CN102759157B - Split air conditioner combining evaporative cooling and semiconductor refrigerating - Google Patents

Split air conditioner combining evaporative cooling and semiconductor refrigerating Download PDF

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Publication number
CN102759157B
CN102759157B CN201210251113.XA CN201210251113A CN102759157B CN 102759157 B CN102759157 B CN 102759157B CN 201210251113 A CN201210251113 A CN 201210251113A CN 102759157 B CN102759157 B CN 102759157B
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China
Prior art keywords
filler
water
heat exchanger
air conditioner
indoor
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Expired - Fee Related
Application number
CN201210251113.XA
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Chinese (zh)
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CN102759157A (en
Inventor
黄翔
孙哲
汪超
孙铁柱
芦建华
单媛
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XI'AN JINGREN ELECTRONIC TECHNOLOGY Co Ltd
Xian Polytechnic University
Original Assignee
XI'AN JINGREN ELECTRONIC TECHNOLOGY Co Ltd
Xian Polytechnic University
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Priority to CN201210251113.XA priority Critical patent/CN102759157B/en
Publication of CN102759157A publication Critical patent/CN102759157A/en
Application granted granted Critical
Publication of CN102759157B publication Critical patent/CN102759157B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention discloses a split air conditioner combining evaporative cooling and semiconductor refrigerating. The split air conditioner comprises an outdoor unit and an indoor unit, wherein a filter screen and a plate-fin heat exchanger are arranged inside the outdoor unit in sequence; filler a is arranged on the upper part of the plate-fin heat exchanger; a spraying device a, a water baffle board a and an exhaust fan a are arranged on the upper part of the filler a in sequence; a water collecting box a is arranged on the lower part of the plate-fin heat exchanger; a submersible pump and a water replenishment valve a are arranged inside the water collecting box a; the water collecting box a is connected with the spraying device a by a water supply tube; filler b is arranged behind the filler a; a spraying device b, a water baffle board b and an exhaust fan b are arranged on the upper part of the filler b in sequence; a water collecting box b is arranged at the lower part of the filler b; a semiconductor refrigerating device, a fan coil unit and a novel draught fan are arranged inside the indoor unit. The split air conditioner provided by the invention not only achieves the effect of selectively opening or closing the semiconductor device according to the water temperature and reducing energy consumption, but also improves the cooling efficiency through heat and moisture exchange based on air and water backflow.

Description

The split-type air conditioner that evaporative cooling combines with semiconductor refrigerating
Technical field
The invention belongs to operation of air conditioning systems technical field, relate to a kind of aircondition, be specifically related to the split-type air conditioner that a kind of evaporative cooling combines with semiconductor refrigerating.
Background technology
Along with improving constantly of resident living level, room air adjusting is carried out by air-conditioning more and more in residential housing inside, to improve the comfortableness of indoor environment.
All there is the series of problems such as cold-producing medium is unfriendly, Energy Efficiency Ratio is lower in current mechanical refrigeration air-conditioning.Evaporation cooling technique is a kind of environmental protection, efficient, green low-carbon and economic air-conditioning technical.Utilize evaporation cooling technique not only can produce cold wind, also can produce cold water, but the cold water temperature of producing is subject to the restriction of outdoor weather condition, water temperature is unstable or do not reach required requirement.
Semiconductor refrigerating has the features such as volume is little, simple in structure, working stability, but because the problems such as its refrigerating efficiency is low, refrigerating capacity is little are not applied widely.By evaporative cooling, combine with semiconductor refrigerating, can improve the stability of evaporation cooling technique, also improved the refrigerating efficiency of semiconductor refrigerating simultaneously, become a new direction of Air-conditioning Development.But current technology does not find the relation of evaporative cooling and semiconductor refrigerating optimum Match, suitable structure and handling process all the time, does not bring into play fully both advantages.
Summary of the invention
The split-type air conditioner that the object of the present invention is to provide evaporative cooling to combine with semiconductor refrigerating, is combined evaporation-cooled device with semiconductor cooling device, not only optimized complete machine mechanism, and has improved refrigerating efficiency and refrigerating capacity.
The technical solution adopted in the present invention is, the split-type air conditioner that evaporative cooling combines with semiconductor refrigerating, include off-premises station and indoor set, on off-premises station one sidewall, be provided with fresh wind port a, fresh wind port a bottom is provided with fresh wind port b, in off-premises station, by new wind approach axis, be disposed with screen pack, plate-fin heat exchanger, the top of plate-fin heat exchanger is provided with filler a, the top of filler a is disposed with spray equipment a, water fender a, exhaust blower a, on off-premises station corresponding to exhaust blower a, be provided with exhaust outlet a, the bottom of plate-fin heat exchanger is provided with header tank a, in header tank a, be provided with immersible pump and water compensating valve a, header tank a is connected with spray equipment a by feed pipe, filler a rear is provided with filler b, the top of filler b is disposed with spray equipment b, water fender b, exhaust blower b, on off-premises station corresponding to exhaust blower b, be provided with exhaust outlet b, the bottom of filler b is provided with header tank b, in header tank b, be provided with water compensating valve b and hydrotreater,
In indoor set, be disposed with semiconductor cooling device, fan coil, semiconductor cooling device bottom is provided with new blower fan, semiconductor cooling device has three passages, upper and lower is the passage of heat, centre is cold passage, and the cold passage of semiconductor cooling device is connected by waterway pipe with fan coil, on the indoor set corresponding with fan coil air inlet, is provided with air inlet, on the indoor set corresponding with fan coil air outlet, be provided with air outlet
Header tank b in off-premises station is connected with the semiconductor cooling device in indoor set by pipeline, on pipeline, be provided with water circulating pump, semiconductor cooling device in indoor set is connected with the spray equipment b in off-premises station by pipeline respectively with fan coil, and off-premises station is connected by fresh wind tube with the new blower fan of indoor set.
Feature of the present invention is also,
Semiconductor cooling device is at least two groups, adopts and is connected in series or is connected in parallel.
Plate-fin heat exchanger adopts corrugated plating fin heat exchanger or adopts point-like, the combined plate-fin heat exchanger of striped, and the material of plate-fin heat exchanger is hydrophily aluminium foil.
Filler a and filler b adopt a kind of in papery, metal, porous ceramics or PVC material.
Spray equipment a is spray arm or nozzle, and spray equipment b is spray arm or nozzle.
Water compensating valve a and water compensating valve b adopt ball-cock assembly or magnetic valve.
Beneficial effect of the present invention is,
Compare with existing semiconductor refrigerating air-conditioning, split-type air conditioner of the present invention has following characteristics:
(1) heat eliminating medium is water, and both sides are water-cooled, has improved semiconductor refrigerating efficiency;
(2) optimize the structure of semiconductor chilling plate, improved refrigerating capacity and refrigerating efficiency.
Compare with the air-conditioner that existing evaporative cooling combines with semiconductor, split-type air conditioner of the present invention has following characteristics:
(1) optimized complete machine structure: by evaporative cooling, further reduced water temperature; By air and water adverse current, there is the wet exchange of heat, improved efficiency; Make more compact and reasonable of complete machine structure, processing procedure is more efficient.
(2) optimized operational mode: can, according to regional difference, select the different semiconductor cooling device of number.Can, according to the difference of water temperature, select open semiconductor device or close semiconductor device.
Accompanying drawing explanation
Fig. 1 is the structural representation of split-type air conditioner of the present invention;
Fig. 2 is the structural representation of the interior plate-fin heat exchanger of off-premises station in split-type air conditioner of the present invention;
Fig. 3 is the structural representation of the interior semiconductor cooling device of indoor set in split-type air conditioner of the present invention.
In figure, 1. fresh wind port a, 2. screen pack, 3. plate-fin heat exchanger, 4. filler a, 5. spray equipment a, 6. water fender a, 7. exhaust blower a, 8. exhaust outlet a, 9. exhaust outlet b, 10. exhaust blower b, 11. water fender b, 12. spray equipment b, 13. filler b, 14. water circulating pumps, 15. hydrotreaters, 16. header tank b, 17. water compensating valve b, 18. water compensating valve a, 19. header tank a, 20. immersible pumps, 21. fresh wind port b, 22. semiconductor cooling devices, 23. fan coils, 24. new blower fans, 25. passage of heats, 26. cold passages.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
Split-type air conditioner of the present invention, its structure as shown in Figure 1, comprise off-premises station, indoor set and between the pipe network that connects form.
On off-premises station one sidewall, be provided with fresh wind port a1, fresh wind port a1 bottom is provided with fresh wind port b21, the top that is disposed with screen pack 2, plate-fin heat exchanger 3 by new wind approach axis in off-premises station is provided with filler a4, the top of filler a4 is disposed with spray equipment a5, water fender a6, exhaust blower a7, on off-premises station corresponding to exhaust blower a7, be provided with exhaust outlet a8, the bottom of plate-fin heat exchanger 3 is provided with header tank a19, in header tank a19, be provided with immersible pump 20 and water compensating valve a18, header tank a19 is connected with spray equipment a5 by feed pipe.Filler a4 rear is provided with filler b13, the top of filler b13 is disposed with spray equipment b12, water fender b11, exhaust blower b10, on off-premises station corresponding to exhaust blower b10, be provided with exhaust outlet b9, the bottom of filler b13 is provided with header tank b16, is provided with water compensating valve b17 and hydrotreater 15 in header tank b16.
In indoor set, be disposed with semiconductor cooling device 22, fan coil 23, semiconductor cooling device 22 bottoms are provided with new blower fan 24, as shown in Figure 3, semiconductor cooling device 22 includes three passages, upper and lower is the passage of heat 25, centre is cold passage 26, the cold passage of semiconductor cooling device 22 is connected by waterway pipe with fan coil 23, on the indoor set corresponding with fan coil 23 air inlets, be provided with air inlet, on the indoor set corresponding with fan coil 23 air outlets, be provided with air outlet.
Off-premises station can be realized clammy but processing procedures such as new wind, and the wet exchange of heat occurs for the air after processed and water, makes water temperature cooling.Indoor set can realize to the cooling and dehumidifying of air or etc. clammy but processing procedure.
Semiconductor cooling device 22 can be one group, also can be many groups.Between many groups, can be series connection, also can be to be connected in parallel.
The pipe network being connected between indoor set and off-premises station is comprised of grid and fresh wind tube.Grid comprises: the header tank b16 in indoor unit casing is connected with semiconductor cooling device in indoor unit casing 22 by pipeline, on this pipeline, be provided with water circulating pump 14, fan coil 23 in indoor unit casing is connected with the spray equipment b12 in outdoor shell by pipeline, and fresh wind tube is connected off-premises station with the new blower fan 24 of indoor set.
Plate-fin heat exchanger 3 can adopt ripple plate-fin also can adopt the plate-fin heat exchanger structure of point-like and striped phase composition, and material is hydrophily aluminium foil.Fig. 2 has provided a kind of structure of plate-fin heat exchanger 3.
Exhaust blower a7, exhaust blower b10, water pump 14, immersible pump 20 all adopt AC power.Semiconductor cooling device 22 adopts dc source.
Filler a4, b13 adopt a kind of in papery, metal, porous ceramics or PVC multiple material.
Spray equipment a5, spray equipment b12 can adopt spray arm or nozzle.
Water compensating valve a18 and water compensating valve b17 adopt ball-cock assembly, also can adopt magnetic valve.Water compensating valve a18, b17 can realize automatically to header tank a19, b16 moisturizing.
The course of work of split-type air conditioner of the present invention:
Outdoor air is filtered by screen pack 2 by fresh wind port a1, as output air (primary air), enters in the dry passage of plate-fin heat exchanger 3, and the channel wall by plate-fin heat exchanger 3 conducts heat, air by etc. but clammy.Sub-fraction is sent into indoor by airduct by new blower fan 24; Another part carries out the wet exchange of heat, the heat that band is leaked water on filler b13 surface with moisture film.The temperature of water reduces, and approaches the wet-bulb temperature of the air after processed.Air drains into atmosphere by exhaust blower 10 through exhaust outlet b9 by water fender b11.Outdoor air, by fresh wind port b21, enters into the wet channel of plate-fin heat exchanger 3 as control air (auxiliary air).Carry out the wet exchange of heat with the moisture film on plate-fin heat exchanger 3 wet channel surfaces, take away the heat of output air (primary air) in plate-fin heat exchanger 3 dry passages.Carry out the wet exchange of heat with the moisture film on filler 4 surfaces again, by water fender a6, by exhaust blower 7, through exhaust outlet a8, drain into atmosphere.
Water in header tank a19 is sprayed to filler a4 surface by spray equipment a5 by immersible pump 20.Water is uniformly distributed by filler a4, enters into the wet channel side of plate-fin heat exchanger 3, finally falls into header tank a19.Water level in header tank a19 during lower than a certain value by water compensating valve a18 automatic water supplement.
Header tank b16 collects processed water, then processes by hydrotreater 15, by water circulating pump 14, sends into indoor set.In indoor set, water, by the passage of heat 25 of semiconductor cooling device 22, obtains the heat in semiconductor cooling device 22 hot junctions, and a road is got back in off-premises station.Another road enters into the cold passage 26 of semiconductor cooling device 22, cooling by semiconductor cooling device 22 cold junctions.Pass into again in fan coil 23.Room air is by but clammy or cooling and dehumidifyings such as fan coil 23 quilts.After raising, water temperature imports in off-premises station.Two path water sprays to filler b13 surface by spray equipment b12, finally falls into header tank b16.Water level in header tank b16 during lower than a certain value by water compensating valve b17 automatic water supplement.
When the cold water of producing when off-premises station can meet the demands indoor requirement, do not open semiconductor cooling device 22.When the cold water of producing when off-premises station can not meet indoor requirement, open semiconductor cooling device 22.And according to institute's chilling requirement size, regulate the voltage swing of semiconductor cooling device 22.
According to regional difference, select the semiconductor cooling device 22 of different many groups, make it meet the effect to evaporative cooling auxiliary adjustment.
Split-type air conditioner of the present invention is by the principle analysis to evaporative cooling and semiconductor refrigerating, find both matching relationship, designed suitable structure and handling process, solved the problem that evaporative cooling combines with semiconductor refrigerating in applying.

Claims (6)

1. the split-type air conditioner that evaporative cooling combines with semiconductor refrigerating, it is characterized in that, include off-premises station and indoor set, on described off-premises station one sidewall, be provided with fresh wind port a(1), described fresh wind port a(1) bottom is provided with fresh wind port b(21), in described off-premises station, by new wind approach axis, be disposed with screen pack (2), plate-fin heat exchanger (3), the top of described plate-fin heat exchanger (3) is provided with filler a(4), described filler a(4) top is disposed with spray equipment a(5), water fender a(6), exhaust blower a(7), described exhaust blower a(7) on corresponding off-premises station, be provided with exhaust outlet a(8), the bottom of described plate-fin heat exchanger (3) is provided with header tank a(19), described header tank a(19) in, be provided with immersible pump (20) and water compensating valve a(18), described header tank a(19) by feed pipe and spray equipment a(5) be connected, described filler a(4) rear is provided with filler b(13), described filler b(13) top is disposed with spray equipment b(12), water fender b(11), exhaust blower b(10), described exhaust blower b(10) on corresponding off-premises station, be provided with exhaust outlet b(9), described filler b(13) bottom is provided with header tank b(16), described header tank b(16) in, be provided with water compensating valve b(17) and hydrotreater (15),
In described indoor set, be disposed with semiconductor cooling device (22), fan coil (23), described semiconductor cooling device (22) bottom is provided with new blower fan (24), described semiconductor cooling device (22) has three passages, upper and lower is the passage of heat (25), centre is cold passage (26), the cold passage (26) of described semiconductor cooling device (22) is connected by waterway pipe with fan coil (23), on the indoor set corresponding with described fan coil (23) air inlet, be provided with air inlet, on the indoor set corresponding with described fan coil (23) air outlet, be provided with air outlet,
Header tank b(16 in described off-premises station) by pipeline, be connected with the semiconductor cooling device (22) in described indoor set, on described pipeline, be provided with water circulating pump (14), semiconductor cooling device in described indoor set (22) and fan coil (23) are respectively by pipeline and spray equipment b(12 in described off-premises station) be connected, described off-premises station is connected by fresh wind tube with the new blower fan (24) of described indoor set.
2. split-type air conditioner according to claim 1, is characterized in that, described semiconductor cooling device (22) is at least two groups, adopts and is connected in series or is connected in parallel.
3. split-type air conditioner according to claim 1, is characterized in that, described plate-fin heat exchanger (3) adopts corrugated plating fin heat exchanger or adopts point-like, the combined plate-fin heat exchanger of striped, and the material of plate-fin heat exchanger (3) is hydrophily aluminium foil.
4. split-type air conditioner according to claim 1, is characterized in that, described filler a(4) and filler b(13) a kind of in papery, metal, porous ceramics or PVC material adopted.
5. split-type air conditioner according to claim 1, is characterized in that, described spray equipment a(5) be spray arm or nozzle, described spray equipment b(12) be spray arm or nozzle.
6. split-type air conditioner according to claim 1, is characterized in that, described water compensating valve a(18) and water compensating valve b(17) employing ball-cock assembly or magnetic valve.
CN201210251113.XA 2012-07-19 2012-07-19 Split air conditioner combining evaporative cooling and semiconductor refrigerating Expired - Fee Related CN102759157B (en)

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Publication number Priority date Publication date Assignee Title
CN103017273B (en) * 2012-12-06 2015-03-04 西安工程大学 Heating and ventilating air conditioner system for rural residence
CN104633879B (en) * 2015-02-06 2018-08-14 广东美的制冷设备有限公司 The control method of air conditioner and air conditioner
CN106839209A (en) * 2017-02-14 2017-06-13 西安工程大学 Photovoltaic semiconductors evaporation cooling domestic air-conditioning system
CN112869573B (en) * 2021-03-01 2022-02-11 云米互联科技(广东)有限公司 Water tank mechanism with water retaining structure and steaming and baking oven applying same

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CN200995602Y (en) * 2006-12-15 2007-12-26 卫行 Semiconductor air conditioner of vehicle
JP4896197B2 (en) * 2009-10-13 2012-03-14 株式会社 セイミツ Precision temperature control air conditioner
CN102384543A (en) * 2010-08-30 2012-03-21 吴仁麒 Water-circulation conducting semiconductor thermoelectric heating-cooling air conditioner
CN202709356U (en) * 2012-07-19 2013-01-30 西安工程大学 Split type evaporative cooling and semiconductor refrigeration compound air conditioner

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