CN114893828B - Air conditioner - Google Patents
Air conditioner Download PDFInfo
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- CN114893828B CN114893828B CN202210324187.5A CN202210324187A CN114893828B CN 114893828 B CN114893828 B CN 114893828B CN 202210324187 A CN202210324187 A CN 202210324187A CN 114893828 B CN114893828 B CN 114893828B
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- air
- pretreatment module
- temperature
- diversion channel
- semiconductor refrigeration
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/0007—Indoor units, e.g. fan coil units
- F24F1/0071—Indoor units, e.g. fan coil units with means for purifying supplied air
- F24F1/0076—Indoor units, e.g. fan coil units with means for purifying supplied air by electric means, e.g. ionisers or electrostatic separators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F8/00—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying
- F24F8/30—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by ionisation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A50/00—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
- Y02A50/20—Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
The application discloses an air conditioner, wherein an air return opening and an air outlet are arranged on an indoor casing, an indoor heat exchanger is arranged on an air duct communicated with the air return opening and the air outlet, a negative oxygen water ion generating module is arranged at the air outlet and comprises a transmitting electrode and a semiconductor refrigerating part, the semiconductor refrigerating part is used for generating condensed water for ionization of the transmitting electrode, an air pretreatment module is arranged on an air flow path of air in the air duct flowing towards the negative oxygen water ion generating module and used for preheating or precooling air flowing through the semiconductor refrigerating part so as to improve the temperature difference of surrounding air of the semiconductor refrigerating part, improve the condensation capacity of the air, ensure that the transmitting electrode can still acquire enough water for tip discharge to generate negative oxygen water ions even under the condition of lower humidity, and improve the air purifying effect of the air conditioner.
Description
Technical Field
The application relates to the technical field of air conditioners, in particular to an air conditioner with an air purifying function.
Background
In the air conditioner using nano water ions as an air purifying principle, on one hand, as the main purifying factor of the nano water ion module is hydroxyl free radicals, the sterilizing effect is better, but the purifying effect of particles is poorer; on the other hand, the nanometer water ion module is integrally arranged in an air conditioner, the nanometer water ion outlet is connected to an air outlet of the air conditioner through a pipeline, the module is not provided with a power system, nanometer water ions are sucked to the air outlet of the air conditioner from the module only by virtue of micro negative pressure generated by the wind speed of the air outlet of the air conditioner, and due to the instability of hydroxyl free radicals, the nanometer water ions are decomposed more in the transmission process and do not reach indoor air to achieve the effect of purifying the air.
The negative oxygen water ion technology refers to nanoscale electrostatic atomized water particles, and is characterized in that water drops on a tip electrode are subjected to high-voltage discharge to gradually split into water mist, the water mist is decomposed into nanoscale water ions with high activity, the nanoscale water ions contain a large amount of high-activity hydroxyl free radicals, the hydroxyl free radicals have extremely high oxidability, and bacteria, microorganisms, formaldehyde, VOC and other components in the air can be decomposed and removed.
The negative oxygen water ions are generated by using a semiconductor refrigeration technology, cooling a transmitting electrode by using a semiconductor refrigeration part, absorbing water from ambient air by the cooled transmitting electrode, and generating tip discharge at the transmitting tip of the transmitting electrode by using negative high voltage to generate the negative oxygen water ions. The water supply mode of utilizing the emitter electrode to cool down and generate condensed water is difficult for the emitter electrode to generate condensed water under the condition of low air humidity, negative oxygen water ions cannot be generated, and the emitter electrode is used as a grounding electrode for emitting under the influence of semiconductor refrigeration, and positive high voltage is used for the electrode, so that the generated negative oxygen water ions do not contain negative ion components, and the functional effect of negative ions is lacked.
The above information disclosed in this background section is only for enhancement of understanding of the background section of the application and therefore it may not form the prior art that is already known to those of ordinary skill in the art.
Disclosure of Invention
In order to solve the problems pointed out in the background art, the application provides an air conditioner, wherein a semiconductor refrigerating part is not used for cooling a transmitting electrode any more, but is used for generating condensed water, the condensed water is led to the transmitting tip of the transmitting electrode by utilizing the hydrophilicity of the transmitting electrode, the temperature difference at the semiconductor refrigerating part is improved by an air pretreatment module, the capability of the semiconductor refrigerating part for generating the condensed water is improved, further, the transmitting electrode is ensured to still obtain enough moisture for tip discharge to generate negative oxygen water ions even under the condition of lower humidity, and the air purifying effect of the air conditioner is improved.
In order to achieve the aim of the application, the application is realized by adopting the following technical scheme:
in some embodiments of the present application, there is provided an air conditioner including:
the indoor shell is provided with an air return opening and an air outlet, and an air duct communicated with the air return opening and the air outlet is provided with an indoor heat exchanger;
the negative oxygen water ion generation module is arranged at the air outlet and comprises an emission electrode and a semiconductor refrigeration part, wherein the semiconductor refrigeration part is used for generating condensed water for ionization of the emission electrode;
and the air pretreatment module is arranged on an air flow path of the air in the air duct for flowing to the negative oxygen water ion generation module and is used for preheating or precooling the air flowing through the semiconductor refrigeration part so as to improve the temperature difference of the ambient air of the semiconductor refrigeration part.
In some embodiments of the present application, the negative oxygen water ion generating module further includes a housing, the emitter electrode and the semiconductor refrigeration unit are both disposed in the housing, a negative oxygen water ion release opening exposing a tip of the emitter electrode is disposed on the housing, and the negative oxygen water ion release opening faces the air outlet;
the shell is also provided with a vent, a diversion channel is arranged in the air channel, the inlet of the diversion channel is positioned at the upstream of the indoor heat exchanger, and the outlet of the diversion channel is communicated with the vent;
the air pretreatment module is arranged on an air flow passage between the inlet of the diversion channel and the semiconductor refrigerating part.
In some embodiments of the present application, the system obtains the humidity Rh at the air outlet;
when Rh is more than or equal to Rh1, the air pretreatment module is closed;
when Rh is smaller than Rh1, if the indoor unit of the air conditioner is in a refrigeration working mode, the air pretreatment module starts a preheating mode; if the indoor unit of the air conditioner is in a heating working mode, the air pretreatment module starts a precooling mode.
In some embodiments of the application, the heating/cooling capacity of the air pretreatment module is inversely proportional to Rh.
In some embodiments of the present application, the temperature T of the air outlet 0 The difference between the temperature T in the diversion channel and the temperature T in the diversion channel is delta T;
the heating/cooling capacity of the air pretreatment module is inversely proportional to Δt.
In some embodiments of the present application, at the temperature T of the air outlet 0 When the difference delta T between the air pretreatment module and the temperature T in the diversion channel is smaller than a first set threshold T1, the air pretreatment module is started;
at the temperature T of the air outlet 0 And when the difference Deltat between the temperature Deltat and the temperature T in the diversion channel is larger than a second set threshold T2, the air pretreatment module is closed.
In some embodiments of the present application, at the temperature T of the air outlet 0 When the difference delta T between the air pretreatment module and the temperature T in the diversion channel is larger than 0, the air pretreatment module pre-cools the air flowing through the semiconductor refrigeration part;
at the temperature T of the air outlet 0 When the difference delta T between the temperature delta T and the temperature T in the diversion channel is smaller than 0, the air pretreatment module preheats the air flowing through the semiconductor refrigeration part.
In some embodiments of the present application, the air pretreatment module includes a semiconductor refrigeration sheet, where a first heat exchange plate is disposed on one side of the semiconductor refrigeration sheet, and a second heat exchange plate is disposed on the other side of the semiconductor refrigeration sheet;
the first heat exchange plate is positioned in an air flow channel between the inlet of the diversion channel and the semiconductor refrigeration part;
the second heat exchange plate is positioned outside the air flow channel between the inlet of the diversion channel and the semiconductor refrigeration part.
In some embodiments of the present application, the first heat exchange plates have a plurality of first ventilation gaps formed between two adjacent first heat exchange plates and are arranged at intervals;
the second heat exchange plates are arranged at intervals, and a second ventilation gap is formed between two adjacent second heat exchange plates.
In some embodiments of the present application, a water storage gap is formed between one end of the emitter electrode and the semiconductor refrigeration part, the emitter electrode has hydrophilicity, condensed water generated by the semiconductor refrigeration part is stored in the water storage gap, and the emitter electrode leads the condensed water in the water storage gap to an emitter tip thereof.
Compared with the prior art, the application has the advantages and positive effects that:
in the air conditioner disclosed by the application, a diversion channel is separated from an indoor air duct and is specially used for flowing to a negative oxygen water ion generating module arranged at an air outlet, and an air pretreatment module is arranged in the diversion channel and is used for preheating or precooling air flowing through a semiconductor refrigerating part so as to improve the temperature difference of ambient air of the semiconductor refrigerating part and the capability of the semiconductor refrigerating part for generating condensed water, thereby ensuring that a transmitting electrode can still acquire enough water for tip discharge to generate negative oxygen water ions even under the condition of lower humidity and improving the air purifying effect of the air conditioner.
Other features and advantages of the present application will become apparent upon review of the detailed description of the application in conjunction with the drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it will be obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort to a person skilled in the art.
Fig. 1 is a schematic structural view of an indoor unit of an air conditioner according to an embodiment;
fig. 2 is a schematic view illustrating a structure of an indoor unit of an air conditioner according to an embodiment, in which a top cover plate is omitted;
fig. 3 is a schematic view of a gas flow path in an indoor unit of an air conditioner according to an embodiment;
fig. 4 is a schematic diagram of a negative oxygen water ion generating module and an air pretreatment module of an air conditioner according to an embodiment;
FIG. 5 is a control flow diagram of an oxygen negative water ion generating module and an air pre-treatment module of an air conditioner according to an embodiment;
FIG. 6 is a schematic view of a gas flow path of an air pretreatment module according to the first embodiment disposed in a piping box;
FIG. 7 is a schematic view showing a structure in which an air pretreatment module according to the first embodiment is provided in a piping box;
FIG. 8 is a schematic view showing the installation structure of an air pretreatment module and a negative oxygen water ion generating module according to the first embodiment;
fig. 9 is a schematic structural view of a negative oxygen water ion generating module according to the first embodiment;
FIG. 10 is an exploded view of a negative oxygen water ion generating module according to the first embodiment;
FIG. 11 is a schematic diagram of a gas flow path of an air pretreatment module according to a second embodiment disposed within an oxygen water ion module;
FIG. 12 is a schematic structural view of a negative oxygen water ion generating module according to a second embodiment;
FIG. 13 is an exploded view of a negative oxygen water ion generating module according to a second embodiment;
fig. 14 is a schematic structural view of a connection plate according to an embodiment;
fig. 15 is a schematic structural view of an air pretreatment module according to an embodiment.
Reference numerals:
100-indoor machine shell, 110-return air inlet, 120-air outlet, 130-indoor heat exchanger, 140-fan, 150-partition plate, 161-front cavity, 162-rear cavity, 170-piping box, 171-air inlet, 180-connecting plate, 181-second air inlet, 182-mounting part and 190-inner bottom wall;
200-negative oxygen water ion generating module, 210-emission electrode, 220-semiconductor refrigerating part, 230-negative high voltage power supply part, 240-shell, 241-first installation cavity, 242-second installation cavity, 243-partition board, 244-negative oxygen water ion releasing port, 245-wiring port, 246-lug, 247-bottom shell, 2471-boss, 248-cover, 2481-buckle, 250-conductive plate, 260-water storage gap, 270-electrode fixing seat and 280-first ventilation port;
300-an air pretreatment module, 310-a semiconductor refrigerating sheet, 320-a first heat exchange plate, 321-a first ventilation gap, 330-a second heat exchange plate, 331-a second ventilation gap;
400-diversion channel.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the application. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
Basic operation principle of air conditioner
The air conditioner of the present application performs a refrigerating cycle of the air conditioner by using a compressor, a condenser, an expansion valve, and an evaporator. The refrigeration cycle includes a series of processes involving compression, condensation, expansion, and evaporation, and refrigerating or heating an indoor space.
The low-temperature low-pressure refrigerant enters the compressor, the compressor compresses the refrigerant gas into a high-temperature high-pressure state, and the compressed refrigerant gas is discharged. The discharged refrigerant gas flows into the condenser. The condenser condenses the compressed refrigerant into a liquid phase, and heat is released to the surrounding environment through the condensation process.
The expansion valve expands the liquid-phase refrigerant in a high-temperature and high-pressure state formed by condensation in the condenser into a low-pressure liquid-phase refrigerant. The evaporator evaporates the refrigerant expanded in the expansion valve and returns the refrigerant gas in a low-temperature and low-pressure state to the compressor. The evaporator may achieve a cooling effect by exchanging heat with a material to be cooled using latent heat of evaporation of a refrigerant. The air conditioner may adjust the temperature of the indoor space throughout the cycle.
The outdoor unit of the air conditioner refers to a portion of a refrigeration cycle including a compressor and an outdoor heat exchanger, the indoor unit of the air conditioner includes an indoor heat exchanger, and an expansion valve may be provided in the indoor unit or the outdoor unit.
The indoor heat exchanger and the outdoor heat exchanger function as a condenser or an evaporator. When the indoor heat exchanger is used as a condenser, the air conditioner performs a heating mode; when the indoor heat exchanger is used as an evaporator, the air conditioner performs a cooling mode.
The mode of converting the indoor heat exchanger and the outdoor heat exchanger into a condenser or an evaporator generally adopts a four-way valve, and the arrangement of a conventional air conditioner is specifically referred to and will not be described herein.
The refrigeration working principle of the air conditioner is as follows: the compressor works to enable the interior of an indoor heat exchanger (in an indoor unit, an evaporator at the moment) to be in an ultralow pressure state, liquid refrigerant in the indoor heat exchanger is rapidly evaporated to absorb heat, air blown out by an indoor fan is cooled by an indoor heat exchanger coil and then changed into cold air to be blown into the indoor, the evaporated refrigerant is pressurized by the compressor and then condensed into liquid state in a high-pressure environment in an outdoor heat exchanger (in an outdoor unit, a condenser at the moment), heat is released, the heat is emitted to the atmosphere by the outdoor fan, and the refrigerating effect is achieved through circulation.
The heating working principle of the air conditioner is as follows: the gaseous refrigerant is pressurized by the compressor to become high-temperature high-pressure gas, and enters the indoor heat exchanger (a condenser at the moment), so that the gaseous refrigerant is condensed, liquefied and released heat to become liquid, and meanwhile, the indoor air is heated, so that the aim of improving the indoor temperature is fulfilled. The liquid refrigerant is decompressed by the throttling device, enters the outdoor heat exchanger (an evaporator at the moment), evaporates, gasifies and absorbs heat to become gas, and simultaneously absorbs heat of outdoor air (the outdoor air becomes colder) to become gaseous refrigerant, and enters the compressor again to start the next cycle.
[ indoor Unit ]
The outer contour of the indoor unit is formed by an indoor unit casing 100, referring to fig. 1 to 3, the indoor unit casing 100 is in a rectangular structure, one side of the indoor unit casing 100 is provided with an air return opening 110, the other side is provided with an air outlet 120, the air return opening 110 is directly communicated with the air outlet 120 from front to back to form an air channel, and an indoor heat exchanger 130 is arranged on the air channel where the air return opening 110 is communicated with the air outlet 120.
Indoor air flows into the inner cavity of the indoor casing 100 through the air return opening 110, exchanges heat through the indoor heat exchanger 130, and flows into the room through the air outlet 120, so that the refrigerating or heating adjustment of the indoor air is realized.
A partition plate 150 is provided in the indoor unit 100, and the partition plate 150 partitions an inner cavity of the indoor unit 100 into a rear cavity 162 and a front cavity 161.
The rear chamber 162 is provided with a fan 140, and the return air inlet 110 is communicated with the rear chamber 162. An indoor heat exchanger 130 is arranged in the front cavity 161, and the air outlet 120 is communicated with the front cavity 161.
[ negative oxygen Water ion generating Module ]
With continued reference to fig. 1-3, the negative oxygen water ion generating module 200 is configured to generate negatively charged nano-water ions that carry negative charges and hydroxyl radicals generated by ionizing water.
The negative charge can charge the particles in the air and promote the particles in the air to agglomerate, the volume and the weight are increased and then the particles are settled to the ground, or the charged particles are adsorbed to the nearby zero potential (the ground), so that the particles such as PM2.5 in the air are removed.
Hydroxyl radical generated by high-voltage ionization in nano water ions has extremely strong oxidizing property, when the hydroxyl radical contacts with bacterial viruses on the surfaces of particles or bacterial viruses in the air, the hydroxyl radical abstracts hydrogen elements from cell walls of bacteria, so that the cell wall structure is destroyed, cells are deactivated, and proteins are denatured due to the strong oxidizing effect of the hydroxyl radical, so that the effects of sterilization and disinfection are achieved.
The negative oxygen water ion generating module 200 is arranged at the air outlet 120, and the generated nanometer water ions are directly blown into a room, so that the air purifying effect is improved.
Referring to fig. 4, the negative oxygen water ion generating module 200 includes an emitter electrode 210, a semiconductor refrigerating part 220, and a negative high voltage power supply part 230.
The semiconductor refrigerating part 220 is used for generating condensed water for ionization of the emitter electrode 210, and the negative high voltage power supply part 230 provides negative high voltage for the emitter electrode 210 to excite moisture on the emitter electrode 210 through high voltage ionization, so as to generate negatively charged nano water ions.
In some embodiments of the present application, the emitter electrode 210 has hydrophilicity so as to guide condensed water generated by the semiconductor refrigerating unit 220 to the emitter tip thereof, and the emitter electrode 210 can ionize and excite negatively charged nano-water ions at the emitter tip after being electrified with negative high voltage.
The emitter electrode 210 may be made of a water absorbing material, and a silver ion sterilizing material may be added inside the water absorbing material to kill bacteria and viruses and the like growing inside the water absorbing material after long-term use.
The semiconductor refrigeration unit 220 is used for generating condensed water, and referring to fig. 11, a water storage gap 260 is formed between one end of the emitter electrode 210 and the semiconductor refrigeration unit 220, the condensed water generated by the semiconductor refrigeration unit 220 is stored in the water storage gap 260, and the emitter electrode 210 directs the condensed water in the water storage gap 260 to the emitter tip thereof by using hydrophilicity.
The ability of the semiconductor refrigeration unit 220 to generate condensed water is related to the temperature difference of the ambient air thereof, and the greater the temperature difference, the greater the ability to generate condensed water; conversely, the smaller the temperature difference, the weaker the ability to generate condensed water.
In some embodiments of the present application, referring to fig. 9 and 10, the negative oxygen water ion generating module 200 further includes a housing 240, and the emitter electrode 210, the semiconductor refrigeration part 220, and the negative high voltage power supply part 230 are all disposed in the housing 240.
The casing 240 may be made of PP, PVC, nylon, PTFE, or other insulating materials, and the casing 240 is provided with a negative oxygen water ion release opening 244 for exposing the emission tip of the emission electrode 210, where the negative oxygen water ion release opening 244 faces the air outlet 120.
The negative oxygen water ion discharge port 244 is bell mouth-shaped, and can effectively avoid static electricity accumulation on the shell 240 by gradually amplifying the ion emission port, so that more high-concentration negative oxygen ions can be discharged.
When the air in the air duct flows out through the air outlet 120, the air does not directly blow the transmitting electrode 210, and the condensation of the air by the semiconductor refrigeration part 220 is prevented from being influenced by the air outlet temperature.
In some embodiments of the present application, a partition 243 is disposed in the inner cavity of the housing 240, the partition 243 divides the inner cavity of the housing 240 into a first mounting cavity 241 and a second mounting cavity 242, and an opening (not shown) for allowing gas to circulate is disposed on the partition 243.
The emitter electrode 210 and the semiconductor refrigerating unit 220 are disposed in the first mounting chamber 241, and the negative high voltage power supply unit 230 is disposed in the second mounting chamber 242.
The housing 240 is provided with a vent (denoted as a first vent 280), and the first vent 280 communicates with the second mounting cavity 242.
Air outside the negative oxygen ion generating module 200 flows into the inner cavity of the housing 240 through the first ventilation opening 280, sequentially flows through the second installation cavity 242 and the first installation cavity 241 to the semiconductor refrigerating part 220, generates condensed water at the semiconductor refrigerating part 220, supplies the condensed water to the emission tip of the emission electrode 210, and flows out of the negative oxygen ion excited by the high-voltage ionization through the release opening 244, and flows the air outlet 120 into the indoor space.
In some embodiments of the present application, referring to fig. 10, the housing 240 includes a bottom shell 247 and a cover 248, a boss 2471 is provided on the bottom shell 247, a buckle 2481 is provided on the cover 248, and a fixed connection between the bottom shell 247 and the cover 248 is achieved through a clamping connection between the buckle 2481 and the boss 2471.
A wiring port 245 is provided on a side edge of the bottom shell 247, and a negative oxygen ion release port 244 is provided on the cover 248.
In some embodiments of the present application, referring to fig. 11, an insulated electrode fixing base 270 is disposed in the first mounting cavity 241, a jack (not labeled) is disposed on the electrode fixing base 270, and the emitter electrode 210 is inserted into the jack.
The top of the electrode holder 270 is provided with a conductive plate 250, the conductive plate 250 is provided with a contact claw (not shown) extending into the jack to contact with the emitter electrode 210, and the conductive plate 250 is electrically connected with the negative high voltage power supply part 230.
The semiconductor refrigeration part 220 is arranged at the bottom of the electrode fixing seat 270 and is opposite to the jack, and the water storage gap 260 is formed between the semiconductor refrigeration part 220 and the bottom of the jack.
In some embodiments of the present application, referring to fig. 7 to 9, a connecting plate 180 is disposed in an inner cavity of the indoor housing 100 and is connected to one end of the indoor heat exchanger 130, a lug 246 is disposed on the housing 240, and the lug 246 is fixedly disposed on the connecting plate 180 through a connecting member such as a screw, so as to realize the fixed installation of the negative oxygen ion generating module 200 at the air outlet 120.
[ air pretreatment Module ]
Since the negative oxygen water ion generating module 200 is disposed at the air outlet 120, the temperature of the ambient air is greatly affected by the air outlet temperature of the air outlet, which affects the condensation capacity of the semiconductor refrigeration unit 220, the present embodiment solves this problem by the air pretreatment module 300.
In some embodiments of the present application, an air pretreatment module 300 is disposed on an air flow path of air flowing in an air duct to the negative oxygen water ion generating module 200, and is used for preheating or pre-cooling air flowing through the semiconductor refrigeration unit 220, so as to increase a temperature difference of ambient air of the semiconductor refrigeration unit 220, increase a capability of the semiconductor refrigeration unit 220 to generate condensed water, further ensure that the emitter electrode 210 can obtain enough water for tip discharge to generate negative oxygen water ions even under a low humidity condition, and improve an air purification effect of the air conditioner.
The air duct is internally divided into a channel of diversion channel 400 which is specially used for flowing to the negative oxygen water ion generating module 200, and the air pretreatment module 300 is used for preheating or precooling the air in the diversion channel 400.
The inlet of the diversion channel 400 is positioned at the upstream of the indoor heat exchanger 130, and the outlet of the diversion channel 400 is communicated with the first ventilation opening 280 on the shell;
the air pretreatment module 300 is provided on an air flow path between an inlet of the flow guide passage 400 and the semiconductor refrigeration unit 220.
The air flowing into the air duct from the air return inlet 110 flows out from the air outlet 120 after a part of the air exchanges heat by the indoor heat exchanger 130; the other part of the air flows into the diversion channel 400 instead of passing through the indoor heat exchanger 130, and then flows into the inner cavity of the shell 240 through the first ventilation opening 280, and the air flows through the air pretreatment module 300 in the process of flowing from the diversion channel 400 to the semiconductor refrigeration part 220, so that the air is preheated or precooled, the air temperature difference at the semiconductor refrigeration part 220 is improved, and the capability of the semiconductor refrigeration part 220 for generating condensed water is improved.
In some embodiments of the present application, referring to fig. 15, an air pretreatment module 300 includes a semiconductor refrigeration sheet 310, with opposite sides of the semiconductor refrigeration sheet 310 being referred to as a first side and a second side.
The semiconductor cooling fin 310 is provided with a first heat exchange plate 320 at a first side and a second heat exchange plate 330 at a second side.
The first heat exchange plate 320 is located within the air flow path between the inlet of the flow guide passage 400 and the semiconductor refrigeration section 220.
The second heat exchange plate 330 is located outside the air flow path between the inlet of the flow guide passage 400 and the semiconductor refrigeration section 220.
When the first side of the semiconductor refrigeration sheet 310 is cooled and the second side is heated, the first heat exchange plate 320 is a heat absorption plate, and the second heat exchange plate 330 is a heat dissipation plate.
When the first side of the semiconductor refrigeration sheet 310 heats and the second side cools, the first heat exchange plate 320 is a heat dissipation plate, and the second heat exchange plate 330 is a heat absorption plate.
When the air conditioner performs the cooling operation mode, the temperature at the air outlet 120 is lower, at this time, the air pretreatment module 300 starts the preheating mode to preheat the air flowing from the diversion channel 400 to the semiconductor refrigeration part 220, at this time, the first heat exchange plate 320 is a heat dissipation plate, the second heat exchange plate 330 is a heat absorption plate, and when the air flows through the air pretreatment module 300, the air is heated by the heat emitted by the first heat exchange plate 320, and the temperature is increased, so that the temperature difference at the semiconductor refrigeration part 220 is improved, and the condensation capacity of the air is improved.
When the air conditioner executes the heating operation mode, the temperature at the air outlet 120 is higher, at this time, the air pretreatment module 300 starts the precooling mode to precool the air flowing from the diversion channel 400 to the semiconductor refrigeration part 220, at this time, the first heat exchange plate 320 is a heat absorption plate, the second heat exchange plate 330 is a heat dissipation plate, and when the air flows through the air pretreatment module 300, the heat is absorbed by the first heat exchange plate 320, the temperature is reduced, and then the temperature difference at the semiconductor refrigeration part 220 is improved, and the condensation capacity is improved.
In some embodiments of the present application, with continued reference to fig. 15, the first heat exchange plates 320 have a plurality of first ventilation gaps 321 formed between two adjacent first heat exchange plates 320, and air flows through the first ventilation gaps 321, so as to improve heat exchange efficiency.
The second heat exchange plates 330 are arranged at intervals, and a second ventilation gap 331 is formed between two adjacent second heat exchange plates 330, so that heat exchange efficiency is improved.
[ flow guide channel ]
In some embodiments of the present application, referring to fig. 3 and 7, a piping box 170 is provided in the inner cavity of the indoor housing 100, and the piping box 170 is used for installing a suction pump, a water pipe, a float switch, etc.
The piping box 170 is a common component in the conventional indoor unit, in the prior art, the rear side of the piping box 170 is communicated with the upstream air duct of the indoor heat exchanger 130, the front side of the piping box 170 is closed, a part of the air flowing in from the return air inlet 110 does not pass through the indoor heat exchanger 130, but flows into the side piping box 170, the front side of the piping box 170 is closed, so that the air in the piping box 170 does not continue to flow outwards, and most of the air filled in the piping box 170 is the air before heat exchange.
The present application makes full use of the space area of the piping box 170, and opens a vent on the front side of the piping box 170 to communicate the front side of the piping box 170 with the air outlet 120, so that a part of the air flowing from the return air inlet 110, which does not exchange heat with the indoor heat exchanger 130, flows into the piping box 170, and flows to the negative oxygen water ion generating module 200 at the air outlet 120 through the vent, and the gas flow space formed in the piping box 170 is the above-mentioned diversion channel 400.
With continued reference to fig. 7, the piping box 170 is provided on the side of the indoor unit casing 100 close to the side, and is located in the front chamber 161, and the rear of the piping box 170 is opened on the side facing the air duct, and an air inlet 171 of the piping box 170 is formed in the region between the opening and the indoor heat exchanger 130 and the partition plate 150.
The front side of the indoor heat exchanger 130 is provided with a connecting plate 180, the connecting plate 180 is simultaneously connected to an inner bottom wall 190 of the indoor housing (actually, an indoor water pan for accommodating condensed water generated by the indoor heat exchanger 130) and a front side wall of the indoor housing 100, so as to separate the piping box 170 from a downstream air duct of the indoor heat exchanger 130, and the negative oxygen water ion generating module 200 is arranged on the connecting plate 180.
In some embodiments of the present application, with continued reference to fig. 7, the indoor heat exchanger 130 is disposed obliquely in the air duct, the upper portion of the indoor heat exchanger 130 extends obliquely toward the air outlet 120, and the connection plate 180 is disposed in a triangular region formed between the indoor heat exchanger 130, the inner bottom wall 190 of the indoor housing, and the front side wall of the indoor housing 100.
[ installation of air pretreatment Module ]
In some embodiments of the present application, referring to fig. 6-10, an air pretreatment module 300 is disposed within the piping box 170.
Referring to fig. 14, the connection plate 180 is provided with a second vent 181, and the second vent 181 is provided with a mounting portion 182 having both ends penetrating, wherein a part of the mounting portion 182 is located in the piping box 170, and the other part is in direct communication with the first vent 280, thereby communicating the inner cavity of the piping box 170 with the inner cavity of the housing 240.
The semiconductor cooling fin 310 is disposed on the mounting portion 182, specifically, on a portion of the mounting portion 182 located on the piping box 170, the first heat exchange plate 320 is located in the inner cavity of the mounting portion 182, and the second heat exchange plate 330 is located outside the mounting portion 182.
The air in the piping box 170 flows into the inner cavity of the housing 240 through the inner cavity of the mounting portion 182, contacts the first heat exchange plate 320 when flowing through the inner cavity of the mounting portion 282, and flows through the first ventilation gap 321 to achieve preheating or precooling of the air.
In some embodiments of the present application, referring to fig. 11 to 13, an air pretreatment module 300 is provided within the negative oxygen water ion generating module 200.
The semiconductor refrigeration sheet 310 is disposed on the housing 240, specifically on the cover 248, the first heat exchange plate 320 is disposed in the inner cavity of the housing 240, specifically in the second mounting cavity 242, and the second heat exchange plate 330 is disposed outside the housing 240.
The air in the piping box 170 flows into the second installation cavity 242 of the casing through the inner cavity of the installation part 182, and then continues to flow to the first installation cavity 241 side, and contacts the first heat exchange plate 320 in the process, and flows through the first ventilation gap 321, so as to achieve preheating or precooling of the air.
[ control of air pretreatment Module ]
In some embodiments of the present application, referring to FIG. 5, at the temperature T of the air outlet 120 0 When the difference Δt between the temperature T in the diversion channel 400 is greater than 0, which indicates that the air conditioner is in the heating operation mode, the air pre-processing module 300 pre-cools the air flowing through the semiconductor refrigeration unit 220.
Temperature T at air outlet 120 0 When the difference Δt between the temperature T in the diversion channel 400 is smaller than 0, the air conditioner is in the cooling operation mode, and the air pre-processing module 300 pre-heats the air flowing through the semiconductor cooling unit 220.
In other embodiments, the control system may also directly read the cooling or heating control command of the air conditioner to directly determine whether the air conditioner is in the cooling or heating operation mode.
In some embodiments of the present application, the system obtains the humidity Rh at the air outlet 120, adjusts the switch of the air pretreatment module 300 according to the humidity, and adjusts the temperature T of the air outlet 120 0 The difference Δt from the temperature T within the diversion channel 400 controls the air pre-conditioning module 300 to switch between pre-cooling and pre-heating modes,and the refrigerating capacity/heating capacity is adjusted by adjusting the working power of the pre-cooling/pre-heating mode of the air pre-processing module 300, so that the flowing air is pre-cooled/pre-heated to improve the temperature difference at the semiconductor refrigerating part 220 and the condensation capacity thereof.
Specifically, (1) when Rh is greater than or equal to Rh1, the air pretreatment module 300 is turned off, and the humidity is high, so that the moisture can be condensed from the air only by the refrigerating capacity of the semiconductor refrigerating unit 220.
(2) When Rh is smaller than Rh1, if the indoor unit of the air conditioner is in a refrigeration working mode, the air pretreatment module 300 starts a preheating mode; if the indoor unit of the air conditioner is in the heating operation mode, the air pre-processing module 300 starts the pre-cooling mode.
Also, the heating/cooling capacity of the air pretreatment module 300 is inversely proportional to Rh.
For ease of understanding, rh2 < Rh1 is set:
when Rh2 is less than Rh1 and Rh2 is less than Rh1,
(1) if the indoor unit is in the cooling operation mode, the air pretreatment module 300 starts the preheating mode, and the heating capacity is Q01;
(2) if the indoor unit is in the heating operation mode, the air pretreatment module 300 starts a cooling mode, and the refrigerating capacity is Q02;
when Rh is less than or equal to Rh2,
(1) if the indoor unit is in the refrigeration working mode, the air pretreatment module 300 starts a preheating mode, and the heating capacity is Q03;
(2) if the indoor unit is in the heating operation mode, the air pretreatment module 300 starts a cooling mode, and the refrigerating capacity is Q04;
Q03＞Q01，Q04＞Q02。
in some embodiments of the present application, the temperature T at the air outlet 120 0 When the difference Δt between the temperature T in the diversion channel 400 and the temperature T in the diversion channel 400 is smaller than the first set threshold T1, the temperature difference is smaller, and the air pretreatment module 300 is turned on at this time, so that the air flowing from the diversion channel 400 to the semiconductor refrigeration unit 220 needs to be pretreated.
Temperature T at air outlet 120 0 The difference Deltat from the temperature T in the diversion channel 400 is greater than the second settingAt the threshold T2, the temperature difference is large, and at this time, the air pretreatment module 300 is turned off, and the moisture can be condensed from the air only by the cooling capacity of the semiconductor cooling unit 220.
In some embodiments of the present application, the heating/cooling capacity of the air pretreatment module 300 and the temperature T of the air outlet 120 0 Inversely proportional to the difference Δt between the temperatures T in the diversion channel 400.
For ease of understanding, t1 < t2 (t is a positive value) is set forth in detail below:
(1) When Rh2 is less than Rh1 and Deltat is a positive value,
when Deltat is greater than or equal to t2, then the air pretreatment module 300 is closed;
when t2 is more than or equal to deltat is more than or equal to t1, the air pretreatment module 300 starts a pre-cooling mode, and the refrigerating capacity is Q11;
when delta t is more than or equal to 0 and less than or equal to t1, the air pretreatment module 300 starts a precooling mode, and the refrigerating capacity is Q12;
the refrigerating capacity Q12 is greater than Q11;
when Deltat is less than or equal to-t 2, then the air pretreatment module 300 is closed;
when-t 2 is less than or equal to delta t is less than or equal to-t 1, the air pretreatment module 300 starts a preheating mode, and the heating capacity is Q21; when the delta t is more than or equal to 0 and less than or equal to-t 1, the air pretreatment module 300 starts a preheating mode, and the heating capacity is Q22;
heating quantity Q22> Q21;
(2) When Rh is less than or equal to Rh2 and Deltat is a positive value,
when Deltat is greater than or equal to t2, then the air pretreatment module 300 is closed;
when t2 is more than or equal to deltat is more than or equal to t1, the air pretreatment module 300 starts a pre-cooling mode, and the refrigerating capacity is Q31;
when delta t is more than or equal to 0 and less than or equal to t1, the air pretreatment module 300 starts a precooling mode, and the refrigerating capacity is Q32;
the refrigerating capacity Q32 is more than Q31 is more than Q12 and more than Q11;
when Deltat is less than or equal to-t 2, then the air pretreatment module 300 is closed;
when-t 2 is less than or equal to delta t is less than or equal to-t 1, the air pretreatment module 300 starts a preheating mode, and the heating capacity is Q41; when the delta t is more than or equal to 0 and less than or equal to-t 1, the air pretreatment module 300 starts a preheating mode, and the heating capacity is Q42;
heating quantity Q42 is more than Q4 and more than Q22 is more than Q21.
The control of the air pretreatment module 300 can prevent the semiconductor refrigeration unit 220 from condensing excessively and can improve the condensation capacity of the semiconductor refrigeration unit 220 under dry conditions.
In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present application should be included in the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (10)
1. An air conditioner, comprising:
the indoor shell is provided with an air return opening and an air outlet, and an air duct communicated with the air return opening and the air outlet is provided with an indoor heat exchanger;
characterized by further comprising:
the negative oxygen water ion generation module is arranged at the air outlet and comprises an emission electrode and a semiconductor refrigeration part, wherein the semiconductor refrigeration part is used for generating condensed water for ionization of the emission electrode;
the air pretreatment module is arranged on an air flow path of the air in the air duct for flowing to the negative oxygen water ion generation module and is used for preheating or precooling the air flowing through the semiconductor refrigeration part so as to improve the temperature difference of the surrounding air of the semiconductor refrigeration part;
the negative oxygen water ion generating module further comprises a shell, the emitting electrode and the semiconductor refrigerating part are arranged in the shell, and a vent is further arranged on the shell;
a diversion channel is arranged in the air flue and is specially used for flowing to the negative oxygen water ion generation module, an inlet of the diversion channel is positioned at the upstream of the indoor heat exchanger, and an outlet of the diversion channel is communicated with the ventilation opening;
the air pretreatment module is arranged on an air flow passage between the inlet of the diversion channel and the semiconductor refrigerating part;
and one part of air flowing into the air duct from the return air inlet flows out of the air outlet after passing through the indoor heat exchanger, and the other part of air flows into the diversion channel instead of passing through the indoor heat exchanger and then flows into the inner cavity of the shell through the ventilation opening, and the air flows through the air pretreatment module in the process of flowing from the diversion channel to the semiconductor refrigeration part, so that preheating or precooling is obtained.
2. An air conditioner according to claim 1, wherein,
the shell is provided with a negative oxygen water ion release port for exposing the emission tip of the emission electrode, and the negative oxygen water ion release port faces the air outlet.
3. An air conditioner according to claim 2, wherein,
the system acquires the humidity Rh at the air outlet;
when Rh is more than or equal to Rh1, the air pretreatment module is closed;
when Rh is smaller than Rh1, if the indoor unit of the air conditioner is in a refrigeration working mode, the air pretreatment module starts a preheating mode; if the indoor unit of the air conditioner is in a heating working mode, the air pretreatment module starts a precooling mode.
4. An air conditioner according to claim 3, wherein,
the heating/cooling capacity of the air pretreatment module is inversely proportional to Rh.
5. An air conditioner according to claim 3, wherein,
the temperature T of the air outlet 0 The difference between the temperature T in the diversion channel and the temperature T in the diversion channel is delta T;
the heating/cooling capacity of the air pretreatment module is inversely proportional to Δt.
6. An air conditioner according to claim 3, wherein,
at the temperature T of the air outlet 0 When the difference delta T between the air pretreatment module and the temperature T in the diversion channel is smaller than a first set threshold T1, the air pretreatment module is started;
at the temperature T of the air outlet 0 And when the difference Deltat between the temperature Deltat and the temperature T in the diversion channel is larger than a second set threshold T2, the air pretreatment module is closed.
7. An air conditioner according to any one of claims 2 to 6, wherein,
at the temperature T of the air outlet 0 When the difference delta T between the air pretreatment module and the temperature T in the diversion channel is larger than 0, the air pretreatment module pre-cools the air flowing through the semiconductor refrigeration part;
at the temperature T of the air outlet 0 When the difference delta T between the temperature delta T and the temperature T in the diversion channel is smaller than 0, the air pretreatment module preheats the air flowing through the semiconductor refrigeration part.
8. The air conditioner according to claim 7, wherein,
the air pretreatment module comprises a semiconductor refrigeration piece, wherein one side of the semiconductor refrigeration piece is provided with a first heat exchange plate, and the other side of the semiconductor refrigeration piece is provided with a second heat exchange plate;
the first heat exchange plate is positioned in an air flow channel between the inlet of the diversion channel and the semiconductor refrigeration part;
the second heat exchange plate is positioned outside the air flow channel between the inlet of the diversion channel and the semiconductor refrigeration part.
9. The air conditioner according to claim 8, wherein,
the first heat exchange plates are arranged at intervals, and a first ventilation gap is formed between two adjacent first heat exchange plates;
the second heat exchange plates are arranged at intervals, and a second ventilation gap is formed between two adjacent second heat exchange plates.
10. The air conditioner according to claim 7, wherein,
the semiconductor refrigerating part is characterized in that a water storage gap is formed between one end of the transmitting electrode and the semiconductor refrigerating part, the transmitting electrode has hydrophilicity, condensed water generated by the semiconductor refrigerating part is stored in the water storage gap, and the transmitting electrode leads the condensed water in the water storage gap to the transmitting tip of the transmitting electrode.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210324187.5A CN114893828B (en) | 2022-03-30 | 2022-03-30 | Air conditioner |
| PCT/CN2022/136313 WO2023185063A1 (en) | 2022-03-30 | 2022-12-02 | Air conditioner |
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| CN202210324187.5A CN114893828B (en) | 2022-03-30 | 2022-03-30 | Air conditioner |
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