CN105987465B

CN105987465B - Preparation method of semiconductor refrigeration module

Info

Publication number: CN105987465B
Application number: CN201510059971.8A
Authority: CN
Inventors: 高希成; 孙珺超; 裴玉哲
Original assignee: Qingdao Haier Smart Technology R&D Co Ltd
Current assignee: Qingdao Haier Smart Technology R&D Co Ltd
Priority date: 2015-02-05
Filing date: 2015-02-05
Publication date: 2020-06-02
Anticipated expiration: 2035-02-05
Also published as: CN105987465A

Abstract

The invention discloses a preparation method of a semiconductor refrigeration module, which mainly comprises a first heat exchange system, a second heat exchange system, semiconductor refrigeration sheets and a shell, wherein the shell is surrounded to form a hollow cavity, each semiconductor refrigeration sheet comprises a first working surface and a second working surface, the first heat exchange system comprises the first working surface and a first fin of each semiconductor refrigeration sheet, the second heat exchange system comprises the second working surface and a second fin of each semiconductor refrigeration sheet, the method comprises the steps of dividing the hollow cavity into at least two cavities by using at least one partition plate which is longitudinally arranged, and arranging the first heat exchange systems in the partial cavities; and dividing the chamber provided with the first heat exchange system into an inner chamber and an outer chamber, and limiting the first working surface and the first fins of the semiconductor refrigeration sheet to the inner chamber. The invention improves the energy utilization efficiency by physically isolating the two heat exchange systems.

Description

Preparation method of semiconductor refrigeration module

Technical Field

The invention relates to a preparation method of a semiconductor refrigeration module.

Background

Cooking at the kitchen range is a hard household work, and particularly in summer, the working environment in a kitchen is very harsh due to the heat generated by the kitchen range and the original hot weather.

In order to solve the problem of overhigh temperature of a kitchen, a fan or an air conditioner is installed in the kitchen, however, the fan has a general blowing refrigeration effect, normal work of the gas stove can be influenced, and potential safety hazards also exist. Due to the special oil fume environment of a kitchen, after a common fan is used for a period of time, a large amount of putty is attached to the fan, the fan is difficult to clean, and the environment of the kitchen is also polluted.

When the air conditioning equipment is installed in a kitchen, on one hand, the cost problem exists, on the other hand, the problem that the cleaning is difficult also exists, and after oil smoke is attached to the surface of an air conditioning heat exchanger, the refrigerating effect is reduced.

Disclosure of Invention

In order to solve the problems of high cost, difficult cleaning, low temperature regulation effect and the like of using an air conditioner in a kitchen in the prior art, the invention provides a preparation method of a semiconductor refrigeration module, and the semiconductor refrigeration module prepared by the preparation method is installed and applied to a range hood.

As an aspect of the present invention, a method for manufacturing a semiconductor refrigeration module is provided, where the semiconductor refrigeration module is mainly composed of a first heat exchange system, a second heat exchange system, semiconductor refrigeration sheets and a housing, the housing encloses a hollow cavity, the semiconductor refrigeration sheets include a first working surface and a second working surface, the first heat exchange system includes the first working surface and first fins of the semiconductor refrigeration sheets, the second heat exchange system includes the second working surface and second fins of the semiconductor refrigeration sheets, the method includes dividing the hollow cavity into at least two cavities by at least one partition plate longitudinally disposed, and a first heat exchange system is disposed in some of the cavities; and dividing the chamber provided with the first heat exchange system into an inner chamber and an outer chamber, and limiting the first working surface and the first fins of the semiconductor refrigeration sheet to the inner chamber.

The method may further comprise the step of confining a second working surface of the semiconductor chilling plate to the inner chamber or the outer chamber.

The method may further include the step of confining the first fin and the second fin within different chambers.

As one embodiment, each chamber is limited with a first fin or a second fin, and the shell is correspondingly provided with an air outlet and an air inlet.

In one embodiment, the method may include dividing the hollow cavity into two chambers, one of which is divided into an inner chamber and an outer chamber, with a longitudinally disposed baffle.

As one specific embodiment, the method may include confining the semiconductor chilling plate to the inner cavity; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; constraining the first fin to the inner cavity; confining the second fin within another chamber; and each chamber is correspondingly provided with an air outlet and an air inlet.

Specifically, the method may further include forming the first heat exchange system by the first working surface of the semiconductor chilling plate, the first fin, the first air inlet nozzle, the first air outlet nozzle, the first air inlet duct, the first air inlet, the first fan, and the first air outlet; and forming the second heat exchange system by the second working surface of the semiconductor refrigerating sheet, the heat pipe, the second fin, the second fan, the second air inlet and the second air outlet.

Specifically, the method may further include disposing the first air outlet on a front side of the housing; arranging the second air outlet on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell; arranging the first air inlet on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell; and arranging the second air inlet on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell.

Specifically, the method can further comprise the step of supplementing a first heat conduction substrate on the first working surface of the semiconductor chilling plate, so that the first fin is in thermal contact with the first heat conduction substrate. And a second heat-conducting substrate is arranged on the second working surface of the semiconductor chilling plate, so that the second fin is in thermal contact with the second heat-conducting substrate.

Specifically, the method may further include providing a support body in the inner cavity, and providing a receiving groove on a top surface of the support body, so that the second working surface of the semiconductor chilling plate is received in the receiving groove. The method may further include providing a heat pipe hole in the support body such that the heat pipe penetrates through the heat pipe hole.

As one specific embodiment, the method may include confining first and second working surfaces of the semiconductor chilling plate to the inner and outer chambers, respectively; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; constraining the first fin to the inner cavity; confining the second fin within another chamber; and each chamber is provided with an air outlet and an air inlet correspondingly on the shell.

Specifically, the method can further comprise the step of arranging a support body on the outer cavity, wherein a containing groove is arranged on the top surface of the support body, so that the second working surface of the semiconductor refrigeration piece is contained in the containing groove. The method may further include providing a heat pipe hole in the support body such that the heat pipe penetrates through the heat pipe hole.

As one specific embodiment, the method may include dividing the hollow cavity into at least three chambers and dividing a portion of the chambers into an inner chamber and an outer chamber with at least two partition plates arranged in a longitudinal direction. Specifically, the hollow cavity may be divided into three chambers by two partition plates arranged longitudinally, and the middle chamber may be divided into an inner chamber and an outer chamber.

As one specific embodiment, the method may include confining the semiconductor chilling plate to an inner cavity of an intermediate chamber; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; confining the first fin to an inner cavity of an intermediate chamber; the second fins comprise two groups of fins which are respectively limited in the cavities at two sides; and each chamber is provided with an air outlet and an air inlet correspondingly on the shell.

Specifically, the method may further include providing a support body in the inner cavity of the intermediate chamber, and providing a receiving groove on a top surface of the support body, so that the second working surface of the semiconductor chilling plate is received in the receiving groove. The method may further include providing a heat pipe hole in the support body such that the heat pipe penetrates through the heat pipe hole.

As one specific embodiment, the method may include confining first and second working surfaces of the semiconductor chilling plate to inner and outer chambers of an intermediate chamber, respectively; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; constraining the first fin to an inner cavity; the second fins comprise two groups of fins which are respectively limited in the cavities at the two sides; and each chamber is provided with an air outlet and an air inlet correspondingly on the shell.

Specifically, the method can further comprise the step of arranging a support body on the outer cavity of the middle chamber, wherein the top surface of the support body is provided with a containing groove, so that the second working surface of the semiconductor chilling plate is contained in the containing groove. The method may further include providing a heat pipe hole in the support body such that the heat pipe penetrates through the heat pipe hole.

As a specific implementation manner, the method may further include arranging a wind guide grid at the first wind outlet. Preferably, the air inlet and the air outlet are both provided with air guide grids.

As one specific implementation mode, the method may further include assisting a heat-conducting silicone grease between the first working surface of the semiconductor chilling plate and the first heat-conducting substrate, and assisting a heat-conducting silicone grease between the second working surface of the semiconductor chilling plate and the second heat-conducting substrate.

As another aspect of the present invention, the present invention relates to a semiconductor refrigeration module, which mainly comprises a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a housing, wherein the housing encloses a hollow cavity, and the semiconductor refrigeration sheet comprises a first working surface and a second working surface; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface for refrigerating the semiconductor and a second fin; the hollow cavity is divided into at least two chambers by at least one partition plate which is longitudinally arranged, and a first heat exchange system is arranged in part of the chambers; the chamber provided with the first heat exchange system is divided into an inner chamber and an outer chamber, the first working surfaces and the first fins of the semiconductor chilling plates being confined to the inner chamber.

In particular, the second working surface of the semiconductor chilling plate is confined to the inner chamber or the outer chamber; the first fin and the second fin are confined to different chambers; and each chamber is limited with a first fin or a second fin, and the shell is correspondingly provided with an air outlet and an air inlet.

In one embodiment, the hollow cavity is divided into two chambers by a partition plate arranged longitudinally, wherein one chamber is divided into an inner chamber and an outer chamber.

As one specific embodiment, the semiconductor chilling plate is limited to the inner cavity; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the first fin is confined to the inner cavity; the second fin is confined within another chamber; and each chamber is correspondingly provided with an air outlet and an air inlet.

As one specific embodiment, the first working surface and the second working surface of the semiconductor chilling plate are respectively limited to the inner cavity and the outer cavity; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the first fin is confined to the inner cavity; the second fin is confined within another chamber; and each chamber is correspondingly provided with an air outlet and an air inlet.

In one embodiment, the hollow cavity is divided into at least three chambers by at least two partition plates arranged longitudinally, and part of the chambers are divided into an inner chamber and an outer chamber. Specifically, the hollow cavity may be divided into three chambers by two partition plates arranged longitudinally, and the middle chamber may be divided into an inner chamber and an outer chamber.

As one specific embodiment, the semiconductor chilling plate is limited in the inner cavity of the middle chamber; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the first fin is confined to the inner cavity of the intermediate chamber; the second fins comprise two groups of fins which are respectively limited in the cavities at two sides; and each chamber is correspondingly provided with an air outlet and an air inlet.

As one specific embodiment, the first working surface and the second working surface of the semiconductor chilling plate are respectively limited to the inner cavity and the outer cavity of the middle cavity; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the first fin is confined to the inner cavity; the second fins comprise two groups of fins which are respectively limited in the cavities at the two sides; and each chamber is correspondingly provided with an air outlet and an air inlet.

As a third aspect of the present invention, there is provided a hood including the aforementioned semiconductor refrigeration module.

As a fourth aspect of the present invention, a bottom mounting method for a semiconductor refrigeration module is provided, the semiconductor refrigeration module mainly includes a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a housing, the housing encloses a hollow cavity, and the semiconductor refrigeration sheet includes a first working surface and a second working surface; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the hollow cavity is divided into at least two chambers by at least one partition plate which is longitudinally arranged, and a first heat exchange system is arranged in part of the chambers; the chamber provided with the first heat exchange system is divided into an inner chamber and an outer chamber, the first working surfaces of the semiconductor chilling plates and the first fins being confined to the inner chamber, the method comprising the step of integrating the housing onto a horizontal housing of a range hood.

Specifically, the integration of the housing on the horizontal housing of the range hood means that the housing is integrated right in front of the horizontal housing of the range hood.

Specifically, the integration of the housing into the horizontal housing of the range hood means that an insert is provided between the housing and the horizontal housing of the range hood, and the housing and the horizontal housing of the range hood are respectively fixed to the upper and lower sides of the insert, so that a certain gap is left between the housing and the horizontal housing of the range hood. The insert may be a U-shaped bracket.

Specifically, integrating the shell on the horizontal shell of the range hood means that support rods are arranged on two side walls of the shell of the semiconductor refrigeration module, and the lower ends of the support rods are fixed on the shell of the range hood, so that a certain gap is reserved between the shell of the semiconductor refrigeration module and the horizontal shell of the range hood.

As a fifth aspect of the present invention, a side mounting method of a semiconductor refrigeration module is provided, the semiconductor refrigeration module mainly includes a first heat exchange system, a second heat exchange system, a semiconductor refrigeration sheet and a housing, the housing encloses a hollow cavity, and the semiconductor refrigeration sheet includes a first working surface and a second working surface; the first heat exchange system comprises a first working surface and a first fin of the semiconductor refrigeration sheet; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the hollow cavity is divided into at least two chambers by at least one partition plate which is longitudinally arranged, and a first heat exchange system is arranged in part of the chambers; the chamber provided with the first heat exchange system is divided into an inner chamber and an outer chamber, the first working surfaces and the first fins of the semiconductor chilling plates being confined to the inner chamber, the method comprising the step of integrating the housing onto a range hood main flue housing.

Specifically, the integration of the housing into the range hood main flue housing means that the housing is integrated into the range hood main flue housing directly in front of the range hood main flue housing.

Specifically, the integration of the housing into the main flue housing of the range hood means that the housing is adhered to the main flue housing or that the semiconductor refrigeration module is secured to the main flue housing using a tension ring.

Preferably, the distance between the housing and the horizontal housing of the range hood is n, wherein n is greater than zero.

As a sixth aspect of the present invention, the present invention relates to a cold and hot air isolation method for a semiconductor refrigeration module, the semiconductor refrigeration module mainly comprises a first heat exchange system, a second heat exchange system, semiconductor refrigeration sheets and a housing, the housing encloses a hollow cavity, the semiconductor refrigeration sheets include a first working surface and a second working surface, and the first heat exchange system includes a first working surface and a first fin of the semiconductor refrigeration sheets; the second heat exchange system comprises a second working surface of the semiconductor refrigeration sheet and a second fin; the hollow cavity is divided into at least two chambers by at least one partition plate which is longitudinally arranged, and a first heat exchange system is arranged in a part of the chambers; dividing a chamber provided with a first heat exchange system into an inner chamber and an outer chamber, and limiting a first working surface and a first fin of the semiconductor refrigeration sheet to the inner chamber; confining a second working surface of the semiconductor chilling plate to the inner chamber or the outer chamber; and the first fin and the second fin are limited in different cavities, so that cold and hot air separation of the semiconductor refrigeration module is realized.

And each chamber is limited with a first fin or a second fin, and the shell is correspondingly provided with an air outlet and an air inlet.

The embodiment of the invention at least realizes the following beneficial effects:

1. the semiconductor refrigeration module prepared by the semiconductor refrigeration module preparation method provided by the invention has the advantages of simple and compact structural design, simple manufacture and low cost;

2. the module shell of the semiconductor refrigeration module prepared by the preparation method is arranged on the horizontal shell of the smoke exhaust ventilator shell or the main flue shell, and does not occupy the volume of the inner cavity of the smoke exhaust ventilator shell, so that the internal structure of the smoke exhaust ventilator shell is not influenced.

3. The semiconductor refrigeration module prepared by the preparation method effectively improves the utilization efficiency of energy by physically isolating the two heat exchange systems.

Drawings

Fig. 1 is a schematic top view of a semiconductor refrigeration module according to an embodiment of the present invention;

FIG. 2 is a right side view of a semiconductor refrigeration module according to one embodiment of the present invention;

FIG. 3 is a front view of the internal structure of a semiconductor refrigeration module according to one embodiment of the present invention;

FIG. 4 is a three-dimensional schematic view of a semiconductor refrigeration module housing according to one embodiment of the present invention;

fig. 5 is a schematic top view of a semiconductor refrigeration module according to a second embodiment of the present invention;

fig. 6 is a right side view of a semiconductor refrigeration module according to a second embodiment of the present invention;

fig. 7 is a front view of the internal structure of a semiconductor refrigeration module according to a second embodiment of the present invention;

fig. 8 is a three-dimensional schematic view of a semiconductor refrigeration module housing according to a second embodiment of the present invention;

fig. 9 is a schematic top view of a semiconductor refrigeration module according to a third embodiment of the present invention;

fig. 10 is a right side view of a semiconductor refrigeration module according to a third embodiment of the present invention;

fig. 11 is a front view of the internal structure of a semiconductor refrigeration module according to a third embodiment of the present invention;

fig. 12 is a three-dimensional schematic view of a semiconductor refrigeration module housing according to a third embodiment of the present invention;

FIG. 13 is a schematic top view of a semiconductor refrigeration module according to a fourth embodiment of the present invention;

FIG. 14 is a right side view of a semiconductor refrigeration module according to a fourth embodiment of the present invention;

FIG. 15 is a front view of the internal structure of a semiconductor refrigeration module according to a fourth embodiment of the present invention;

fig. 16 is a three-dimensional schematic view of a semiconductor refrigeration module housing according to a fourth embodiment of the present invention;

FIG. 17 is a perspective view of the semiconductor refrigeration module of the present invention mounted to a horizontal housing of a range hood;

fig. 18 is a perspective view of the present invention with a semiconductor refrigeration module mounted to the main flue housing of a range hood.

Detailed Description

The present invention is further described with reference to the following drawings and specific examples so that those skilled in the art can better understand the present invention and can practice the present invention, but the examples are not intended to limit the present invention.

The embodiment of the invention provides a semiconductor refrigeration module and a range hood externally integrated with the refrigeration module. And the semiconductor refrigeration module is based on the semiconductor refrigeration piece, is matched with the fin for heat exchange, and blows out cold or heat generated by electrifying the semiconductor refrigeration piece through the fan. Can generate a local cold environment or hot environment for users, and meets the requirement of comfort of people. The semiconductor refrigerating sheet is provided with two working surfaces, the upper end is a first working surface, the lower end is a second working surface, and when the first working surface is a hot end, the second working surface is a cold end; when the first working surface is a cold end, the second working surface is a hot end. The semiconductor refrigeration module can be integrated with the exterior of the range hood, can be integrated at the upper end of the horizontal part of the range hood housing or can be integrated on the front surface of the main flue housing of the range hood. The refrigeration module can work independently and also can be intelligently linked with the range hood.

The semiconductor refrigeration module provided by the invention has the outstanding characteristics that the first heat exchange system and the second heat exchange system realize partial or even complete physical isolation, the bidirectional flow of heat energy and cold energy generated by the semiconductor refrigeration sheet can be effectively prevented, the utilization efficiency of energy is improved, and the electric energy consumption is reduced.

In one embodiment, the cooling module has two modes, a cooling mode and a warming mode: when the cooling mode is pressed, the upper end of the semiconductor refrigerating sheet is a cold end, the lower end of the semiconductor refrigerating sheet is a hot end, and an air outlet in front of the module is used for discharging cold air; when the warm mode is pressed, the upper end of the semiconductor refrigerating sheet is a hot end, the lower end of the semiconductor refrigerating sheet is a cold end, and hot air is discharged from an air outlet right in front of the module. The cooling mode will be described below as an example.

The invention provides a semiconductor refrigeration module which mainly comprises a first heat exchange system 120, a second heat exchange system 121, semiconductor refrigeration pieces 106 and a shell 100, wherein the shell 100 encloses a hollow cavity 107, and the semiconductor refrigeration pieces 106 comprise a first working surface and a second working surface; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the hollow cavity 107 is divided into at least two chambers by at least one partition plate 122 arranged longitudinally, and the first heat exchange system 120 is arranged in a part of the chambers; the chamber in which the first heat exchange system 120 is disposed is divided into an inner chamber 116 and an outer chamber, and the first working surface of the semiconductor chilling plate 106 and the first fins 109 are confined to the inner chamber 116.

Specifically, the second working surface of the semiconductor cooling plate 106 is confined to the inner cavity 116 or the outer cavity; the first fins 109 and the second fins 110 are confined to different chambers; each chamber is limited by a first fin 109 or a second fin 110, and an air outlet and an air inlet are correspondingly arranged on the shell 100.

Referring to fig. 1-4 as example 1, the hollow chamber 107 is divided into two chambers by a partition 122 disposed longitudinally, wherein one chamber is divided into an inner chamber 116 and an outer chamber. The semiconductor cooling fins 106 are confined to the inner cavity 116; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fin 109 is confined to the inner cavity 116; the second fin 110 is confined within another chamber; each chamber is provided with an air outlet and an air inlet corresponding to the housing 100.

Specifically, the first heat exchanging system 120 may include a first working surface of the semiconductor cooling fins 106, first fins 109, a first air inlet nozzle 117, a first air outlet nozzle 118, a first air inlet duct 119, a first air inlet 102, a first fan 108, and a first air outlet 101; the second heat exchanging system 121 includes a second working surface of the semiconductor chilling plate 106, a second fin 110, a heat pipe 111, a second fan 112, a second air inlet 113 and a second air outlet 114.

More specifically, the first air outlet 101 may be disposed at a front side of the housing 100; the second air outlet 114 is disposed on the top, bottom, rear, left side, or right side of the housing 100; the first air inlet 102 is disposed on a top surface, a bottom surface, a rear side surface, a left side surface or a right side surface of the housing 100; the second air inlet 113 is disposed on a top surface, a bottom surface, a rear side surface, a left side surface, or a right side surface of the housing 100.

In particular, the first working surface of the semiconductor chilling plate 106 may be supplemented by a first heat conducting substrate 104, the first fins 109 being in thermal contact with the first heat conducting substrate 104. The second working surface of the semiconductor chilling plate 106 may be supplemented with a second heat conducting substrate 105, and the second fin 110 is in thermal contact with the second heat conducting substrate 105 through a heat pipe.

In particular, the inner cavity 116 may be provided with a support body 115, the top surface of the support body 115 being provided with a receiving groove in which the second working surface of the semiconductor chilling plate 106 is received. The support 115 may be a poor thermal conductor, and the support 115 may be provided with a heat pipe hole through which the heat pipe 111 passes.

As example 2, referring to fig. 5-8, the hollow chamber 107 is divided into two chambers by a partition 122 disposed longitudinally, wherein one chamber is divided into an inner chamber 116 and an outer chamber. The first and second working surfaces of the semiconductor cooling plate 106 are confined to the inner cavity 116 and the outer cavity, respectively; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fin 109 is confined to the inner cavity 116; the second fin 110 is confined within another chamber; each chamber is provided with an air outlet and an air inlet corresponding to the housing 100.

Specifically, the first heat exchanging system 120 may include a first working surface of the semiconductor cooling fins 106, first fins 109, a first air inlet nozzle 117, a first air outlet nozzle 118, a first air inlet duct 119, a first air inlet 102, a first fan 108, and a first air outlet 101; the second heat exchanging system 121 includes a second working surface of the semiconductor cooling fins 106, a heat pipe 111, a second fin 110, a second fan 112, a second air inlet 113, and a second air outlet 114.

Specifically, the outer chamber may be provided with a support body 115, the top surface of the support body 115 being provided with a receiving groove in which the second working surface of the semiconductor chilling plate 106 is received. The support 115 may be a poor thermal conductor, and the support 115 may be provided with a heat pipe hole through which the heat pipe 111 passes.

As example 3, referring to fig. 9 to 12, the hollow chamber 107 is divided into at least three chambers by at least two partition plates 122 arranged longitudinally, and a part of the chambers are divided into an inner chamber 116 and an outer chamber. Specifically, the hollow chamber 107 may be divided into three chambers by two partition plates 122 disposed longitudinally, and the middle chamber may be divided into an inner chamber 116 and an outer chamber. The semiconductor chilling plate 106 is confined to the inner cavity 116 of the intermediate chamber; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fin 109 is confined to the inner cavity 116 of the intermediate chamber; the second fins 110 comprise two groups of fins which are respectively limited in the cavities at two sides; each chamber is provided with an air outlet and an air inlet corresponding to the housing 100.

In particular, the first working surface of the semiconductor chilling plate 106 may be supplemented by a first heat conducting substrate 104, the first fins 109 being in thermal contact with the first heat conducting substrate 104; the second working surface of the semiconductor chilling plate 106 may be supplemented with a second heat conducting substrate 105, and the second fin 110 is in thermal contact with the second heat conducting substrate 105 through a heat pipe.

In particular, the inner cavity 116 of the intermediate chamber may also be provided with a support body 115, the top surface of the support body 115 being provided with a housing groove in which the second working surface of the semiconductor chilling plate 106 is housed. The support 115 may be a poor thermal conductor, and the support 115 may be provided with a heat pipe hole through which the heat pipe 111 passes.

As example 4, referring to fig. 13 to 16, the hollow chamber 107 is divided into at least three chambers by at least two partition plates 122 arranged longitudinally, and a part of the chambers are divided into an inner chamber 116 and an outer chamber. Specifically, the hollow chamber 107 may be divided into three chambers by two partition plates 122 disposed longitudinally, and the middle chamber may be divided into an inner chamber 116 and an outer chamber. The first and second working surfaces of the semiconductor cooling plate 106 are confined to the inner and outer chambers 116, respectively, of the intermediate chamber; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fin 109 is confined to the inner cavity 116; the second fins 110 comprise two groups of fins which are respectively limited in the two side chambers; each chamber is provided with an air outlet and an air inlet corresponding to the housing 100.

Specifically, the outer chamber of the middle chamber may further include a supporting body 115, the supporting body 115 may have a receiving groove on a top surface thereof, and the second working surface of the semiconductor chilling plate 106 may be received in the receiving groove. The support 115 may be a poor thermal conductor, and the support 115 may be provided with a heat pipe hole through which the heat pipe 111 passes.

In the semiconductor refrigeration module shown in embodiments 1 to 4, the first air outlet 101 may be provided with an air guiding grid 103. Preferably, the air inlet and the air outlet may be both provided with air guiding grids 103.

In the semiconductor refrigeration module shown in embodiments 1 to 4, a heat-conducting silicone grease 200 may be added between the first working surface of the semiconductor refrigeration sheet 106 and the first heat-conducting substrate 104; and a heat-conducting silicone grease 201 can be additionally arranged between the second working surface of the semiconductor chilling plate 106 and the second heat-conducting substrate 105.

The invention also provides a range hood which comprises the semiconductor refrigeration module.

As embodiment 5, a method for manufacturing a semiconductor refrigeration module according to embodiments 1 to 4 is described, where the semiconductor refrigeration module is mainly composed of a first heat exchange system 120, a second heat exchange system 121, semiconductor refrigeration sheets 106 and a housing 100, the housing 100 encloses a hollow cavity 107, the semiconductor refrigeration sheets 106 include a first working surface and a second working surface, the first heat exchange system 120 includes the first working surface and first fins 109 of the semiconductor refrigeration sheets 106, and the second heat exchange system 121 includes the second working surface and second fins 110 of the semiconductor refrigeration sheets 106, the method includes dividing the hollow cavity 107 into at least two chambers by at least one partition plate 122 disposed in a longitudinal direction, and the first heat exchange system 120 is disposed in some of the chambers; the step of dividing the chamber provided with the first heat exchange system 120 into an inner chamber 116 and an outer chamber, and confining the first working surface of the semiconductor chilling plate 106 and the first fins 109 to the inner chamber 116.

The method may further include the step of confining a second working surface of the semiconductor chilling plate 106 to either the inner chamber 116 or the outer chamber.

The method may further comprise the step of confining the first fin 109 and the second fin 110 in different chambers.

As an embodiment, each chamber is limited by a first fin 109 or a second fin 110, and an air outlet and an air inlet are correspondingly formed on the housing 100.

In one embodiment, the method may include dividing the hollow chamber 107 into two chambers, one of which is divided into an inner chamber 116 and an outer chamber, with a longitudinally disposed baffle 122.

As one specific example, the method may include confining the semiconductor chilling plate 106 to the interior cavity 116; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; confining the first fin 109 to the inner cavity 116; confining the second fin 110 within another chamber; each chamber is provided with an air outlet and an air inlet corresponding to the housing 100.

Specifically, the method may further include configuring the first working surface of the semiconductor chilling plate 106, the first fin 109, the first air inlet nozzle 117, the first air outlet nozzle 118, the first air inlet duct 119, the first air inlet 102, the first fan 108, and the first air outlet 101 as the first heat exchange system 120; and the second working surface of the semiconductor chilling plate 106, the heat pipe 111, the second fin 110, the second fan 112, the second air inlet 113 and the second air outlet 114 form the second heat exchange system 121.

Specifically, the method may further include disposing the first air outlet 101 on a front side of the housing 100; the second air outlet 114 is disposed on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100; the first air inlet 102 is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100; and, the second air inlet 113 is disposed on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100.

Specifically, the method may further include providing a first heat conducting substrate 104 on a first working surface of the semiconductor chilling plate 106, such that the first fin 109 is in thermal contact with the first heat conducting substrate 104; a second heat conducting substrate 105 is attached to the second working surface of the semiconductor cooling plate 106, so that the second fin 110 is in thermal contact with the second heat conducting substrate 105 through a heat pipe.

Specifically, the method may further include providing a support body 115 in the inner cavity 116, and providing a receiving groove on a top surface of the support body 115, such that the second working surface of the semiconductor chilling plate 106 is received in the receiving groove. It may further include providing a heat pipe hole in the support body 115 such that the heat pipe 111 penetrates the heat pipe hole.

As one specific example, the method may include confining first and second working surfaces of the semiconductor chilling plate 106 to the inner cavity 116 and the outer cavity, respectively; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; confining the first fin 109 to the inner cavity 116; confining the second fin 110 within another chamber; and each chamber is provided with an air outlet and an air inlet corresponding to the outer shell 100.

Specifically, the method may further include disposing the first air outlet 101 on a front side of the housing 100; the second air outlet 114 is disposed on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100; the first air inlet 102 is arranged on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100; and the second air inlet 113 is disposed on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the housing 100.

Specifically, the method may further include providing a support body 115 in the outer chamber, and providing a receiving groove on a top surface of the support body 115, such that the second working surface of the semiconductor chilling plate 106 is received in the receiving groove. It may further include providing a heat pipe hole in the support body 115 such that the heat pipe 111 penetrates the heat pipe hole.

In one embodiment, the method may include dividing the hollow chamber 107 into at least three chambers and dividing a portion of the chambers into an inner chamber 116 and an outer chamber with at least two partitions 122 disposed in a longitudinal direction. Specifically, the hollow chamber 107 may be divided into three chambers, and the middle chamber may be divided into the inner chamber 116 and the outer chamber by two partition plates 122 arranged in the longitudinal direction.

As one specific example, the method may include confining the semiconductor chilling plate 106 to an inner cavity 116 of an intermediate chamber; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; confining the first fin 109 to the inner cavity 116 of the intermediate chamber; the second fins 110 comprise two groups of fins which are respectively limited in the cavities at two sides; and each chamber is provided with an air outlet and an air inlet corresponding to the outer shell 100.

Specifically, the method may further include providing a support body 115 in the inner cavity 116 of the intermediate chamber, and providing a receiving groove on a top surface of the support body 115 for receiving the second working surface of the semiconductor chilling plate 106 therein. The method may further include providing a heat pipe hole in the support body 115, and inserting the heat pipe 111 through the heat pipe hole.

As one specific example, the method may include confining first and second working surfaces of the semiconductor chilling plate 106 to inner and outer chambers of an intermediate chamber, respectively; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; confining the first fin 109 to the inner cavity 116; the second fins 110 comprise two groups of fins which are respectively limited in the two side chambers; and each chamber is provided with an air outlet and an air inlet corresponding to the outer shell 100.

Specifically, the method may further comprise providing a support 115 in the outer cavity of the intermediate chamber, the support 115 having a receiving groove on a top surface thereof, and receiving the second working surface of the semiconductor chilling plate 106 in the receiving groove. The method may further include providing a heat pipe hole in the support body 115, and inserting the heat pipe 111 through the heat pipe hole.

Specifically, the method may further include providing a wind guiding grid 103 at the first wind outlet 101. Preferably, air guide grids 103 are arranged at the air inlet and the air outlet.

Specifically, the method may further include attaching a thermal grease 200 between the first working surface of the semiconductor chilling plate 106 and the first heat-conducting substrate 104, and attaching a thermal grease 201 between the second working surface of the semiconductor chilling plate 106 and the second heat-conducting substrate 105.

Embodiment 6 relates to a bottom mounting method for a semiconductor refrigeration module, the semiconductor refrigeration module mainly includes a first heat exchange system 120, a second heat exchange system 121, semiconductor refrigeration fins 106, and a housing 100, the housing 100 encloses a hollow cavity 107, and the semiconductor refrigeration fins 106 include a first working surface and a second working surface; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the hollow cavity 107 is divided into at least two chambers by at least one partition plate 122 arranged longitudinally, and a first heat exchange system 120 is arranged in a part of the chambers; the chamber provided with the first heat exchange system 120 is divided into an inner chamber 116 and an outer chamber, the first working surfaces of the semiconductor chilling plates 106 and the first fins 109 being confined to the inner chamber 116, the method including the step of integrating the housing 100 into a horizontal hood housing 313.

Specifically, the integration of the housing 100 into the hood horizontal housing 313 means that the housing 100 is integrated into the hood horizontal housing 313 directly in front.

Specifically, the integration of the housing 100 into the horizontal hood housing 313 means that an insert is provided between the housing 100 and the horizontal hood housing 313, and the housing 100 and the horizontal hood housing 313 are fixed to upper and lower sides of the insert, respectively, such that a certain gap is maintained between the housing 100 and the horizontal hood housing 313. The insert may be a U-shaped bracket 317.

Specifically, the integration of the housing 100 into the horizontal housing 313 of the range hood means that support rods are arranged on two side walls of the semiconductor refrigeration module housing 100, and the lower ends of the support rods are fixed to the housing of the range hood, so that a certain gap is reserved between the semiconductor refrigeration module housing 100 and the horizontal housing 313 of the range hood.

Fig. 17 is a three-dimensional schematic view of the integration of a semiconductor refrigeration module with a horizontal housing of a range hood. It can be seen that the semiconductor refrigeration module can be integrated with the exterior of the range hood, can be integrated into the range hood housing, and is preferably integrated directly in front of the horizontal housing of the range hood.

The hood 151 housing includes a hood horizontal housing 313 and a hood main flue housing 310. The main flue of the range hood is 316. As shown in fig. 17, the semiconductor cooling module 150 is externally integrated with the horizontal housing 313 of the hood 151, but is not limited to be externally integrated directly in front. The control panel 315 of the smoke exhaust ventilator can send an electric control instruction to the semiconductor refrigeration module 150, or the semiconductor refrigeration module is provided with a control panel for automatic control. In one embodiment, the air inlets at the hot and cold ends are designed to be located at the lower end of the semiconductor refrigeration module 150, so that the module housing 100 is spaced from the horizontal housing 313 of the range hood rather than being in close contact with the horizontal housing to keep the air inlets open to the outside air. For example, the lower end of the module is welded or otherwise provided with a U-shaped bracket 317, and the left, the right and the front of the bracket are integrated or segmented, so that the rear section of the bracket is empty and air inlet is ensured. Or, two side walls of the semiconductor refrigeration module casing 100 are provided with support rods, and the lower ends of the support rods are fixed on the smoke exhaust ventilator casing, so that a certain gap is reserved between the semiconductor refrigeration module casing 100 and the smoke exhaust ventilator horizontal casing 313.

Specifically, the semiconductor refrigeration module mounted in this embodiment may be the semiconductor refrigeration module described in any one of embodiments 1 to 4.

Embodiment 7 relates to a side mounting method of a semiconductor refrigeration module, the semiconductor refrigeration module mainly includes a first heat exchange system 120, a second heat exchange system 121, semiconductor refrigeration fins 106, and a housing 100, the housing 100 encloses a hollow cavity 107, and the semiconductor refrigeration fins 106 include a first working surface and a second working surface; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the hollow cavity 107 is divided into at least two chambers by at least one partition plate 122 arranged longitudinally, and a first heat exchange system 120 is arranged in a part of the chambers; the chamber in which the first heat exchange system 120 is disposed is divided into an inner chamber 116 and an outer chamber, the first working surfaces of the semiconductor chilling plates 106 and the first fins 109 being confined to the inner chamber 116, the method including the step of integrating the housing 100 into a range hood main flue housing 310.

Specifically, the integration of the housing 100 into the range hood main flue housing 310 means that the housing 100 is integrated into the range hood main flue housing 310 directly in front.

Specifically, the integration of the housing 100 into the range hood main flue housing 310 means that the housing 100 is adhered to the main flue housing 310 or a semiconductor refrigeration module is fixed to the main flue housing 310 using a tension ring.

Preferably, the distance between the housing 100 and the range hood horizontal housing 313 is n, wherein n is greater than zero.

Fig. 18 is a three-dimensional schematic view of the integration of a semiconductor refrigeration module with a range hood main flue housing. It can be seen that the semiconductor refrigeration module 150 can be integrated externally with the range hood 151, can be integrated into the range hood main flue housing 310, and preferably is integrated directly in front of the main flue housing 310. Specifically, the semiconductor refrigeration module 150 may be adhered to the flue housing 310, the semiconductor refrigeration module 150 may be fixed to the flue housing 310 by using an elastic ring, or another method for fixing the semiconductor refrigeration module 150 to the flue housing 310 may be used. In one embodiment, when the semiconductor refrigeration module 150 is externally integrated into the main flue housing 310 of the range hood, hot and cold air from the module enters from below and hot air from above, it is necessary to keep a proper distance between the lower end of the semiconductor refrigeration module 150 and the horizontal housing 313 of the range hood so that the air inlet can communicate with the outside air.

The invention provides a cold and hot air isolation mode of a semiconductor refrigeration module, the semiconductor refrigeration module mainly comprises a first heat exchange system 120, a second heat exchange system 121, semiconductor refrigeration sheets 106 and a shell 100, the shell 100 encloses a hollow cavity 107, the semiconductor refrigeration sheets 106 comprise a first working surface and a second working surface, and the first heat exchange system 120 comprises the first working surface and first fins 109 of the semiconductor refrigeration sheets 106; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the hollow cavity 107 is divided into at least two chambers by at least one partition plate 122 which is arranged longitudinally, and a first heat exchange system 120 is arranged in a part of the chambers; dividing the chamber provided with the first heat exchange system 120 into an inner chamber 116 and an outer chamber, confining the first working surface of the semiconductor chilling plate 106 and the first fins 109 to the inner chamber 116; confining a second working surface of the semiconductor cooling plate 106 to the inner cavity 116 or the outer cavity; the first fins 109 and the second fins 110 are limited in different cavities, so that cold and hot air separation of the semiconductor refrigeration module is realized.

Each chamber is limited by a first fin 109 or a second fin 110, and an air outlet and an air inlet are correspondingly arranged on the shell 100.

In one embodiment, the hollow chamber 107 is divided into two chambers by a partition 122 disposed longitudinally, wherein one chamber is divided into an inner chamber 116 and an outer chamber.

In one embodiment, the semiconductor cooling fins 106 are confined to the inner cavity 116; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fin 109 is confined to the inner cavity 116; the second fin 110 is confined within another chamber; each chamber is provided with an air outlet and an air inlet corresponding to the housing 100.

As one specific example, the first and second working surfaces of the semiconductor cooling plate 106 are confined to the inner cavity 116 and the outer cavity, respectively; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fin 109 is confined to the inner cavity 116; the second fin 110 is confined within another chamber; each chamber is provided with an air outlet and an air inlet corresponding to the housing 100.

In one embodiment, the hollow chamber 107 is divided into at least three chambers by at least two partitions 122 arranged longitudinally, and a part of the chambers are divided into an inner chamber 116 and an outer chamber. Specifically, the hollow chamber 107 may be divided into three chambers by two partition plates 122 arranged longitudinally, and the middle chamber may be divided into an inner chamber 116 and an outer chamber.

As one specific example, the semiconductor chilling plate 106 is confined to the inner cavity 116 of the intermediate chamber; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fin 109 is confined to the inner cavity 116 of the intermediate chamber; the second fins 110 comprise two groups of fins which are respectively limited in the cavities at two sides; each chamber is provided with an air outlet and an air inlet corresponding to the housing 100.

As one specific example, the first and second working surfaces of the semiconductor cooling plate 106 are confined to the inner and

outer chambers

116 and 116, respectively, of the intermediate chamber; the first heat exchange system 120 comprises a first working surface of the semiconductor chilling plates 106 and first fins 109; the second heat exchange system 121 comprises a second working surface of the semiconductor chilling plate 106 and a second fin 110; the first fin 109 is confined to the inner cavity 116; the second fins 110 comprise two groups of fins which are respectively limited in the two side chambers; each chamber is provided with an air outlet and an air inlet corresponding to the housing 100.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.

Claims

1. A preparation method of a semiconductor refrigeration module is disclosed, the semiconductor refrigeration module mainly comprises a first heat exchange system (120), a second heat exchange system (121), semiconductor refrigeration sheets (106) and a shell (100), the housing (100) encloses a hollow cavity (107), the semiconductor chilling plate (106) comprises a first working surface and a second working surface, the first heat exchange system (120) comprises a first working surface of the semiconductor chilling plates (106) and first fins (109), the second heat exchange system (121) comprising second working surfaces of the semiconductor chilling plates (106) and second fins (110), characterized in that, the method comprises the steps that the hollow cavity (107) is divided into at least two chambers by at least one partition plate (122) which is arranged longitudinally, and a first heat exchange system (120) is arranged in part of the chambers; -a step of dividing the chamber provided with a first heat exchange system (120) into an inner chamber (116) and an outer chamber, -a step of confining a first working surface and a first fin (109) of the semiconductor chilling plate (106) to the inner chamber (116), -a step of confining a second working surface of the semiconductor chilling plate (106) to the inner chamber (116) or the outer chamber, -the second heat exchange system (121) further comprising a heat pipe (111), -a support body (115) is provided at the inner chamber (116) or the outer chamber, -a receiving groove is provided at a top surface of the support body (115) such that the second working surface of the semiconductor chilling plate (106) is received within the receiving groove, -a heat pipe aperture is provided at the support body (115) such that the heat pipe (111) extends through the heat pipe aperture, the second fin (110) being in thermal contact with the second working surface through the heat pipe (111).

2. The method of manufacturing of claim 1, comprising the step of confining the first fin (109) and the second fin (110) in different chambers.

3. The method of claim 2, comprising defining each chamber with a first fin (109) or a second fin (110), and providing the housing (100) with an air outlet and an air inlet.

4. The method of any one of claims 1-3, wherein the hollow chamber (107) is divided into two chambers, one of which is divided into an inner chamber (116) and an outer chamber, by a longitudinally disposed partition (122).

5. A method as claimed in claim 4, characterized by confining said semiconductor chilling plate (106) to said internal cavity (116);

the first heat exchange system (120) comprises first working surfaces of the semiconductor chilling plates (106) and first fins (109);

the second heat exchange system (121) comprises second working surfaces of the semiconductor chilling plates (106) and second fins (110);

-confining the first fin (109) to the inner cavity (116);

confining the second fin (110) within another chamber;

each chamber is correspondingly provided with an air outlet and an air inlet on the shell (100).

6. The preparation method of claim 5, characterized in that the first working surface of the semiconductor chilling plate (106), the first fin (109), the first air inlet nozzle (117), the first air outlet nozzle (118), the first air inlet duct (119), the first air inlet (102), the first fan (108) and the first air outlet (101) form the first heat exchange system (120); and forming a second heat exchange system (121) by using a second working surface of the semiconductor refrigeration sheet (106), the heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

7. The method according to claim 6, characterized in that the first outlet (101) is arranged on the front side of the casing (100); arranging the second air outlet (114) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); arranging the first air inlet (102) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); and arranging the second air inlet (113) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100).

8. The manufacturing method according to claim 7, characterized in that a first heat conducting substrate (104) is attached to the first working surface of the semiconductor chilling plate (106) so that the first fin (109) is in thermal contact with the first heat conducting substrate (104).

9. The manufacturing method of claim 7, characterized in that a second heat conducting substrate (105) is attached to the second working surface of the semiconductor chilling plate (106), so that the second fin (110) is in thermal contact with the second heat conducting substrate (105).

10. A method of manufacturing as claimed in claim 4, characterized by confining a first working surface and a second working surface of the semiconductor chilling plate (106) to the inner chamber (116) and the outer chamber, respectively;

-confining the first fin (109) to the inner cavity (116);

confining the second fin (110) within another chamber;

and each chamber is provided with an air outlet and an air inlet correspondingly on the shell (100).

11. The manufacturing method of claim 10, wherein the first working surface of the semiconductor chilling plate (106), the first fin (109), the first air inlet nozzle (117), the first air outlet nozzle (118), the first air inlet duct (119), the first air inlet (102), the first fan (108) and the first air outlet (101) form the first heat exchange system (120); and forming a second heat exchange system (121) by using a second working surface of the semiconductor refrigeration sheet (106), the heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

12. The method of claim 11, wherein the first outlet (101) is disposed on a front side of the housing (100); arranging the second air outlet (114) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); arranging the first air inlet (102) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); and arranging the second air inlet (113) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100).

13. The manufacturing method according to claim 12, characterized in that a first heat conducting substrate (104) is attached to the first working surface of the semiconductor chilling plate (106) so that the first fin (109) is in thermal contact with the first heat conducting substrate (104).

14. The manufacturing method of claim 12, characterized in that a second heat conducting substrate (105) is attached to the second working surface of the semiconductor chilling plate (106) so that the second fin (110) is in thermal contact with the second heat conducting substrate (105).

15. The method of any one of claims 1 to 3, wherein the hollow chamber (107) is divided into at least three chambers and a part of the chambers are divided into an inner chamber (116) and an outer chamber by at least two partition plates (122) arranged in a longitudinal direction.

16. The method of claim 15, wherein the hollow chamber (107) is divided into three chambers and the intermediate chamber is divided into an inner chamber (116) and an outer chamber by two partitions (122) arranged in a longitudinal direction.

17. A method as claimed in claim 16, characterized by confining said semiconductor chilling plate (106) to an inner cavity (116) of an intermediate chamber;

-confining the first fin (109) to an inner cavity (116) of an intermediate chamber;

the second fins (110) comprise two groups of fins which are respectively limited in the cavities at two sides;

18. The manufacturing method of claim 17, wherein the first working surface of the semiconductor chilling plate (106), the first fin (109), the first air inlet nozzle (117), the first air outlet nozzle (118), the first air inlet duct (119), the first air inlet (102), the first fan (108) and the first air outlet (101) form the first heat exchange system (120); and forming a second heat exchange system (121) by using a second working surface of the semiconductor refrigeration sheet (106), the heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

19. The method of claim 18, wherein the first outlet (101) is provided at a front side of the housing (100); arranging the second air outlet (114) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); arranging the first air inlet (102) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); and arranging the second air inlet (113) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100).

20. The manufacturing method of claim 19, characterized in that a first heat conducting substrate (104) is attached to the first working surface of the semiconductor chilling plate (106) so that the first fin (109) is in thermal contact with the first heat conducting substrate (104).

21. The manufacturing method of claim 19, characterized in that a second heat conducting substrate (105) is attached to the second working surface of the semiconductor chilling plate (106) so that the second fin (110) is in thermal contact with the second heat conducting substrate (105).

22. A method of manufacturing as claimed in claim 16, characterized by confining the first and second working surfaces of the semiconductor chilling plate (106) to an inner chamber (116) and an outer chamber of an intermediate chamber, respectively;

-confining the first fin (109) to an inner cavity (116);

the second fins (110) comprise two groups of fins which are respectively limited in the cavities at the two sides;

23. The manufacturing method of claim 22, wherein the first working surface of the semiconductor chilling plate (106), the first fin (109), the first air inlet nozzle (117), the first air outlet nozzle (118), the first air inlet duct (119), the first air inlet (102), the first fan (108) and the first air outlet (101) form the first heat exchange system (120); and forming a second heat exchange system (121) by using a second working surface of the semiconductor refrigeration sheet (106), the heat pipe (111), the second fin (110), the second fan (112), the second air inlet (113) and the second air outlet (114).

24. The method of claim 23, wherein the first outlet (101) is disposed on a front side of the housing (100); arranging the second air outlet (114) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); arranging the first air inlet (102) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100); and arranging the second air inlet (113) on the top surface, the bottom surface, the rear side surface, the left side surface or the right side surface of the shell (100).

25. The manufacturing method of claim 24, wherein a first heat conducting substrate (104) is attached to the first working surface of the semiconductor chilling plate (106) so that the first fin (109) is in thermal contact with the first heat conducting substrate (104).

26. The method of claim 24, wherein: and a second heat-conducting substrate (105) is attached to the second working surface of the semiconductor chilling plate (106), so that the second fin (110) is in thermal contact with the second heat-conducting substrate (105).

27. A method as claimed in any one of claims 7, 12, 19 or 24, wherein a wind-guiding grid (103) is provided at said first outlet opening (101).

28. The method as claimed in claim 27, wherein wind guide grids (103) are provided at both the wind inlet and the wind outlet.

29. The method of any one of claims 8, 13, 20, or 25, wherein: and a heat-conducting silicone grease (200) is supplemented between the first working surface of the semiconductor chilling plate (106) and the first heat-conducting substrate (104).

30. The method of any one of claims 9, 14, 21 or 26, wherein: and a heat-conducting silicone grease (201) is supplemented between the second working surface of the semiconductor chilling plate (106) and the second heat-conducting substrate (105).