CN204693674U - Air regulator and use the smoke exhaust ventilator of this air regulator - Google Patents
Air regulator and use the smoke exhaust ventilator of this air regulator Download PDFInfo
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- CN204693674U CN204693674U CN201520081553.4U CN201520081553U CN204693674U CN 204693674 U CN204693674 U CN 204693674U CN 201520081553 U CN201520081553 U CN 201520081553U CN 204693674 U CN204693674 U CN 204693674U
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Abstract
The utility model discloses a kind of air regulator, described air regulator comprises the first heat-exchange system, second heat-exchange system and semiconductor chilling plate, described semiconductor chilling plate comprises the first working surface and the second working surface, described first heat-exchange system and semiconductor chilling plate first working surface carry out heat exchange, described second heat-exchange system and semiconductor chilling plate second working surface carry out heat exchange, described air regulator comprises the first module and the second module, described first heat-exchange system and described semiconductor chilling plate are positioned at described first module, described first heat-exchange system comprises the first fin, described second heat-exchange system comprises the side a and b connected by liquid cooling pipe, and described A end is positioned at the first module, and described B end is positioned at the second module, and described B end comprises the second fin.The utility model also discloses a kind of smoke exhaust ventilator using this air regulator.By the physical isolation by two heat-exchange systems, improve energy utilization efficiency.
Description
Technical field
The utility model relates to a kind of air regulator and uses the smoke exhaust ventilator of this air regulator.
Background technology
Be an arduous housework in the culinary art of cooking of kitchen focus edge of table, particularly in summer, originally hot weather adds the heat that kitchen range send, and makes working environment in kitchen very harsh.
In order to solve the too high problem of kitchen temperature, have people provided with fan or air-conditioning in kitchen, but fan blowing refrigeration is general, and gas-cooker can be affected normally works, also there is potential safety hazard.Due to the oil smoke surroundings that kitchen is special, after general fan uses a period of time, fan adheres to a large amount of putties, is difficult to cleaning, also can causes the pollution of kitchen environment.
Install an air-conditioner equipment in kitchen, there is Cost Problems on the one hand, also can there is the problem being difficult to clean on the other hand, after air-condition heat exchanger surface attachment oil smoke, also there is the problem that refrigeration declines.
Utility model content
In order to solve prior art exist, in kitchen, using air-condition cost is higher, and being difficult to cleaning and the low inferior problem of temperature regulation effect, the utility model provides a kind of air regulator and air regulator preparation method, and is installed and be applied in smoke exhaust ventilator.
As an aspect of the present utility model, relate to a kind of air regulator, described air regulator comprises the first heat-exchange system, second heat-exchange system and semiconductor chilling plate, described semiconductor chilling plate comprises the first working surface and the second working surface, described first heat-exchange system and semiconductor chilling plate first working surface carry out heat exchange, described second heat-exchange system and semiconductor chilling plate second working surface carry out heat exchange, described air regulator comprises the first module and the second module, described first heat-exchange system and described semiconductor chilling plate are positioned at described first module, described first heat-exchange system comprises the first fin, described second heat-exchange system comprises the side a and b connected by liquid cooling pipe, and described A end is positioned at the first module, and described B end is positioned at the second module, and described B end comprises the second fin.
Described first module surrounds the first module hollow chamber by the first module housing, and the A end of described first heat-exchange system, described semiconductor chilling plate and described second heat-exchange system is positioned at described first module hollow chamber.Described first heat-exchange system comprises the first fin, the first fan, the first module inlet and the first module outlet.
Described second module surrounds the second module hollow chamber by the second module housing, and the B end of described second heat-exchange system is positioned at described second module hollow chamber.Described second heat-exchange system comprises the second fin, the second fan, water pump, liquid cooling pipe, the second module inlet and the second module outlet.
As one of detailed description of the invention, described first module hollow chamber can be provided with supporter, described semiconductor chilling plate second working surface is embedded in described supporter, described first module is provided with the first module liquid cooling pore, the first module inlet and the first module outlet, and described second module is provided with the second module liquid cooling pore, the second module inlet and the second module outlet.
Particularly, Ke Yishi, described supporter is the non-conductor of heat, and described supporter is provided with liquid cooling pore, and described liquid cooling pipe runs through described liquid cooling pore.
Described first module outlet is positioned at the leading flank of the first module housing, described first module inlet is positioned at the trailing flank of the first module housing, left surface, right flank, end face or bottom surface, described second module inlet is positioned at the leading flank of the second module housing, trailing flank, left surface, right flank, end face or bottom surface, and described second module outlet is positioned at the end face of the second module housing, bottom surface, leading flank, trailing flank, left surface or right flank.Preferably, the first fan of described first heat-exchange system is arranged between described first module outlet and the first fin.
First working surface of described semiconductor chilling plate can be aided with the first conductive substrate, described first working surface and the first conductive substrate thermo-contact.Can also be aided with the first heat-conducting silicone grease between the first working surface of described semiconductor chilling plate and the first conductive substrate.
Second working surface of described semiconductor chilling plate can be aided with the second conductive substrate, described second working surface and the second conductive substrate thermo-contact.Can also be aided with the second heat-conducting silicone grease between the second working surface of described semiconductor chilling plate and the second conductive substrate.
Can also be that described second conductive substrate is liquid cooling plate, be provided with the second conductive substrate liquid cooling interface tube, described liquid cooling pipe connects with the second conductive substrate liquid cooling interface tube.
Described second heat-exchange system can also comprise metal tube.
Or described second heat-exchange system can also comprise heat radiation microtubule, described heat radiation microtubule comprises concurrent flow pipe and header.
Described metal tube or heat radiation microtubule are provided with the second module liquid cooling interface tube, and described liquid cooling pipe connects with the second module liquid cooling interface tube.
As one of detailed description of the invention, described first module hollow chamber can be provided with incubation cavity, described semiconductor chilling plate participates in forming described incubation cavity wall, described first fin is positioned at described incubation cavity, described first module is provided with the first module liquid cooling pore, the first module inlet, the first module outlet, incubation cavity air inlet and incubation cavity air outlet, and described second module is provided with the second module liquid cooling pore, the second module inlet and the second module outlet.
Particularly, can be, first working surface of described semiconductor chilling plate participates in the bottom surface forming incubation cavity, described first heat-exchange system comprises the first fin, the first fan, the first module inlet, the first module outlet, the first exhaust air flue, incubation cavity air inlet and incubation cavity air outlet, and described second heat-exchange system comprises the second fin, the second fan, water pump, liquid cooling pipe, the second module inlet and the second module outlet.
Described first module outlet is positioned at the leading flank of the first module housing, described first module inlet is positioned at the trailing flank of the first module housing, left surface, right flank, end face or bottom surface, described first module incubation cavity air inlet is positioned at the trailing flank of incubation cavity, left surface, right flank, end face or bottom surface, described first module incubation cavity air outlet is positioned at the left surface of incubation cavity, right flank, end face, bottom surface or leading flank, described second module inlet is positioned at the leading flank of the second module housing, trailing flank, left surface, right flank, end face or bottom surface, described second module outlet is positioned at the end face of the second module housing, bottom surface, leading flank, trailing flank, left surface or right flank.Can also be, described first heat-exchange system incubation cavity air inlet is corresponding with described first module inlet, described incubation cavity air outlet is corresponding with described first module outlet, and described first fan is arranged between described incubation cavity air outlet and described first module outlet.
First working surface of described semiconductor chilling plate can be aided with the first conductive substrate, described first working surface and the first conductive substrate thermo-contact.Can also be aided with the first heat-conducting silicone grease between the first working surface of described semiconductor chilling plate and the first conductive substrate.
Second working surface of described semiconductor chilling plate can be aided with the second conductive substrate, described second working surface and the second conductive substrate thermo-contact.Can also be aided with the second heat-conducting silicone grease between the second working surface of described semiconductor chilling plate and the second conductive substrate.
Can also be that described second conductive substrate is liquid cooling plate, be provided with the second conductive substrate liquid cooling interface tube, described liquid cooling pipe connects with the second conductive substrate liquid cooling interface tube.Further, described liquid cooling pipe connects with the second module liquid cooling interface tube.
As one of detailed description of the invention, described first module outlet can be provided with wind deflector or wind-guiding grid.Preferably, described chamber first module inlet, described second module inlet and described second module outlet all can be provided with wind deflector or wind-guiding grid.
As another aspect of the present utility model, relate to a kind of smoke exhaust ventilator, described smoke exhaust ventilator comprises above-mentioned arbitrary air regulator.
As the 3rd aspect of the present utility model, relate to a kind of preparation method of air regulator, described air regulator comprises the first heat-exchange system, second heat-exchange system and semiconductor chilling plate, described semiconductor chilling plate comprises the first working surface and the second working surface, described first heat-exchange system and semiconductor chilling plate first working surface carry out heat exchange, described second heat-exchange system and semiconductor chilling plate second working surface carry out heat exchange, described air regulator comprises the first module and the second module, described first heat-exchange system comprises the first fin, described second heat-exchange system comprises side a and b, described B end comprises the second fin, described method comprises, by described first heat-exchange system, the A end of described semiconductor chilling plate and described second heat-exchange system is limited in described first module, the B of described second heat-exchange system end is limited to the second module, and the side a and b of described second heat-exchange system is carried out the step that connects by liquid cooling pipe.
Described method can also comprise, the first module hollow chamber is surrounded by the first module housing, the A of described first heat-exchange system, described semiconductor chilling plate and described second heat-exchange system end is limited in described first module hollow chamber, makes the first fin, the first fan, the first module inlet and the first module outlet form the step of described first heat-exchange system.
The second module hollow chamber is surrounded by the second module housing, the B of described second heat-exchange system end is limited in described second module hollow chamber, makes the second fin, the second fan, water pump, liquid cooling pipe, the second module inlet and the second module outlet form the step of described second heat-exchange system.
As one of detailed description of the invention, described method can also comprise, supporter is provided with in described first module hollow chamber, described semiconductor chilling plate second working surface is embedded in described supporter, the first module liquid cooling pore, the first module inlet and the first module outlet is offered in described first module, the step of the second module liquid cooling pore, the second module inlet and the second module outlet is offered in described second module, can also comprise, establish liquid cooling pore at described supporter, make described liquid cooling pipe run through the step of described liquid cooling pore.
Above-mentioned preparation method specifically can comprise, the first module outlet is offered at the leading flank of described first module housing, the first module inlet is offered in the trailing flank of described first module housing, left surface, right flank, end face or bottom surface, offer the second module inlet in the leading flank of described second module housing, trailing flank, left surface, right flank, end face or bottom surface, offer the step of the second module outlet at the end face of described second module housing, bottom surface, leading flank, trailing flank, left surface or right flank.Can also comprise, the first fan of described first heat-exchange system is arranged at the step between described first module outlet and the first fin.
Above-mentioned preparation method specifically can comprise, and is aided with the first conductive substrate at the first working surface of described semiconductor chilling plate, and makes the step of described first fin and described first conductive substrate thermo-contact.Can also comprise, between first working surface and the first conductive substrate of described semiconductor chilling plate, be aided with the step of the first heat-conducting silicone grease.
Above-mentioned preparation method specifically can comprise, and is aided with the second conductive substrate at the second working surface of described semiconductor chilling plate, and makes the step of described second fin and described second conductive substrate thermo-contact.Can also comprise, between second working surface and the second conductive substrate of described semiconductor chilling plate, be aided with the step of the second heat-conducting silicone grease.
Above-mentioned preparation method specifically can comprise, and offers the second conductive substrate liquid cooling interface tube at described second conductive substrate, and the step that described liquid cooling pipe is connected with the second conductive substrate liquid cooling interface tube.
Above-mentioned preparation method specifically can comprise, at liquid cooling pipe end connection metal pipe, and by metal tube and the second fin thermo-contact.
Or, connect heat radiation microtubule at liquid cooling pipe end, and will dispel the heat microtubule and the second fin thermo-contact, described heat radiation microtubule is made up of concurrent flow pipe and header.
Can also comprise, offer the second module liquid cooling interface tube at described metal tube or described heat radiation microtubule, and described liquid cooling pipe is connected with the second module liquid cooling interface tube.
As one of detailed description of the invention, described method can also comprise, incubation cavity is provided with in described first module hollow chamber, participated in forming described incubation cavity wall by described semiconductor chilling plate, described first fin is limited to the step in described incubation cavity, can also comprise, offer the first module liquid cooling pore in described first module, first module inlet, first module outlet, incubation cavity air inlet and incubation cavity air outlet, offer the second module liquid cooling pore in described second module, the step of the second module inlet and the second module outlet, can also comprise, and participates in the bottom surface forming incubation cavity, to make the first fin by the first working surface of described semiconductor chilling plate, first fan, first module inlet, first module outlet, first exhaust air flue, incubation cavity air inlet and incubation cavity air outlet form described first heat-exchange system, make the second fin, second fan, water pump, liquid cooling pipe, second module inlet and the second module outlet form the step of described second heat-exchange system.
Above-mentioned preparation method specifically can comprise, the first module outlet is offered at the leading flank of described first module housing, at the trailing flank of described first module housing, left surface, right flank, the first module inlet is offered in end face or bottom surface, at the trailing flank of described incubation cavity, left surface, right flank, the first module incubation cavity air inlet is offered in end face or bottom surface, at the left surface of described incubation cavity, right flank, end face, bottom surface or leading flank offer the first module incubation cavity air outlet, at the leading flank of described second module housing, trailing flank, left surface, right flank, the second module inlet is offered in end face or bottom surface, at the end face of described second module housing, bottom surface, leading flank, trailing flank, left surface or right flank offer the step of the second module outlet.Can also comprise, described first fan is arranged on the step between described incubation cavity air outlet and described first module outlet.
Above-mentioned preparation method specifically can comprise, and is aided with the first conductive substrate at the first working surface of described semiconductor chilling plate, and makes the step of described first fin and described first conductive substrate thermo-contact.Can also comprise, between first working surface and the first conductive substrate of described semiconductor chilling plate, be aided with the step of the first heat-conducting silicone grease.
Above-mentioned preparation method specifically can comprise, and is aided with the second conductive substrate at the second working surface of described semiconductor chilling plate, and makes the step of described second fin and described second conductive substrate thermo-contact.Can also comprise, between second working surface and the second conductive substrate of described semiconductor chilling plate, be aided with the step of the second heat-conducting silicone grease.
Above-mentioned preparation method specifically can comprise, and offers the second conductive substrate liquid cooling interface tube at described second conductive substrate, and the step that described liquid cooling pipe is connected with the second conductive substrate liquid cooling interface tube.Can also comprise, make the step that described liquid cooling pipe connects with the second module liquid cooling interface tube.
As one of detailed description of the invention, described method can also comprise, the step of wind deflector or wind-guiding grid is established in described first module outlet, further, can also comprise, all offer the step of wind deflector or wind-guiding grid in described chamber first module inlet, described second module inlet and described second module outlet.
As the 4th aspect of the present utility model, relate to a kind of air regulator installation method, described air regulator comprises the first heat-exchange system, second heat-exchange system and semiconductor chilling plate, described semiconductor chilling plate comprises the first working surface and the second working surface, described first heat-exchange system and semiconductor chilling plate first working surface carry out heat exchange, described second heat-exchange system and semiconductor chilling plate second working surface carry out heat exchange, described air regulator comprises the first module and the second module, described first heat-exchange system and described semiconductor chilling plate are positioned at described first module, described first heat-exchange system comprises the first fin, described second heat-exchange system comprises the side a and b connected by liquid cooling pipe, described A end is positioned at the first module, and described B end is positioned at the second module, and described B end comprises the second fin, described installation method comprises, by the step of described first module integration to smoke exhaust ventilator front.
Described first module integration is referred to smoke exhaust ventilator front, by described first module integration to smoke exhaust ventilator dead ahead.
Described method can also comprise, by the step of described first module integration to the horizontal shell front of smoke exhaust ventilator.
Particularly, can be, described first module integration is referred to the horizontal shell front of smoke exhaust ventilator, described first module housing is adhered to the horizontal shell front of smoke exhaust ventilator, or insert is established between the horizontal shell front of smoke exhaust ventilator and the first module housing, described first module housing and the horizontal shell of smoke exhaust ventilator lay respectively at the both sides up and down of insert, or arrange support bar respectively in described first module housing both sides, described support bar are fixed on the horizontal shell front of smoke exhaust ventilator.
Described method can also comprise, by the step of described first module integration to smoke exhaust ventilator flue collector shell front.
Particularly, can be, described first module integration is referred to smoke exhaust ventilator flue collector shell front, described first module housing is adhered to smoke exhaust ventilator flue collector shell front, or use loose collar that the first module is fixed on smoke exhaust ventilator flue collector shell front.
More specifically, Ke Yishi, during by described first module integration to smoke exhaust ventilator flue collector shell front, the distance between described first module housing and the horizontal shell of described smoke exhaust ventilator is n, and wherein, n is greater than zero.
Described method can also comprise, by the step of described second module integration to the horizontal shell of smoke exhaust ventilator.
Particularly, Ke Yishi, refers to described second module integration to the horizontal shell of smoke exhaust ventilator, by described second module integration to the horizontal shell left part of smoke exhaust ventilator or right part.
Particularly, can be, described second module integration is referred to the horizontal shell of smoke exhaust ventilator, described second module housing is adhered to the horizontal shell of smoke exhaust ventilator, or insert is established between the horizontal shell of smoke exhaust ventilator and the second module housing, described second module housing and the horizontal shell of smoke exhaust ventilator lay respectively at the both sides up and down of insert, or arrange support bar respectively in described second module housing both sides, described support bar are fixed on the horizontal shell of smoke exhaust ventilator.
Described method can also comprise, by the step of described second module integration to smoke exhaust ventilator flue collector shell.
Particularly, Ke Yishi, refers to described second module integration to smoke exhaust ventilator flue collector shell, by described second module integration to smoke exhaust ventilator flue collector shell left side or right flank.
Particularly, Ke Yishi, refers to described second module integration to smoke exhaust ventilator flue collector shell, and described second module housing is adhered to smoke exhaust ventilator flue collector shell, or uses loose collar that the second module is fixed on smoke exhaust ventilator flue collector shell.
More specifically, Ke Yishi, during by described second module integration to smoke exhaust ventilator flue collector shell, the distance between described second module housing and the horizontal shell of described smoke exhaust ventilator is n, and wherein, n is greater than zero.
The utility model embodiment at least achieves following beneficial effect:
1, the air regulator that provides of the utility model, structural design is simply compact, manufacture simple, and cost is low.
2, the utility model air regulator is divided into the first module and the second module, by the first module integration to smoke exhaust ventilator front, second module can be integrated into smoke exhaust ventilator any position, reduce the installation volume in smoke exhaust ventilator front, make air regulator of the present utility model can be adapted to the smoke exhaust ventilator of different type of machines.
3, the utility model will be equipped with the module housing of air regulator module, on the horizontal shell being installed on cooking-fume exhausting hood housing or on flue collector shell, it does not all take the volume of cooking-fume exhausting hood housing inner chamber, therefore cooking-fume exhausting hood housing internal structure is not affected, and during smoke exhaust ventilator cleaning, only module housing need be taken off from cooking-fume exhausting hood housing, can conveniently clean, therefore it is not only easy to installing/dismounting, and is easy to clean and maintenance.
4, by by the physical isolation of two heat-exchange systems, effectively improve the utilization ratio of energy.
Accompanying drawing explanation
Fig. 1 is the utility model air regulator overall structure schematic diagram;
Fig. 2 is the first module top view of one of the utility model embodiment;
Fig. 3 is the first module side view of one of the utility model embodiment;
Fig. 4 is the first form side view of the utility model second module;
Fig. 5 is the first form top view of the utility model second module;
Fig. 6 is the utility model second module the second form side view;
Fig. 7 is the utility model second module the second form top view;
Fig. 8 is the utility model second module housing structural representation;
Fig. 9 is the first module top view of the utility model embodiment two;
Figure 10 is the first module side view of the utility model embodiment two;
Figure 11 is the first installation form schematic diagram of the utility model air regulator;
Figure 12 is the utility model air regulator the second installation form schematic diagram;
Figure 13 is the third installation form schematic diagram of the utility model air regulator;
Figure 14 is the utility model air regulator the 4th kind of installation form schematic diagram.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, and to make those skilled in the art better can understand the utility model being implemented, but illustrated embodiment is not as to restriction of the present utility model.
The utility model embodiment provides the smoke exhaust ventilator of air regulator and this air regulator of external harmoniousness.Air regulator, based semiconductor cooling piece, and with the use of fin heat exchange, cold semiconductor chilling plate energising produced by fan or heat blowout.Can be cold environment or thermal environment that user produces a local, meet the comfortableness requirement of people.Air regulator mainly comprises the first module and the second module, is mainly provided with the first heat-exchange system and the second heat-exchange system A holds in the first module, is mainly provided with the second heat-exchange system B and holds in the second module, is connected between two modules by liquid cooling pipe.Semiconductor chilling plate has two working surfaces, and upper end is the first working surface, and lower end is the second working surface, and when the first working surface is hot junction, the second working surface is cold junction; When the first working surface is cold junction, the second working surface is hot junction.Air regulator can with smoke exhaust ventilator external harmoniousness, the first module accessible site is to cooking-fume exhausting hood housing horizontal component upper end or be integrated into smoke exhaust ventilator flue collector outer casing frontispiece.Air regulator can work independently, also can with smoke exhaust ventilator intelligent linkage.
The utility model provide air regulator outstanding feature to be, its first heat-exchange system and the second heat-exchange system achieve part, or even whole physical isolation, can effectively prevent semiconductor chilling plate produce the two-way flow of heat energy and cold energy, put forward high-octane utilization ratio, reduce power consumption.
In one detailed description of the invention, air regulator mode of operation has nice and cool pattern and warm pattern two kinds: when pressing nice and cool pattern, and semiconductor chilling plate upper end is cold junction, and lower end is hot junction, and the first module front air outlet goes out cold wind; When pressing warm pattern, semiconductor chilling plate upper end is hot junction, and lower end is cold junction, and the first module dead ahead air outlet goes out hot blast.Below, be described for nice and cool pattern.
The utility model provides a kind of air regulator, described air regulator comprises the first heat-exchange system 122, second heat-exchange system 123 and semiconductor chilling plate 109, described semiconductor chilling plate 109 comprises the first working surface and the second working surface, described first heat-exchange system 122 carries out heat exchange with semiconductor chilling plate 109 first working surface, described second heat-exchange system 123 carries out heat exchange with semiconductor chilling plate 109 second working surface, described air regulator comprises the first module 127 and the second module 128, described first heat-exchange system 122 and described semiconductor chilling plate 109 are positioned at described first module 127, described first heat-exchange system 122 comprises the first fin 112, described second heat-exchange system 123 comprises the A end 138 and B end 139 that are connected by liquid cooling pipe 129, and described A end 138 is positioned at the first module 127, and described B end 139 is positioned at the second module 128, and described B end 139 comprises the second fin 121.
Described first module 127 surrounds the first module hollow chamber 110 by the first module housing 100, the A end 138 of described first heat-exchange system 122, described semiconductor chilling plate 109 and described second heat-exchange system 123 is positioned at described first module hollow chamber 110, particularly, described first heat-exchange system 122 comprises the first fin 112, first fan 106, first module inlet 102 and the first module outlet 101.
Described second module 128 surrounds the second module hollow chamber 115 by the second module housing 126, the B end 139 of described second heat-exchange system 123 is positioned at described second module hollow chamber 115, particularly, described second heat-exchange system 123 comprises the second fin 121, second fan 114, water pump 137, liquid cooling pipe 129, second module inlet 124 and the second module outlet 125.
As embodiment 1, with reference to Fig. 1-Fig. 8, described first module hollow chamber 110 can be provided with supporter 116, described semiconductor chilling plate 109 second working surface is embedded in described supporter 116, described first module 127 is provided with the first module liquid cooling pore 134, first module inlet 102 and the first module outlet 101, and described second module 128 is provided with the second module liquid cooling pore 133, second module inlet 124 and the second module outlet 125.
Particularly, Ke Yishi, described supporter 116 is the non-conductor of heat, and described supporter 116 is provided with liquid cooling pore, and described liquid cooling pipe 129 runs through described liquid cooling pore.
Described first module outlet 101 is positioned at the leading flank of the first module housing 100, described first module inlet 102 is positioned at the trailing flank of the first module housing 100, left surface, right flank, end face or bottom surface, described second module inlet 124 is positioned at the leading flank of the second module housing 126, trailing flank, left surface, right flank, end face or bottom surface, and described second module outlet 125 is positioned at the end face of the second module housing 126, bottom surface, leading flank, trailing flank, left surface or right flank.Preferably, the first fan 106 of described first heat-exchange system 122 is arranged between described first module outlet 101 and the first fin 112.
First working surface of described semiconductor chilling plate 109 can be aided with the first conductive substrate 107, described first working surface and the first conductive substrate 107 thermo-contact.Can also be aided with the first heat-conducting silicone grease 113 between the first working surface of described semiconductor chilling plate 109 and the first conductive substrate 107.
Second working surface of described semiconductor chilling plate 109 can be aided with the second conductive substrate 108, described second working surface and the second conductive substrate 108 thermo-contact.Can also be aided with the second heat-conducting silicone grease 120 between the second working surface of described semiconductor chilling plate 109 and the second conductive substrate 108.
Can also be that described second conductive substrate 108 is liquid cooling plate, is provided with the second conductive substrate liquid cooling interface tube 135, and described liquid cooling pipe 129 connects with the second conductive substrate liquid cooling interface tube 135.
Described second heat-exchange system 123 can also comprise metal tube 117.
Or described second heat-exchange system 123 can also comprise heat radiation microtubule 131, and described heat radiation microtubule 131 comprises concurrent flow pipe 130 and header 132.
Described metal tube 117 or described heat radiation microtubule 131 are provided with the second module liquid cooling interface tube 136, and described liquid cooling pipe 129 connects with the second module liquid cooling interface tube 136.
As embodiment 2, with reference to Fig. 1, Fig. 4-Figure 10, described first module hollow chamber 110 can be provided with incubation cavity 103, described semiconductor chilling plate 109 participates in forming described incubation cavity 103 wall, described first fin 112 is positioned at described incubation cavity 103, described first module 127 is provided with the first module liquid cooling pore 134, first module inlet 102, first module outlet 101, incubation cavity air inlet 104 and incubation cavity air outlet 105, and described second module 128 is provided with the second module liquid cooling pore 133, second module inlet 124 and the second module outlet 125.
Particularly, can be, first working surface of described semiconductor chilling plate 109 participates in the bottom surface forming incubation cavity 103, described first heat-exchange system 122 comprises the first fin 112, first fan 106, first module inlet 102, first module outlet 101, first exhaust air flue 111, incubation cavity air inlet 104 and incubation cavity air outlet 105, and described second heat-exchange system 123 comprises the second fin 121, second fan 114, water pump 137, liquid cooling pipe 129, second module inlet 124 and the second module outlet 125.
Described first module outlet 101 is positioned at the leading flank of the first module housing 100, described first module inlet 102 is positioned at the trailing flank of the first module housing 100, left surface, right flank, end face or bottom surface, described first module incubation cavity air inlet 104 is positioned at the trailing flank of incubation cavity 103, left surface, right flank, end face or bottom surface, described first module incubation cavity air outlet 105 is positioned at the left surface of incubation cavity 103, right flank, end face, bottom surface or leading flank, described second module inlet 124 is positioned at the leading flank of the second module housing 126, trailing flank, left surface, right flank, end face or bottom surface, described second module outlet 125 is positioned at the end face of the second module housing 126, bottom surface, leading flank, trailing flank, left surface or right flank.Can also be, described first heat-exchange system 122 incubation cavity air inlet 104 is corresponding with described first module inlet 102, described incubation cavity air outlet 105 is corresponding with described first module outlet 101, and described first fan 106 is arranged between described incubation cavity air outlet 105 and described first module outlet 101.
First working surface of described semiconductor chilling plate 109 can be aided with the first conductive substrate 107, described first working surface and the first conductive substrate 107 thermo-contact.Can also be aided with the first heat-conducting silicone grease 113 between the first working surface of described semiconductor chilling plate 109 and the first conductive substrate 107.
Second working surface of described semiconductor chilling plate 109 can be aided with the second conductive substrate 108, described second working surface and the second conductive substrate 108 thermo-contact.Can also be aided with the second heat-conducting silicone grease 120 between the second working surface of described semiconductor chilling plate 109 and the second conductive substrate 108.
Can also be that described second conductive substrate 108 is liquid cooling plate, is provided with the second conductive substrate liquid cooling interface tube 135, and described liquid cooling pipe 129 connects with the second conductive substrate liquid cooling interface tube 135.Further, described liquid cooling pipe 129 connects with the second module liquid cooling interface tube 136.
The air regulator that above embodiment provides, described first module outlet 101 can be provided with wind deflector or wind-guiding grid.Preferably, described first module inlet 102, described second module inlet 124 and described second module outlet 125 all can be provided with wind deflector or wind-guiding grid.
The air regulator that above embodiment provides, described liquid cooling pipe 129 can be water pipe.
In a detailed description of the invention, as shown in Figure 8, have two liquid cooling pores in the second module housing 126 dead ahead, each side have an air inlet, top has air outlet.
The utility model also provides a kind of smoke exhaust ventilator, and described smoke exhaust ventilator comprises the air regulator that above-described embodiment 1 and example 2 any embodiment provide.
The utility model also provides a kind of preparation method of air regulator, described air regulator comprises the first heat-exchange system 122, second heat-exchange system 123 and semiconductor chilling plate 109, described semiconductor chilling plate 109 comprises the first working surface and the second working surface, described first heat-exchange system 122 carries out heat exchange with semiconductor chilling plate 109 first working surface, described second heat-exchange system 123 carries out heat exchange with semiconductor chilling plate 109 second working surface, described air regulator comprises the first module 127 and the second module 128, described first heat-exchange system 122 comprises the first fin 112, described second heat-exchange system comprises A end 138 and B end 139, described B end 139 comprises the second fin 121, described method comprises, by described first heat-exchange system 122, the A end 138 of described semiconductor chilling plate 109 and described second heat-exchange system 123 is limited in described first module 127, 139 are held to be limited to the second module 128 B of described second heat-exchange system 123, and the A of described second heat-exchange system 123 held 138 and B end 139 carry out by liquid cooling pipe 129 step that is connected.
Described method can also comprise, the first module hollow chamber 110 is surrounded by the first module housing 100, hold 138 to be limited in described first module hollow chamber 110 A of described first heat-exchange system 122, described semiconductor chilling plate 109 and described second heat-exchange system 123, make the first fin 112, first fan 106, first module inlet 102 and the first module outlet 101 form the step of described first heat-exchange system 122.
The second module hollow chamber 115 is surrounded by the second module housing 126, hold 139 to be limited in described second module hollow chamber 115 B of described second heat-exchange system 123, make the second fin 121, second fan 114, water pump 137, liquid cooling pipe 129, second module inlet 124 and the second module outlet 125 form the step of described second heat-exchange system 123.
As embodiment 3, described method can also comprise, supporter 116 is provided with in described first module hollow chamber 110, described semiconductor chilling plate 109 second working surface is embedded in the step in described supporter 116, can also comprise, offer the first module liquid cooling pore 134, first module inlet 102 and the first module outlet 101 in described first module 127, offer the step of the second module liquid cooling pore 133, second module inlet 124 and the second module outlet 125 in described second module 128.
Above-mentioned preparation method specifically can comprise, and establishes liquid cooling pore at described supporter 116, makes described liquid cooling pipe 129 run through the step of described liquid cooling pore.
Above-mentioned preparation method specifically can comprise, the first module outlet 101 is offered at the leading flank of described first module housing 100, at the trailing flank of described first module housing 100, left surface, right flank, the first module inlet 102 is offered in end face or bottom surface, at the leading flank of described second module housing 126, trailing flank, left surface, right flank, the second module inlet 124 is offered in end face or bottom surface, at the end face of described second module housing 126, bottom surface, leading flank, trailing flank, left surface or right flank offer the second module outlet 125, can also comprise, first fan 106 of described first heat-exchange system 122 is arranged between described first module outlet 101 and the first fin 112.
Above-mentioned preparation method specifically can comprise, and is aided with the first conductive substrate 107 at the first working surface of described semiconductor chilling plate 109, and makes described first fin 112 and described first conductive substrate 107 thermo-contact.Can also comprise, between first working surface and the first conductive substrate 107 of described semiconductor chilling plate 109, be aided with the first heat-conducting silicone grease 113.
Above-mentioned preparation method specifically can comprise, and is aided with the second conductive substrate 108 at the second working surface of described semiconductor chilling plate 109, and makes described second fin 121 and described second conductive substrate 108 thermo-contact.Can also comprise, between second working surface and the second conductive substrate 108 of described semiconductor chilling plate 109, be aided with the second heat-conducting silicone grease 120.
Above-mentioned preparation method specifically can comprise, and offers the second conductive substrate liquid cooling interface tube 135 at described second conductive substrate 108, and described liquid cooling pipe 129 is connected with the second conductive substrate liquid cooling interface tube 135.
Above-mentioned preparation method specifically can comprise, at liquid cooling pipe 129 end connection metal pipe 117, and by metal tube 117 and the second fin 121 thermo-contact.
Or, connect heat radiation microtubule 131 at liquid cooling pipe 129 end, and will dispel the heat microtubule 131 and the second fin 121 thermo-contact, described heat radiation microtubule 131 is made up of concurrent flow pipe 130 and header 132.
Can also comprise, offer the second module liquid cooling interface tube 136 at described metal tube 117 or heat radiation microtubule 131, and the step that described liquid cooling pipe 129 is connected with the second module liquid cooling interface tube 136.
As embodiment 4, described method can also comprise, incubation cavity 103 is provided with in described first module hollow chamber 110, participated in forming described incubation cavity 103 wall by described semiconductor chilling plate 109, described first fin 112 is limited to the step in described incubation cavity 103, can also comprise, the first module liquid cooling pore 134 is offered in described first module 127, first module inlet 102, first module outlet 101, incubation cavity air inlet 104 and incubation cavity air outlet 105, the second module liquid cooling pore 133 is offered in described second module 128, the step of the second module inlet 124 and the second module outlet 125.
Above-mentioned preparation method specifically can comprise, the bottom surface forming incubation cavity 103 is participated in by the first working surface of described semiconductor chilling plate 109, to make the first fin 112, first fan 106, first module inlet 102, first module outlet 101, first exhaust air flue 111, incubation cavity air inlet 104 and incubation cavity air outlet 105 be formed described first heat-exchange system 122, the second fin 121, second fan 114, water pump 137, liquid cooling pipe 129, second module inlet 124 and the second module outlet 125 is made to form the step of described second heat-exchange system 123.
Above-mentioned preparation method specifically can comprise, the first module outlet 101 is offered at the leading flank of described first module housing 100, at the trailing flank of described first module housing 100, left surface, right flank, the first module inlet 102 is offered in end face or bottom surface, at the trailing flank of described incubation cavity 103, left surface, right flank, the first module incubation cavity air inlet 104 is offered in end face or bottom surface, at the left surface of described incubation cavity 103, right flank, end face, bottom surface or leading flank offer the first module incubation cavity air outlet 105, at the leading flank of described second module housing 126, trailing flank, left surface, right flank, the second module inlet 124 is offered in end face or bottom surface, at the end face of described second module housing 126, bottom surface, leading flank, trailing flank, left surface or right flank offer the step of the second module outlet 125, can also comprise, described first fan 106 is arranged on the step between described incubation cavity air outlet 105 and described first module outlet 101.
Above-mentioned preparation method specifically can comprise, and is aided with the first conductive substrate 107 at the first working surface of described semiconductor chilling plate 109, and makes described first fin 112 and described first conductive substrate 107 thermo-contact.Can also comprise, between first working surface and the first conductive substrate 107 of described semiconductor chilling plate 109, be aided with the first heat-conducting silicone grease 113.
Above-mentioned preparation method specifically can comprise, and is aided with the second conductive substrate 108 at the second working surface of described semiconductor chilling plate 109, and makes described second fin 121 and described second conductive substrate 108 thermo-contact.Can also comprise, between second working surface and the second conductive substrate 108 of described semiconductor chilling plate 109, be aided with the second heat-conducting silicone grease 120.
Above-mentioned preparation method specifically can comprise, and offers the second conductive substrate liquid cooling interface tube 135 at described second conductive substrate 108, and described liquid cooling pipe 129 is connected with the second conductive substrate liquid cooling interface tube 135.Can also comprise, described liquid cooling pipe 129 is connected with the second module liquid cooling interface tube 136.
Described in embodiment 3 and embodiment 4, method can also specifically comprise, the step of wind deflector or wind-guiding grid is established in described first module outlet 101, further, can also comprise, all offer the step of wind deflector or wind-guiding grid in described chamber first module inlet 102, described second module inlet 124 and described second module outlet 125.
The utility model also provides a kind of installation method of air regulator, described air regulator comprises the first heat-exchange system 122, second heat-exchange system 123 and semiconductor chilling plate 109, described semiconductor chilling plate 109 comprises the first working surface and the second working surface, described first heat-exchange system 122 carries out heat exchange with semiconductor chilling plate 109 first working surface, described second heat-exchange system 123 carries out heat exchange with semiconductor chilling plate 109 second working surface, described air regulator comprises the first module 127 and the second module 128, described first heat-exchange system 122 and described semiconductor chilling plate 109 are positioned at described first module 127, described second heat-exchange system 123 comprises the hot junction and cold junction that are connected by liquid cooling pipe 129, described hot junction and cold junction lay respectively at the first module 127 and the second module 128, described installation method comprises, described first module 127 is integrated into the step in smoke exhaust ventilator front.
Described first module 127 is integrated into smoke exhaust ventilator front refer to, described first module 127 is integrated into smoke exhaust ventilator dead ahead.
Described method can also comprise, and described first module 127 is integrated into the step in smoke exhaust ventilator horizontal shell 313 front.
Particularly, can be, described first module 127 is integrated into smoke exhaust ventilator horizontal shell 313 front refer to, described first module housing 100 is adhered to smoke exhaust ventilator horizontal shell 313 front, or insert is established between smoke exhaust ventilator horizontal shell 313 front and the first module housing 100, described first module housing 100 and the horizontal shell 313 of smoke exhaust ventilator lay respectively at the both sides up and down of insert, or in described first module housing 100 both sides, support bar is set respectively, described support bar is fixed on smoke exhaust ventilator horizontal shell 313 front.
Described method can also comprise, and described first module 127 is integrated into the step in smoke exhaust ventilator flue collector shell 310 front.
Particularly, can be, described first module 127 is integrated into smoke exhaust ventilator flue collector shell 310 front refer to, described first module housing 100 is adhered to smoke exhaust ventilator flue collector shell 310 front, or use loose collar that the first module 127 is fixed on smoke exhaust ventilator flue collector shell 310 front.
More specifically, Ke Yishi, when described first module 127 is integrated into smoke exhaust ventilator flue collector shell 310 front, the distance between described first module housing 100 and the horizontal shell 313 of described smoke exhaust ventilator is n, and wherein, n is greater than zero.
Described method can also comprise, and described second module 128 is integrated into the step of the horizontal shell 313 of smoke exhaust ventilator.
Particularly, Ke Yishi, is integrated into the horizontal shell 313 of smoke exhaust ventilator by described second module 128 and refers to, described first module 127 is integrated into smoke exhaust ventilator horizontal shell 313 left part or right part.
Particularly, can be, described second module 128 is integrated into the horizontal shell 313 of smoke exhaust ventilator refer to, described second module housing 126 is adhered to the horizontal shell 313 of smoke exhaust ventilator, or insert is established between the horizontal shell 313 of smoke exhaust ventilator and the second module housing 126, described second module housing 126 and the horizontal shell 313 of smoke exhaust ventilator lay respectively at the both sides up and down of insert, or in described second module housing 126 both sides, support bar is set respectively, described support bar is fixed on the horizontal shell 313 of smoke exhaust ventilator.
Described method can also comprise, and described second module 128 is integrated into the step of smoke exhaust ventilator flue collector shell 310.
Particularly, Ke Yishi, is integrated into smoke exhaust ventilator flue collector shell 310 by described second module 128 and refers to, described second module 128 is integrated into smoke exhaust ventilator flue collector shell 310 left surface or right flank.
Particularly, can be, described second module 128 is integrated into smoke exhaust ventilator flue collector shell 310 refer to, described second module housing 126 is adhered to smoke exhaust ventilator flue collector shell 310, or use loose collar that the second module 128 is fixed on smoke exhaust ventilator flue collector shell 310.
More specifically, Ke Yishi, when described second module 128 is integrated into smoke exhaust ventilator flue collector shell 310, the distance between described second module housing 126 and the horizontal shell 313 of described smoke exhaust ventilator is n, and wherein, n is greater than zero.
Figure 11 is the first installation form of air regulator; Figure 12 is air regulator the second installation form; Figure 13 is the third installation form of air regulator; Figure 14 is air regulator the 4th kind of installation form.
Figure 11 is the integrated schematic three dimensional views of the horizontal shell of air regulator and smoke exhaust ventilator.Can find out, air regulator can with smoke exhaust ventilator external harmoniousness, can be integrated on cooking-fume exhausting hood housing, the first module 127 of air regulator 118 is preferentially integrated into the horizontal shell dead ahead of smoke exhaust ventilator.
Smoke exhaust ventilator 119 shell comprises the horizontal shell 313 of smoke exhaust ventilator and smoke exhaust ventilator flue collector shell 310.Smoke exhaust ventilator flue collector is 316.As shown in figure 11, the first module 127 external harmoniousness of air regulator 118, on the horizontal shell 313 of smoke exhaust ventilator 119, is not limited to external harmoniousness certainly to dead ahead, the second module 128 external harmoniousness to the side of the horizontal shell 313 of smoke exhaust ventilator, proceeds posterolateral.Smoke exhaust ventilator control panel 315 send electronic control module can to air regulator 118, or air regulator carries control panel and carries out automatic control.
In a detailed description of the invention, Ke Yishi, is adhered to the horizontal shell 313 of smoke exhaust ventilator respectively by the first module 127 and the second module 128.In another detailed description of the invention, the cold and hot end air inlet of design is all positioned at module lower end, then need to make the first module housing 100 bottom surface and keep certain distance between the second module housing 126 bottom surface and the horizontal shell 313 of smoke exhaust ventilator, but not close contact, can communicate with outside air to keep air inlet.Such as, module lower end configures insert with welding or other modes, about insert and front one or segmentation, makes insert back segment for empty, ensures air intake.Or, support bar is established respectively in first module housing 100 and the second module housing 126 two side, cooking-fume exhausting hood housing is fixed in this support bar lower end, makes the first module housing 100 and retains certain space between the second module housing 126 and the horizontal shell of smoke exhaust ventilator 313.
Figure 12 is air regulator and cooking-fume exhausting hood housing integration mode schematic three dimensional views.Can find out, the first module 127 of air regulator 118 can with smoke exhaust ventilator external harmoniousness, can be integrated on the horizontal shell of smoke exhaust ventilator, preferentially be integrated into dead ahead.Second module 128 external harmoniousness is to the side of smoke exhaust ventilator flue collector shell 310.
In a detailed description of the invention, Ke Yishi, the second module 128 is from the air draught of lower end, both sides, and from top air draft, the second module liquid cooling pore 133 is arranged on outer casing bottom, keeps suitable distance between the second module 128 lower end and the horizontal shell of smoke exhaust ventilator 313.Can be, first module 127 is adhered to the horizontal shell 313 of smoke exhaust ventilator, or insert is respectively equipped with between the horizontal shell 313 of smoke exhaust ventilator and the first module housing 100, described first module housing 100 and the horizontal shell 313 of smoke exhaust ventilator lay respectively at the both sides up and down of insert, or in described first module housing 100 both sides, support bar is set respectively, described support bar is fixed on the horizontal shell 313 of smoke exhaust ventilator, second module 128 is adhered to flue collector shell 310, or uses loose collar that the second module 128 is fixed on flue collector shell 310.
Figure 13 is air regulator and cooking-fume exhausting hood housing integration mode schematic three dimensional views.Can find out, the first module 127 of air regulator 118 can with smoke exhaust ventilator external harmoniousness, can be integrated on smoke exhaust ventilator flue collector shell, preferentially be integrated into dead ahead.Second module 128 external harmoniousness to the side of the horizontal shell 313 of smoke exhaust ventilator, proceeds posterolateral.
In a detailed description of the invention, can be, first module 127 is adhered to flue collector shell 310, or use loose collar that the first module 127 is fixed on flue collector shell 310, second module housing 126 is adhered to the horizontal shell 313 of smoke exhaust ventilator, or insert is established between the horizontal shell 313 of smoke exhaust ventilator and the second module housing 126, second module housing 126 and the horizontal shell 313 of smoke exhaust ventilator lay respectively at the both sides up and down of insert, or in the second module housing 126 both sides, support bar is set respectively, support bar is fixed on the horizontal shell 313 of smoke exhaust ventilator.
Figure 14 is air regulator and cooking-fume exhausting hood housing integration mode schematic three dimensional views.Can find out, the first module 127 of air regulator 118 can with smoke exhaust ventilator external harmoniousness, can be integrated on smoke exhaust ventilator flue collector shell, preferentially be integrated into dead ahead.Second module 128 external harmoniousness is to the side of smoke exhaust ventilator flue collector shell 310.
In a detailed description of the invention, Ke Yishi, the second module 128 is from the air draught of lower end, both sides, and from top air draft, the second module liquid cooling pore 133 is arranged on outer casing bottom, keeps suitable distance between the second module 128 lower end and the horizontal shell of smoke exhaust ventilator 313.Can be that the first module 127 and the second module 128 are adhered to flue collector shell 310 respectively, or use loose collar that the first module 127 and the second module 128 are fixed on flue collector shell 310.
The above embodiment is only for absolutely proving the preferred embodiment that the utility model is lifted, and protection domain of the present utility model is not limited thereto.The equivalent alternative or conversion that those skilled in the art do on the utility model basis, all within protection domain of the present utility model.Protection domain of the present utility model is as the criterion with claims.
Claims (30)
1. an air regulator, described air regulator comprises the first heat-exchange system (122), second heat-exchange system (123) and semiconductor chilling plate (109), described semiconductor chilling plate (109) comprises the first working surface and the second working surface, described first heat-exchange system (122) and semiconductor chilling plate (109) first working surface carry out heat exchange, described second heat-exchange system (123) and semiconductor chilling plate (109) second working surface carry out heat exchange, it is characterized in that: described air regulator comprises the first module (127) and the second module (128),
Described first heat-exchange system (122) and described semiconductor chilling plate (109) are positioned at described first module (127), and described first heat-exchange system (122) comprises the first fin (112);
Described second heat-exchange system (123) comprises A end (138) and B end (139) that are connected by liquid cooling pipe (129), described A end (138) is positioned at the first module (127), described B end (139) is positioned at the second module (128), and described B end (139) comprises the second fin (121).
2. air regulator described in claim 1, it is characterized in that: described first module (127) surrounds the first module hollow chamber (110) by the first module housing (100), A end (138) of described first heat-exchange system (122), described semiconductor chilling plate (109) and described second heat-exchange system (123) is positioned at described first module hollow chamber (110).
3. air regulator described in claim 2, is characterized in that: described first heat-exchange system (122) comprises the first fin (112), the first fan (106), the first module inlet (102) and the first module outlet (101).
4. air regulator described in claim 3, it is characterized in that: described second module (128) surrounds the second module hollow chamber (115) by the second module housing (126), B end (139) of described second heat-exchange system (123) is positioned at described second module hollow chamber (115).
5. air regulator described in claim 4, is characterized in that: described second heat-exchange system (123) comprises the second fin (121), the second fan (114), water pump (137), liquid cooling pipe (129), the second module inlet (124) and the second module outlet (125).
6. air regulator described in claim 5, it is characterized in that: described first module hollow chamber (110) is provided with supporter (116), described semiconductor chilling plate (109) second working surface is embedded in described supporter (116), described first module (127) is provided with the first module liquid cooling pore (134), the first module inlet (102) and the first module outlet (101), and described second module (128) is provided with the second module liquid cooling pore (133), the second module inlet (124) and the second module outlet (125).
7. air regulator described in claim 6, is characterized in that: described supporter (116) is the non-conductor of heat, and described supporter (116) is provided with liquid cooling pore, and described liquid cooling pipe (129) runs through described liquid cooling pore.
8. air regulator described in claim 6, it is characterized in that: described first module outlet (101) is positioned at the leading flank of the first module housing (100), described first module inlet (102) is positioned at the trailing flank of the first module housing (100), left surface, right flank, end face or bottom surface, described second module inlet (124) is positioned at the leading flank of the second module housing (126), trailing flank, left surface, right flank, end face or bottom surface, described second module outlet (125) is positioned at the end face of the second module housing (126), bottom surface, leading flank, trailing flank, left surface or right flank.
9. air regulator described in claim 6, is characterized in that: first fan (106) of described first heat-exchange system (122) is arranged between described first module outlet (101) and the first fin (112).
10. air regulator described in claim 1, is characterized in that: the first working surface of described semiconductor chilling plate (109) is aided with the first conductive substrate (107), described first working surface and the first conductive substrate (107) thermo-contact.
Air regulator described in 11. claims 10, is characterized in that: be aided with the first heat-conducting silicone grease (113) between the first working surface of described semiconductor chilling plate (109) and the first conductive substrate (107).
Air regulator described in 12. claims 1, is characterized in that: the second working surface of described semiconductor chilling plate (109) is aided with the second conductive substrate (108), described second working surface and the second conductive substrate (108) thermo-contact.
Air regulator described in 13. claims 12, is characterized in that: be aided with the second heat-conducting silicone grease (120) between the second working surface of described semiconductor chilling plate (109) and the second conductive substrate (108).
Air regulator described in 14. claims 12, it is characterized in that: described second conductive substrate (108) is liquid cooling plate, be provided with the second conductive substrate liquid cooling interface tube (135), described liquid cooling pipe (129) connects with the second conductive substrate liquid cooling interface tube (135).
Air regulator described in 15. claims 5, is characterized in that: described second heat-exchange system (123) also comprises metal tube (117).
Air regulator described in 16. claims 5, is characterized in that: described second heat-exchange system (123) also comprises heat radiation microtubule (131), and described heat radiation microtubule (131) comprises concurrent flow pipe (130) and header (132).
Air regulator described in 17. claims 15 or 16, it is characterized in that: when comprising metal tube (117), described metal tube (117) is provided with the second module liquid cooling interface tube (136), when comprising heat radiation microtubule (131), described heat radiation microtubule (131) is provided with the second module liquid cooling interface tube (136), and described liquid cooling pipe (129) connects with the second module liquid cooling interface tube (136).
Air regulator described in 18. claims 2, it is characterized in that: described first module hollow chamber (110) is provided with incubation cavity (103), described semiconductor chilling plate (109) participates in forming described incubation cavity (103) wall, described first fin (112) is positioned at described incubation cavity (103), described first module (127) is provided with the first module liquid cooling pore (134), first module inlet (102) and the first module outlet (101), described second module (128) is provided with the second module liquid cooling pore (133), second module inlet (124) and the second module outlet (125).
Air regulator described in 19. claims 18, it is characterized in that: the first working surface of described semiconductor chilling plate (109) participates in forming the bottom surface of incubation cavity (103), and described first heat-exchange system (122) comprises the first fin (112), the first fan (106), the first module inlet (102), the first module outlet (101), the first exhaust air flue (111), incubation cavity air inlet (104) and incubation cavity air outlet (105);
Described second heat-exchange system (123) comprises the second fin (121), the second fan (114), water pump (137), liquid cooling pipe (129), the second module inlet (124) and the second module outlet (125).
Air regulator described in 20. claims 19, it is characterized in that: described first module outlet (101) is positioned at the leading flank of the first module housing (100), described first module inlet (102) is positioned at the trailing flank of the first module housing (100), left surface, right flank, end face or bottom surface, described first module incubation cavity air inlet (104) is positioned at the trailing flank of incubation cavity (103), left surface, right flank, end face or bottom surface, described first module incubation cavity air outlet (105) is positioned at the left surface of incubation cavity (103), right flank, end face, bottom surface or leading flank, described second module inlet (124) is positioned at the leading flank of the second module housing (126), trailing flank, left surface, right flank, end face or bottom surface, described second module outlet (125) is positioned at the end face of the second module housing (126), bottom surface, leading flank, trailing flank, left surface or right flank.
Air regulator described in 21. claims 20, it is characterized in that: described first heat-exchange system (122) incubation cavity air inlet (104) is corresponding with described first module inlet (102), described incubation cavity air outlet (105) is corresponding with described first module outlet (101), and described first fan (106) is arranged between described incubation cavity air outlet (105) and described first module outlet (101).
Air regulator described in 22. claims 18, is characterized in that: the first working surface of described semiconductor chilling plate (109) is aided with the first conductive substrate (107), described first working surface and the first conductive substrate (107) thermo-contact.
Air regulator described in 23. claims 22, is characterized in that: be aided with the first heat-conducting silicone grease (113) between the first working surface of described semiconductor chilling plate (109) and the first conductive substrate (107).
Air regulator described in 24. claims 18, is characterized in that: the second working surface of described semiconductor chilling plate (109) is aided with the second conductive substrate (108), described second working surface and the second conductive substrate (108) thermo-contact.
Air regulator described in 25. claims 24, is characterized in that: be aided with the second heat-conducting silicone grease (120) between the second working surface of described semiconductor chilling plate (109) and the second conductive substrate (108).
Air regulator described in 26. claims 24, it is characterized in that: described second conductive substrate (108) is liquid cooling plate, be provided with the second conductive substrate liquid cooling interface tube (135), described liquid cooling pipe (129) connects with the second conductive substrate liquid cooling interface tube (135).
Air regulator described in 27. claims 26, is characterized in that: described liquid cooling pipe (129) connects with the second module liquid cooling interface tube (136).
Air regulator described in 28. claims 5, is characterized in that: described first module outlet (101) is provided with wind deflector or wind-guiding grid.
Air regulator described in 29. claims 28, is characterized in that: described first module inlet (102), described second module inlet (124) and described second module outlet (125) are equipped with wind deflector or wind-guiding grid.
30. 1 kinds of smoke exhaust ventilators, is characterized in that: described smoke exhaust ventilator comprises the air regulator described in any one of claim 1-29.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520081553.4U CN204693674U (en) | 2015-02-05 | 2015-02-05 | Air regulator and use the smoke exhaust ventilator of this air regulator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520081553.4U CN204693674U (en) | 2015-02-05 | 2015-02-05 | Air regulator and use the smoke exhaust ventilator of this air regulator |
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| Publication Number | Publication Date |
|---|---|
| CN204693674U true CN204693674U (en) | 2015-10-07 |
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| CN201520081553.4U Active CN204693674U (en) | 2015-02-05 | 2015-02-05 | Air regulator and use the smoke exhaust ventilator of this air regulator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105987464A (en) * | 2015-02-05 | 2016-10-05 | 青岛海尔智能技术研发有限公司 | Air conditioner, preparation method thereof and range hood using air conditioner |
-
2015
- 2015-02-05 CN CN201520081553.4U patent/CN204693674U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105987464A (en) * | 2015-02-05 | 2016-10-05 | 青岛海尔智能技术研发有限公司 | Air conditioner, preparation method thereof and range hood using air conditioner |
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