CN202955804U - Machine room semiconductor refrigeration big-small environment air conditioner based on combined operation of evaporative cooling and semiconductor refrigeration - Google Patents
Machine room semiconductor refrigeration big-small environment air conditioner based on combined operation of evaporative cooling and semiconductor refrigeration Download PDFInfo
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- CN202955804U CN202955804U CN 201220613685 CN201220613685U CN202955804U CN 202955804 U CN202955804 U CN 202955804U CN 201220613685 CN201220613685 CN 201220613685 CN 201220613685 U CN201220613685 U CN 201220613685U CN 202955804 U CN202955804 U CN 202955804U
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Abstract
The utility model discloses a machine room semiconductor refrigeration big-small environment air conditioner based on a combined operation of evaporative cooling and semiconductor refrigeration. The machine room semiconductor refrigeration big-small environment air conditioner based on the combined operation of the evaporative cooling and the semiconductor refrigeration comprises an evaporative cold air machine and a plurality of semiconductor refrigerating devices. The evaporative cold air machine is communicated with a big environment through an air supply pipeline, the semiconductor refrigerating devices are fixed on a machine cabinet which is arranged in a machine room small environment through a ceramic groove, and a plurality of air outlets are arranged on the wall of the machine room which corresponds to the evaporative cold air machine. The machine room semiconductor refrigeration big-small environment air conditioner based on the combined operation of the evaporative cooling and the semiconductor refrigeration are a combination of an evaporative cooling air-conditioning technique and the semiconductor refrigeration, and the air conditioner which is applied to the big-small environment is designed, and an effect of energy saving is achieved. In addition, not only is an occupation space reduced, but also a mixed loss of cold air and hot air is reduced, and the use ration of refrigerating capacity is improved.
Description
Technical field
The utility model belongs to the air conditioner refrigerating technical field, is specifically related to a kind of machine room size environment air-conditioning based on evaporative cooling and semiconductor refrigerating cooperation.
Background technology
A large amount of computer equipments all is installed in the machine room, as: server, router, memory device, switch etc.These equipment all can be in the mode of heat transfer, convection current, radiation to the machine room distribute heat, and the temperature of machine room rises rapidly; Simultaneously, machine room has again the latent heat amount little, the characteristics that the regional caloric value that equipment is intensive is concentrated.Like this, formed respectively large and small environment at machine room and the intensive zone of equipment.
For machine room, in personnel seldom enter, so overall situation only need satisfy the most basic humiture requirement.In the equipment cooling compact district, heat dissipation capacity is concentrated, the sensible heat amount is large, the latent heat amount is little, so subenvironment is satisfying on the humiture basis of overall situation, assists the refrigeration of other form again, with the heat absorption of concentrating, the equipment region temperature is reduced, improved the equipment working environment, thereby improved equipment service behaviour and operational reliability.
At present, the vaporizing type air conditioner that air conditioner in machine room adopts, it is affected by environment larger, and is not high to the Temperature and Humidity Control precision of machine room, especially uses the machine room at precision instrument, just must assist the requirement of satisfying humiture with the refrigeration of other form.
Summary of the invention
The purpose of this utility model is to provide a kind of machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation, and it is little not only to take up room, and has reduced the losses by mixture of hot and cold wind, has improved the utilization rate of refrigerating capacity.
The technical scheme that the utility model adopts is, machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation, include vaporizing type air conditioner and a plurality of semiconductor cooling device, vaporizing type air conditioner is communicated with the overall situation of machine room by air supply duct, semiconductor cooling device is fixed in by ceramic trough in the rack that arranges in the machine room subenvironment, is provided with a plurality of exhaust outlets on the wall of the machine room corresponding with vaporizing type air conditioner.
Characteristics of the present utility model also are,
Vaporizing type air conditioner, include machine unit shell, be provided with air inlet on the machine unit shell sidewall, be provided with filler by the air approach axis in the machine unit shell, the rear portion of filler is provided with blower fan, be provided with air outlet on the corresponding machine unit shell sidewall of blower fan, the top of filler is provided with water-locator, and the bottom of filler is provided with header tank, is provided with water filter and water compensating valve in the header tank, water-locator is communicated with water filter in the header tank by feed pipe, also is provided with water circulating pump on the feed pipe.
The material of filler is a kind of among papery, metal, porous ceramics or the PVC.
Blower fan is frequency conversion fan, adopts ac power supply.
Water compensating valve adopts ball-cock assembly or magnetic valve.
Semiconductor cooling device includes semiconductor chilling plate, semiconductor chilling plate one side is connected with the cold junction cooler, be provided with the heat conductive insulating layer between semiconductor chilling plate and the cold junction cooler, the opposite side of semiconductor chilling plate is connected with the hot-side heat dissipation device, also is provided with the heat conductive insulating layer between semiconductor chilling plate and the hot-side heat dissipation device.
Semiconductor chilling plate in the semiconductor cooling device adopts one chip or multiple-piece, and connected mode is serial or parallel connection.
Cold junction cooler and hot-side heat dissipation device in the semiconductor cooling device all adopt the fin form, and the fin form adopts different section forms.
Scribble the insulated paint of one deck low thermal resistance on cold junction cooler in the semiconductor cooling device and the end face of hot-side heat dissipation device.
Semiconductor cooling device adopts dc source.
The beneficial effects of the utility model are,
1) air-conditioning of the present utility model adopts the Evaporative Cooling Air Conditioning technology, compares with traditional compression mechanical refrigeration, and not only having cold-producing medium is natural cold source water, does not discharge greenhouse gases, ozone layer is not destroyed environmentally friendly characteristics; Simultaneously, have characteristics simple in structure, that the wasted work rate is little.
2) air-conditioning of the present utility model adopts vaporizing type air conditioner that the air of cooling is provided in the machine room overall situation, satisfies the requirement of ambient temperature and humidity; Semiconductor-assisted freezes in the subenvironment that equipment cooling is concentrated, and further reduces the environment temperature of equipment, improves its service behaviour and operational reliability; Both associatings are applied in the big or small environment of machine room, have reached energy-conservation characteristics.
3) vaporizing type air conditioner in the air-conditioning of the present utility model adopts direct air system, and all-fresh air can be provided, and guarantees indoor good air quality, can filter new wind again, reduces the machine room dustiness, plays catharsis.
4) be provided with semiconductor cooling device in the air-conditioning of the present utility model, without complicated pipeline equipment, have take up room little, the characteristics that cooling time is fast, be convenient to install.
Description of drawings
Fig. 1 is air-conditioning front view of the present utility model;
Fig. 2 is air-conditioning left view of the present utility model;
Fig. 3 is the structural representation of the vaporizing type air conditioner in the air-conditioning of the present utility model;
Fig. 4 is the structural representation of the semiconductor cooling device in the air-conditioning of the present utility model.
Among the figure, 1. vaporizing type air conditioner, 2. semiconductor cooling device, 3. ceramic trough, 4. rack, 5. exhaust outlet, 6. water-locator, 7. blower fan, 8. water circulating pump, 9. water filter, 10. filler, 11. water compensating valves, 12. header tank, 13. cold junction coolers, 14. hot-side heat dissipation devices, 15. the heat conductive insulating layer, 16. semiconductor chilling plates.
The specific embodiment
Below in conjunction with the drawings and specific embodiments the utility model is elaborated.
The utility model is based on the machine room size environment air-conditioner of evaporative cooling and semiconductor refrigerating cooperation, its structure as shown in Figure 1, include vaporizing type air conditioner 1 and a plurality of semiconductor cooling device 2, as shown in Figure 2, vaporizing type air conditioner 1 is communicated with the overall situation of machine room by air supply duct, semiconductor cooling device 2 is fixed in by ceramic trough 3 in the rack 4 that arranges in the machine room subenvironment, is provided with a plurality of exhaust outlets 5 on the wall of the machine room corresponding with vaporizing type air conditioner 1.
Vaporizing type air conditioner 1, its structure as shown in Figure 3, include machine unit shell, be provided with air inlet on the machine unit shell sidewall, be provided with filler 10 by the air approach axis in the machine unit shell, the rear portion of filler 10 is provided with blower fan 7, be provided with air outlet on the blower fan 7 corresponding machine unit shell sidewalls, the top of filler 10 is provided with water-locator 6, the bottom of filler 10 is provided with header tank 12, be provided with water filter 9 and water compensating valve 11 in the header tank 12, water-locator 6 is communicated with by the water filter 9 in feed pipe and the header tank 12, also is provided with water circulating pump 8 on the feed pipe.
Wherein, the material of filler 10 is a kind of among papery, metal, porous ceramics or the PVC.
Blower fan 7 is frequency conversion fan, adopts ac power supply, by control, can realize energy-conservation.Water compensating valve 11 adopts ball-cock assembly or magnetic valve.
Semiconductor cooling device 2, its structure as shown in Figure 4, include semiconductor chilling plate 16, semiconductor chilling plate 16 1 sides are connected with cold junction cooler 13, be provided with heat conductive insulating layer 15 between semiconductor chilling plate 16 and the cold junction cooler 13, the opposite side of semiconductor chilling plate 16 is connected with hot-side heat dissipation device 14, also is provided with heat conductive insulating layer 15 between semiconductor chilling plate 16 and the hot-side heat dissipation device 14.
The mode that semiconductor chilling plate 16 in the semiconductor cooling device 2 adopts has one chip or multiple-piece, and the connected mode of multiple-piece semiconductor chilling plate 16 has serial or parallel connection.
Semiconductor cooling device 2 adopts dc source, and cold junction cooler 13 and hot-side heat dissipation device 14 in the semiconductor cooling device 2 all adopt the fin form, strengthens heat exchange, and wherein the fin form adopts different section form, uiform section form or unequal section form.The insulated paint that scribbles one deck low thermal resistance on cold junction cooler 13 and hot-side heat dissipation device 14 end faces forms the heat conductive insulating layer, to reach good insulation effect.
The employed vaporizing type air conditioner 1 of the utility model is based on the Evaporative Cooling Air Conditioning technology, utilizes air to contact with water, carries out the wet exchange of heat, and the water evaporation endothermic is taken away airborne heat, thereby the temperature of air is reduced and humidification.Core parts are fillers 10 in the vaporizing type air conditioner 1, the water-locator 6 at filler 10 tops delivered to the water in the header tank 12 by water circulating pump 8, water-locator 6 sprays water to filler 10 uniformly, new wind is through the power of blower fan 7, through filler 10, carry out the wet exchange of heat with moisture film on it, the header tank 12 below the water that falls from filler 10 falls at last circulates by water circulating pump 8 again.Wherein, because filler 10 also has dedusting and antibiotic property, also filter through the air behind the vaporizing type air conditioner 1, reduced the machine room dustiness, satisfy the cleanliness factor requirement.Use vaporizing type air conditioner 1 to carry the air of cooling to machine room in the overall situation of machine room.
Use semiconductor cooling device 2 in the subenvironment of machine room, semiconductor cooling device 2 based semiconductor materials are passing in the situation of electric current, and the cold junction of formation and hot junction can be used for refrigeration.In semiconductor cooling device 2, cold junction cooler 13 places rack inboard, and the surface arranges heat exchanger, and the heat that absorption equipment distributes can cool off the air of rack the inside, reduces the temperature of equipment working environment; Hot-side heat dissipation device 14 places the rack outside, and the surface arranges heat exchanger, with the dissipation of heat that absorbs.
When the subenvironment refrigerating capacity changes in demand of machine room, can realize by changing voltage.
As shown in Figures 1 and 2, core of the present utility model is the large and small environment that forms in vaporizing type air conditioner 1, semiconductor cooling device 2 and the machine room.The cooling of machine room is divided into two parts: overall situation cooling and subenvironment cooling.Utilize the Evaporative Cooling Air Conditioning technology, outdoor new wind is processed in vaporizing type air conditioner, then by airduct and air port the air of processing is delivered to the overall situation of machine room, satisfy the requirement of machine room humiture; Simultaneously, rack at machine room is arranged semiconductor cooling device 2, the semiconductor cooling device that utilizes rack to install, heat dissipation equipment is carried out auxiliary temperature-reducing, compact district at the equipment distribute heat, just heat is absorbed, so that the facility environment temperature reduces, reduced simultaneously hot and cold wind losses by mixture.By the associating of vaporizing type air conditioner and semiconductor refrigerating, satisfied the requirement of machine room size environment air conditioning.
The utility model is based on the course of work of the machine room of evaporative cooling and semiconductor refrigerating cooperation size environment air-conditioner:
During machine room need to freeze, open vaporizing type air conditioner 1, water circulating pump 8 is delivered to the water in the header tank 12 in the water-locator 6 at filler 10 tops, water-locator 6 sprays water on the filler 10, form uniform moisture film at filler 10, outdoor new wind is by filler 10, and the moisture film on the filler 10 carries out that heat is wet to be exchanged, and air is lowered the temperature, humidification; Then by blower fan 7, through airduct and air port will lower the temperature with humidification after air be sent in the machine room, regulate temperature, the humidity of overall situation, make it satisfy the requirement of indoor temperature and humidity, be discharged to outdoor by the exhaust outlet 5 in the machine room again.
Open semiconductor cooling device 2, electric current is by semiconductor chilling plate 16, semiconductor chilling plate 16 begins refrigeration, wherein cold junction cooler 13 absorbs the heat that the inboard equipment of rack distributes, from hot-side heat dissipation device 14 dissipation of heat is gone out again, regulate the temperature of subenvironment, so that the temperature of the rack inboard that equipment cooling is concentrated reduces.
Claims (10)
1. based on the big or small environment air-conditioner of the machine room of evaporative cooling and semiconductor refrigerating cooperation, it is characterized in that, include vaporizing type air conditioner (1) and a plurality of semiconductor cooling device (2), described vaporizing type air conditioner (1) is communicated with the overall situation of machine room by air supply duct, described semiconductor cooling device (2) is fixed in the rack (4) that arranges in the machine room subenvironment by ceramic trough (3), is provided with a plurality of exhaust outlets (5) on the wall of the machine room corresponding with described vaporizing type air conditioner (1).
2. according to the machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation claimed in claim 1, it is characterized in that, described vaporizing type air conditioner (1), include machine unit shell, be provided with air inlet on the described machine unit shell sidewall, be provided with filler (10) by the air approach axis in the described machine unit shell, the rear portion of described filler (10) is provided with blower fan (7), be provided with air outlet on the corresponding machine unit shell sidewall of described blower fan (7), the top of described filler (10) is provided with water-locator (6), the bottom of described filler (10) is provided with header tank (12), be provided with water filter (9) and water compensating valve (11) in the described header tank (12), described water-locator (6) is communicated with by the interior water filter (9) of feed pipe and described header tank (12), also is provided with water circulating pump (8) on the described feed pipe.
3. according to the machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation claimed in claim 2, it is characterized in that the material of described filler (10) is a kind of among papery, metal, porous ceramics or the PVC.
4. according to the machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation claimed in claim 2, it is characterized in that described blower fan (7) is frequency conversion fan, adopt ac power supply.
5. according to the machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation claimed in claim 2, it is characterized in that described water compensating valve (11) adopts ball-cock assembly or magnetic valve.
6. according to the machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation claimed in claim 1, it is characterized in that, described semiconductor cooling device (2) includes semiconductor chilling plate (16), described semiconductor chilling plate (16) one sides are connected with cold junction cooler (13), be provided with heat conductive insulating layer (15) between described semiconductor chilling plate (16) and the described cold junction cooler (13), the opposite side of described semiconductor chilling plate (16) is connected with hot-side heat dissipation device (14), also is provided with heat conductive insulating layer (15) between described semiconductor chilling plate (16) and the described hot-side heat dissipation device (14).
7. according to the machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation claimed in claim 6, it is characterized in that, semiconductor chilling plate (16) in the described semiconductor cooling device (2) adopts one chip or multiple-piece, and connected mode is serial or parallel connection.
8. according to the machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation claimed in claim 6, it is characterized in that, cold junction cooler (13) and hot-side heat dissipation device (14) in the described semiconductor cooling device (2) all adopt the fin form, and the fin form adopts different section forms.
9. according to the machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation claimed in claim 6, it is characterized in that, scribble the insulated paint of one deck low thermal resistance on the cold junction cooler (13) in the described semiconductor cooling device (2) and the end face of hot-side heat dissipation device (14).
10. according to the machine room size environment air-conditioner based on evaporative cooling and semiconductor refrigerating cooperation claimed in claim 6, it is characterized in that described semiconductor cooling device (2) adopts dc source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220613685 CN202955804U (en) | 2012-11-19 | 2012-11-19 | Machine room semiconductor refrigeration big-small environment air conditioner based on combined operation of evaporative cooling and semiconductor refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220613685 CN202955804U (en) | 2012-11-19 | 2012-11-19 | Machine room semiconductor refrigeration big-small environment air conditioner based on combined operation of evaporative cooling and semiconductor refrigeration |
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| Publication Number | Publication Date |
|---|---|
| CN202955804U true CN202955804U (en) | 2013-05-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220613685 Expired - Fee Related CN202955804U (en) | 2012-11-19 | 2012-11-19 | Machine room semiconductor refrigeration big-small environment air conditioner based on combined operation of evaporative cooling and semiconductor refrigeration |
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| Country | Link |
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| CN (1) | CN202955804U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110207293A (en) * | 2019-05-22 | 2019-09-06 | 新疆新特空调节能技术有限公司 | A kind of interior circulation air conditioner device of indirect evaporating-cooling compound electric refrigeration |
| CN110381713A (en) * | 2019-08-16 | 2019-10-25 | 紫光股份有限公司 | A kind of thermo-electric cooling device for high density server cabinet |
-
2012
- 2012-11-19 CN CN 201220613685 patent/CN202955804U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110207293A (en) * | 2019-05-22 | 2019-09-06 | 新疆新特空调节能技术有限公司 | A kind of interior circulation air conditioner device of indirect evaporating-cooling compound electric refrigeration |
| CN110381713A (en) * | 2019-08-16 | 2019-10-25 | 紫光股份有限公司 | A kind of thermo-electric cooling device for high density server cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130529 Termination date: 20131119 |