CN105805980A - Side mounting method of semiconductor refrigeration module - Google Patents
Side mounting method of semiconductor refrigeration module Download PDFInfo
- Publication number
- CN105805980A CN105805980A CN201410853695.8A CN201410853695A CN105805980A CN 105805980 A CN105805980 A CN 105805980A CN 201410853695 A CN201410853695 A CN 201410853695A CN 105805980 A CN105805980 A CN 105805980A
- Authority
- CN
- China
- Prior art keywords
- inner chamber
- shell
- exocoel
- chilling plate
- semiconductor chilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a side mounting method of a semiconductor refrigeration module. The semiconductor refrigeration module is mainly formed by a first heat exchange system, a second heat exchange system, a semiconductor chilling plate and a shell, wherein the shell encircles to form a hollow cavity, and the semiconductor chilling plate comprises a first working surface and a second working surface; the hollow cavity is divided into an inner cavity and an outer cavity; the semiconductor chilling plate is limited in the inner cavity or limited in the outer cavity, or the first working surface and the second working surface of the semiconductor chilling plate are separately limited in the inner cavity and the outer cavity; and the method comprises the steps of integrating the shell to the shell of a main flue of a range hood. By physical isolation of the two heat exchange systems, the energy utilization efficiency can be improved.
Description
Technical field
The present invention relates to the side installation method of a kind of semiconductor refrigerating module.
Background technology
It is an arduous housework in the culinary art of cooking of kitchen focus edge of table, particularly in summer, the heat that originally hot weather sends plus kitchen range, make working environment in kitchen very harsh.
The problem too high in order to solve kitchen temperature, has people to install fan or air-conditioning in kitchen, but fan blowing refrigeration is general, and can affect gas-cooker normal operation, there is also potential safety hazard.Due to the oil smoke surroundings that kitchen is special, after general fan uses a period of time, fan adheres to substantial amounts of putty, is difficult to clean, will also result in the pollution of kitchen environment.
Kitchen is installed air-conditioning equipment, there is Cost Problems on the one hand, also can there is the problem being difficult to clean on the other hand, after air-conditioning heat exchanger surface attachment oil smoke, there is also the problem that refrigeration declines.
Summary of the invention
In order to solve what prior art existed, kitchen use air-conditioning relatively costly, and be difficult to clean and the low inferior problem of temperature regulation effect, the present invention provides the side installation method of a kind of semiconductor refrigerating module, semiconductor refrigerating module provided by the invention is installed and is applied in smoke exhaust ventilator.
As one aspect of the present invention, relate to the side installation method of a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate includes the first working surface and the second working surface；Described cavity is divided into inner chamber and exocoel；Described semiconductor chilling plate is restricted to described inner chamber, or is restricted to described exocoel, or the first working surface of described semiconductor chilling plate and the second working surface are limited to described inner chamber and described exocoel respectively；Described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；Described first fin is restricted to inner chamber, and described second fin is restricted to exocoel；Described shell is provided with inner chamber air outlet, inner chamber air inlet, exocoel air outlet and exocoel air inlet, and described method includes, and described shell is integrated into the step on smoke exhaust ventilator flue collector shell.
Specifically, described being integrated into by described shell on smoke exhaust ventilator flue collector shell refers to, shell is integrated into dead ahead on smoke exhaust ventilator flue collector shell.
Specifically, described it is integrated into shell on smoke exhaust ventilator flue collector shell to refer to, shell is adhered to flue collector shell, or uses loose collar that semiconductor refrigerating module is fixed on flue collector shell.Distance between described shell and the horizontal shell of described smoke exhaust ventilator is n, and wherein, n is more than zero.
As one of detailed description of the invention, described semiconductor chilling plate is restricted to inner chamber, and described first heat-exchange system includes the first working surface of semiconductor chilling plate, the first fin, inner chamber air inlet, inner chamber wind inlet channel, the first fan, the first air intake tuyere, the first air-out tuyere and inner chamber air outlet；Described second heat-exchange system includes the second working surface of semiconductor chilling plate, heat pipe, the second fin, the second fan, exocoel air inlet and exocoel air outlet.
Specifically, described inner chamber air outlet is positioned at described shell front side face；Described exocoel air outlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank.
As one of detailed description of the invention, described semiconductor chilling plate is restricted to exocoel, and described first heat-exchange system includes the first working surface of semiconductor chilling plate, heat pipe, the first fin, inner chamber air inlet, inner chamber wind inlet channel, the first fan, the first air intake tuyere, the first air-out tuyere and inner chamber air outlet；Described second heat-exchange system includes the second working surface of semiconductor chilling plate, the second fin, the second fan, exocoel air inlet and exocoel air outlet.
Specifically, described exocoel air outlet is positioned at described shell front side face；Described inner chamber air outlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank.
Described inner chamber and described exocoel it is limited to respectively as one of detailed description of the invention, the first working surface of described semiconductor chilling plate and the second working surface；Described first heat-exchange system includes the first working surface of semiconductor chilling plate, the first fin, inner chamber air inlet, inner chamber wind inlet channel, the first fan, the first air intake tuyere, the first air-out tuyere and inner chamber air outlet；Described second heat-exchange system includes the second working surface of semiconductor chilling plate, the second fin, the second fan, exocoel air inlet and exocoel air outlet.
Specifically, described inner chamber air outlet is positioned at described shell front side face；Described exocoel air outlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank.
As another aspect of the present invention, relate to a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate includes the first working surface and the second working surface；Described cavity is divided into inner chamber and exocoel；Described semiconductor chilling plate is restricted to described inner chamber, or is restricted to described exocoel, or the first working surface of described semiconductor chilling plate and the second working surface are limited to described inner chamber and described exocoel respectively；Described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；Described first fin is restricted to inner chamber, and described second fin is restricted to exocoel；Described shell is provided with inner chamber air outlet, inner chamber air inlet, exocoel air outlet and exocoel air inlet.
As one of detailed description of the invention, described semiconductor chilling plate is restricted to inner chamber, and described first heat-exchange system includes the first working surface of semiconductor chilling plate, the first fin, inner chamber air inlet, inner chamber wind inlet channel, the first fan, the first air intake tuyere, the first air-out tuyere and inner chamber air outlet；Described second heat-exchange system includes the second working surface of semiconductor chilling plate, heat pipe, the second fin, the second fan, exocoel air inlet and exocoel air outlet.
Described inner chamber air outlet is positioned at described shell front side face；Described exocoel air outlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank.
First working surface of described semiconductor chilling plate is aided with the first conductive substrate, and described first fin thermally contacts with described first conductive substrate.Second working surface of described semiconductor chilling plate is aided with the second conductive substrate, and described second fin thermally contacts with described second conductive substrate.
Described inner chamber can be provided with supporter, and described supporter end face sets holding tank, and the second working surface of described semiconductor chilling plate is contained in described holding tank.Described supporter is preferably the non-conductor of heat, and described supporter is provided with heat pipe hole, and described heat pipe runs through described heat pipe hole.
Described second fin, described second fan, described exocoel air inlet and described exocoel air outlet can respectively two groups.
As one of detailed description of the invention, described semiconductor chilling plate is restricted to exocoel, and described first heat-exchange system includes the first working surface of semiconductor chilling plate, heat pipe, the first fin, inner chamber air inlet, inner chamber wind inlet channel, the first fan, the first air intake tuyere, the first air-out tuyere and inner chamber air outlet；Described second heat-exchange system includes the second working surface of semiconductor chilling plate, the second fin, the second fan, exocoel air inlet and exocoel air outlet.
Described exocoel air outlet is positioned at described shell front side face；Described inner chamber air outlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank.
First working surface of described semiconductor chilling plate is aided with the first conductive substrate, and described first fin thermally contacts with described first conductive substrate.Second working surface of described semiconductor chilling plate is aided with the second conductive substrate, and described second fin thermally contacts with described second conductive substrate.
Described exocoel can be provided with supporter, and described supporter end face sets holding tank, and the first working surface of described semiconductor chilling plate is contained in described holding tank.Described supporter is preferably the non-conductor of heat, and described supporter is provided with heat pipe hole, and described heat pipe runs through described heat pipe hole.
Described inner chamber and described exocoel it is limited to respectively as one of detailed description of the invention, the first working surface of described semiconductor chilling plate and the second working surface；Described first heat-exchange system includes the first working surface of semiconductor chilling plate, the first fin, inner chamber air inlet, inner chamber wind inlet channel, the first fan, the first air intake tuyere, the first air-out tuyere and inner chamber air outlet；Described second heat-exchange system includes the second working surface of semiconductor chilling plate, the second fin, the second fan, exocoel air inlet and exocoel air outlet.
Described inner chamber air outlet is positioned at described shell front side face；Described exocoel air outlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet is positioned at described outer casing top surface, bottom surface, trailing flank, left surface or right flank.
First working surface of described semiconductor chilling plate is aided with the first conductive substrate, and described first fin thermally contacts with described first conductive substrate.Second working surface of described semiconductor chilling plate is aided with the second conductive substrate, and described second fin thermally contacts with described second conductive substrate.Specifically, described second fin thermally contacts with Heat Pipes with described second conductive substrate.
Described exocoel can be provided with supporter, and described supporter end face sets holding tank, and the second working surface of described semiconductor chilling plate is contained in described holding tank.Described supporter is provided with heat pipe hole, and described heat pipe runs through described heat pipe hole.
Described second fin, described second fan, described exocoel air inlet and described exocoel air outlet can respectively two groups.
The above semiconductor refrigerating module, described inner chamber air inlet, described inner chamber air outlet, described exocoel air inlet and described exocoel air outlet all can arrange wind-guiding grid.
The above semiconductor refrigerating module, can be aided with heat-conducting silicone grease between the first working surface and first conductive substrate of described semiconductor chilling plate；Heat-conducting silicone grease can be aided with between second working surface and second conductive substrate of described semiconductor chilling plate.
As the third aspect of the invention, relating to a kind of smoke exhaust ventilator, described smoke exhaust ventilator includes any of the above-described kind of semiconductor refrigerating module.
As the fourth aspect of the invention, the preparation method relating to a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly by the first heat-exchange system, second heat-exchange system, semiconductor chilling plate and shell are constituted, described shell surrounds cavity, described semiconductor chilling plate includes the first working surface and the second working surface, described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate, described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate, described method includes, described cavity is divided into the step of inner chamber and exocoel.
As one of detailed description of the invention, described method includes, described semiconductor chilling plate is limited to described inner chamber or described exocoel, or the first working surface and second working surface of described semiconductor chilling plate are limited to described inner chamber and the step of described exocoel respectively, can also include, described first fin is limited to inner chamber, and described second fin is limited to the step of exocoel；The step of inner chamber air outlet, inner chamber air inlet, exocoel air outlet and exocoel air inlet is set at described shell.
As the fifth aspect of the invention, relate to the bottom installation method of a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, and described semiconductor chilling plate includes the first working surface and the second working surface；Described cavity is divided into inner chamber and exocoel；Described semiconductor chilling plate is restricted to described inner chamber, or is restricted to described exocoel, or the first working surface of described semiconductor chilling plate and the second working surface are limited to described inner chamber and described exocoel respectively；Described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；Described first fin is restricted to inner chamber, and described second fin is restricted to exocoel；Described shell is provided with inner chamber air outlet, inner chamber air inlet, exocoel air outlet and exocoel air inlet, and described method includes, and described shell is integrated into the step on the horizontal shell of smoke exhaust ventilator.
Specifically, described it is integrated on the horizontal shell of smoke exhaust ventilator to refer to shell, shell is integrated into the horizontal shell dead ahead of smoke exhaust ventilator.
Specifically, described it is integrated on the horizontal shell of smoke exhaust ventilator to refer to shell, between the horizontal shell of described shell and smoke exhaust ventilator, insert is set, horizontal to described shell and smoke exhaust ventilator shell is individually fixed in the both sides up and down of insert so that between described shell and the horizontal shell of smoke exhaust ventilator, retain certain space.Described insert can be U-bracket.
As the sixth aspect of the invention, relate to the cold-hot wind isolation method of a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of the first heat-exchange system, the second heat-exchange system, semiconductor chilling plate and shell, described shell surrounds cavity, described semiconductor chilling plate includes the first working surface and the second working surface, and described first heat-exchange system includes the first working surface and first fin of described semiconductor chilling plate；Described second heat-exchange system includes the second working surface and second fin of described semiconductor chilling plate；By described cavity being divided into inner chamber and exocoel；Described first fin is limited to inner chamber, described second fin is limited to exocoel；Inner chamber air outlet, inner chamber air inlet, exocoel air outlet and exocoel air inlet is set, it is achieved the cold-hot wind isolation of semiconductor refrigerating module at described shell.
Specifically, it is possible to be, described semiconductor chilling plate is limited to described inner chamber or described exocoel, or the first working surface and second working surface of described semiconductor chilling plate are limited to described inner chamber and described exocoel respectively.
The embodiment of the present invention at least achieves following beneficial effect:
1, semiconductor refrigerating module provided by the invention, structural design is simply compact, manufactures simple, and cost is low；
2, the present invention will be equipped with the module housing of semiconductor refrigerating module and is installed on the horizontal shell of cooking-fume exhausting hood housing or on flue collector shell, it is all not take up the volume of cooking-fume exhausting hood housing inner chamber, therefore cooking-fume exhausting hood housing internal structure is not affected, and during smoke exhaust ventilator cleaning, only module housing need to be taken off from cooking-fume exhausting hood housing, can conveniently cleaning, therefore it is not only easy to installing/dismounting, and is readily cleaned maintenance.
3, by by the physical isolation of two heat-exchange systems, being effectively increased the utilization ratio of energy.
Accompanying drawing explanation
Fig. 1 is the semiconductor refrigerating module schematic top plan view of one of the embodiment of the present invention；
Fig. 2 is the semiconductor refrigerating module right view of one of the embodiment of the present invention；
Fig. 3 is the semiconductor refrigerating inside modules structure front view of one of the embodiment of the present invention；
Fig. 4 is the semiconductor refrigerating module housing schematic three dimensional views of one of the embodiment of the present invention；
Fig. 5 is the semiconductor refrigerating module schematic top plan view of the two of the embodiment of the present invention；
Fig. 6 is the semiconductor refrigerating module right view of the two of the embodiment of the present invention；
Fig. 7 is the semiconductor refrigerating inside modules structure front view of the two of the embodiment of the present invention；
Fig. 8 is the semiconductor refrigerating module housing schematic three dimensional views of the two of the embodiment of the present invention；
Fig. 9 is the semiconductor refrigerating module schematic top plan view of the three of the embodiment of the present invention；
Figure 10 is the semiconductor refrigerating module right view of the three of the embodiment of the present invention；
Figure 11 is the semiconductor refrigerating inside modules structure front view of the three of the embodiment of the present invention；
Figure 12 is the semiconductor refrigerating module housing schematic three dimensional views of the three of the embodiment of the present invention；
Figure 13 is the axonometric chart that semiconductor refrigerating module of the present invention is installed on the horizontal shell of smoke exhaust ventilator；
Figure 14 is that semiconductor refrigerating module is installed on the axonometric chart of smoke exhaust ventilator flue collector shell by the present invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the invention will be further described, so that those skilled in the art can be better understood from the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
Embodiments provide semiconductor refrigerating module and the smoke exhaust ventilator of this refrigeration module of external harmoniousness.Semiconductor refrigerating module, based semiconductor cooling piece, and with the use of fin heat exchange, cold semiconductor chilling plate energising produced by fan or heat blowout.Cold environment or the thermal environment of a local can be produced for user, meet the comfortableness requirement of people.Semiconductor chilling plate has two working surfaces, and upper end is the first working surface, and lower end is the second working surface, and when the first working surface is hot junction, the second working surface is cold end；When the first working surface is cold end, the second working surface is hot junction.Semiconductor refrigerating module with smoke exhaust ventilator external harmoniousness, can be integrated into cooking-fume exhausting hood housing horizontal component upper end or be integrated into smoke exhaust ventilator flue collector outer casing frontispiece.Refrigeration module can work independently, it is possible to smoke exhaust ventilator intelligent linkage.
One outstanding feature of semiconductor refrigerating module provided by the present invention is in that, its first heat-exchange system and the second heat-exchange system achieve part, or even whole physical isolation, can effectively prevent the two-way flow of the produced heat energy of semiconductor chilling plate and cold energy, put forward high-octane utilization ratio, reduce power consumption.
In one detailed description of the invention, refrigeration module mode of operation has nice and cool pattern and warm pattern two kinds: when pressing nice and cool pattern, and semiconductor chilling plate upper end is cold end, and lower end is hot junction, and module front air outlet goes out cold wind；When pressing warm pattern, semiconductor chilling plate upper end is hot junction, and lower end is cold end, and module dead ahead air outlet goes out hot blast.Hereinafter, illustrate for nice and cool pattern.
The present invention provides a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of first heat-exchange system the 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, and described semiconductor chilling plate 106 includes the first working surface and the second working surface；Described cavity 107 is divided into inner chamber 116 and exocoel；Described semiconductor chilling plate 106 is restricted to described inner chamber 116, or is restricted to described exocoel, or the first working surface of described semiconductor chilling plate 106 and the second working surface are limited to described inner chamber 116 and described exocoel respectively；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to inner chamber 116, and described second fin 110 is restricted to exocoel；Described shell 100 is provided with inner chamber air outlet 101, inner chamber air inlet 102, exocoel air outlet 114 and exocoel air inlet 113.
As embodiment 1, with reference to Fig. 1-Fig. 4, described semiconductor chilling plate 106 is restricted to inner chamber 116, and described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin 109, inner chamber air inlet 102, inner chamber wind inlet channel the 119, first fan the 108, first air intake tuyere the 117, first air-out tuyere 118 and inner chamber air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan 112, exocoel air inlet 113 and exocoel air outlet 114.
Described inner chamber air outlet 101 is positioned at described shell 100 leading flank；Described exocoel air outlet 114 may be located at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet 102 may be located at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet 113 may be located at described shell 100 end face, bottom surface, trailing flank, left surface or right flank.
First working surface of described semiconductor chilling plate 106 is aided with the first conductive substrate 104, and described first fin 109 thermally contacts with described first conductive substrate 104.Second working surface of described semiconductor chilling plate 106 is aided with the second conductive substrate 105, and described second fin 110 thermally contacts with described second conductive substrate 105.
Described inner chamber 116 can be provided with supporter 115, and described supporter 115 end face sets holding tank, and the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.Described supporter 115 is preferably the non-conductor of heat, and described supporter 115 is provided with heat pipe hole, and described heat pipe 111 runs through described heat pipe hole.
Described second fin 110, described second fan 112, described exocoel air inlet 113 and described exocoel air outlet 114 can respectively two groups, more quickly to realize energy dissipation.
As embodiment 2, with reference to Fig. 5-Fig. 8, described semiconductor chilling plate 106 is restricted to exocoel, and described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, heat pipe the 111, first fin 109, inner chamber air inlet 102, inner chamber wind inlet channel the 119, first fan the 108, first air intake tuyere the 117, first air-out tuyere 118 and inner chamber air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, second fin the 110, second fan 112, exocoel air inlet 113 and exocoel air outlet 114.
Described exocoel air outlet 114 is positioned at described shell 100 leading flank；Described inner chamber air outlet 101 may be located at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet 113 may be located at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet 102 may be located at described shell 100 end face, bottom surface, trailing flank, left surface or right flank.
First working surface of described semiconductor chilling plate 106 is aided with the first conductive substrate 104, and described first fin 109 thermally contacts with described first conductive substrate 104.Second working surface of described semiconductor chilling plate 106 is aided with the second conductive substrate 105, and described second fin 110 thermally contacts with described second conductive substrate 105.
Described exocoel can be provided with supporter 115, and described supporter 115 end face sets holding tank, and the first working surface of described semiconductor chilling plate 106 is contained in described holding tank.Described supporter 115 is preferably the non-conductor of heat, and described supporter 115 is provided with heat pipe hole, and described heat pipe 111 runs through described heat pipe hole.
As embodiment 3, with reference to Fig. 9-Figure 12, the first working surface of described semiconductor chilling plate 106 and the second working surface are limited to described inner chamber 116 and described exocoel respectively；Described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin 109, inner chamber air inlet 102, inner chamber wind inlet channel the 119, first fan the 108, first air intake tuyere the 117, first air-out tuyere 118 and inner chamber air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, second fin the 110, second fan 112, exocoel air inlet 113 and exocoel air outlet 114.
Described inner chamber air outlet 101 is positioned at described shell 100 leading flank；Described exocoel air outlet 114 may be located at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet 102 may be located at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet 113 may be located at described shell 100 end face, bottom surface, trailing flank, left surface or right flank.
First working surface of described semiconductor chilling plate 106 is aided with the first conductive substrate 104, and described first fin 109 thermally contacts with described first conductive substrate 104.Second working surface of described semiconductor chilling plate 106 is aided with the second conductive substrate 105, and described second fin 110 thermally contacts with described second conductive substrate 105.Specifically, in the present embodiment, described second fin 110 can be realize thermally contacting with heat pipe 111 with described second conductive substrate 105.
Described exocoel can be provided with supporter 115, and described supporter 115 end face sets holding tank, and the second working surface of described semiconductor chilling plate 106 is contained in described holding tank.Described supporter 115 is provided with heat pipe hole, and described heat pipe 111 runs through described heat pipe hole.
Described second fin 110, described second fan 112, described exocoel air inlet 113 and described exocoel air outlet 114 can respectively two groups, to realize the more fast diffusion of energy.
The semiconductor refrigerating module that above example 1-3 provides, all can arrange wind-guiding grid 103 at described inner chamber air inlet 102, described inner chamber air outlet 101, described exocoel air inlet 113 and described exocoel air outlet 114.
The semiconductor refrigerating module that above example 1-3 provides, can be aided with heat-conducting silicone grease 200 between the first working surface and first conductive substrate 104 of described semiconductor chilling plate 106；Heat-conducting silicone grease 201 can be aided with between second working surface and second conductive substrate 105 of described semiconductor chilling plate 106.
The present invention also provides for a kind of smoke exhaust ventilator, and described smoke exhaust ventilator includes the semiconductor refrigerating module that above-described embodiment 1-3 any embodiment provides.
The preparation method that the present invention also provides for semiconductor refrigerating module, this semiconductor refrigerating module is mainly by the first heat-exchange system 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100 are constituted, described shell 100 surrounds cavity 107, described semiconductor chilling plate 106 includes the first working surface and the second working surface, described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106, described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106, described method includes, described cavity 107 is divided into the step of inner chamber 116 and exocoel.
As embodiment 4, described method includes, described semiconductor chilling plate 106 is limited to described inner chamber 116 or described exocoel, or the first working surface of described semiconductor chilling plate 106 and the second working surface are limited to respectively the step of described inner chamber 116 and described exocoel, can also include, described first fin 109 is limited to inner chamber 116, and described second fin 110 is limited to the step of exocoel；The step of inner chamber air outlet 101, inner chamber air inlet 102, exocoel air outlet 114 and exocoel air inlet 113 is set at described shell 100.
Above-mentioned preparation method specifically can include, and described semiconductor chilling plate 106 is limited to inner chamber 116；The first working surface of described semiconductor chilling plate 106, the first fin 109, inner chamber air inlet 102, inner chamber wind inlet channel the 119, first fan the 108, first air intake tuyere the 117, first air-out tuyere 118 and inner chamber air outlet 101 is made to constitute described first heat-exchange system 120；The second working surface of described semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan 112, exocoel air inlet 113 and exocoel air outlet 114 is made to constitute described second heat-exchange system 121.
Above-mentioned preparation method specifically can include, and offers inner chamber air outlet 101 at described shell 100 leading flank；Exocoel air outlet 114 is offered at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Inner chamber air inlet 102 is offered at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Exocoel air inlet 113 is offered at described shell 100 end face, bottom surface, trailing flank, left surface or right flank.
Above-mentioned preparation method specifically can include, and the first working surface at described semiconductor chilling plate 106 is aided with the first conductive substrate 104, and described first fin 109 is thermally contacted with described first conductive substrate 104；The second working surface at described semiconductor chilling plate 106 is aided with the second conductive substrate 105, and described second fin 110 is thermally contacted with described second conductive substrate 105.
Above-mentioned preparation method specifically can include, and sets supporter 115 at described inner chamber 116, and described supporter 115 end face sets holding tank, and is contained in described holding tank by the second working surface of described semiconductor chilling plate 106.Heat pipe hole is set so that described heat pipe 111 runs through described heat pipe hole at described supporter 115.
Above-mentioned preparation method specifically can include, described second fin 110, described second fan 112, described exocoel air inlet 113 and described exocoel air outlet 114 respectively two groups.
As embodiment 5, described method includes, described semiconductor chilling plate 106 is limited to the step of exocoel, can also include so that the first working surface of described semiconductor chilling plate 106, heat pipe the 111, first fin 109, inner chamber air inlet 102, inner chamber wind inlet channel the 119, first fan the 108, first air intake tuyere the 117, first air-out tuyere 118 and inner chamber air outlet 101 constitute described first heat-exchange system 120；And so that the second working surface of described semiconductor chilling plate 106, second fin the 110, second fan 112, exocoel air inlet 113 and exocoel air outlet 114 constitute the step of described second heat-exchange system 121.
Described method can also specifically include, and offers exocoel air outlet 114 at described shell 100 leading flank；Inner chamber air outlet 101 is offered at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Exocoel air inlet 113 is offered at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；And, the step of inner chamber air inlet 102 is offered at described shell 100 end face, bottom surface, trailing flank, left surface or right flank.
Described method can also specifically include, and the first working surface at described semiconductor chilling plate 106 is aided with the first conductive substrate 104 so that described first fin 109 thermally contacts with described first conductive substrate 104；The second working surface at described semiconductor chilling plate 106 is aided with the second conductive substrate 105, and described second fin 110 thermally contacts with described second conductive substrate 105.
Described method can also specifically include, and sets supporter 115 at described exocoel, and described supporter 115 end face sets holding tank, and is contained in described holding tank by the first working surface of described semiconductor chilling plate 106.It is provided with heat pipe hole at described supporter 115, and makes described heat pipe 111 run through described heat pipe hole.
As embodiment 6, described method includes, and the first working surface of described semiconductor chilling plate 106 and the second working surface are limited to described inner chamber 116 and described exocoel respectively；The first working surface of described semiconductor chilling plate 106, the first fin 109, inner chamber air inlet 102, inner chamber wind inlet channel the 119, first fan the 108, first air intake tuyere the 117, first air-out tuyere 118 and inner chamber air outlet 101 is made to constitute described first heat-exchange system 120；The second working surface of described semiconductor chilling plate 106, second fin the 110, second fan 112, exocoel air inlet 113 and exocoel air outlet 114 is made to constitute described second heat-exchange system 121.
Described method can also specifically include, and sets inner chamber air outlet 101 at described shell 100 leading flank；Exocoel air outlet 114 is set at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Inner chamber air inlet 102 is set at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；And, set exocoel air inlet 113 at described shell 100 end face, bottom surface, trailing flank, left surface or right flank.
Described method can also specifically include, and the first working surface at described semiconductor chilling plate 106 is aided with the first conductive substrate 104 so that described first fin 109 thermally contacts with described first conductive substrate 104；The second working surface at described semiconductor chilling plate 106 is aided with the second conductive substrate 105 so that described second fin 110 thermally contacts with described second conductive substrate 105.Described second fin 110 realizes thermally contacting with heat pipe 111 with described second conductive substrate 105.
Described method can also specifically include, and sets supporter 115 at described exocoel, and described supporter 115 end face sets holding tank, and is contained in described holding tank by the second working surface of described semiconductor chilling plate 106.Set heat pipe hole at described supporter 115, and described heat pipe 111 is run through described heat pipe hole.
Described second fin 110, described second fan 112, described exocoel air inlet 113 and described exocoel air outlet 114 can respectively two groups.
Described method can also specifically include, and arranges the step of wind-guiding grid 103 at described inner chamber air inlet 102, described inner chamber air outlet 101, described exocoel air inlet 113 and described exocoel air outlet 114.
As embodiment 7, the bottom installation method of a kind of semiconductor refrigerating module is provided, this semiconductor refrigerating module 150 is mainly made up of first heat-exchange system the 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, and described semiconductor chilling plate 106 includes the first working surface and the second working surface；Described cavity 107 is divided into inner chamber 116 and exocoel；Described semiconductor chilling plate 106 is restricted to described inner chamber 116, or is restricted to described exocoel, or the first working surface of described semiconductor chilling plate 106 and the second working surface are limited to described inner chamber 116 and described exocoel respectively；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to inner chamber 116, and described second fin 110 is restricted to exocoel；Described shell 100 is provided with inner chamber air outlet 101, inner chamber air inlet 102, exocoel air outlet 114 and exocoel air inlet 113, and described method includes, and described shell 100 is integrated into the step on the horizontal shell 313 of smoke exhaust ventilator.
Specifically, described it is integrated on the horizontal shell 313 of smoke exhaust ventilator to refer to shell 100, shell 100 is integrated into smoke exhaust ventilator horizontal shell 313 dead ahead.
Specifically, described it is integrated on the horizontal shell 313 of smoke exhaust ventilator to refer to shell 100, between the horizontal shell 313 of described shell 100 and smoke exhaust ventilator, insert is set, horizontal to described shell 100 and smoke exhaust ventilator shell 313 is individually fixed in the both sides up and down of insert so that between described shell 100 and the horizontal shell of smoke exhaust ventilator 313, retain certain space.Described insert can be U-bracket 317.
Specifically, described being integrated into by described shell 100 on the horizontal shell 313 of smoke exhaust ventilator refers to, support bar is set in semiconductor refrigerating module 150 shell 100 two side, cooking-fume exhausting hood housing is fixed in this support bar lower end so that retain certain space between semiconductor refrigerating module housing 100 and the horizontal shell of smoke exhaust ventilator 313.
Figure 13 is semiconductor refrigerating module and the smoke exhaust ventilator integrated schematic three dimensional views of horizontal shell.It can be seen that semiconductor refrigerating module can with smoke exhaust ventilator external harmoniousness, it is possible to be integrated on cooking-fume exhausting hood housing, preferentially it is integrated into the horizontal shell dead ahead of smoke exhaust ventilator.
Smoke exhaust ventilator 151 shell includes the horizontal shell 313 of smoke exhaust ventilator and smoke exhaust ventilator flue collector shell 310.Smoke exhaust ventilator flue collector is 316.As shown in figure 13, semiconductor refrigerating module 150 external harmoniousness, to the horizontal shell 313 of smoke exhaust ventilator 151, is certainly not limited to external harmoniousness to dead ahead.Smoke exhaust ventilator control panel 315 sends automatically controlled instruction can to semiconductor refrigerating module 150, or semiconductor refrigerating module carries control panel and carries out automatic control.In a detailed description of the invention, the cold and hot end air inlet of design is all located at semiconductor refrigerating module 150 lower end, then it is required that keep certain distance between module housing 100 bottom surface and the horizontal shell 313 of smoke exhaust ventilator, but not close contact, to keep air inlet can communicate with outside air.Such as, module lower end is with welding or other mode configuring u supports 317, and with front one or segmentation about support, it is empty for making holder back section, it is ensured that air intake.Or, setting support bar in semiconductor refrigerating module housing 100 two side, cooking-fume exhausting hood housing is fixed in this support bar lower end so that retain certain space between semiconductor refrigerating module housing 100 and the horizontal shell of smoke exhaust ventilator 313.
As embodiment 8, the side installation method of a kind of semiconductor refrigerating module is provided, this semiconductor refrigerating module 150 is mainly made up of first heat-exchange system the 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, and described semiconductor chilling plate 106 includes the first working surface and the second working surface；Described cavity 107 is divided into inner chamber 116 and exocoel；Described semiconductor chilling plate 106 is restricted to described inner chamber 116, or is restricted to described exocoel, or the first working surface of described semiconductor chilling plate 106 and the second working surface are limited to described inner chamber 116 and described exocoel respectively；Described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；Described first fin 109 is restricted to inner chamber 116, and described second fin 110 is restricted to exocoel；Described shell 100 is provided with inner chamber air outlet 101, inner chamber air inlet 102, exocoel air outlet 114 and exocoel air inlet 113, and described method includes, and described shell 100 is integrated into the step on smoke exhaust ventilator flue collector shell 310.
Specifically, described it is integrated on smoke exhaust ventilator flue collector shell 310 by described shell 100 to refer to, shell 100 is integrated into dead ahead on smoke exhaust ventilator flue collector shell 310.
Specifically, described being integrated into by shell 100 on smoke exhaust ventilator flue collector shell 310 refers to, shell 100 is adhered to flue collector shell 310, or uses loose collar that semiconductor refrigerating module 150 is fixed on flue collector shell 310.Distance between described shell 100 and the horizontal shell 313 of described smoke exhaust ventilator is n, and wherein, n is more than zero.
Figure 14 is semiconductor refrigerating module and the smoke exhaust ventilator integrated schematic three dimensional views of flue collector shell.It can be seen that semiconductor refrigerating module 150 can with smoke exhaust ventilator 151 external harmoniousness, it is possible to be integrated on smoke exhaust ventilator flue collector shell 310, be preferentially integrated into flue collector shell 310 dead ahead.Specifically, can be that semiconductor refrigerating module 150 is adhered to flue collector shell 310, can also be use loose collar that semiconductor refrigerating module 150 is fixed on flue collector shell 310, it is also possible to be that semiconductor refrigerating module 150 can be fixed on the mode of flue collector shell 310 by other.In a detailed description of the invention, when on semiconductor refrigerating module 150 external harmoniousness to smoke exhaust ventilator flue collector shell 310, the cold and hot end air intake of module all enters from below, hot blast blows out from top, now, need maintenance appropriately distance between this semiconductor refrigerating module 150 lower end and the horizontal shell 313 of smoke exhaust ventilator, in order to air inlet can communicate with outside air.
The inventive point of the present invention is in that, invent the cold-hot wind isolation method of a kind of semiconductor refrigerating module, this semiconductor refrigerating module is mainly made up of first heat-exchange system the 120, second heat-exchange system 121, semiconductor chilling plate 106 and shell 100, described shell 100 surrounds cavity 107, described semiconductor chilling plate 106 includes the first working surface and the second working surface, and described first heat-exchange system 120 includes the first working surface and first fin 109 of described semiconductor chilling plate 106；Described second heat-exchange system 121 includes the second working surface and second fin 110 of described semiconductor chilling plate 106；By described cavity 107 is divided into inner chamber 116 and exocoel；Described first fin 109 is limited to inner chamber 116, described second fin 110 is limited to exocoel；Inner chamber air outlet 101, inner chamber air inlet 102, exocoel air outlet 114 and exocoel air inlet 113 is set, it is achieved the cold-hot wind isolation of semiconductor refrigerating module at described shell 100.
Specifically, it is possible to be, described semiconductor chilling plate 106 is limited to described inner chamber 116 or described exocoel, or the first working surface and second working surface of described semiconductor chilling plate 106 are limited to described inner chamber 116 and described exocoel respectively.
Specifically, it is possible to be, the first working surface and the first fin 109 that make described semiconductor chilling plate 106 thermally contact；The second working surface and the second fin 110 that make described semiconductor chilling plate 106 thermally contact.
As one of detailed description of the invention, described semiconductor chilling plate 106 is restricted to inner chamber 116, and described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin 109, inner chamber air inlet 102, inner chamber wind inlet channel the 119, first fan the 108, first air intake tuyere the 117, first air-out tuyere 118 and inner chamber air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, heat pipe the 111, second fin the 110, second fan 112, exocoel air inlet 113 and exocoel air outlet 114.
It is concrete it may be that described inner chamber air outlet 101 is positioned at described shell 100 leading flank；Described exocoel air outlet 114 is positioned at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet 102 is positioned at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet 113 is positioned at described shell 100 end face, bottom surface, trailing flank, left surface or right flank.
As one of detailed description of the invention, described semiconductor chilling plate 106 is restricted to exocoel, and described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, heat pipe the 111, first fin 109, inner chamber air inlet 102, inner chamber wind inlet channel the 119, first fan the 108, first air intake tuyere the 117, first air-out tuyere 118 and inner chamber air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, second fin the 110, second fan 112, exocoel air inlet 113 and exocoel air outlet 114.
It is concrete it may be that described exocoel air outlet 114 is positioned at described shell 100 leading flank；Described inner chamber air outlet 101 is positioned at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet 113 is positioned at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet 102 is positioned at described shell 100 end face, bottom surface, trailing flank, left surface or right flank.
Described inner chamber 116 and described exocoel it is limited to respectively as one of detailed description of the invention, the first working surface of described semiconductor chilling plate 106 and the second working surface；Described first heat-exchange system 120 includes the first working surface of semiconductor chilling plate 106, the first fin 109, inner chamber air inlet 102, inner chamber wind inlet channel the 119, first fan the 108, first air intake tuyere the 117, first air-out tuyere 118 and inner chamber air outlet 101；Described second heat-exchange system 121 includes the second working surface of semiconductor chilling plate 106, the second fin the 110, second fan 112 exocoel air inlet 113 and exocoel air outlet 114.
It is concrete it may be that described inner chamber air outlet 101 is positioned at described shell 100 leading flank；Described exocoel air outlet 114 is positioned at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet 102 is positioned at described shell 100 end face, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet 113 is positioned at described shell 100 end face, bottom surface, trailing flank, left surface or right flank.
As specific embodiment, described inner chamber air inlet 102, described inner chamber air outlet 101, described exocoel air inlet 113 and described exocoel air outlet 114 can be provided with wind-guiding grid 103.
Embodiment described above is only the preferred embodiment lifted for absolutely proving the present invention, and protection scope of the present invention is not limited to this.Equivalent replacement that those skilled in the art make on basis of the present invention or conversion, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.
Claims (10)
1. the side installation method of a semiconductor refrigerating module, this semiconductor refrigerating module (150) is mainly made up of the first heat-exchange system (120), the second heat-exchange system (121), semiconductor chilling plate (106) and shell (100), described shell (100) surrounds cavity (107), and described semiconductor chilling plate (106) includes the first working surface and the second working surface；Described cavity (107) is divided into inner chamber (116) and exocoel；Described semiconductor chilling plate (106) is restricted to described inner chamber (116), or be restricted to described exocoel, or the first working surface of described semiconductor chilling plate (106) and the second working surface are limited to described inner chamber (116) and described exocoel respectively；Described first heat-exchange system (120) includes the first working surface and first fin (109) of described semiconductor chilling plate (106)；Described second heat-exchange system (121) includes the second working surface and second fin (110) of described semiconductor chilling plate (106)；Described first fin (109) is restricted to inner chamber (116), and described second fin (110) is restricted to exocoel；Described shell (100) is provided with inner chamber air outlet (101), inner chamber air inlet (102), exocoel air outlet (114) and exocoel air inlet (113), it is characterized in that, described method includes, and described shell (100) is integrated into the step on smoke exhaust ventilator flue collector shell (310).
2. side installation method described in claim 1, it is characterized in that, described it is integrated on smoke exhaust ventilator flue collector shell (310) by described shell (100) to refer to, shell (100) is integrated into the upper dead ahead of smoke exhaust ventilator flue collector shell (310).
3. side installation method described in claim 1, it is characterized in that, described it is integrated on smoke exhaust ventilator flue collector shell (310) by shell (100) to refer to, shell (100) is adhered to flue collector shell (310), or uses loose collar that semiconductor refrigerating module (150) is fixed on flue collector shell (310).
4. side installation method described in claim 1, it is characterised in that the distance between described shell (100) and the horizontal shell of described smoke exhaust ventilator (313) is n, wherein, n is more than zero.
5. side installation method described in claim 1, it is characterized in that, described semiconductor chilling plate (106) is restricted to inner chamber (116), and described first heat-exchange system (120) includes the first working surface of semiconductor chilling plate (106), the first fin (109), inner chamber air inlet (102), inner chamber wind inlet channel (119), the first fan (108), the first air intake tuyere (117), the first air-out tuyere (118) and inner chamber air outlet (101)；Described second heat-exchange system (121) includes the second working surface of semiconductor chilling plate (106), heat pipe (111), the second fin (110), the second fan (112), exocoel air inlet (113) and exocoel air outlet (114).
6. side installation method described in claim 5, it is characterised in that described inner chamber air outlet (101) is positioned at described shell (100) leading flank；Described exocoel air outlet (114) is positioned at described shell (100) end face, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet (102) is positioned at described shell (100) end face, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet (113) is positioned at described shell (100) end face, bottom surface, trailing flank, left surface or right flank.
7. side installation method described in claim 1, it is characterized in that, described semiconductor chilling plate (106) is restricted to exocoel, and described first heat-exchange system (120) includes the first working surface of semiconductor chilling plate (106), heat pipe (111), the first fin (109), inner chamber air inlet (102), inner chamber wind inlet channel (119), the first fan (108), the first air intake tuyere (117), the first air-out tuyere (118) and inner chamber air outlet (101)；Described second heat-exchange system (121) includes the second working surface of semiconductor chilling plate (106), the second fin (110), the second fan (112), exocoel air inlet (113) and exocoel air outlet (114).
8. side installation method described in claim 7, it is characterised in that described exocoel air outlet (114) is positioned at described shell (100) leading flank；Described inner chamber air outlet (101) is positioned at described shell (100) end face, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet (113) is positioned at described shell (100) end face, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet (102) is positioned at described shell (100) end face, bottom surface, trailing flank, left surface or right flank.
9. side installation method described in claim 1, it is characterised in that the first working surface of described semiconductor chilling plate (106) and the second working surface are limited to described inner chamber (116) and described exocoel respectively；Described first heat-exchange system (120) includes the first working surface of semiconductor chilling plate (106), the first fin (109), inner chamber air inlet (102), inner chamber wind inlet channel (119), the first fan (108), the first air intake tuyere (117), the first air-out tuyere (118) and inner chamber air outlet (101)；Described second heat-exchange system (121) includes the second working surface of semiconductor chilling plate (106), the second fin (110), the second fan (112), exocoel air inlet (113) and exocoel air outlet (114).
10. side installation method described in claim 9, it is characterised in that described inner chamber air outlet (101) is positioned at described shell (100) leading flank；Described exocoel air outlet (114) is positioned at described shell (100) end face, bottom surface, trailing flank, left surface or right flank；Described inner chamber air inlet (102) is positioned at described shell (100) end face, bottom surface, trailing flank, left surface or right flank；Described exocoel air inlet (113) is positioned at described shell (100) end face, bottom surface, trailing flank, left surface or right flank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410853695.8A CN105805980A (en) | 2014-12-31 | 2014-12-31 | Side mounting method of semiconductor refrigeration module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410853695.8A CN105805980A (en) | 2014-12-31 | 2014-12-31 | Side mounting method of semiconductor refrigeration module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105805980A true CN105805980A (en) | 2016-07-27 |
Family
ID=56420917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410853695.8A Pending CN105805980A (en) | 2014-12-31 | 2014-12-31 | Side mounting method of semiconductor refrigeration module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105805980A (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656344A (en) * | 2002-05-21 | 2005-08-17 | Bsh博施及西门子家用器具有限公司 | Vapor extraction apparatus having an extended range of functions |
| KR100570715B1 (en) * | 2005-03-30 | 2006-04-24 | (주)아이에스서플라이 | Cabinet cooling system |
| CN101737885A (en) * | 2009-11-04 | 2010-06-16 | 合肥博普高新科技有限公司 | Energy-saving and environment-friendly small air conditioner |
| KR20130005602A (en) * | 2011-07-07 | 2013-01-16 | (주)퓨리셈 | Heat-exchanger unit |
| CN103206805A (en) * | 2013-04-12 | 2013-07-17 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| KR101323876B1 (en) * | 2013-06-19 | 2013-10-30 | 주식회사 아맥스 | Cooling packaging and refrigerator having the same |
| CN103591730A (en) * | 2013-12-02 | 2014-02-19 | 广东富信科技股份有限公司 | Integrated semiconductor refrigeration system |
| CN103838334A (en) * | 2014-01-17 | 2014-06-04 | 东华理工大学 | Heat dissipation base of notebook computer |
| CN203744338U (en) * | 2014-02-26 | 2014-07-30 | 海尔集团公司 | Air supply module of range hood and range hood |
| CN203744339U (en) * | 2014-03-05 | 2014-07-30 | 海尔集团公司 | Range hood |
| CN203869124U (en) * | 2014-05-15 | 2014-10-08 | 海尔集团技术研发中心 | Air supply module for range hood, and range hood |
| CN204006211U (en) * | 2014-06-30 | 2014-12-10 | 青岛海尔洗碗机有限公司 | A kind of lampblack absorber with refrigerating function |
| CN204006454U (en) * | 2014-07-15 | 2014-12-10 | 青岛海尔智能技术研发有限公司 | Portable air-conditioning |
| KR20140145676A (en) * | 2013-06-13 | 2014-12-24 | 금오공과대학교 산학협력단 | The Air Conditioner using Themoelectric Modules and PCM |
| KR101472959B1 (en) * | 2013-11-28 | 2014-12-24 | 주식회사 바이온텍 | Fluid cooling device having a thermoelectric element for purifier |
-
2014
- 2014-12-31 CN CN201410853695.8A patent/CN105805980A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656344A (en) * | 2002-05-21 | 2005-08-17 | Bsh博施及西门子家用器具有限公司 | Vapor extraction apparatus having an extended range of functions |
| KR100570715B1 (en) * | 2005-03-30 | 2006-04-24 | (주)아이에스서플라이 | Cabinet cooling system |
| CN101737885A (en) * | 2009-11-04 | 2010-06-16 | 合肥博普高新科技有限公司 | Energy-saving and environment-friendly small air conditioner |
| KR20130005602A (en) * | 2011-07-07 | 2013-01-16 | (주)퓨리셈 | Heat-exchanger unit |
| CN103206805A (en) * | 2013-04-12 | 2013-07-17 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| KR20140145676A (en) * | 2013-06-13 | 2014-12-24 | 금오공과대학교 산학협력단 | The Air Conditioner using Themoelectric Modules and PCM |
| KR101323876B1 (en) * | 2013-06-19 | 2013-10-30 | 주식회사 아맥스 | Cooling packaging and refrigerator having the same |
| KR101472959B1 (en) * | 2013-11-28 | 2014-12-24 | 주식회사 바이온텍 | Fluid cooling device having a thermoelectric element for purifier |
| CN103591730A (en) * | 2013-12-02 | 2014-02-19 | 广东富信科技股份有限公司 | Integrated semiconductor refrigeration system |
| CN103838334A (en) * | 2014-01-17 | 2014-06-04 | 东华理工大学 | Heat dissipation base of notebook computer |
| CN203744338U (en) * | 2014-02-26 | 2014-07-30 | 海尔集团公司 | Air supply module of range hood and range hood |
| CN203744339U (en) * | 2014-03-05 | 2014-07-30 | 海尔集团公司 | Range hood |
| CN203869124U (en) * | 2014-05-15 | 2014-10-08 | 海尔集团技术研发中心 | Air supply module for range hood, and range hood |
| CN204006211U (en) * | 2014-06-30 | 2014-12-10 | 青岛海尔洗碗机有限公司 | A kind of lampblack absorber with refrigerating function |
| CN204006454U (en) * | 2014-07-15 | 2014-12-10 | 青岛海尔智能技术研发有限公司 | Portable air-conditioning |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203744338U (en) | Air supply module of range hood and range hood | |
| CN204006211U (en) | A kind of lampblack absorber with refrigerating function | |
| CN204141659U (en) | Smoke exhaust ventilator external alternating temperature module and smoke exhaust ventilator | |
| CN204693673U (en) | Semiconductor refrigerating module and smoke exhaust ventilator | |
| CN204141662U (en) | Smoke exhaust ventilator external alternating temperature module and smoke exhaust ventilator | |
| CN105805798A (en) | Bottom mounting method of semiconductor refrigeration module | |
| CN204460539U (en) | Semiconductor refrigerating module and smoke exhaust ventilator | |
| CN204693887U (en) | Semiconductor refrigerating module and smoke exhaust ventilator | |
| CN105805861A (en) | Cold and hot air isolation mode of semiconductor refrigeration module | |
| CN204693674U (en) | Air regulator and use the smoke exhaust ventilator of this air regulator | |
| CN105805979A (en) | Cold and hot air isolation mode of semiconductor refrigeration module | |
| CN105805980A (en) | Side mounting method of semiconductor refrigeration module | |
| CN105805797A (en) | Bottom mounting method for semiconductor refrigeration module | |
| CN105805862A (en) | Production method of semiconductor refrigeration module | |
| CN105805859A (en) | Semiconductor refrigeration module and range hood | |
| CN109960375A (en) | One kind being used for host computer base support means | |
| CN105805865A (en) | Side surface mounting method of semiconductor refrigerating module | |
| CN105805863A (en) | Preparation method of semiconductor refrigerating module | |
| CN105805860A (en) | Semiconductor refrigeration module and range hood | |
| CN105987465A (en) | Preparation method of semiconductor refrigeration module | |
| CN105987415A (en) | Bottom mounting method of semiconductor refrigeration module | |
| CN105987463A (en) | Lateral mounting method of semiconductor refrigeration module | |
| CN105987533A (en) | Semiconductor refrigeration module and range hood | |
| CN2909143Y (en) | Compound radiator | |
| CN105987466A (en) | Cold and hot air separation method of semiconductor refrigeration module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160727 |
|
| RJ01 | Rejection of invention patent application after publication |