CN102967016A - Air-conditioning system with combination of evaporative cooling and semiconductor cooling for large environment and small environment of room - Google Patents
Air-conditioning system with combination of evaporative cooling and semiconductor cooling for large environment and small environment of room Download PDFInfo
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- CN102967016A CN102967016A CN2012104688651A CN201210468865A CN102967016A CN 102967016 A CN102967016 A CN 102967016A CN 2012104688651 A CN2012104688651 A CN 2012104688651A CN 201210468865 A CN201210468865 A CN 201210468865A CN 102967016 A CN102967016 A CN 102967016A
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Abstract
The invention discloses an air-conditioning system with combination of evaporative cooling and semiconductor cooling for a large environment and a small environment of a room. The air-conditioning system comprises an evaporative cooling unit and a plurality of semiconductor cooling devices, wherein the evaporative cooling unit is communicated with the large environment of the room through an air supply pipeline, the semiconductor cooling devices are fixedly arranged in a cabinet in the small environment of the room through ceramic slots, and a wall of the room corresponding to the evaporative cooling unit is provided with a plurality of air vents. The air-conditioning system for the large environment and the small environment of the room is designed by combining the evaporative cooling air-conditioning technology with the semiconductor cooling technology, and the energy-saving effect can be achieved. In addition, the occupied space can be reduced, mixed losses of cold air and hot air can be decreased, and the rate of utilization of the cooling capacity can be increased.
Description
Technical field
The invention belongs to the air conditioner refrigerating technical field, be specifically related to the machine room size environment air-conditioning system of a kind of evaporative cooling and semiconductor refrigerating associating.
Background technology
A large amount of computer equipments all is installed in the machine room, as: server, router, memory device, switch etc.These equipment all can be in the mode of heat transfer, convection current, radiation to the machine room distribute heat, and the temperature of machine room rises rapidly; Simultaneously, machine room has again the latent heat amount little, the characteristics that the regional caloric value that equipment is intensive is concentrated.Like this, formed respectively large and small environment at machine room and the intensive zone of equipment.
For machine room, in personnel seldom enter, so overall situation only need satisfy the most basic humiture requirement.In the equipment cooling compact district, heat dissipation capacity is concentrated, the sensible heat amount is large, the latent heat amount is little, so subenvironment is satisfying on the humiture basis of overall situation, assists the refrigeration of other form again, with the heat absorption of concentrating, the equipment region temperature is reduced, improved the equipment working environment, thereby improved equipment service behaviour and operational reliability.
At present, the vaporizing type air conditioner that computer-room air conditioning system adopts, it is affected by environment larger, and is not high to the Temperature and Humidity Control precision of machine room, especially uses the machine room at precision instrument, just must assist the requirement of satisfying humiture with the refrigeration of other form.
Summary of the invention
The object of the present invention is to provide the machine room size environment air-conditioning system of a kind of evaporative cooling and semiconductor refrigerating associating, it is little not only to take up room, and has reduced the losses by mixture of hot and cold wind, has improved the utilization rate of refrigerating capacity.
The technical solution adopted in the present invention is, the machine room size environment air-conditioning system of evaporative cooling and semiconductor refrigerating associating, include vaporizing type air conditioner and a plurality of semiconductor cooling device, vaporizing type air conditioner is communicated with the overall situation of machine room by air supply duct, semiconductor cooling device is fixed in by ceramic trough in the rack that arranges in the machine room subenvironment, is provided with a plurality of exhaust outlets on the wall of the machine room corresponding with vaporizing type air conditioner.
Characteristics of the present invention also are,
Vaporizing type air conditioner, include machine unit shell, be provided with air inlet on the machine unit shell sidewall, be provided with filler by the air approach axis in the machine unit shell, the rear portion of filler is provided with blower fan, be provided with air outlet on the corresponding machine unit shell sidewall of blower fan, the top of filler is provided with water-locator, and the bottom of filler is provided with header tank, is provided with water filter and water compensating valve in the header tank, water-locator is communicated with water filter in the header tank by feed pipe, also is provided with water circulating pump on the feed pipe.
The material of filler is a kind of among papery, metal, porous ceramics or the PVC.
Blower fan is frequency conversion fan, adopts ac power supply.
Water compensating valve adopts ball-cock assembly or magnetic valve.
Semiconductor cooling device includes semiconductor chilling plate, semiconductor chilling plate one side is connected with the cold junction cooler, be provided with the heat conductive insulating layer between semiconductor chilling plate and the cold junction cooler, the opposite side of semiconductor chilling plate is connected with the hot-side heat dissipation device, also is provided with the heat conductive insulating layer between semiconductor chilling plate and the hot-side heat dissipation device.
Semiconductor chilling plate in the semiconductor cooling device adopts one chip or multiple-piece, and connected mode is serial or parallel connection.
Cold junction cooler and hot-side heat dissipation device in the semiconductor cooling device all adopt the fin form, and the fin form adopts different section forms.
Scribble the insulated paint of one deck low thermal resistance on cold junction cooler in the semiconductor cooling device and the end face of hot-side heat dissipation device.
Semiconductor cooling device adopts dc source.
Beneficial effect of the present invention is,
1) air-conditioning system of the present invention adopts the Evaporative Cooling Air Conditioning technology, compares with traditional compression mechanical refrigeration, and not only having cold-producing medium is natural cold source water, does not discharge greenhouse gases, ozone layer is not destroyed environmentally friendly characteristics; Simultaneously, have characteristics simple in structure, that the wasted work rate is little.
2) air-conditioning system of the present invention adopts vaporizing type air conditioner that the air of cooling is provided in the machine room overall situation, satisfies the requirement of ambient temperature and humidity; Semiconductor-assisted freezes in the subenvironment that equipment cooling is concentrated, and further reduces the environment temperature of equipment, improves its service behaviour and operational reliability; Both associatings are applied in the big or small environment of machine room, have reached energy-conservation characteristics.
3) vaporizing type air conditioner in the air-conditioning system of the present invention adopts direct air system, and all-fresh air can be provided, and guarantees indoor good air quality, can filter new wind again, reduces the machine room dustiness, plays catharsis.
4) be provided with semiconductor cooling device in the air-conditioning system of the present invention, without complicated pipeline equipment, have take up room little, the characteristics that cooling time is fast, be convenient to install.
Description of drawings
Fig. 1 is air-conditioning system front view of the present invention;
Fig. 2 is air-conditioning system left view of the present invention;
Fig. 3 is the structural representation of the vaporizing type air conditioner in the air-conditioning system of the present invention;
Fig. 4 is the structural representation of the semiconductor cooling device in the air-conditioning system of the present invention.
Among the figure, 1. vaporizing type air conditioner, 2. semiconductor cooling device, 3. ceramic trough, 4. rack, 5. exhaust outlet, 6. water-locator, 7. blower fan, 8. water circulating pump, 9. water filter, 10. filler, 11. water compensating valves, 12. header tank, 13. cold junction coolers, 14. hot-side heat dissipation devices, 15. the heat conductive insulating layer, 16. semiconductor chilling plates.The specific embodiment
The present invention is described in detail below in conjunction with the drawings and specific embodiments.
The machine room size environment air-conditioning system of evaporative cooling of the present invention and semiconductor refrigerating associating, its structure as shown in Figure 1, include vaporizing type air conditioner 1 and a plurality of semiconductor cooling device 2, as shown in Figure 2, vaporizing type air conditioner 1 is communicated with the overall situation of machine room by air supply duct, semiconductor cooling device 2 is fixed in by ceramic trough 3 in the rack 4 that arranges in the machine room subenvironment, is provided with a plurality of exhaust outlets 5 on the wall of the machine room corresponding with vaporizing type air conditioner 1.
Vaporizing type air conditioner 1, its structure as shown in Figure 3, include machine unit shell, be provided with air inlet on the machine unit shell sidewall, be provided with filler 10 by the air approach axis in the machine unit shell, the rear portion of filler 10 is provided with blower fan 7, be provided with air outlet on the blower fan 7 corresponding machine unit shell sidewalls, the top of filler 10 is provided with water-locator 6, the bottom of filler 10 is provided with header tank 12, be provided with water filter 9 and water compensating valve 11 in the header tank 12, water-locator 6 is communicated with by the water filter 9 in feed pipe and the header tank 12, also is provided with water circulating pump 8 on the feed pipe.
Wherein, the material of filler 10 is a kind of among papery, metal, porous ceramics or the PVC.
Blower fan 7 is frequency conversion fan, adopts ac power supply, by control, can realize energy-conservation.Water compensating valve 11 adopts ball-cock assembly or magnetic valve.
Semiconductor cooling device 2, its structure as shown in Figure 4, include semiconductor chilling plate 16, semiconductor chilling plate 16 1 sides are connected with cold junction cooler 13, be provided with heat conductive insulating layer 15 between semiconductor chilling plate 16 and the cold junction cooler 13, the opposite side of semiconductor chilling plate 16 is connected with hot-side heat dissipation device 14, also is provided with heat conductive insulating layer 15 between semiconductor chilling plate 16 and the hot-side heat dissipation device 14.
The mode that semiconductor chilling plate 16 in the semiconductor cooling device 2 adopts has one chip or multiple-piece, and the connected mode of multiple-piece semiconductor chilling plate 16 has serial or parallel connection.
Semiconductor cooling device 2 adopts dc source, and cold junction cooler 13 and hot-side heat dissipation device 14 in the semiconductor cooling device 2 all adopt the fin form, strengthens heat exchange, and wherein the fin form adopts different section form, uiform section form or unequal section form.The insulated paint that scribbles one deck low thermal resistance on cold junction cooler 13 and hot-side heat dissipation device 14 end faces forms the heat conductive insulating layer, to reach good insulation effect.
Vaporizing type air conditioner 1 used in the present invention is based on the Evaporative Cooling Air Conditioning technology, utilizes air to contact with water, carries out the wet exchange of heat, and the water evaporation endothermic is taken away airborne heat, thereby the temperature of air is reduced and humidification.Core parts are fillers 10 in the vaporizing type air conditioner 1, the water-locator 6 at filler 10 tops delivered to the water in the header tank 12 by water circulating pump 8, water-locator 6 sprays water to filler 10 uniformly, new wind is through the power of blower fan 7, through filler 10, carry out the wet exchange of heat with moisture film on it, the header tank 12 below the water that falls from filler 10 falls at last circulates by water circulating pump 8 again.Wherein, because filler 10 also has dedusting and antibiotic property, also filter through the air behind the vaporizing type air conditioner 1, reduced the machine room dustiness, satisfy the cleanliness factor requirement.Use vaporizing type air conditioner 1 to carry the air of cooling to machine room in the overall situation of machine room.
Use semiconductor cooling device 2 in the subenvironment of machine room, semiconductor cooling device 2 based semiconductor materials are passing in the situation of electric current, and the cold junction of formation and hot junction can be used for refrigeration.In semiconductor cooling device 2, cold junction cooler 13 places rack inboard, and the surface arranges heat exchanger, and the heat that absorption equipment distributes can cool off the air of rack the inside, reduces the temperature of equipment working environment; Hot-side heat dissipation device 14 places the rack outside, and the surface arranges heat exchanger, with the dissipation of heat that absorbs.
When the subenvironment refrigerating capacity changes in demand of machine room, can realize by changing voltage.
As shown in Figures 1 and 2, core of the present invention is the large and small environment that forms in vaporizing type air conditioner 1, semiconductor cooling device 2 and the machine room.The cooling of machine room is divided into two parts: overall situation cooling and subenvironment cooling.Utilize the Evaporative Cooling Air Conditioning technology, outdoor new wind is processed in vaporizing type air conditioner, then by airduct and air port the air of processing is delivered to the overall situation of machine room, satisfy the requirement of machine room humiture; Simultaneously, rack at machine room is arranged semiconductor cooling device 2, the semiconductor cooling device that utilizes rack to install, heat dissipation equipment is carried out auxiliary temperature-reducing, compact district at the equipment distribute heat, just heat is absorbed, so that the facility environment temperature reduces, reduced simultaneously hot and cold wind losses by mixture.By the associating of vaporizing type air conditioner and semiconductor refrigerating, satisfied the requirement of machine room size environment air conditioning.
The course of work of using air-conditioning system based on the machine room of evaporative cooling and semiconductor refrigerating cooperation of the present invention:
During machine room need to freeze, open vaporizing type air conditioner 1, water circulating pump 8 is delivered to the water in the header tank 12 in the water-locator 6 at filler 10 tops, water-locator 6 sprays water on the filler 10, form uniform moisture film at filler 10, outdoor new wind is by filler 10, and the moisture film on the filler 10 carries out that heat is wet to be exchanged, and air is lowered the temperature, humidification; Then by blower fan 7, through airduct and air port will lower the temperature with humidification after air be sent in the machine room, regulate temperature, the humidity of overall situation, make it satisfy the requirement of indoor temperature and humidity, be discharged to outdoor by the exhaust outlet 5 in the machine room again.
Open semiconductor cooling device 2, electric current is by semiconductor chilling plate 16, semiconductor chilling plate 16 begins refrigeration, wherein cold junction cooler 13 absorbs the heat that the inboard equipment of rack distributes, from hot-side heat dissipation device 14 dissipation of heat is gone out again, regulate the temperature of subenvironment, so that the temperature of the rack inboard that equipment cooling is concentrated reduces.
Claims (10)
1. the machine room size environment air-conditioning system of evaporative cooling and semiconductor refrigerating associating, it is characterized in that, include vaporizing type air conditioner (1) and a plurality of semiconductor cooling device (2), described vaporizing type air conditioner (1) is communicated with the overall situation of machine room by air supply duct, described semiconductor cooling device (2) is fixed in the rack (4) that arranges in the machine room subenvironment by ceramic trough (3), is provided with a plurality of exhaust outlets (5) on the wall of the machine room corresponding with described vaporizing type air conditioner (1).
2. the machine room size environment air-conditioning system of uniting according to evaporative cooling claimed in claim 1 and semiconductor refrigerating, it is characterized in that, described vaporizing type air conditioner (1), include machine unit shell, be provided with air inlet on the described machine unit shell sidewall, be provided with filler (10) by the air approach axis in the described machine unit shell, the rear portion of described filler (10) is provided with blower fan (7), be provided with air outlet on the corresponding machine unit shell sidewall of described blower fan (7), the top of described filler (10) is provided with water-locator (6), the bottom of described filler (10) is provided with header tank (12), be provided with water filter (9) and water compensating valve (11) in the described header tank (12), described water-locator (6) is communicated with by the interior water filter (9) of feed pipe and described header tank (12), also is provided with water circulating pump (8) on the described feed pipe.
3. according to the machine room size environment air-conditioning system of evaporative cooling claimed in claim 2 and semiconductor refrigerating associating, it is characterized in that the material of described filler (10) is a kind of among papery, metal, porous ceramics or the PVC.
4. according to the machine room size environment air-conditioning system of evaporative cooling claimed in claim 2 and semiconductor refrigerating associating, it is characterized in that described blower fan (7) is frequency conversion fan, adopt ac power supply.
5. according to the machine room size environment air-conditioning system of evaporative cooling claimed in claim 2 and semiconductor refrigerating associating, it is characterized in that described water compensating valve (11) adopts ball-cock assembly or magnetic valve.
6. the machine room size environment air-conditioning system of uniting according to evaporative cooling claimed in claim 1 and semiconductor refrigerating, it is characterized in that, described semiconductor cooling device (2) includes semiconductor chilling plate (16), described semiconductor chilling plate (16) one sides are connected with cold junction cooler (13), be provided with heat conductive insulating layer (15) between described semiconductor chilling plate (16) and the described cold junction cooler (13), the opposite side of described semiconductor chilling plate (16) is connected with hot-side heat dissipation device (14), also is provided with heat conductive insulating layer (15) between described semiconductor chilling plate (16) and the described hot-side heat dissipation device (14).
7. the machine room size environment air-conditioning system of uniting according to evaporative cooling claimed in claim 6 and semiconductor refrigerating, it is characterized in that, semiconductor chilling plate (16) in the described semiconductor cooling device (2) adopts one chip or multiple-piece, and connected mode is serial or parallel connection.
8. the machine room size environment air-conditioning system of uniting according to evaporative cooling claimed in claim 6 and semiconductor refrigerating, it is characterized in that, cold junction cooler (13) and hot-side heat dissipation device (14) in the described semiconductor cooling device (2) all adopt the fin form, and the fin form adopts different section forms.
9. the machine room size environment air-conditioning system of uniting according to evaporative cooling claimed in claim 6 and semiconductor refrigerating, it is characterized in that, scribble the insulated paint of one deck low thermal resistance on the cold junction cooler (13) in the described semiconductor cooling device (2) and the end face of hot-side heat dissipation device (14).
10. according to the machine room size environment air-conditioning system of evaporative cooling claimed in claim 6 and semiconductor refrigerating associating, it is characterized in that described semiconductor cooling device (2) adopts dc source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104688651A CN102967016A (en) | 2012-11-19 | 2012-11-19 | Air-conditioning system with combination of evaporative cooling and semiconductor cooling for large environment and small environment of room |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012104688651A CN102967016A (en) | 2012-11-19 | 2012-11-19 | Air-conditioning system with combination of evaporative cooling and semiconductor cooling for large environment and small environment of room |
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| CN102967016A true CN102967016A (en) | 2013-03-13 |
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| CN2012104688651A Pending CN102967016A (en) | 2012-11-19 | 2012-11-19 | Air-conditioning system with combination of evaporative cooling and semiconductor cooling for large environment and small environment of room |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104075396A (en) * | 2014-07-04 | 2014-10-01 | 中国工程物理研究院化工材料研究所 | Air intelligent humidifying system and method thereof for storage environment of collection of cultural relics |
| CN104154613A (en) * | 2014-07-25 | 2014-11-19 | 福建省南鸿通讯科技有限公司 | Intelligent energy-saving control system |
| CN104456792A (en) * | 2014-11-20 | 2015-03-25 | 西安工程大学 | Large and small textile mill environment self-adaptation air conditioner with absorption refrigeration and evaporation cooling combined |
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| CN2656907Y (en) * | 2003-09-17 | 2004-11-17 | 曹爱国 | Air conditioner using thermoelectric cooling |
| CN101636623A (en) * | 2006-03-10 | 2010-01-27 | 开利公司 | High efficiency hybrid a/c system |
| CN201528495U (en) * | 2009-03-27 | 2010-07-14 | 黄晓峰 | Equipment cabinet with partitioned temperature control |
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2012
- 2012-11-19 CN CN2012104688651A patent/CN102967016A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2656907Y (en) * | 2003-09-17 | 2004-11-17 | 曹爱国 | Air conditioner using thermoelectric cooling |
| CN101636623A (en) * | 2006-03-10 | 2010-01-27 | 开利公司 | High efficiency hybrid a/c system |
| CN201528495U (en) * | 2009-03-27 | 2010-07-14 | 黄晓峰 | Equipment cabinet with partitioned temperature control |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104075396A (en) * | 2014-07-04 | 2014-10-01 | 中国工程物理研究院化工材料研究所 | Air intelligent humidifying system and method thereof for storage environment of collection of cultural relics |
| CN104075396B (en) * | 2014-07-04 | 2016-09-21 | 四川省科学城海天实业有限公司 | Intelligent air humidity controlling system and method thereof for cultural relics in the collection of cultural institution Conservation environment |
| CN104154613A (en) * | 2014-07-25 | 2014-11-19 | 福建省南鸿通讯科技有限公司 | Intelligent energy-saving control system |
| CN104154613B (en) * | 2014-07-25 | 2017-01-18 | 福建省南鸿通讯科技有限公司 | Intelligent energy-saving control system |
| CN104456792A (en) * | 2014-11-20 | 2015-03-25 | 西安工程大学 | Large and small textile mill environment self-adaptation air conditioner with absorption refrigeration and evaporation cooling combined |
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Application publication date: 20130313 |