CN204693673U

CN204693673U - Semiconductor refrigerating module and smoke exhaust ventilator

Info

Publication number: CN204693673U
Application number: CN201420867229.0U
Authority: CN
Inventors: 高希成; 栾明业; 孙珺超; 克里夫·里德
Original assignee: Qingdao Haier Smart Technology R&D Co Ltd
Current assignee: Qingdao Haier Smart Technology R&D Co Ltd
Priority date: 2014-12-31
Filing date: 2014-12-31
Publication date: 2015-10-07
Anticipated expiration: 2024-12-31

Abstract

The utility model discloses a kind of semiconductor refrigerating module and smoke exhaust ventilator, form primarily of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate comprises the first working surface and the second working surface; Described cavity, by least one dividing plate longitudinally arranged, is divided at least two chambers; Described semiconductor chilling plate is restricted in section chambers, and/or the first working surface of described semiconductor chilling plate and the second working surface are limited in different chambers respectively; Described first heat-exchange system comprises the first working surface and first fin of described semiconductor chilling plate; Described second heat-exchange system comprises the second working surface and second fin of described semiconductor chilling plate; Each restriction has the chamber of the first fin or the second fin, is provided with air outlet and air inlet in described shell correspondence.By the physical isolation by two heat-exchange systems, improve energy utilization efficiency.

Description

Semiconductor refrigerating module and smoke exhaust ventilator

Technical field

The utility model relates to a kind of semiconductor refrigerating module and smoke exhaust ventilator.

Background technology

Be an arduous housework in the culinary art of cooking of kitchen focus edge of table, particularly in summer, originally hot weather adds the heat that kitchen range send, and makes working environment in kitchen very harsh.

In order to solve the too high problem of kitchen temperature, have people provided with fan or air-conditioning in kitchen, but fan blowing refrigeration is general, and gas-cooker can be affected normally works, also there is potential safety hazard.Due to the oil smoke surroundings that kitchen is special, after general fan uses a period of time, fan adheres to a large amount of putties, is difficult to cleaning, also can causes the pollution of kitchen environment.

Install an air-conditioner equipment in kitchen, there is Cost Problems on the one hand, also can there is the problem being difficult to clean on the other hand, after air-condition heat exchanger surface attachment oil smoke, also there is the problem that refrigeration declines.

Utility model content

In order to solve prior art exist, in kitchen, using air-condition cost is higher, and be difficult to cleaning and the low inferior problem of temperature regulation effect, the utility model provides a kind of semiconductor refrigerating module, and is installed and be applied in smoke exhaust ventilator.

As an aspect of the present utility model, relate to a kind of semiconductor refrigerating module, this semiconductor refrigerating module is formed primarily of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate comprises the first working surface and the second working surface; Described cavity, by least one dividing plate longitudinally arranged, is divided at least two chambers; Described semiconductor chilling plate is restricted in section chambers, and/or the first working surface of described semiconductor chilling plate and the second working surface are limited in different chambers respectively; Described first heat-exchange system comprises the first working surface and first fin of described semiconductor chilling plate; Described second heat-exchange system comprises the second working surface and second fin of described semiconductor chilling plate; Described first fin and described second fin are restricted in different chambers; Each restriction has the chamber of the first fin or the second fin, is provided with air outlet and air inlet in described shell correspondence.

As one of detailed description of the invention, described cavity, by the dividing plate longitudinally arranged, is divided into two chambers.First working surface of described semiconductor chilling plate and the second working surface are limited in two chambers respectively; Described first heat-exchange system comprises the first working surface and first fin of described semiconductor chilling plate; Described second heat-exchange system comprises the second working surface and second fin of described semiconductor chilling plate; Described first heat-exchange system and described second heat-exchange system are limited in two chambers respectively; Each chamber, is provided with air outlet and air inlet in described shell correspondence.

Particularly, described first heat-exchange system comprises the first working surface of semiconductor chilling plate, the first fin, the first air inlet, the first fan and the first air outlet; Described second heat-exchange system comprises the second working surface of semiconductor chilling plate, the second fin, the second fan, the second air inlet and the second air outlet.

More specifically, described first air outlet and described second air outlet, a leading flank being arranged at described shell, another is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank; Described first air inlet is arranged at end face, bottom surface, trailing flank, left surface or right flank; Described second air inlet is arranged at end face, bottom surface, trailing flank, left surface or right flank.

Specifically, the first working surface of described semiconductor chilling plate is aided with the first conductive substrate, described first fin and described first conductive substrate thermo-contact; Second working surface of described semiconductor chilling plate is aided with the second conductive substrate, described second fin and described second conductive substrate thermo-contact.

As one of detailed description of the invention, described semiconductor chilling plate is restricted in one of them chamber; Described first heat-exchange system comprises the first working surface and first fin of described semiconductor chilling plate; Described second heat-exchange system comprises the second working surface and second fin of described semiconductor chilling plate; Described first fin and described second fin are restricted in different chambers; Each chamber, is provided with air outlet and air inlet in described shell correspondence.

Particularly, described first heat-exchange system comprises the first working surface of semiconductor chilling plate, the first fin, the first air inlet, the first fan and the first air outlet; Described second heat-exchange system comprises the second working surface of semiconductor chilling plate, heat pipe, the second fin, the second fan, the second air inlet and the second air outlet.

More specifically, in described first air outlet and described second air outlet, a leading flank being arranged at described shell, another is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank; Described first air inlet is arranged at end face, bottom surface, trailing flank, left surface or right flank; Described second air inlet is arranged at end face, bottom surface, trailing flank, left surface or right flank.

Restriction has in the chamber of described semiconductor chilling plate and can also be provided with supporter, and described supporter end face establishes holding tank, and the second working surface of described semiconductor chilling plate is contained in described holding tank.Described supporter is the non-conductor of heat, and described supporter is provided with heat pipe hole, and described heat pipe runs through described heat pipe hole.

As one of detailed description of the invention, described cavity, by least two dividing plates longitudinally arranged, is divided at least three chambers.Can be specifically that described cavity, by two dividing plates longitudinally arranged, is divided into three chambers.

As one of embodiment, described semiconductor chilling plate is restricted in middle chamber; Described first heat-exchange system comprises the first working surface and first fin of described semiconductor chilling plate; Described second heat-exchange system comprises the second working surface and second fin of described semiconductor chilling plate; Described first fin is restricted to middle chamber, and described second fin comprises two groups of fins, is restricted to respectively in the chamber of both sides; Each chamber, is provided with air outlet and air inlet in described shell correspondence.

Can also be provided with supporter in described intermediate cavity, described supporter end face establishes holding tank, and the second working surface of described semiconductor chilling plate is contained in described holding tank.Described supporter is the non-conductor of heat, and described supporter is provided with heat pipe hole, and described heat pipe runs through described heat pipe hole.

As one of detailed description of the invention, the first working surface of described semiconductor chilling plate is restricted in a side cavity, and the second working surface is restricted in intermediate cavity; Described first heat-exchange system comprises the first working surface and first fin of described semiconductor chilling plate; Described second heat-exchange system comprises the second working surface and second fin of described semiconductor chilling plate; Described first fin is restricted to a side cavity, such as the first working surface side chamber, and described second fin comprises two groups of fins, is restricted in intermediate cavity and in opposite side chamber respectively; Each chamber, is provided with air outlet and air inlet in described shell correspondence.

As one of embodiment, the air outlet being located at described shell front side face can be provided with wind-guiding grid.As preferably, described air inlet and described air outlet can all arrange wind-guiding grid.

As one of specific embodiment, between the first working surface of described semiconductor chilling plate and the first conductive substrate, heat-conducting silicone grease can be aided with; Also heat-conducting silicone grease can be aided with between second working surface of described semiconductor chilling plate and the second conductive substrate.

As one of specific embodiment, described first heat-exchange system can also comprise the first air intake tuyere and the first air-out tuyere.

As another aspect of the present utility model, relate to a kind of smoke exhaust ventilator, described smoke exhaust ventilator comprises aforesaid semiconductor refrigerating module.

As the 3rd aspect of the present utility model, relate to a kind of preparation method of semiconductor refrigerating module, this semiconductor refrigerating module is formed primarily of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate comprises the first working surface and the second working surface; Described first heat-exchange system comprises the first working surface and first fin of described semiconductor chilling plate, described second heat-exchange system comprises the second working surface and second fin of described semiconductor chilling plate, described method comprises, with at least one dividing plate longitudinally arranged, described cavity is divided into the step of at least two chambers.

Described method can also comprise, and is limited in section chambers by described semiconductor chilling plate, and/or the first working surface of described semiconductor chilling plate and the second working surface are limited to the step in different chambers respectively.

Described method can also comprise, and described first fin and described second fin is limited to the step in different chambers.

As one of embodiment, each restriction has the chamber of the first fin or the second fin, sets out air port and air inlet in described shell correspondence.

As the 4th aspect of the present utility model, relate to a kind of bottom installation method of semiconductor refrigerating module, this semiconductor refrigerating module is formed primarily of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate comprises the first working surface and the second working surface; Described cavity, by least one dividing plate longitudinally arranged, is divided at least two chambers; Described semiconductor chilling plate is restricted in section chambers, and/or the first working surface of described semiconductor chilling plate and the second working surface are limited in different chambers respectively; Described first heat-exchange system comprises the first working surface and first fin of described semiconductor chilling plate; Described second heat-exchange system comprises the second working surface and second fin of described semiconductor chilling plate; Described first fin and described second fin are restricted in different chambers; Each restriction has the chamber of the first fin or the second fin, and be provided with air outlet and air inlet in described shell correspondence, described method comprises, and described shell is integrated into the step on the horizontal shell of smoke exhaust ventilator.

Particularly, described being integrated into by shell on the horizontal shell of smoke exhaust ventilator refers to, shell is integrated into the horizontal shell dead ahead of smoke exhaust ventilator.

Specifically, described being integrated into by shell on the horizontal shell of smoke exhaust ventilator refers to, between described shell and the horizontal shell of smoke exhaust ventilator, insert is set, described shell and the horizontal shell of smoke exhaust ventilator are individually fixed in the both sides up and down of insert, make to retain certain space between described shell and the horizontal shell of smoke exhaust ventilator.Described insert can be U-shaped support.

Particularly, described being integrated into by described shell on the horizontal shell of smoke exhaust ventilator refers to, establish support bar in semiconductor refrigerating module housing two side, cooking-fume exhausting hood housing is fixed in this support bar lower end, makes to retain certain space between semiconductor refrigerating module housing and the horizontal shell of smoke exhaust ventilator.

As the 5th aspect of the present utility model, relate to a kind of side installation method of semiconductor refrigerating module, this semiconductor refrigerating module is formed primarily of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate comprises the first working surface and the second working surface; Described cavity, by least one dividing plate longitudinally arranged, is divided at least two chambers; Described semiconductor chilling plate is restricted in section chambers, and/or the first working surface of described semiconductor chilling plate and the second working surface are limited in different chambers respectively; Described first heat-exchange system comprises the first working surface and first fin of described semiconductor chilling plate; Described second heat-exchange system comprises the second working surface and second fin of described semiconductor chilling plate; Described first fin and described second fin are restricted in different chambers; Each restriction has the chamber of the first fin or the second fin, and be provided with air outlet and air inlet in described shell correspondence, described method comprises, and described shell is integrated into the step on smoke exhaust ventilator flue collector shell.

Particularly, described being integrated into by described shell on smoke exhaust ventilator flue collector shell refers to, shell is integrated into dead ahead on smoke exhaust ventilator flue collector shell.

Specifically, described being integrated into by shell on smoke exhaust ventilator flue collector shell refers to, shell is adhered to flue collector shell, or uses loose collar that semiconductor refrigerating module is fixed on flue collector shell.

As preferably, the distance between described shell and the horizontal shell of described smoke exhaust ventilator is n, and wherein, n is greater than zero.

As the 6th aspect of the present utility model, relate to a kind of cold-hot wind isolation method of semiconductor refrigerating module, this semiconductor refrigerating module is formed primarily of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, described semiconductor chilling plate comprises the first working surface and the second working surface, and described first heat-exchange system comprises the first working surface and first fin of described semiconductor chilling plate; Described second heat-exchange system comprises the second working surface and second fin of described semiconductor chilling plate; By with at least one dividing plate longitudinally arranged, described cavity is divided at least two chambers; Described semiconductor chilling plate is limited in section chambers, and/or the first working surface of described semiconductor chilling plate and the second working surface are limited in different chambers respectively; Described first fin and described second fin are limited in different chambers; And, make each restriction have the chamber of the first fin or the second fin, set out air port and air inlet in described shell correspondence, realize the cold-hot wind isolation of semiconductor refrigerating module.

The utility model embodiment at least achieves following beneficial effect:

1, the semiconductor refrigerating module that provides of the utility model, structural design is simply compact, manufacture simple, and cost is low;

2, the utility model the module housing that semiconductor refrigerating module is housed is installed on cooking-fume exhausting hood housing horizontal shell on or on flue collector shell, it does not all take the volume of cooking-fume exhausting hood housing inner chamber, therefore cooking-fume exhausting hood housing internal structure is not affected, and during smoke exhaust ventilator cleaning, only module housing need be taken off from cooking-fume exhausting hood housing, can conveniently clean, therefore it is not only easy to installing/dismounting, and is easy to clean and maintenance.

3, by by the physical isolation of two heat-exchange systems, effectively improve the utilization ratio of energy.

Accompanying drawing explanation

Fig. 1 is the semiconductor refrigerating module schematic top plan view of one of the utility model embodiment;

Fig. 2 is the semiconductor refrigerating module right view of one of the utility model embodiment;

Fig. 3 is the semiconductor refrigerating inside modules structure front view of one of the utility model embodiment;

Fig. 4 is the semiconductor refrigerating module housing schematic three dimensional views of one of the utility model embodiment;

Fig. 5 is the semiconductor refrigerating module schematic top plan view of the utility model embodiment two;

Fig. 6 is the semiconductor refrigerating module right view of the utility model embodiment two;

Fig. 7 is the semiconductor refrigerating inside modules structure front view of the utility model embodiment two;

Fig. 8 is the semiconductor refrigerating module housing schematic three dimensional views of the utility model embodiment two;

Fig. 9 is the semiconductor refrigerating module schematic top plan view of the utility model embodiment three;

Figure 10 is the semiconductor refrigerating module right view of the utility model embodiment three;

Figure 11 is the semiconductor refrigerating inside modules structure front view of the utility model embodiment three;

Figure 12 is the semiconductor refrigerating module housing schematic three dimensional views of the utility model embodiment three;

Figure 13 is the semiconductor refrigerating module schematic top plan view of the utility model embodiment four;

Figure 14 is the semiconductor refrigerating module right view of the utility model embodiment four;

Figure 15 is the semiconductor refrigerating inside modules structure front view of the utility model embodiment four;

Figure 16 is the semiconductor refrigerating module housing schematic three dimensional views of the utility model embodiment four;

Figure 17 is the stereogram that the utility model semiconductor refrigerating module is installed on the horizontal shell of smoke exhaust ventilator;

Figure 18 is that semiconductor refrigerating module is installed on the stereogram of smoke exhaust ventilator flue collector shell by the utility model.

Detailed description of the invention

Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, and to make those skilled in the art better can understand the utility model being implemented, but illustrated embodiment is not as to restriction of the present utility model.

The utility model embodiment provides the smoke exhaust ventilator of semiconductor refrigerating module and this refrigeration module of external harmoniousness.Semiconductor refrigerating module, based semiconductor cooling piece, and with the use of fin heat exchange, cold semiconductor chilling plate energising produced by fan or heat blowout.Can be cold environment or thermal environment that user produces a local, meet the comfortableness requirement of people.Semiconductor chilling plate has two working surfaces, and upper end is the first working surface, and lower end is the second working surface, and when the first working surface is hot junction, the second working surface is cold junction; When the first working surface is cold junction, the second working surface is hot junction.Semiconductor refrigerating module can with smoke exhaust ventilator external harmoniousness, accessible site is to cooking-fume exhausting hood housing horizontal component upper end or be integrated into smoke exhaust ventilator flue collector outer casing frontispiece.Refrigeration module can work independently, also can with smoke exhaust ventilator intelligent linkage.

The utility model provide semiconductor refrigerating module outstanding feature to be, its first heat-exchange system and the second heat-exchange system achieve part, or even whole physical isolation, can effectively prevent semiconductor chilling plate produce the two-way flow of heat energy and cold energy, put forward high-octane utilization ratio, reduce power consumption.

In one detailed description of the invention, refrigeration module mode of operation has nice and cool pattern and warm pattern two kinds: when pressing nice and cool pattern, and semiconductor chilling plate upper end is cold junction, and lower end is hot junction, and module front air outlet goes out cold wind; When pressing warm pattern, semiconductor chilling plate upper end is hot junction, and lower end is cold junction, and module dead ahead air outlet goes out hot blast.Below, be described for nice and cool pattern.

The utility model provides a kind of semiconductor refrigerating module, this semiconductor refrigerating module is formed primarily of the first heat-exchange system 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, and described semiconductor chilling plate 106 comprises the first working surface and the second working surface; Described cavity 107, by least one dividing plate 122 longitudinally arranged, is divided at least two chambers; Described semiconductor chilling plate 106 is restricted in section chambers, and/or the first working surface of described semiconductor chilling plate 106 and the second working surface are limited in different chambers respectively; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 and described second fin 110 are restricted in different chambers; Each restriction has the chamber of the first fin 109 or the second fin 110, is provided with air outlet and air inlet in described shell 100 correspondence.

As embodiment 1, with reference to Fig. 1-Fig. 4, described cavity 107, by the dividing plate 122 longitudinally arranged, is divided into two chambers.First working surface of described semiconductor chilling plate 106 and the second working surface are limited in two chambers respectively; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first heat-exchange system 120 and described second heat-exchange system 121 are limited in two chambers respectively; Each chamber, is provided with air outlet and air inlet in described shell 100 correspondence.

Particularly, described first heat-exchange system 120 comprises the first working surface, first fin 109, first air inlet 102, first fan 108 and first air outlet 101 of semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface, second fin 110, second fan 112, second air inlet 113 and second air outlet 114 of semiconductor chilling plate 106.

More specifically, described first air outlet 101 and described second air outlet 114, are arranged at the leading flank of described shell 100, and another is arranged at the end face of described shell 100, bottom surface, trailing flank, left surface or right flank; Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or right flank; Described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or right flank.

Specifically, the first working surface of described semiconductor chilling plate 106 is aided with the first conductive substrate 104, described first fin 109 and described first conductive substrate 104 thermo-contact; Second working surface of described semiconductor chilling plate 106 is aided with the second conductive substrate 105, described second fin 110 and described second conductive substrate 105 thermo-contact.

As embodiment 2, with reference to Fig. 5-Fig. 8, described cavity 107, by the dividing plate 122 longitudinally arranged, is divided into two chambers.Described semiconductor chilling plate 106 is restricted in one of them chamber; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 and described second fin 110 are restricted in different chambers; Each chamber, is provided with air outlet and air inlet in described shell 100 correspondence.

Particularly, described first heat-exchange system 120 comprises the first working surface, first fin 109, first air inlet 102, first fan 108 and first air outlet 101 of semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface of semiconductor chilling plate 106, heat pipe 111, second fin 110, second fan 112, second air inlet 113 and the second air outlet 114.

More specifically, in described first air outlet 101 and described second air outlet 114, a leading flank being arranged at described shell 100, another is arranged at the end face of described shell 100, bottom surface, trailing flank, left surface or right flank; Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or right flank; Described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or right flank.

Specifically, the first working surface of described semiconductor chilling plate 106 is aided with the first conductive substrate 104, described first fin 109 and described first conductive substrate 104 thermo-contact; Second working surface of described semiconductor chilling plate 106 is aided with the second conductive substrate 105, and described second fin 110 is by heat pipe and described second conductive substrate 105 thermo-contact.

Restriction has in the chamber of described semiconductor chilling plate 106 can also be provided with supporter 115, and described supporter 115 end face establishes holding tank, and the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.Described supporter 115 is the non-conductor of heat, and described supporter 115 is provided with heat pipe hole, and described heat pipe 111 runs through described heat pipe hole.

As embodiment 3, with reference to Fig. 9-Figure 12, described cavity 107, by least two dividing plates 122 longitudinally arranged, is divided at least three chambers.Specifically, described cavity 107, by two dividing plates 122 longitudinally arranged, is divided into three chambers.

Described semiconductor chilling plate 106 is restricted in middle chamber; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 is restricted to middle chamber, and described second fin 110 comprises two groups of fins, is restricted to respectively in the chamber of both sides; Each chamber, is provided with air outlet and air inlet in described shell 100 correspondence.

Can also be provided with supporter 115 in described intermediate cavity, described supporter 115 end face establishes holding tank, and the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.Described supporter 115 is the non-conductor of heat, and described supporter 115 is provided with heat pipe hole, and described heat pipe 111 runs through described heat pipe hole.

As embodiment 4, with reference to Figure 13-Figure 16, described cavity 107, by two dividing plates 122 longitudinally arranged, is divided into three chambers.

First working surface of described semiconductor chilling plate 106 is restricted in a side cavity, and the second working surface is restricted in intermediate cavity; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 is restricted to a side cavity, and described second fin 110 comprises two groups of fins, is restricted in intermediate cavity and in opposite side chamber respectively; Each chamber, is provided with air outlet and air inlet in described shell 100 correspondence.

Semiconductor refrigerating module shown in embodiment 1-4, the air outlet being located at described shell 100 leading flank can be provided with wind-guiding grid 103.As preferably, described air inlet and described air outlet also can all arrange wind-guiding grid 103.

Semiconductor refrigerating module shown in embodiment 1-4, can be aided with heat-conducting silicone grease 200 between the first working surface of described semiconductor chilling plate 106 and the first conductive substrate 104; Also heat-conducting silicone grease 201 can be aided with between second working surface of described semiconductor chilling plate 106 and the second conductive substrate 105.

Semiconductor refrigerating module shown in embodiment 1-4, described first heat-exchange system 120 can also comprise the first air intake tuyere 117 and the first air-out tuyere 118.

The utility model also provides a kind of smoke exhaust ventilator, and described smoke exhaust ventilator comprises aforesaid semiconductor refrigerating module.

As embodiment 5, relate to the preparation method of semiconductor refrigerating module described in embodiment 1-4, this semiconductor refrigerating module is formed primarily of the first heat-exchange system 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, and described semiconductor chilling plate 106 comprises the first working surface and the second working surface; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106, described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106, described method comprises, with at least one dividing plate 122 longitudinally arranged, described cavity 107 is divided into the step of at least two chambers.

Described method can also comprise, and is limited in section chambers by described semiconductor chilling plate 106, and/or the first working surface of described semiconductor chilling plate 106 and the second working surface are limited to the step in different chambers respectively.

Described method can also comprise, and described first fin 109 and described second fin 110 is limited to the step in different chambers.

As one of embodiment, each restriction has the chamber of the first fin 109 or the second fin 110, sets out air port and air inlet in described shell 100 correspondence.

As one of detailed description of the invention, the dividing plate 122 longitudinally arranged with, is divided into two chambers by described cavity 107.

As one of specific embodiment, described method also comprises, and the first working surface of described semiconductor chilling plate 106 and the second working surface is limited to respectively in two chambers; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first heat-exchange system 120 and described second heat-exchange system 121 are limited in two chambers respectively; Each chamber, is provided with air outlet and air inlet in described shell 100 correspondence.

Particularly, described method also comprises, and the first working surface of described semiconductor chilling plate 106, the first fin 109, first air inlet 102, first fan 108 and the first air outlet 101 are formed described first heat-exchange system 120; Second working surface of described semiconductor chilling plate 106, the second fin 110, second fan 112, second air inlet 113 and the second air outlet 114 are formed described second heat-exchange system 121.

Particularly, described method also comprises, and in described first air outlet 101 and described second air outlet 114 is arranged at the leading flank of described shell 100, and another is arranged at the end face of described shell 100, bottom surface, trailing flank, left surface or right flank; Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or right flank; And, described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or right flank.

Particularly, described method also comprises, and is aided with the first conductive substrate 104 at the first working surface of described semiconductor chilling plate 106, makes described first fin 109 and described first conductive substrate 104 thermo-contact; Be aided with the second conductive substrate 105 at the second working surface of described semiconductor chilling plate 106, make described second fin 110 and described second conductive substrate 105 thermo-contact.

As one of specific embodiment, described method also comprises, and is limited in one of them chamber by described semiconductor chilling plate 106; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 and described second fin 110 are limited in different chambers; Each chamber, sets out air port and air inlet in described shell 100 correspondence.

Particularly, described method also comprises, and the first working surface of described semiconductor chilling plate 106, the first fin 109, first air inlet 102, first fan 108 and the first air outlet 101 are formed described first heat-exchange system 120; Second working surface of described semiconductor chilling plate 106, heat pipe 111, second fin 110, second fan 112, second air inlet 113 and the second air outlet 114 are formed described second heat-exchange system 121.

Particularly, described method also comprises, and in described first air outlet 101 and described second air outlet 114 is arranged at the leading flank of described shell 100, and another is arranged at the end face of described shell 100, bottom surface, trailing flank, left surface or right flank; Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or right flank; And described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or right flank.

Particularly, described method also comprises, and is aided with the first conductive substrate 104 at the first working surface of described semiconductor chilling plate 106, makes described first fin 109 and described first conductive substrate 104 thermo-contact; Be aided with the second conductive substrate 105 at the second working surface of described semiconductor chilling plate 106, make described second fin 110 by heat pipe and described second conductive substrate 105 thermo-contact.

Particularly, described method also comprises, and have in the chamber of described semiconductor chilling plate 106 in restriction and arrange supporter 115, described supporter 115 end face establishes holding tank, and the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.Described supporter 115 is the non-conductor of heat, and described supporter 115 arranges heat pipe hole, makes described heat pipe 111 run through described heat pipe hole.

As one of detailed description of the invention, with at least two dividing plates 122 longitudinally arranged, described cavity 107 is divided at least three chambers.Specifically, with two dividing plates 122 longitudinally arranged, described cavity 107 is divided into three chambers.

As one of specific embodiment, described method also comprises, and is limited to by described semiconductor chilling plate 106 in middle chamber; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 is limited to middle chamber, described second fin 110 comprises two groups of fins, is limited to respectively in the chamber of both sides; Each chamber, sets out air port and air inlet in described shell 100 correspondence.

Particularly, described method also comprises, and arranges supporter 115 in described intermediate cavity, and described supporter 115 end face establishes holding tank, is contained in described holding tank by the second working surface of described semiconductor chilling plate 106.Described supporter 115 arranges heat pipe hole, and described heat pipe 111 is run through described heat pipe hole.

As one of specific embodiment, be limited in a side cavity by the first working surface of described semiconductor chilling plate 106, the second working surface is limited in intermediate cavity; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 is limited to a side cavity, and described second fin 110 comprises two groups of fins, is limited in intermediate cavity and in opposite side chamber respectively; Each chamber, sets out air port and air inlet in described shell 100 correspondence.

As embodiment 6, relate to a kind of bottom installation method of semiconductor refrigerating module, this semiconductor refrigerating module is formed primarily of the first heat-exchange system 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, and described semiconductor chilling plate 106 comprises the first working surface and the second working surface; Described cavity 107, by least one dividing plate 122 longitudinally arranged, is divided at least two chambers; Described semiconductor chilling plate 106 is restricted in section chambers, and/or the first working surface of described semiconductor chilling plate 106 and the second working surface are limited in different chambers respectively; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 and described second fin 110 are restricted in different chambers; Each restriction has the chamber of the first fin 109 or the second fin 110, and be provided with air outlet and air inlet in described shell 100 correspondence, described method comprises, and described shell 100 is integrated into the step on the horizontal shell 313 of smoke exhaust ventilator.

Particularly, described being integrated into by shell 100 on the horizontal shell 313 of smoke exhaust ventilator refers to, shell 100 is integrated into smoke exhaust ventilator horizontal shell 313 dead ahead.

Specifically, described being integrated into by shell 100 on the horizontal shell 313 of smoke exhaust ventilator refers to, between described shell 100 and the horizontal shell 313 of smoke exhaust ventilator, insert is set, described shell 100 and the horizontal shell 313 of smoke exhaust ventilator are individually fixed in the both sides up and down of insert, make to retain certain space between described shell 100 and the horizontal shell of smoke exhaust ventilator 313.Described insert can be U-shaped support 317.

Particularly, described being integrated into by described shell 100 on the horizontal shell 313 of smoke exhaust ventilator refers to, support bar is established in semiconductor refrigerating module housing 100 two side, cooking-fume exhausting hood housing is fixed in this support bar lower end, makes to retain certain space between semiconductor refrigerating module housing 100 and the horizontal shell of smoke exhaust ventilator 313.

Figure 17 is semiconductor refrigerating module and the integrated schematic three dimensional views of the horizontal shell of smoke exhaust ventilator.Can find out, semiconductor refrigerating module can with smoke exhaust ventilator external harmoniousness, can be integrated on cooking-fume exhausting hood housing, preferentially be integrated into the horizontal shell dead ahead of smoke exhaust ventilator.

Smoke exhaust ventilator 151 shell comprises the horizontal shell 313 of smoke exhaust ventilator and smoke exhaust ventilator flue collector shell 310.Smoke exhaust ventilator flue collector is 316.As shown in figure 13, semiconductor refrigerating module 150 external harmoniousness, on the horizontal shell 313 of smoke exhaust ventilator 151, is not limited to external harmoniousness certainly to dead ahead.Smoke exhaust ventilator control panel 315 send automatically controlled instruction can to semiconductor refrigerating module 150, or semiconductor refrigerating module carries control panel and carries out automatic control.In a detailed description of the invention, the cold and hot end air inlet of design is all positioned at semiconductor refrigerating module 150 lower end, then need to make to keep certain distance between module housing 100 bottom surface and the horizontal shell 313 of smoke exhaust ventilator, but not close contact, can communicate with outside air to keep air inlet.Such as, module lower end is with welding or other mode configuring u supports 317, and about support and front one or segmentation, make holder back section be empty, ensure air intake.Or establish support bar in semiconductor refrigerating module housing 100 two side, cooking-fume exhausting hood housing is fixed in this support bar lower end, make to retain certain space between semiconductor refrigerating module housing 100 and the horizontal shell of smoke exhaust ventilator 313.

Particularly, the semiconductor refrigerating module that the present embodiment is installed can be the arbitrary described semiconductor refrigerating module of embodiment 1-4.

As embodiment 7, relate to a kind of side installation method of semiconductor refrigerating module, this semiconductor refrigerating module is formed primarily of the first heat-exchange system 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, and described semiconductor chilling plate 106 comprises the first working surface and the second working surface; Described cavity 107, by least one dividing plate 122 longitudinally arranged, is divided at least two chambers; Described semiconductor chilling plate 106 is restricted in section chambers, and/or the first working surface of described semiconductor chilling plate 106 and the second working surface are limited in different chambers respectively; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 and described second fin 110 are restricted in different chambers; Each restriction has the chamber of the first fin 109 or the second fin 110, and be provided with air outlet and air inlet in described shell 100 correspondence, described method comprises, and described shell 100 is integrated into the step on smoke exhaust ventilator flue collector shell 310.

Particularly, described being integrated on smoke exhaust ventilator flue collector shell 310 by described shell 100 refers to, shell 100 is integrated into dead ahead on smoke exhaust ventilator flue collector shell 310.

Specifically, described being integrated into by shell 100 on smoke exhaust ventilator flue collector shell 310 refers to, shell 100 is adhered to flue collector shell 310, or uses loose collar that semiconductor refrigerating module is fixed on flue collector shell 310.

As preferably, the distance between described shell 100 and the horizontal shell 313 of described smoke exhaust ventilator is n, and wherein, n is greater than zero.

Figure 18 is semiconductor refrigerating module and the integrated schematic three dimensional views of smoke exhaust ventilator flue collector shell.Can find out, semiconductor refrigerating module 150 can with smoke exhaust ventilator 151 external harmoniousness, can be integrated on smoke exhaust ventilator flue collector shell 310, preferentially be integrated into flue collector shell 310 dead ahead.Particularly, can be that semiconductor refrigerating module 150 is adhered to flue collector shell 310, also can be use loose collar that semiconductor refrigerating module 150 is fixed on flue collector shell 310, can also be that semiconductor refrigerating module 150 can be fixed on the mode of flue collector shell 310 by other.In a detailed description of the invention, when semiconductor refrigerating module 150 external harmoniousness is on smoke exhaust ventilator flue collector shell 310, the cold and hot end air intake of module enters all from below, hot blast blows out from top, now, need to keep suitable distance between this semiconductor refrigerating module 150 lower end and the horizontal shell of smoke exhaust ventilator 313, so that air inlet can communicate with outside air.

Utility model point of the present utility model is, a kind of cold-hot wind isolation method of semiconductor refrigerating module is provided, this semiconductor refrigerating module is formed primarily of the first heat-exchange system 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, described semiconductor chilling plate 106 comprises the first working surface and the second working surface, and described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; By with at least one dividing plate 122 longitudinally arranged, described cavity 107 is divided at least two chambers; Described semiconductor chilling plate 106 is limited in section chambers, and/or the first working surface of described semiconductor chilling plate 106 and the second working surface are limited in different chambers respectively; Described first fin 109 and described second fin 110 are limited in different chambers; And, make each restriction have the chamber of the first fin 109 or the second fin 110, set out air port and air inlet in described shell 100 correspondence, realize the cold-hot wind isolation of semiconductor refrigerating module.

As one of detailed description of the invention, described cavity 107, by the dividing plate 122 longitudinally arranged, is divided into two chambers.

As one of specific embodiment, the first working surface of described semiconductor chilling plate 106 and the second working surface are limited in two chambers respectively; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first heat-exchange system 120 and described second heat-exchange system 121 are limited in two chambers respectively; Each chamber, is provided with air outlet and air inlet in described shell 100 correspondence.

As one of specific embodiment, described semiconductor chilling plate 106 is restricted in one of them chamber; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 and described second fin 110 are restricted in different chambers; Each chamber, is provided with air outlet and air inlet in described shell 100 correspondence.

Specifically, the first working surface of described semiconductor chilling plate 106 can be aided with the first conductive substrate 104, described first fin 109 and described first conductive substrate 104 thermo-contact; Second working surface of semiconductor chilling plate 106 described in 1 also can be aided with the second conductive substrate 105, described second fin 110 and described second conductive substrate 105 thermo-contact.

Specifically, restriction has in the chamber of described semiconductor chilling plate 106 can be provided with supporter 115, and described supporter 115 end face establishes holding tank, and the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.Described supporter 115 is the non-conductor of heat, and described supporter 115 is provided with heat pipe hole, and described heat pipe 111 runs through described heat pipe hole.

As one of detailed description of the invention, described cavity 107, by two dividing plates 122 longitudinally arranged, is divided into three chambers.

As one of specific embodiment, described semiconductor chilling plate 106 is restricted in middle chamber; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 is restricted to middle chamber, and described second fin 110 comprises two groups of fins, is restricted to respectively in the chamber of both sides; Each chamber, is provided with air outlet and air inlet in described shell 100 correspondence.

As one of detailed description of the invention, the first working surface of described semiconductor chilling plate 106 is restricted in a side cavity, and the second working surface is restricted in intermediate cavity; Described first heat-exchange system 120 comprises the first working surface and first fin 109 of described semiconductor chilling plate 106; Described second heat-exchange system 121 comprises the second working surface and second fin 110 of described semiconductor chilling plate 106; Described first fin 109 is restricted to a side cavity, and described second fin 110 comprises two groups of fins, is restricted in intermediate cavity and in opposite side chamber respectively; Each chamber, is provided with air outlet and air inlet in described shell 100 correspondence.

The above embodiment is only for absolutely proving the preferred embodiment that the utility model is lifted, and protection domain of the present utility model is not limited thereto.The equivalent alternative or conversion that those skilled in the art do on the utility model basis, all within protection domain of the present utility model.Protection domain of the present utility model is as the criterion with claims.

Claims

1. a semiconductor refrigerating module, it is characterized in that: this semiconductor refrigerating module is formed primarily of the first heat-exchange system (120), the second heat-exchange system (121), semiconductor chilling plate (106) and shell (100), described shell (100) surrounds cavity (107)

Described semiconductor chilling plate (106) comprises the first working surface and the second working surface;

Described cavity (107) is divided at least two chambers by least one dividing plate (122) longitudinally arranged;

Described semiconductor chilling plate (106) is restricted in section chambers, and/or the first working surface of described semiconductor chilling plate (106) and the second working surface are limited in different chambers respectively;

Described first heat-exchange system (120) comprises the first working surface and first fin (109) of described semiconductor chilling plate (106);

Described second heat-exchange system (121) comprises the second working surface and second fin (110) of described semiconductor chilling plate (106);

Described first fin (109) and described second fin (110) are restricted in different chambers;

Each restriction has the chamber of the first fin (109) or the second fin (110), is provided with air outlet and air inlet in described shell (100) correspondence.

2. semiconductor refrigerating module described in claim 1, is characterized in that: described cavity (107) is divided into two chambers by the dividing plate (122) longitudinally arranged.

3. semiconductor refrigerating module described in claim 2, is characterized in that: the first working surface of described semiconductor chilling plate (106) and the second working surface are limited in two chambers respectively;

Described first heat-exchange system (120) and described second heat-exchange system (121) are limited in two chambers respectively;

Each chamber, is provided with air outlet and air inlet in described shell (100) correspondence.

4. semiconductor refrigerating module described in claim 3, is characterized in that: described first heat-exchange system (120) comprises the first working surface of semiconductor chilling plate (106), the first fin (109), the first air inlet (102), the first fan (108) and the first air outlet (101); Described second heat-exchange system (121) comprises the second working surface of semiconductor chilling plate (106), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

5. semiconductor refrigerating module described in claim 4, it is characterized in that: described first air outlet (101) and described second air outlet (114), a leading flank being arranged at described shell (100), another is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank; Described first air inlet (102) is arranged at end face, bottom surface, trailing flank, left surface or right flank; Described second air inlet (113) is arranged at end face, bottom surface, trailing flank, left surface or right flank.

6. semiconductor refrigerating module described in claim 5, it is characterized in that: the first working surface of described semiconductor chilling plate (106) is aided with the first conductive substrate (104), described first fin (109) and the thermo-contact of described first conductive substrate (104).

7. semiconductor refrigerating module described in claim 6, it is characterized in that: the second working surface of described semiconductor chilling plate (106) is aided with the second conductive substrate (105), described second fin (110) and the thermo-contact of described second conductive substrate (105).

8. semiconductor refrigerating module described in claim 2, is characterized in that: described semiconductor chilling plate (106) is restricted in one of them chamber;

9. semiconductor refrigerating module described in claim 8, is characterized in that: described first heat-exchange system (120) comprises the first working surface of semiconductor chilling plate (106), the first fin (109), the first air inlet (102), the first fan (108) and the first air outlet (101); Described second heat-exchange system (121) comprises the second working surface of semiconductor chilling plate (106), heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

10. semiconductor refrigerating module described in claim 9, it is characterized in that: in described first air outlet (101) and described second air outlet (114), a leading flank being arranged at described shell (100), another is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank; Described first air inlet (102) is arranged at end face, bottom surface, trailing flank, left surface or right flank; Described second air inlet (113) is arranged at end face, bottom surface, trailing flank, left surface or right flank.

Semiconductor refrigerating module described in 11. claims 10, it is characterized in that: the first working surface of described semiconductor chilling plate (106) is aided with the first conductive substrate (104), described first fin (109) and the thermo-contact of described first conductive substrate (104).

Semiconductor refrigerating module described in 12. claims 10, it is characterized in that: the second working surface of described semiconductor chilling plate (106) is aided with the second conductive substrate (105), described second fin (110) and the thermo-contact of described second conductive substrate (105).

Semiconductor refrigerating module described in 13. claims 10, it is characterized in that: restriction has in the chamber of described semiconductor chilling plate (106) and is provided with supporter (115), described supporter (115) end face establishes holding tank, and the second working surface of described semiconductor chilling plate (106) is contained in described holding tank.

Semiconductor refrigerating module described in 14. claims 13, is characterized in that: described supporter (115) is the non-conductor of heat, and described supporter (115) is provided with heat pipe hole, and described heat pipe (111) runs through described heat pipe hole.

Semiconductor refrigerating module described in 15. claims 1, is characterized in that: described cavity (107) is divided at least three chambers by least two dividing plates (122) longitudinally arranged.

Semiconductor refrigerating module described in 16. claims 15, is characterized in that: described cavity (107) is divided into three chambers by two dividing plates (122) longitudinally arranged.

Semiconductor refrigerating module described in 17. claims 16, is characterized in that: described semiconductor chilling plate (106) is restricted in middle chamber;

Described first fin (109) is restricted to middle chamber, and described second fin (110) comprises two groups of fins, is restricted to respectively in the chamber of both sides;

Semiconductor refrigerating module described in 18. claims 17, is characterized in that: described first heat-exchange system (120) comprises the first working surface of semiconductor chilling plate (106), the first fin (109), the first air inlet (102), the first fan (108) and the first air outlet (101); Described second heat-exchange system (121) comprises the second working surface of semiconductor chilling plate (106), heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

Semiconductor refrigerating module described in 19. claims 18, it is characterized in that: in described first air outlet (101) and described second air outlet (114), a leading flank being arranged at described shell (100), another is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank; Described first air inlet (102) is arranged at end face, bottom surface, trailing flank, left surface or right flank; Described second air inlet (113) is arranged at end face, bottom surface, trailing flank, left surface or right flank.

Semiconductor refrigerating module described in 20. claims 19, it is characterized in that: the first working surface of described semiconductor chilling plate (106) is aided with the first conductive substrate (104), described first fin (109) and the thermo-contact of described first conductive substrate (104).

Semiconductor refrigerating module described in 21. claims 20, it is characterized in that: the second working surface of described semiconductor chilling plate (106) is aided with the second conductive substrate (105), described second fin (110) and the thermo-contact of described second conductive substrate (105).

Semiconductor refrigerating module described in 22. claims 21, it is characterized in that: in described intermediate cavity, be provided with supporter (115), described supporter (115) end face establishes holding tank, and the second working surface of described semiconductor chilling plate (106) is contained in described holding tank.

Semiconductor refrigerating module described in 23. claims 22, is characterized in that: described supporter (115) is the non-conductor of heat, and described supporter (115) is provided with heat pipe hole, and described heat pipe (111) runs through described heat pipe hole.

Semiconductor refrigerating module described in 24. claims 16, is characterized in that: the first working surface of described semiconductor chilling plate (106) is restricted in a side cavity, and the second working surface is restricted in intermediate cavity;

Described first fin (109) is restricted to the first working surface side chamber, and described second fin (110) comprises two groups of fins, is restricted in intermediate cavity and in opposite side chamber respectively;

Semiconductor refrigerating module described in 25. claims 24, is characterized in that: described first heat-exchange system (120) comprises the first working surface of semiconductor chilling plate (106), the first fin (109), the first air inlet (102), the first fan (108) and the first air outlet (101); Described second heat-exchange system (121) comprises the second working surface of semiconductor chilling plate (106), heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

Semiconductor refrigerating module described in 26. claims 25, it is characterized in that: in described first air outlet (101) and described second air outlet (114), a leading flank being arranged at described shell (100), another is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank; Described first air inlet (102) is arranged at end face, bottom surface, trailing flank, left surface or right flank; Described second air inlet (113) is arranged at end face, bottom surface, trailing flank, left surface or right flank.

Semiconductor refrigerating module described in 27. claims 26, it is characterized in that: the first working surface of described semiconductor chilling plate (106) is aided with the first conductive substrate (104), described first fin (109) and the thermo-contact of described first conductive substrate (104).

Semiconductor refrigerating module described in 28. claims 27, it is characterized in that: the second working surface of described semiconductor chilling plate (106) is aided with the second conductive substrate (105), described second fin (110) and the thermo-contact of described second conductive substrate (105).

Semiconductor refrigerating module described in 29. any one of claim 1-28, is characterized in that, the air outlet being located at described shell (100) leading flank is provided with wind-guiding grid (103).

Described in 30. claims 29, semiconductor refrigerating module, is characterized in that, described air inlet and described air outlet all arrange wind-guiding grid (103).

Semiconductor refrigerating module described in 31. any one of claim 6,11,20 or 27, is characterized in that: be aided with heat-conducting silicone grease (200) between the first working surface of described semiconductor chilling plate (106) and the first conductive substrate (104).

Semiconductor refrigerating module described in 32. any one of claim 7,12,21 or 28, is characterized in that: be aided with heat-conducting silicone grease (201) between the second working surface of described semiconductor chilling plate (106) and the second conductive substrate (105).

Semiconductor refrigerating module described in 33. any one of claim 4,9,18 or 25, is characterized in that: described first heat-exchange system (120) also comprises the first air intake tuyere (117) and the first air-out tuyere (118).

34. smoke exhaust ventilators, is characterized in that, described smoke exhaust ventilator comprises the semiconductor refrigerating module described in any one of claim 1-33.