CN102759157A - Split air conditioner combining evaporative cooling and semiconductor refrigerating - Google Patents

Split air conditioner combining evaporative cooling and semiconductor refrigerating Download PDF

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Publication number
CN102759157A
CN102759157A CN201210251113XA CN201210251113A CN102759157A CN 102759157 A CN102759157 A CN 102759157A CN 201210251113X A CN201210251113X A CN 201210251113XA CN 201210251113 A CN201210251113 A CN 201210251113A CN 102759157 A CN102759157 A CN 102759157A
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CN
China
Prior art keywords
filler
water
heat exchanger
air conditioner
indoor
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Application number
CN201210251113XA
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Chinese (zh)
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CN102759157B (en
Inventor
黄翔
孙哲
汪超
孙铁柱
芦建华
单媛
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XI'AN JINGREN ELECTRONIC TECHNOLOGY Co Ltd
Xian Polytechnic University
Original Assignee
XI'AN JINGREN ELECTRONIC TECHNOLOGY Co Ltd
Xian Polytechnic University
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Priority to CN201210251113.XA priority Critical patent/CN102759157B/en
Publication of CN102759157A publication Critical patent/CN102759157A/en
Application granted granted Critical
Publication of CN102759157B publication Critical patent/CN102759157B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention discloses a split air conditioner combining evaporative cooling and semiconductor refrigerating. The split air conditioner comprises an outdoor unit and an indoor unit, wherein a filter screen and a plate-fin heat exchanger are arranged inside the outdoor unit in sequence; filler a is arranged on the upper part of the plate-fin heat exchanger; a spraying device a, a water baffle board a and an exhaust fan a are arranged on the upper part of the filler a in sequence; a water collecting box a is arranged on the lower part of the plate-fin heat exchanger; a submersible pump and a water replenishment valve a are arranged inside the water collecting box a; the water collecting box a is connected with the spraying device a by a water supply tube; filler b is arranged behind the filler a; a spraying device b, a water baffle board b and an exhaust fan b are arranged on the upper part of the filler b in sequence; a water collecting box b is arranged at the lower part of the filler b; a semiconductor refrigerating device, a fan coil unit and a novel draught fan are arranged inside the indoor unit. The split air conditioner provided by the invention not only achieves the effect of selectively opening or closing the semiconductor device according to the water temperature and reducing energy consumption, but also improves the cooling efficiency through heat and moisture exchange based on air and water backflow.

Description

The split-type air conditioner that evaporative cooling combines with semiconductor refrigerating
Technical field
The invention belongs to the operation of air conditioning systems technical field, relate to a kind of aircondition, be specifically related to the split-type air conditioner that a kind of evaporative cooling combines with semiconductor refrigerating.
Background technology
Along with improving constantly of resident living level, the room air adjusting is carried out by air-conditioning more and more in residential housing inside, to improve the comfortableness of indoor environment.
All there are a series of problems such as cold-producing medium is unfriendly, Energy Efficiency Ratio is lower in present mechanical refrigeration air-conditioning.Evaporation cooling technique is a kind of environmental protection, efficient, green low-carbon and economic air-conditioning technical.Utilize evaporation cooling technique not only can produce cold wind, also can produce cold water, but the cold water temperature of producing receives the restriction of outdoor weather condition, water temperature is unstable or do not reach required requirement.
Semiconductor refrigerating has characteristics such as volume is little, simple in structure, working stability, but problem is not applied widely because its refrigerating efficiency is low, refrigerating capacity is little etc.Combine with semiconductor refrigerating through evaporative cooling, can improve the stability of evaporation cooling technique, also improved the refrigerating efficiency of semiconductor refrigerating simultaneously, become a new direction of Air-conditioning Development.But present technology does not find the relation of evaporative cooling and semiconductor refrigerating optimum Match, suitable structure and handling process all the time, does not bring into play both advantages fully.
Summary of the invention
The split-type air conditioner that the object of the present invention is to provide evaporative cooling to combine with semiconductor refrigerating combines evaporation-cooled device with semiconductor cooling device, not only optimized complete machine mechanism, and has improved refrigerating efficiency and refrigerating capacity.
The technical scheme that the present invention adopted is that the split-type air conditioner that evaporative cooling combines with semiconductor refrigerating includes off-premises station and indoor set; Off-premises station one sidewall is provided with fresh wind port a, and fresh wind port a bottom is provided with fresh wind port b, is disposed with screen pack, plate-fin heat exchanger by new wind approach axis in the off-premises station; The top of plate-fin heat exchanger is provided with filler a, and the top of filler a is disposed with spray equipment a, water fender a, exhaust blower a, and the off-premises station that exhaust blower a is corresponding is provided with exhaust outlet a; The bottom of plate-fin heat exchanger is provided with header tank a, is provided with immersible pump and water compensating valve a in the header tank a, and header tank a is connected with spray equipment a through feed pipe; Filler a rear is provided with filler b; The top of filler b is disposed with spray equipment b, water fender b, exhaust blower b, and the off-premises station that exhaust blower b is corresponding is provided with exhaust outlet b, and the bottom of filler b is provided with header tank b; Be provided with water compensating valve b and hydrotreater in the header tank b
Be disposed with semiconductor cooling device, fan coil in the indoor set, the semiconductor cooling device bottom is provided with new blower fan, and semiconductor cooling device has three passages; The upper and lower is the passage of heat; The centre is cold passage, and the cold passage of semiconductor cooling device is connected through waterway pipe with fan coil, and the indoor set corresponding with the fan coil air inlet is provided with air inlet; The indoor set corresponding with the fan coil air outlet is provided with air outlet
Header tank b in the off-premises station is connected with semiconductor cooling device in the indoor set through pipeline; Pipeline is provided with water circulating pump; Semiconductor cooling device in the indoor set and fan coil are connected with spray equipment b in the off-premises station through pipeline respectively, and off-premises station is connected through fresh wind tube with the new blower fan of indoor set.
Characteristics of the present invention also are,
Semiconductor cooling device is at least two groups, adopts to be connected in series or to be connected in parallel.
Plate-fin heat exchanger adopts the corrugated plating fin heat exchanger or adopts point-like, the combined plate-fin heat exchanger of striped, and the material of plate-fin heat exchanger is the hydrophily aluminium foil.
Filler a and filler b adopt a kind of in papery, metal, porous ceramics or the PVC material.
Spray equipment a is spray arm or nozzle, and spray equipment b is spray arm or nozzle.
Water compensating valve a and water compensating valve b adopt ball-cock assembly or magnetic valve.
Beneficial effect of the present invention is,
Compare with the conventional semiconductor refrigeration air-conditioner, split-type air conditioner of the present invention has following characteristics:
(1) heat eliminating medium is a water, and both sides are water-cooled, has improved semiconductor refrigerating efficient;
(2) optimize the structure of semiconductor chilling plate, improved refrigerating capacity and refrigerating efficiency.
Compare with the air-conditioner that existing evaporative cooling and semiconductor combine, split-type air conditioner of the present invention has following characteristics:
(1) optimized complete machine structure:, further reduced water temperature through evaporative cooling indirectly-directly; Through air and water adverse current the wet exchange of heat taking place, has improved efficient; Make more compact and reasonable of complete machine structure, processing procedure is more efficient.
(2) optimized operational mode: can select the different semiconductor cooling device of number according to the difference in area.Can select to open semiconductor device or close semiconductor device according to the difference of water temperature.
Description of drawings
Fig. 1 is the structural representation of split-type air conditioner of the present invention;
Fig. 2 is the structural representation of the interior plate-fin heat exchanger of off-premises station in the split-type air conditioner of the present invention;
Fig. 3 is the structural representation of the interior semiconductor cooling device of indoor set in the split-type air conditioner of the present invention.
Among the figure, 1. fresh wind port a, 2. screen pack, 3. plate-fin heat exchanger, 4. filler a, 5. spray equipment a, 6. water fender a; 7. exhaust blower a, 8. exhaust outlet a, 9. exhaust outlet b, 10. exhaust blower b, 11. water fender b, 12. spray equipment b, 13. filler b; 14. water circulating pump, 15. hydrotreaters, 16. header tank b, 17. water compensating valve b, 18. water compensating valve a, 19. header tank a, 20. immersible pumps; 21. fresh wind port b, 22. semiconductor cooling devices, 23. fan coils, 24. new blower fans, 25. passage of heats, 26. cold passages.
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is elaborated.
Split-type air conditioner of the present invention, its structure is as shown in Figure 1, comprise off-premises station, indoor set and between the pipe network that connects form.
Off-premises station one sidewall is provided with fresh wind port a1; Fresh wind port a1 bottom is provided with fresh wind port b21; The top that is disposed with screen pack 2, plate-fin heat exchanger 3 by new wind approach axis in the off-premises station is provided with filler a4; The top of filler a4 is disposed with spray equipment a5, water fender a6, exhaust blower a7, and the off-premises station that exhaust blower a7 is corresponding is provided with exhaust outlet a8, and the bottom of plate-fin heat exchanger 3 is provided with header tank a19; Be provided with immersible pump 20 and water compensating valve a18 in the header tank a19, header tank a19 is connected with spray equipment a5 through feed pipe.Filler a4 rear is provided with filler b13; The top of filler b13 is disposed with spray equipment b12, water fender b11, exhaust blower b10; The off-premises station that exhaust blower b10 is corresponding is provided with exhaust outlet b9; The bottom of filler b13 is provided with header tank b16, is provided with water compensating valve b17 and hydrotreater 15 in the header tank b16.
Be disposed with semiconductor cooling device 22, fan coil 23 in the indoor set; Semiconductor cooling device 22 bottoms are provided with new blower fan 24; As shown in Figure 3, semiconductor cooling device 22 includes three passages, and the upper and lower is the passage of heat 25; The centre is cold passage 26; The cold passage of semiconductor cooling device 22 and fan coil 23 are connected through waterway pipe, are provided with air inlet with the corresponding indoor set of fan coil 23 air inlets, are provided with air outlet with the corresponding indoor set of fan coil 23 air outlets.
Off-premises station can realize that to clammy but processing procedures such as new wind the wet exchange of heat takes place for air after being processed and water, makes the water temperature cooling.Indoor set can realize to the cooling and dehumidifying of air or etc. clammy but processing procedure.
Semiconductor cooling device 22 can be one group, also can be many groups.Can be series connection between many groups, also can be to be connected in parallel.
The pipe network that is connected between indoor set and the off-premises station is made up of grid and fresh wind tube.Grid comprises: the header tank b16 in the indoor set housing is connected through semiconductor cooling device 22 in pipeline and the indoor set housing; This pipeline is provided with water circulating pump 14; Fan coil 23 in the indoor set housing is connected with spray equipment b12 in the outdoor shell through pipeline, and fresh wind tube is connected off-premises station with the new blower fan 24 of indoor set.
Plate-fin heat exchanger 3 can adopt the ripple plate-fin also can adopt the plate-fin heat exchanger structure of point-like and striped phase composition, and material is the hydrophily aluminium foil.Fig. 2 has provided a kind of structure of plate-fin heat exchanger 3.
Exhaust blower a7, exhaust blower b10, water pump 14, immersible pump 20 all adopt AC power.Semiconductor cooling device 22 adopts dc source.
Filler a4, b13 adopt a kind of in papery, metal, porous ceramics or many kinds of materials of PVC.
Spray equipment a5, spray equipment b12 can adopt spray arm or nozzle.
Water compensating valve a18 and water compensating valve b17 adopt ball-cock assembly, also can adopt magnetic valve.Water compensating valve a18, b17 can realize giving automatically header tank a19, b16 moisturizing.
The course of work of split-type air conditioner of the present invention:
Outdoor air is filtered by screen pack 2 through fresh wind port a1, enters in the dry passage of plate-fin heat exchanger 3 as output air (primary air), and through the channel wall heat transfer of plate-fin heat exchanger 3, air quilt etc. are but clammy.Sub-fraction is sent into indoor through airduct by new blower fan 24; Another part carries out the wet exchange of heat on filler b13 surface with moisture film, takes away the heat of water.The temperature of water reduces, and approaches the wet-bulb temperature of the air after being processed.Air drains into atmosphere by exhaust blower 10 through exhaust outlet b9 through water fender b11.Outdoor air enters into the wet channel of plate-fin heat exchanger 3 through fresh wind port b21 as control air (auxiliary air).Carry out the wet exchange of heat with the moisture film on plate-fin heat exchanger 3 wet channels surface, take away the heat of output air (primary air) in plate-fin heat exchanger 3 dry passages.Moisture film with filler 4 surfaces carries out the wet exchange of heat again, drains into atmosphere by exhaust blower 7 through exhaust outlet a8 through water fender a6.
Water among the header tank a19 is sprayed to filler a4 surface by spray equipment a5 through immersible pump 20.Water is evenly distributed by filler a4, enters into the wet channel side of plate-fin heat exchanger 3, finally falls into header tank a19., passes through the water level among the header tank a19 water compensating valve a18 automatic water supplement when being lower than a certain value.
Header tank b16 collects the water that was processed, and handles through hydrotreater 15 again, sends into indoor set by water circulating pump 14.In indoor set, water obtains the heat in semiconductor cooling device 22 hot junctions through the passage of heat 25 of semiconductor cooling device 22, and one the tunnel gets back in the off-premises station.Another road enters into the cold passage 26 of semiconductor cooling device 22, is cooled off by semiconductor cooling device 22 cold junctions.Feed again in the fan coil 23.Room air is through but clammy or cooling and dehumidifyings such as fan coil 23 quilts.Water temperature raises in the back remittance off-premises station.Two path water sprays to filler b13 surface through spray equipment b12, finally falls into header tank b16., passes through the water level among the header tank b16 water compensating valve b17 automatic water supplement when being lower than a certain value.
When the cold water of producing when off-premises station can meet the demands indoor the requirement, do not open semiconductor cooling device 22.When the cold water of producing when off-premises station can not satisfy indoor the requirement, open semiconductor cooling device 22.And, regulate the voltage swing of semiconductor cooling device 22 according to institute's chilling requirement size.
According to the difference in area, select the semiconductor cooling device 22 of different many groups, make it satisfy effect to the evaporative cooling auxiliary adjustment.
Split-type air conditioner of the present invention is through to the principle analysis of evaporative cooling and semiconductor refrigerating, find both matching relationship, designed suitable structure and handling process, solved the problem in evaporative cooling and the semiconductor refrigerating application in conjunction.

Claims (6)

1. the split-type air conditioner that combines with semiconductor refrigerating of evaporative cooling; It is characterized in that, include off-premises station and indoor set, said off-premises station one sidewall is provided with fresh wind port a (1); Said fresh wind port a (1) bottom is provided with fresh wind port b (21); Be disposed with screen pack (2), plate-fin heat exchanger (3) by new wind approach axis in the said off-premises station, the top of said plate-fin heat exchanger (3) is provided with filler a (4), and the top of said filler a (4) is disposed with spray equipment a (5), water fender a (6), exhaust blower a (7); The off-premises station that said exhaust blower a (7) is corresponding is provided with exhaust outlet a (8); The bottom of said plate-fin heat exchanger (3) is provided with header tank a (19), is provided with immersible pump (20) and water compensating valve a (18) in the said header tank a (19), and said header tank a (19) is connected with spray equipment a (5) through feed pipe; Said filler a (4) rear is provided with filler b (13); The top of said filler b (13) is disposed with spray equipment b (12), water fender b (11), exhaust blower b (10), and the off-premises station that said exhaust blower b (10) is corresponding is provided with exhaust outlet b (9), and the bottom of said filler b (13) is provided with header tank b (16); Be provided with water compensating valve b (17) and hydrotreater (15) in the said header tank b (16)
Be disposed with semiconductor cooling device (22), fan coil (23) in the said indoor set; Said semiconductor cooling device (22) bottom is provided with new blower fan (24); Said semiconductor cooling device (22) has three passages, and the upper and lower is the passage of heat (25), and the centre is cold passage (26); The cold passage (26) of said semiconductor cooling device (22) is connected through waterway pipe with fan coil (23); Be provided with air inlet with the corresponding indoor set of said fan coil (23) air inlet, be provided with air outlet with the corresponding indoor set of said fan coil (23) air outlet
Header tank b (16) in the said off-premises station is connected with the interior semiconductor cooling device (22) of said indoor set through pipeline; Said pipeline is provided with water circulating pump (14); Semiconductor cooling device (22) in the said indoor set is connected with the interior spray equipment b (12) of said off-premises station through pipeline respectively with fan coil (23), and said off-premises station is connected through fresh wind tube with the new blower fan (24) of said indoor set.
2. split-type air conditioner according to claim 1 is characterized in that, described semiconductor cooling device (22) is at least two groups, adopts to be connected in series or to be connected in parallel.
3. split-type air conditioner according to claim 1 is characterized in that, described plate-fin heat exchanger (3) adopts the corrugated plating fin heat exchanger or adopts point-like, the combined plate-fin heat exchanger of striped, and the material of plate-fin heat exchanger (3) is the hydrophily aluminium foil.
4. split-type air conditioner according to claim 1 is characterized in that, described filler a (4) and filler b (13) adopt a kind of in papery, metal, porous ceramics or the PVC material.
5. split-type air conditioner according to claim 1 is characterized in that, described spray equipment a (5) is spray arm or nozzle, and described spray equipment b (12) is spray arm or nozzle.
6. split-type air conditioner according to claim 1 is characterized in that, described water compensating valve a (18) and water compensating valve b (17) adopt ball-cock assembly or magnetic valve.
CN201210251113.XA 2012-07-19 2012-07-19 Split air conditioner combining evaporative cooling and semiconductor refrigerating Expired - Fee Related CN102759157B (en)

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Application Number Priority Date Filing Date Title
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CN102759157B CN102759157B (en) 2014-10-01

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103017273A (en) * 2012-12-06 2013-04-03 西安工程大学 Heating and ventilating air conditioner system for rural residence
CN104633879A (en) * 2015-02-06 2015-05-20 广东美的制冷设备有限公司 Air conditioner and control method for the same
CN106839209A (en) * 2017-02-14 2017-06-13 西安工程大学 Photovoltaic semiconductors evaporation cooling domestic air-conditioning system
CN112869573A (en) * 2021-03-01 2021-06-01 云米互联科技(广东)有限公司 Water tank mechanism with water retaining structure and steaming and baking oven applying same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200995602Y (en) * 2006-12-15 2007-12-26 卫行 Semiconductor air conditioner of vehicle
JP2011085266A (en) * 2009-10-13 2011-04-28 Seimitsu:Kk Precision temperature control air conditioner
CN102384543A (en) * 2010-08-30 2012-03-21 吴仁麒 Water-circulation conducting semiconductor thermoelectric heating-cooling air conditioner
CN202709356U (en) * 2012-07-19 2013-01-30 西安工程大学 Split type evaporative cooling and semiconductor refrigeration compound air conditioner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200995602Y (en) * 2006-12-15 2007-12-26 卫行 Semiconductor air conditioner of vehicle
JP2011085266A (en) * 2009-10-13 2011-04-28 Seimitsu:Kk Precision temperature control air conditioner
CN102384543A (en) * 2010-08-30 2012-03-21 吴仁麒 Water-circulation conducting semiconductor thermoelectric heating-cooling air conditioner
CN202709356U (en) * 2012-07-19 2013-01-30 西安工程大学 Split type evaporative cooling and semiconductor refrigeration compound air conditioner

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103017273A (en) * 2012-12-06 2013-04-03 西安工程大学 Heating and ventilating air conditioner system for rural residence
CN103017273B (en) * 2012-12-06 2015-03-04 西安工程大学 Heating and ventilating air conditioner system for rural residence
CN104633879A (en) * 2015-02-06 2015-05-20 广东美的制冷设备有限公司 Air conditioner and control method for the same
CN106839209A (en) * 2017-02-14 2017-06-13 西安工程大学 Photovoltaic semiconductors evaporation cooling domestic air-conditioning system
CN112869573A (en) * 2021-03-01 2021-06-01 云米互联科技(广东)有限公司 Water tank mechanism with water retaining structure and steaming and baking oven applying same

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