CN105805865B - Side mounting method of semiconductor refrigeration module - Google Patents

Abstract

The invention discloses a side installation method of a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing, the casing encloses a hollow cavity, and the semiconductor refrigeration The sheet includes a first working surface and a second working surface; the hollow cavity is divided into at least two chambers by at least one partition arranged longitudinally; the semiconductor refrigeration sheet is confined in part of the chamber, and/or the The first working surface and the second working surface of the semiconductor refrigeration sheet are respectively confined in different chambers; the method includes the step of integrating the casing into the casing of the main flue of the range hood. By physically isolating the two heat exchange systems, the energy utilization efficiency is improved.

Description

Side Mounting Method of Semiconductor Refrigeration Module

technical field

The invention relates to a side mounting method of a semiconductor refrigeration module.

Background technique

Cooking beside the kitchen stove is a hard housework, especially in summer. The hot weather and the heat from the stove make the working environment in the kitchen very harsh.

In order to solve the problem of overheating in the kitchen, some people install fans or air conditioners in the kitchen. However, the cooling effect of fans is average, and it will affect the normal operation of the gas stove, and there are also potential safety hazards. Due to the special lampblack environment in the kitchen, after the fan has been used for a period of time, a large amount of putty is attached to the fan, which is difficult to clean and also causes pollution to the kitchen environment.

The installation of air-conditioning equipment in the kitchen, on the one hand, has the problem of cost, and on the other hand, there is also the problem of difficulty in cleaning. After the oil fume is attached to the surface of the air-conditioning heat exchanger, there is also a problem that the cooling effect is reduced.

SUMMARY OF THE INVENTION

In order to solve the problems existing in the prior art, such as high cost of using an air conditioner in a kitchen, difficulty in cleaning and low temperature adjustment effect, the present invention provides a semiconductor refrigeration module, which is installed and applied to a range hood.

As an aspect of the present invention, it relates to a side installation method of a semiconductor refrigeration module, the semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing, and the casing encloses a hollow cavity , the semiconductor refrigerating sheet includes a first working surface and a second working surface; the hollow cavity is divided into at least two chambers by at least one partition plate arranged longitudinally; the semiconductor refrigerating sheet is limited in part of the cavity, And/or the first working surface and the second working surface of the semiconducting sheet are respectively confined in different chambers; the first heat exchange system includes the first working surface and the first fin of the semiconducting sheet ; the second heat exchange system includes the second working surface of the semiconductor refrigeration fin and the second fin; the first fin and the second fin are confined in different chambers; each confinement has In the cavity of the first fin or the second fin, an air outlet and an air inlet are correspondingly provided in the casing, and the method includes the step of integrating the casing into the casing of the main flue of the range hood.

Specifically, the integration of the casing into the casing of the main flue of the range hood refers to the integration of the casing into the casing of the main flue of the range hood directly in front of the casing.

Specifically, the integration of the casing into the main flue casing of the range hood refers to adhering the casing to the main flue casing, or using an elastic ring to fix the semiconductor refrigeration module to the main flue casing.

Preferably, the distance between the casing and the horizontal casing of the range hood is n, where n is greater than zero.

As one of the specific embodiments, the hollow cavity is divided into two chambers by a partition plate arranged longitudinally.

As one of the specific embodiments, the first working surface and the second working surface of the semiconductor refrigeration sheet are respectively confined in two chambers; the first heat exchange system includes the first working surface of the semiconductor refrigeration sheet and the the first fin; the second heat exchange system includes the second working surface of the semiconductor refrigeration fin and the second fin; the first heat exchange system and the second heat exchange system are respectively limited to two In the chamber; each chamber is provided with an air outlet and an air inlet correspondingly in the casing.

Specifically, the first heat exchange system includes a first working surface of a semiconductor refrigeration fin, a first fin, a first air inlet, a first fan and a first air outlet; the second heat exchange system includes a semiconductor refrigeration fin The second working surface, the second fin, the second fan, the second air inlet and the second air outlet.

More specifically, one of the first air outlet and the second air outlet is arranged on the front side of the housing, and the other is arranged on the top surface, bottom surface, rear side, left side or the right side; the first air inlet is arranged on the top, bottom, rear, left or right side; the second air inlet is arranged on the top, bottom, rear, left or right side.

As one of the specific implementations, the hollow cavity is divided into three chambers by two partitions arranged longitudinally.

As one of the specific embodiments, the semiconductor refrigeration sheet is confined in the middle chamber; the first heat exchange system includes a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system The system includes a second working surface of the semiconductor refrigeration fin and a second fin; the first fin is confined to the middle chamber, and the second fin includes two sets of fins, which are respectively confined to two sides In the chamber; each chamber is provided with an air outlet and an air inlet correspondingly in the casing.

Specifically, the first heat exchange system includes a first working surface of a semiconductor refrigeration fin, a first fin, a first air inlet, a first fan and a first air outlet; the second heat exchange system includes a semiconductor refrigeration fin The second working surface, the heat pipe, the second fin, the second fan, the second air inlet and the second air outlet.

More specifically, one of the first air outlet and the second air outlet is arranged on the front side of the casing, and the other is arranged on the top, bottom, rear and left sides of the casing. or the right side; the first air inlet is arranged on the top surface, bottom surface, rear side, left side or right side; the second air inlet is arranged on the top surface, bottom surface, rear side, left side or the right side.

As one of the specific embodiments, the first working surface of the semiconductor refrigeration sheet is restricted in one side chamber, and the second working surface is restricted in the middle chamber; the first heat exchange system includes the semiconductor refrigeration sheet a first working surface and a first fin; the second heat exchange system includes a second working surface of the semiconductor refrigeration fin and a second fin; the first fin is confined to a side chamber, the The second fin includes two groups of fins, which are respectively confined in the middle chamber and the other side chamber; and each chamber is provided with an air outlet and an air inlet correspondingly in the housing.

Specifically, the first heat exchange system includes a first working surface of a semiconductor refrigeration fin, a first fin, a first air inlet, a first fan and a first air outlet; the second heat exchange system includes a semiconductor refrigeration fin The second working surface, the heat pipe, the second fin, the second fan, the second air inlet and the second air outlet.

More specifically, one of the first air outlet and the second air outlet is arranged on the front side of the casing, and the other is arranged on the top, bottom, rear and left sides of the casing. or the right side; the first air inlet is arranged on the top surface, bottom surface, rear side, left side or right side; the second air inlet is arranged on the top surface, bottom surface, rear side, left side or the right side.

As another aspect of the present invention, it relates to a semiconductor refrigeration module, the semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing, the casing encloses a hollow cavity, and the The semiconductor refrigeration sheet includes a first working surface and a second working surface; the hollow cavity is divided into at least two chambers by at least one partition plate arranged longitudinally; the semiconductor refrigeration sheet is confined in part of the chamber, and/or The first working surface and the second working surface of the semiconductor refrigeration sheet are respectively confined in different chambers; the first heat exchange system includes the first working surface and the first fin of the semiconductor refrigeration sheet; the The second heat exchange system includes a second working surface of the refrigerating fin and a second fin; the first fin and the second fin are confined in different chambers; each confines a first fin In the cavity of the fin or the second fin, an air outlet and an air inlet are correspondingly arranged in the casing.

As a third aspect of the present invention, it relates to a range hood comprising the aforementioned semiconductor refrigeration module.

As a fourth aspect of the present invention, it relates to a method for preparing a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing, and the casing encloses a hollow space. cavity, the semiconducting refrigerating sheet includes a first working surface and a second working surface; the first heat exchange system includes a first working surface and a first fin of the semiconducting refrigerating sheet, and the second heat exchange system includes For the second working surface and the second fin of the semiconductor refrigeration sheet, the method includes the step of dividing the hollow cavity into at least two chambers with at least one partition plate arranged longitudinally.

The method may further include the steps of confining the cryocooler chip within a portion of the chamber, and/or confining the first working surface and the second working surface of the cryocooler chip into different chambers, respectively.

The method may further include the step of confining the first fin and the second fin into different chambers.

As one of the embodiments, each cavity limited by the first fin or the second fin is provided with an air outlet and an air inlet corresponding to the casing.

As a fifth aspect of the present invention, it relates to a bottom installation method for a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing, and the casing encloses a A hollow cavity, the semiconductor refrigeration sheet includes a first working surface and a second working surface; the hollow cavity is divided into at least two chambers by at least one partition plate arranged longitudinally; the semiconductor refrigeration sheet is limited to part of the cavity indoors, and/or the first working surface and the second working surface of the semiconductor refrigeration sheet are respectively confined to different chambers; the first heat exchange system includes the first working surface and the first working surface of the semiconductor refrigeration sheet fins; the second heat exchange system includes a second working surface of the semiconductor refrigeration fin and a second fin; the first fin and the second fin are confined within different chambers; each A cavity limited by the first fin or the second fin is provided with an air outlet and an air inlet corresponding to the casing, and the method includes the step of integrating the casing into the horizontal casing of the range hood.

Specifically, the integration of the housing into the horizontal housing of the range hood refers to integrating the housing into the front of the horizontal housing of the range hood.

Specifically, the integration of the casing into the horizontal casing of the cooker hood means that an insert is arranged between the casing and the horizontal casing of the cooker hood, and the casing and the horizontal casing of the cooker hood are respectively fixed to the insert. the upper and lower sides of the hood, so that a certain gap is reserved between the casing and the horizontal casing of the range hood. The insert may be a U-shaped bracket.

Specifically, the integration of the housing into the horizontal housing of the range hood means that support rods are provided on both side walls of the semiconductor refrigeration module housing, and the lower ends of the support rods are fixed to the range hood housing, so that the housing of the semiconductor refrigeration module is connected to the range hood housing. A certain gap is reserved between the horizontal casings of the range hood.

As a sixth aspect of the present invention, it relates to a cold and hot air isolation method for a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a casing. Enclosing a hollow cavity, the semiconductor refrigeration fin includes a first working surface and a second working surface, the first heat exchange system includes a first working surface and a first fin of the semiconductor refrigeration fin; the second heat exchanger The thermal system includes the second working surface of the semiconductor refrigeration sheet and the second fin; the hollow cavity is divided into at least two chambers by using at least one partition plate arranged in the longitudinal direction; the semiconductor refrigeration sheet is limited to Part of the cavity, and/or confine the first working surface and the second working surface of the semiconductor refrigeration sheet to different cavities respectively; confine the first fin and the second fin to different cavities Indoors; and, making each chamber limited with the first fin or the second fin, correspondingly set an air outlet and an air inlet in the outer casing, so as to realize the isolation of cold and hot air of the semiconductor refrigeration module.

The embodiments of the present invention achieve at least the following beneficial effects:

1. The semiconductor refrigeration module provided by the present invention has simple and compact structure design, simple manufacture and low cost;

2. In the present invention, the module housing equipped with the semiconductor refrigeration module is installed on the horizontal housing of the range hood housing or on the main flue housing, which does not occupy the volume of the inner cavity of the range hood housing, so it does not affect the range hood. The inner structure of the shell is not only easy to install and disassemble, but also easy to clean and maintain.

3. By physically isolating the two heat exchange systems, the energy utilization efficiency is effectively improved.

Description of drawings

1 is a schematic top view of a semiconductor refrigeration module according to one embodiment of the present invention;

2 is a right side view of a semiconductor refrigeration module according to one embodiment of the present invention;

3 is a front view of the internal structure of a semiconductor refrigeration module according to one embodiment of the present invention;

4 is a three-dimensional schematic diagram of a semiconductor refrigeration module housing according to one embodiment of the present invention;

5 is a schematic top view of the semiconductor refrigeration module according to the second embodiment of the present invention;

6 is a right side view of the semiconductor refrigeration module according to the second embodiment of the present invention;

7 is a front view of the internal structure of the semiconductor refrigeration module according to the second embodiment of the present invention;

8 is a three-dimensional schematic diagram of a semiconductor refrigeration module housing according to Embodiment 2 of the present invention;

9 is a schematic top view of a semiconductor refrigeration module according to Embodiment 3 of the present invention;

10 is a right side view of the semiconductor refrigeration module according to the third embodiment of the present invention;

11 is a front view of the internal structure of the semiconductor refrigeration module according to the third embodiment of the present invention;

12 is a three-dimensional schematic diagram of a semiconductor refrigeration module housing according to Embodiment 3 of the present invention;

13 is a schematic top view of a semiconductor refrigeration module according to Embodiment 4 of the present invention;

14 is a right side view of the semiconductor refrigeration module according to the fourth embodiment of the present invention;

15 is a front view of the internal structure of the semiconductor refrigeration module according to the fourth embodiment of the present invention;

16 is a three-dimensional schematic diagram of a semiconductor refrigeration module housing according to Embodiment 4 of the present invention;

17 is a perspective view of the semiconductor refrigeration module of the present invention installed on the horizontal casing of the range hood;

FIG. 18 is a perspective view of installing the semiconductor refrigeration module on the main flue casing of the range hood according to the present invention.

Detailed ways

The present invention is further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

Embodiments of the present invention provide a semiconductor refrigeration module and a range hood externally integrated with the refrigeration module. The semiconductor cooling module is based on semiconductor cooling fins, and is combined with fins for heat exchange, and the cooling or heat generated by the energization of the semiconductor cooling fins is blown out through a fan. It can generate a local cold environment or hot environment for users to meet the comfort requirements of people. The semiconductor refrigeration chip has two working surfaces, the upper end is the first working surface, and the lower end is the second working surface. When the first working surface is the hot end, the second working surface is the cold end; when the first working surface is the cold end , the second working surface is the hot end. The semiconductor refrigeration module can be integrated with the outside of the cooker hood, can be integrated into the upper end of the horizontal part of the cooker hood shell, or integrated into the front of the shell of the main flue of the cooker hood. The refrigeration module can work independently, or can be intelligently linked with the range hood.

A prominent feature of the semiconductor refrigeration module provided by the present invention is that the first heat exchange system and the second heat exchange system are partially or even completely physically isolated, which can effectively prevent the bidirectional flow of heat energy and cold energy generated by the semiconductor refrigeration sheet. , improve energy utilization efficiency and reduce power consumption.

In a specific embodiment, the cooling module has two working modes: cool mode and warm mode: when the cool mode is pressed, the upper end of the semiconductor refrigeration sheet is the cold end, the lower end is the hot end, and the air outlet in front of the module emits cold air; In mode, the upper end of the semiconductor refrigeration chip is the hot end, the lower end is the cold end, and the air outlet in front of the module emits hot air. Hereinafter, the cool mode will be described as an example.

The present invention provides a semiconductor refrigeration module, the semiconductor refrigeration module is mainly composed of a first heat exchange system 120, a second heat exchange system 121, a semiconductor refrigeration sheet 106 and a casing 100, the casing 100 encloses a hollow cavity 107, the The semiconductor refrigeration sheet 106 includes a first working surface and a second working surface; the hollow cavity 107 is divided into at least two chambers by at least one partition 122 arranged longitudinally; the semiconductor refrigeration sheet 106 is limited in part of the cavity , and/or the first working surface and the second working surface of the semiconducting sheet 106 are respectively confined in different chambers; the first heat exchange system 120 includes the first working surface and the second working surface of the semiconducting sheet 106 The first fin 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration fin 106 and the second fin 110; the first fin 109 and the second fin 110 are restricted In different chambers; each chamber limited by the first fins 109 or the second fins 110 is provided with an air outlet and an air inlet in the housing 100 .

As Embodiment 1, referring to FIGS. 1-4 , the hollow cavity 107 is divided into two chambers by a partition 122 arranged longitudinally. The first working surface and the second working surface of the semiconductor refrigeration sheet 106 are respectively confined in two chambers; the first heat exchange system 120 includes the first working surface and the first fin of the semiconductor cooling sheet 106 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration sheet 106 and the second fins 110; the first heat exchange system 120 and the second heat exchange system 121 are respectively limited to Inside the two chambers; each chamber is provided with an air outlet and an air inlet correspondingly in the housing 100 .

Specifically, the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106, the first fins 109, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchanger The thermal system 121 includes the second working surface of the semiconductor refrigeration sheet 106 , the second fins 110 , the second fan 112 , the second air inlet 113 and the second air outlet 114 .

More specifically, one of the first air outlet 101 and the second air outlet 114 is arranged on the front side of the housing 100 , and the other is arranged on the top surface, bottom surface, rear side, Left side or right side; the first air inlet 102 is arranged on the top, bottom, rear, left or right side; the second air inlet 113 is arranged on the top, bottom, rear Side, left or right side.

Specifically, the first working surface of the semiconductor refrigeration sheet 106 is supplemented by a first thermally conductive substrate 104, and the first fins 109 are in thermal contact with the first thermally conductive substrate 104; The second working surface is supplemented by a second thermally conductive substrate 105 , and the second fins 110 are in thermal contact with the second thermally conductive substrate 105 .

As Embodiment 2, referring to FIGS. 5-8 , the hollow cavity 107 is divided into two chambers by a partition 122 arranged longitudinally. The semiconductor refrigeration sheet 106 is confined in one of the chambers; the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106 and the first fins 109; the second heat exchange system 121 includes The second working surface of the semiconductor refrigeration sheet 106 and the second fins 110; the first fins 109 and the second fins 110 are confined in different chambers; each chamber, in the housing 100 corresponds to an air outlet and an air inlet.

Specifically, the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106, the first fins 109, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchanger The thermal system 121 includes a second working surface of the semiconductor refrigeration sheet 106 , a heat pipe 111 , a second fin 110 , a second fan 112 , a second air inlet 113 and a second air outlet 114 .

More specifically, among the first air outlet 101 and the second air outlet 114 , one is provided on the front side of the housing 100 , and the other is provided on the top, bottom, and rear sides of the housing 100 . , left side or right side; the first air inlet 102 is arranged on the top, bottom, rear, left or right side; the second air inlet 113 is arranged on the top, bottom, Rear side, left side or right side.

Specifically, the first working surface of the semiconductor refrigeration sheet 106 is supplemented by a first thermally conductive substrate 104, and the first fins 109 are in thermal contact with the first thermally conductive substrate 104; The second working surface is supplemented by a second thermally conductive substrate 105, and the second fins 110 are in thermal contact with the second thermally conductive substrate 105 through a heat pipe.

A support body 115 may also be provided in the chamber bounded by the semiconductor refrigeration chip 106 , a receiving groove is formed on the top surface of the support body 115 , and the second working surface of the semiconductor refrigeration chip 106 is received in the receiving groove. The support body 115 is a poor conductor of heat, the support body 115 is provided with a heat pipe hole, and the heat pipe 111 penetrates through the heat pipe hole.

As Embodiment 3, referring to FIGS. 9-12 , the hollow cavity 107 is divided into at least three chambers by at least two partitions 122 arranged longitudinally. Specifically, the hollow cavity 107 is divided into three chambers by two partitions 122 arranged longitudinally.

The semiconductor refrigeration sheet 106 is confined in the middle chamber; the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106 and the first fins 109; the second heat exchange system 121 includes The second working surface of the semiconductor refrigeration sheet 106 and the second fins 110; the first fins 109 are limited to the middle chamber, and the second fins 110 include two groups of fins, which are respectively limited to In the chambers on both sides; each chamber is provided with an air outlet and an air inlet correspondingly in the casing 100 .

Specifically, the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106, the first fins 109, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchanger The thermal system 121 includes a second working surface of the semiconductor refrigeration sheet 106 , a heat pipe 111 , a second fin 110 , a second fan 112 , a second air inlet 113 and a second air outlet 114 .

More specifically, among the first air outlet 101 and the second air outlet 114 , one is provided on the front side of the housing 100 , and the other is provided on the top, bottom, and rear sides of the housing 100 . , left side or right side; the first air inlet 102 is arranged on the top, bottom, rear, left or right side; the second air inlet 113 is arranged on the top, bottom, Rear side, left side or right side.

Specifically, the first working surface of the semiconductor refrigeration sheet 106 is supplemented by a first thermally conductive substrate 104, and the first fins 109 are in thermal contact with the first thermally conductive substrate 104; The second working surface is supplemented by a second thermally conductive substrate 105, and the second fins 110 are in thermal contact with the second thermally conductive substrate 105 through a heat pipe.

A support body 115 may also be provided in the intermediate chamber, a top surface of the support body 115 is provided with an accommodating groove, and the second working surface of the semiconductor refrigeration chip 106 is accommodated in the accommodating groove. The support body 115 is a poor conductor of heat, the support body 115 is provided with a heat pipe hole, and the heat pipe 111 penetrates through the heat pipe hole.

As Example 4, referring to FIGS. 13-16 , the hollow cavity 107 is divided into three chambers by two partitions 122 arranged longitudinally.

The first working surface of the semiconductor refrigeration sheet 106 is confined in one side chamber, and the second working surface is confined in the middle chamber; the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106 and the first fin 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration sheet 106 and the second fin 110; the first fin 109 is limited to one side of the chamber, so The second fin 110 includes two groups of fins, which are respectively confined in the middle chamber and the other side chamber; each chamber is provided with an air outlet and an air inlet corresponding to the housing 100 .

Specifically, the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106, the first fins 109, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchanger The thermal system 121 includes a second working surface of the semiconductor refrigeration sheet 106 , a heat pipe 111 , a second fin 110 , a second fan 112 , a second air inlet 113 and a second air outlet 114 .

More specifically, among the first air outlet 101 and the second air outlet 114 , one is provided on the front side of the housing 100 , and the other is provided on the top, bottom, and rear sides of the housing 100 . , left side or right side; the first air inlet 102 is arranged on the top, bottom, rear, left or right side; the second air inlet 113 is arranged on the top, bottom, Rear side, left side or right side.

Specifically, the first working surface of the semiconductor refrigeration sheet 106 is supplemented by a first thermally conductive substrate 104, and the first fins 109 are in thermal contact with the first thermally conductive substrate 104; The second working surface is supplemented by a second thermally conductive substrate 105, and the second fins 110 are in thermal contact with the second thermally conductive substrate 105 through a heat pipe.

In the semiconductor refrigeration module shown in Embodiments 1-4, the air outlet provided on the front side of the casing 100 may be provided with an air guide grid 103 . Preferably, both the air inlet and the air outlet may be provided with air guide grilles 103 .

In the semiconductor refrigeration modules shown in Embodiments 1-4, thermal conductive silicone grease 200 may be supplemented between the first working surface of the semiconductor refrigeration sheet 106 and the first thermally conductive substrate 104 . ; The second working surface of the semiconductor refrigeration sheet 106 and the second thermal conductive substrate 105 may also be supplemented with thermal conductive silicone grease 201 .

In the semiconductor refrigeration module shown in Embodiments 1-4, the first heat exchange system 120 may further include a first air inlet nozzle 117 and a first air outlet nozzle 118 .

The present invention also provides a range hood comprising the aforementioned semiconductor refrigeration module.

As Embodiment 5, it relates to the preparation method of the semiconductor refrigeration module described in Embodiments 1-4. The semiconductor refrigeration module is mainly composed of a first heat exchange system 120 , a second heat exchange system 121 , a semiconductor refrigeration sheet 106 and a housing 100 . The shell 100 encloses a hollow cavity 107, the semiconductor refrigeration sheet 106 includes a first working surface and a second working surface; the first heat exchange system 120 includes a first working surface and a first fin of the semiconductor refrigeration sheet 106 sheet 109, the second heat exchange system 121 includes the second working surface of the refrigerating sheet 106 and the second fin 110, the method includes, with at least one partition 122 disposed longitudinally, the hollow cavity 107 The step of dividing into at least two chambers.

The method may further include the steps of confining the refrigerating chip 106 in a portion of the chamber, and/or confining the first working surface and the second working surface of the refrigerating chip 106 in different chambers, respectively.

The method may also include the step of confining the first fin 109 and the second fin 110 to different chambers.

As one of the embodiments, each cavity limited by the first fins 109 or the second fins 110 is provided with an air outlet and an air inlet corresponding to the housing 100 .

As one of the specific implementations, a longitudinally arranged partition 122 is used to divide the hollow cavity 107 into two chambers.

As one of the specific embodiments, the method further includes: confining the first working surface and the second working surface of the semiconductor refrigeration sheet 106 in two chambers respectively; the first heat exchange system 120 includes the semiconductor The first working surface and the first fins 109 of the refrigeration sheet 106; the second heat exchange system 121 includes the second working surface and the second fins 110 of the semiconductor refrigeration sheet 106; the first heat exchange system 120 and the second heat exchange system 121 are respectively confined in two chambers; each chamber is provided with an air outlet and an air inlet correspondingly in the housing 100 .

Specifically, the method further includes: forming the first working surface of the semiconductor refrigeration sheet 106 , the first fins 109 , the first air inlet 102 , the first fan 108 and the first air outlet 101 to form the first heat exchanger. Thermal system 120 : The second heat exchange system 121 is constituted by the second working surface of the semiconductor refrigeration sheet 106 , the second fins 110 , the second fan 112 , the second air inlet 113 and the second air outlet 114 .

Specifically, the method further includes: arranging one of the first air outlet 101 and the second air outlet 114 on the front side of the housing 100 , and the other on the top surface of the housing 100 , bottom surface, rear side, left side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side; and the second air inlet 113 is arranged on the top, bottom, rear, left or right side.

Specifically, the method further includes, supplementing the first working surface of the semiconductor refrigeration sheet 106 with a first thermally conductive substrate 104, so that the first fins 109 are in thermal contact with the first thermally conductive substrate 104; A second thermally conductive substrate 105 is supplemented on the second working surface of the semiconductor refrigeration sheet 106 , so that the second fins 110 are in thermal contact with the second thermally conductive substrate 105 .

As one specific embodiment, the method further includes: confining the semiconductor refrigeration sheet 106 in one of the chambers; the first heat exchange system 120 includes a first working surface of the semiconductor refrigeration sheet 106 and a first working surface of the semiconductor refrigeration sheet 106 . Fins 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration sheet 106 and the second fins 110; the first fins 109 and the second fins 110 are limited to different In each chamber, an air outlet and an air inlet are correspondingly arranged in the casing 100 .

Specifically, the method further includes: forming the first working surface of the semiconductor refrigeration sheet 106 , the first fins 109 , the first air inlet 102 , the first fan 108 and the first air outlet 101 to form the first cooling device. Thermal system 120; the second working surface of the semiconductor refrigeration sheet 106, the heat pipe 111, the second fin 110, the second fan 112, the second air inlet 113 and the second air outlet 114 constitute the second heat exchange system 121.

Specifically, the method further includes: arranging one of the first air outlet 101 and the second air outlet 114 on the front side of the housing 100 , and the other on the top surface of the housing 100 , Bottom surface, rear side, left side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side; and the second air inlet 113 is arranged on the Top, bottom, rear, left or right side.

Specifically, the method further includes, supplementing the first working surface of the semiconductor refrigeration sheet 106 with a first thermally conductive substrate 104, so that the first fins 109 are in thermal contact with the first thermally conductive substrate 104; The second working surface of the semiconductor refrigeration sheet 106 is supplemented with a second thermally conductive substrate 105, so that the second fins 110 are in thermal contact with the second thermally conductive substrate 105 through a heat pipe.

Specifically, the method further includes: arranging a support body 115 in the chamber where the semiconductor refrigeration chip 106 is confined, and a receiving groove is provided on the top surface of the support body 115 so that the second working surface of the semiconductor refrigeration chip 106 can accommodate in the accommodating groove. The support body 115 is a poor conductor of heat, and a heat pipe hole is provided on the support body 115 so that the heat pipe 111 penetrates through the heat pipe hole.

As one of the specific embodiments, the hollow cavity 107 is divided into at least three chambers by at least two partitions 122 arranged longitudinally. Specifically, the hollow cavity 107 is divided into three chambers by two longitudinally arranged partitions 122 .

As one of the specific embodiments, the method further includes: confining the semiconductor refrigeration sheet 106 in a middle chamber; the first heat exchange system 120 includes a first working surface of the semiconductor refrigeration sheet 106 and a first working surface of the semiconductor refrigeration sheet 106 . Fins 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration fin 106 and the second fins 110; the first fins 109 are confined to the middle chamber, the second The fins 110 include two groups of fins, which are respectively confined in the chambers on both sides; for each chamber, an air outlet and an air inlet are correspondingly provided in the housing 100 .

Specifically, the method further includes: forming the first working surface of the semiconductor refrigeration sheet 106 , the first fins 109 , the first air inlet 102 , the first fan 108 and the first air outlet 101 to form the first cooling device. Thermal system 120; the second working surface of the semiconductor refrigeration sheet 106, the heat pipe 111, the second fin 110, the second fan 112, the second air inlet 113 and the second air outlet 114 constitute the second heat exchange system 121.

Specifically, the method further includes: arranging one of the first air outlet 101 and the second air outlet 114 on the front side of the housing 100 , and the other on the top surface of the housing 100 , bottom surface, rear side, left side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side; and the second air inlet 113 is arranged on the top, bottom, rear, left or right side.

Specifically, the method further includes, supplementing the first working surface of the semiconductor refrigeration sheet 106 with a first thermally conductive substrate 104, so that the first fins 109 are in thermal contact with the first thermally conductive substrate 104; A second thermally conductive substrate 105 is supplemented on the second working surface of the semiconductor refrigeration sheet 106 , so that the second fins 110 are in thermal contact with the second thermally conductive substrate 105 .

Specifically, the method further includes: arranging a support body 115 in the intermediate chamber, a accommodating groove on the top surface of the supporting body 115, and accommodating the second working surface of the semiconductor refrigeration chip 106 in the accommodating groove . The support body 115 is provided with a heat pipe hole, and the heat pipe 111 is inserted through the heat pipe hole.

As one of the specific embodiments, the first working surface of the semiconductor refrigeration sheet 106 is confined in one side chamber, and the second working surface is confined in the middle chamber; the first heat exchange system 120 includes the semiconductor refrigeration sheet 106 of the first working surface and the first fin 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration fin 106 and the second fin 110; the first fin 109 is limited to For one side chamber, the second fin 110 includes two groups of fins, which are respectively confined in the middle chamber and the other side chamber; for each chamber, an air outlet and an air inlet are correspondingly provided in the housing 100 .

Specifically, the method further includes: forming the first working surface of the semiconductor refrigeration sheet 106 , the first fins 109 , the first air inlet 102 , the first fan 108 and the first air outlet 101 to form the first cooling device. Thermal system 120; the second working surface of the semiconductor refrigeration sheet 106, the heat pipe 111, the second fin 110, the second fan 112, the second air inlet 113 and the second air outlet 114 constitute the second heat exchange system 121.

Specifically, the method further includes: arranging one of the first air outlet 101 and the second air outlet 114 on the front side of the housing 100 , and the other on the top surface of the housing 100 , bottom surface, rear side, left side or right side; the first air inlet 102 is arranged on the top surface, bottom surface, rear side, left side or right side; and the second air inlet 113 is arranged on the top, bottom, rear, left or right side.

Specifically, the method further includes, supplementing the first working surface of the semiconductor refrigeration sheet 106 with a first thermally conductive substrate 104, so that the first fins 109 are in thermal contact with the first thermally conductive substrate 104; A second thermally conductive substrate 105 is supplemented on the second working surface of the semiconductor refrigeration sheet 106 , so that the second fins 110 are in thermal contact with the second thermally conductive substrate 105 .

As the sixth embodiment, it relates to a bottom installation method of a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system 120, a second heat exchange system 121, a semiconductor refrigeration sheet 106 and a casing 100. The casing 100 surrounds into a hollow cavity 107, the semiconductor refrigeration sheet 106 includes a first working surface and a second working surface; the hollow cavity 107 is divided into at least two chambers by at least one partition 122 arranged longitudinally; the semiconductor refrigeration sheet 106 is confined in part of the chamber, and/or the first working surface and the second working surface of the refrigerating sheet 106 are respectively confined in different chambers; the first heat exchange system 120 includes the refrigerating sheet 106 of the first working surface and the first fins 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration sheet 106 and the second fins 110; the first fins 109 and the The second fins 110 are confined in different chambers; each chamber limited by the first fins 109 or the second fins 110 is provided with an air outlet and an air inlet correspondingly in the housing 100 , and the method includes , the step of integrating the casing 100 into the horizontal casing 313 of the range hood.

Specifically, the integration of the housing 100 into the horizontal housing 313 of the range hood refers to the integration of the housing 100 into the horizontal housing 313 of the range hood directly in front of the housing 100 .

Specifically, the integration of the housing 100 into the horizontal housing 313 of the range hood means that an insert is arranged between the housing 100 and the horizontal housing 313 of the range hood, and the housing 100 and the horizontal housing 313 of the range hood are integrated 313 are respectively fixed on the upper and lower sides of the insert, so that a certain gap is reserved between the casing 100 and the horizontal casing 313 of the range hood. The insert may be a U-shaped bracket 317 .

Specifically, the integration of the housing 100 into the horizontal housing 313 of the range hood means that support rods are provided on both side walls of the semiconductor refrigeration module housing 100, and the lower ends of the support rods are fixed to the range hood housing, so that the semiconductor refrigeration module A certain gap is reserved between the housing 100 and the horizontal housing 313 of the range hood.

Fig. 17 is a three-dimensional schematic diagram of the integration of the semiconductor refrigeration module and the horizontal casing of the range hood. It can be seen that the semiconductor refrigeration module can be integrated with the outside of the range hood, and can be integrated into the housing of the range hood, preferably in front of the horizontal housing of the range hood.

The housing of the range hood 151 includes a horizontal housing 313 of the range hood and a housing 310 of the main flue of the range hood. The main flue of the range hood is 316. As shown in FIG. 13 , the semiconductor refrigeration module 150 is externally integrated into the horizontal casing 313 of the range hood 151 , and of course it is not limited to external integration to the front. The range hood control panel 315 can issue electrical control commands to the semiconductor refrigeration module 150, or the semiconductor refrigeration module has its own control panel for automatic control. In a specific embodiment, the designed air inlets at the cold and hot ends are located at the lower end of the semiconductor refrigeration module 150, so it is necessary to keep a certain distance between the bottom surface of the module housing 100 and the horizontal housing 313 of the range hood, rather than in close contact, so as to keep the air inlet. The tuyere can communicate with the outside air. For example, a U-shaped bracket 317 is configured at the lower end of the module by welding or other methods, and the left and right and front of the bracket are integrated or segmented, so that the rear part of the bracket is empty to ensure air intake. Alternatively, support rods are provided on both side walls of the semiconductor refrigeration module housing 100 , and the lower ends of the support rods are fixed to the range hood housing, so that a certain gap is reserved between the semiconductor refrigeration module housing 100 and the range hood horizontal housing 313 .

Specifically, the semiconductor refrigeration module installed in this embodiment may be the semiconductor refrigeration module described in any one of Embodiments 1-4.

As the seventh embodiment, it relates to a side installation method of a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system 120, a second heat exchange system 121, a semiconductor refrigeration sheet 106 and a casing 100, and the casing 100 surrounds into a hollow cavity 107, the semiconductor refrigeration sheet 106 includes a first working surface and a second working surface; the hollow cavity 107 is divided into at least two chambers by at least one partition 122 arranged longitudinally; the semiconductor refrigeration sheet 106 is confined in part of the chamber, and/or the first working surface and the second working surface of the refrigerating sheet 106 are respectively confined in different chambers; the first heat exchange system 120 includes the refrigerating sheet 106 of the first working surface and the first fins 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration sheet 106 and the second fins 110; the first fins 109 and the The second fins 110 are confined in different chambers; each chamber limited by the first fins 109 or the second fins 110 is provided with an air outlet and an air inlet correspondingly in the housing 100 , and the method includes , the step of integrating the casing 100 into the main flue casing 310 of the range hood.

Specifically, the integration of the casing 100 into the main flue casing 310 of the range hood refers to the integration of the casing 100 into the main flue casing 310 of the range hood directly in front of the casing.

Specifically, the integration of the casing 100 into the main flue casing 310 of the range hood refers to adhering the casing 100 to the main flue casing 310, or using an elastic ring to fix the semiconductor refrigeration module to the main flue casing 310 .

Preferably, the distance between the housing 100 and the horizontal housing 313 of the range hood is n, where n is greater than zero.

18 is a three-dimensional schematic diagram of the integration of the semiconductor refrigeration module and the main flue casing of the range hood. It can be seen that the semiconductor refrigeration module 150 can be integrated with the outside of the range hood 151 , can be integrated into the main flue casing 310 of the range hood, and is preferably integrated directly in front of the main flue casing 310 . Specifically, the semiconductor refrigeration module 150 can be adhered to the main flue casing 310, or the semiconductor refrigeration module 150 can be fixed to the main flue casing 310 by using an elastic ring, or other methods can be used to fix the semiconductor refrigeration module 150 to the main flue casing 310. Main flue casing 310 way. In a specific embodiment, when the semiconductor refrigeration module 150 is externally integrated into the main flue casing 310 of the range hood, both the cold and hot ends of the module enter from below, and the hot air blows out from the top. At this time, the semiconductor refrigeration module 150 is required. An appropriate distance is maintained between the lower end and the horizontal casing 313 of the range hood, so that the air inlet can communicate with the outside air.

Specifically, the semiconductor refrigeration module installed in this embodiment may be the semiconductor refrigeration module described in any one of Embodiments 1-4.

The invention of the present invention is to provide a cold and hot air isolation method for a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system 120 , a second heat exchange system 121 , a semiconductor refrigeration sheet 106 and a housing 100 . The shell 100 encloses a hollow cavity 107 , the semiconductor refrigeration sheet 106 includes a first working surface and a second working surface, and the first heat exchange system 120 includes a first working surface and a first fin of the semiconductor refrigeration sheet 106 sheet 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration sheet 106 and the second fins 110; the hollow cavity 107 is divided into at least one two chambers; confine the semiconductor refrigeration sheet 106 in part of the chamber, and/or confine the first working surface and the second working surface of the semiconductor refrigeration sheet 106 to different chambers respectively; A fin 109 and the second fin 110 are confined in different chambers; and, so that each chamber limited by the first fin 109 or the second fin 110 is provided with an air outlet in the housing 100 And the air inlet to realize the cold and hot air isolation of the semiconductor refrigeration module.

As one of the specific embodiments, the hollow cavity 107 is divided into two chambers by a partition 122 arranged longitudinally.

As one of the specific embodiments, the first working surface and the second working surface of the semiconductor refrigeration sheet 106 are respectively confined in two chambers; the first heat exchange system 120 includes the first working surface of the semiconductor cooling sheet 106 . The working surface and the first fins 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration sheet 106 and the second fins 110; the first heat exchange system 120 and the second heat exchange system The thermal system 121 is respectively confined in two chambers; each chamber is provided with an air outlet and an air inlet correspondingly in the housing 100 .

Specifically, the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106, the first fins 109, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchanger The thermal system 121 includes the second working surface of the semiconductor refrigeration sheet 106 , the second fins 110 , the second fan 112 , the second air inlet 113 and the second air outlet 114 .

More specifically, one of the first air outlet 101 and the second air outlet 114 is arranged on the front side of the housing 100 , and the other is arranged on the top surface, bottom surface, rear side, Left side or right side; the first air inlet 102 is arranged on the top, bottom, rear, left or right side; the second air inlet 113 is arranged on the top, bottom, rear Side, left or right side.

As one of the specific embodiments, the semiconductor refrigeration sheet 106 is confined in one of the chambers; the first heat exchange system 120 includes a first working surface of the semiconductor refrigeration sheet 106 and a first fin 109; the The second heat exchange system 121 includes the second working surface of the semiconductor refrigeration sheet 106 and the second fins 110; the first fins 109 and the second fins 110 are confined in different chambers; each In the chamber, an air outlet and an air inlet are correspondingly provided in the housing 100 .

Specifically, the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106, the first fins 109, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchanger The thermal system 121 includes a second working surface of the semiconductor refrigeration sheet 106 , a heat pipe 111 , a second fin 110 , a second fan 112 , a second air inlet 113 and a second air outlet 114 .

More specifically, among the first air outlet 101 and the second air outlet 114 , one is provided on the front side of the housing 100 , and the other is provided on the top, bottom, and rear sides of the housing 100 . , left side or right side; the first air inlet 102 is arranged on the top, bottom, rear, left or right side; the second air inlet 113 is arranged on the top, bottom, Rear side, left side or right side.

Specifically, the first working surface of the semiconductor refrigeration sheet 106 can be supplemented by a first thermally conductive substrate 104, and the first fins 109 are in thermal contact with the first thermally conductive substrate 104; 1. the semiconductor refrigeration sheet The second working surface of 106 may also be supplemented by a second thermally conductive substrate 105 with which the second fins 110 are in thermal contact.

Specifically, a support body 115 may be provided in the chamber where the semiconductor refrigeration chip 106 is limited, a receiving groove is formed on the top surface of the support body 115, and the second working surface of the semiconductor refrigeration chip 106 is accommodated in the receiving groove Inside. The support body 115 is a poor conductor of heat, the support body 115 is provided with a heat pipe hole, and the heat pipe 111 penetrates through the heat pipe hole.

As one of the specific embodiments, the hollow cavity 107 is divided into three chambers by two partitions 122 arranged longitudinally.

As one of the specific embodiments, the semiconductor refrigeration sheet 106 is confined in the middle chamber; the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106 and the first fins 109; the The second heat exchange system 121 includes the second working surface of the semiconductor refrigeration sheet 106 and the second fins 110; the first fins 109 are confined to the middle chamber, and the second fins 110 include two groups The fins are respectively confined in the chambers on both sides; each chamber is provided with an air outlet and an air inlet correspondingly in the casing 100 .

Specifically, the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106, the first fins 109, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchanger The thermal system 121 includes a second working surface of the semiconductor refrigeration sheet 106 , a heat pipe 111 , a second fin 110 , a second fan 112 , a second air inlet 113 and a second air outlet 114 .

More specifically, among the first air outlet 101 and the second air outlet 114 , one is provided on the front side of the housing 100 , and the other is provided on the top, bottom, and rear sides of the housing 100 . , left side or right side; the first air inlet 102 is arranged on the top, bottom, rear, left or right side; the second air inlet 113 is arranged on the top, bottom, Rear side, left side or right side.

As one of the specific implementations, the first working surface of the semiconductor refrigeration sheet 106 is confined in one side chamber, and the second working surface is confined in the middle chamber; the first heat exchange system 120 includes the semiconductor refrigeration sheet The first working surface of the fin 106 and the first fin 109; the second heat exchange system 121 includes the second working surface of the semiconductor refrigeration fin 106 and the second fin 110; the first fin 109 is limited In one side chamber, the second fin 110 includes two groups of fins, which are respectively confined in the middle chamber and the other side chamber; each chamber is provided with an air outlet and an air inlet correspondingly in the housing 100 . tuyere.

Specifically, the first heat exchange system 120 includes the first working surface of the semiconductor refrigeration sheet 106, the first fins 109, the first air inlet 102, the first fan 108 and the first air outlet 101; the second heat exchanger The thermal system 121 includes a second working surface of the semiconductor refrigeration sheet 106 , a heat pipe 111 , a second fin 110 , a second fan 112 , a second air inlet 113 and a second air outlet 114 .

More specifically, among the first air outlet 101 and the second air outlet 114 , one is provided on the front side of the housing 100 , and the other is provided on the top, bottom, and rear sides of the housing 100 . , left side or right side; the first air inlet 102 is arranged on the top, bottom, rear, left or right side; the second air inlet 113 is arranged on the top, bottom, Rear side, left side or right side.

The above-mentioned embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present invention are all within the protection scope of the present invention. The protection scope of the present invention is subject to the claims.

Claims (11)

1. A side mounting method of a semiconductor refrigeration module is disclosed, the semiconductor refrigeration module mainly comprises a first heat exchange system (120), a second heat exchange system (121), semiconductor refrigeration pieces (106) and a shell (100), wherein the shell (100) encloses a hollow cavity (107), and the semiconductor refrigeration pieces (106) comprise a first working surface and a second working surface; the hollow cavity (107) is divided into at least two chambers by at least one partition plate (122) which is arranged longitudinally; the semiconductor chilling plate (106) is limited in a partial chamber; the first heat exchange system (120) comprises first working surfaces of the semiconductor chilling plates (106) and first fins (109); the second heat exchange system (121) comprises second working surfaces of the semiconductor chilling plates (106) and second fins (110); the first fin (109) and the second fin (110) are confined within different chambers; each chamber limited with a first fin (109) or a second fin (110) is correspondingly provided with an air outlet and an air inlet on the shell (100), the semiconductor refrigeration device is characterized in that a supporting body (115) is arranged in the chamber limited with the semiconductor refrigeration sheet (106), the top surface of the supporting body (115) is provided with a containing groove, the second working surface of the semiconductor refrigeration sheet (106) is contained in the containing groove, the supporting body (115) is a poor thermal conductor, the supporting body (115) is provided with a heat pipe hole, and the second working surface is in thermal contact with the second fin (110) through a heat pipe (111) penetrating through the heat pipe hole; the method includes the step of integrating the housing (100) onto a range hood main flue housing (310).

2. The side mounting method of claim 1 wherein said integrating the housing (100) into the range hood main flue housing (310) is directly forward of integrating the housing (100) into the range hood main flue housing (310).

3. The side mounting method of claim 1, wherein said integrating the housing (100) into the range hood main flue housing (310) comprises adhesively attaching the housing (100) to the main flue housing (310) or using a tension ring to secure the semiconductor refrigeration module to the main flue housing (310).

4. The side mounting method of claim 1, wherein the distance between the housing (100) and the horizontal range hood housing (313) is n, wherein n is greater than zero.

5. A side mounting method according to claim 1, wherein the hollow chamber (107) is divided into two chambers by a partition (122) arranged longitudinally, and the semiconductor chilling plate (106) is confined in one of the chambers.

6. The side mounting method of claim 5, wherein the first heat exchange system (120) comprises a first working surface of the semiconductor chilling plate (106), a first fin (109), a first air inlet (102), a first fan (108), and a first air outlet (101); the second heat exchange system (121) comprises a second working surface of the semiconductor refrigeration sheet (106), a heat pipe (111), a second fin (110), a second fan (112), a second air inlet (113) and a second air outlet (114).

7. The side mounting method according to claim 6, wherein the first outlet (101) and the second outlet (114) are disposed one on a front side of the housing (100) and the other on a top, bottom, rear, left, or right side of the housing (100); the first air inlet (102) is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface; the second air inlet (113) is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface.

8. The side mounting method according to claim 1, wherein the hollow chamber (107) is divided into three chambers by two partitions (122) arranged longitudinally.

9. The side mounting method of claim 8, wherein said semiconductor chilling plate (106) is confined within a central chamber;

the first heat exchange system (120) comprises first working surfaces of the semiconductor chilling plates (106) and first fins (109);

the second heat exchange system (121) comprises second working surfaces of the semiconductor chilling plates (106) and second fins (110);

the first fin (109) is limited in the middle cavity, and the second fin (110) comprises two groups of fins which are respectively limited in the cavities at two sides;

each chamber is correspondingly provided with an air outlet and an air inlet on the shell (100).

10. The side mounting method of claim 9, wherein the first heat exchange system (120) comprises a first working surface of the semiconductor chilling plate (106), a first fin (109), a first air inlet (102), a first fan (108), and a first air outlet (101); the second heat exchange system (121) comprises a second working surface of the semiconductor refrigeration sheet (106), a heat pipe (111), a second fin (110), a second fan (112), a second air inlet (113) and a second air outlet (114).

11. The side mounting method according to claim 10, wherein one of the first outlet (101) and the second outlet (114) is provided on a front side surface of the housing (100), and the other is provided on a top surface, a bottom surface, a rear side surface, a left side surface or a right side surface of the housing (100); the first air inlet (102) is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface; the second air inlet (113) is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface.

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