat-conducting substrate. The second working surface of the peltier can be supplemented with a second heat-conducting substrate, and the second fins are in thermal contact with the second heat-conducting substrate.

The outer cavity of the middle chamber may be provided with a support, and the top surface of the support is provided with a receiving groove, and the second working surface of the semiconductor cooling chip is accommodated in the receiving groove. It may be that the support body is a poor conductor of heat, the support body is provided with a heat pipe hole, and the heat pipe passes through the heat pipe hole.

As one of the specific implementation manners, the first air outlet may be provided with an air guiding grid. Preferably, both the air inlet and the air outlet can be provided with air guide grilles.

As one of the specific embodiments, thermal conductive silicone grease may be added between the first working surface of the semiconductor cooling chip and the first thermal conductive substrate. Thermally conductive silicone grease may be added between the second working surface of the semiconductive cooling sheet and the second thermally conductive substrate.

As another aspect of the present invention, it relates to a range hood, which includes the aforementioned semiconductor refrigeration module.

As the third aspect of the present utility model, it relates to a method for preparing a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing. The casing is surrounded by a Hollow cavity, the semiconductive cooling sheet includes a first working surface and a second working surface, the first heat exchange system includes the first working surface and first fins of the semiconducting cooling sheet, and the second heat exchanging system Including the second working surface and the second fin of the peltier, the method includes, using at least one partition arranged vertically, dividing the hollow cavity into at least two chambers, and in a part of the chambers, The first heat exchange system; the step of dividing the chamber provided with the first heat exchange system into an inner cavity and an outer cavity, and confining the first working surface and the first fins of the semiconductive refrigeration sheet to the inner cavity.

The method may further include the step of confining the second working surface of the peltier to the inner cavity or the outer cavity.

The method may also include the step of confining the first fin and the second fin in different chambers.

As one of the embodiments, each chamber bounded by the first fin or the second fin is correspondingly provided with an air outlet and an air inlet in the housing.

As the fourth aspect of the utility model, it relates to a method for installing the bottom of a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing. Forming a hollow cavity, the semiconductive cooling sheet includes a first working surface and a second working surface; the first heat exchange system includes the first working surface and first fins of the semiconducting cooling sheet; the second heat exchanging The system includes the second working surface and the second fin of the semiconducting refrigerating sheet; the hollow cavity is divided into at least two chambers by at least one partition arranged longitudinally, and a first heat exchange system is provided in some chambers; The chamber provided with the first heat exchange system is divided into an inner chamber and an outer chamber, and the first working surface and the first fins of the semiconductive refrigeration sheet are limited to the inner chamber, and the method includes, placing the Step in which the housing is integrated into the horizontal housing of the cooker hood.

Specifically, the integration of the shell into the horizontal shell of the range hood refers to the integration of the shell into the front of the horizontal shell of the range hood.

Specifically, the integration of the shell into the horizontal shell of the range hood refers to setting an insert between the shell and the horizontal shell of the range hood, and fixing the shell and the horizontal shell of the range hood to the insert respectively. The upper and lower sides of the range hood, so that a certain gap is reserved between the shell and the horizontal shell of the range hood. The insert may be a U-shaped bracket.

Specifically, the integration of the housing into the range hood horizontal housing refers to setting support rods on the two side walls of the semiconductor refrigeration module housing, and the lower ends of the support rods are fixed to the range hood housing, so that the semiconductor refrigeration module housing and the exhaust A certain gap is reserved between the range hood horizontal casings.

As the fifth aspect of the present utility model, it relates to a side installation method of a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing. Forming a hollow cavity, the semiconductive cooling sheet includes a first working surface and a second working surface; the first heat exchange system includes the first working surface and first fins of the semiconducting cooling sheet; the second heat exchanging The system includes the second working surface and the second fin of the semi-conductor cooling sheet; the hollow cavity is divided into at least two chambers by at least one partition arranged longitudinally, and a first heat exchange system is arranged in some chambers; The chamber provided with the first heat exchange system is divided into an inner chamber and an outer chamber, and the first working surface and the first fins of the semiconductive refrigeration sheet are limited to the inner chamber, and the method includes, placing the Steps in which the housing is integrated into the range hood main flue housing.

Specifically, the integration of the casing into the casing of the main flue of the range hood refers to integrating the casing into the casing of the main flue of the range hood right in front of it.

Specifically, the integration of the shell into the main flue shell of the range hood refers to bonding the shell to the main flue shell, or using an elastic ring to fix the semiconductor refrigeration module to the main flue shell.

Preferably, the distance between the housing and the horizontal housing of the range hood is n, wherein n is greater than zero.

As the sixth aspect of the present invention, it relates to a cold and hot air isolation method of a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing. The shell surrounds a hollow cavity, the semiconductive cooling sheet includes a first working surface and a second working surface, and the first heat exchange system includes the first working surface and first fins of the semiconducting cooling sheet; the second The heat exchanging system includes the second working surface and the second fin of the semi-conductor cooling sheet; the hollow cavity is divided into at least two chambers by using at least one partition plate arranged vertically, and the first chamber is arranged in a part of the chamber A heat exchange system; the chamber provided with the first heat exchange system is divided into an inner cavity and an outer cavity, and the first working surface and the first fin of the semiconductive refrigeration sheet are limited to the inner cavity; the The second working surface of the semiconductive cooling sheet is limited to the inner cavity or the outer cavity; the first fin and the second fin are limited to different chambers to realize the isolation of cold and hot air of the semiconductive cooling module.

Each chamber bounded by the first fin or the second fin is correspondingly provided with an air outlet and an air inlet in the housing.

Embodiments of the utility model at least achieve the following beneficial effects:

1. The semiconductor refrigeration module provided by the utility model has a simple and compact structure design, simple manufacture, and low cost;

2. The utility model installs the module shell equipped with the semiconductor refrigeration module on the horizontal shell of the range hood shell or on the main flue shell, neither of which occupies the volume of the inner cavity of the range hood shell, so it does not affect the range hood The internal structure of the range hood, and when cleaning the range hood, you only need to remove the module shell from the range hood shell to facilitate cleaning, so it is not only easy to install and disassemble, but also easy to clean and maintain.

3. By physically separating the two heat exchange systems, the energy utilization efficiency is effectively improved.

Description of drawings

Fig. 1 is a schematic top view of a semiconductor refrigeration module according to one embodiment of the present invention;

Fig. 2 is a right view of the semiconductor refrigeration module of one of the embodiments of the present invention;

Fig. 3 is a front view of the internal structure of the semiconductor refrigeration module, one of the embodiments of the present invention;

Fig. 4 is a three-dimensional schematic diagram of the shell of the semiconductor refrigeration module, one of the embodiments of the present invention;

Fig. 5 is a schematic top view of the semiconductor refrigeration module of the second embodiment of the utility model;

Fig. 6 is a right view of the semiconductor refrigeration module of the second embodiment of the utility model;

Fig. 7 is a front view of the internal structure of the semiconductor refrigeration module of the second embodiment of the utility model;

Fig. 8 is a three-dimensional schematic diagram of the shell of the semiconductor refrigeration module in the second embodiment of the utility model;

Fig. 9 is a schematic top view of the semiconductor refrigeration module of the third embodiment of the utility model;

Fig. 10 is the right view of the semiconductor refrigeration module of the third embodiment of the utility model;

Fig. 11 is a front view of the internal structure of the semiconductor refrigeration module of the third embodiment of the utility model;

Fig. 12 is a three-dimensional schematic diagram of the shell of the semiconductor refrigeration module in the third embodiment of the utility model;

Fig. 13 is a top view schematic diagram of the semiconductor refrigeration module of the fourth embodiment of the utility model;

Fig. 14 is a right view of the semiconductor refrigeration module of the fourth embodiment of the utility model;

Fig. 15 is a front view of the internal structure of the semiconductor refrigeration module of the fourth embodiment of the utility model;

Fig. 16 is a three-dimensional schematic diagram of the shell of the semiconductor refrigeration module in the fourth embodiment of the present invention;

Fig. 17 is a perspective view of the semiconductor refrigeration module of the present invention installed on the horizontal casing of the range hood;

Fig. 18 is a perspective view of the utility model in which the semiconductor refrigeration module is installed on the main flue casing of the range hood.

Detailed ways

The utility model will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the utility model and implement it, but the examples given are not intended to limit the utility model.

The embodiment of the utility model provides a semiconductor refrigeration module and a range hood externally integrated with the refrigeration module. The semi-conductor refrigeration module is based on the semi-conductor refrigeration sheet, and uses fins for heat exchange, and the cooling or heat generated by the semiconductor refrigeration sheet is blown out by the fan. It can generate a local cold environment or hot environment for users to meet human comfort requirements. The semiconductor refrigeration chip has two working surfaces, the upper end is the first working surface, and the lower end is the second working surface. When the first working surface is the hot end, the second working surface is the cold end; when the first working surface is the cold end , the second working surface is the hot end. The semiconductor refrigeration module can be integrated with the outside of the range hood, can be integrated into the upper end of the horizontal part of the range hood shell or integrated into the front of the range hood main flue shell. The refrigeration module can work independently, or it can be intelligently linked with the range hood.

A prominent feature of the semiconductor refrigeration module provided by the utility model is that the first heat exchange system and the second heat exchange system realize partial or even complete physical isolation, which can effectively prevent the two-way heat energy and cold energy generated by the semiconductor refrigeration sheet. Flow, improve energy utilization efficiency, reduce power consumption.

In a specific embodiment, the cooling module has two working modes: cool mode and warm mode: when the cool mode is pressed, the upper end of the semiconductor cooling chip is the cold end, the lower end is the hot end, and the air outlet in front of the module emits cold air; when the warm mode is pressed In mode, the upper end of the semiconductor cooling chip is the hot end, the lower end is the cold end, and the hot air comes out from the air outlet directly in front of the module. In the following, the cool mode is taken as an example for description.

The utility model provides a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system 120, a second heat exchange system 121, a semiconductor refrigeration sheet 106 and a casing 100. The casing 100 encloses a hollow cavity 107. The semiconductor cooling plate 106 includes a first working surface and a second working surface; the first heat exchange system 120 includes the first working surface of the semiconductor cooling plate 106 and the first fins 109; the second heat exchanging system 121 includes the second working surface and the second fin 110 of the semi-conductor cooling sheet 106; the hollow cavity 107 is divided into at least two chambers by at least one partition 122 arranged vertically, and the part of the chamber is provided with the The first heat exchange system 120; the chamber provided with the first heat exchange system 120 is divided into an inner cavity 116 and an outer cavity, and the first working surface and the first fins 109 of the semiconductive refrigeration sheet 106 are limited to The inner cavity 116 .

Specifically, the second working surface of the semiconductor cooling fin 106 is limited to the inner cavity 116 or the outer cavity; the first fin 109 and the second fin 110 are limited to different chambers ; Each chamber limited by the first fin 109 or the second fin 110 is provided with an air outlet and an air inlet correspondingly in the housing 100 .

As Embodiment 1, referring to FIGS. 1-4 , the hollow cavity 107 is divided into two chambers by a partition 122 arranged longitudinally, one of which is divided into an inner cavity 116 and an outer cavity. The semiconductor cooling plate 106 is limited to the inner cavity 116; the first heat exchange system 120 includes the first working surface of the semiconductor cooling plate 106 and the first fins 109; the second heat exchange system 121 Including the second working surface of the peltier refrigerating sheet 106 and the second fin 110; the first fin 109 is limited to the inner cavity 116; the second fin 110 is limited to another cavity; Each chamber is correspondingly provided with an air outlet and an air inlet in the casing 100 .

Specifically, it may be that the first heat exchange system 120 includes the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Wind duct 119, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchange system 121 includes the second working surface of the semiconducting cooling fin 106, the second fin 110, the heat pipe 111, The second fan 112 , the second air inlet 113 and the second air outlet 114 .

More specifically, it may be that the first air outlet 101 is arranged on the front side of the housing 100; the second air outlet 114 is arranged on the top surface, the bottom surface, the rear side, and the left side of the housing 100 side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side of the casing 100; the second air inlet 113 is arranged on the casing 100's top, bottom, rear, left or right sides.

Specifically, the first working surface of the peltier refrigerating sheet 106 can be supplemented with a first heat conducting substrate 104 , and the first fins 109 are in thermal contact with the first heat conducting substrate 104 . The second working surface of the peltier refrigerating sheet 106 can be supplemented with a second heat conducting substrate 105, and the second fin 110 is in thermal contact with the second heat conducting substrate 105 through a heat pipe.

Specifically, the inner cavity 116 may be provided with a support body 115 , and the top surface of the support body 115 is provided with a receiving groove, and the second working surface of the semiconductor cooling chip 106 is accommodated in the receiving groove. It may be that the support body 115 is a poor conductor of heat, the support body 115 is provided with a heat pipe hole, and the heat pipe 111 passes through the heat pipe hole.

As a second embodiment, referring to FIGS. 5-8 , the hollow cavity 107 is divided into two chambers by a partition 122 arranged longitudinally, one of which is divided into an inner cavity 116 and an outer cavity. The first working surface and the second working surface of the semiconductor cooling plate 106 are respectively limited to the inner cavity 116 and the outer cavity; the first heat exchange system 120 includes the first working surface of the semiconductor cooling plate 106 surface and first fins 109; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106 and the second fins 110; the first fins 109 are limited to the inner cavity 116 The second fin 110 is confined in another chamber; each chamber is provided with an air outlet and an air inlet correspondingly in the housing 100 .

Specifically, it may be that the first heat exchange system 120 includes the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Wind duct 119, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106, the heat pipe 111, the second fin 110, The second fan 112 , the second air inlet 113 and the second air outlet 114 .

More specifically, it may be that the first air outlet 101 is arranged on the front side of the housing 100; the second air outlet 114 is arranged on the top surface, the bottom surface, the rear side, and the left side of the housing 100 side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side of the casing 100; the second air inlet 113 is arranged on the casing 100's top, bottom, rear, left or right sides.

Specifically, the first working surface of the peltier refrigerating sheet 106 can be supplemented with a first heat conducting substrate 104 , and the first fins 109 are in thermal contact with the first heat conducting substrate 104 . The second working surface of the peltier refrigerating sheet 106 can be supplemented with a second heat conducting substrate 105, and the second fin 110 is in thermal contact with the second heat conducting substrate 105 through a heat pipe.

Specifically, the outer cavity may be provided with a support body 115 , and the top surface of the support body 115 is provided with a receiving groove, and the second working surface of the semiconductor cooling chip 106 is accommodated in the receiving groove. It may be that the support body 115 is a poor conductor of heat, the support body 115 is provided with a heat pipe hole, and the heat pipe 111 passes through the heat pipe hole.

As Embodiment 3, referring to FIGS. 9-12 , the hollow cavity 107 is divided into at least three chambers by at least two partitions 122 arranged longitudinally, and some of the chambers are divided into an inner cavity 116 and an outer cavity. Specifically, it may be that the hollow chamber 107 is divided into three chambers by two partitions 122 arranged longitudinally, and the middle chamber is divided into an inner chamber 116 and an outer chamber. The semiconductor cooling plate 106 is limited to the inner cavity 116 of the intermediate chamber; the first heat exchange system 120 includes the first working surface of the semiconductor cooling plate 106 and the first fins 109; the second heat exchanging The system 121 includes the second working surface of the peltier 106 and the second fin 110; the first fin 109 is confined to the inner cavity 116 of the intermediate chamber; the second fin 110 includes two sets of fins The sheets are respectively limited in the chambers on both sides; each chamber is correspondingly provided with an air outlet and an air inlet in the housing 100 .

Specifically, it may be that the first heat exchange system 120 includes the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Wind duct 119, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106, the heat pipe 111, the second fin 110, The second fan 112 , the second air inlet 113 and the second air outlet 114 .

More specifically, it may be that the first air outlet 101 is arranged on the front side of the housing 100; the second air outlet 114 is arranged on the top surface, the bottom surface, the rear side, and the left side of the housing 100 side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side of the casing 100; the second air inlet 113 is arranged on the casing 100's top, bottom, rear, left or right sides.

Specifically, the first working surface of the semiconductive cooling sheet 106 can be supplemented with a first heat conducting substrate 104, and the first fins 109 are in thermal contact with the first thermal conducting substrate 104; the semiconducting cooling sheet 106 The second working surface can be supplemented by a second thermally conductive substrate 105, and the second fins 110 are in thermal contact with the second thermally conductive substrate 105 through heat pipes.

Specifically, the inner cavity 116 of the middle chamber can also be provided with a support body 115, the top surface of the support body 115 is provided with a receiving groove, and the second working surface of the semiconductor cooling chip 106 is accommodated in the receiving groove . It may be that the support body 115 is a poor conductor of heat, the support body 115 is provided with a heat pipe hole, and the heat pipe 111 passes through the heat pipe hole.

As Embodiment 4, referring to FIG. 13-FIG. 16, the hollow cavity 107 is divided into at least three chambers by at least two partitions 122 arranged longitudinally, and some of the chambers are divided into an inner cavity 116 and an outer cavity. Specifically, it may be that the hollow chamber 107 is divided into three chambers by two partitions 122 arranged longitudinally, and the middle chamber is divided into an inner chamber 116 and an outer chamber. The first working surface and the second working surface of the semiconductor cooling plate 106 are respectively limited to the inner cavity 116 and the outer cavity of the intermediate chamber; the first heat exchange system 120 includes the first working surface of the semiconductor cooling plate 106 surface and first fins 109; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106 and the second fins 110; the first fins 109 are limited to the inner cavity 116 The second fins 110 include two groups of fins, which are respectively confined in the chambers on both sides; each chamber is correspondingly provided with an air outlet and an air inlet in the housing 100 .

Specifically, it may be that the first heat exchange system 120 includes the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Wind duct 119, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106, the heat pipe 111, the second fin 110, The second fan 112 , the second air inlet 113 and the second air outlet 114 .

More specifically, it may be that the first air outlet 101 is arranged on the front side of the housing 100; the second air outlet 114 is arranged on the top surface, the bottom surface, the rear side, and the left side of the housing 100 side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side of the casing 100; the second air inlet 113 is arranged on the casing 100's top, bottom, rear, left or right sides.

Specifically, the first working surface of the semiconductive cooling sheet 106 can be supplemented with a first heat conducting substrate 104, and the first fins 109 are in thermal contact with the first thermal conducting substrate 104; the semiconducting cooling sheet 106 The second working surface can be supplemented by a second thermally conductive substrate 105, and the second fins 110 are in thermal contact with the second thermally conductive substrate 105 through heat pipes.

Specifically, the outer cavity of the middle chamber can also be provided with a support body 115 , the top surface of the support body 115 is provided with an accommodating groove, and the second working surface of the semiconductor cooling chip 106 is accommodated in the accommodating groove. It may be that the support body 115 is a poor conductor of heat, the support body 115 is provided with a heat pipe hole, and the heat pipe 111 passes through the heat pipe hole.

In the semiconductor refrigeration module shown in Embodiment 1-4, the first air outlet 101 may be provided with an air guide grid 103 . As a preference, both the air inlet and the air outlet may be provided with an air guiding grid 103 .

In the semiconductive refrigeration module shown in Embodiment 1-4, the first working surface of the semiconductive refrigeration sheet 106 and the first heat conduction substrate 104 can be supplemented with thermally conductive silicone grease 200; the second working surface of the semiconductive refrigeration sheet 106 Thermal conductive silicone grease 201 may also be added between the surface and the second thermal conductive substrate 105 .

The utility model also provides a range hood, which includes the aforementioned semiconductor refrigeration module.

As Embodiment 5, it relates to the preparation method of the semiconductor refrigeration module described in Embodiments 1-4. The semiconductor refrigeration module is mainly composed of the first heat exchange system 120, the second heat exchange system 121, the semiconductor refrigeration sheet 106 and the shell 100. The casing 100 encloses a hollow cavity 107, the semiconductor cooling fin 106 includes a first working surface and a second working surface, and the first heat exchange system 120 includes the first working surface and a first fin of the semiconductor cooling fin 106. sheet 109, the second heat exchange system 121 includes the second working surface of the peltier sheet 106 and the second fins 110, the method includes, using at least one partition 122 arranged vertically, dividing the hollow cavity 107 is divided into at least two chambers, and a first heat exchange system 120 is provided in a part of the chambers; the chamber provided with the first heat exchange system 120 is divided into an inner chamber 116 and an outer chamber, and the semiconductor refrigeration sheet 106 The steps of the first working surface and the first fin 109 are limited to the inner cavity 116 .

The method may further include the step of confining the second working surface of the peltier 106 to the inner cavity 116 or the outer cavity.

The method may further comprise the step of confining the first fin 109 and the second fin 110 in different chambers.

As one of the embodiments, each cavity is bounded by the first fin 109 or the second fin 110 , and the housing 100 is provided with an air outlet and an air inlet correspondingly.

As one of specific implementations, the method may include, using a partition 122 arranged longitudinally, to divide the hollow cavity 107 into two chambers, and divide one of the chambers into an inner cavity 116 and an outer cavity.

As one of the specific embodiments, the method may include, confining the semiconductor cooling chip 106 to the inner cavity 116; the first heat exchange system 120 includes the first working surface of the semiconductor cooling chip 106 and The first fin 109; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106 and the second fin 110; the first fin 109 is limited to the inner cavity 116; The second fin 110 is limited in another chamber; each chamber is correspondingly provided with an air outlet and an air inlet in the housing 100 .

Specifically, the method may further include, placing the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Road 119, the first air inlet 102, the first fan 108 and the first air outlet 101 constitute the first heat exchange system 120; , the second fan 112 , the second air inlet 113 and the second air outlet 114 constitute the second heat exchange system 121 .

Specifically, the method may further include: disposing the first air outlet 101 on the front side of the housing 100; disposing the second air outlet 114 on the top, bottom and rear sides of the housing 100 , the left side or the right side; the first air inlet 102 is arranged on the top surface, the bottom surface, the rear side, the left side or the right side of the housing 100; and, the second air inlet 113 It is arranged on the top surface, the bottom surface, the rear side, the left side or the right side of the housing 100 .

Specifically, the method may further include, supplementing the first working surface of the peltier refrigerating sheet 106 with a first heat conduction substrate 104 so that the first fins 109 are in thermal contact with the first heat conduction substrate 104 ; A second heat conduction substrate 105 is supplemented on the second working surface of the semiconductive cooling sheet 106, so that the second fin 110 is in thermal contact with the second heat conduction substrate 105 through a heat pipe.

Specifically, the method may further include setting a supporting body 115 in the inner cavity 116, and setting a receiving groove on the top surface of the supporting body 115, so that the second working surface of the semiconductor cooling chip 106 is accommodated in the receiving groove Inside. It may also include that a heat pipe hole is provided on the support body 115 so that the heat pipe 111 passes through the heat pipe hole.

As one of the specific embodiments, the method may include, restricting the first working surface and the second working surface of the semiconductive cooling sheet 106 to the inner cavity 116 and the outer cavity respectively; The system 120 includes the first working surface of the semiconductor cooling fin 106 and the first fin 109; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106 and the second fin 110; The first fins 109 are limited to the inner cavity 116; the second fins 110 are limited to another cavity; for each cavity, an air outlet and an air inlet are correspondingly provided in the housing 100 .

Specifically, the method may further include, placing the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Road 119, the first air inlet 102, the first fan 108 and the first air outlet 101 constitute the first heat exchange system 120; , the second fan 112 , the second air inlet 113 and the second air outlet 114 constitute the second heat exchange system 121 .

Specifically, the method may further include: disposing the first air outlet 101 on the front side of the housing 100; disposing the second air outlet 114 on the top, bottom and rear sides of the housing 100 , the left side or the right side; the first air inlet 102 is arranged on the top surface, the bottom surface, the rear side, the left side or the right side of the housing 100; and the second air inlet 113 is arranged on the top surface, bottom surface, rear side, left side or right side of the housing 100 .

Specifically, the method may further include, supplementing the first working surface of the peltier refrigerating sheet 106 with a first heat conduction substrate 104 so that the first fins 109 are in thermal contact with the first heat conduction substrate 104 ; A second heat conduction substrate 105 is supplemented on the second working surface of the semiconductive cooling sheet 106, so that the second fin 110 is in thermal contact with the second heat conduction substrate 105 through a heat pipe.

Specifically, the method may also include setting a support body 115 in the outer cavity, and a receiving groove is arranged on the top surface of the supporting body 115, so that the second working surface of the semiconductor cooling chip 106 is accommodated in the receiving groove . It may also include that a heat pipe hole is provided on the support body 115 so that the heat pipe 111 passes through the heat pipe hole.

As one of the specific implementation methods, the method may include, using at least two partitions 122 arranged vertically, dividing the hollow cavity 107 into at least three chambers, and dividing part of the chambers into an inner cavity 116 and an outer cavity . Specifically, it may be that the hollow cavity 107 is divided into three chambers by two partitions 122 arranged longitudinally, and the middle chamber is divided into an inner cavity 116 and an outer cavity.

As one of the specific embodiments, the method may include, confining the semiconductor cooling chip 106 to the inner cavity 116 of the intermediate chamber; the first heat exchange system 120 includes the first working surface of the semiconductor cooling chip 106 and the first fin 109; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106 and the second fin 110; the first fin 109 is limited to the inner cavity of the intermediate chamber 116 ; the second fins 110 include two sets of fins, which are respectively limited in chambers on both sides; each chamber is provided with an air outlet and an air inlet correspondingly in the housing 100 .

Specifically, the method may further include, placing the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Road 119, the first air inlet 102, the first fan 108 and the first air outlet 101 constitute the first heat exchange system 120; , the second fan 112 , the second air inlet 113 and the second air outlet 114 constitute the second heat exchange system 121 .

Specifically, the method may further include: disposing the first air outlet 101 on the front side of the housing 100; disposing the second air outlet 114 on the top, bottom and rear sides of the housing 100 , the left side or the right side; the first air inlet 102 is arranged on the top surface, the bottom surface, the rear side, the left side or the right side of the housing 100; and, the second air inlet 113 It is arranged on the top surface, the bottom surface, the rear side, the left side or the right side of the housing 100 .

Specifically, the method may further include, supplementing the first working surface of the peltier refrigerating sheet 106 with a first heat conduction substrate 104 so that the first fins 109 are in thermal contact with the first heat conduction substrate 104 ; A second heat conduction substrate 105 is supplemented on the second working surface of the semiconductive cooling sheet 106, so that the second fin 110 is in thermal contact with the second heat conduction substrate 105 through a heat pipe.

Specifically, the method may further include, setting a support body 115 in the inner cavity 116 of the intermediate chamber, and setting a receiving groove on the top surface of the support body 115, and accommodating the second working surface of the semiconductor cooling chip 106 in the in the holding tank. It may also include that a heat pipe hole is provided on the support body 115, and the heat pipe 111 is passed through the heat pipe hole.

As one of the specific embodiments, the method may include, restricting the first working surface and the second working surface of the semiconductive cooling sheet 106 to the inner cavity 116 and the outer cavity of the middle chamber respectively; The system 120 includes the first working surface of the semiconductor cooling fin 106 and the first fin 109; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106 and the second fin 110; The first fins 109 are limited to the inner cavity 116; the second fins 110 include two groups of fins, which are respectively limited to the chambers on both sides; for each chamber, an air outlet and an air inlet are correspondingly provided in the housing 100 .

Specifically, the method may further include, placing the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Road 119, the first air inlet 102, the first fan 108 and the first air outlet 101 constitute the first heat exchange system 120; , the second fan 112 , the second air inlet 113 and the second air outlet 114 constitute the second heat exchange system 121 .

Specifically, the method may further include: disposing the first air outlet 101 on the front side of the housing 100; disposing the second air outlet 114 on the top, bottom and rear sides of the housing 100 , the left side or the right side; the first air inlet 102 is arranged on the top surface, the bottom surface, the rear side, the left side or the right side of the housing 100; and, the second air inlet 113 It is arranged on the top surface, the bottom surface, the rear side, the left side or the right side of the housing 100 .

Specifically, the method may further include, supplementing the first working surface of the peltier refrigerating sheet 106 with a first heat conduction substrate 104 so that the first fins 109 are in thermal contact with the first heat conduction substrate 104 ; A second heat conduction substrate 105 is supplemented on the second working surface of the semiconductive cooling sheet 106, so that the second fin 110 is in thermal contact with the second heat conduction substrate 105 through a heat pipe.

Specifically, the method may further include, setting a support body 115 in the outer cavity of the middle chamber, and setting a receiving groove on the top surface of the support body 115, and accommodating the second working surface of the semiconductor cooling chip 106 in the in the holding tank. It may also include that a heat pipe hole is provided on the support body 115, and the heat pipe 111 is passed through the heat pipe hole.

Specifically, the method may further include setting an air guide grill 103 at the first air outlet 101 . Preferably, an air guiding grid 103 is provided at both the air inlet and the air outlet.

Specifically, the method may further include, supplementing the thermal conductive silicone grease 200 between the first working surface of the semiconductor cooling chip 106 and the first heat conducting substrate 104, The thermal conductive silicone grease 201 is supplemented between the second thermal conductive substrate 105 .

As Embodiment 6, it relates to a method for installing the bottom of a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system 120, a second heat exchange system 121, a semiconductor refrigeration sheet 106, and a casing 100. The casing 100 surrounds Forming a hollow cavity 107, the semiconductor cooling plate 106 includes a first working surface and a second working surface; the first heat exchange system 120 includes the first working surface of the semiconductor cooling plate 106 and first fins 109; The second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106 and the second fins 110; the hollow cavity 107 is divided into at least two chambers by at least one partition 122 arranged vertically, partly A first heat exchange system 120 is provided in the chamber; the chamber provided with the first heat exchange system 120 is divided into an inner cavity 116 and an outer cavity, and the first working surface and the first fins 109 of the semiconductive refrigeration sheet 106 are Confined to said interior cavity 116 , said method comprises the step of integrating said housing 100 into a horizontal housing 313 of a cooker hood.

Specifically, integrating the casing 100 into the horizontal casing 313 of the range hood refers to integrating the casing 100 right in front of the horizontal casing 313 of the range hood.

Specifically, the integration of the casing 100 into the horizontal casing 313 of the range hood means that an insert is provided between the casing 100 and the horizontal casing 313 of the range hood, and the casing 100 and the horizontal casing of the range hood 313 are respectively fixed on the upper and lower sides of the insert so that a certain gap remains between the housing 100 and the horizontal housing 313 of the range hood. The insert may be a U-shaped bracket 317 .

Specifically, the integration of the housing 100 into the horizontal housing 313 of the range hood means that support rods are provided on both side walls of the semiconductor refrigeration module housing 100, and the lower ends of the support rods are fixed to the range hood housing, so that the semiconductor refrigeration module A certain gap is reserved between the casing 100 and the horizontal casing 313 of the range hood.

Fig. 17 is a three-dimensional schematic diagram of the integration of the semiconductor refrigeration module and the horizontal casing of the range hood. It can be seen that the semiconductor refrigeration module can be integrated with the outside of the range hood, can be integrated into the range hood casing, and is preferentially integrated directly in front of the range hood horizontal casing.

The shell of the range hood 151 includes a horizontal shell 313 of the range hood and a shell 310 of the main flue of the range hood. The main flue of range hood is 316. As shown in FIG. 17 , the semiconductor refrigeration module 150 is externally integrated into the horizontal shell 313 of the range hood 151 , and of course it is not limited to being externally integrated directly in front. The range hood control panel 315 can send electric control commands to the semiconductor refrigeration module 150, or the semiconductor refrigeration module has its own control panel for self-control. In a specific embodiment, the air inlets of the hot and cold ends are designed to be located at the lower end of the semiconductor refrigeration module 150, so it is necessary to keep a certain distance between the bottom surface of the module casing 100 and the horizontal casing 313 of the range hood, rather than close contact, so as to keep the The tuyere can communicate with the outside air. For example, a U-shaped bracket 317 is configured by welding or other means at the lower end of the module, and the left, right and front of the bracket are integrated or segmented, so that the rear section of the bracket is empty to ensure air intake. Alternatively, support rods are provided on both side walls of the semiconductor refrigeration module housing 100 , and the lower ends of the support rods are fixed to the range hood housing, so that a certain gap remains between the semiconductor refrigeration module housing 100 and the range hood horizontal housing 313 .

Specifically, the semiconductor refrigeration module installed in this embodiment may be the semiconductor refrigeration module described in any one of Embodiments 1-4.

As Embodiment 7, it relates to a side installation method of a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system 120, a second heat exchange system 121, a semiconductor refrigeration sheet 106, and a casing 100. The casing 100 surrounds Forming a hollow cavity 107, the semiconductor cooling plate 106 includes a first working surface and a second working surface; the first heat exchange system 120 includes the first working surface of the semiconductor cooling plate 106 and first fins 109; The second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106 and the second fins 110; the hollow cavity 107 is divided into at least two chambers by at least one partition 122 arranged vertically, partly A first heat exchange system 120 is provided in the chamber; the chamber provided with the first heat exchange system 120 is divided into an inner cavity 116 and an outer cavity, and the first working surface and the first fins 109 of the semiconductive refrigeration sheet 106 are Confined to the inner cavity 116 , the method includes the step of integrating the housing 100 into the main flue housing 310 of the range hood.

Specifically, the integration of the casing 100 into the main flue casing 310 of the range hood refers to integrating the casing 100 into the casing 310 of the main flue of the range hood right in front.

Specifically, the integration of the casing 100 into the main flue casing 310 of the range hood refers to bonding the casing 100 to the main flue casing 310, or using an elastic ring to fix the semiconductor refrigeration module to the main flue casing 310. .

Preferably, the distance between the casing 100 and the horizontal casing 313 of the range hood is n, wherein n is greater than zero.

Fig. 18 is a three-dimensional schematic diagram of the integration of the semiconductor refrigeration module and the main flue shell of the range hood. It can be seen that the semiconductor refrigeration module 150 can be externally integrated with the range hood 151 , can be integrated into the main flue casing 310 of the range hood, and is preferably integrated directly in front of the main flue casing 310 . Specifically, the semiconductor refrigeration module 150 may be bonded to the main flue casing 310, or an elastic ring may be used to fix the semiconductor refrigeration module 150 to the main flue casing 310, or other methods may be used to fix the semiconductor refrigeration module 150 to the main flue casing 310. Main flue housing 310 way. In a specific implementation, when the semiconductor refrigeration module 150 is externally integrated on the main flue casing 310 of the range hood, the air intake at the hot and cold ends of the module enters from the bottom, and the hot air blows out from the top. At this time, the semiconductor refrigeration module 150 is required An appropriate distance is kept between the lower end and the range hood horizontal casing 313 so that the air inlet can communicate with the outside air.

Specifically, the semiconductor refrigeration module installed in this embodiment may be the semiconductor refrigeration module described in any one of Embodiments 1-4.

The utility model of the utility model is to provide a method for isolating hot and cold air of a semiconductor refrigeration module, the semiconductor refrigeration module is mainly composed of a first heat exchange system 120, a second heat exchange system 121, a semiconductor refrigeration sheet 106 and a casing 100 , the housing 100 encloses a hollow cavity 107, the semiconductor cooling plate 106 includes a first working surface and a second working surface, and the first heat exchange system 120 includes the first working surface and the second working surface of the semiconductor cooling plate 106 A fin 109; the second heat exchange system 121 includes the second working surface of the peltier 106 and the second fin 110; by using at least one partition 122 arranged vertically, the hollow cavity 107 is divided It is at least two chambers, and a first heat exchange system 120 is provided in a part of the chambers; the chamber provided with the first heat exchange system 120 is divided into an inner chamber 116 and an outer chamber, and the first heat exchange system 120 of the semiconductor cooling chip 106 A working surface and the first fin 109 are limited to the inner cavity 116; the second working surface of the semiconductive cooling sheet 106 is limited to the inner cavity 116 or the outer cavity; the first fin 109 and the The second fins 110 are confined in different chambers to realize the isolation of cold and hot air of the semiconductor refrigeration module.

Each chamber bounded by the first fin 109 or the second fin 110 is provided with an air outlet and an air inlet correspondingly in the housing 100 .

As one of specific implementations, the hollow cavity 107 is divided into two chambers by a partition 122 arranged longitudinally, one of which is divided into an inner cavity 116 and an outer cavity.

As one of the specific embodiments, the semiconductor cooling fin 106 is limited to the inner cavity 116; the first heat exchange system 120 includes the first working surface of the semiconductor cooling fin 106 and the first fins 109; The second heat exchange system 121 includes the second working surface of the peltier 106 and the second fin 110; the first fin 109 is limited to the inner cavity 116; the second fin 110 is Confined in another chamber; each chamber is correspondingly provided with an air outlet and an air inlet in the housing 100 .

Specifically, it may be that the first heat exchange system 120 includes the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Wind duct 119, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106, the heat pipe 111, the second fin 110, The second fan 112 , the second air inlet 113 and the second air outlet 114 .

More specifically, it may be that the first air outlet 101 is arranged on the front side of the housing 100; the second air outlet 114 is arranged on the top surface, the bottom surface, the rear side, and the left side of the housing 100 side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side of the casing 100; the second air inlet 113 is arranged on the casing 100's top, bottom, rear, left or right sides.

As one of the specific embodiments, the first working surface and the second working surface of the semiconductor cooling plate 106 are respectively limited to the inner cavity 116 and the outer cavity; the first heat exchange system 120 includes the semiconductor cooling The first working surface of the cooling fin 106 and the first fins 109; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106 and the second fins 110; the first fins 109 are limited to the inner cavity 116 ; the second fin 110 is limited to another cavity; each cavity is provided with an air outlet and an air inlet correspondingly in the housing 100 .

Specifically, it may be that the first heat exchange system 120 includes the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Wind duct 119, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106, the heat pipe 111, the second fin 110, The second fan 112 , the second air inlet 113 and the second air outlet 114 .

More specifically, it may be that the first air outlet 101 is arranged on the front side of the housing 100; the second air outlet 114 is arranged on the top surface, the bottom surface, the rear side, and the left side of the housing 100 side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side of the casing 100; the second air inlet 113 is arranged on the casing 100's top, bottom, rear, left or right sides.

As one of the specific implementations, the hollow cavity 107 is divided into at least three chambers by at least two partitions 122 arranged longitudinally, and some of the chambers are divided into an inner cavity 116 and an outer cavity. Specifically, it may be that the hollow chamber 107 is divided into three chambers by two partitions 122 arranged longitudinally, and the middle chamber is divided into an inner chamber 116 and an outer chamber.

As one of the specific embodiments, the semiconductor cooling fin 106 is limited to the inner cavity 116 of the intermediate chamber; the first heat exchange system 120 includes the first working surface of the semiconductor cooling fin 106 and the first fins 109 The second heat exchange system 121 includes the second working surface of the peltier 106 and the second fin 110; the first fin 109 is limited to the inner chamber 116 of the intermediate chamber; the second The fins 110 include two groups of fins, which are respectively confined in chambers on both sides; each chamber is correspondingly provided with an air outlet and an air inlet in the housing 100 .

Specifically, it may be that the first heat exchange system 120 includes the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Wind duct 119, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106, the heat pipe 111, the second fin 110, The second fan 112 , the second air inlet 113 and the second air outlet 114 .

More specifically, it may be that the first air outlet 101 is arranged on the front side of the housing 100; the second air outlet 114 is arranged on the top surface, the bottom surface, the rear side, and the left side of the housing 100 side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side of the casing 100; the second air inlet 113 is arranged on the casing 100's top, bottom, rear, left or right sides.

As one of the specific embodiments, the first working surface and the second working surface of the semiconductor cooling plate 106 are respectively limited to the inner cavity 116 and the outer cavity of the intermediate chamber; the first heat exchange system 120 includes the semiconductor cooling The first working surface of the cooling fin 106 and the first fins 109; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106 and the second fins 110; the first fins 109 are limited to the inner cavity 116 ; the second fins 110 include two sets of fins, which are respectively limited to the chambers on both sides; each chamber is correspondingly provided with an air outlet and an air inlet in the housing 100 .

Specifically, it may be that the first heat exchange system 120 includes the first working surface of the semiconductor cooling fin 106, the first fins 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet Wind duct 119, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchange system 121 includes the second working surface of the semiconductor cooling fin 106, the heat pipe 111, the second fin 110, The second fan 112 , the second air inlet 113 and the second air outlet 114 .

More specifically, it may be that the first air outlet 101 is arranged on the front side of the housing 100; the second air outlet 114 is arranged on the top surface, the bottom surface, the rear side, and the left side of the housing 100 side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side of the casing 100; the second air inlet 113 is arranged on the casing 100's top, bottom, rear, left or right sides.

The above-mentioned embodiments are only preferred embodiments for fully illustrating the utility model, and the protection scope of the utility model is not limited thereto. The equivalent substitutions or transformations made by those skilled in the art on the basis of the present utility model are all within the protection scope of the present utility model. The scope of protection of the utility model shall be determined by the claims.

Claims (38)

1. A semiconductor refrigeration module, characterized in that: the semiconductor refrigeration module is mainly composed of a first heat exchange system (120), a second heat exchange system (121), a semiconductor refrigeration sheet (106) and a casing (100), so The shell (100) encloses a hollow cavity (107), The semiconductor cooling chip (106) includes a first working surface and a second working surface; The first heat exchange system (120) includes a first working surface and first fins (109) of the semiconductor cooling fin (106); The second heat exchange system (121) includes a second working surface and second fins (110) of the semiconductor cooling fin (106); The hollow cavity (107) is divided into at least two chambers by at least one partition (122) arranged longitudinally, and the first heat exchange system (120) is installed in some chambers; The chamber of the thermal system (120) is divided into an inner chamber (116) and an outer chamber, and the first working surface and the first fins (109) of the semiconductive refrigeration sheet (106) are limited to the inner chamber ( 116). 2. The semiconductor refrigeration module according to claim 1, characterized in that: the second working surface of the semiconductor refrigeration sheet (106) is limited to the inner cavity (116) or the outer cavity; said first fin (109) and said second fin (110) are confined to different chambers; Each chamber bounded by the first fin (109) or the second fin (110) is correspondingly provided with an air outlet and an air inlet in the casing (100). 3. The semiconductor refrigeration module according to claim 2, characterized in that: the hollow cavity (107) is divided into two chambers by a partition (122) arranged longitudinally, and one of the chambers is divided into an inner cavity ( 116) and the external cavity. 4. The semiconductor refrigeration module according to claim 3, characterized in that: the semiconductor refrigeration sheet (106) is limited to the inner cavity (116); The first heat exchange system (120) includes a first working surface and first fins (109) of the semiconductor cooling fin (106); The second heat exchange system (121) includes a second working surface and second fins (110) of the semiconductor cooling fin (106); said first fin (109) is confined to said lumen (116); said second fin (110) is confined within another chamber; Each chamber is correspondingly provided with an air outlet and an air inlet on the casing (100). 5. The semiconductor refrigeration module according to claim 4, characterized in that: the first heat exchange system (120) includes the first working surface of the semiconductor refrigeration sheet (106), the first fins (109), the first air inlet The air nozzle (117), the first air outlet nozzle (118), the first air inlet duct (119), the first air inlet (102), the first fan (108) and the first air outlet (101); The second heat exchanging system (121) includes the second working surface of the semiconductor cooling fin (106), the heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and The second air outlet (114). 6. The semiconductor refrigeration module according to claim 5, characterized in that: the first air outlet (101) is arranged on the front side of the casing (100); the second air outlet (114) is arranged on the The top surface, bottom surface, rear side, left side or right side of the housing (100); the first air inlet (102) is set on the top, bottom, rear side, left side of the housing (100) Side or right side; the second air inlet (113) is arranged on the top surface, bottom surface, rear side, left side or right side of the casing (100). 7. The semiconductive refrigeration module according to claim 6, characterized in that: the first working surface of the semiconductive refrigeration sheet (106) is supplemented with a first heat conduction substrate (104), and the first fin (109) and the thermally contacting the first thermally conductive substrate (104). 8. The semiconductive refrigeration module according to claim 7, characterized in that: the second working surface of the semiconductive refrigeration sheet (106) is supplemented by a second heat conduction substrate (105), and the second fin (110) and the The second thermally conductive substrate (105) is in thermal contact. 9. The semiconductor refrigeration module according to claim 6, characterized in that: the inner cavity (116) is provided with a support body (115), the top surface of the support body (115) is provided with a receiving groove, and the semiconductor refrigeration sheet (106 ) The second working surface is accommodated in the accommodating groove. 10. The semiconductor refrigeration module according to claim 9, characterized in that: the support body (115) is a poor conductor of heat, the support body (115) is provided with a heat pipe hole, and the heat pipe (111) runs through the heat pipe hole. 11. The semiconductor refrigeration module according to claim 3, characterized in that: the first working surface and the second working surface of the semiconductor refrigeration sheet (106) are respectively limited to the inner cavity (116) and the outer cavity; The first heat exchange system (120) includes a first working surface and first fins (109) of the semiconductor cooling fin (106); The second heat exchange system (121) includes a second working surface and second fins (110) of the semiconductor cooling fin (106); said first fin (109) is confined to said lumen (116); said second fin (110) is confined within another chamber; Each chamber is correspondingly provided with an air outlet and an air inlet on the casing (100). 12. The semiconductor refrigeration module according to claim 11, characterized in that: the first heat exchange system (120) includes the first working surface of the semiconductor refrigeration sheet (106), the first fins (109), the first air inlet The air nozzle (117), the first air outlet nozzle (118), the first air inlet duct (119), the first air inlet (102), the first fan (108) and the first air outlet (101); The second heat exchanging system (121) includes the second working surface of the semiconductor cooling fin (106), the heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and The second air outlet (114). 13. The semiconductor refrigeration module according to claim 12, characterized in that: the first air outlet (101) is arranged on the front side of the casing (100); the second air outlet (114) is arranged on the The top surface, bottom surface, rear side, left side or right side of the housing (100); the first air inlet (102) is set on the top, bottom, rear side, left side of the housing (100) Side or right side; the second air inlet (113) is arranged on the top surface, bottom surface, rear side, left side or right side of the casing (100). 14. The semiconductive refrigeration module according to claim 13, characterized in that: the first working surface of the semiconductive refrigeration sheet (106) is supplemented with a first heat conduction substrate (104), and the first fin (109) and the thermally contacting the first thermally conductive substrate (104). 15. The semiconductive refrigeration module according to claim 13, characterized in that: the second working surface of the semiconductive refrigeration sheet (106) is supplemented with a second heat conduction substrate (105), and the second fin (110) and the The second thermally conductive substrate (105) is in thermal contact. 16. The semiconductor refrigeration module according to claim 13, characterized in that: the outer cavity is provided with a support body (115), the top surface of the support body (115) is provided with a receiving groove, and the first semiconductor refrigeration sheet (106) The two working surfaces are accommodated in the accommodating groove. 17. The semiconductor refrigeration module according to claim 16, characterized in that: the support body (115) is a poor conductor of heat, the support body (115) is provided with a heat pipe hole, and the heat pipe (111) runs through the heat pipe hole. 18. The semiconductor refrigeration module according to claim 2, characterized in that: the hollow cavity (107) is divided into at least three chambers by at least two partitions (122) arranged longitudinally, and part of the chambers are divided into inner cavity (116) and external cavity. 19. The semiconductor refrigeration module according to claim 18, characterized in that: the hollow cavity (107) is divided into three chambers by two partitions (122) arranged longitudinally, and the middle chamber is divided into an inner cavity ( 116) and the external cavity. 20. The semiconductor refrigeration module according to claim 19, characterized in that: the semiconductor refrigeration sheet (106) is limited to the inner cavity (116) of the intermediate chamber; The first heat exchange system (120) includes a first working surface and first fins (109) of the semiconductor cooling fin (106); The second heat exchange system (121) includes a second working surface and second fins (110) of the semiconductor cooling fin (106); said first fin (109) is confined to the lumen (116) of the intermediate chamber; The second fins (110) include two groups of fins, which are respectively confined in chambers on both sides; Each chamber is correspondingly provided with an air outlet and an air inlet on the casing (100). 21. The semiconductor refrigeration module according to claim 20, characterized in that: the first heat exchange system (120) includes the first working surface of the semiconductor refrigeration sheet (106), the first fins (109), the first air inlet The air nozzle (117), the first air outlet nozzle (118), the first air inlet duct (119), the first air inlet (102), the first fan (108) and the first air outlet (101); The second heat exchanging system (121) includes the second working surface of the semiconductor cooling fin (106), the heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and The second air outlet (114). 22. The semiconductor refrigeration module according to claim 21, characterized in that: the first air outlet (101) is arranged on the front side of the casing (100); the second air outlet (114) is arranged on the The top surface, bottom surface, rear side, left side or right side of the housing (100); the first air inlet (102) is set on the top, bottom, rear side, left side of the housing (100) Side or right side; the second air inlet (113) is arranged on the top surface, bottom surface, rear side, left side or right side of the casing (100). 23. The semiconductive refrigeration module according to claim 22, characterized in that: the first working surface of the semiconductive refrigeration sheet (106) is supplemented with a first heat conduction substrate (104), and the first fin (109) and the thermally contacting the first thermally conductive substrate (104). 24. The semiconductive refrigeration module according to claim 22, characterized in that: the second working surface of the semiconductive refrigeration sheet (106) is supplemented with a second heat conduction substrate (105), and the second fin (110) and the The second thermally conductive substrate (105) is in thermal contact. 25. The semiconductor refrigeration module according to claim 22, characterized in that: the inner cavity (116) of the intermediate chamber is provided with a support body (115), and the top surface of the support body (115) is provided with a receiving groove, and the semiconductor refrigeration module The second working surface of the refrigeration sheet (106) is accommodated in the accommodation groove. 26. The semiconductor refrigeration module according to claim 25, characterized in that: the support body (115) is a poor conductor of heat, the support body (115) is provided with a heat pipe hole, and the heat pipe (111) runs through the heat pipe hole. 27. The semiconductor refrigeration module according to claim 19, characterized in that: the first working surface and the second working surface of the semiconductor refrigeration sheet (106) are respectively limited to the inner cavity (116) and outer cavity of the middle chamber; The first heat exchange system (120) includes a first working surface and first fins (109) of the semiconductor cooling fin (106); The second heat exchange system (121) includes a second working surface and second fins (110) of the semiconductor cooling fin (106); said first fin (109) is confined to said lumen (116); The second fins (110) include two groups of fins, which are respectively confined in chambers on both sides; Each chamber is correspondingly provided with an air outlet and an air inlet on the casing (100). 28. The semiconductor refrigeration module according to claim 27, characterized in that: the first heat exchange system (120) includes the first working surface of the semiconductor refrigeration sheet (106), the first fins (109), the first air inlet The air nozzle (117), the first air outlet nozzle (118), the first air inlet duct (119), the first air inlet (102), the first fan (108) and the first air outlet (101); The second heat exchanging system (121) includes the second working surface of the semiconductor cooling fin (106), the heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and The second air outlet (114). 29. The semiconductor refrigeration module according to claim 28, characterized in that: the first air outlet (101) is arranged on the front side of the casing (100); the second air outlet (114) is arranged on the The top surface, bottom surface, rear side, left side or right side of the housing (100); the first air inlet (102) is set on the top, bottom, rear side, left side of the housing (100) Side or right side; the second air inlet (113) is arranged on the top surface, bottom surface, rear side, left side or right side of the casing (100). 30. The semiconductive refrigeration module according to claim 29, characterized in that: the first working surface of the semiconductive refrigeration sheet (106) is supplemented with a first heat conduction substrate (104), and the first fin (109) and the thermally contacting the first thermally conductive substrate (104). 31. The semiconductive refrigeration module according to claim 30, characterized in that: the second working surface of the semiconductive refrigeration sheet (106) is supplemented with a second heat conduction substrate (105), and the second fin (110) and the The second thermally conductive substrate (105) is in thermal contact. 32. The semiconductor refrigeration module according to claim 29, characterized in that: the outer cavity of the middle chamber is provided with a support body (115), the top surface of the support body (115) is provided with a receiving groove, and the semiconductor refrigeration sheet ( 106) the second working surface is accommodated in the accommodating groove. 33. The semiconductor refrigeration module according to claim 32, characterized in that: the support body (115) is a poor conductor of heat, the support body (115) is provided with a heat pipe hole, and the heat pipe (111) runs through the heat pipe hole. 34. The semiconductor refrigeration module according to any one of claims 5, 6, 12, 13, 21, 22, 28, 29, characterized in that the first air outlet (101) is provided with an air guide grid (103) . 35. The semiconductor refrigeration module according to claim 34, characterized in that, both the air inlet and the air outlet are provided with air guide grids (103). 36. The semiconductive refrigeration module according to any one of claims 7, 14, 23 or 30, characterized in that: the first working surface of the semiconductive refrigeration sheet (106) and the first heat conduction substrate (104) are supplemented by Thermal grease (200). 37. The semiconductive refrigeration module according to any one of claims 8, 15, 24 or 31, characterized in that: the second working surface of the semiconductive refrigeration sheet (106) and the second heat conduction substrate (105) are supplemented by Thermal grease (201). 38. A range hood, characterized in that the range hood comprises the semiconductor refrigeration module according to any one of claims 1-37.