CN105987533A - Semiconductor refrigeration module and range hood - Google Patents

Abstract

The invention discloses a semiconductor refrigeration module. The semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a shell, wherein a hollow cavity is surrounded by the shell; the semiconductor refrigeration sheet comprises a first working surface and a second working surface; the first heat exchange system comprises the first working surface of the semiconductor refrigeration sheet and a first fin; the second heat exchange system comprises the second working surface of the semiconductor refrigeration sheet and a second fin; the hollow cavity is divided into at least two chambers through at least one separation plate which is vertically arranged; the first heat exchange system is arranged in one part of the chamber; the chamber provided with the first heat exchange system is divided into an inner cavity and an outer cavity; and the first working surface of the semiconductor refrigeration sheet and the first fin are limited in the inner cavity. The invention further discloses a range hood applying the semiconductor refrigeration module. By physically isolating the two heat exchange systems, the energy utilization efficiency is improved.

Description

Semiconductor refrigerating module and smoke exhaust ventilator

Technical field

The present invention relates to a kind of semiconductor refrigerating module and smoke exhaust ventilator.

Background technology

It is an arduous housework in the culinary art of cooking of kitchen focus edge of table, particularly in summer, the heat that originally hot weather sends plus kitchen range, make working environment in kitchen the harshest.

The problem too high in order to solve kitchen temperature, has people to install fan or air-conditioning in kitchen, but fan blowing refrigeration is general, and can affect gas-cooker and normally work, there is also potential safety hazard.Due to the oil smoke surroundings that kitchen is special, after general fan uses a period of time, fan adheres to substantial amounts of putty, is difficult to clean, will also result in the pollution of kitchen environment.

Air-conditioning equipment is installed in kitchen, on the one hand there is Cost Problems, on the other hand also can there is the problem being difficult to clean, after air-conditioning heat exchanger surface attachment oil smoke, there is also the problem that refrigeration declines.

Summary of the invention

In order to solve what prior art existed, using air-conditioning relatively costly in kitchen, and be difficult to clean and the low inferior problem of temperature regulation effect, the present invention provides a kind of semiconductor refrigerating module, and is installed and be applied in smoke exhaust ventilator.

As one aspect of the present invention, relate to a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate includes the first working surface and the second working surface；Described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor refrigerating；Described cavity, by least one longitudinally disposed dividing plate, is divided at least two chamber, is provided with the first heat-exchange system in section chambers；The chamber being provided with the first heat-exchange system is divided into inner chamber and exocoel, and the first working surface and first fin of described semiconductor chilling plate are restricted to described inner chamber.

Specifically, the second working surface of described semiconductor chilling plate is restricted to described inner chamber or described exocoel；Described first fin is restricted to different chambers from described second fin；Each restriction has the first fin or the chamber of the second fin, is correspondingly provided with air outlet and air inlet at described shell.

As one of detailed description of the invention, described cavity, by a longitudinally disposed dividing plate, is divided into two chambers, and one of them chamber is divided into inner chamber and exocoel.

As one of specific embodiment, described semiconductor chilling plate is restricted to described inner chamber；Described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；Described first fin is restricted to described inner chamber；Described second fin is restricted in another chamber；Each chamber, is correspondingly provided with air outlet and air inlet at described shell.

Specifically, it may be that described first heat-exchange system includes the first working surface of semiconductor chilling plate, the first fin, the first air intake tuyere, the first air-out tuyere, the first wind inlet channel, the first air inlet, the first fan and the first air outlet；Described second heat-exchange system includes the second working surface of semiconductor chilling plate, heat pipe, the second fin, the second fan, the second air inlet and the second air outlet.

More specifically, it may be that described first air outlet is arranged at the leading flank of described shell；Described second air outlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank；Described first air inlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank；Described second air inlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank.

First working surface of described semiconductor chilling plate can be aided with the first conductive substrate, and described first fin thermally contacts with described first conductive substrate.Second working surface of described semiconductor chilling plate can be aided with the second conductive substrate, and described second fin thermally contacts with described second conductive substrate.

Described inner chamber can be provided with supporter, and described supporter end face sets holding tank, and the second working surface of described semiconductor chilling plate is contained in described holding tank.It may be that the non-conductor that described supporter is heat, described supporter is provided with heat pipe hole, and described heat pipe runs through described heat pipe hole.

As one of specific embodiment, the first working surface of described semiconductor chilling plate and the second working surface are restricted to described inner chamber and described exocoel respectively；Described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；Described first fin is restricted to described inner chamber；Described second fin is restricted in another chamber；Each chamber, is correspondingly provided with air outlet and air inlet at described shell.

Specifically, it may be that described first heat-exchange system includes the first working surface of semiconductor chilling plate, the first fin, the first air intake tuyere, the first air-out tuyere, the first wind inlet channel, the first air inlet, the first fan and the first air outlet；Described second heat-exchange system includes the second working surface of semiconductor chilling plate, heat pipe, the second fin, the second fan, the second air inlet and the second air outlet.

More specifically, it may be that described first air outlet is arranged at the leading flank of described shell；Described second air outlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank；Described first air inlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank；Described second air inlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank.

First working surface of described semiconductor chilling plate can be aided with the first conductive substrate, and described first fin thermally contacts with described first conductive substrate.Second working surface of described semiconductor chilling plate can be aided with the second conductive substrate, and described second fin thermally contacts with described second conductive substrate.

Described exocoel can be provided with supporter, and described supporter end face sets holding tank, and the second working surface of described semiconductor chilling plate is contained in described holding tank.It may be that the non-conductor that described supporter is heat, described supporter is provided with heat pipe hole, and described heat pipe runs through described heat pipe hole.

As one of detailed description of the invention, described cavity, by longitudinally disposed at least two dividing plate, is divided at least three chamber, and section chambers is divided into inner chamber and exocoel.Specifically, it may be that described cavity is by two longitudinally disposed dividing plates, being divided into three chambers, intermediate cavity is divided into inner chamber and exocoel.

As one of specific embodiment, described semiconductor chilling plate is restricted to the inner chamber of intermediate cavity；Described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；Described first fin is restricted to the inner chamber of intermediate cavity；Described second fin includes two groups of fins, is restricted to respectively in the chamber of both sides；Each chamber, is correspondingly provided with air outlet and air inlet at described shell.

Specifically, it may be that described first heat-exchange system includes the first working surface of semiconductor chilling plate, the first fin, the first air intake tuyere, the first air-out tuyere, the first wind inlet channel, the first air inlet, the first fan and the first air outlet；Described second heat-exchange system includes the second working surface of semiconductor chilling plate, heat pipe, the second fin, the second fan, the second air inlet and the second air outlet.

More specifically, it may be that described first air outlet is arranged at the leading flank of described shell；Described second air outlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank；Described first air inlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank；Described second air inlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank.

First working surface of described semiconductor chilling plate can be aided with the first conductive substrate, and described first fin thermally contacts with described first conductive substrate.Second working surface of described semiconductor chilling plate can be aided with the second conductive substrate, and described second fin thermally contacts with described second conductive substrate.

The inner chamber of described intermediate cavity can be provided with supporter, and described supporter end face sets holding tank, and the second working surface of described semiconductor chilling plate is contained in described holding tank.It may be that the non-conductor that described supporter is heat, described supporter is provided with heat pipe hole, and described heat pipe runs through described heat pipe hole.

As one of specific embodiment, the first working surface of described semiconductor chilling plate and the second working surface are restricted to inner chamber and the exocoel of intermediate cavity respectively；Described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；Described first fin is restricted to described inner chamber；Described second fin includes two groups of fins, is restricted to respectively in two side cavity；Each chamber, is correspondingly provided with air outlet and air inlet at described shell.

Specifically, it may be that described first heat-exchange system includes the first working surface of semiconductor chilling plate, the first fin, the first air intake tuyere, the first air-out tuyere, the first wind inlet channel, the first air inlet, the first fan and the first air outlet；Described second heat-exchange system includes the second working surface of semiconductor chilling plate, heat pipe, the second fin, the second fan, the second air inlet and the second air outlet.

More specifically, it may be that described first air outlet is arranged at the leading flank of described shell；Described second air outlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank；Described first air inlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank；Described second air inlet is arranged at the end face of described shell, bottom surface, trailing flank, left surface or right flank.

First working surface of described semiconductor chilling plate can be aided with the first conductive substrate, and described first fin thermally contacts with described first conductive substrate.Second working surface of described semiconductor chilling plate can be aided with the second conductive substrate, and described second fin thermally contacts with described second conductive substrate.

The exocoel of described intermediate cavity can be provided with supporter, and described supporter end face sets holding tank, and the second working surface of described semiconductor chilling plate is contained in described holding tank.It may be that the non-conductor that described supporter is heat, described supporter is provided with heat pipe hole, and described heat pipe runs through described heat pipe hole.

As one of detailed description of the invention, described first air outlet can be provided with wind-guiding grid.Preferably, described air inlet and described air outlet all can arrange wind-guiding grid.

As one of specific embodiment, between the first working surface and first conductive substrate of described semiconductor chilling plate, heat-conducting silicone grease can be aided with.Heat-conducting silicone grease can be aided with between second working surface and second conductive substrate of described semiconductor chilling plate.

As another aspect of the present invention, relating to a kind of smoke exhaust ventilator, described smoke exhaust ventilator includes aforesaid semiconductor refrigerating module.

As the third aspect of the invention, relate to the preparation method of a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly by the first heat-exchange system, second heat-exchange system, semiconductor chilling plate and shell are constituted, described shell surrounds cavity, described semiconductor chilling plate includes the first working surface and the second working surface, described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate, described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate, described method includes, with at least one longitudinally disposed dividing plate, described cavity is divided at least two chamber, the first heat-exchange system it is provided with in section chambers；The chamber being provided with the first heat-exchange system is divided into inner chamber and exocoel, the first working surface of described semiconductor chilling plate and the first fin are limited to the step of described inner chamber.

Described method can also include, the second working surface of described semiconductor chilling plate is limited to described inner chamber or the step of described exocoel.

Described method can also include, described first fin and described second fin are limited to the step in different chambers.

As one of embodiment, each restriction has the first fin or the chamber of the second fin, sets out air port and air inlet in described shell correspondence.

As the fourth aspect of the invention, relate to the bottom installation method of a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate includes the first working surface and the second working surface；Described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；Described cavity, by least one longitudinally disposed dividing plate, is divided at least two chamber, is provided with the first heat-exchange system in section chambers；The chamber being provided with the first heat-exchange system is divided into inner chamber and exocoel, and the first working surface of described semiconductor chilling plate and the first fin are restricted to described inner chamber, and described method includes, described shell is integrated into the step on the horizontal shell of smoke exhaust ventilator.

Specifically, described being integrated into by shell on the horizontal shell of smoke exhaust ventilator refers to, shell is integrated into smoke exhaust ventilator horizontal shell dead ahead.

Specifically, described being integrated into by shell on the horizontal shell of smoke exhaust ventilator refers to, between the horizontal shell of described shell and smoke exhaust ventilator, insert is set, horizontal to described shell and smoke exhaust ventilator shell is individually fixed in the both sides up and down of insert so that between described shell and the horizontal shell of smoke exhaust ventilator, retain certain space.Described insert can be U-bracket.

Specifically, described being integrated into by described shell on the horizontal shell of smoke exhaust ventilator refers to, setting support bar in semiconductor refrigerating module housing two side, cooking-fume exhausting hood housing is fixed in this support bar lower end so that retain certain space between semiconductor refrigerating module housing and the horizontal shell of smoke exhaust ventilator.

As the fifth aspect of the invention, relate to the side installation method of a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate includes the first working surface and the second working surface；Described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；Described cavity, by least one longitudinally disposed dividing plate, is divided at least two chamber, is provided with the first heat-exchange system in section chambers；The chamber being provided with the first heat-exchange system is divided into inner chamber and exocoel, and the first working surface of described semiconductor chilling plate and the first fin are restricted to described inner chamber, and described method includes, described shell is integrated into the step on smoke exhaust ventilator flue collector shell.

Specifically, described being integrated into by described shell on smoke exhaust ventilator flue collector shell refers to, shell is integrated into dead ahead on smoke exhaust ventilator flue collector shell.

Specifically, described being integrated into by shell on smoke exhaust ventilator flue collector shell refers to, shell is adhered to flue collector shell, or uses loose collar that semiconductor refrigerating module is fixed on flue collector shell.

As preferably, the distance between described shell and the horizontal shell of described smoke exhaust ventilator is n, and wherein, n is more than zero.

As the sixth aspect of the invention, relate to the cold-hot wind isolation method of a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, described semiconductor chilling plate includes that the first working surface and the second working surface, described first heat-exchange system include the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；By with at least one longitudinally disposed dividing plate, described cavity being divided at least two chamber, in section chambers, it is provided with the first heat-exchange system；The chamber being provided with the first heat-exchange system is divided into inner chamber and exocoel, the first working surface and first fin of described semiconductor chilling plate are limited to described inner chamber；Second working surface of described semiconductor chilling plate is limited to described inner chamber or exocoel；Described first fin and described second fin are limited in different chambers, it is achieved the cold-hot wind isolation of semiconductor refrigerating module.

Each restriction has the first fin or the chamber of the second fin, is correspondingly provided with air outlet and air inlet at described shell.

The embodiment of the present invention at least achieves following beneficial effect:

1, the semiconductor refrigerating module that the present invention provides, structure design is the compactest, is simple to manufacture, and low cost；

2, the present invention will be equipped with the module housing of semiconductor refrigerating module and is installed on the horizontal shell of cooking-fume exhausting hood housing or on flue collector shell, it is all not take up the volume of cooking-fume exhausting hood housing inner chamber, the most do not affect cooking-fume exhausting hood housing internal structure, and during smoke exhaust ventilator cleaning, only module housing need to be taken off from cooking-fume exhausting hood housing, can conveniently clean, therefore it is not only easy to installing/dismounting, and is readily cleaned maintenance.

3, by by the physical isolation of two heat-exchange systems, being effectively increased the utilization ratio of energy.

Accompanying drawing explanation

Fig. 1 is the semiconductor refrigerating module schematic top plan view of one of the embodiment of the present invention；

Fig. 2 is the semiconductor refrigerating module right view of one of the embodiment of the present invention；

Fig. 3 is the semiconductor refrigerating inside modules structure front view of one of the embodiment of the present invention；

Fig. 4 is the semiconductor refrigerating module housing schematic three dimensional views of one of the embodiment of the present invention；

Fig. 5 is the semiconductor refrigerating module schematic top plan view of the two of the embodiment of the present invention；

Fig. 6 is the semiconductor refrigerating module right view of the two of the embodiment of the present invention；

Fig. 7 is the semiconductor refrigerating inside modules structure front view of the two of the embodiment of the present invention；

Fig. 8 is the semiconductor refrigerating module housing schematic three dimensional views of the two of the embodiment of the present invention；

Fig. 9 is the semiconductor refrigerating module schematic top plan view of the three of the embodiment of the present invention；

Figure 10 is the semiconductor refrigerating module right view of the three of the embodiment of the present invention；

Figure 11 is the semiconductor refrigerating inside modules structure front view of the three of the embodiment of the present invention；

Figure 12 is the semiconductor refrigerating module housing schematic three dimensional views of the three of the embodiment of the present invention；

Figure 13 is the semiconductor refrigerating module schematic top plan view of the four of the embodiment of the present invention；

Figure 14 is the semiconductor refrigerating module right view of the four of the embodiment of the present invention；

Figure 15 is the semiconductor refrigerating inside modules structure front view of the four of the embodiment of the present invention；

Figure 16 is the semiconductor refrigerating module housing schematic three dimensional views of the four of the embodiment of the present invention；

Figure 17 is the axonometric chart that semiconductor refrigerating module of the present invention is installed on the horizontal shell of smoke exhaust ventilator；

Figure 18 is that semiconductor refrigerating module is installed on the axonometric chart of smoke exhaust ventilator flue collector shell by the present invention.

Detailed description of the invention

The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, so that those skilled in the art can be better understood from the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.

Embodiments provide semiconductor refrigerating module and the smoke exhaust ventilator of this refrigeration module of external harmoniousness.Semiconductor refrigerating module, based on semiconductor chilling plate, and with the use of fin heat exchange, the cold or the heat that semiconductor chilling plate energising are produced by fan are blown out.Can be user's cold environment or thermal environment of producing a local, meet the comfortableness requirement of people.Semiconductor chilling plate has two working surfaces, and upper end is the first working surface, and lower end is the second working surface, and when the first working surface is hot junction, the second working surface is cold end；When the first working surface is cold end, the second working surface is hot junction.Semiconductor refrigerating module can be integrated into cooking-fume exhausting hood housing horizontal component upper end with smoke exhaust ventilator external harmoniousness or be integrated into smoke exhaust ventilator flue collector outer casing frontispiece.Refrigeration module can work independently, it is possible to smoke exhaust ventilator intelligent linkage.

One outstanding feature of semiconductor refrigerating module provided by the present invention is, its first heat-exchange system and the second heat-exchange system achieve part, even all physical isolation, can effectively prevent the produced heat energy of semiconductor chilling plate and the two-way flow of cold energy, put forward high-octane utilization ratio, reduce power consumption.

In one detailed description of the invention, refrigeration module mode of operation has nice and cool pattern and warm pattern two kinds: when pressing nice and cool pattern, and semiconductor chilling plate upper end is cold end, and lower end is hot junction, and module front air outlet goes out cold wind；When pressing warm pattern, semiconductor chilling plate upper end is hot junction, and lower end is cold end, and module dead ahead air outlet goes out hot blast.Hereinafter, illustrate as a example by nice and cool pattern.

The present invention provides a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of first heat-exchange system the 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, and described semiconductor chilling plate 106 includes the first working surface and the second working surface；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described cavity 107, by least one longitudinally disposed dividing plate 122, is divided at least two chamber, is provided with described first heat-exchange system 120 in section chambers；The chamber being provided with described first heat-exchange system 120 is divided into inner chamber 116 and exocoel, and the first working surface and first fin 109 of described semiconductor chilling plate 106 are restricted to described inner chamber 116.

Specifically, the second working surface of described semiconductor chilling plate 106 is restricted to described inner chamber 116 or described exocoel；Described first fin 109 is restricted to different chambers from described second fin 110；Each restriction has the first fin 109 or chamber of the second fin 110, is correspondingly provided with air outlet and air inlet at described shell 100.

As embodiment 1, with reference to Fig. 1-Fig. 4, described cavity 107, by a longitudinally disposed dividing plate 122, is divided into two chambers, and one of them chamber is divided into inner chamber 116 and exocoel.Described semiconductor chilling plate 106 is restricted to described inner chamber 116；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to described inner chamber 116；Described second fin 110 is restricted in another chamber；Each chamber, is correspondingly provided with air outlet and air inlet at described shell 100.

Specifically, it may be that described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, the second fin 110, heat pipe the 111, second fan the 112, second air inlet 113 and the second air outlet 114.

More specifically, it may be that described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

Specifically, the first working surface of described semiconductor chilling plate 106 can be aided with the first conductive substrate 104, and described first fin 109 thermally contacts with described first conductive substrate 104.Second working surface of described semiconductor chilling plate 106 can be aided with the second conductive substrate 105, and described second fin 110 is thermally contacted with described second conductive substrate 105 by heat pipe.

Specifically, described inner chamber 116 can be provided with supporter 115, and described supporter 115 end face sets holding tank, and the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.It may be that the non-conductor that described supporter 115 is heat, described supporter 115 is provided with heat pipe hole, and described heat pipe 111 runs through described heat pipe hole.

As embodiment 2, with reference to Fig. 5-Fig. 8, described cavity 107, by a longitudinally disposed dividing plate 122, is divided into two chambers, and one of them chamber is divided into inner chamber 116 and exocoel.First working surface of described semiconductor chilling plate 106 and the second working surface are restricted to described inner chamber 116 and described exocoel respectively；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to described inner chamber 116；Described second fin 110 is restricted in another chamber；Each chamber, is correspondingly provided with air outlet and air inlet at described shell 100.

Specifically, it may be that described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114.

More specifically, it may be that described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

Specifically, the first working surface of described semiconductor chilling plate 106 can be aided with the first conductive substrate 104, and described first fin 109 thermally contacts with described first conductive substrate 104.Second working surface of described semiconductor chilling plate 106 can be aided with the second conductive substrate 105, and described second fin 110 is thermally contacted with described second conductive substrate 105 by heat pipe.

Specifically, described exocoel can be provided with supporter 115, and described supporter 115 end face sets holding tank, and the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.It may be that the non-conductor that described supporter 115 is heat, described supporter 115 is provided with heat pipe hole, and described heat pipe 111 runs through described heat pipe hole.

As embodiment 3, with reference to Fig. 9-Figure 12, described cavity 107, by longitudinally disposed at least two dividing plate 122, is divided at least three chamber, and section chambers is divided into inner chamber 116 and exocoel.Specifically, it may be that described cavity 107 is by two longitudinally disposed dividing plates 122, being divided into three chambers, intermediate cavity is divided into inner chamber 116 and exocoel.Described semiconductor chilling plate 106 is restricted to the inner chamber 116 of intermediate cavity；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to the inner chamber 116 of intermediate cavity；Described second fin 110 includes two groups of fins, is restricted to respectively in the chamber of both sides；Each chamber, is correspondingly provided with air outlet and air inlet at described shell 100.

Specifically, it may be that described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114.

More specifically, it may be that described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

Specifically, the first working surface of described semiconductor chilling plate 106 can be aided with the first conductive substrate 104, and described first fin 109 thermally contacts with described first conductive substrate 104；Second working surface of described semiconductor chilling plate 106 can be aided with the second conductive substrate 105, and described second fin 110 is thermally contacted with described second conductive substrate 105 by heat pipe.

Specifically, the inner chamber 116 of described intermediate cavity is also provided with supporter 115, and described supporter 115 end face sets holding tank, and the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.It may be that the non-conductor that described supporter 115 is heat, described supporter 115 is provided with heat pipe hole, and described heat pipe 111 runs through described heat pipe hole.

As embodiment 4, with reference to Figure 13-Figure 16, described cavity 107, by longitudinally disposed at least two dividing plate 122, is divided at least three chamber, and section chambers is divided into inner chamber 116 and exocoel.Specifically, it may be that described cavity 107 is by two longitudinally disposed dividing plates 122, being divided into three chambers, intermediate cavity is divided into inner chamber 116 and exocoel.First working surface of described semiconductor chilling plate 106 and the second working surface are restricted to inner chamber 116 and the exocoel of intermediate cavity respectively；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to described inner chamber 116；Described second fin 110 includes two groups of fins, is restricted to respectively in two side cavity；Each chamber, is correspondingly provided with air outlet and air inlet at described shell 100.

Specifically, it may be that described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114.

More specifically, it may be that described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

Specifically, the first working surface of described semiconductor chilling plate 106 can be aided with the first conductive substrate 104, and described first fin 109 thermally contacts with described first conductive substrate 104；Second working surface of described semiconductor chilling plate 106 can be aided with the second conductive substrate 105, and described second fin 110 is thermally contacted with described second conductive substrate 105 by heat pipe.

Specifically, the exocoel of described intermediate cavity is also provided with supporter 115, and described supporter 115 end face sets holding tank, and the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.It may be that the non-conductor that described supporter 115 is heat, described supporter 115 is provided with heat pipe hole, and described heat pipe 111 runs through described heat pipe hole.

Semiconductor refrigerating module shown in embodiment 1-4, described first air outlet 101 can be provided with wind-guiding grid 103.As preferably, described air inlet and described air outlet can also be respectively provided with wind-guiding grid 103.

Semiconductor refrigerating module shown in embodiment 1-4, can be aided with heat-conducting silicone grease 200 between the first working surface and first conductive substrate 104 of described semiconductor chilling plate 106；Heat-conducting silicone grease 201 can also be aided with between second working surface and second conductive substrate 105 of described semiconductor chilling plate 106.

The present invention also provides for a kind of smoke exhaust ventilator, and described smoke exhaust ventilator includes aforesaid semiconductor refrigerating module.

nullAs embodiment 5，Relate to the preparation method of semiconductor refrigerating module described in embodiment 1-4，This semiconductor refrigerating module is mainly by the first heat-exchange system 120、Second heat-exchange system 121、Semiconductor chilling plate 106 and shell 100 are constituted，Described shell 100 surrounds cavity 107，Described semiconductor chilling plate 106 includes the first working surface and the second working surface，Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106，Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106，Described method includes，With at least one longitudinally disposed dividing plate 122，Described cavity 107 is divided at least two chamber，The first heat-exchange system 120 it is provided with in section chambers；The chamber being provided with the first heat-exchange system 120 is divided into inner chamber 116 and exocoel, the first working surface of described semiconductor chilling plate 106 and the first fin 109 are limited to the step of described inner chamber 116.

Described method can also include, the second working surface of described semiconductor chilling plate 106 is limited to described inner chamber 116 or the step of described exocoel.

Described method can also include, described first fin 109 and described second fin 110 are limited to the step in different chambers.

As one of embodiment, each restriction has the first fin 109 or chamber of the second fin 110, sets out air port and air inlet in described shell 100 correspondence.

As one of detailed description of the invention, described method can include, with a longitudinally disposed dividing plate 122, described cavity 107 is divided into two chambers, one of them chamber is divided into inner chamber 116 and exocoel.

As one of specific embodiment, described method can include, described semiconductor chilling plate 106 is limited to described inner chamber 116；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is limited to described inner chamber 116；Described second fin 110 is limited in another chamber；Each chamber, is correspondingly provided with air outlet and air inlet at described shell 100.

Specifically, described method can also include, the first working surface of described semiconductor chilling plate 106, first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101 are constituted described first heat-exchange system 120；Second working surface of described semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114 are constituted described second heat-exchange system 121.

Specifically, described method can also include, described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；And, described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

Specifically, described method can also include, the first working surface at described semiconductor chilling plate 106 is aided with the first conductive substrate 104 so that described first fin 109 thermally contacts with described first conductive substrate 104；The second working surface at described semiconductor chilling plate 106 is aided with the second conductive substrate 105 so that described second fin 110 is thermally contacted with described second conductive substrate 105 by heat pipe.

Specifically, described method can also include, arranges supporter 115 at described inner chamber 116, and described supporter 115 end face sets holding tank so that the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.Can also include, heat pipe hole is set at described supporter 115 so that described heat pipe 111 runs through described heat pipe hole.

As one of specific embodiment, described method can include, the first working surface and second working surface of described semiconductor chilling plate 106 are limited to described inner chamber 116 and described exocoel respectively；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is limited to described inner chamber 116；Described second fin 110 is limited in another chamber；Each chamber, is correspondingly arranged air outlet and air inlet at described shell 100.

Specifically, described method can also include, the first working surface of described semiconductor chilling plate 106, first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101 are constituted described first heat-exchange system 120；Second working surface of described semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114 are constituted described second heat-exchange system 121.

Specifically, described method can also include, described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；And described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

Specifically, described method can also include, the first working surface at described semiconductor chilling plate 106 is aided with the first conductive substrate 104 so that described first fin 109 thermally contacts with described first conductive substrate 104；The second working surface at described semiconductor chilling plate 106 is aided with the second conductive substrate 105 so that described second fin 110 is thermally contacted with described second conductive substrate 105 by heat pipe.

Specifically, described method can also include, arranges supporter 115 at described exocoel, and described supporter 115 end face sets holding tank so that the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.Can also include, heat pipe hole is set at described supporter 115 so that described heat pipe 111 runs through described heat pipe hole.

As one of detailed description of the invention, described method can include, with longitudinally disposed at least two dividing plate 122, described cavity 107 is divided at least three chamber, section chambers is divided into inner chamber 116 and exocoel.Specifically, it may be that with two longitudinally disposed dividing plates 122, described cavity 107 is divided into three chambers, intermediate cavity is divided into inner chamber 116 and exocoel.

As one of specific embodiment, described method can include, described semiconductor chilling plate 106 is limited to the inner chamber 116 of intermediate cavity；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is limited to the inner chamber 116 of intermediate cavity；Described second fin 110 includes two groups of fins, is limited to respectively in the chamber of both sides；Each chamber, is correspondingly arranged air outlet and air inlet at described shell 100.

Specifically, described method can also include, the first working surface of described semiconductor chilling plate 106, first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101 are constituted described first heat-exchange system 120；Second working surface of described semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114 are constituted described second heat-exchange system 121.

Specifically, described method can also include, described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；And, described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

Specifically, described method can also include, the first working surface at described semiconductor chilling plate 106 is aided with the first conductive substrate 104 so that described first fin 109 thermally contacts with described first conductive substrate 104；The second working surface at described semiconductor chilling plate 106 is aided with the second conductive substrate 105 so that described second fin 110 is thermally contacted with described second conductive substrate 105 by heat pipe.

Specifically, described method can also include, the inner chamber 116 in described intermediate cavity arranges supporter 115, and described supporter 115 end face sets holding tank, is contained in described holding tank by the second working surface of described semiconductor chilling plate 106.Can also include, heat pipe hole is set at described supporter 115, described heat pipe 111 is run through described heat pipe hole.

As one of specific embodiment, described method can include, the first working surface of described semiconductor chilling plate 106 and the second working surface are limited to inner chamber 116 and the exocoel of intermediate cavity respectively；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is limited to inner chamber 116；Described second fin 110 includes two groups of fins, is limited to respectively in two side cavity；Each chamber, is correspondingly arranged air outlet and air inlet at described shell 100.

Specifically, described method can also include, the first working surface of described semiconductor chilling plate 106, first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101 are constituted described first heat-exchange system 120；Second working surface of described semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114 are constituted described second heat-exchange system 121.

Specifically, described method can also include, described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；And, described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

Specifically, described method can also include, the first working surface at described semiconductor chilling plate 106 is aided with the first conductive substrate 104 so that described first fin 109 thermally contacts with described first conductive substrate 104；The second working surface at described semiconductor chilling plate 106 is aided with the second conductive substrate 105 so that described second fin 110 is thermally contacted with described second conductive substrate 105 by heat pipe.

Specifically, described method can also include, the exocoel in described intermediate cavity arranges supporter 115, and described supporter 115 end face sets holding tank, is contained in described holding tank by the second working surface of described semiconductor chilling plate 106.Can also include, heat pipe hole is set at described supporter 115, described heat pipe 111 is run through described heat pipe hole.

Specifically, described method can also include, arranges wind-guiding grid 103 at described first air outlet 101.Preferably, it is respectively provided with wind-guiding grid 103 at described air inlet and described air outlet.

Specifically, described method can also include, between first working surface and the first conductive substrate 104 of described semiconductor chilling plate 106, it is aided with heat-conducting silicone grease 200, between second working surface and the second conductive substrate 105 of described semiconductor chilling plate 106, is aided with heat-conducting silicone grease 201.

As embodiment 6, relate to the bottom installation method of a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of first heat-exchange system the 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, and described semiconductor chilling plate 106 includes the first working surface and the second working surface；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described cavity 107, by least one longitudinally disposed dividing plate 122, is divided at least two chamber, is provided with the first heat-exchange system 120 in section chambers；The chamber being provided with the first heat-exchange system 120 is divided into inner chamber 116 and exocoel, first working surface and first fin 109 of described semiconductor chilling plate 106 are restricted to described inner chamber 116, described method includes, described shell 100 is integrated into the step on the horizontal shell of smoke exhaust ventilator 313.

Specifically, described being integrated into by shell 100 on the horizontal shell of smoke exhaust ventilator 313 refers to, shell 100 is integrated into smoke exhaust ventilator horizontal shell 313 dead ahead.

Specifically, described being integrated into by shell 100 on the horizontal shell of smoke exhaust ventilator 313 refers to, between described shell 100 and the horizontal shell of smoke exhaust ventilator 313, insert is set, described shell 100 and the horizontal shell of smoke exhaust ventilator 313 are individually fixed in the both sides up and down of insert so that between described shell 100 and the horizontal shell of smoke exhaust ventilator 313, retain certain space.Described insert can be U-bracket 317.

Specifically, described being integrated on the horizontal shell of smoke exhaust ventilator 313 by described shell 100 refers to, support bar is set in semiconductor refrigerating module housing 100 two side, cooking-fume exhausting hood housing is fixed in this support bar lower end so that retain certain space between semiconductor refrigerating module housing 100 and the horizontal shell of smoke exhaust ventilator 313.

Figure 17 is semiconductor refrigerating module and the smoke exhaust ventilator integrated schematic three dimensional views of horizontal shell.It can be seen that semiconductor refrigerating module can be desirably integrated on cooking-fume exhausting hood housing with smoke exhaust ventilator external harmoniousness, preferentially it is integrated into smoke exhaust ventilator horizontal shell dead ahead.

Smoke exhaust ventilator 151 shell includes the horizontal shell of smoke exhaust ventilator 313 and smoke exhaust ventilator flue collector shell 310.Smoke exhaust ventilator flue collector is 316.As shown in figure 17, on semiconductor refrigerating module 150 external harmoniousness to the horizontal shell of smoke exhaust ventilator 151 313, it is certainly not limited to external harmoniousness to dead ahead.Smoke exhaust ventilator control panel 315 sends automatically controlled instruction can to semiconductor refrigerating module 150, or semiconductor refrigerating module carries control panel and carries out automatic control.In a detailed description of the invention, the cold and hot end air inlet of design is all located at semiconductor refrigerating module 150 lower end, then it is required that keep certain distance between module housing 100 bottom surface and the horizontal shell of smoke exhaust ventilator 313, rather than it is in close contact, to keep air inlet can communicate with outside air.Such as, module lower end is with welding or other mode configuring u supports 317, and about support and front one or segmentation, it is empty for making holder back section, it is ensured that air intake.Or, setting support bar in semiconductor refrigerating module housing 100 two side, cooking-fume exhausting hood housing is fixed in this support bar lower end so that retain certain space between semiconductor refrigerating module housing 100 and the horizontal shell of smoke exhaust ventilator 313.

Specifically, the semiconductor refrigerating module that the present embodiment is installed can be the arbitrary described semiconductor refrigerating module of embodiment 1-4.

As embodiment 7, relate to the side installation method of a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of first heat-exchange system the 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, and described semiconductor chilling plate 106 includes the first working surface and the second working surface；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described cavity 107, by least one longitudinally disposed dividing plate 122, is divided at least two chamber, is provided with the first heat-exchange system 120 in section chambers；The chamber being provided with the first heat-exchange system 120 is divided into inner chamber 116 and exocoel, first working surface and first fin 109 of described semiconductor chilling plate 106 are restricted to described inner chamber 116, described method includes, described shell 100 is integrated into the step on smoke exhaust ventilator flue collector shell 310.

Specifically, described being integrated on smoke exhaust ventilator flue collector shell 310 by described shell 100 refers to, shell 100 is integrated into dead ahead on smoke exhaust ventilator flue collector shell 310.

Specifically, described being integrated into by shell 100 on smoke exhaust ventilator flue collector shell 310 refers to, shell 100 is adhered to flue collector shell 310, or uses loose collar that semiconductor refrigerating module is fixed on flue collector shell 310.

As preferably, the distance between described shell 100 and the horizontal shell of described smoke exhaust ventilator 313 is n, and wherein, n is more than zero.

Figure 18 is semiconductor refrigerating module and the smoke exhaust ventilator integrated schematic three dimensional views of flue collector shell.It can be seen that semiconductor refrigerating module 150 can be desirably integrated on smoke exhaust ventilator flue collector shell 310 with smoke exhaust ventilator 151 external harmoniousness, be preferentially integrated into flue collector shell 310 dead ahead.Specifically, can be that semiconductor refrigerating module 150 is adhered to flue collector shell 310, can also be to use loose collar that semiconductor refrigerating module 150 is fixed on flue collector shell 310, it is also possible to be that semiconductor refrigerating module 150 can be fixed on the mode of flue collector shell 310 by other.In a detailed description of the invention, when on semiconductor refrigerating module 150 external harmoniousness to smoke exhaust ventilator flue collector shell 310, module cold and hot end air intake enters the most from below, hot blast blows out from top, now, need to keep between this semiconductor refrigerating module 150 lower end and the horizontal shell of smoke exhaust ventilator 313 appropriately distance, in order to air inlet can communicate with outside air.

Specifically, the semiconductor refrigerating module that the present embodiment is installed can be the arbitrary described semiconductor refrigerating module of embodiment 1-4.

The inventive point of the present invention is, the cold-hot wind isolation method of a kind of semiconductor refrigerating module is provided, this semiconductor refrigerating module is mainly made up of first heat-exchange system the 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, described semiconductor chilling plate 106 includes that the first working surface and the second working surface, described first heat-exchange system 120 include the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；By with at least one longitudinally disposed dividing plate 122, described cavity 107 being divided at least two chamber, in section chambers, it is provided with the first heat-exchange system 120；The chamber being provided with the first heat-exchange system 120 is divided into inner chamber 116 and exocoel, the first working surface and first fin 109 of described semiconductor chilling plate 106 are limited to described inner chamber 116；Second working surface of described semiconductor chilling plate 106 is limited to described inner chamber 116 or exocoel；Described first fin 109 and described second fin 110 are limited in different chambers, it is achieved the cold-hot wind isolation of semiconductor refrigerating module.

Each restriction has the first fin 109 or chamber of the second fin 110, is correspondingly provided with air outlet and air inlet at described shell 100.

As one of detailed description of the invention, described cavity 107, by a longitudinally disposed dividing plate 122, is divided into two chambers, and one of them chamber is divided into inner chamber 116 and exocoel.

As one of specific embodiment, described semiconductor chilling plate 106 is restricted to described inner chamber 116；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to described inner chamber 116；Described second fin 110 is restricted in another chamber；Each chamber, is correspondingly provided with air outlet and air inlet at described shell 100.

Specifically, it may be that described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114.

More specifically, it may be that described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

As one of specific embodiment, the first working surface of described semiconductor chilling plate 106 and the second working surface are restricted to described inner chamber 116 and described exocoel respectively；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to described inner chamber 116；Described second fin 110 is restricted in another chamber；Each chamber, is correspondingly provided with air outlet and air inlet at described shell 100.

Specifically, it may be that described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114.

More specifically, it may be that described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

As one of detailed description of the invention, described cavity 107, by longitudinally disposed at least two dividing plate 122, is divided at least three chamber, and section chambers is divided into inner chamber 116 and exocoel.Specifically, it may be that described cavity 107 is by two longitudinally disposed dividing plates 122, being divided into three chambers, intermediate cavity is divided into inner chamber 116 and exocoel.

As one of specific embodiment, described semiconductor chilling plate 106 is restricted to the inner chamber 116 of intermediate cavity；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to the inner chamber 116 of intermediate cavity；Described second fin 110 includes two groups of fins, is restricted to respectively in the chamber of both sides；Each chamber, is correspondingly provided with air outlet and air inlet at described shell 100.

Specifically, it may be that described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114.

More specifically, it may be that described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

As one of specific embodiment, the first working surface of described semiconductor chilling plate 106 and the second working surface are restricted to inner chamber 116 and the exocoel of intermediate cavity respectively；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to described inner chamber 116；Described second fin 110 includes two groups of fins, is restricted to respectively in two side cavity；Each chamber, is correspondingly provided with air outlet and air inlet at described shell 100.

Specifically, it may be that described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin the 109, first air intake tuyere the 117, first air-out tuyere the 118, first wind inlet channel the 119, first air inlet the 102, first fan 108 and the first air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan the 112, second air inlet 113 and the second air outlet 114.

More specifically, it may be that described first air outlet 101 is arranged at the leading flank of described shell 100；Described second air outlet 114 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described first air inlet 102 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100；Described second air inlet 113 is arranged at end face, bottom surface, trailing flank, left surface or the right flank of described shell 100.

Embodiment described above is only the preferred embodiment lifted by absolutely proving the present invention, and protection scope of the present invention is not limited to this.The equivalent that those skilled in the art are made on the basis of the present invention substitutes or conversion, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.

Claims (38)

1. a semiconductor refrigerating module, it is characterized in that: this semiconductor refrigerating module is mainly made up of the first heat-exchange system (120), the second heat-exchange system (121), semiconductor chilling plate (106) and shell (100), described shell (100) surrounds cavity (107)

Described semiconductor chilling plate (106) includes the first working surface and the second working surface；

Described first heat-exchange system (120) includes the first working surface and first fin (109) of described semiconductor chilling plate (106)；

Described second heat-exchange system (121) includes the second working surface and second fin (110) of described semiconductor chilling plate (106)；

Described cavity (107), by longitudinally disposed at least one dividing plate (122), is divided at least two chamber, is provided with described first heat-exchange system (120) in section chambers；Being provided with the chamber of described first heat-exchange system (120), be divided into inner chamber (116) and exocoel, the first working surface and first fin (109) of described semiconductor chilling plate (106) are restricted to described inner chamber (116).

2. semiconductor refrigerating module described in claim 1, it is characterised in that: the second working surface of described semiconductor chilling plate (106) is restricted to described inner chamber (116) or described exocoel；

Described first fin (109) is restricted to different chambers from described second fin (110)；

Each restriction has the first fin (109) or the chamber of the second fin (110), is correspondingly provided with air outlet and air inlet at described shell (100).

3. semiconductor refrigerating module described in claim 2, it is characterised in that: described cavity (107), by a longitudinally disposed dividing plate (122), is divided into two chambers, and one of them chamber is divided into inner chamber (116) and exocoel.

4. semiconductor refrigerating module described in claim 3, it is characterised in that: described semiconductor chilling plate (106) is restricted to described inner chamber (116)；

Described first heat-exchange system (120) includes the first working surface and first fin (109) of described semiconductor chilling plate (106)；

Described second heat-exchange system (121) includes the second working surface and second fin (110) of described semiconductor chilling plate (106)；

Described first fin (109) is restricted to described inner chamber (116)；

Described second fin (110) is restricted in another chamber；

Each chamber, is correspondingly provided with air outlet and air inlet at described shell (100).

5. semiconductor refrigerating module described in claim 4, it is characterised in that: described first heat-exchange system (120) includes the first working surface of semiconductor chilling plate (106), the first fin (109), the first air intake tuyere (117), the first air-out tuyere (118), the first wind inlet channel (119), the first air inlet (102), the first fan (108) and the first air outlet (101)；Described second heat-exchange system (121) includes the second working surface of semiconductor chilling plate (106), heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

6. semiconductor refrigerating module described in claim 5, it is characterised in that: described first air outlet (101) is arranged at the leading flank of described shell (100)；Described second air outlet (114) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank；Described first air inlet (102) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank；Described second air inlet (113) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank.

7. semiconductor refrigerating module described in claim 6, it is characterised in that: the first working surface of described semiconductor chilling plate (106) is aided with the first conductive substrate (104), and described first fin (109) thermally contacts with described first conductive substrate (104).

8. semiconductor refrigerating module described in claim 7, it is characterised in that: the second working surface of described semiconductor chilling plate (106) is aided with the second conductive substrate (105), and described second fin (110) thermally contacts with described second conductive substrate (105).

9. semiconductor refrigerating module described in claim 6, it is characterized in that: described inner chamber (116) is provided with supporter (115), described supporter (115) end face sets holding tank, and the second working surface of described semiconductor chilling plate (106) is contained in described holding tank.

10. semiconductor refrigerating module described in claim 9, it is characterised in that: described supporter (115) is the non-conductor of heat, and described supporter (115) is provided with heat pipe hole, and described heat pipe (111) runs through described heat pipe hole.

Semiconductor refrigerating module described in 11. claim 3, it is characterised in that: the first working surface of described semiconductor chilling plate (106) and the second working surface are restricted to described inner chamber (116) and described exocoel respectively；

Described first heat-exchange system (120) includes the first working surface and first fin (109) of described semiconductor chilling plate (106)；

Described second heat-exchange system (121) includes the second working surface and second fin (110) of described semiconductor chilling plate (106)；

Described first fin (109) is restricted to described inner chamber (116)；

Described second fin (110) is restricted in another chamber；

Each chamber, is correspondingly provided with air outlet and air inlet at described shell (100).

Semiconductor refrigerating module described in 12. claim 11, it is characterised in that: described first heat-exchange system (120) includes the first working surface of semiconductor chilling plate (106), the first fin (109), the first air intake tuyere (117), the first air-out tuyere (118), the first wind inlet channel (119), the first air inlet (102), the first fan (108) and the first air outlet (101)；Described second heat-exchange system (121) includes the second working surface of semiconductor chilling plate (106), heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

Semiconductor refrigerating module described in 13. claim 12, it is characterised in that: described first air outlet (101) is arranged at the leading flank of described shell (100)；Described second air outlet (114) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank；Described first air inlet (102) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank；Described second air inlet (113) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank.

Semiconductor refrigerating module described in 14. claim 13, it is characterised in that: the first working surface of described semiconductor chilling plate (106) is aided with the first conductive substrate (104), and described first fin (109) thermally contacts with described first conductive substrate (104).

Semiconductor refrigerating module described in 15. claim 13, it is characterised in that: the second working surface of described semiconductor chilling plate (106) is aided with the second conductive substrate (105), and described second fin (110) thermally contacts with described second conductive substrate (105).

Semiconductor refrigerating module described in 16. claim 13, it is characterised in that: described exocoel is provided with supporter (115), and described supporter (115) end face sets holding tank, and the second working surface of described semiconductor chilling plate (106) is contained in described holding tank.

Semiconductor refrigerating module described in 17. claim 16, it is characterised in that: described supporter (115) is the non-conductor of heat, and described supporter (115) is provided with heat pipe hole, and described heat pipe (111) runs through described heat pipe hole.

Semiconductor refrigerating module described in 18. claim 2, it is characterised in that: described cavity (107), by longitudinally disposed at least two dividing plate (122), is divided at least three chamber, and section chambers is divided into inner chamber (116) and exocoel.

Semiconductor refrigerating module described in 19. claim 18, it is characterised in that: described cavity (107), by two longitudinally disposed dividing plates (122), is divided into three chambers, and intermediate cavity is divided into inner chamber (116) and exocoel.

Semiconductor refrigerating module described in 20. claim 19, it is characterised in that: described semiconductor chilling plate (106) is restricted to the inner chamber (116) of intermediate cavity；

Described first heat-exchange system (120) includes the first working surface and first fin (109) of described semiconductor chilling plate (106)；

Described second heat-exchange system (121) includes the second working surface and second fin (110) of described semiconductor chilling plate (106)；

Described first fin (109) is restricted to the inner chamber (116) of intermediate cavity；

Described second fin (110) includes two groups of fins, is restricted to respectively in the chamber of both sides；

Each chamber, is correspondingly provided with air outlet and air inlet at described shell (100).

Semiconductor refrigerating module described in 21. claim 20, it is characterised in that: described first heat-exchange system (120) includes the first working surface of semiconductor chilling plate (106), the first fin (109), the first air intake tuyere (117), the first air-out tuyere (118), the first wind inlet channel (119), the first air inlet (102), the first fan (108) and the first air outlet (101)；Described second heat-exchange system (121) includes the second working surface of semiconductor chilling plate (106), heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

Semiconductor refrigerating module described in 22. claim 21, it is characterised in that: described first air outlet (101) is arranged at the leading flank of described shell (100)；Described second air outlet (114) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank；Described first air inlet (102) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank；Described second air inlet (113) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank.

Semiconductor refrigerating module described in 23. claim 22, it is characterised in that: the first working surface of described semiconductor chilling plate (106) is aided with the first conductive substrate (104), and described first fin (109) thermally contacts with described first conductive substrate (104).

Semiconductor refrigerating module described in 24. claim 22, it is characterised in that: the second working surface of described semiconductor chilling plate (106) is aided with the second conductive substrate (105), and described second fin (110) thermally contacts with described second conductive substrate (105).

Semiconductor refrigerating module described in 25. claim 22, it is characterized in that: the inner chamber (116) of described intermediate cavity is provided with supporter (115), described supporter (115) end face sets holding tank, and the second working surface of described semiconductor chilling plate (106) is contained in described holding tank.

Semiconductor refrigerating module described in 26. claim 25, it is characterised in that: described supporter (115) is the non-conductor of heat, and described supporter (115) is provided with heat pipe hole, and described heat pipe (111) runs through described heat pipe hole.

Semiconductor refrigerating module described in 27. claim 19, it is characterised in that: the first working surface of described semiconductor chilling plate (106) and the second working surface are restricted to inner chamber (116) and the exocoel of intermediate cavity respectively；

Described first heat-exchange system (120) includes the first working surface and first fin (109) of described semiconductor chilling plate (106)；

Described second heat-exchange system (121) includes the second working surface and second fin (110) of described semiconductor chilling plate (106)；

Described first fin (109) is restricted to described inner chamber (116)；

Described second fin (110) includes two groups of fins, is restricted to respectively in two side cavity；

Each chamber, is correspondingly provided with air outlet and air inlet at described shell (100).

Semiconductor refrigerating module described in 28. claim 27, it is characterised in that: described first heat-exchange system (120) includes the first working surface of semiconductor chilling plate (106), the first fin (109), the first air intake tuyere (117), the first air-out tuyere (118), the first wind inlet channel (119), the first air inlet (102), the first fan (108) and the first air outlet (101)；Described second heat-exchange system (121) includes the second working surface of semiconductor chilling plate (106), heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

Semiconductor refrigerating module described in 29. claim 28, it is characterised in that: described first air outlet (101) is arranged at the leading flank of described shell (100)；Described second air outlet (114) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank；Described first air inlet (102) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank；Described second air inlet (113) is arranged at the end face of described shell (100), bottom surface, trailing flank, left surface or right flank.

Semiconductor refrigerating module described in 30. claim 29, it is characterised in that: the first working surface of described semiconductor chilling plate (106) is aided with the first conductive substrate (104), and described first fin (109) thermally contacts with described first conductive substrate (104).

Semiconductor refrigerating module described in 31. claim 30, it is characterised in that: the second working surface of described semiconductor chilling plate (106) is aided with the second conductive substrate (105), and described second fin (110) thermally contacts with described second conductive substrate (105).

Semiconductor refrigerating module described in 32. claim 29, it is characterized in that: the exocoel of described intermediate cavity is provided with supporter (115), described supporter (115) end face sets holding tank, and the second working surface of described semiconductor chilling plate (106) is contained in described holding tank.

Semiconductor refrigerating module described in 33. claim 32, it is characterised in that: described supporter (115) is the non-conductor of heat, and described supporter (115) is provided with heat pipe hole, and described heat pipe (111) runs through described heat pipe hole.

Semiconductor refrigerating module described in 34. any one of claim 1-33, it is characterised in that described first air outlet (101) is provided with wind-guiding grid (103).

Semiconductor refrigerating module described in 35. claim 34, it is characterised in that described air inlet and described air outlet are respectively provided with wind-guiding grid (103).

Semiconductor refrigerating module described in 36. any one of claim 7,14,23 or 30, it is characterised in that: it is aided with heat-conducting silicone grease (200) between the first working surface and first conductive substrate (104) of described semiconductor chilling plate (106).

Semiconductor refrigerating module described in 37. any one of claim 8,15,24 or 31, it is characterised in that: it is aided with heat-conducting silicone grease (201) between the second working surface and second conductive substrate (105) of described semiconductor chilling plate (106).

38. smoke exhaust ventilators, it is characterised in that described smoke exhaust ventilator includes the semiconductor refrigerating module described in any one of claim 1-37.