CN104633879A - Air conditioner and control method for the same - Google Patents

Air conditioner and control method for the same Download PDF

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Publication number
CN104633879A
CN104633879A CN201510064890.7A CN201510064890A CN104633879A CN 104633879 A CN104633879 A CN 104633879A CN 201510064890 A CN201510064890 A CN 201510064890A CN 104633879 A CN104633879 A CN 104633879A
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CN
China
Prior art keywords
temperature
refrigerating capacity
air
conditioner
preset temperature
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Granted
Application number
CN201510064890.7A
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Chinese (zh)
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CN104633879B (en
Inventor
陈明瑜
马闯
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GD Midea Air Conditioning Equipment Co Ltd
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Guangdong Midea Refrigeration Equipment Co Ltd
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Priority to CN201510064890.7A priority Critical patent/CN104633879B/en
Publication of CN104633879A publication Critical patent/CN104633879A/en
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Publication of CN104633879B publication Critical patent/CN104633879B/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/30Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/62Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/62Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
    • F24F11/63Electronic processing
    • F24F11/65Electronic processing for selecting an operating mode
    • F24F11/66Sleep mode

Abstract

The invention discloses an air conditioner which comprises a shell, a compressor, a temperature sensor, a semiconductor module and a controller, wherein the compressor, the temperature sensor, the semiconductor module and the controller are arranged in the shell, the temperature sensor is used for detecting indoor environment temperature and providing the controller with the temperature, the compressor is used for presetting frequency operation and providing the controller with output refrigerating capacity corresponding to the preset frequency, and the semiconductor module is used for starting thermoelectric refrigeration to perform temperature compensation on the air conditioner when the controller judges that the indoor environment temperature is higher than the preset temperature and the output refrigerating capacity is smaller than preset output refrigerating capacity. The invention further discloses a control method for the air conditioner. According to the air conditioner and the control method, the air conditioner can automatically complete temperature compensation, and therefore comfortable sleeping temperature is offered to a user.

Description

The control method of air-conditioner and air-conditioner
Technical field
The present invention relates to refrigeration technology field, particularly relate to the control method of a kind of air-conditioner and air-conditioner.
Background technology
The sleep pattern of air-conditioner, generally includes two kinds of modes: a kind of is by compressor operating frequency with fixing curve motion, but is difficult to meet the requirement of most users to comfortableness; Another kind is set the opening of compressor operating frequency to user oneself, but most user all cannot according to oneself need compressor operating frequency is set, under the sleep pattern of user's setting, compressor running frequency was not cold is exactly overheated, thus cannot reach the requirement of comfortableness at all.
Foregoing, only for auxiliary understanding technical scheme of the present invention, does not represent and admits that foregoing is prior art.
Summary of the invention
Main purpose of the present invention is the control method providing a kind of air-conditioner and air-conditioner, is intended to automatically complete temperature-compensating, to provide comfortable sleep temperature to user.
For achieving the above object, the invention provides a kind of air-conditioner, described air-conditioner comprise housing and be located at compressor in described housing, temperature sensor, semiconductor subassembly and controller, described temperature sensor is for detecting indoor environment temperature and being supplied to described controller, described compressor is used for running with preset frequency and output refrigerating capacity corresponding for described preset frequency being supplied to described controller, described semiconductor subassembly be used for described controller judge described indoor environment temperature be greater than preset temperature and described output refrigerating capacity be less than predetermined export refrigerating capacity time, start thermoelectric cooling and temperature-compensating is carried out to air-conditioner.
Preferably, described semiconductor subassembly comprises first order semiconductor and second level semiconductor, described preset temperature comprises the first preset temperature and the second preset temperature, and described second preset temperature is greater than described first preset temperature, described first order semiconductor is used for, when described indoor environment temperature is greater than the first preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, carries out thermoelectric cooling and starting one-level temperature-compensating program; Described second level semiconductor is used for, when described indoor environment temperature is greater than the second preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, carries out thermoelectric cooling and starting secondary temperature-compensating program.
Preferably, described first order semiconductor and second level semiconductor have the refrigeration end that is oppositely arranged and heat end, and described housing is provided with an air outlet, is provided with a drip tray in described housing, the described end that heats is positioned at described drip tray, and described refrigeration end is positioned at described air outlet position.
Preferably, the coaming plate that described drip tray comprises the support be connected with described housing, the disk body extended to described casing center from described support and extends away from air outlet direction around described disk body one circumference, described disk body and described coaming plate form an accommodation space to accept condensed water, described disk body is provided with a through hole, for described semiconductor subassembly heat end through and stretch in described accommodation space.
Preferably, described drip tray also comprise from described disk body to extend away from described air outlet direction in two block water plates be oppositely arranged, the two ends of described two block water plates connect with described coaming plate respectively, and enclose the container cavity being formed and heat end and condensed water described in accommodation, to be lowered the temperature to the described end that heats by described condensed water.
Preferably, the vertical range of described two block water plates and described disk body be greater than described in heat and hold and the vertical range of described disk body.
In addition, for achieving the above object, the present invention also provides a kind of control method of air-conditioner, and the control method of described air-conditioner comprises the following steps:
Open sleep pattern, and detect indoor environment temperature;
Obtain the output refrigerating capacity that the running frequency of air-conditioner is corresponding;
When described indoor environment temperature is greater than preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, opens the semiconductor subassembly be arranged in air-conditioner shell and carry out temperature-compensating.
Preferably, described preset temperature comprises the first preset temperature and the second preset temperature, described when described indoor environment temperature is greater than preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, the step that the unlatching semiconductor subassembly be arranged in air-conditioner shell carries out temperature-compensating comprises:
More described indoor environment temperature and the first preset temperature, described output refrigerating capacity and the predetermined size exported between refrigerating capacity;
When described indoor environment temperature is greater than the first preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, starts first order semiconductor and carry out one-level temperature-compensating.
Preferably, described second preset temperature is greater than described first preset temperature, described when described indoor environment temperature is greater than preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, the step that the unlatching semiconductor subassembly be arranged in air-conditioner shell carries out temperature-compensating comprises:
More described indoor environment temperature and the second preset temperature, described output refrigerating capacity and the predetermined size exported between refrigerating capacity;
When described indoor environment temperature is greater than the second preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, starts second level semiconductor and carry out secondary temperature-compensating.
Preferably, described indoor environment temperature and the first preset temperature, described output refrigerating capacity and predetermined export the step of size between refrigerating capacity after also comprise:
If described indoor environment temperature is less than described first preset temperature and reaches the scheduled time, then the compressor controlling air-conditioner is out of service.
The present invention by arranging compressor, temperature sensor, semiconductor subassembly and controller in the housing of air-conditioner, utilize temperature sensor to detect indoor environment temperature and to be supplied to described controller, output refrigerating capacity corresponding for the preset frequency of air-conditioner operation is supplied to described controller, and utilize controller to carry out thermoelectric cooling to control semiconductor subassembly, air-conditioner can be made automatically to complete temperature-compensating, thus provide comfortable sleep temperature to user.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of air-conditioner of the present invention;
Fig. 2 is the structural representation of semiconductor subassembly and drip tray in Fig. 1;
Fig. 3 is the schematic flow sheet of control method one embodiment of air-conditioner of the present invention;
Fig. 4 is the refinement schematic flow sheet of step S103 in Fig. 3.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Detailed description of the invention
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The invention provides a kind of air-conditioner 1, with reference to Fig. 1, in one embodiment, described air-conditioner 1 comprises housing 2 and compressor (not shown), temperature sensor (not shown), semiconductor subassembly 4 and the controller (not shown) be located in described housing 2.In the present embodiment, the top of described housing 2 has an air inlet (not shown), described TEMP implement body is positioned at described air inlet position, for detecting indoor environment temperature and being supplied to described controller, described compressor is used for running with preset frequency and output refrigerating capacity corresponding for described preset frequency being supplied to described controller, described semiconductor subassembly 4 for judge described indoor environment temperature at described controller and be greater than preset temperature and described output refrigerating capacity be less than predetermined export refrigerating capacity time, start thermoelectric cooling and temperature-compensating is carried out to air-conditioner 1.
The present invention by arranging compressor, temperature sensor, semiconductor subassembly 4 and controller in the housing 2 of air-conditioner 1, utilize temperature sensor to detect indoor environment temperature and to be supplied to described controller, output refrigerating capacity corresponding to the preset frequency run by air-conditioner 1 is supplied to described controller, and control semiconductor subassembly 4 by controller and carry out thermoelectric cooling, air-conditioner 1 can be made automatically to complete temperature-compensating, thus provide comfortable sleep temperature to user.
Further, see figures.1.and.2, described housing 2 is also provided with an air outlet 5, is provided with a drip tray 6 in described housing 2.In this preferred embodiment, described semiconductor subassembly 4 comprises first order semiconductor (not shown) and second level semiconductor (not shown), described preset temperature comprises the first preset temperature and the second preset temperature, and described second preset temperature is greater than described first preset temperature.Described first order semiconductor and second level semiconductor equalizing have the refrigeration end 10 that is oppositely arranged and heat end 20, described in heat end 20 and be positioned at described drip tray 6, described refrigeration end 10 is positioned at described air outlet 5 position.Like this, by the described end 20 that heats is located in described drip tray 6, utilizes the cold service of condensed water can fall heat to heating end 20, thus further increase the refrigeration of refrigeration end 10.By described refrigeration end 10 being located at the position of described air outlet 5, can making to turn to cold wind from the wind of described air outlet 5 blowout is maximum, thus improving the refrigeration of air-conditioner 1 pair of indoor environment.Described first order semiconductor is used for, when described indoor environment temperature is greater than the first preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, carries out thermoelectric cooling and starting one-level temperature-compensating program; Described second level semiconductor is used for, when described indoor environment temperature is greater than the second preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, carries out thermoelectric cooling and starting secondary temperature-compensating program.Should be understood that, in the present embodiment, described first order semiconductor is applicable to following condition, as: when the first default environment temperature is 27 DEG C, and indoor environment temperature is when being 28 DEG C, 29 DEG C or 30 DEG C etc., then start one-level temperature-compensating program, indoor environment temperature being down to first presets under environment temperature or the first default environment temperature, as successively lowered the temperature with the grade of 0.5 DEG C until reach first to preset under environment temperature or the first preset temperature 1 DEG C, be understandable that, concrete numerical value can rationally be arranged according to actual needs, is not limited to the present embodiment.Described second level semiconductor is applicable to following condition, as: when the second default environment temperature is 30 DEG C, and indoor environment temperature is when being 31 DEG C, 32 DEG C or 33 DEG C etc., then start secondary temperature-compensating program, indoor environment temperature is down to second and presets environment temperature to preset under environment temperature or the first preset temperature 1 DEG C down to first, as successively lowered the temperature with the grade of 1 DEG C until reach first to preset under environment temperature or the first preset temperature 1 DEG C, be understandable that, concrete numerical value can rationally be arranged according to actual needs, is not limited to the present embodiment.
Further, with reference to Fig. 2, the coaming plate 63 that described drip tray 6 comprises the support 61 be connected with described housing 2, the disk body 62 extended to described housing 2 center from described support 61 and extends away from air outlet 5 direction around described disk body 62 1 circumference.Described disk body 62 and described coaming plate 63 form an accommodation space 64 to accept condensed water, and described disk body 62 is provided with a through hole 65, for described semiconductor subassembly 4 heat end 20 through and stretch in described accommodation space 64.
Further, described drip tray 6 also comprise from described disk body 62 to extend away from described air outlet 5 direction in two block water plates 66 be oppositely arranged, the two ends of described two block water plates 66 connect with described coaming plate 63 respectively, and enclose the container cavity 67 being formed and heat end 20 and condensed water described in accommodation, to be lowered the temperature to the described end 20 that heats by described condensed water.In this preferred embodiment, described in described two block water plates 66 and the vertical range of described disk body 62 are greater than, heat the vertical range of end 20 and described disk body 62.Like this, condensed water can be concentrated in described container cavity 67, and raise the water level in described container cavity 67, thus can improve the described cooling-down effect heating end 20.
The present invention also provides a kind of control method of air-conditioner, and with reference to Fig. 3, in one embodiment, the control method of described air-conditioner comprises the following steps:
Step S101, opens sleep pattern, and detects indoor environment temperature;
In the present embodiment, after user presses sleep pattern button by remote controller, namely air-conditioner 1 opens sleep pattern, and detects indoor environment temperature by temperature sensor.Be understandable that, the detection of indoor environment temperature can be Real-Time Monitoring also can be detect once every the scheduled time.
Step S102, obtains the output refrigerating capacity that the running frequency of air-conditioner 1 is corresponding;
In this preferred embodiment, the controller of air-conditioner 1 obtains the running frequency of air-conditioner 1, and obtains output refrigerating capacity corresponding to described running frequency.Setting a/C-Status air quantity is Q=300m 3/ h (cubic meter/per hour), the frequency of compressor operating is 20 ~ 23Hz, and corresponding output refrigerating capacity is 900 to 1200W (watt), and indoor environment temperature is at about 27 DEG C.
Step S103, when described indoor environment temperature is greater than preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, opens the semiconductor subassembly 4 be arranged in the housing 2 of air-conditioner 1 and carries out temperature-compensating.
In this preferred embodiment, as reached 30 DEG C at hotter indoor environment temperature in summer, when the frequency of compressor operating is 20 ~ 23Hz, when output refrigerating capacity is less than 800W, then can start semiconductor subassembly 4 and carry out temperature-compensating, as being Q=300m at a/C-Status air quantity 3during/h, the temperature at air outlet 5 place of air-conditioner 1 is 28 DEG C, then after the thermoelectric cooling of described semiconductor subassembly 4, twice to 26 DEG C falls in temperature, thus reaches the effect of temperature-compensating.
In one embodiment, as shown in Figure 4, on the basis of the embodiment of above-mentioned Fig. 3, in the present embodiment, described preset temperature comprises the first preset temperature and the second preset temperature, and described step S103 comprises:
Step S1031, more described indoor environment temperature and the first preset temperature, described output refrigerating capacity and the predetermined size exported between refrigerating capacity;
In this preferred embodiment, described controller simultaneously more described indoor environment temperature and the first preset temperature as the size between 27 DEG C, and described output refrigerating capacity and predeterminedly export refrigerating capacity as the size between 800W.
Step S1032, when described indoor environment temperature is greater than the first preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, starts first order semiconductor and carries out one-level temperature-compensating.
In the present embodiment, when described indoor environment temperature be greater than the first preset temperature as 27 DEG C and as described in output refrigerating capacity be less than predetermined export refrigerating capacity as 800W time, then start first order semiconductor and carry out one-level temperature-compensating program.In this preferred embodiment, when the first default environment temperature is 27 DEG C, and indoor environment temperature is when being 28 DEG C, 29 DEG C or 30 DEG C etc., then start one-level temperature-compensating program, indoor environment temperature being down to first presets under environment temperature or the first default environment temperature, as successively lowered the temperature with the grade of 0.5 DEG C until reach first to preset under environment temperature 27 DEG C or the first preset temperature 1 DEG C as 26 DEG C, be understandable that, each concrete numerical value can rationally be arranged according to actual needs, is not limited to the present embodiment.
In one embodiment, as shown in Figure 4, on the basis of the embodiment of above-mentioned Fig. 3, in the present embodiment, described second preset temperature is greater than described first preset temperature, and described step S103 comprises:
Step S1033, more described indoor environment temperature and the second preset temperature, described output refrigerating capacity and the predetermined size exported between refrigerating capacity;
In the present embodiment, when described indoor environment temperature is greater than the first preset temperature, described controller continues more described indoor environment temperature and the second preset temperature as the size between 30 DEG C, and described output refrigerating capacity and the predetermined size exported between refrigerating capacity 800W.
Step S1034, when described indoor environment temperature is greater than the second preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, starts second level semiconductor and carries out secondary temperature-compensating.
In the present embodiment, when described indoor environment temperature be greater than the second preset temperature as 30 DEG C and as described in output refrigerating capacity be less than predetermined export refrigerating capacity as 800W time, then start second level semiconductor and carry out secondary temperature-compensating program.In this preferred embodiment, when the second default environment temperature is 30 DEG C, and indoor environment temperature is when being 31 DEG C, 32 DEG C or 33 DEG C etc., then start secondary temperature-compensating program, indoor environment temperature being down to second to preset below environment temperature until first to preset under environment temperature or the first preset temperature 1 DEG C, as successively lowered the temperature with the grade of 1 DEG C until reach first to preset under environment temperature 27 DEG C or the first preset temperature 1 DEG C as 26 DEG C, be understandable that, each concrete numerical value can rationally be arranged according to actual needs, is not limited to the present embodiment.
In one embodiment, as shown in Figure 4, on the basis of the embodiment of above-mentioned Fig. 3, in the present embodiment, also comprise after described step S1031:
Step S1035, if described indoor environment temperature is less than described first preset temperature and reaches the scheduled time, then the compressor controlling air-conditioner 1 is out of service.
In the present embodiment, if temperature sensor detects in real time or the indoor environment temperature that detects every the scheduled time in the scheduled time as in 30min, be all less than the first predetermined temperature as 27 DEG C, then to control the compressor of air-conditioner 1 out of service for controller.
These are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.

Claims (10)

1. an air-conditioner, it is characterized in that, described air-conditioner comprises housing and is located at the compressor in described housing, temperature sensor, semiconductor subassembly and controller, described temperature sensor is for detecting indoor environment temperature and being supplied to described controller, described compressor is used for running with preset frequency and output refrigerating capacity corresponding for described preset frequency being supplied to described controller, described semiconductor subassembly be used for described controller judge described indoor environment temperature be greater than preset temperature and described output refrigerating capacity be less than predetermined export refrigerating capacity time, start thermoelectric cooling and temperature-compensating is carried out to air-conditioner.
2. air-conditioner as claimed in claim 1, it is characterized in that, described semiconductor subassembly comprises first order semiconductor and second level semiconductor, described preset temperature comprises the first preset temperature and the second preset temperature, and described second preset temperature is greater than described first preset temperature, described first order semiconductor is used for, when described indoor environment temperature is greater than the first preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, carries out thermoelectric cooling and starting one-level temperature-compensating program; Described second level semiconductor is used for, when described indoor environment temperature is greater than the second preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, carries out thermoelectric cooling and starting secondary temperature-compensating program.
3. air-conditioner as claimed in claim 2, it is characterized in that, described first order semiconductor and second level semiconductor have the refrigeration end that is oppositely arranged and heat end, described housing is provided with an air outlet, a drip tray is provided with in described housing, the described end that heats is positioned at described drip tray, and described refrigeration end is positioned at described air outlet position.
4. air-conditioner as claimed in claim 3, it is characterized in that, the coaming plate that described drip tray comprises the support be connected with described housing, the disk body extended to described casing center from described support and extends away from air outlet direction around described disk body one circumference, described disk body and described coaming plate form an accommodation space to accept condensed water, described disk body is provided with a through hole, for described semiconductor subassembly heat end through and stretch in described accommodation space.
5. air-conditioner as claimed in claim 4, it is characterized in that, described drip tray also comprise from described disk body to extend away from described air outlet direction in two block water plates be oppositely arranged, the two ends of described two block water plates connect with described coaming plate respectively, and enclose the container cavity being formed and heat end and condensed water described in accommodation, to be lowered the temperature to the described end that heats by described condensed water.
6. air-conditioner as claimed in claim 5, is characterized in that, heats and hold and the vertical range of described disk body described in the vertical range of described two block water plates and described disk body is greater than.
7. a control method for air-conditioner, is characterized in that, the control method of described air-conditioner comprises the following steps:
Open sleep pattern, and detect indoor environment temperature;
Obtain the output refrigerating capacity that the running frequency of air-conditioner is corresponding;
When described indoor environment temperature is greater than preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, opens the semiconductor subassembly be arranged in air-conditioner shell and carry out temperature-compensating.
8. the control method of air-conditioner as claimed in claim 7, it is characterized in that, described preset temperature comprises the first preset temperature and the second preset temperature, described when described indoor environment temperature is greater than preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, the step that the unlatching semiconductor subassembly be arranged in air-conditioner shell carries out temperature-compensating comprises:
More described indoor environment temperature and the first preset temperature, described output refrigerating capacity and the predetermined size exported between refrigerating capacity;
When described indoor environment temperature is greater than the first preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, starts first order semiconductor and carry out one-level temperature-compensating.
9. the control method of air-conditioner as claimed in claim 8, it is characterized in that, described second preset temperature is greater than described first preset temperature, described when described indoor environment temperature is greater than preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, the step that the unlatching semiconductor subassembly be arranged in air-conditioner shell carries out temperature-compensating comprises:
More described indoor environment temperature and the second preset temperature, described output refrigerating capacity and the predetermined size exported between refrigerating capacity;
When described indoor environment temperature is greater than the second preset temperature and described output refrigerating capacity is less than predetermined output refrigerating capacity, starts second level semiconductor and carry out secondary temperature-compensating.
10. the control method of air-conditioner as claimed in claim 8, is characterized in that, described indoor environment temperature and the first preset temperature, described output refrigerating capacity and predetermined export the step of size between refrigerating capacity after also comprise:
If described indoor environment temperature is less than described first preset temperature and reaches the scheduled time, then the compressor controlling air-conditioner is out of service.
CN201510064890.7A 2015-02-06 2015-02-06 The control method of air conditioner and air conditioner Active CN104633879B (en)

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CN105757912B (en) * 2016-04-27 2018-11-30 合肥工业大学智能制造技术研究院 A kind of quick accuracy controlling system of museum's showcase microenvironment temperature and humidity
CN111457545A (en) * 2020-04-21 2020-07-28 宁波奥克斯电气股份有限公司 Compressor control method and device and air conditioner
CN113154560A (en) * 2021-04-16 2021-07-23 宁波奥克斯电气股份有限公司 Air conditioner and control method and device of air conditioner

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